Utilizing Change Of State Patents (Class 165/104.21)
  • Patent number: 10876799
    Abstract: A loop heat pipe includes a liquid pipe and a vapor pipe that connect an evaporator and a condenser and form a loop-shaped passage. The liquid pipe includes two outermost metal layers, and inner metal layers stacked between the outer metal layers. The inner metal layers include one or more flow passages in which a working fluid flows, and a porous body communicating with the one or more flow passages. One inner metal layer includes a first bottomed groove opening to a side of another inner metal layer adjacent to the one inner metal layer, and the other inner metal layer includes a second bottomed groove opening to a side of the one inner metal layer. The one or more flow passages include a flow passage formed by the first and second bottomed grooves that are arranged to oppose and communicate with each other in a thickness direction.
    Type: Grant
    Filed: March 12, 2019
    Date of Patent: December 29, 2020
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Yoshihiro Machida
  • Patent number: 10845069
    Abstract: A dehumidification system includes a compressor, a primary evaporator, a primary condenser, a secondary evaporator, and a secondary condenser. The secondary evaporator receives an inlet airflow and outputs a first airflow to the primary evaporator. The primary evaporator receives the first airflow and outputs a second airflow to the secondary condenser. The secondary condenser receives the second airflow and outputs a third airflow to the primary condenser. The primary condenser receives the third airflow and outputs a dehumidified airflow. The compressor receives a flow of refrigerant from the primary evaporator and provides the flow of refrigerant to the primary condenser.
    Type: Grant
    Filed: December 27, 2018
    Date of Patent: November 24, 2020
    Assignee: Therma-Stor LLC
    Inventors: Scott E. Sloan, Weizhong Yu, Grant M. Lorang, Todd R. DeMonte, Timothy S. O'Brien
  • Patent number: 10838287
    Abstract: A cooling device includes an evaporator, a condenser, a vapor pipe, and a liquid pipe. The evaporator includes a housing having a reservoir, a wick disposed in the housing and retaining the working fluid in the liquid phase, and a groove member having a plurality of flow channels through which the working fluid in the vapor phase flows. The wick has first, second and third layers. The first layer has a plurality of first apertures, and is higher in thermal conductivity than both the second and third layers. The third layer transports the working fluid in the liquid phase in the reservoir to the second layer. The second layer has a plurality of second apertures corresponding to the first apertures, the second apertures having aperture area larger than corresponding one of the first apertures. The second layer transports the working fluid in the liquid phase to the first layer.
    Type: Grant
    Filed: September 3, 2019
    Date of Patent: November 17, 2020
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Katsuya Shimizu, Norio Imaoka
  • Patent number: 10831249
    Abstract: A heat conduction component and a mobile terminal are disclosed. The heat conduction component is applied to a mobile terminal. The heat conduction component includes a support part and a heat dissipation part. A cavity is disposed inside the support part. The heat dissipation part is disposed in the cavity, and the heat dissipation part has mesh capillary holes. The heat source component is located at one end of the heat dissipation part, a low temperature area is located at the other end of the heat dissipation part, and a temperature of the low temperature area is lower than a temperature of an area in which the heat source component is located. A heat conduction medium is disposed in the mesh capillary hole of the heat dissipation part.
    Type: Grant
    Filed: July 31, 2017
    Date of Patent: November 10, 2020
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Huawen Jiang, Linfang Jin
  • Patent number: 10801761
    Abstract: A passive heat recovery or defrosting apparatus features an evaporator, a condenser, and vapour and liquid conveyance lines connected therebetween. The vapour and liquid conveyance lines respectively connect to upper and lower ends of the evaporator and condenser. The evaporator and/or condenser has a ring-shaped body for fitting around or inline with a pipe to achieve heat exchange relation with a fluid passing therethrough. The evaporator is installed on or inside a warm pipe or duct (e.g. waste drain pipe, clothes dryer exhaust duct, flue pipe, or indoor section of a sewer vent stack) at a lower elevation than the condenser. The condenser is placed on an outdoor end of either a sewer stack or air intake duct for defrosting purposes, or is placed on a water supply line or air intake of a hot water tank, clothes dryer, etc. Working fluid circulates passively between the evaporator and condenser.
    Type: Grant
    Filed: March 22, 2018
    Date of Patent: October 13, 2020
    Inventor: James W. Dobson
  • Patent number: 10749288
    Abstract: A liquid-cooling assembly includes two or more cooling sub-assemblies and a flexible interconnect assembly. The two or more cooling sub-assemblies are configured for cooling two or more respective pluggable connector-cages, each cooling sub-assembly including (i) a heat-conducting plate for coupling to a respective pluggable connector-cage, and (ii) a liquid-conducting channel having an inlet and an outlet for flowing cooling liquid. The flexible interconnect assembly is configured to transfer the cooling liquid to and from inlets and outlets of the cooling sub-assemblies, and to mechanically support the cooling sub-assemblies while permitting motion of the cooling sub-assemblies relative to one another.
    Type: Grant
    Filed: April 11, 2019
    Date of Patent: August 18, 2020
    Assignee: MELLANOX TECHNOLOGIES, LTD.
