Heat transfer system applying boundary later penetration
A heat transfer system is disclosed incorporating a passive pump utilizing bubble technology to cycle a coolant through associated channels. The system includes a housing and channels containing a slurry consisting of liquid having a low boiling point and microspheres formed of metallic foam introduced into said liquid. The microspheres are caused to flow onto a heat source and penetrate the coolant boundary layer and thereby provide an efficient and fast transfer of heat from the source onto the microspheres and the coolant. The microspheres further provide and efficient and fast transfer of heat through the slurry to a heat dissipating component.
This application claims the benefit of the earlier filing date of the provisional application Ser. No. 61/628,982 filed on Nov. 10, 2011 of the same title and of the same inventor, Troy W. Livingston.
BACKGROUND OF THE INVENTIONThe present invention relates to a system and method for removing and dissipating heat from heat generating components such electronic chips, electronic circuit board and power components in computers.
This provisional patent application is related to U.S. Patent Application Ser. No. 61/575,946 filed on Aug. 31, 2011 titled “Heat Transfer Bridge” in the name of Troy W. Livingston. Said provisional application is being filed as a regular utility application concurrently herewith and is incorporated herein by this reference thereto. The Ser. No. of said utility application will be provided to the USPTO as available.
SUMMARY OF INVENTIONA heat transfer system is disclosed incorporating a passive pump utilizing bubble technology to cycle a coolant through associated channels. The system includes a housing and channels containing a slurry consisting of liquid having a low boiling point and microspheres formed of metallic foam introduced into said liquid. The microspheres are caused to flow onto a heat source and penetrate the coolant boundary layer and thereby provide an efficient and fast transfer of heat from the source onto the microspheres and the coolant. The microspheres further provide a fast transfer of heat through the slurry to associated heat dissipating components.
The foregoing features and advantages of the present invention will be apparent from the following more particular description of the invention. The accompanying drawings, listed herein below, are useful in explaining the invention.
As cited above, the present application is related to U.S. provisional patent application Ser. No. 61/575,946 filed on Aug. 31, 2011 titled “Heat Transfer Bridge” in the name of Troy W. Livingston. The content of said Heat Transfer Bridge application is incorporated herein by this reference and cites the need for systems and methods for cooling electronic chips, electronic circuits, computers. Further discussions of the need for cooling electronic components is discussed in a multitude of U.S. patents including for example the recent U.S. Pat. No. 8,011,424 issued to Mark M. Murray and titled “Method for Convective Heat Transfer Utilizing a Particulate Solution in a Time Varying Field”.
The afore cited Livingston patent application Ser. No. 61/575,946 discloses cooling systems utilizing heat pumps and bubble technology to provide cooling for electronic circuits, IC chips and computers. Patent application Ser. No. 61/575,946 also discloses the provision of a coolant comprising a slurry including formed metal particles, and this application incorporates by reference thereto the disclosure and drawings of said application. The present invention provides improvement to said application Ser. No. 61/575,946.
Container 14 is mounted over a heat source 22 comprising, for example, an IC chip. The adjacent sections of the overall system 12 including container 14 and outlet tube 18 and return tubes 20 are disclosed and described in the referenced patent application, Ser. No. 61/575,946. The improvements provided by the present invention can be fully described using the relatively simplified drawings of
As disclosed in said prior application, a fluid such as for example methylene chloride 24 is contained in container 14 and in tubes 18 and 20. Methylene chloride (dichloromethane) is a volatile fluid that has a low boiling point of 39.6 degrees C. (103 degrees F.). Note that other fluids having a low boiling point could also be utilized. Microspheres 26 are introduced into the fluid 24 to form a slurry 30 that can flow in the tubes 18 and 20. As will be explained in more detail hereafter, in a preferred embodiment the copper microspheres are approximately 0.020 inches in diameter and are formed of copper foam material. Note that in the cited application Ser. No. 61/575,946 metal particles are employed in the slurry 30, whereas but in the present application comprises formed foam copper microspheres 26 are introduced into the liquid 24 to constitute the slurry 30.
Refer now briefly to the bubble function in chamber 16. When the heat source becomes hot and the dichloromethane fluid 24 reaches its boiling point of 103 degrees F., the fluid will start to produce bubbles 32 on the interior surface 34 of chamber 16 which is adjacent the heat source 22. The small originating bubbles 32 will rise and coalesce continuously to form larger bubbles 36, and the still larger bubbles indicated at 38. The coalescing function indicated in
A fluid boundary layer is a known phenomena in fluid mechanics and is a layer of substantially static fluid liquid 24 in the intermediate the flowing liquid and a bounding surface. The bounding surfaces shown in
The inventive cooling system disclosed herein provides microspheres of foamed metal that are introduced into a cooling liquid to form a slurry. The microspheres are formed into round balls and compressed to match the density of the liquid to provide an almost neutral buoyancy to provide a unique heat transfer slurry. The microspheres penetrate the boundary layer as will be described herein to improve the heat transfer rate and the heat transfer efficiency. As alluded to above, the heat transfer rate and as well as the heat transfer efficiency are improved both when transferring heat to the microspheres from a hot source and when transferring heat from the microspheres to a heat dissipating source.
