COOLING DEVICE AND ELECTRONIC DEVICE INCLUDING THE SAME
A cooling device includes: a heat sink including a plurality of fins formed to be plate shaped, which are arranged in parallel to one another; and a cooling fan arranged in a direction from the heat sink, the direction being perpendicular to perpendicular lines of the fins. A plurality of fins of a side heat sink constituting the heat sink include edges aligned on an oblique line with respect to perpendicular lines of the fins and formed on the outer periphery of the cooling fan. With this structure, it is possible to improve usage efficiency of an air flow generated by the cooling fan.
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The present application claims priority from Japanese application JP2010-061704 filed on Mar. 17, 2010, the content of which is hereby incorporated by reference into this application.
BACKGROUND OF THE INVENTION1. Field of the Invention
The present invention relates to a cooling device for cooling an electronic component mounted on a circuit board, and more particularly, to a technology for increasing usage efficiency of an air flow generated by a cooling fan.
2. Description of the Related Art
There is known an electronic device (for example, personal computer, game device, or audio-visual device) including a cooling device for cooling an electronic component mounted on a circuit board (see U.S. Pat. No. 6,637,505). There is known a cooling device including a heat sink for receiving heat from an electronic component, and a cooling fan for generating an air flow that passes through the heat sink. Further, there is known a heat sink including a plurality of fins with plate shapes, which are aligned at intervals in a lateral direction.
SUMMARY OF THE INVENTIONIn the cooling device, in some cases, the cooling fan is arranged so that the center line of rotation is directed upward, and the cooling fan in such a posture is arranged in front of the heat sink including the fins aligned in the lateral direction. In this layout, even though air to flow to a radially outer side of the cooling fan is generated by driving of the cooling fan, only air flowing substantially just rearward from the cooling fan to the heat sink is used for cooling the electronic component. Thus, usage efficiency of the air flow is not satisfactory.
A cooling device according to the present invention includes: a heat sink including a plurality of fins formed to be plate shaped and aligned at intervals, the heat sink being arranged such that perpendicular line of any one of the plurality of fins are along a first direction; and a cooling fan situated from the plurality of fins in a second direction perpendicular to the first direction, the cooling fan being rotatable about a center line along a third direction perpendicular to both the first direction and the second direction. The heat sink includes a plurality of oblique arrangement fins serving as at least one part of the plurality of fins. The plurality of oblique arrangement fins include edges aligned on an oblique line with respect to the first direction and formed on an outer periphery of the cooling fan.
An electronic device according to the present invention includes the cooling device.
According to the present invention, the edges of the plurality of oblique arrangement fins are aligned on the oblique line with respect to the first direction which is defined as a direction along the perpendicular line of the fin, and formed on the outer periphery of the cooling fan. Thus, the air flowing from the cooling fan obliquely with respect to the second direction can pass through the heat sink, and hence it is possible to increase the usage efficiency of the air flow.
In the accompanying drawings:
Hereinafter, an embodiment of the present invention is described with reference to the drawings.
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The upper housing 22 includes a right front wall portion 22b and a left front wall portion 22c, each of which extends downward from a front edge of the upper panel portion 22a toward the lower housing 21. The electronic device 1 is an entertainment device such as a game device and an audio-visual device that reads data and a program stored in a hard disk device, a disc-shaped portable storage medium such as an optical disc, and the like, and provides moving image, and sounds to a user. An insertion slot 22d, through which such a storage medium is inserted, is formed in the right front wall portion 22b. The right front wall portion 22b is situated more rearward than the left front wall portion 22c. A front board 22e extending forward from a lower edge of the right front wall portion 22b is arranged in front of the right front wall portion 22b. The front board 22e is provided with a plurality of buttons 23 functioning as an eject button for ejecting a storage medium, a power button, and the like.
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The power source unit 3 includes a circuit board 32 on which a power circuit is mounted, and a case 31 housing the board 32. The case 31 in this example has a substantially rectangular parallelepiped shape elongated in a right-and-left direction. The width of the case 31 in the right-and-left direction ranges from one side surface to the opposite side surface of the electronic device 1. As illustrated in
The cooling device 10 and the reading device 4 are arranged in front of the power source unit 3, and are aligned side by side. The circuit board 5 is arranged on lower sides of the cooling device 10 and the reading device 4.
