Utilizing Change Of State Patents (Class 165/104.21)
  • Patent number: 10367283
    Abstract: A connector is disclosed that includes a cage that defines a first port and second port that are vertically spaced apart. Card slots are positioned in the ports. A thermal management module is positioned between the two ports. The thermal management module directs thermal energy from one or both ports past a rear wall of the connector. A heat sink can be coupled to the thermal management module to improve thermal dissipation.
    Type: Grant
    Filed: September 8, 2017
    Date of Patent: July 30, 2019
    Assignee: Molex, LLC
    Inventors: Frank L'Esperance, Jerry Kachlic
  • Patent number: 10359614
    Abstract: An automated microscope apparatus comprises an outer housing having an external wall; optionally but preferably an internal wall in the housing configured to form a first compartment and a separate second compartment in the outer housing; a microscope assembly in the housing (preferably in the first compartment); a microprocessor in the housing (preferably in the second compartment), and (optionally but preferably) a heat sink mounted on the housing external wall, preferably adjacent the second compartment, with the microprocessor thermally coupled to said heat sink and operatively associated with the microscope assembly. Systems and methods employing the same are also described, along with component parts thereof.
    Type: Grant
    Filed: July 2, 2013
    Date of Patent: July 23, 2019
    Assignee: Advanced Animal Diagnostics, Inc.
    Inventors: Stefano Bresolin, David A. Calderwood, Tobias M. Heineck, David Newcomb, Chris Paul, Jasper N. Pollard, Rodolfo R. Rodriguez, Demetris Young
  • Patent number: 10359791
    Abstract: A controller unit for communicating with and controlling one or more discrete air conditioner units within a building is disclosed. In some instances, the discrete air conditioner controller may be configured to receive signals in a first signal format from a central coordinator and to transmit signals to the one or more discrete air conditioner units in a second signal format. The first signal format and second signal format may be different wireless formats. In some cases, the controller unit may store a programmable operating schedule, which may be updated via the central coordinator.
    Type: Grant
    Filed: February 1, 2016
    Date of Patent: July 23, 2019
    Assignee: Honeywell International Inc.
    Inventors: Ishit Trivedi, Manaswini Rath, Shankar M. Venugopal, Balakrishna G. Gudi
  • Patent number: 10350692
    Abstract: Provided is a plate-like heater for a bonding apparatus (30) including: a lower surface (31b) to which a bonding tool (40) is attached; and an upper surface (31a) to which a heat insulator (20) is attached. The upper surface (31a) is provided with a large number of capillary slits (35), and the large number of capillary slits (35) and a matching surface (21) of the heat insulator (20) attached to the upper surface (31a) form a large number of capillary coolant flow-paths (37) each extending from a cavity (36) to a lateral surface (33). This allows effective cooling of the heater for a bonding apparatus.
    Type: Grant
    Filed: January 15, 2015
    Date of Patent: July 16, 2019
    Assignee: SHINKAWA LTD.
    Inventors: Kohei Seyama, Yasuhiro Chida, Osamu Kakutani
  • Patent number: 10352526
    Abstract: A cooling member for a lighting and/or signaling system for a motor vehicle comprising a base and at least one heat dissipating device with a thermal conduction link to the base, the dissipating device comprising a plurality of dissipating elements, wherein each dissipating element comprises at least one dissipating wall extending from a fixing face. The embodiments relate also to a lighting and/or signaling system and to a method for producing the cooling member.
