Abstract: The present invention provides a stack-type vertical heat dissipation device comprising an evaporator unit and a condenser unit. The evaporator unit has a side configured for direct or indirect contact with, and thereby receiving heat from, a high-temperature device in order for the heat to convert a heat conduction medium inside the evaporator unit into a gaseous state. The condenser unit is stacked on a top side of a housing of the evaporator unit, and is provided therein with a flow channel that is in communication with the evaporator unit and allows passage of the heat conduction medium so that the heat conduction medium is able to return to the evaporator unit under a force of gravity after condensing from the gaseous state into a liquid state and thereby complete a thermal cycle.

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a hybrid thermal management system. The hybrid thermal management system can include a heat source, an air mover, a heat sink coupled to the air mover, a thermal electric cooling device (TEC), and a heat pipe. The heat pipe can couple the heat source to the heat sink and to the TEC and transfer heat from the heat source to the heat sink and to the TEC.

Abstract: A refrigerator includes a main body defining a storage space, a cryogenic freezing compartment having an insulation space that is independent with respect to the storage space, an evaporator disposed inside the storage space to cool the storage space, and a thermoelectric module assembly disposed at one side of the cryogenic freezing compartment so that the cryogenic freezing compartment is cooled to a temperature less than that of the storage space. The thermoelectric module assembly includes a thermoelectric module, a cold sink coming into contact with a heat absorption surface of the thermoelectric module and disposed in the cryogenic freezing compartment, and a heat sink coming into contact with a heat generation surface of the thermoelectric module. The heat sink is cooled by introducing a refrigerant supplied to the evaporator.

Abstract: A liquid-cooling radiator module includes a first reservoir, a second reservoir, a heat dissipation stacked structure, a radiator inlet and a radiator outlet. The first reservoir includes a first chamber and a second chamber. The second reservoir includes a third chamber and a fourth chamber. A fin tube layer of the heat dissipation stacked structure is sandwiched between the first reservoir and the second reservoir. The radiator inlet is connected to the first reservoir and the first chamber. The radiator outlet is connected to the second reservoir and the fourth chamber. A part of fin tubes of the fin tube layer communicates with the first chamber and the third chamber, another part of the fin tubes communicates with the third chamber and the second chamber, and one another part of the fin tubes communicates with the second chamber and the fourth chamber.

Abstract: A partition member has a thickness direction and a surface direction perpendicular to the thickness direction, and which separates single cells that make up an assembled battery in the thickness direction, or a single cell that makes up the assembled battery in the thickness direction and a member other than the single cells. The partition member includes, in the interior thereof, a fluid having a boiling point at normal pressure of 80° C. to 250° C., and a flow channel of the fluid extending along the surface direction. The fluid is held in a fluid holding part, and the fluid holding part is hermetically sealed by a packaging material.

Abstract: A capillary structure of vapor chamber and the vapor chamber. The capillary structure of vapor chamber includes a sintered main body. The sintered main body has multiple perforations and multiple extension sections integrally extending from one side of the sintered main body. The extension sections are arranged at intervals or not arranged at intervals to support the sintered main body. The vapor chamber includes a first plate body and a second plate body. The first and second plate bodies are correspondingly mated with each other to together define an airtight chamber. The second plate body has a heated section and a first capillary structure. The sintered main body is correspondingly disposed in the heated section and supported on (overlapped with) the first capillary structure. By means of the extension sections, the sintered main body and the first capillary structure define therebetween a gap.

Abstract: A liquid collection assembly positionable between a fill material and a fan of a cooling tower for collecting liquid gravitating through the fill material while allowing air to pass up to the fill material. The liquid collection assembly includes a plurality of trough assemblies supported in a spaced apart, vertically overlapping relationship to provide a uniform path for rising air, to capture the down flowing liquid, to provide a barrier between the liquid distribution system and the fan, and to carry the liquid into the at least one gutter. The trough assemblies are supported by a first end plate and a second end plate through which trough assemblies extend.

