Layered Emitter Coating Structure for Crack Resistance with PDAG Coatings

Abstract

A thermal management apparatus includes an electrohydrodynamic fluid accelerator in which an emitter electrode and another electrode are energizable to motivate fluid flow. The emitter electrode is a layered structure including an electrode core material and an outermost coating that is susceptible to micro-cracking or corona erosion. A barrier material is provided in a sublayer to protect the underlying electrode core material. An adhesion promoting layer may be used between the barrier material and the electrode core material or between other layers of the structure. solid solution. A method of making an EHD product includes positioning the layered electrode relative to another electrode to motivate fluid flow when energized.

Description

BACKGROUND

1. Field of the Invention

This application relates generally to electrodes in electrohydrodynamic or electrostatic devices such as electrohydrodynamic fluid accelerators and electrostatic precipitators, and particularly to classes of materials that can be used to form such electrodes.

2. Description of the Related Art

Many electronic devices and mechanically operated devices require air flow to help cool certain operating systems by convection. Cooling helps prevent device overheating and improves long term reliability. It is known to provide cooling air flow with the use of fans or other similar moving mechanical devices; however, such devices generally have limited operating lifetimes, produce noise or vibration, consume power or suffer from other design problems.

The use of an ion flow air mover device, such as an electrohydrodynamic (EHD) device or electro-fluid dynamic (EFD) device, may result in improved cooling efficiency, reduced vibrations, power consumption, electronic device temperatures, and noise generation. This may reduce overall device lifetime costs, device size or volume, and may improve electronic device performance or user experience.

Devices built using the principle of the ionic movement of a fluid are variously referred to in the literature as ionic wind machines, electric wind machines, corona wind pumps, electro-fluid-dynamics (EFD) devices, electrohydrodynamic (EHD) thrusters and EHD gas pumps. Some aspects of the technology have also been exploited in devices referred to as electrostatic air cleaners or electrostatic precipitators.

In general, EHD technology uses ion flow principles to move fluids (e.g., air molecules). Basic principles of EHD fluid flow are reasonably well understood by persons of skill in the art. Accordingly, a brief illustration of ion flow using corona discharge principles in a simple two electrode system sets the stage for the more detailed description that follows.

With reference to the illustration in FIG. 1, EHD principles include applying a high intensity electric field between a first electrode 10 (often termed the “corona electrode,” the “corona discharge electrode,” the “emitter electrode” or just the “emitter”) and a second electrode 12. Fluid molecules, such as surrounding air molecules, near the emitter discharge region 11 become ionized and form a stream 14 of ions 16 that accelerate toward second electrode 12, colliding with neutral fluid molecules 22. During these collisions, momentum is imparted from the stream 14 of ions 16 to the neutral fluid molecules 22, inducing a corresponding movement of fluid molecules 22 in a desired fluid flow direction, denoted by arrow 13, toward second electrode 12. Second electrode 12 may be variously referred to as the “accelerating,” “attracting,” “target” or “collector” electrode. While stream 14 of ions 16 is attracted to, and generally neutralized by, second electrode 12, neutral fluid molecules 22 continue past second electrode 12 at a certain velocity. The movement of fluid produced by EHD principles has been variously referred to as “electric,” “corona” or “ionic” wind and has been defined as the movement of gas induced by the movement of ions from the vicinity of a high voltage discharge electrode 10.

Ozone (0₃), while naturally occurring, can also be produced during operation of various electronics devices, including EHD devices, photocopiers, laser printers and electrostatic air cleaners, and by certain kinds of electric motors and generators, etc. Elevated ozone levels have been associated with respiratory irritation and certain health issues. Therefore, ozone emission can be subject to regulatory limits such as those set by the Underwriters Laboratories (UL) or the Environmental Protection Agency (EPA). Accordingly, techniques to reduce ozone concentrations have been developed and deployed to catalytically or reactively break down ozone (O₃) into the more stable diatomic molecular form (O₂) of oxygen.

Some of the characteristics in which known emitter and collector materials are often deficient entail surface chemistry and catalysis. For example, EHD device performance reduction or failure can be caused by gradual coating of the emitter with silica. Still other EHD devices produce unacceptable concentrations of ozone in the air transported through the device. Additionally, some electrodes may be susceptible to oxidation, corona erosion, or accumulation of detrimental materials. The term “corona erosion” refers to various adverse effects from a plasma discharge environment including enhanced oxidation, and etching or sputter of emitter surfaces. In general, corona erosion can result from any plasma or ion discharge including, silent discharge, AC discharge, dielectric barrier discharge (“DBD”) or the like.

Generally, many desirable electrode materials properties can be achieved by forming the emitter and collector being made of particular metals. For example, the emitter may be made of tungsten and the collector made of aluminum to provide desired conductivity, hardness and strength. However, pure metals are often deficient in some regard with respect to other desirable materials characteristics. One proposed solution is to use an alloy in place of a pure metal. While various metals or alloys may be selected to address a particular one of these performance parameters, a combination of two materials having known performance characteristics often yields an alloy or compound exhibiting significantly different characteristics.

For example, a collector may be made of an aluminum alloy to increase its hardness. Similarly, the emitter electrode may be made of stainless steel, so that the three elements of iron, nickel and chromium are present and exposed to the atmosphere in which the EHD device operates. While each of the elements present in the alloy will contribute in some way to the overall characteristics required, alloys of such metals do not always provide the same desirable characteristics as the pure metals would alone and such compound characteristics are not always readily predictable.

Many metal alloys exhibit duplex or higher ordered microstructures. For example, mixing of lead with tin results not in a mixture of pure lead and tin, but a two-phase mixture consisting of lead containing tin and tin containing lead. The alloy no longer contains either pure lead or pure tin so the beneficial effects of these elements may be altered, diminished or lost. While some phases formed on alloying may present other beneficial materials characteristics, such beneficial properties are not readily determinable or predictable without extensive testing as the new phases do not present the same properties as the pure components.

Accordingly, improvements are sought in enhancing electrode performance by providing predictable combined performance characteristics through combination of selected materials.

SUMMARY

It has been discovered that alloys comprising solid-solutions may be employed in emitter and collector electrodes or other electrodes or components of EHD devices to provide a range of combined, yet substantially independent desirable materials characteristics. The solid solution includes a solvent metal and one or more solute material(s). The solute materials can include metals, semi-metals, non-metals and compounds. The solute material forms an interstitial or substitutional solid solution in the solvent metal.

Thus, electrohydrodynamic (“EHD”) device emitter and collector electrodes may be made of solid solution alloys exhibiting substantially independent material properties corresponding to the various selected components of the solid solution alloy. To provide desirable combinations of characteristics in varied applications, these components may be further formed of multiple materials selected to exhibit a combination of materials performance characteristics.

Advantageous emitter and collector electrode characteristics can include, e.g.:

1-Electrical conductivity

2-Resistance to erosion by corona

3-Resistance to oxidation

4-Non-stick/low adhesion surface for silica and dust

5-Low ozone generation or catalytic activity towards ozone

6-Low coefficient of friction

7-Moderate hardness and tensile strength

8-Resistance to high temperature

9-Resistance to thermal cycling

It has been discovered that by maintaining the alloy components in substantially pure form, at least at the atomic level, the performance characteristics of the alloy may be determined by the independent performance characteristics of the solvent metal and solute material.