In a preferred embodiment, microspheres 26 are formed from copper foam. Copper is an excellent conductor of heat. The microspheres are introduced into a methylene chloride liquid 24 to form the coolant slurry 30. In one embodiment, the slurry 30 comprises forty percent by volume of methylene chloride 24 and forty percent by volume of foam copper microspheres 26; other fluids having a low boiling point may be used. The boundary layer as specifically related to the present invention will now be described with reference to
For purposes of description and clarity
It is a function of the microspheres 26 to absorb heat from the heat source 34; however as described above, the coolant boundary layer 42 acts as an insulator tending to prevent heat transfer from the hot surface 34 to the liquid slurry 30. Refer now to both
Another important aspect of the invention is the improved rate of heat transfer provided by the copper microspheres in the slurry liquid as compared to the rate of heat transfer in a clear liquid. As is known, the rate of heat conduction through a metal is much higher than in liquid. For comparison, thermal conductivity charts show that the heat transfer rate of copper given as 385 (W/mK) as compared to that of water which given as 0.6 (at 20 degrees C.). As stated above the microsphere 26 is formed from foamed copper material. The foamed copper is compressed to the density of the coolant liquid, and since the microsphere 26 is not solid copper, but rather a foam composite, the rate of heat transfer through the microsphere can be considered to change (as a rough approximation) to about 100 times the rate of heat transfer through the coolant liquid.
Refer now also to
Refer now to
While the invention has been particularly shown and described with reference to preferred embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention.
Claims
1. A heat transfer system comprising in combination
- a) a container for a flowing fluid slurry, said container having a panel with an interior bounding surface for said slurry and an exterior surface for receiving heat wherein a fluid boundary layer comprising a thin film of fluid formed on said bounding surface effectively comprises a heat transfer insulator;
- b) an outlet channel and an inlet channel for said container;
- c) a slurry comprising a fluid having a low boiling point and metal microspheres;
- d) a heat source positioned to be thermally coupled to said container;
- e) said fluid generating bubbles in response to heat received from said heat source;
- f) said bubbles providing a pumping action to drive said heated slurry upwardly through said outlet channel
- e) a large quantity of said metal microspheres in said slurry being moved over and engaging said interior bounding surface thereby penetrating said fluid boundary layer to obtain an efficient metal to metal heat transfer.
2. A fluid flow system for transferring heat from a heat source to a heat dissipating region, said system comprising in combination
- a) a container inclosing a flowing liquid slurry;
- b) a heat source mounted to provide heat to said container and said slurry;
- c) said slurry containing a plurality of foamed copper microspheres that are substantially of the same density as said liquid;
- d) said fluid generating bubbles in response to heat received from said heat source and said bubbles providing a pumping heated slurry to flow from said heat source toward said heat dissipating region and said microspheres to transfer heat generally upwardly and away from said heat source;
- e) said copper microspheres in said flowing providing a fast rate of heat transfer through the spheres to adjacent liquid, said liquid slurry providing a slower rate of heat transfer to adjacent microsphere which next provides a fast rate of heat transfer to adjacent microspheres and liquid whereby a series of zones of fast heat transfer are provided to thereby in total effect a fast efficient transfer of heat from said heat source to said heat dissipating region.
3. A heat transfer system comprising in combination
- a) a source of metallic microspheres;
- b) a source of heated air;
- c) a heat dissipating surface;
- d) a chamber region into which said microspheres are introduced;
- e) a nozzle for jetting said heated air into said chamber region and to impinge on said heat dissipating surface;
- f) said jetted heated air driving said microsphere onto said heat dissipating surface and penetrating the air (fluid) boundary to provide a fast rate of heat transfer from said heated air to said dissipating surface.
4. A heat transfer system as in claim 1 wherein
- a) a portion of said flow path is angled causing said microspheres to strike against said interior boundary layer surface.
5. A heat transfer system as in claim 1 providing a relatively enlarged heating chamber enabling said bubbles to coalesce to the size of said outlet channel to drive said bubbles through said channel.
Type: Application
Filed: Mar 28, 2012
Publication Date: May 16, 2013
Inventor: Troy W. Livingston (Northbrook, IL)
Application Number: 13/385,732
International Classification: F28D 15/00 (20060101);