Abstract: Devices, systems, and methods are disclosed for cooling using both air and/or liquid cooling sub circuits. A vapor compression cooling system having both an air and liquid cooling sub circuit designed to service high sensible process heat loads that cannot be solely cooled by either liquid or air is provided.

Abstract: A vapor chamber that includes a housing having a first sheet and a second sheet that oppose each other and that are joined to each other in a peripheral region of the housing; a working liquid enclosed within the housing; and a wick structure on an inside surface of the first sheet or the second sheet. In the vapor chamber, the wick structure includes multiple protruding portions and a grid portion integral with the protruding portions. In addition, surfaces of the protruding portions and a surface of the grid portion opposite the inside surface of the first sheet or the second sheet are positioned on a same flat surface.

Abstract: A cooling system includes an evaporator, connected through fluid lines to a first condenser, a second condenser, a compressor, and a thermal expansion valve. One or more valves are arranged in the fluid lines. The one or more valves operated to, in a first mode, circulate fluid between the evaporator the first condenser; in a second mode, circulate the fluid between a) the evaporator and the first condenser, and b) the evaporator, the second condenser, and the thermal expansion valve, and; in a third mode, circulate the fluid between a) the evaporator and the first condenser, and c) the evaporator, the compressor, the second condenser, and the thermal expansion valve.

Abstract: A evaporator of a loop heat pipe includes a liquid inlet side portion that extends in a widthwise direction crossing with a lengthwise direction from a liquid inlet side to a vapor outlet side, a plurality of portions that continue to the liquid inlet side portion and extend in the lengthwise direction, a plurality of vapor flow paths that are provided between the plurality of portions and extend in the lengthwise direction, and a vapor outlet side vapor flow path that extends in the widthwise direction and continues to the vapor flow paths. Each of the plurality of portions includes a first groove communicating two adjacent ones of the vapor flow paths.

Abstract: An enhanced gravity-driven, thin film condensation heat transfer condenser is disclosed for use in a thermosyphon performing in two perpendicular orientations, as well as orientations in between. The thermosyphon includes an evaporator fluidly coupled to a first condenser configured with a plurality of fins, with each of the plurality of fins having notches adjacent to flanges, the notches forming vapor flow channels through the plurality of fins. The first condenser is fluidly coupled to a second condenser, and vapor flowing from the evaporator must first pass through the first condenser before entering the second condenser.

Abstract: A heat rejection panel comprising a first and a second plate. The first plate comprises an oscillating heat pipe face having a plurality of first opened elongated recesses formed therein, and the second plate comprises an oscillating heat pipe face having a plurality of second open elongated recesses formed therein. The first plate oscillating heat pipe face is hermetically sealed to the second plate oscillating heat pipe face forming a bond joint therebetween. The first plate caps the second open elongated recesses and the second plate caps the first open elongated recesses such that first open elongated recesses are physically and fluidly connected to the second open elongated recesses, thereby forming at least one non-planar oscillating heat pipe channel within the panel that reciprocates back and forth across the bond joint having the bond joint as a longitudinal axis.

Abstract: An information handling system includes a computing device, a computing component of the computing device that is housed in a chassis, and a chilled air filter that reduces a humidity level of a portion of an airflow when the chilled air filter is in an active state. The portion of the airflow thermally manages the computing component. The airflow is received by the chassis via an air receiving exchange and exhausted by the chassis via an air expelling exchange.

Abstract: An apparatus incorporating a multi-surface heat sink may comprise an integrated circuit die, a heat spreader, a plate element, and a heat sink. The heat spreader may be positioned above the IC die. The plate element may be positioned above the heat spreader. A bottom surface of the heat sink may have a first region positioned above the plate element. One or more spring elements may be positioned between the plate element and the first region of the bottom surface of the heat sink. The one or more spring elements may be under a compressive load between the plate element and the heat sink. One or more thermal conduit elements may be secured to both the plate element and the heat sink. The one or more thermal conduit elements may apply at least a part of the compressive load between the plate element and the heat sink.