For example, in some implementations, an alloy of nickel is infused with carbon (e.g., at 1 atomic weight percent) resulting in carbon atoms in solid solution in a matrix of nickel atoms. Thus, both nickel and carbon are present at the surface of the alloy and each contributes respective independent properties and characteristics to the combined material performance characteristics. In contrast, cementite or Fe₃C, which is a conventional intermetallic compound, exhibits very different properties from iron and carbon separately.

In some implementations, an emitter electrode material includes palladium solvent metal and a silver solute material. Palladium exhibits many desirable characteristics such as high strength and conductivity, while silver is an excellent catalyst for ozone. In the solid solution, some palladium atoms are displaced by silver at the surface of the electrode, and, in some cases through at least a substantial portion of the bulk of the electrode. Thus, the materials characteristics of the electrode are substantially similar to those of pure palladium, with the addition of an ozone reducing catalytic effect provided by sufficient concentration of silver atoms at the electrode surface.

Silver (Ag) is an excellent candidate for imparting ozone reduction characteristics to an emitter electrode, e.g., a corona emitter wire. Silver, however, does not generally exhibit long life in the emitter wire corona environment. It has been discovered that an AgPd solid solution for the outer emitter electrode coating maintains much of the Ag ozone benefit while at the same time increasing the emitter life over pure Ag. However, the difference in the size of the Pd and Ag atoms can generate some degree of stress in such a solid solution coating due to the strain on the lattice. It has been found that these stresses within the AgPd solid solution coating can result in micro-cracking of the surface in some cases, which can accelerate deterioration of the electrode and electrode failure. The micro-cracks in the solid solution coating expose the underlying core material of the emitter electrode which can be more susceptible to corona plasma induced degradation.

Advantageously, it has been discovered that a layered electrode coating structure can mitigate cracking or at least propagation of cracks and corona erosion beyond the outer AgPd solid solution layer under corona plasma conditions. It has been further discovered that the electrode may be made robust to micro-cracking of the surface by creation of an underlying intermediate layer(s) that is less susceptible to deterioration in a corona environment thereby mitigating exposure of the electrode core material to the plasma discharge environment following compromise of the coating and enabling the electrode to maintain mechanical and electrical integrity. For example, an ozone reducing material or other exposed material may be exhausted without compromising the functionality of the underlying emitter electrode.

In some implementations, a multi-layered structure is formed over the electrode core material. With this layered structure, the sublayers prevent formation of micro-cracks in the outer solid solution layer from exposing underlying electrode core materials which deteriorate more quickly in the corona plasma environment. For example, a particular implementation includes a multi-layered structure including, starting from the outermost layer, an ozone reducing material that may be prone to cracking or wear, such as PdAg. A diffusion barrier material limits formation of the solid solution to the outermost layer. An adhesion layer such as Ni binds the diffusion barrier material to an underlying corona plasma resistant material, such as Pd, or a platinum group metal, e.g., rhodium, iridium, platinum and palladium. Additional suitable materials can include gold, titanium-tungsten alloy, chromium, rhodium, iridium, platinum and palladium. The corona plasma resistant material is in turn bound by a second adhesion material, such as Ni or Au, to a mechanically robust, high-strength electrode core material such as titanium, steel, tungsten, tantalum, molybdenum or nickel.

In some applications, a method of producing a layered electrode system includes depositing materials on an electrode core, e.g., a tungsten core, in the following order: Ni (adhesion layer), Pd, Ni (diffusion barrier), Pd (solvent metal), and Ag (solute material). The Ag coating is then diffused into the Pd at high temperature and the Ni layer serves as a diffusion barrier to protect the underlying Pd layer.

Micro-cracking can be mitigated, in some implementations, by introduction of a third element into the solid solution coating. A barrier layer may still be advantageous to protect the electrode core, in some cases. In some implementations, the solvent metal has a lattice structure and the first solute material has a first molecular structure tending to stress the lattice structure of the solvent metal when in solid solution. The second solute material has a second molecular structure tending to mitigate the stress on the lattice structure of the solvent metal from the first solute material when in solid solution together with the first solute material in the solvent metal. In a particular implementation, the solvent metal includes palladium, the first solute material includes silver and the second solute material includes at least one of nickel, manganese and copper.

In some implementations, titanium or tantalum serves as the solvent metal. Both of these metals exhibit high strength and conductance, yet typically oxidize in the type of plasma environment commonly found in an EHD device. Gold, however, resists tarnishing and oxidation and is soluble in both titanium and tantalum. A gold-enriched solid solution electrode surface is thus more resistant to oxidation than either of the pure solvent metals, improving at least that characteristic without significantly impacting other desirable solvent metal properties like tensile strength or electrical conductivity.

In some implementations, the longevity of an EHD device may be improved if dust or other detrimental materials do not accumulate on the emitter and collector electrode surfaces. Different pure metals suitable for use as emitter or collector electrodes generally exhibit similar relatively high friction coefficients. However, non-metal materials such as carbon graphite are known to have relatively low friction coefficients. Advantageously, some metals, notably palladium, can absorb nearly up to about 2 wt % carbon in interstitial solid solution. An interstitial solid solution of graphite in palladium provides the characteristics of palladium, with the additional low friction coefficient characteristic of graphite. Thus, a solid solution including graphite can provide a low coefficient of friction and/or low surface adhesion to an electrode surface.

In an interstitial solid solution, the solute material atoms fit inside the empty volume or “interstices” of the solvent metal matrix. In a substitutional solid solution, the solute material atoms displace some of the solvent metal atoms in the solvent metal matrix.

In some implementations, one or more compounds or alloys may serve as the solute material in solid solution with the solvent metal. For example, a solid solution can include molybdenum as the solvent metal modified by the addition of a nickel molybdenum compound as the solute material. In this instance, the materials characteristics are those of molybdenum and the compound MoNi.

In some implementations, a single solvent metal may accommodate more than one solute material, each added to confer different, substantially independent characteristics. For example, a palladium solvent metal may receive both silver and manganese independently as solute materials.

In some implementations, one aspect of the invention features a multi-layered electrode for use in an electrohydrodynamic device. The electrode includes an electrode core material and a coating about the core material, the coating being susceptible to adverse effects from a plasma discharge environment, e.g., following micro-crack formation, pinhole formation, defect formation, corona erosion or consumption of a portion of the coating.

A barrier material is disposed between the electrode core material and the coating. The barrier material selected to substantially mitigate exposure of the electrode core material to the adverse affects of the plasma discharge environment following compromise of the coating, e.g., due to micro-cracking, pin hole formation, coating defect formation or corona erosion of the coating.

In some implementations, the coating is a solid solution includes a solvent metal and at least one solute material.

In some implementations, the barrier material includes a diffusion barrier material selected to bound diffusion of the solute material within the solvent metal.