    Inventors: Oren Weltsch, Alexei Berkovich
  • Patent number: 10739830
    Abstract: An electronic device according to an embodiment of the present disclosure includes a printed circuit board (PCB), a first component disposed in a first region on the PCB and a second component disposed in a second region on the PCB, and a chamber disposed on the first and second components and having a region including the first and second regions, in which fluid absorbing heat radiating from the first and second components is included in the chamber.
    Type: Grant
    Filed: November 22, 2017
    Date of Patent: August 11, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hae Jin Lee, Kyung Ha Koo, Jung Je Bang, Chi Hyun Cho
  • Patent number: 10743442
    Abstract: An assembly includes a substrate including a base portion defining a plurality of orifices that extend through the base portion, the plurality of orifices defining a plurality of jet paths extending along and outward from the plurality of orifices, a mesh coupled to the base portion, the mesh defining a plurality of pores aligned with the plurality of jet paths, and a heat-generating device coupled to the mesh opposite the base portion, the heat-generating device defining a bottom surface that is oriented transverse to the plurality of jet paths.
    Type: Grant
    Filed: December 11, 2018
    Date of Patent: August 11, 2020
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Shailesh N. Joshi, Naoya Take
  • Patent number: 10732239
    Abstract: A cryostat system is kept at a cryogenic operating temperature without providing or supplying cryogenic fluids by a cryocooler. The cryostat system includes a superconducting magnet arrangement and a heat sink apparatus to prolong the time before the superconducting magnet arrangement quenches/returns to the normally conducting state if active cooling fails. The heat sink apparatus includes magnetocaloric material and is thermally connected to the superconducting magnet arrangement and/or to parts of the cryostat system through which ambient heat can flow to the superconducting magnet arrangement. In this way, the cryostat system can be operated in a truly “cryogen-free” manner while maintaining a sufficiently long time to quench in the event of potential operational malfunctions.
    Type: Grant
    Filed: May 11, 2017
    Date of Patent: August 4, 2020
    Assignee: BRUKER SWITZERLAND AG
    Inventors: Patrick Wikus, Joerg Hinderer
  • Patent number: 10712099
    Abstract: A heat pipe, includes; an outer tube including first and second ends, the first end closed air tight; a box connected to the second end, a cross-sectional area of the box perpendicular to the outer tube central axis is larger than a cross-sectional area of the outer tube perpendicular to its axis; an inner tube positioned in the outer tube, a central axis of the inner tube parallel to the outer tube central axis, including third and fourth ends, the third end closer to the first end than the fourth end and open in the outer tube; a partition tube including fifth and sixth ends widening from the fifth end toward the sixth end, the fifth end connected with the fourth end, part of the sixth end connected on an inner surface of the box; and fluid in a space formed by the outer tube and the box.
    Type: Grant
    Filed: July 6, 2018
    Date of Patent: July 14, 2020
    Assignees: KABUSHIKI KAISHA TOSHIBA, Toshiba Energy Systems & Solutions Corporation
    Inventors: Kunio Hoshino, Rei Kimura, Yasushi Yamamoto, Masato Fukuta, Takashi Mawatari, Satoru Abe
  • Patent number: 10697712
    Abstract: A vapor chamber has a first plate, a second plate, at least one ring structure, and a chamber. The first plate and the second plate have holes communicating with each other. The second plate has a cavity portion concaved away from the first plate. The ring structure is in the cavity portion and encloses the holes. The chamber is formed between the first plate and the second plate. A capillary structure layer and a working liquid are in the chamber. Therefore, even when either of the first and second plates is broken by heads of screws mounted through the holes, which are larger and oppress the margins of the holes, or even when either of the first and second plates is broken during forming of the holes via stamping or drilling, the chamber always remain sealed.
    Type: Grant
    Filed: January 9, 2019
    Date of Patent: June 30, 2020
    Assignee: COOLER MASTER CO., LTD.
    Inventor: Jen-Chih Cheng
  • Patent number: 10684661
    Abstract: A hybrid cooling server assembly can have a printed circuit board (PCB) with a processor socket disposed thereon and a hybrid cooling plate can be operably coupled with the processor socket. A radiator can having a working fluid received therein and be in fluidic communication with the radiator and the hybrid cooling plate by one or more tubular members. One or more cooling fans can be proximal to the radiator. The working fluid can be operable to receive heat from the cooling plate and reject heat at the radiator and the one or more cooling fans can be operable to produce an airflow across the hybrid cooling plate, thereby allowing the hybrid cooling plate transfer thermal energy to the airflow.
    Type: Grant
    Filed: March 19, 2019
    Date of Patent: June 16, 2020
    Assignee: CISCO TECHNOLOGY, INC.
    Inventors: Anant Thakar, Rakesh Bhatia
  • Patent number: 10674631
    Abstract: A thin vapor chamber with circuit unit is provided, which has a first flexible substrate structure and a second flexible substrate structure, wherein the first flexible substrate structure and the second flexible substrate structure relatively enclose a working fluid. A plurality of wicking spaces is formed between the first flexible substrate structure and the second flexible substrate structure. A circuit unit is formed at least partially on the side of the first flexible substrate structure or the second flexible substrate structure away from the working fluid, so as to integrate the electronic components and circuit units, and to evenly dissipate the heat generated by the electronic components and circuit units. The present invention makes an effective improvement to the space efficiency of the electronic device.
