HEAT DISSIPATION APPARATUS

Abstract

A heat dissipation apparatus includes a heat sink, a resilient pressing member, and two fasteners. The pressing member includes an abutting portion to press the heat sink, and two locking portions extending from opposite ends of the abutting portion. The fasteners are respectively latched to the locking portions. When the heat sink is mounted to a heat-generating component by the fasteners, the abutting portion is stretched to be resiliently flexed by the locking portions latched by the fasteners. The abutting portion abuts against the heat sink toward the heat-generating component, thereby urging the heat sink to be in intimate thermal contact with the heat-generating component.

Description

BACKGROUND

1. Technical Field

The present disclosure relates to a heat dissipation apparatus.

2. Description of Related Art

Finned heat sinks have been found to be particularly effective for transferring heat through conduction from a heat-generating component such as a semiconductor chip and rapidly dissipating such heat to the environment. However, in the past, various means used to attach a heat sink to the heat-generating component does not allow the heat sink to be in intimate thermal contact with the heat-generating component. As a result, it is difficulty to remove heat generated by the heat-generating component.

BRIEF DESCRIPTION OF THE DRAWINGS

Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, all the views are schematic, and like reference numerals designate corresponding parts throughout the several views.

FIG. 1 is an exploded, isometric view of an exemplary embodiment of a heat dissipation apparatus.

FIG. 2 is an enlarged, isometric view of a fastener of the heat dissipation apparatus of FIG. 1.

FIG. 3 is an assembled, isometric view of the heat dissipation apparatus of FIG. 1.

FIG. 4 is a side plan view showing the heat dissipation apparatus of FIG. 3 fixed to a circuit board.

DETAILED DESCRIPTION

The present disclosure, including the accompanying drawings, is illustrated by way of examples and not by way of limitation. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.

Referring to FIG. 1, an exemplary embodiment of a heat dissipation apparatus 1 includes a heat sink 10, a resilient pressing member 20, and two fasteners 30.

The heat sink 10 includes an elongated, thermal-conductive base 12, and a plurality of thermal-conductive fins 14 extending substantially perpendicularly from a top of the base 12. A receiving groove 142 is transversely defined in the fins 14 and extends along the length direction of the base 12. Two support portions 16 are respectively formed at opposite ends of the base 12. A fixing hole 162 is defined in each support portion 16.

The pressing member 20 includes an abutting portion 22, and two locking portions 24 respectively extending from opposite ends of the abutting portion 22. The abutting portion 22 is substantially arc-shaped, with the opposite ends of the abutting portion 22 tilted relative to a center of the abutting portion 22. Each locking portion 24 is substantially V-shaped.

Referring to FIG. 2, each fastener 30 includes a columnar body 32 and a catch 34 extending from a first end of the body 32. A latching hole 322 is radially defined in a second end of the body 32 opposite to the first end, corresponding to one locking portion 24 of the pressing member 20. The catch 34 is hollowed to be readily flexed. Two opposite cutouts 36 are defined in a conjunction of the body 32 and the catch 34.

Referring to FIGS. 1-3, in assembly, the locking portions 24 of the pressing member 20 are respectively latched in the latching holes 322 of the fasteners 30, and the pressing member 20 is received in the receiving groove 142 of the heat sink 10. When the catches 34 of the fasteners 30 are in alignment with the fixing holes 162 of the corresponding support portions 16 of the heat sink 10, the catches 34 are urged to extend through the corresponding fixing holes 162. Thus, the abutting portion 22 of the pressing member 20 is substantially positioned at a center of the top of the base 12 of the heat sink 10.

Referring to FIG. 4, in mounting the heat dissipation apparatus 1 to a circuit board 40 for transferring heat from a heat-generating component 42 mounted on the circuit board 40, the catches 34 of the fasteners 30 are in alignment with two through holes 44 defined in the circuit board 40. The catches 34 are urged again to be resiliently flexed and inserted in the corresponding through holes 44. Meanwhile, the abutting portion 22 of the pressing member 20 is stretched to be resiliently flexed by the locking portions 24, which are latched in the latching holes 322 of the fasteners 30.

Thus, the abutting portion 22 abuts against the center of the top of the base 12 to urge a center of a bottom of the base 12 to be in intimate thermal contact with the heat-generating component 42.

When the catches 34 extend through the corresponding through holes 44, the catches 34 are restored to catch the circuit board 40. Sides bounding the though holes 44 are respectively held in the corresponding cutouts 36. Thus, the heat sink 10 is firmly secured to the circuit board 40, with the center of the bottom of the base 12 in intimate thermal contact with the heat-generating component 42, for quickly and efficiently dissipating heat from the heat-generating component 42.

It is to be understood, however, that even though numerous characteristics and advantages of the embodiments have been set forth in the foregoing description, together with details of the structure and function of the embodiments, the present disclosure is illustrative only, and changes may be made in details, especially in matters of shape, size, and arrangement of parts within the principles of the embodiments to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Claims

1. A heat dissipation apparatus comprising:

a heat sink;

a resilient pressing member comprising an abutting portion to press the heat sink, and two locking portions extending from opposite ends of the abutting portion; and

two fasteners latched to the locking portions, respectively;

wherein when the heat sink is mounted to a heat-generating component by the fasteners, the abutting portion is stretched to be resiliently flexed by the locking portions latched by the fasteners, the abutting portion abuts against the heat sink toward the heat-generating component, thereby urging the heat sink to be in intimate thermal contact with the heat-generating component.

2. The heat dissipation apparatus of claim 1, wherein each of the fasteners comprises a body and a catch extending from a first end of the body; the catches of the fasteners are hollowed to be readily flexed.

3. The heat dissipation apparatus of claim 2, wherein two opposite cutouts are defined in a conjunction of the body and the catch of each of the fasteners.

4. The heat dissipation apparatus of claim 2, wherein a latching hole is defined in a second end of the body opposite to the first end of each of the fasteners, and the locking portions are latched in the latching holes of the fasteners, respectively.

5. The heat dissipation apparatus of claim 1, wherein the heat sink comprises a thermal-conductive base, and a plurality of thermal-conductive fins extending from a top of the base; two fixing holes are respectively defined in the base, the fasteners respectively extend through the fixing holes.

6. The heat dissipation apparatus of claim 5, wherein two support portions are respectively formed at opposite ends of the base, the fixing holes are respectively defined in the support portions.

7. The heat dissipation apparatus of claim 5, wherein a receiving groove is transversely defined in the fins and extends along a length direction of the base, the abutting portion is received in the receiving groove.

8. The heat dissipation apparatus of claim 1, wherein the abutting portion is arc-shaped, with the opposite ends of the abutting portion tilted relative to a center of the abutting portion.

9. The heat dissipation apparatus of claim 1, wherein the locking portions are substantially V-shaped.