In some implementations, an adhesion promoting layer is disposed between the barrier material and at least one of the electrode core material and the solid solution coating.

In some implementations, at least one of the barrier material and the adhesion promoting layer includes at least one of nickel, gold, titanium-tungsten alloy and chromium.

In some implementations, at least one of the barrier material and the adhesion promoting material further includes multiple distinct layers.

In some implementations, the multiple layers of the at least one of the barrier material and the adhesion promoting material include nickel, rhodium, iridium, platinum and palladium.

In some implementations, the coating includes a solid solution in which a solvent metal includes palladium and a first solute material includes silver.

In some implementations, the coating includes an ozone reducing material.

In some implementations, the electrode core material includes at least one of tungsten, titanium, steel, tantalum, molybdenum and nickel.

In some implementations, the coating is a solid solution formed by heat treating distinct solvent metal and solute material depositions.

In some implementations, the barrier layer is selected to resist corona erosion following consumption of a portion of the coating.

In some implementations, one aspect of the invention features an electrohydrodynamic device including one or more collector electrodes; and a layered emitter electrode in spaced relation to the one or more collector electrodes. The layered emitter electrode and one or more collector electrodes are energizable to motivate fluid flow along a flow path. The layered emitter electrodes include: an electrode core material, a coating about the core material, the coating being susceptible to adverse effects from a plasma discharge environment, e.g., micro-crack propagation, pinhole formation, coating defect formation and corona erosion. A barrier material is provided between the electrode core material and the coating. The barrier material is selected to substantially mitigate exposure of the electrode core material to the adverse effects from a plasma discharge environment following micro-cracking, pinhole formation, coating defect formation, corona erosion or consumption of the coating.

In some implementations, the coating includes a solid solution of a solvent metal and a solute material, the solute material exhibiting one or more of ozone reactivity, resistance to oxidation, resistance to corona erosion, low coefficient of friction, and low surface adhesion.

In some implementations, the coating includes palladium and nickel, the layered electrode further includes an adhesion promoting layer includes nickel between the electrode core material and the coating.

In some implementations, one aspect of the invention features an apparatus including an enclosure and a thermal management assembly for use in convection cooling of one or more devices within the enclosure. The thermal management assembly defines a flow path for conveyance of air between portions of the enclosure over heat transfer surfaces positioned along the flow path to dissipate heat generated by the one or more devices. The thermal management assembly includes an electrohydrodynamic (EHD) fluid accelerator including one or more collector electrodes and a layered emitter electrode in spaced relation to the one or more collector electrodes. The layered emitter electrode and one or more collector electrodes are energizable to motivate fluid flow along a flow path. The layered emitter electrodes includes: an electrode core material, a coating about the core material, the coating being susceptible to adverse effects from a plasma discharge environment, e.g., micro-crack propagation, pin hole formation, coating defect formation or corona erosion. A barrier material is provided between the electrode core material and the coating. The barrier material is selected to substantially mitigate exposure of the electrode core material to the plasma discharge environment following compromise of the coating, e.g., due to micro-crack propagation, pin hole formation, coating defect formation, corona erosion or consumption of a portion of the coating.

In some implementations, the one or more devices includes one of a computing device, laptop computer, tablet computer, smart phone, projector, copy machine, fax machine, printer, radio, audio or video recording device, audio or video playback device, communications device, charging device, power inverter, light source, medical device, home appliance, power tool, toy, game console, television, and video display device.

In some implementations, the solute material is selected to reduce ozone. In some cases, the first solute material is an ozone reducing material, e.g., catalyst, selected from a group that includes: manganese dioxide (MnO₂); silver (Ag); silver oxide (Ag₂O); and an oxide of copper (CuO).

In some implementations, an electrohydrodynamic fluid accelerator includes an emitter electrode and/or at least one collector electrode including a solid solution and energizable to generate ions and to thereby motivate fluid flow along a flow path. The collector electrode is coupled into a heat transfer pathway to dissipate heat into the fluid flow. The emitter and/or collector electrodes exhibit performance characteristics of both the solvent metal and solute material(s) of the solid solution.

In some applications, a method of making a product includes providing an electrode core and selecting a solvent metal and solute material to form a solid solution on the electrode core material. The solvent metal and solute material are selected to provide respective first and second performance characteristics.

In some applications, forming the solid solution component includes one of dip coating, spray coating or electroplating an underlying structure with the solid solution. In some applications, forming the solid solution component includes one of electroplating, anodizing or alodizing an underlying structure. In some cases, heat treatment of separate solvent and solute materials deposited by any of the above methods can be used to form the solid solution.

In some applications, one aspect of the invention features a method of forming an electrode. The method includes: providing an electrode core material and providing a coating over the electrode core material, the coating being susceptible to at least one of micro-cracking pinhole formation, coating defect formation and corona erosion. The method further includes providing a barrier material between the electrode core material and the coating to substantially mitigate exposure of the electrode core material due to the at least one of micro-cracking pin hole formation, coating defect formation and corona erosion of the coating.

In some applications, the method includes providing an adhesion promoting material between the barrier material and at least one of the electrode core material and the coating.

In some applications, at least one of the adhesion promoting material and the barrier material includes nickel.

In some applications, providing the coating includes heat treating silver and palladium deposits such that the silver diffuses into the palladium but not into the barrier material.

In some applications, the method further includes providing a Pt metal layer between the electrode core material and the coating.

In some applications, the method further includes positioning heat transfer surfaces downstream of, and proximate to, the collector electrode; and fixing an emitter electrode proximate to the collector electrode that, when energized, generates ions and thereby motivates fluid flow over the heat transfer surfaces. The emitter electrode, collector electrode and heat transfer surfaces are so positioned and fixed to constitute a thermal management assembly.

In some applications, the method includes introducing the thermal management assembly into an electronic device and thermally coupling a heat dissipating device thereof to the heat transfer surfaces.

In the present application, some implementations of the devices illustrated and described herein are referred to as electrohydrodynamic fluid accelerator devices, also referred to as “EHD devices,” “EHD fluid accelerators,” and the like. Such devices are suitable for use as a component in a thermal management solution to dissipate heat generated by an electronic circuit amongst other things. For concreteness, some implementations are described relative to particular EHD device configurations in which a corona discharge at or proximate to an emitter electrode operates to generate ions that are accelerated in the presence of electrical fields, thereby motivating fluid flow. While corona discharge-type devices provide a useful descriptive context, it will be understood (based on the present description) that other ion generation techniques may also be employed. For example, in some implementations, techniques such as silent discharge, AC discharge, dielectric barrier discharge (“DBD”) or the like may be used to generate ions that are in turn accelerated in the presence of electrical fields and to motivate fluid flow.

Based on the description herein, persons of ordinary skill in the art will appreciate that provision of solid solution materials on electrodes or other systems surfaces may likewise benefit systems that employ other ion generation techniques to motivate fluid flow. For example, a DBD system that provides electrical discharge between two electrodes separated by an insulating dielectric barrier may generate ozone, which may be mitigated using techniques described herein. Thus, in the claims that follow, the terms “emitter electrode” and “electrohydrodynamic fluid accelerator” are meant to encompass a broad range of devices without regard to the particular ion generation techniques employed.