    Type: Grant
    Filed: July 8, 2019
    Date of Patent: June 2, 2020
    Assignee: FORCECON TECHNOLOGY CO., LTD.
    Inventor: Cheng-Chen Cheng
  • Patent number: 10667430
    Abstract: Provided is a vapor chamber that is extremely thin but nonetheless allows a working fluid to smoothly flow back, prevents dry-out and provides a superior heat transport capability, regardless of an installation orientation such as a top heat orientation or a change in the installation orientation.
    Type: Grant
    Filed: December 31, 2018
    Date of Patent: May 26, 2020
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yoshikatsu Inagaki, Kenya Kawabata, Hirofumi Aoki
  • Patent number: 10634368
    Abstract: The present invention relates to a control box and to an outdoor unit of an air conditioner comprising the same; the control box using a refrigerant cooling device and an air cooling device so as to radiate heat efficiently. The control box comprises: a case; a heat-radiating electronic component located inside the case; a refrigerant cooling device which is attached to one side of the case and makes contact with the electronic component so as to radiate heat to the outside; and an air cooling device which is attached to one side of the case and has a circulation fan for forcible circulating the air inside the case. Because the present invention is provided both with the refrigerant cooling device and the air cooling device, the electronic component inside the control box can radiate heat efficiently.
    Type: Grant
    Filed: October 8, 2014
    Date of Patent: April 28, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jong Tae Kim, Min Wook Park, Yong Ho Lee, Seong Hwan Jang, Il Kwon Jung
  • Patent number: 10634434
    Abstract: An arrangement for cooling a closed, sealed cabinet (1), comprising a thermosiphon heat exchanger (2) disposed inside the cabinet (1) and having an evaporator (3) and a condenser (4) for circulating a working fluid between the evaporator (3) and the condenser (4) in a closed loop, wherein the working fluid evaporated in the evaporator (3) by heat flows to the condenser (4) for cooling and the condensed working fluid flows back to the evaporator (3). The evaporator (3) is exposed to hot air flow generated inside the cabinet (1), and a heat transfer element (5) is attached to the condenser (3) in a sealed manner through a cabinet wall (6) for transferring heat to the outside of the cabinet (1).
    Type: Grant
    Filed: August 24, 2016
    Date of Patent: April 28, 2020
    Assignee: ABB Schweiz AG
    Inventors: Risto Laurila, Tero Viitanen, Bruno Agostini
  • Patent number: 10631435
    Abstract: A heat dissipation assembly includes a condenser, an evaporator, a vapor conduit, and a liquid conduit. The condenser has a condensing chamber therein. Two ends of the vapor conduit are respectively connected to the condenser and the evaporator. Two ends of the liquid conduit are respectively connected to the condenser and the evaporator. A geometric center of the liquid conduit in the condensing chamber is lower than or equal to a geometric center of the condensing chamber.
    Type: Grant
    Filed: October 27, 2016
    Date of Patent: April 21, 2020
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Wei-Fang Wu, Li-Kuang Tan
  • Patent number: 10631442
    Abstract: A cooling system for the electronic components of a computer rack, including a primary circuit of primary liquid; a primary exchanger intended to transfer heat from first electronic components to the primary liquid; a secondary circuit of refrigerant fluid; a primary-secondary exchanger; a tertiary circuit of tertiary liquid; a secondary-tertiary exchanger; and a tertiary-thermal source exchanger. The cooling system also includes a tertiary-secondary exchanger; and an air-tertiary exchanger intended to transfer, to the tertiary liquid, heat from the air of the computer rack heated by second electronic components, the air-tertiary exchanger being arranged, in the tertiary circuit, downstream of the tertiary-secondary exchanger and upstream of the secondary-tertiary exchanger.
    Type: Grant
    Filed: May 31, 2018
    Date of Patent: April 21, 2020
    Assignee: BULL SAS
    Inventor: Georges Lecourtier
  • Patent number: 10624238
    Abstract: A loop heat pipe includes an evaporator; a condenser; a first pipe configured to connect the evaporator and the condenser and in which vapor-phase working fluid flows; and a second pipe configured to connect the condenser and the evaporator and in which liquid-phase working fluid flows, wherein the evaporator, the condenser, the first pipe, and the second pipe is joined to a first tabular and a second tabular, respectively, the first tabular includes a first recessed section in a region to be formed as the evaporator and a region to be formed as a condensation pipe configuring the condenser and the second tabular includes a second recessed section in the region to be formed as the evaporator, the region to be formed as the condensation pipe.