    Type: Grant
    Filed: August 4, 2015
    Date of Patent: July 16, 2019
    Assignee: Valeo Vision
    Inventors: Marc Duarte, Eric Stefura, Paul Jacquemin, Christophe Cleto, Lotfi Redjem Saad, Brahim El Hachir
  • Patent number: 10345049
    Abstract: A communication-type thermal conduction device includes a vapor chamber, at least one heat pipe, and at least one third capillary structure. The vapor chamber has a bottom board. A first capillary structure is disposed on an inner surface of the bottom board. A second capillary structure is disposed in the heat pipe. One end portion of the heat pipe is connected to the bottom board, and the end portion has an open portion in communication with the heat pipe and the vapor chamber. The second capillary structure has a connected portion exposed by means of the open portion. The third capillary structure is connected to the first capillary structure and the connected portion, so that the first and second capillary structures are in communication with each other. Accordingly, holistic thermal conduction can be achieved, and the vapor chamber incorporating the heat pipe can provide the desired heat dissipation effect.
    Type: Grant
    Filed: April 11, 2017
    Date of Patent: July 9, 2019
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Chien-Hung Sun, Leilei Liu, Xiao-Min Zhang
  • Patent number: 10342164
    Abstract: A rack mount-type information processing apparatus includes: a plurality of slots, into each of which an electronic device is inserted, a liquid-cooled element provided in a cooling target included in the electronic device, a liquid to cool the cooling target being circulated in the liquid-cooled element; a manifold pipe extending in a direction where the slots are arranged; and a plurality of connection pipes configured to interconnect the liquid-cooled element and the manifold pipe, and coupled in parallel to the manifold pipe at a portion of the manifold pipe which corresponds to at least one slot among the plurality of slots.
    Type: Grant
    Filed: October 5, 2017
    Date of Patent: July 2, 2019
    Assignee: FUJITSU LIMITED
    Inventors: Tsuyoshi So, Osamu Aizawa, Keita Hirai, Koji Nakagawa, Yoshinori Uzuka, Nobumitsu Aoki, Naofumi Kosugi
  • Patent number: 10321606
    Abstract: Apparatuses, systems and methods associated with a flexible thermally conductive shunt are disclosed herein. The flexible thermally conductive shunt may include a thermally conductive element, the thermally conductive element being flexible. The flexible thermally conductive shunt may further include a thermally conductive member thermally coupled to the thermally conductive element. The thermally conductive member may include a shell and a cavity. The shell may be sealed to the thermally conductive element, wherein the thermally conductive element extends through a discontinuity of the shell. The cavity may be formed at a center of the thermally conductive member and enclosed by the shell, wherein a first portion of the thermally conductive element extends within the cavity and a second portion of the thermally conductive element extends out of the thermally conductive member via the discontinuity of the shell. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: March 28, 2017
    Date of Patent: June 11, 2019
    Assignee: Intel Corporation
    Inventors: Mark E. Sprenger, Kenan Arik, Michael S. Brazel
  • Patent number: 10309728
    Abstract: Titanium-based thermal ground planes are described. A thermal ground plane in accordance with the present invention comprises a titanium substrate comprising a plurality of pillars, wherein the plurality of Ti pillars can be optionally oxidized to form nanostructured titania coated pillars, and a vapor cavity, in communication with the plurality of titanium pillars, for transporting thermal energy from one region of the thermal ground plane to another region of the thermal ground plane.
    Type: Grant
    Filed: July 22, 2014
    Date of Patent: June 4, 2019
    Assignee: The Regents of the University of California
    Inventors: Noel C. MacDonald, Carl D. Meinhart, Changsong Ding, Payam Bozorgi, Gaurav Soni, Brian D. Piorek
  • Patent number: 10278308
    Abstract: An interlaced heat dissipation structure of an addin card generally includes an addin card, a plurality of heat dissipation fins arranged on the addin card, at least one receiving space defined between the heat dissipation fins, a plurality of cooling pipes extending through the heat dissipation fins, and a plurality of heat dissipative elements arranged in the receiving space in a manner of being interlaced with the cooling pipes. As such, the heat dissipation fins, the cooling pipes, and the heat dissipative elements help cool down the addin card to keep the operation of the addin card stable. The interlaced arrangement of the cooling pipes and the heat dissipative elements in the receiving space defined between the heat dissipation fins makes it possible to maximize the total effective heat dissipation area.