In some cases, the emitter electrode and the collector electrode(s) together at least partially define an electrohydrodynamic fluid accelerator. For example, emitter electrode and the collector electrode(s) can be positioned relative to one another such that, when energized, ions are generated therebetween and fluid flow is thereby motivated along a fluid flow path.

In some implementations, the electrohydrodynamic fluid accelerator includes the emitter electrode and is energizable to motivate fluid flow along a fluid flow path, and the collector electrode surfaces are disposed upstream of the electrohydrodynamic fluid accelerator along the fluid flow path and are operable as part of an electrostatic precipitator.

In some implementations, an electrode including an exposed solid solution portion is energizable to contribute to flow of ion current in one of an electrohydrodynamic fluid accelerator and an electrostatic precipitator. In some implementations, both the emitter electrode and the collector electrode(s) are operable as part of an electrohydrodynamic fluid accelerator. Still, in some implementations, the emitter electrode and the collector electrode(s) are operable as part of an electrostatic precipitator. In some cases, at least one additional electrode surface is disposed either upstream or downstream of the electrohydrodynamic fluid accelerator or electrostatic precipitator along the fluid flow path.

In some implementations, the EHD device is part of a thermal management assembly for use in convective cooling of one or more devices within an enclosure. The thermal management assembly defines a flow path for conveyance of air between portions of the enclosure over heat transfer surfaces positioned along the flow path to dissipate heat generated by the one or more devices. The thermal management assembly includes an electrohydrodynamic (EHD) fluid accelerator including emitter and collector electrodes energizable to motivate fluid flow along the flow path.

In some implementations, the one or more devices includes one of a computing device, projector, copy machine, fax machine, printer, radio, audio or video recording device, audio or video playback device, communications device, charging device, power inverter, light source, medical device, home appliance, power tool, toy, game console, television, and video display device.

Advantages of use of an EHD device for thermal management in such devices includes, e.g., substantially silent operation, reduced power consumption, reduced vibration, reduced thermal solution footprint and volume, and form factor flexibility, e.g., capability to utilize space around other electronics.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention may be better understood, and its numerous objects, features, and advantages made apparent to those skilled in the art by referencing the accompanying drawings.

FIG. 1 is a depiction of certain basic principles of electrohydrodynamic (EHD) fluid flow.

FIG. 2 depicts a cross-sectional view of an electrode including an electrode core and a solid solution layer about the core including a solvent metal and a solute material.

FIG. 3 depicts a cross-sectional view of an electrode having a substantial portion thereof formed of a solid solution of a solvent metal and a solute material.

FIG. 4 depicts an interstitial solid solution matrix structure.

FIG. 5 depicts a substitutional solid solution matrix structure.

FIG. 6 depicts a block diagram of a method of providing an electrode with independent performance characteristics of respective solid solution components.

FIG. 7 depicts a layered electrode coating structure providing robustness against electrode erosion from surface micro-cracking

FIG. 8 depicts a block diagram of a method of forming a multi-layered electrode structure.

FIG. 9 depicts a schematic block diagram illustrating one implementation of an environment in which a solid solution electrode may operate.

FIG. 10 is a rear view of a display device including an EHD device in which a solid solution electrode may operate to motivate airflow along a localized flow path.

FIGS. 11a-b depict top views of tablet or handheld computing devices including an EHD in which a solid solution electrode may operate to motivate airflow.

The use of the same reference symbols in different drawings indicates similar or identical items.

DETAILED DESCRIPTION

Some implementations of thermal management systems described herein employ EHD devices to motivate flow of a fluid, typically air, based on acceleration of ions generated as a result of corona discharge. Other implementations may employ other ion generation and motivation techniques and will nonetheless be understood in the descriptive context provided herein. For example, in some implementations, techniques such as silent discharge, AC discharge, dielectric barrier discharge (DBD) or the like may be used to generate ions that are in turn accelerated in the presence of electrical fields to motivate fluid flow.

Typically, when a thermal management system is integrated into an operational environment, heat transfer paths (often implemented as heat pipes or using other technologies) are provided to transfer heat from where it is generated or dissipated to a location(s) within an enclosure where air flow motivated by an EHD device(s) flows over primary heat transfer surfaces. For example, heat generated by various system electronics (e.g., microprocessors, graphics units, etc.) and/or other system components (e.g., light sources, power units, etc.) can be transferred via a heat pipe to radiator fins and then to a cooling fluid and exhausted from the enclosure. Of course, while some implementations may be fully integrated in an operational system such as a laptop or desktop computer, a projector or video display device, printer, photocopier, etc., other implementations may take the form of subassemblies.

With reference to FIG. 2, an electrode 200 includes an electrode core 202 and a solid solution layer 204 about core 202. Solid solution layer 204 includes a solvent metal 206 and a solute material 208. In some implementations, electrode core 202 and solvent metal 206 can include at least one of, e.g., tungsten, titanium, tantalum, palladium, molybdenum, and titanium nitride. In some implementations, solute electrode material 208 can include at least one of silver, nickel, manganese, gold, carbon, hydrogen, silicon and germanium.

Electrode 200 can be an emitter, collector or other electrode component of an EHD device. In some implementations, an emitter electrode 200 includes a surface, e.g., solid solution layer 204, comprising a solvent metal 206 and a solute material 208 selected to provide two substantially independent performance characteristics to the electrode surface. One or more collector electrodes can be positioned in spaced relation to emitter electrode 200 with the electrodes being energizable to motivate fluid flow along a flow path. The solute material 208 causes electrode 200 to exhibit one or more of ozone reactivity, resistance to oxidation, resistance to corona erosion, low coefficient of friction, and low surface adhesion.

In some implementations, the solute material 208 may be selected to have an ozone reduction function, e.g., to catalyze or otherwise reduce ozone generated by the device. As an illustrative example, a material that includes silver (Ag) may be used to reduce ozone in an air flow. Silver may also be used to prevent silica growth. In some embodiments, solute material 208 can include at least one of silver (Ag), silver oxide (Ag2O), manganese dioxide (MnO2), oxides of copper (CuO), palladium, cobalt, iron and carbon or other ozone reactive materials.

As used herein, the terms “ozone reducing material” refers to any material useful to catalyze, bind, sequester or otherwise reduce ozone. Ozone reducing materials can include ozone catalysts, ozone catalyst binders, ozone reactants or other materials suitable to react with, bind to, or otherwise reduce or sequester ozone. Ozone reducing materials can be selected to also target other undesirable airborne materials and pollutants.

In some implementations of electrode 200, solid solution layer 204 is formed via one of electroplating, anodizing, sputter deposition, dip coating and vapor deposited onto electrode core 202. In some instances, the solid solution layer 204 forms a substantially pore-free coating over electrode core 202. In some instances, solid solution layer 204 forms a discontinuous or varying layer over electrode core 202. Such a solid solution layer 204 need not be uniform or continuous over the entirety of core 202 or of operating surface of electrode 200.