Abstract: A refrigerator 10 comprises at least one box-shaped storage compartment 14 and a heat radiating member 23. The storage compartment 14 is formed in such a way that one side of a frame formed by a wall member is closed and the other thereof is provided with an opening surface configured to be opened or closed by a door. The wall member includes a hollow structure composed of a plurality of plate members 21 and 22 and a foam insulation 25 filled in the hollow structure. The heat radiating member 23 is arranged in the wall member. In the wall member, a pressure member 24 configured to press the heat radiating member against the plate member is provided. The pressure member 24 is a material configured to press the heat radiating member 23 under predetermined conditions.

Abstract: A heat transfer device such as a heat sink includes one or more fins for dissipating heat received from a heat source, such as an integrated circuit or other electronic component. A thermosiphon component including a tube that defines a closed, continuous loop and contains a working fluid is attached to a face of a corresponding fin and is arranged to operate as a two-phase thermosiphon to transfer heat across areas of the fin. The heat transfer may equalize temperatures across the fin, enhancing efficiency.

Abstract: A protection element for vapor chamber includes a main body and a protection element. The main body is divided into a working zone and a sealing zone. The sealing zone is located around an outer periphery of the working zone and is provided with a notch area, to which a fluid-adding and air-evacuating pipe is connected. The protection element is correspondingly mounted to the notch area to contact with the sealing zone of the main body. With the arrangement of the protection element, the fluid-adding and air-evacuating pipe is protected against collision and impact and accordingly, the main body of the vapor chamber is protected against vacuum and working fluid leakage.

Abstract: An system and method for cooling of electronic equipment, for example a computer system, in a subsurface environment including a containment vessel in at least partial contact with subsurface liquid or solid material. The containment vessel may be disposed in a variety of subsurface environments, including boreholes, man-made excavations, subterranean caves, as well as ponds, lakes, reservoirs, oceans, or other bodies of water. The containment vessel may be installed with a subsurface configuration allowing for human access for maintenance and modification. Cooling is achieved by one or more fluids circulating inside and/or outside the containment vessel, with a variety of configurations of electronic devices disposed within the containment vessel. The circulating fluid(s) may be cooled in place by thermal conduction or by active transfer of the fluid(s) out of the containment vessel to an external heat exchange mechanism, then back into the containment vessel.

Abstract: A heat exchanger, a heat exchanger unit, and a refrigeration cycle apparatus are provided where heat exchange performance is improved, and drainage properties and resistance against frost formation are improved. A flat tube and a plurality of fins that are each a plate having a plate surface extending in a longitudinal direction and in a width direction orthogonal to the longitudinal direction are provided. The plate surface intersects a pipe axis of the flat tube, and the plurality of fins are arranged at an interval from one another. The plurality of fins each have a first spacer formed in the plate and maintaining the interval. The flat tube has a longitudinal axis of a section perpendicular to the pipe axis, and the longitudinal axis is inclined to the width direction by an inclination angle ?. The first spacer has a standing surface extending in a direction intersecting the plate surface.

Abstract: An air-conditioning device that allows sufficient power to be reliably supplied to an imaging device is provided. The air-conditioning device includes a control unit that makes an imaging device capture an image while at least one predetermined component of the air-conditioning device is at rest.

Abstract: A method for attaching a heat-emitting device and a capillary heat pipe to a panel of a spacecraft wall is disclosed including the steps of: a) positioning a capillary heat pipe on a portion of the panel; attaching female attachment bodies to the panel, the female attachment bodies protruding relative to the capillary heat pipe; c) placing a thermally-conductive and self-curing paste over a portion of the capillary heat pipe or over a heat-emitting device; d) placing a heat-emitting device on the thermally-conductive and self-curing paste and on the female attachment bodies, said heat-emitting device bearing against and being in direct contact with the female attachment bodies, and e) attaching the heat-emitting device and said capillary heat pipe to the panel by attaching male attachment members to the female attachment bodies.

