HEAT DISSIPATION ASSEMBLY FOR ELECTRONIC DEVICE

Abstract

A heat dissipation assembly includes a heat sink and an airflow guide. The airflow guide includes a top wall, two sidewalls connected to the top wall, and an airflow guide component mounted on an inner surface of the top wall. The top wall and the two sidewalls cooperatively define an air passage for allowing air to flow through. The heat sink is disposed in the air passage and the airflow guide component is configured to guide air through the air passage to the heat sink.

Description

BACKGROUND

1. Technical Field

The present disclosure relates to a heat dissipation assembly for an electronic device.

2. Description of Related Art

Heat dissipation is a significant problem in the research and development of electrical devices, for example, servers. When CPUs of different calorific values are used in a server, heat sinks of different sizes are used to dissipate heat generated by the CPU. When the height of a heat sink does not match the height of an airflow guide, part of the air flowing through an airflow guide may flow out without passing through the heat sink, thus decreasing the efficiency of heat dissipation by the server.

Therefore, it is desirable to provide a heat dissipation assembly which can overcome the above-mentioned limitations.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a heat dissipation assembly in accordance with an embodiment, together with a circuit board.

FIG. 2 is a perspective view of an airflow guide of the heat dissipation assembly of FIG. 1.

FIG. 3 is a perspective view of one embodiment of an airflow guide component of the airflow guide of the heat dissipation assembly of FIG. 1.

FIG. 4 is another perspective view of the airflow guide of the heat dissipation assembly of FIG. 1.

FIG. 5 is an exploded perspective view of the airflow guide of the heat dissipation assembly of FIG. 1.

FIG. 6 is an enlarged view of the circled area VI of FIG. 4.

FIG. 7 is a perspective view of another embodiment of an airflow guide component of the airflow guide.

DETAILED DESCRIPTION

Referring to FIG. 1, an embodiment of a heat dissipation assembly 20 is shown. The heat dissipation assembly 20 is configured to be mounted on a circuit board 22. The heat dissipation assembly 20 includes heat sinks 24 for absorbing and dissipating heat generated by electrical components mounted on the circuit board 22, and an airflow guide 10.

Referring to FIGS. 2-6, the airflow guide 10 includes a top wall 11, a first sidewall 12, a second sidewall 13, a third sidewall 14, and two airflow guide components 15. The top wall, the first sidewall 12, and the second sidewall 13 cooperatively form a first air passage 16. The first air passage 16 includes a first air inlet 162 and a first air outlet 161. One of the heat sinks 24 is disposed in the first air passage 16 (described later). Moving air goes into the first air passage 16 via the first air inlet 162, and goes out through the first air outlet 161, thus carrying heat away from the heat sink 24. The top wall, the second sidewall 13, and the third sidewall 14 cooperatively form a second air passage 17. The second air passage 17 includes a second air inlet 172 and a second air outlet 171. One of the airflow guide components 15 guides air into the first air passage 16 to one of the heat sinks 24, while the other airflow guide components 15 guides air into the second air passage 16 to the other heat sink 24.

The top wall 11 includes four first fixing devices 111 and two second fixing devices 112. In the present embodiment, the first fixing devices are fixing holes, and the second fixing devices 112 are engaging slots. Each engaging slot is formed by the top wall 11 and a fixing plate 113 mounted on an inner surface of the top wall 11. The fixing plate 113 may be fixed on the top wall 11 via adhesive or similar means.

In one embodiment, each airflow guide component 15 is a triangular prism, and includes a first surface 154, a second surface 153, two third fixing devices 151 formed on the first surface 154, and a fourth fixing devices 152 formed on the first surface 154. The second surface 153 is an airflow guide surface. Each third fixing device 151 is made to couple to one of the first fixing devices 111 so that the airflow guide 15 is detachably assembled on the top wall 11. Each fourth fixing device 152 is configured to couple to the second fixing devices 112 so that the airflow guide 15 is detachably assembled on the top wall 11. In the present embodiment, the third fixing devices 151 are fixing rods, and the fourth fixing device 152 is an engaging part extending outwards from the first surface 154. The purpose of the second surface 153 of each airflow guide component 15 is to guide air in the first air passage 16 or the second air passage 17 to the heat sinks 24.