In some implementations, the solute material 208 is deposited on the underlying solvent metal 206 and is then heat treated to form the solid solution layer 204. For example, a material that includes silver (Ag) is deposited over a palladium electrode core 202. The silver material and core 202 are then heat treated to infuse the silver into the surface of the palladium electrode core 202 to produce a solid solution layer 204 that reduces ozone production and can also prevent silica growth.

For example, in some implementations, the solid solution layer 204 may provide low adhesion or a “non stick” surface, or may exhibit a surface property that repels silica, which is a common material in dendrite formation. As an illustrative example, the solute material 208 may include carbon such as graphite, and may have low adhesion to dendrite formation and other detrimental material, and may improve the ease of mechanically removing such detrimental material.

Electrode performance characteristics may also be enhanced or provided by treating the surface or solid solution layer 204 of electrode 200. The terms “surface conditioning” and “conditioning materials” may be used to refer to any surface coating, surface deposit, surface alteration or other surface treatment suitable to provide ozone reduction, low surface adhesion, or other surface-specific performance or benefits described herein. For example, in some implementations, ozone reducing materials may be provided on various components in the form of “surface conditioning” on certain surfaces, e.g., on radiator surfaces, collector electrode surfaces, or other component surfaces.

With reference to FIG. 3, an electrode 300 is formed, at least through a substantial portion thereof, of a solid solution 304 including a solvent metal 306 and one or more solute material(s) 308/310. In some implementations, the solid solution 304 is of a substantially consistent composition throughout a thickness of the electrode 300. In some implementations, the solute materials 308/310 are concentrated substantially at an exterior portion, e.g., at the surface, of the electrode 300. In some implementations, the solute materials 308/310 include at least one of titanium nitride, chromium carbide and silica. In some implementations, the solute materials 308/310 include at least one of a metal, semi-metal, non-metal and a compound. Thus, one or multiple solute materials may be selected to provide desired performance characteristics in addition to those characteristics of the solvent metal 306.

In some implementations, the solvent metal 306 provides at least a first performance characteristic, e.g., moderate tensile strength and moderate hardness. The solute materials 308/310 provide at least a second performance characteristic, e.g., ozone reduction, low surface adhesion, low coefficient of friction, resistance to one of oxidation and corona erosion.

Electrode 300 may be formed substantially entirely of solid solution 304. Alternatively, solid solution 304 may comprise only a portion of the thickness of electrode 300. Thus, while electrode 300 is depicted as having the solid solution 304 extending substantially throughout the extent of electrode 300, solid solution 304 may be more concentrated or even limited to an outer portion of electrode 300 depending on the method of formation. For example, solid solution 304 may be formed on a preexisting electrode substrate via any number of plating, deposition, or other surface treatments.

While electrodes 200 and 300 are depicted as being substantially circular, any number of profiles may be used in electrode structures. For example, electrodes 200 and 300 may take the form of a plate, wire, rod, array, needle, cone, or the like and benefit from solid solution combined performance characteristics.

With reference to FIG. 4, an interstitial solid solution structure 400 includes a matrix of molecules of a solvent metal 402 and molecules of a solute material 404 in the interstices 406 of the matrix. A wide range of solute materials may be infused into the matrix of the solvent metal 402. For example, multiple solute materials 404 may be infused into the matrix of the solvent metal 402. Some examples of interstitial solid solutions include: carbon in iron, and hydrogen in palladium.

Such infusion can be accomplished, for example, by mixing the solvent metal 402 and solute material 404 in molten form. Alternatively, the solute material 404 may be infused into the surface of a solid solvent metal 402 via any suitable deposition method and heat treatment or other suitable infusion method. Other methods include sol gel, vapor phase deposition and wet plating.

In some cases, a solute material may cause internal stresses in the matrix of the solvent metal 402. It has been discovered that infusion of a multiple solute materials 404 of differing molecule size or properties can serve to at least partially mitigate such stresses and reduce the degree of resultant surface micro-cracking For example, a first solute material of manganese (atomic radius 127 pm) in palladium (atomic radius 137 pm) at 5 atomic percent solution may result in significant micro-cracking It has been discovered that infusion of a second solute material of silver (atomic radius 144 pm) can serve to mitigate the internal matrix stresses and resultant surface micro-cracking It is believed that the second solute material, which is a smaller molecule than that of the first solute material, allows for localized relief of lattice or matrix stresses due to the tight fit of the first solute material within the interstices of the matrix. Similarly, the second solute material may serve to further disperse the first solute material throughout the matrix, further reducing localized stress. Of course, the interstitial solute material 404 need not be uniformly dispersed within the solvent metal 402 but may be concentrated in discrete areas or within a particular thickness or other region.

With reference to FIG. 5, a substitutional solid solution structure 500 includes solvent metal molecules 502 and solute material molecules 504 in a matrix in which the solute material molecules 504 have displaced solvent metal molecules 502. Some examples of substitutional solid solutions include: silver in palladium, and manganese in palladium, and copper in nickel.

In some substitutional solid solution implementations, it may be desirable to select solvent metal 502 and solute material 504 and their relative concentrations so as to mitigate localized stresses in the solid solution matrix. Such stresses could otherwise lead to micro-cracking, which can, in turn, lead to erosion of the electrode, particularly of more susceptible core materials, and ultimately to premature electrode performance deterioration or electrode failure.

With reference again to FIG. 1, emitter electrode 10 may be energizable to generate ions and may be positioned relative to collector electrode(s) 12 to motivate fluid flow along a fluid flow path. Thus, emitter electrode 10 and collector electrode(s) 12 may at least partially define an EHD fluid accelerator. Any number of additional electrodes may be positioned upstream and downstream of the EHD fluid accelerator along the fluid flow path. For example, in some implementations, a collector electrode can be disposed upstream of the EHD fluid accelerator along the fluid flow path and can operate as an electrostatic precipitator.

With reference to FIG. 6, in some applications, a method 600 of making a product includes providing an electrode core material. (block 602). The method further includes selecting a solvent metal with a first performance characteristic. (block 604). At least a first solute material is also selected with a second performance characteristic. (block 606). A solid solution is then formed about the electrode core from the solvent metal and the solute material(s). (block 608). Each of the solvent metal and the solute material remain substantially pure at the atomic level within the solid solution and thus impart the respective independent first and second performance characteristics to the electrode. (610)

The solid solution can be first formed and then deposited on the electrode core. Alternatively, in some implementations, the electrode core material comprises the solvent metal, and the solid solution is provided at least at the surface of the electrode core material. For example, the solid solution can be formed on the electrode core, e.g., with the solute material infusing into the electrode core as the solvent metal. In some cases, a substantial portion of the electrode itself can be formed from a solid solution.

For example, providing the solid solution on the electrode core material can comprise providing, separately, the solute material and the solvent metal over a core and heat treating the solute material and solvent metal to induce formation of the solid solution. In some applications, the solid solution is provided on the electrode core material via at least one of electroplating, vapor deposition, and sputter deposition. In some implementations, the solid solution is provided substantially at the surface of the electrode core material. In some implementations, the solid solution extends, at least partially, into the electrode core material.

