Heat dissipation device which is pre-built with an air vent structure

Abstract

A heat dissipation device which is pre-built with an air vent structure uses primarily a plurality of cooling fins, which are formed into different lengths, to assemble into the heat dissipation devices of different shapes, for shunning away from other elements inside a computer host. In addition, diversion baffles of a different angle can be arranged and assembled, so as to form air ducts following an angle of wind direction, allowing an air flow to be smoothly guided in by a fan, and to quickly flow into a heat transmission zone in a gap between the cooling fins, such that a heat source can be dissipated more quickly.

Description

BACKGROUND OF THE INVENTION

a) Field of the Invention

The present invention relates to a heat dissipation device which is pre-built with an air vent structure, and more particularly to a heat dissipation device which is formed with all kinds of shapes by assembling cooling fins that are shaped in advance with different lengths, so as to avoid other structures and to form diversion baffles as air ducts for guiding an cold air flow.

b) Description of the Prior Art

To solve an over-heat problem of elements inside a computer host, usually a heat dissipation device is installed on an electronic heating element, such that heat generated from the electronic element can be dissipated by the heat dissipation device. However, for the conventional heat dissipation device, a base plate of a radiator is installed with cooling fins, and the base plate is tightly pressed on the electronic heating element, to dissipate heat energy from high temperature created when the electronic element is operating, through the cooling fins. Although this kind of heat dissipation device has a low cost, its heat conduction rate is slow, and hence is only suitable for a computer with a lower operation speed. As the heat dissipation effect is limited for the electronic heating element requiring to operate with a fast speed or for a long time, the conventional heat dissipation device is not perfect at all. Due to that the heat dissipation requirement has not been able to be satisfied by using only the cooling fins, an existing improvement mode is to use a heat dissipation device with a fan, which dissipates the heat energy by force convection. Referring to FIG. 1, a proper space beside the cooling fins 1 is installed with the fan 2, wherein the cooling fins 1 are arranged in a trench-shape to be divided into a plurality of hot air outlets 3. When this heat dissipation device is installed on a surface of the electronic heating element, and the fan 2 starts to operate, a cold air will be guided in through air inlets 4 to blow toward the cooling fins 1, in order to dissipate the heat energy which is conducted upward by the electronic element, thereby achieving a function of heat dissipation. Nevertheless, as end surfaces of the cold air inlets and the hot air outlets are all vertical to a plane, a wind-break wall will be formed to block the air flow from the fan when the cold air blows in; therefore, it is easy to result in a stagnant layer, such that a heat source will be accumulated between the cooling fins and the fan, thereby wasting power of the fan, and allowing the heat dissipation effect to only work for a normal application. Accordingly, there are some vendors who increase wind speed for improvement. However, in order to increase wind pressure, rotation of the fan will result in louder noise, and thereby troubling people. More particularly, with new advancement of computer technology, all kinds of new products are showing up continuously, and, inside a computer host, new elements are constantly required to be installed or updated. In addition to a basic requirement of beauty, compatibility is more emphasized. However, as all kinds of elements are having different specifications, they are often unable to be emplaced or are often in conflict with the radiator in assembling, due to the incompatibility with the specification of radiator. Therefore, other suitable heat dissipation device should be searched for, which usually forms the biggest trouble and an issue to be overcome mostly, upon assembling the radiator.