    Type: Grant
    Filed: November 20, 2018
    Date of Patent: April 14, 2020
    Assignee: FUJITSU LIMITED
    Inventors: Takeshi Shioga, Tomoyuki Abe
  • Patent number: 10612862
    Abstract: Disclosed is a method of forming a combined vapor chamber and heat pipe assembly. A top plate of a vapor chamber may have one or more apertures, through which specially-shaped connectors can be inserted. Each connector may have a collar and flange, with the collar configured to be inserted into an aperture in the top plate. Once inserted, an open end of a heat pipe can be aligned and connected with the protruding portion of the collar. The connector joins the open end of the heat pipe with the top plate, and the heat pipe, connector, and top plate can be joined together to form a single unit. Afterwards, the top plate can be joined with the bottom plate in order to form the characteristic enclosure of a vapor chamber.
    Type: Grant
    Filed: February 20, 2018
    Date of Patent: April 7, 2020
    Assignee: Heatscape.com, Inc.
    Inventors: Ali Mira, Yashar Mira, Michael Mira
  • Patent number: 10608268
    Abstract: An energy management system having a fuel cell apparatus (150) as a power generator that generates power using fuel, and an EMS (200) that communicates with the fuel cell apparatus (150). The EMS (200) receives messages that indicate the status of the fuel cell apparatus (150) when normal operation, from the fuel cell apparatus (150).
    Type: Grant
    Filed: August 5, 2013
    Date of Patent: March 31, 2020
    Assignee: Kyocera Corporation
    Inventor: Kazutaka Nakamura
  • Patent number: 10605052
    Abstract: A downhole tool system includes a tool housing, a chassis located within the tool housing, and an electronics assembly positioned on the chassis within the tool housing. The electronics assembly includes a heat sink comprising an inner surface and an outer surface. The outer surface includes a tapered portion and in is contact with the tool housing. The electronics assembly further includes one or more electronic components mounted onto the heat sink, in which at least a portion of the electronic components is in contact with the inner surface of the heat sink.
    Type: Grant
    Filed: November 19, 2015
    Date of Patent: March 31, 2020
    Assignee: Halliburton Energy Services, Inc.
    Inventors: Lizheng Zhang, Tanest Chinwanawich, Adan Herrera
  • Patent number: 10578293
    Abstract: A light source cooling body (100), a light source assembly, a luminaire and a method to manufacture a light source cooling body or a light source assembly are provided. The light source cooling body comprises a homogeneous body (104) made of a thermally conductive material. The homogenous body comprises an open space that comprises a wick structure, a condenser (112) and an evaporator (116). Near the evaporator the light source cooling body has an interface area (102) to thermally couple with a light source and to receive heat from the light source. The condenser is arranged away from the interface area. A portion 114 of the open space is tubular shaped. The open space may hold a cooling liquid partially in the gaseous phase and partially in the liquid phase and the wick structure is configured to transport the cooling material in the liquid phase towards the evaporator.
    Type: Grant
    Filed: June 8, 2015
    Date of Patent: March 3, 2020
    Assignee: SIGNIFY HOLDING B.V.
    Inventors: Simon Eme Kadijk, Theodoor Cornelis Treurniet, Susanne Lina Goldbach
  • Patent number: 10579112
    Abstract: A portable information handling system transfers thermal energy associated with operation of processing components between rotationally coupled housing portions through a thermal spreader disposed between the housing portions, such as a sheet having one or more layers of graphite. A tensioning assembly engages the thermal sheet to manage excess material associated with varying rotational orientations of the housing portions.
    Type: Grant
    Filed: April 13, 2018
    Date of Patent: March 3, 2020
    Assignee: Dell Products L.P.
    Inventors: Travis C. North, Mark A. Schwager, Austin M. Shelnutt, John T. Morrison
  • Patent number: 10571163
    Abstract: A thermoelectric heat pump air conditioner comprising an indoor air conditioner and an outdoor air conditioner. The indoor air conditioner comprises a first phase-change suppressing heat transfer plate, a thermoelectric cooling assembly and a heat exchanger. A first cooling medium pipe and a first thermally superconducting pipe are formed in the first phase-change suppressing heat transfer plate. The first thermal superconducting pipe is filled with a first heat transfer working medium. The heat exchanger is attached on a surface, away from the phase-change suppressing heat transfer plate, of the thermoelectric cooling assembly. A second cooling medium pipe is formed in the heat exchanger. The outdoor air conditioner comprises a second phase-change suppressing heat transfer plate. A third cooling medium pipe and a second thermally superconducting pipe are formed in the second phase-change suppressing heat transfer plate.
    Type: Grant
    Filed: May 19, 2016
    Date of Patent: February 25, 2020
    Inventors: Cheechiang Saelee, Jianzhong Zhang
  • Patent number: 10551133
    Abstract: A heat-transfer device and system for conducting heat from a heat source. The heat-transfer device can include an evaporator having one or more reinforcement elements occupying respective recesses defined in a body of the evaporator, wherein the reinforcement elements are more resistant to deformation under clamp load than the material of the evaporator body, while still having desirable heat conductivity. In some embodiments, the heat-transfer system includes a plurality of serially coupled evaporators for generating a respective vapor; at least one reinforcement element interposed between adjacent evaporators; and a condenser in fluid communication with the evaporator.
    Type: Grant
    Filed: September 19, 2013
    Date of Patent: February 4, 2020
    Assignee: Thermal Corp.