In implementations in which the electrode core is the solvent metal, the solid solution can extend substantially throughout the electrode core material. Example solvent metals include, e.g., at least one of tungsten, titanium, tantalum, palladium, molybdenum, and titanium nitride. Example solute material(s) include, e.g., at least one of silver, nickel, gold, carbon, hydrogen, silicon, germanium, titanium nitride, chromium carbide, and silica.

With reference to FIG. 7, a multi-layered electrode structure 700 provides robustness against electrode erosion following surface micro-cracking An electrode core material 702 is provided with various barrier layers between the core material and an outermost solid solution layer 704. The solid solution layer 704, e.g., an AgPd solid solution, provides ozone reduction or other desired performance characteristic. Due, at least in part, to the difference in the size of the solid solution atoms, e.g., between the Pd solvent metal and Ag solute material atoms, micro-cracks can form in solid solution layer 704, which can expose underlying layers to corona erosion. Solute materials may include, for example, manganese, silver, nickel, gold, carbon, hydrogen, silicon, germanium, titanium nitride, chromium carbide and silica.

Micro-cracking of the surface, in turn, can accelerate deterioration of the electrode as the micro-cracks expose the underlying electrode core material 702. Some electrode core material 702 candidates, e.g., titanium, are susceptible to corona plasma induced degradation. In some implementations, electrode core material is a mechanically robust, high-strength material such as tungsten, steel, or titanium.

Advantageously, it has been discovered that a layered electrode coating structure can mitigate cracking or at least propagation of cracks beyond the outer AgPd solid solution layer under corona plasma conditions. One implementation of a multi-layered structure 700 is described, starting from the outermost solid solution layer 704, e.g., an ozone reducing material that may be prone to cracking or wear, such as PdAg. In some cases, a layer of pure solvent metal 706 may remain between the diffusion barrier and the solid solution layer 704 depending on the depth of penetration of the solute material into the solvent metal.

A diffusion barrier material 708 limits formation of the solid solution to the outermost layer 704, e.g., in cases where the solid solution is formed on the electrode rather than before coating onto the electrode. Suitable diffusion barrier materials include nickel, chromium, platinum, and titanium-tungsten oxy-nitride. Of course, layer 708 may be omitted in cases where the solid solution of layer 704 is formed before application of layer 704 because the solute material will not diffuse into underlying layers.

A Pt metal group layer 710 underlying diffusion barrier material 708 is bonded to electrode core material 702 via an adhesion layer 712. Suitable adhesion layer materials can include nickel, chromium and titanium. Pt group metals can include Pd, Rh, Ir, Pt, etc. With this layered structure 700, diffusion barrier material 708 limits solute material diffusion, and therefore resultant micro-cracking to outer layer 704. Diffusion barrier material 708 can thus also limit erosion of the solute material to layer 704. Thus, diffusion barrier material 708 and the underlying Pt grout materials and adhesion layers ensure that any micro-cracks that may form in the outer solid solution layer 704 do not expose underlying electrode core material 702.

In some cases, the Pt group metal layer 710 may serve as diffusion barrier layer 708, such that these two layers are effectively a single layer. Similarly, in some cases, the solid solution of layer 704 may not be formed in situ, but may be applied as a solid solution, such that layers 706 and 708 are omitted.

With reference to FIG. 8, in some applications, a method of producing a layered electrode system 800 includes providing an electrode core (block 802) and depositing various materials (blocks 804-812) on the electrode core, e.g., on a tungsten (W) core. An adhesion layer, e.g., Ni or Au, is provided over the electrode core material. (block 804). A Pt group metal layer, e.g., Pd, is provided over the adhesion layer. (block 806) A diffusion barrier layer, e.g., Ni, is provided over the Pt group metal layer. (block 808). A solvent metal layer, e.g., Pd, is provided over the diffusion barrier layer. (block 810) A solute material, e.g., Ag, is provided over the solvent metal layer. (block 812). The solute material is then diffused into the solvent metal to form a solid solution, with diffusion being limited to the solvent metal layer by the diffusion barrier material.

In a particular illustrative implementation, the various electrode layers may be applied in the following order: Ni, Pd, Ni, Pd, and Ag. For example, the Ag layer is then diffused into the Pd at high temperature and the Ni layer serves as a diffusion barrier to protect the underlying Pd layer. Thus, any erosion of the solute material or at the loci of micro-cracks in the solid solution layer may be largely constrained to the outermost layer(s), protecting the underlying layers, and significantly, the electrode core material.

It will be understood, that a wide range of materials may be used for each of the layers of the layered electrode structure and that additional layers may be added or interposed. For example, in some implementations, multiple solid solution layers may be used to limit micro-cracking within the discrete solid solution layers while providing a greater overall solid solution thickness. Similarly, layers may be combined or omitted depending on the materials selected and desired performance characteristics. Accordingly, a wide range of layered electrode structures are within the scope of the invention.

While earlier electrode structures generally sought to present the most inert or durable layer on the electrode outermost surface, implementations of the multi-layered electrode structure provide a durable sublayer beneath a more corona erosion susceptible outermost layer.

It has also been discovered that addition of a third element into the solid solution can mitigate lattice imbalances and the resultant stresses in a solid solution. For example, nickel (Ni) and copper (Cu) have similar lattice structures as Ag and Pd (face centered cubic) and a lattice constant smaller than Pd. In addition, nickel, manganese and copper also form oxides that can catalyze reduction of ozone. Thus, addition of nickel or copper into a solid solution containing palladium and silver can serve to mitigate the lattice stresses and resultant micro-cracking observed with palladium and silver alone in solid solution.

In some implementations, an electrode for use in an electrohydrodynamic device includes an electrode core material and a solid solution coating about the core material. The solid solution coating includes a solvent metal and a first solute material, which, when in solid solution alone with the solvent metal, produces micro-cracking of the solid solution coating. The solid solution further includes a second solute material, which, when in solid solution in the solvent metal together with the first solute material, substantially mitigates micro-cracking of the solid solution coating.

In some implementations, the solvent metal has a lattice structure and the first solute material has a first molecular structure tending to stress the lattice structure of the solvent metal when in solid solution. The second solute material has a second molecular structure tending to mitigate the stress on the lattice structure of the solvent metal from the first solute material when in solid solution together with the first solute material in the solvent metal. In a particular implementation, the solvent metal includes palladium, the first solute material includes silver and the second solute material includes at least one of nickel, manganese and copper.

In some applications, an EHD product is made by a method that includes positioning an emitter or collector electrode comprising a solid solution and at least one other electrode to motivate fluid flow along a flow path when the electrodes are energized. One or both of the emitter and collector electrodes, or another electrode, includes a surface comprising a solid solution comprising a solvent metal and a solute material selected to provide two substantially independent performance characteristics to the respective electrode surface.

In some applications, the method further includes positioning heat transfer surfaces in the flow path to transfer heat to the fluid flow. The emitter electrode, collector electrode and primary heat transfer surfaces are so positioned and fixed to constitute a thermal management assembly.