Abstract: A heat dissipation structure and a manufacturing method thereof and a display device. The heat dissipation structure includes: a heat dissipation plate body, including an evaporation part and a condensation part; a plurality of micro-cavity structures, disposed in the heat dissipation plate body, two ports of each of the micro-cavity structures being sealed, and the micro-cavity structures being filled with liquid. Each of the micro-cavity structures extends from the evaporation part to the condensation part, and after the liquid absorbs heat at the evaporation part to change into vapor, the vapor moves toward the condensation part, and the vapor moved to the condensation part is condensed and liquefied and moves toward the evaporation part to achieve heat dissipation.

Abstract: A heat exchanger, a heat exchanger unit, and a refrigeration cycle apparatus are provided where heat exchange performance is improved, and drainage properties and resistance against frost formation are improved. A flat tube and a plurality of fins that are each a plate having a plate surface extending in a longitudinal direction and in a width direction orthogonal to the longitudinal direction are provided. The plate surface intersects a pipe axis of the flat tube, and the plurality of fins are arranged at an interval from one another. The plurality of fins each have a first spacer formed in the plate and maintaining the interval. The flat tube has a longitudinal axis of a section perpendicular to the pipe axis, and the longitudinal axis is inclined to the width direction by an inclination angle ?. The first spacer has a standing surface extending in a direction intersecting the plate surface.

Abstract: Embodiments may utilize a series of exposed fins, which increase the surface area of the heat sink creating additional air flow. As hotter air rises within the system, cooler is drawn into the heatsink. The fins may be exposed on both sides of the longitudinal axis, allowing cooler air to be drawn towards the longitudinal axis above the heatsink and flow upward. This process may cool the fins. Additionally, the spacing between the fins may have to be wide enough to allow for air to freely enter the heatsink.

Abstract: The embodiments of the present disclosure relates a cryopump including a pump housing including a suction port, a cold head located within the pump housing, a shielding element located within the pump housing and covering the cold head, a baffle at the suction port, the baffle including a gas passage with an inlet and an outlet, an orthographic projection of the baffle to the cross section of the pump housing completely covers an orthographic projection of the suction port thereto, the gas passage includes a first portion and a second portion intersecting with each other, the inlet is defined by one end of the first portion, the outlet is defined by one end of the second portion.

Abstract: An example apparatus is disclosed that includes a base and a wickless capillary driven constrained vapor bubble heat pipe carried by the base. The wickless capillary driven constrained vapor bubble heat pipe includes a capillary, and the capillary has a longitudinal axis and a cross-sectional shape orthogonal to the longitudinal axis. The cross-sectional shape includes a first curved wall, a second curved wall, a first corner between a first straight wall and a second straight wall, and a second corner between a third straight wall and a fourth straight wall.

Abstract: The present disclosure provides a heat pipe capable of preventing deformation of even a thin container and having excellent heat transfer characteristics by preventing freezing of a working fluid even if the longitudinal direction of the container is set substantially parallel to the direction of gravity in cold regions. A heat pipe includes a container having a tubular shape with both ends sealed, a wick structure stored in the container, and a working fluid sealed in the container, wherein, in at least one of cross sections perpendicular to the longitudinal direction of the container, the wick structure is in contact with the inner surface of the container at two points but both side surfaces of the wick structure are not in contact with any inner surface of the container, and a sintered metal layer is formed on the container inner surface being not in contact with the wick structure.