    Type: Grant
    Filed: March 31, 2017
    Date of Patent: April 30, 2019
    Assignee: EVGA CORPORATION
    Inventor: Tai-Sheng Han
  • Patent number: 10267579
    Abstract: A method for improving thermal efficiency of a heating device that reduces an amount of heat flowing out from a heating device 11 to the outside by installing a heat-resistant inorganic conjugated molded product 16 in and along a pathway 15 for heated gas generated from the heating device 11 without interrupting the flow of heated gas passing the pathway 15, heating the inorganic conjugated molded product 16 with the heated gas, and putting radiation heat from the heated inorganic conjugated molded product 16 back into the heating device 11, the inorganic conjugated molded product 16 being provided with an interior layer and an exterior layer, the exterior layer consisting of a coverture for inorganic materials that protects the interior layer from heated gas.
    Type: Grant
    Filed: May 26, 2014
    Date of Patent: April 23, 2019
    Assignee: JAPAN ULTRA-HIGH TEMPERATURE MATERIALS RESEARCH CENTER
    Inventors: Takemi Yamamura, Narihito Nakagawa, Terumi Hisayuki, Motohide Toda, Hironaga Iguchi, Yoshikazu Matsumura, Kiyohito Okamura
  • Patent number: 10252238
    Abstract: An apparatus for producing pulverulent poly(meth)acrylate in a reactor for droplet polymerization having an apparatus for dropletization of a monomer solution for the production of the poly(meth)acrylate having holes through which the monomer solution is introduced, an addition point for a gas above the apparatus for dropletization, at least one gas withdrawal point on the circumference of the reactor and a fluidized bed, and above the gas withdrawal point the reactor has a region having a constant hydraulic internal diameter and below the gas withdrawal point the reactor has a hydraulic internal diameter that steadily decreases. The reactor has a heating means in the region having a steadily decreasing hydraulic internal diameter.
    Type: Grant
    Filed: February 25, 2016
    Date of Patent: April 9, 2019
    Assignee: BASF SE
    Inventors: Robert Bayer, Jürgen Freiberg, Rudolf Schliwa, Marco Krüger
  • Patent number: 10256688
    Abstract: An electric machine having a rotor, stator and housing. The rotor includes a radially mounted array of permanent magnets and the stator includes a plurality of electromagnets radially positioned around the rotor. The machine includes a fluid circuit consisting of first and second cavities enclosed by the stator and positioned between the rotor and housing. The fluid circuit also includes an air gap between the stator and rotor and a plurality of ventilation channels extending through the rotor. The air gap and ventilation channels are in fluid communication with the first and second cavities. The rotor also includes an internal fan extending into the first or second cavity. When the rotor is caused to rotate with respect to the stator, the fan causes air or another fluid to circulate through the fluid circuit to cool the rotor.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: April 9, 2019
    Assignee: ZERO E TECHNOLOGIES, LLC
    Inventors: Thomas H. Hopkins, Felipe J. Castillo, Scott T. Graham, Keith W. Klontz
  • Patent number: 10247488
    Abstract: A heat dissipation device includes a substrate and at least one heat pipe, which is pressed to tightly fit in a receiving groove defined by the substrate to make two opposite lateral sides of the heat pipe tightly respectively in contact with two opposite inner sides of the receiving groove to tightly connect the substrate to the heat pipe to solve the problem existing in the conventional heat dissipation device of a poor levelness of the receiving groove on a top and a bottom side of the substrate, so as to have reduced manufacturing costs and provide uniform temperature effect.
    Type: Grant
    Filed: September 17, 2015
    Date of Patent: April 2, 2019
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Sheng-Huang Lin, Yuan-Yi Lin
  • Patent number: 10239033
    Abstract: A reactor system (1) having a reactor 3, at least one cooler (5) connected to the reactor (3), at least one pump (7) for circulating at least some of a liquid heat-transfer medium (9), wherein the pump (7) is connected to the reactor (3) and/or the at least one cooler (5), and a container (11) for collecting the liquid heat-transfer medium (9) is provided. The container (11) is connected to the reactor (3) and/or the at least one cooler (5) and is disposed substantially below the reactor (3) and/or the at least one cooler (5). Also provided are exothermic reactions which are conducted in the reactor system.