    Inventors: Jerome E. Toth, Leonard N. Dore, Doug Grove, Austin Cornell
  • Patent number: 10539356
    Abstract: A sintered heat tube and a semiconductor cooling refrigerator having the same, the sintered heat tube comprises: a main tube segment with its both ends closed, and a manifold tube segment/manifold tube segments extending from one or more portions of one side of the main tube segment (respectively), wherein a work chamber of each manifold tube segment communicates with that of the main tube segment. In the sintered heat tube and the semiconductor cooling refrigerator having the sintered heat tube of the present invention, as the sintered heat tube includes manifold tube segments, the sintered heat tube of the present invention greatly improves the heat radiating or cold transferring efficiency. The sintered heat tube is particularly suitable for heat radiation of heat sources of a high heat flow density such as semiconductor cooling plates.
    Type: Grant
    Filed: September 29, 2015
    Date of Patent: January 21, 2020
    Assignee: QINGDAO HAIER JOINT STOCK CO., LTD.
    Inventors: Haibo Tao, Kui Zhang, Jianru Liu, Peng Li, Chunyang Li, Feifei Qi, Lisheng Ji
  • Patent number: 10508868
    Abstract: A protection element for heat dissipation unit includes a main body and a protection element. The main body is divided into a working zone and a sealing zone. The sealing zone is located around an outer periphery of the working zone and is provided with a notch area, to which a fluid-adding and air-evacuating pipe is connected. The protection element is a ductile structure correspondingly arranged at the notch area to contact with the sealing zone of the main body and the pipe. With the arrangement of the protection element, the fluid-adding and air-evacuating pipe is protected against collision and impact and accordingly, the main body of the heat dissipation unit is protected against vacuum and working fluid leakage.
    Type: Grant
    Filed: December 14, 2017
    Date of Patent: December 17, 2019
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Han-Min Liu, Jian Zhang, Xiao-Xiang Zhou
  • Patent number: 10502497
    Abstract: A heat pipe assembly that includes at least one axial groove heat pipe and at least one porous media heat pipe. The porous media heat pipe may be embedded into a flange of the axial groove heat pipe, or embedded into a wall of the axial groove heat pipe, or embedded into another bore of the axial groove heat pipe. The evaporator of the at least one porous media heat pipe may be located remotely and can accept a high heat flux, while a condenser of the at least one porous media heat pipe is attached to the axial groove heat pipe.
    Type: Grant
    Filed: January 24, 2018
    Date of Patent: December 10, 2019
    Assignee: ADVANCED COOLING TECHNOLOGIES, INC.
    Inventors: Jens E. Weyant, Michael Dechristopher, William G. Anderson
  • Patent number: 10473404
    Abstract: A straight-through structure of heat dissipation unit includes a first plate body and a second plate body correspondingly mated with each other to define a closed chamber. A hydrophilic layer is disposed on the surface of the closed chamber and a capillary structure is disposed in the closed chamber. The first plate body is formed with a first recess, a first perforation and a second recess. The first recess is connected with the capillary structure disposed on the third face of the second plate body. One end of the second recess abuts against the capillary structure. The capillary structure layer is not in contact with the first recess. The second plate body has a second perforation in alignment with the first perforation. When it is necessary to perforate the heat dissipation unit, the straight-through structure can keep the closed chamber in the vacuumed and airtight state.
    Type: Grant
    Filed: November 14, 2017
    Date of Patent: November 12, 2019
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Kuo-Chun Hsieh, Chih-Ming Chen
  • Patent number: 10414244
    Abstract: A refrigeration system includes a primary evaporator that cooperates with a compressor, which compresses first refrigerant containing lubricant oil, to form a refrigeration cycle that circulates the first refrigerant. At the primary evaporator, the first refrigerant absorbs heat from second refrigerant and is thereby evaporated. The refrigeration system further includes a condenser, at which the second refrigerant releases heat to the first refrigerant and is thereby condensed. The refrigeration system also includes a secondary evaporator that cooperates with the condenser to form a refrigerant circulation circuit, in which the second refrigerant is circulated. At the secondary evaporator, the secondary evaporator absorbs heat from a primary cooling subject and is thereby evaporated. A refrigerant flow passage of the primary evaporator and a refrigerant flow passage of the condenser are independently formed, so that the refrigeration cycle and the refrigerant circulation circuit are independently formed.
    Type: Grant
    Filed: June 23, 2016
    Date of Patent: September 17, 2019
    Assignee: DENSO CORPORATION
    Inventor: Tetsuo Kozasa
  • Patent number: 10420203
    Abstract: An apparatus includes a heat sink and a post that supports the heat sink that is monolithically formed with the heat sink. The apparatus can further include a printed wiring board attached to a top side of the heat sink with electronic components attached to the printed wiring board, a plurality of posts integrated into a bottom side of the heat sink and extending outwards from the heat sink, wherein the heat sink and the plurality of posts are monolithically formed, and a heat pipe attached to the bottom side of the heat sink with a first end near an electronic component and a second end near one of the plurality of posts.