SUMMARY OF THE INVENTION

Accordingly, the present invention is to provide a heat dissipation device which is pre-built with an air vent structure, having a good efficiency of heat dissipation in a limited space inside a computer host. Specifically, in the present invention, a cooling fin set is formed by mutually connecting cooling fins into an integral body, with a punching technology. The cooling fins are pre-built with different lengths, such that all kinds of heat dissipation devices of different shapes can be arranged after assembling, so as to shun away from other elements inside the computer host in emplacement. In addition, due to the pre-built assembly, a plurality of diversion baffles can be formed. A certain angle can appear on the diversion baffles, following a direction of wind, to form a proper bus duct, for guiding a direction of air flow when a fan is operating, allowing the air flow to quickly flow toward a heat transmission zone in each gap between the cooling fins, thereby more quickly dissipating heat received by the cooling fins. As the cooling fins of different lengths can be pre-built for the present invention, a combination of different shapes can be formed, and other elements can be shunned away in accordance with a location and an angle of the fan inside the computer host; therefore, all kinds of choices can be available to fit with down-stream vendors and to facilitate the assembly by a user, thereby being extremely suitable for and facilitating the assembly of all kinds of heat dissipation devices. In particular, when the air flow is guided in by the fan, a vortex-shape wind-break wall created by the air flow can be destroyed due to a blocking of the diversion baffles, so as to prevent from a reflux phenomenon resulted by reflection and collision of the air flow. Moreover, a flow field becomes smaller by an included angle formed by the air flow, which increases the wind pressure formed when the air flow blows toward the heat transmission zones, and relatively increases the air flow rate, allowing the air flow which is guided in by the fan to be guided by the diversion baffles to flow quickly and continuously, without causing a stagnant condition. Therefore, it will effectively increase a convection efficiency of the air which passes through the cooling fins, such that a function of the fan can be developed sufficiently, noise of the fan can be reduced, and the best heat dissipation function can be achieved, thereby truly solving an over-heat problem for the computer elements. In addition, as the shapes of cooling fins can be pre-built, the heat dissipation device can be formed integrally with a variation of shapes, thereby allowing the heat dissipation device to be provided with a beautiful appearance.

Accordingly, the primary object of the present invention is to solve a limitation to the heat dissipation device for a conventional computer heat dissipation structure, such that by pre-building the cooling fins of different lengths, the heat dissipation structures of different shapes can be formed to shun away from other computer elements, and all kinds of choices can be available to fit with up-stream and down-stream vendors for manufacturing and assembling.

Another object of the present invention is to solve a limitation to the heat dissipation effect for the conventional computer heat dissipation structure, such that by using the cooling fins of different lengths, the diversion baffles are assembled to form air ducts with a certain angle, which allows the cold air to be quickly guided into the cooling fins following the air ducts, to dissipate the heat and reduce temperature efficiently, thereby achieving the best heat dissipation effect.

Yet another object of the present invention is to provide a design of various combinations by assembling the cooling fins of different lengths, so as to facilitate applying to all kinds of heat dissipation devices.

Still another object of the present invention is to form a variation of shapes integrally, allowing the heat dissipation device to have a beautiful appearance.

To enable a further understanding of the said objectives and the technological methods of the invention herein, the brief description of the drawings below is followed by the detailed description of the preferred embodiments.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a perspective view of a conventional heat dissipation device.

FIG. 2 shows an exploded view of an embodiment of the present invention.

FIG. 3 shows a perspective view of an embodiment of the present invention after being assembled.

FIG. 4 shows a schematic view of an embodiment of the present invention, into which wind is guided.

FIG. 5 shows a plan view of another embodiment of the present invention.

FIG. 6 shows a plan view of still another embodiment of the present invention.

FIG. 7 shows a schematic view of yet another embodiment of the present invention, into which wind is guided.

FIG. 8 shows a perspective view of still yet another embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Referring to FIG. 2, it shows an exploded view of a preferred embodiment of the present invention, wherein a cooling fin 10 is a thin plate formed by punching, a top and bottom rim of the cooling fin 10 are bended horizontally with heat transmission wings 11, and each heat transmission wing 11 is provided with a locking part 12 constituted by a locking slot 121 and a locking hook 122, with the locking slot 121 being extended forward with the locking hook 122. A bended part of the locking hook 122 is formed with an inverted hook, such that the cooling fins 10 can be assembled forward and backward into a cooling fin set, without dropping off. When the cooling fins 10 are formed by punching, a length of each piece can be configured in advance, meaning that upon punching, a fin of different length can be formed by extending respectively from a left and right side of the locking part 12, allowing each cooling fin 10 to be formed with an extension section 13 of different length. After integrally punching and assembling each cooling fin 10, the extension section 13 can be arranged and combined into all kinds of diversion baffles 14 of different levels.