In some applications, the method includes introducing the thermal management assembly into an electronic device and thermally coupling a heat generating or dissipating device thereof to the primary heat transfer surfaces. In some cases, the electronic device includes at least one of a computing device, projector, copy machine, fax machine, printer, radio, audio or video recording device, audio or video playback device, communications device, charging device, power inverter, light source, medical device, home appliance, power tool, toy, game console, television, and video display device.

In some implementations, an EHD fluid accelerator includes an emitter electrode and a collector electrode(s) energizable to generate ions and to thereby motivate fluid flow along a flow path. Primary heat transfer surfaces (collectively referred to sometimes as a “radiator”) are positioned downstream of the emitter electrode along the flow path. The radiator is coupled into a heat transfer pathway to dissipate heat from a device into the fluid flow.

In some implementations, the radiator is distinct from the collector electrode, but proximate thereto in the flow path. In some cases, the radiator is positioned immediately downstream of the collector electrode. In some cases, the radiator abuts the collector electrode. In some cases, the radiator is spaced a distance apart from the collector electrode. Still, in some implementations, the downstream radiator and the collector electrode are constituent surfaces of a unitary structure that functions both as the collector electrode and as a radiator. In some cases, the downstream radiator and the collector are separately formed, but joined to form the unitary structure. In some cases, the radiator and collector are integrally formed.

In some implementations, a monolithic structure may act as a collector electrode and a heat transfer radiator. The solid solution materials may be selected to provide both desirable performance characteristics for both electrode and radiator functions. In some implementations, the collector electrodes and radiator are provided (or at least fabricated) as separate structures that may be mated, integrated or more generally positioned proximate to each other in operational configurations. These and other variations will be understood with reference to the described implementations.

Some implementations of thermal management systems described herein employ EFA or EHD devices to motivate flow of a fluid, typically air, based on acceleration of ions generated as a result of corona discharge. Other implementations may employ other ion generation techniques and will nonetheless be understood in the descriptive context provided herein. Using heat transfer surfaces that may or may not be monolithic or integrated with collector electrodes, heat dissipated by electronics (e.g., microprocessors, graphics units, etc.) and/or other components can be transferred to the fluid flow and exhausted. Typically, when a thermal management system is integrated into an operational environment, heat transfer paths e.g., heat pipes, are provided to transfer heat from where it is dissipated or generated to a location(s) within the enclosure where air flow motivated by an EFA or EHD device(s) flows over heat transfer surfaces.

In general, a variety of scales, geometries, positional interrelationships and other design variations are envisioned for emitter and collector electrodes of a given device. For concreteness of description, certain illustrative implementations, surface profiles and positional interrelationships with other components are described herein. In some implementations, the emitter electrode is an elongated wire and the collector electrode includes two elongated plates substantially parallel to the emitter electrode. Of course, the emitter and collector electrodes may be selected and arranged in any manner suitable to generate ions and thereby motivate fluid flow. For example, planar portions of the collector electrodes may be oriented generally orthogonally to the longitudinal extent of an emitter electrode wire. Any references to leading, trailing, upstream, or downstream are to be understood with directional reference to EHD fluid flow.

In some thermal management system implementations, collector electrodes can provide significant heat transfer to fluid flows motivated therethrough or thereover. In some cases, the collector electrodes can also serve as a primary heat transfer surface. In some thermal management implementations, the primary heat transfer surfaces do not participate substantially in EHD fluid acceleration, i.e., they do not serve as electrodes.

It will be understood that particular EHD design variations are included for purposes of illustration and, persons of ordinary skill in the art will appreciate a broad range of design variations consistent with the description herein. Although implementations of the present invention are not limited thereto, portions of the description herein are consistent with geometries, air flows, and heat transfer paths typical of laptop-type computer electronics and will be understood in view of that descriptive context. Of course, the described implementations are merely illustrative and, notwithstanding the particular context in which any particular implementation is introduced, persons of ordinary skill in the art having benefit of the present description will appreciate a wide range of design variations and exploitations for the developed techniques and configurations. Indeed, EHD device technologies present significant opportunities for adapting structures, geometries, scale, flow paths, controls and placement to meet thermal management challenges in a wide range of applications, systems and devices of various form factors. Moreover, reference to particular materials, dimensions, packaging or form factors, thermal conditions, loads or heat transfer conditions and/or system designs or applications is merely illustrative.

FIG. 9 is a schematic block diagram illustrating one implementation of an environment in which a solid solution electrode may operate. An electronic device 900, such as a computer, includes an EFA or EHD air cooling system 920. Electronic device 900 comprises a housing 916, or case, having a cover 910 that includes a display device 912. A portion of the front surface 921 of housing 916 has been cut away to reveal interior 922. Housing 916 of electronic device 900 may also comprise a top surface (not shown) that supports one or more input devices that may include, for example, a keyboard, touchpad and tracking device. Electronic device 900 further comprises electronic circuit 960 which generates heat in operation. A thermal management solution comprises a heat pipe 944 that draws heat from electronic circuit 960 to heat sink device 942.

Device 920 is powered by high voltage power supply 930 and is positioned proximate to heat sink 942. Electronic device 900 may also comprise many other circuits, depending on its intended use; to simplify illustration of this second implementation. Other components that may occupy interior area 922 of housing 920 have been omitted from FIG. 9.

With continued reference to FIG. 9, in operation, high voltage power supply 930 is operated to create a voltage difference between emitter electrodes and collector electrodes disposed in device 920, generating an ion flow or stream that moves ambient air toward the collector electrodes. The moving air leaves device 920 in the direction of arrow 902, traveling through the protrusions of heat sink 942 and through an exhaust grill or opening 970 in the rear surface 918 of housing 916, thereby dissipating heat accumulating in the air above and around heat sink 942. Note that the position of illustrated components, e.g., of power supply 930 relative to device 920 and electronic circuit 960, may vary from that shown in FIG. 9.

Note that electronic device 900 has been greatly simplified for purposes of illustration and the position of illustrated components, e.g., of power supply 930 relative to device 920 and electronic circuit 960, may vary from that shown in FIG. 9. While device 900 is depicted as a laptop computing device, tablet devices, and handheld devices may likewise benefit from EHD cooling and ozone reduction as described.

A controller 932 is connected to device 920 and may use sensor inputs to determine the state of the air cooling system, e.g., to determine a need for cleaning electrodes on a timed or scheduled basis, on a system efficiency measurement basis or by other suitable methods of determining when to clean electrodes. For example, detection of electrode arcing or other electrode performance characteristics may be used to initiate movement of a cleaning device or electrode conditioning device. Electrode performance may be determined, for example, by monitoring voltage levels, current levels, acoustic levels, electrical potentials, determining of the presence of a level of contamination by optical means, detecting an event or performance parameter, or other methods indicating a benefit from mechanically cleaning or conditioning the electrode.