    Type: Grant
    Filed: July 1, 2013
    Date of Patent: September 17, 2019
    Assignee: Hamilton Sundstrand Corporation
    Inventors: Jay W. Kokas, Kenneth J. Trotman, Kerry R. Querns, Rachel Farner
  • Patent number: 10420253
    Abstract: A loop heat-pipe includes an evaporator; a condenser; a first line which connects the evaporator to the condenser and in which working fluid of vapor phase flows; and a second line which connects the condenser to the evaporator and in which working fluid of liquid phase flows, wherein each of the evaporator, the condenser, the first line, and the second line is bonded to a first and second plate, the first plate includes in a region for the evaporator: first protrusions that extend in a length direction, and second protrusions that extend in a width direction, which intersects with the length direction; the second plate includes in a region for the evaporator: either or both of third protrusions extending in the length direction and fourth protrusions extending in the width direction, and recesses partitioned by either or both of the third protrusions and the fourth protrusions.
    Type: Grant
    Filed: November 5, 2018
    Date of Patent: September 17, 2019
    Assignee: FUJITSU LIMITED
    Inventors: Takeshi Shioga, Tomoyuki Abe
  • Patent number: 10408545
    Abstract: A cooling system includes a heat absorbing device which has a first pipe port and absorbs heat discharged from equipment by using refrigerant; a radiator which has a second pipe port placed higher than the first pipe port and cools the refrigerant; a first flexible pipe whose one end is connected with the first pipe port and whose another end is connected with the second pipe port and through which the refrigerant flows and which can bend freely; and a loading table having a surface which becomes higher in a vertical direction as approaching from one end of the surface to another end, and on which the first flexible pipe is placed so as to become higher in the vertical direction as approaching from a side of the first flexible pipe, which is connected with the first pipe port, to a side of the first flexible pipe which is connected with the second pipe port.
    Type: Grant
    Filed: December 2, 2014
    Date of Patent: September 10, 2019
    Assignee: NEC PLATFORMS, LTD.
    Inventors: Yasuhito Nakamura, Shunsuke Fujii
  • Patent number: 10409341
    Abstract: A cooling apparatus that includes a base plate including two heat exchange units and a cover coupled to the base plate and enclosing the two heat exchange units. A recess is defined in the base plate and between the two heat exchange units. The cover and the base plate define a heat exchange chamber that includes the two heat exchange units. The cover has a first set of openings and a second set of openings, and is coupled to the base plate such that the first set of openings is above a first heat exchange unit and the second set of openings is above a second heat exchange unit. The cooling apparatus further includes a first pumping unit on the cover and over the first set of openings and a second pumping unit on the cover and over the second set of openings.
    Type: Grant
    Filed: February 15, 2017
    Date of Patent: September 10, 2019
    Assignee: Cooler Master Co., Ltd.
    Inventor: Shui Fa Tsai
  • Patent number: 10399710
    Abstract: A twist capsule rotary joint system for passing a fluid through a pressure hull without a dynamic seal. A rotating cylindrical drum positioned outboard of the pressure hull is adapted to be driven in a reciprocating manner through an angle and backward through the same angle. At least one outboard pressure line or hose has a first end attached to a fixed connector that extends through the pressure hull near and radially outward of the rotating cylindrical drum. A second end of the outboard pressure line or hose is attached to a connector that extends through the top outboard surface of the drum. As the drum rotates, the pressure line wraps around the drum, or unwraps from the drum. In an exemplary embodiment, two pressure lines carry two-phase coolant through the pressure hull of a spacecraft in support of a rotating radiator that is adapted to rotate to present a minimum surface area toward the sun.
    Type: Grant
    Filed: March 24, 2016
    Date of Patent: September 3, 2019
    Assignee: The Government of the United States of America, as represented by the Secretary of the Navy
    Inventors: Adam Thurn, Philip A. Feerst, Ronald L. Sutton, Stephen M. Koss, Robert W. Baldauff
  • Patent number: 10367283
    Abstract: A connector is disclosed that includes a cage that defines a first port and second port that are vertically spaced apart. Card slots are positioned in the ports. A thermal management module is positioned between the two ports. The thermal management module directs thermal energy from one or both ports past a rear wall of the connector. A heat sink can be coupled to the thermal management module to improve thermal dissipation.
    Type: Grant
    Filed: September 8, 2017
    Date of Patent: July 30, 2019
    Assignee: Molex, LLC
    Inventors: Frank L'Esperance, Jerry Kachlic
  • Patent number: 10359614
    Abstract: An automated microscope apparatus comprises an outer housing having an external wall; optionally but preferably an internal wall in the housing configured to form a first compartment and a separate second compartment in the outer housing; a microscope assembly in the housing (preferably in the first compartment); a microprocessor in the housing (preferably in the second compartment), and (optionally but preferably) a heat sink mounted on the housing external wall, preferably adjacent the second compartment, with the microprocessor thermally coupled to said heat sink and operatively associated with the microscope assembly. Systems and methods employing the same are also described, along with component parts thereof.
    Type: Grant
    Filed: July 2, 2013
    Date of Patent: July 23, 2019
    Assignee: Advanced Animal Diagnostics, Inc.