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As described above, the side wall portion 19b is formed to surround an outer periphery of the cooling fan 15 and side surfaces of the heat sink 11. As illustrated in
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The front heat sink 12 includes the plurality of fins 12a which are arranged in parallel to one another and aligned at intervals. The fins 12a are each formed into a plate shape facing toward the lateral sides, and are arranged in parallel to the straight line L1. The front heat sink 12 is substantially rectangular in plan view. Front edges 12b of the plurality of fins 12a are aligned on straight line L2, and rear edges 12c of the plurality of fins 12a are aligned on straight line L3. The straight lines L2 and L3 are perpendicular to the straight line L1 and are parallel to each other.
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The side heat sink 14 includes a plate-shaped base portion 14d in the lower portion thereof (see
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The line L6, on which the front edges 14b are aligned, is a straight line extending obliquely forward and leftward. The front edges 14b of the plurality of fins 14a are aligned in a direction parallel to a tangent line at a position different from the rearmost portion P1 of the outer periphery of the cooling fan 15 (in this case, position between the rearmost portion P1 and a leftmost portion P2 of the outer periphery of the cooling fan 15). Meanwhile, the front edges 12b of the plurality of fins 12a are aligned in a direction parallel to a tangent line at the rearmost portion P1 (that is, right-and-left direction). As illustrated in
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In this regard, the front heat sink 12 is situated on the heat receiving block 41, as described above. Thus, the integrated circuit 5A is cooled by the front heat sink 12 and the side heat sink 14. As illustrated in
The side heat sink 14 includes a plurality of fins 14a-R situated on the right side of the heat releasing portion 42b, and a plurality of fins 14a-L situated on the left side of the heat releasing portion 42b. In other words, the heat releasing portion 42b is arranged under substantially the center portion in the right-and-left direction of the side heat sink 14. That is, the heat releasing portion 42b extends from the front edge 14b of the fin 14a situated at substantially the center portion in the right-and-left direction thereof, to the rear edge 14c of the fins 14a. With this structure, the heat of the heat pipe 42 is diffused over a wide range of the base portion 14d of the side heat sink 14. Further, as described above, the heat releasing portion 42b is curved under the side heat sink 14. Thus, the heat of the heat pipe 42 is diffused over a wider range of the base portion 14d.
Further, a distance D2 between the front edge 14b of the leftmost fin 14a-1 and the outer periphery of the cooling fan 15 is larger than a distance D1 between the front edge 14b of the fin 14a just above the heat pipe 42 and the outer periphery of the cooling fan 15. By providing the distance D2 larger as described above, it is possible to reduce resistance against rotation of the cooling fan 15 while maintaining cooling performance exerted by the side heat sink 14. That is, when many of the fins 14a, 12a are arranged near the cooling fan 15, air resistance against the rotation of the cooling fan 15 occurs. In this example, the distance D2 is large, and hence it is possible to reduce the air resistance. Further, the heat of the heat releasing portion 42b is most transferred to the fin 14a situated just above the heat releasing portion 42b. In this example, the distance D1 is small, and hence a large amount of the air can flow toward the fin 14a situated just above the heat releasing portion 42b. As a result, it is possible to improve the cooling performance of the side heat sink 14.
In this regard, in this example, a distance D3 between the front edge 14b of the rightmost fin 14a-2 and the outer periphery of the cooling fan 15 is larger than the distance D1. Further, a front edge 14b of a fin 14a-3, which becomes tangent to the outer periphery of the cooling fan 15 when the straight line L6 is moved parallel toward the cooling fan 15, is closest to the outer periphery of the cooling fan 15. Further, as the fins 14a have the larger distances from the fin 14a-3, the fins 14a have the larger distances from the outer periphery of the cooling fan 15.
The front heat sink 12, the rear heat sink 13, and the side heat sink 14 are formed by, for example, extruding. Specifically, in a manufacturing step for the heat sinks 12, 13, and 14, extruding is performed, in which a material such as aluminum is extruded in a direction parallel to the fins 12a, 13a, and 14a. After that, a member obtained by the extruding is cut at intervals corresponding to the widths of the front heat sink 12, the rear heat sink 13, and the side heat sink 14. When manufacturing the front heat sink 12 and the rear heat sink 13, the member obtained by the extruding is cut in a plane orthogonal to the extruding direction. When manufacturing the side heat sink 14, the member obtained by the extruding is cut in a plane oblique to the extruding direction (that is, plane including the line L6 along which the front edges 14b are aligned).