Abstract: An electronic device according to various embodiments of the present invention can comprise: a housing including a first plate facing a first direction, a second plate facing a second direction opposite to the first direction, and a side member for encompassing a space between the first plate and the second plate; a circuit board arranged inside the housing and including at least one heating element; a first vapor chamber for receiving, through conduction, and dispersing, in at least a partial space between the first plate and the circuit board, heat released from the at least one heating element; a heat sink for receiving, through conduction, and absorbing, in at least a partial space between the circuit board and the second plate, heat released from the at least one heating element; and a fan for supplying air such that the heat absorbed by the heat sink is forcibly convected toward the outside of the electronic device. Additional various embodiments are possible.

Abstract: Apparatus and methods directed to an assembly associated with a downhole tool, and including: a thermal housing; at least one internal component inside the thermal housing, wherein the at least one internal component comprises at least one thermally sensitive component; and a thermal isolation support connecting the at least one internal component to the tool. The thermal isolation support may comprise an additive manufacturing structural framework connected to the tool. The structural framework may include a plurality of structural members, with a majority of the plurality of structural members substantially non-parallel with a longitudinal axis of the downhole tool.

Abstract: The present invention relates to a thermal control device of a component, the control device including: a power source, a converter able to convert a temperature variation into a resistance variation, and a cooling module including two faces, a first face at a first temperature and a second face at a second temperature, the difference between the first temperature and the second temperature depending on the current supplying the cooling module, the first face being in, contact with the component, the cooling module, the converter and the power source being arranged electrically so that the current supplying the converter decreases with a temperature increase and the current supplying the cooling module remains constant.

Abstract: The present invention provides a substrate stage and a substrate processing apparatus that appropriately control a temperature of a staging surface on which a substrate is placed. The substrate stage includes a stage base including a cooling surface therein, and a supply flow path forming member formed of a material having a lower thermal conductivity than that of the stage base and including cooling nozzles configured to spray a coolant toward the cooling surface.

Abstract: An evaporator includes an inlet in a lower manifold, an outlet in an upper manifold, and a multiport tube extending between the lower manifold and the upper manifold. The multiport tube provides a flow path between the lower manifold and the upper manifold. One of the outer side walls of the multiport tube is provided with a first evaporator section with a first heat receiving surface and a second evaporator section with a second heat receiving surface, the first and second evaporator sections passing a heat load received via the respective first and second heat receiving surfaces to a fluid in said multiport tube. The first and second heat receiving surfaces form an angle with each other to align with and contact different surfaces of an object to be cooled.

Abstract: A stem cell manufacturing system for manufacturing stem cells from somatic cells includes: one or more closed production device(s) configured to produce stem cells from somatic cells; one or more drive device(s) configured to be connected with the production device(s) and drive the production device(s) in such a manner as to maintain the production device(s) in an environment suitable for producing stem cells; one or more cryopreservation device(s) configured to cryopreserve the produced stem cells; a first memory device configured to store whether or not somatic cells have been introduced to the production device(s), as a first state; a second memory device configured to store whether or not the production device(s) is/are connected with the drive device(s), as a second state; and a third memory device configured to store whether or not the produced stem cells can be placed in the cryopreservation device(s), as a third state.

Abstract: Provided are a phase change cooler with enhanced cooling performance and enhanced pressure resistance performance, and an electronic device using such a phase change cooler. The phase change cooler includes a heat receiving unit, a heat dissipating unit, a vapor pipe and a liquid pipe that interconnect the heat receiving unit and the heat dissipating unit to form a loop, and refrigerant encapsulated inside the phase change cooler. The heat receiving unit has an approximately semicircular cross section, and the vapor pipe is coupled to an inclined face of the heat receiving unit.

Abstract: A pulse loop heat exchanger, under vacuum, having a working fluid therein, comprising a heat exchanger body, a first continuity plate, and a second continuity plate is provided. The heat exchanger body, first continuity plate and second continuity plate comprise a plurality of channels and grooves on different elevated plane levels, respectfully. The different elevated plane levels result in increased output pressure gain in downward working fluid flow portions of the grooves, boosting thermo-fluidic transport oscillation driving forces throughout the heat exchanger. The second continuity plate comprises a second continuity plate attachment surface having a third elevated continuity channel. In addition to providing for fluid transport and boosting oscillation driving forces, the third elevated continuity channel also provides an internal reservoir.