    Inventors: Stefano Bresolin, David A. Calderwood, Tobias M. Heineck, David Newcomb, Chris Paul, Jasper N. Pollard, Rodolfo R. Rodriguez, Demetris Young
  • Patent number: 10359791
    Abstract: A controller unit for communicating with and controlling one or more discrete air conditioner units within a building is disclosed. In some instances, the discrete air conditioner controller may be configured to receive signals in a first signal format from a central coordinator and to transmit signals to the one or more discrete air conditioner units in a second signal format. The first signal format and second signal format may be different wireless formats. In some cases, the controller unit may store a programmable operating schedule, which may be updated via the central coordinator.
    Type: Grant
    Filed: February 1, 2016
    Date of Patent: July 23, 2019
    Assignee: Honeywell International Inc.
    Inventors: Ishit Trivedi, Manaswini Rath, Shankar M. Venugopal, Balakrishna G. Gudi
  • Patent number: 10350692
    Abstract: Provided is a plate-like heater for a bonding apparatus (30) including: a lower surface (31b) to which a bonding tool (40) is attached; and an upper surface (31a) to which a heat insulator (20) is attached. The upper surface (31a) is provided with a large number of capillary slits (35), and the large number of capillary slits (35) and a matching surface (21) of the heat insulator (20) attached to the upper surface (31a) form a large number of capillary coolant flow-paths (37) each extending from a cavity (36) to a lateral surface (33). This allows effective cooling of the heater for a bonding apparatus.
    Type: Grant
    Filed: January 15, 2015
    Date of Patent: July 16, 2019
    Assignee: SHINKAWA LTD.
    Inventors: Kohei Seyama, Yasuhiro Chida, Osamu Kakutani
  • Patent number: 10352526
    Abstract: A cooling member for a lighting and/or signaling system for a motor vehicle comprising a base and at least one heat dissipating device with a thermal conduction link to the base, the dissipating device comprising a plurality of dissipating elements, wherein each dissipating element comprises at least one dissipating wall extending from a fixing face. The embodiments relate also to a lighting and/or signaling system and to a method for producing the cooling member.
    Type: Grant
    Filed: August 4, 2015
    Date of Patent: July 16, 2019
    Assignee: Valeo Vision
    Inventors: Marc Duarte, Eric Stefura, Paul Jacquemin, Christophe Cleto, Lotfi Redjem Saad, Brahim El Hachir
  • Patent number: 10345049
    Abstract: A communication-type thermal conduction device includes a vapor chamber, at least one heat pipe, and at least one third capillary structure. The vapor chamber has a bottom board. A first capillary structure is disposed on an inner surface of the bottom board. A second capillary structure is disposed in the heat pipe. One end portion of the heat pipe is connected to the bottom board, and the end portion has an open portion in communication with the heat pipe and the vapor chamber. The second capillary structure has a connected portion exposed by means of the open portion. The third capillary structure is connected to the first capillary structure and the connected portion, so that the first and second capillary structures are in communication with each other. Accordingly, holistic thermal conduction can be achieved, and the vapor chamber incorporating the heat pipe can provide the desired heat dissipation effect.
    Type: Grant
    Filed: April 11, 2017
    Date of Patent: July 9, 2019
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Chien-Hung Sun, Leilei Liu, Xiao-Min Zhang
  • Patent number: 10342164
    Abstract: A rack mount-type information processing apparatus includes: a plurality of slots, into each of which an electronic device is inserted, a liquid-cooled element provided in a cooling target included in the electronic device, a liquid to cool the cooling target being circulated in the liquid-cooled element; a manifold pipe extending in a direction where the slots are arranged; and a plurality of connection pipes configured to interconnect the liquid-cooled element and the manifold pipe, and coupled in parallel to the manifold pipe at a portion of the manifold pipe which corresponds to at least one slot among the plurality of slots.
    Type: Grant
    Filed: October 5, 2017
    Date of Patent: July 2, 2019
    Assignee: FUJITSU LIMITED
    Inventors: Tsuyoshi So, Osamu Aizawa, Keita Hirai, Koji Nakagawa, Yoshinori Uzuka, Nobumitsu Aoki, Naofumi Kosugi
  • Patent number: 10321606
    Abstract: Apparatuses, systems and methods associated with a flexible thermally conductive shunt are disclosed herein. The flexible thermally conductive shunt may include a thermally conductive element, the thermally conductive element being flexible. The flexible thermally conductive shunt may further include a thermally conductive member thermally coupled to the thermally conductive element. The thermally conductive member may include a shell and a cavity. The shell may be sealed to the thermally conductive element, wherein the thermally conductive element extends through a discontinuity of the shell. The cavity may be formed at a center of the thermally conductive member and enclosed by the shell, wherein a first portion of the thermally conductive element extends within the cavity and a second portion of the thermally conductive element extends out of the thermally conductive member via the discontinuity of the shell. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: March 28, 2017
    Date of Patent: June 11, 2019
    Assignee: Intel Corporation
    Inventors: Mark E. Sprenger, Kenan Arik, Michael S. Brazel
  • Patent number: 10309728
    Abstract: Titanium-based thermal ground planes are described. A thermal ground plane in accordance with the present invention comprises a titanium substrate comprising a plurality of pillars, wherein the plurality of Ti pillars can be optionally oxidized to form nanostructured titania coated pillars, and a vapor cavity, in communication with the plurality of titanium pillars, for transporting thermal energy from one region of the thermal ground plane to another region of the thermal ground plane.