As described above, in the cooling device 10, the fins 14a of the side heat sink 14 includes, on their sides toward the cooling fan 15, the front edges 14b. The front edges 14b are aligned on the oblique line L6 with respect to the direction along the perpendicular lines of the fins 12a, 13a, and 14a. Further, the front edges 14b are formed on the outer periphery of the cooling fan 15. In other words, the line L6 passes by the outer periphery of the cooling fan 15. With this structure, not only the air flowing from the cooling fan 15 just rearward, but also the air flowing from the cooling fan 15 obliquely rearward can pass through the heat sink 11, and hence it is possible to increase usage efficiency of the air flow.
Further, the heat sink 11 includes the side heat sink 14 and the front heat sink 12. The heat sink 12 is arranged next to the side heat sink 14 and surrounds a part of the outer periphery of the cooling fan 15 together with the side heat sink 14. This structure of the heat sink 11 can farther improve cooling performance of the cooling device.
Further, the front heat sink 12 includes the plurality of fins 12 arranged in parallel to one another and aligned at the intervals. The fins 12 are arranged such that the perpendicular lines thereof is along a direction of the perpendicular lines of the fins 14. According to this structure, the air passing through the side heat sink 14 and the air passing through the front heat sink 12 flow in the same direction. Thus, it is possible to effectively cool a device which is arranged in the same direction from the side heat sink 14 and the front heat sink 12. And, it is possible to smoothly discharge, toward the outside of the electronic device, the air from the side heat sink 14 and the front heat sink 12.
Further, the fins 14 of the side heat sink 14 are aligned at regular intervals A. The fin 14a-2 situated at the end of the side heat sink 14 and the fin 12a-1 situated at the end of the front heat sink 12 have an interval therebetween which is same as the intervals between the fins 14. This structure can enable the air to smoothly pass through the side heat sink 14 and the front heat sink 12.
Further, the plurality of fins 12a of the front heat sink 12 are aligned at regular intervals A. The fin 14a-2 situated at the end of the side heat sink 14 and the fin 12a-1 situated at the end of the front heat sink 12 have an interval which is same as the intervals between the fins 12. This structure can enable the air to smoothly pass through the side heat sink 14 and the front heat sink 12.
Further, the line L6 on which the front edges 14b of the fins 14a are aligned is a straight line. With this structure, in comparison with a structure where the front edges 14b of the fins 14a are aligned on a curved line, manufacture of the heat sink 11 can be facilitated.
Further, the rear edges 14c opposite to the front edges 14b of the fins 14a are aligned on another straight line L10 which extends in a direction along the straight line L6. This structure can enable the following manufacturing process of the side heat sinks 14. An original material of the side heat sinks 14 is extruded in a direction parallel to the fins 14a. And then, the extruded material is cut at regular intervals, that is, at intervals each corresponding to a width in the front-back direction of side heat sink 14. As a result, it is possible to easily produce a plurality of side heat sink 14 and thus increase production efficiency.
Further, the heat sink 11 includes a base portion 14d formed into a plate shape, and the fins 14a are formed to be upright on the base portion 14d. The fins 14a and the base portion 14d are formed integrally with each other by extruding in which a material is extruded in a direction parallel to the fins 14a. According to this structure, it is possible to increase production efficiency of the heat sink 11.
Further, the heat pipe 42 is disposed below the fins 14a, for transferring heat of the electronic component 5A on the circuit board 5 to the fins 14a. One part of the plurality of fins 14a is situated on one side with respect to the heat pipe 42, and another part of the plurality of fins 14a is situated on the other side with respect to the heat pipe 42. According to this structure, it is possible to transfer heat of the heat pipe 42 to the whole of the plurality of fins 14a.