Abstract: A heat dissipation assembly includes a condenser, an evaporator, a vapor conduit, and a liquid conduit. The condenser has a condensing chamber therein. Two ends of the vapor conduit are respectively connected to the condenser and the evaporator. Two ends of the liquid conduit are respectively connected to the condenser and the evaporator. A geometric center of the liquid conduit in the condensing chamber is lower than or equal to a geometric center of the condensing chamber.

Abstract: Various aspects as described herein are directed to a radiative cooling apparatuses and methods for cooling an object. As consistent with one or more embodiments, a radiative cooling apparatus includes an arrangement of a plurality of different material located at different depths along a depth dimension relative to the object. The plurality of different material includes a solar spectrum reflecting portion configured and arranged to suppress light modes, thereby inhibiting coupling of the incoming electromagnetic radiation, of at least some wavelengths in the solar spectrum, to the object at a range of angles of incidence relative to the depth dimension. Further, the plurality of material includes a thermally-emissive arrangement configured and arranged to facilitate, simultaneously with the inhibiting coupling of the incoming electromagnetic radiation, the thermally-generated electromagnetic emissions from the object at the range of angles of incidence and in mid-IR wavelengths.

Abstract: A heat exchanger for cooling a heat-generating component includes first and second plates, each having a core layer of a first metal and an inner clad layer of a lower melting second metal, which is inert to the working fluid contained in a fluid chamber of the heat exchanger. The outer peripheral sealing surfaces of the first and second plates are joined by welding, wherein the weld joint is fluidly isolated from the fluid chamber by a layer of the second metal in an area adjacent to the weld joint. In some embodiments, the heat exchanger includes liquid flow passages and primary and secondary gas flow passages, each secondary passage providing communication between primary gas flow passages. The gas and liquid flow passages may be defined by a wick material having hydrophilic areas and non-wicking areas of reduced thickness. A method of manufacturing is also disclosed.

Abstract: A vapor chamber device is provided. The vapor chamber device includes a heat-generating component, a first metallic layer deposited directly on the heat-generating component, and a second metallic layer deposited so as to contact the first metallic layer at a perimeter. The first and second metallic layers fully enclose an internal void formed therein.

Abstract: A heat pipe including a vapor line having a flow path through which a working fluid vapor flows, wherein the vapor line includes walls opposite to each other across the flow path, and a support post disposed in the flow path and spaced apart from the walls, wherein the walls are made of a plurality of metal layers stacked one over another, and the support post is made of a single seamless member having the same thickness as the walls.

Abstract: Heat transfer systems and methods are disclosed. A heat transfer system includes an electronic enclosure that houses electronic components and includes a volume for a first fluid. A cold plate within the electronic enclosure is configured to contain a second fluid, and the cold plate includes a recess providing access to the second fluid. The heat transfer system also includes a heat transfer device configured to transfer heat from the first fluid to the second fluid. The heat transfer device is a single integrated piece that is situated within the recess wherein a first surface of the heat transfer device is configured to directly interface with the first fluid and a second surface of the heat transfer device is configured to directly interface with the second fluid.

Abstract: Variable temperature analytical instrument components are provided that can include: a conduit configured to extend between two chambers having different pressures; and a first mass about a section of the conduit, wherein the first mass is maintained at a first temperature. Variable temperature analytical instruments are provided that can include: a sample chamber configured to be operably coupled to a heat or cold source via one or more conduits; an interface component configured to engage the one or more conduits with the sample chamber, the interface comprising a conduit configured to extend between two chambers having different pressures; and a first mass about a section of the conduit, wherein the first mass is maintained at a first temperature. Methods for maintaining temperatures within a variable temperature analytical instrument are also provided.