Referring to FIGS. 2 to 4, to assemble the cooling fins 10, one piece is connected with the other one by locking the locking hooks 122 of a rear piece into the locking slots 121 of a front piece, so as to accomplish the assembling. When the cooling fins 10 are merged to assemble into a cooling fin set, a bottom of the set will form a detailed heat conduction surface from the merging of the heat transmission wings 11, therefore the cooling fins 10 can have a large heat absorption and dissipation area to be completely in contact with a heat source, so as to sufficiently absorb the heat released by the electronic element. In addition, heat transmission zones 15, which are arranged like trenches, are formed by merging bended parts of the heat transmission wings 11. When a fan 31 operates to send air flow to the cooling fins 10 from air outlets, the air flow is guided to the heat transmission zones 15 by the diversion baffles 14. As an included angle formed by the diversion baffles 14 follows with a spiral air duct of the fan 31, a reflux phenomenon resulted from reflection and collision of the air flow can be prevented. Accordingly, using the diversion baffles 14 can stop the reflux of air flow, and can also make a flow field to be smaller by the included angle, increasing wind pressure resulted by blowing the air flow toward the heat transmission zones 15, and relatively increasing an air flow rate, thereby allowing the air flow to flow more smoothly, without resulting in stagnation. Therefore, a convection efficiency of the air that passes through the cooling fins can be increased effectively, and the cold air can be quickly and continuously driven in to dissipate the heat from the heating element, thereby achieving the best heat dissipation effect. In addition, a function of the fan 31 can be sufficiently developed, and noise of the fan 31 can be reduced.

Referring to FIGS. 5 to 7, the present invention can be applied to different designs of computer motherboards, or the cooling fin set and the diversion baffles 14 can be assembled and arranged according to positions of other elements and a location of air outlet of the fan 31, primarily by forming different specifications and shapes after assembling the extension sections 13 and the diversion baffles 14 of different lengths, for shunning away from other units 21, and forming the proper air ducts in accordance with the wind direction. As shown in FIG. 5 and FIG. 6, as there are other units 21 inside the computer host, an ordinary or regular radiator cannot be used, yet in the present invention, these units 21 can be easily shunned away by assembling the extension sections 13 of different lengths, and a certain angle can be formed on the diversion baffles 14 to exactly face the direction of the air outlet of the fan 31. Referring to FIG. 7, when the air outlet of the fan 31 is at a right side, then a left side of the diversion baffles 14 is set to be higher and gradually descending toward a right side, allowing the air flow of the fan 31 to be guided in smoothly by the diversion baffles 14, and to quickly flow toward the heat transmission zones 15 in the gaps between the cooling fins 10, thereby continuously and quickly dissipating the heat.

Referring to FIG. 8, the diversion baffles 14 can be also configured to have an arc shape in different height, so as to fit with the air outlet to blow in the air flow from main parts of the heat transmission zones 15, in order to increase the heat dissipation at heat accumulation regions of the main parts, with the rest of air flow being able to blow into other heat dissipation regions to sufficiently achieve a function of heat dissipation.

It is worth to be mentioned that the cooling fins and their assembly of the present invention can be formed and assembled integrally by punching, allowing a fast mass production, and integrally forming into a variation of shapes to provide the heat dissipation device with a beautiful appearance.

Accordingly, the heat dissipation device which is pre-built with an air vent structure of the present invention is a valid and perfect invention, which is provided with a good practicability, and is a brand new originality in the design of structural space and shape, to have novelty. In addition, the cooling fin structure that is pre-assembled by the punching technology can be integrally formed to be produced massively, and can shun away from other units; therefore, all kinds of choices can be available to fit with down-stream vendors for manufacturing. Furthermore, the heat dissipation rate can be increased significantly, to truly improve the heat dissipation function of the computer electronic elements, which is an advanced creation that breaks through the limitations of prior art.

It is of course to be understood that the embodiments described herein is merely illustrative of the principles of the invention and that a wide variety of modifications thereto may be effected by persons skilled in the art without departing from the spirit and scope of the invention as set forth in the following claims.

Claims

1. A heat dissipation device which is pre-built with an air vent structure being assembled by connecting a plurality of cooling fins, with the cooling fin being bended with heat transmission wings to form a plurality of heat transmission zones in merging; each of the cooling fins being provided with an extension section of different length which is pre-assembled to form a variation of shapes and a plurality of diversion baffles; the diversion baffles being formed with a certain angle according to air outlets, and forming a bus duct, such that an air flow is smoothly guided when a fan is operating, allowing a cold air to quickly flow toward the heat transmission zone in a gap between the cooling fins, thereby allowing a heat source to be dissipated more quickly.

2. The heat dissipation device which is pre-built with an air vent structure, according to claim 1, wherein the plural cooling fins are formed and assembled integrally by punching.