Note that, the present invention is not limited to the above-mentioned cooling device 10, and various modifications can be made. For example, in the above description, the side heat sink 14 is arranged on the left side of the front heat sink 12 and the rear heat sink 13. However, the side heat sink 14 may be arranged on the right side of the front heat sink 12 and the rear heat sink 13. In this case, the front edges 14b of the fins 14a of the side heat sink 14 are aligned on a line which extends rightward and forward and passes by the outer periphery of the cooling fan 15.
Further, the cooling device 10 is provided with the two heat sinks 12, 13 in addition to the side heat sink 14. However, the cooling device 10 may be provided with only any one of the front heat sink 12 and the rear heat sink 13.
Further, in place of the front heat sink 12 or the rear heat sink 13, or together with the front heat sink 12 or the rear heat sink 13, a heat sink bilaterally symmetrical with the side heat sink 14 may be provided to the cooling device 10.
Further, in the above description, the front heat sink 12, the side heat sink 14, and the rear heat sink 13 are individual members. However, any two of or all of the front heat sink 12, the side heat sink 14, and the rear heat sink 13 may be formed integrally with each other.
While there have been described what are at present considered to be a certain embodiment of the invention, it will be understood that various modifications may be made thereto, and it is intended that the appended claims cover all such modifications as fall within the true spirit and scope of the invention.
Claims
1. A cooling device, comprising:
- a heat sink including a plurality of fins formed to be plate shaped and aligned at intervals, the heat sink being arranged such that perpendicular line of any one of the plurality of fins are along a first direction; and
- a cooling fan situated from the plurality of fins in a second direction perpendicular to the first direction, the cooling fan being rotatable about a center line along a third direction perpendicular to both the first direction and the second direction, wherein:
- the heat sink includes a plurality of oblique arrangement fins serving as at least one part of the plurality of fins; and
- the plurality of oblique arrangement fins include edges aligned on an oblique line with respect to the first direction and formed on an outer periphery of the cooling fan.
2. The cooling device according to claim 1, wherein the heat sink includes a first heat sink provided with the plurality of oblique arrangement fins, and a second heat sink arranged next to the first heat sink and surrounding one part of the outer periphery of the cooling fan together with the first heat sink.
3. The cooling device according to claim 2, wherein the second heat sink includes the plurality of fins formed to be plate shaped, which are arranged in parallel to one another and aligned at the intervals.
4. The cooling device according to claim 3, wherein:
- the plurality of oblique arrangement fins of the first heat sink are aligned at regular intervals; and
- An oblique arrangement fin situated at an end of the first heat sink and a fin situated at an end of the second heat sink have an interval therebetween which is same as the regular intervals.
5. The cooling device according to claim 3, wherein:
- the plurality of fins of the second heat sink are aligned at regular intervals; and
- An oblique arrangement fin situated at an end of the first heat sink and a fin situated at an end of the second heat sink have an interval therebetween which is same as the regular intervals.
6. The cooling device according to claim 1, wherein the edges of the plurality of oblique arrangement fins are aligned on a straight line oblique with respect to the first direction and formed on the outer periphery of the cooling fan.
7. The cooling device according to claim 6, wherein edges opposite to the edges of the plurality of oblique arrangement fins are aligned on another straight line which extends in a direction along the straight line.
8. The cooling device according to claim 6, wherein:
- the heat sink includes a base portion formed into a plate shape;
- the plurality of oblique arrangement fins are formed to be upright on the base portion; and
- the plurality of oblique arrangement fins and the base portion are formed integrally with each other by extruding in which a material is extruded in a direction parallel to the plurality of oblique arrangement fins.
9. The cooling device according to claim 1, further comprising a heat transfer member arranged under the plurality of oblique arrangement fins, for transferring heat of an electronic component on a circuit board to the plurality of oblique arrangement fins,
- wherein one part of the plurality of oblique arrangement fins is situated on one side with respect to the heat transfer member, and another part of a plurality of oblique arrangement fins is situated on the other side with respect to the heat transfer member.
10. An electronic device, comprising the cooling device according to claim 1 built therein.
Type: Application
Filed: Mar 15, 2011
Publication Date: Sep 22, 2011
Applicant: SONY COMPUTER ENTERTAINMENT INC. (Tokyo)
Inventors: Kensuke Ikeda (Tokyo), Keiichi Aoki (Tokyo), Yukito Inoue (Tokyo)
Application Number: 13/048,037
International Classification: F28F 13/00 (20060101);