Abstract: A fluid cooling system for an electronics package having a chassis is disclosed. The system includes an electronics package housed within a chassis, one or more mounting structures attached to the chassis, and a fluid cooling module interfaced with one or more electronics of the electronics package, the fluid cooling module housed within the chassis and mounted to the one or more mounting structures, where circulation of a fluid of the fluid cooling module cools the one or more electronics. A chassis fluid distribution manifold is used to connect with the chassis fluid inlet and outlet and to distribute fluid within the chassis.

Abstract: A flat loop heat pipe includes an evaporator that vaporizes a working fluid, a condenser that liquefies the working fluid vaporized by the evaporator, a vapor pipe that connects the evaporator to the condenser, and a liquid pipe that connects the condenser to the evaporator. The liquid pipe includes a first wick. The condenser includes a flow passage and a second wick. The flow passage connects the vapor pipe and the liquid pipe. The second wick is connected to the first wick. The second wick is exposed in the flow passage and extends from the flow passage in a planar direction.

Abstract: A method and apparatus for the continuous sublimation of a substance includes cascading a material containing a substance capable of sublimation, such as water, between a plurality of trays vertically stacked within a processing zone provided within a processing chamber. A substantially atmospheric environment is maintained within the processing zone at a temperature whereby the substance sublimes forming a sublimate within the environment. The environment containing the sublimate is contacted with a drying agent such as a desiccant to maintain the environment whereby the substance sublimes at substantially atmospheric pressure and at the controlled temperature.

Abstract: A middle member of heat dissipation device and the heat dissipation device. The middle member includes a middle member main body having a first face, a second face, multiple perforations and a channeled structure assembly. The channeled structure assembly is disposed on the first face or the second face. The perforations are formed through the middle member main body between the first and second faces. The channeled structure assembly and the perforations are arranged in alignment with each other or not in alignment with each other. The middle member and a first plate body and a second plate body are overlapped with each other to form the heat dissipation device. The complex structures disposed on the first and second faces of the middle member main body are able to achieve a stable vapor-liquid circulation effect.

Abstract: A tube heat exchanger extending in a vertical direction, comprising: a first chamber including a lower portion provided with at least one intake inlet for a diphasic fluid including a liquid and a first vapor containing a mist; an upper portion; and a first recovery member passed through by the first vapor and recovering the mist in liquid form, the first vapor next arriving in the upper portion, a central chamber forming liquid films running over the tubes and vaporizing at least partially to produce a second vapor, the tubes being traveled inwardly by a fluid hotter than the diphasic fluid, and a second chamber receiving the first vapor and the second vapor to form a third vapor, and including an outlet for the non-vaporized liquid and an outlet for the third vapor, the first chamber and the second chamber together forming a volume surrounding the central chamber around the vertical direction.

Abstract: A cooling device to be provided is capable of being reduced in size, capable of cooling a heating component uniformly, having high radiating performance, and facilitating implementation of a work in a flat state. A first cooler body includes a first base plate and first blades. The first base plate has a first component mounting surface. A second cooler body includes a second base plate and second blades. The second base plate has a second component mounting surface. With the second cooler body maintained connected to the first cooler body, a rotary mechanism allows the second cooler body to rotate relative to the first cooler body between a state in which the first component mounting surface and the second component mounting surface are pointed to the same direction and a state in which the second blades get into gaps between the first blades without interfering with the first blades.

Abstract: A cooling system includes a primary heat sink including a primary top base plate, a primary bottom base plate and a primary fin pack including a plurality of fins, where the primary fin pack is disposed between the primary top base plate and the primary bottom base plate. The cooling system further includes secondary heat sink including a secondary top base plate, a secondary bottom base plate and a secondary fin pack including a plurality of fins, where the secondary fin pack is disposed between the secondary top base plate and the secondary bottom base plate. A heat pipe extends between the primary top base plate and the primary bottom base plate, where the heat pipe further extends from the primary heat sink and couples with the secondary heat sink.