    Type: Grant
    Filed: March 17, 2015
    Date of Patent: March 26, 2019
    Assignee: BASF SE
    Inventors: Ulrich Hammon, Thomas Walter
  • Patent number: 10240873
    Abstract: A joint assembly of vapor chambers connects the vapor chambers to effectuate joint operation thereof. For example, two paired vapor chambers are connected therebetween by a capillary pipe and a gas pipe. The capillary pipe is filled with a third wick which connects with a first wick and a second wick in the two vapor chambers. The two vapor chambers are in spatial communication with each other because of the gas pipe. A working fluid in the two vapor chambers is transferred between the first, second and third wicks by capillarity. The gas-phase working fluid moves between the two vapor chambers via the gas pipe, thereby allowing the two vapor chambers to operate jointly.
    Type: Grant
    Filed: September 20, 2017
    Date of Patent: March 26, 2019
    Assignee: TAI-SOL ELECTRONICS CO., LTD.
    Inventors: Chuan-Chi Tseng, Wen-Ching Liao, Ming-Quan Cui
  • Patent number: 10228194
    Abstract: An airtight structure includes a first plate, a second plate, a wick structure mounted between the first plate and the second plate. A middle portion of the second plate forms a cup portion. The cup portion and the first plate together define a cavity. The wick structure is received in the cavity. A portion of the first plate extends upwardly to form a first extending portion. The first extending portion is a hollow cylinder. A portion adjacent to an end of the second plate forms a through hole corresponding to the first extending portion. The first extending portion extends through the through hole, an inner surface of the through hole contacts the first extending portion.
    Type: Grant
    Filed: May 25, 2017
    Date of Patent: March 12, 2019
    Assignee: CHAMP TECH OPTICAL (FOSHAN) CORPORATION
    Inventors: Xiao-Yu Zhao, Chi-Yuan Lai, Meng Fu
  • Patent number: 10224261
    Abstract: An electronic component mounting structure includes a terminal of an electronic component package and a chip heat radiating member. The terminal is soldered on a land of an electronic substrate and the chip heat radiating member is soldered on a back surface of the electronic component package. The chip heat radiating member is covered by a packaging resin. A metallic heat radiating pattern integrally includes a pattern extension part that protrudes from the electronic component package, such that at least a part of the metallic heat radiating pattern is formed so as to be larger than the electronic component package. The pattern extension part is configured to guide excessive solder to an outside of the electronic component package.
    Type: Grant
    Filed: September 4, 2015
    Date of Patent: March 5, 2019
    Assignee: CALSONIC KANSEI CORPORATION
    Inventors: Hideki Sunaga, Yuuzou Shimamura, Norio Fujii, Yuuji Daimon
  • Patent number: 10222125
    Abstract: An apparatus for cooling an electronic component has a planar top member of a thermal energy conductive material and a parallel planar bottom member of the material, the planar bottom member including a surface having regions configured for heat exchange contact with the electronic component. The planar top member has a plurality of stamped indent formations at a plurality of locations, each indent formation providing a contact surface such that the planar top member is affixed to the bottom member by braze or solder at each contact surface. Alternatively, the planar bottom member also has a plurality of stamped indent formations in alignment with indent formations of the top member. The planar top member is affixed to the bottom member by brazing or soldering each respective contact surface of an indent formation of the planar top member to an opposing contact surface of a corresponding indent formation of the parallel planar bottom member.