    Type: Grant
    Filed: July 22, 2014
    Date of Patent: June 4, 2019
    Assignee: The Regents of the University of California
    Inventors: Noel C. MacDonald, Carl D. Meinhart, Changsong Ding, Payam Bozorgi, Gaurav Soni, Brian D. Piorek
  • Patent number: 10278308
    Abstract: An interlaced heat dissipation structure of an addin card generally includes an addin card, a plurality of heat dissipation fins arranged on the addin card, at least one receiving space defined between the heat dissipation fins, a plurality of cooling pipes extending through the heat dissipation fins, and a plurality of heat dissipative elements arranged in the receiving space in a manner of being interlaced with the cooling pipes. As such, the heat dissipation fins, the cooling pipes, and the heat dissipative elements help cool down the addin card to keep the operation of the addin card stable. The interlaced arrangement of the cooling pipes and the heat dissipative elements in the receiving space defined between the heat dissipation fins makes it possible to maximize the total effective heat dissipation area.
    Type: Grant
    Filed: March 31, 2017
    Date of Patent: April 30, 2019
    Assignee: EVGA CORPORATION
    Inventor: Tai-Sheng Han
  • Patent number: 10267579
    Abstract: A method for improving thermal efficiency of a heating device that reduces an amount of heat flowing out from a heating device 11 to the outside by installing a heat-resistant inorganic conjugated molded product 16 in and along a pathway 15 for heated gas generated from the heating device 11 without interrupting the flow of heated gas passing the pathway 15, heating the inorganic conjugated molded product 16 with the heated gas, and putting radiation heat from the heated inorganic conjugated molded product 16 back into the heating device 11, the inorganic conjugated molded product 16 being provided with an interior layer and an exterior layer, the exterior layer consisting of a coverture for inorganic materials that protects the interior layer from heated gas.
    Type: Grant
    Filed: May 26, 2014
    Date of Patent: April 23, 2019
    Assignee: JAPAN ULTRA-HIGH TEMPERATURE MATERIALS RESEARCH CENTER
    Inventors: Takemi Yamamura, Narihito Nakagawa, Terumi Hisayuki, Motohide Toda, Hironaga Iguchi, Yoshikazu Matsumura, Kiyohito Okamura
  • Patent number: 10252238
    Abstract: An apparatus for producing pulverulent poly(meth)acrylate in a reactor for droplet polymerization having an apparatus for dropletization of a monomer solution for the production of the poly(meth)acrylate having holes through which the monomer solution is introduced, an addition point for a gas above the apparatus for dropletization, at least one gas withdrawal point on the circumference of the reactor and a fluidized bed, and above the gas withdrawal point the reactor has a region having a constant hydraulic internal diameter and below the gas withdrawal point the reactor has a hydraulic internal diameter that steadily decreases. The reactor has a heating means in the region having a steadily decreasing hydraulic internal diameter.
    Type: Grant
    Filed: February 25, 2016
    Date of Patent: April 9, 2019
    Assignee: BASF SE
    Inventors: Robert Bayer, Jürgen Freiberg, Rudolf Schliwa, Marco Krüger
  • Patent number: 10256688
    Abstract: An electric machine having a rotor, stator and housing. The rotor includes a radially mounted array of permanent magnets and the stator includes a plurality of electromagnets radially positioned around the rotor. The machine includes a fluid circuit consisting of first and second cavities enclosed by the stator and positioned between the rotor and housing. The fluid circuit also includes an air gap between the stator and rotor and a plurality of ventilation channels extending through the rotor. The air gap and ventilation channels are in fluid communication with the first and second cavities. The rotor also includes an internal fan extending into the first or second cavity. When the rotor is caused to rotate with respect to the stator, the fan causes air or another fluid to circulate through the fluid circuit to cool the rotor.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: April 9, 2019
    Assignee: ZERO E TECHNOLOGIES, LLC
    Inventors: Thomas H. Hopkins, Felipe J. Castillo, Scott T. Graham, Keith W. Klontz
  • Patent number: 10247488
    Abstract: A heat dissipation device includes a substrate and at least one heat pipe, which is pressed to tightly fit in a receiving groove defined by the substrate to make two opposite lateral sides of the heat pipe tightly respectively in contact with two opposite inner sides of the receiving groove to tightly connect the substrate to the heat pipe to solve the problem existing in the conventional heat dissipation device of a poor levelness of the receiving groove on a top and a bottom side of the substrate, so as to have reduced manufacturing costs and provide uniform temperature effect.
    Type: Grant
    Filed: September 17, 2015
    Date of Patent: April 2, 2019
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Sheng-Huang Lin, Yuan-Yi Lin