With reference to FIG. 10, in some implementations, one or more EHD air movers 1066 including a solid solution electrode may be positioned along an edge of a display device 1060, e.g., television or monitor, to provide air flow to dissipate heat generated by a light source 1050 of the display device 1060. The air flow can travel a flow path extending across a major dimension of the display device or can travel a more localized path. Heat transfer and dissipation can be aided by heat spreaders, heat pipes, or other thermal spreaders/paths. In this example, EHD air movers 1066 motivate air flow over a relatively short flow path across heat transfer surfaces associated with light sources 1060. The inlets and outlets of the flow path can be defined in any suitable combination of display housing surfaces, e.g., front bezel portions, top or bottom surfaces, lateral surfaces or rearward facing portions of the display device 1060.

With reference to FIGS. 11a-b, in some implementations, one or more EHD air movers 1066 including a solid solution electrode are constructed and arranged to motivate air flow (indicated by broad arrows) through or within a tablet or handheld computing device 1080, 1080′. For example, air flow may be drawn into and exhausted from device 1080 as in FIG. 9a, passing, e.g., over a battery, CPU, display light source, or associated heat transfer surfaces. Alternatively, the air flow may circulate within a substantially sealed portion of an enclosure of device 1080′ to better distribute heat for radiative heat transfer from the enclosure to the environment. In some implementations, device 1080 has a total thickness of less than about 10 mm and a display surface covers substantially an entire major surface thereof. Any air flow topology and EHD air mover placement may be suitably selected relative to respective electronic assemblies (or circuit boards) for processors (e.g., CPU, GPU, etc.) and/or radio frequency (RF) sections (e.g., WiFi, WiMax, 3G/4G voice/data, GPS, etc.).

In some implementations, an EFA or EHD air cooling system or other similar ion action device employing an electrode cleaning system may be integrated in an operational system such as a laptop or desktop computer, a projector or video display device, etc., while other implementations may take the form of subassemblies. Various features may be used with different devices including EFA or EHD devices such as air movers, film separators, film treatment devices, air particulate cleaners, photocopy machines and cooling systems for electronic devices such as computers, laptops and handheld devices. One or more devices includes one of a computing device, projector, copy machine, fax machine, printer, radio, audio or video recording device, audio or video playback device, communications device, charging device, power inverter, light source, medical device, home appliance, power tool, toy, game console, television, and video display device.

While the foregoing represents a description of various implementations of the invention, it is to be understood that the claims below recite the features of the present invention, and that other implementations, not specifically described hereinabove, fall within the scope of the present invention.

Claims

1. A multi-layered electrode for use in an electrohydrodynamic device, the electrode comprising:

an electrode core material;

a coating about the core material, the coating being susceptible to compromise due to adverse effects from a plasma discharge environment; and

a barrier material between the electrode core material and the coating, the barrier material selected to substantially mitigate exposure of the electrode core material to the plasma discharge environment following compromise of the coating.

2. The electrode of claim 1, wherein the barrier layer is selected to resist the adverse effects from a plasma discharge environment following at least one of micro-crack formation, pinhole formation, defect formation, erosion and consumption of a portion of the coating.

3. The electrode of claim 1, wherein the coating is a solid solution comprising a solvent metal and at least one solute material.

4. The electrode of claim 3, wherein the barrier material includes a diffusion barrier material selected to bound diffusion of the solute material within the solvent metal.

5. The electrode of claim 1, further comprising an adhesion promoting layer between the barrier material and at least one of the electrode core material and the solid solution coating.

6. The electrode of claim 5, wherein at least one of the barrier material and the adhesion promoting layer comprises at least one of nickel, gold, titanium-tungsten alloy, chromium, rhodium, iridium, platinum and palladium.

7. The electrode of claim 5, wherein at least one of the barrier material and the adhesion promoting material further comprises multiple distinct layers.

8. The electrode of claim 7, wherein the multiple layers of the at least one of the barrier material and the adhesion promoting material include nickel, rhodium, iridium, platinum, palladium, gold, titanium-tungsten alloy and chromium.

9. The electrode of claim 1, wherein the coating comprises a solid solution in which a solvent metal includes palladium and a first solute material includes silver.

10. The electrode of claim 1, wherein the electrode core material comprises at least one of tungsten, titanium, steel, tantalum, molybdenum and nickel.

11. The electrode of claim 1, wherein the coating is a solid solution formed by heat treating distinct solvent metal and solute material depositions.

12. The electrode of claim 1, wherein the coating comprises an ozone reducing material.

13. A method of forming an electrode, the method comprising:

providing an electrode core material;

providing a coating over the electrode core material, the coating being susceptible to compromise due to adverse effects from a plasma discharge environment; and

providing a barrier material between the electrode core material and the coating to substantially mitigate exposure of the electrode core material to the plasma discharge environment following compromise of the coating.

14. The method of claim 13, further comprising providing an adhesion promoting material between the barrier material and at least one of the electrode core material and the coating.

15. The method of claim 13, wherein at least one of the adhesion promoting material and the barrier material comprises nickel.

16. The method of claim 13, wherein providing the coating includes heat treating silver and palladium deposits such that the silver diffuses into the palladium but not into the barrier material.

17. The method of claim 13, further comprising providing a Pt group metal layer between the electrode core material and the coating.

18. An electrohydrodynamic device comprising:

one or more collector electrodes; and

a layered emitter electrode in spaced relation to the one or more collector electrodes; the layered emitter electrode and one or more collector electrodes being energizable to motivate fluid flow along a flow path;

wherein the layered emitter electrodes comprises: an electrode core material; a coating about the core material, the coating being susceptible to compromise due to adverse effects from a plasma discharge environment; and a barrier material between the electrode core material and the coating, the barrier material selected to substantially mitigate exposure of the electrode core material to the plasma discharge environment following compromise of the coating.

19. The device of claim 18, wherein the coating comprises a solid solution of a solvent metal and a solute material, the solute material exhibiting one or more of ozone reactivity, resistance to oxidation, resistance to corona erosion, low coefficient of friction, and low surface adhesion.

20. The device of claim 18, wherein the coating comprising palladium and nickel, the layered electrode further comprising an adhesion promoting layer comprising nickel between the electrode core material and the coating.

21. An apparatus comprising:

an enclosure; and

a thermal management assembly for use in convection cooling of one or more devices within the enclosure, the thermal management assembly defining a flow path for conveyance of air between portions of the enclosure over heat transfer surfaces positioned along the flow path to dissipate heat generated by the one or more devices, the thermal management assembly including an electrohydrodynamic (EHD) fluid accelerator comprising:

one or more collector electrodes; and

a layered emitter electrode in spaced relation to the one or more collector electrodes; the layered emitter electrode and one or more collector electrodes being energizable to motivate fluid flow along a flow path;

wherein the layered emitter electrodes comprises: an electrode core material; a coating about the core material, the coating being susceptible to at least one of micro-cracking, pin hole formation, coating defect formation and corona erosion; and a barrier material between the electrode core material and the coating, the barrier material selected to substantially mitigate exposure of the electrode core material to the plasma discharge environment following compromise of the coating.

22. The apparatus of claim 21, wherein the one or more devices includes one of a computing device, laptop computer, tablet computer, smart phone, projector, copy machine, fax machine, printer, radio, audio or video recording device, audio or video playback device, communications device, charging device, power inverter, light source, medical device, home appliance, power tool, toy, game console, television, and video display device.