    Type: Grant
    Filed: August 4, 2015
    Date of Patent: March 5, 2019
    Assignee: International Business Machines Corporation
    Inventors: Paul W. Coteus, Shawn A. Hall, Mark D. Schultz, Todd E. Takken, Shurong Tian
  • Patent number: 10215500
    Abstract: Semiconductor device assemblies having stacked semiconductor dies and thermal transfer devices that include vapor chambers are disclosed herein. In one embodiment, a semiconductor device assembly includes a first semiconductor die, a second semiconductor die at a base region of the first die, and a thermal transfer device attached to a peripheral region of the first die and extending over the second die. The thermal transfer device includes a conductive structure having an internal cavity and a working fluid at least partially filling the cavity. The conductive structure further includes first and second fluid conversion regions adjacent the cavity. The first fluid conversion region transfers heat from at least the peripheral region of the first die to a volume of the working fluid to vaporize the volume in the cavity, and the second fluid conversion region condenses the volume of the working fluid in the cavity after it has been vaporized.
    Type: Grant
    Filed: May 22, 2015
    Date of Patent: February 26, 2019
    Assignee: Micron Technology, Inc.
    Inventors: Steven K. Groothuis, Jian Li
  • Patent number: 10219365
    Abstract: A circuit card assembly includes a circuit card, a plurality of components disposed on a first surface of the circuit card in a shadow arrangement, and a plurality of air-cooled heat sink structures disposed on each of the components. Each of the plurality of heat sink structures comprises a plurality of impedance zones arranged in series substantially perpendicular to the airflow path, where the plurality of impedance zones comprise a first impedance zone having a first air impedance, and a second impedance zone having a second air impedance less than the first air impedance. Further, the plurality of zones in the plurality of heat sink structures are aligned so that the first impedance zone in one of the plurality of heat sink structures does not overlap with the first impedance zone in another of the plurality of heat sink structures, relative to the airflow path.
    Type: Grant
    Filed: February 23, 2018
    Date of Patent: February 26, 2019
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chao-Jung Chen, Yi-Chieh Chen, Ming-Hung Tsai, Jen-Mao Chen
  • Patent number: 10212862
    Abstract: This invention relates to a cooling apparatus comprising a base plate, an evaporator and a condenser. In order to obtain a simple and efficient cooling apparatus the evaporator is a porous aluminum evaporator having a capillary structure with pores and a plurality of larger sized evaporator channels extending through the evaporator between a second end and the first end of the evaporator. A compensation chamber extending along a second surface of the evaporator receives first fluid from the condenser such that pores opening up into the second surface of the evaporator are provided with first fluid.
    Type: Grant
    Filed: June 28, 2016
    Date of Patent: February 19, 2019
    Assignee: ABB Schweiz AG
    Inventors: Bruno Agostini, Daniele Torresin, Francesco Agostini, Gernot Riedel, Mathieu Habert
  • Patent number: 10184730
    Abstract: A phase change cell includes a housing enclosing a phase change chamber that holds a phase change material and a gas pocket. The housing includes a side wall extending between first and second end walls. A capillary is disposed in an interior surface of the side wall. In response to heating of the phase change cell, the capillary is configured to draw the phase change material in a liquid phase towards the periphery of the phase change chamber. A temperature sensor is coupled to the housing in a vicinity of the capillary to measure the phase change temperature. According to another aspect, the housing includes a moveable surface that bounds a portion of the phase change chamber. The phase change temperature of the phase change material changes based on the position of the moveable wall.
    Type: Grant
    Filed: August 17, 2016
    Date of Patent: January 22, 2019
    Assignee: Harris Corporation
    Inventors: Rachele B. Cocks, Robert E. Kartman, Blaine L. Hershberger, James A. Isca
  • Patent number: 10184733
    Abstract: A heat exchanger includes: a first flow passage where first liquid flows; a second flow passage where second liquid flows; and a heat exchanger main body configured to exchange heat between the first liquid and the second liquid. The heat exchanger main body includes a cross-sectional area adjuster configured to change a flow passage cross-sectional area of at least one of the first flow passage and the second flow passage by thermal deformation. The cross-sectional area adjuster adjusts a value of the flow passage cross-sectional area in a low temperature range to be larger than a value of the flow passage cross-sectional area in a high temperature range.