The first fixing devices 111 can also be fixing rods, and correspondingly, the third fixing devices 151 can be fixing holes. The second fixing devices 112 may be a protrusion extending outwards from the inner surface of the top wall 11, and in a corresponding manner, the fourth fixing devices 152 may be engaging slots defined in the first surface 154. In other embodiments, the airflow guide component 15 and the top wall 11 may be formed integrally.

Referring again to FIG. 1, the airflow guide components 15 are assembled in the airflow guide 10 in such a manner that one of the second surfaces 153 faces the first air inlet 162, and the other second surface 153 faces the second air inlet 172. The airflow guide components 15 guide air into the first and second air passages 16 and 17 and through the heat sinks 24, thus enhancing heat dissipation.

Referring to FIG. 7, another embodiment of an airflow guide component 25 is shown. The airflow guide component 25 includes a plate-shaped fixing part 251 and a plate-shaped airflow guide part 252. The fixing part 251 extends obliquely from one end of the airflow guide part 252. In the present embodiment, the included angle between the fixing part 251 and the airflow guide part 252 is about 30 degrees. Two fixing rods 253 are formed on the surface 2511 of the fixing part 251, and from the middle of the length of the surface 2511, the surface 2511 is extended outwards by an engaging part 254. In the present embodiment, the rods 253 are integrally formed with the fixing part 251. In other embodiments, the rods 253 may be installed or attached to the surface 2511. The airflow guide component 252 includes a surface 2521 serving as an airflow guide surface. Comparing the airflow guide component 15 of the first embodiment with the airflow guide component 25 in this embodiment, the airflow guide component 25 has a simpler structure, and uses less material.

While various embodiments have been described, it is to be understood that the disclosure is not limited thereto. On the contrary, various modifications and similar arrangements (as would be apparent to those skilled in the art), are also intended to be covered. Therefore, the scope of the appended claims should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements.

Claims

1. A heat dissipation assembly, comprising:

a heat sink; and

an airflow guide comprising: a top wall; two sidewalls extending from the top wall, the top wall and the two sidewalls cooperatively defining an air passage, the air passage being configured for allowing air to flow through, the heat sink being received in the air passage; and an airflow guide component mounted on an inner surface of the top wall and received in the air passage, the airflow guide component being configured for guiding air in the air passage to the heat sink.

2. The heat dissipation assembly of claim 1, wherein the airflow guide component is detachably mounted on the top wall.

3. The heat dissipation assembly of claim 1, wherein the top wall and the airflow guide component are integrally formed with each other.

4. The heat dissipation assembly of claim 1, wherein the air passage comprises an air inlet and an air outlet, the airflow guide component comprises an airflow guide surface facing the air inlet and obliquely relative to the top wall, and the airflow guide surface is configured for guiding the air in the air passage to the heat sink.

5. The heat dissipation assembly of claim 4, wherein the airflow guide component is a triangular prism, and the airflow guide surface is a surface of the triangular prism.

6. The heat dissipation assembly of claim 4, wherein the airflow guide component comprises a fixing part and an airflow guide part connected to the fixing part, and the airflow guide surface is a surface of the airflow guide part.

7. The heat dissipation assembly of claim 2, wherein the top wall comprises a first fixing component, the airflow guide component comprises a second fixing component, and the second fixing component is coupled to the first fixing component so that the airflow guide component is fixed on the top wall.

8. The heat dissipation assembly of claim 7, wherein the first fixing component is a fixing hole defined in the inner surface of the top wall, the second fixing component is a fixing rod extending from a surface of the airflow guide component, the fixing rod is received in the fixing hole.

9. The heat dissipation assembly of claim 7, wherein the first fixing component is a fixing rod extending from the inner surface of the top wall, the second fixing component is a fixing hole defined in a surface of the airflow guide component, the fixing rod is received in the fixing hole.

10. The heat dissipation assembly of claim 7, wherein the airflow guide comprises a fixing plate positioned on the inner surface of the top wall, the first fixing component is an engaging slot defined between the inner surface of the top wall and the fixing plate, the second fixing component is an engaging part, the engaging part is received in the engaging slot.

11. The heat dissipation assembly of claim 7, wherein the first fixing component is an engaging part extending from the inner surface of the top wall, and the second fixing component is an engaging slot defined in a surface of the airflow guide component, the engaging part is received in the engaging slot.