    Type: Grant
    Filed: December 27, 2015
    Date of Patent: January 22, 2019
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Satoshi Tominaga, Daisuke Tokozakura, Takahiro Shiina, Kazuya Arakawa, Hitoshi Takayama, Keisuke Ichige, Masanori Iritani
  • Patent number: 10183806
    Abstract: A telemetric digital thermometer for use with a fluid transport container having internal and external shells. The telemetric digital thermometer includes a mount having a peripheral flange and a support collar, with the peripheral flange being connectable to the external shell. A temperature sensor sense a temperature of the internal shell. A thermometer insert may include an outer collar engageable with the peripheral flange, and an inner body engageable with the support collar. A GPS module may detect position of the thermometer insert. A wireless transceiver may transmit a signal including temperature data and position data. The thermometer insert and the mount may be collectively sized and structured such that the GPS module and the wireless transceiver are positioned radially outward of the external shell when the thermometer insert is connected to the mount and the mount is connected to the external shell.
    Type: Grant
    Filed: October 19, 2017
    Date of Patent: January 22, 2019
    Assignee: Anytrek Corporation
    Inventor: Haijian Zeng
  • Patent number: 10182517
    Abstract: A vapor pipe 103 connects a heat dissipation portion 200 and each of a plurality of heat receiving portions 102. A liquid pipe 104 connects the heat dissipation portion 200 and each of a plurality of the heat receiving portions 102. A bypass pipe 105 connects the vapor pipe 103 and the liquid pipe 104. A valve 106 opens and closes a flow path of the bypass pipe 105. A first connection portion 107 connects the vapor pipe 103 and the bypass pipe 105. A second connection portion 108 connects the liquid pipe 103 and the bypass pipe 105. The first connection portion 107 is disposed at a position higher than that of the second connection portion 108. As a result, refrigerant can be efficiently transported in a short time.
    Type: Grant
    Filed: November 14, 2014
    Date of Patent: January 15, 2019
    Assignee: NEC Corporation
    Inventors: Minoru Yoshikawa, Kenichi Inaba, Masanori Sato, Akira Shoujiguchi, Arihiro Matsunaga, Masaki Chiba
  • Patent number: 10168104
    Abstract: A filling pipe for use in high-temperature heat pipe filling operation includes an alkali metal filling unit, metallic pipe fixing unit, hermetic seal cover and stopping net. The alkali metal filling unit has a filling body, a receiving space disposed in the filling body. A feed inlet and a feeding pipe are disposed at the top and bottom of the filling body, respectively. A vacuum-generating component is disposed at the filling body laterally. The metallic pipe fixing unit has a fixing body and a taper opening disposed thereon and adapted to limit the metallic pipe. When the fixing body gets connected to the filling body, the feeding pipe is inserted into metallic pipe. The hermetic seal cover covers separably the feed inlet. The stopping net is movably disposed in the receiving space. Therefore, solid alkali metals are filled into a metallic pipe easily and safely.
    Type: Grant
    Filed: June 24, 2016
    Date of Patent: January 1, 2019
    Assignee: TAMKANG UNIVERSITY
    Inventors: Shung-Wen Kang, Kun-Cheng Chien
  • Patent number: 10158272
    Abstract: An electric machine includes a housing having an air inlet opening near a front or rear end of the housing for aspirating air, and an air outlet opening for expelling air. The housing accommodates a stator, and a rotor is mounted in the housing for rotation about an axis of rotation. Mounted on a side of the housing in parallel relation to the axis of rotation is a hood-like attachment to cover the air inlet and outlet openings so that air expelled from the housing through the air outlet opening is fed back to the air inlet opening. Disposed in the stator are pipes for flow of a liquid cooling medium to directly cool the stator during operation. At least some of the pipes project beyond the stator toward the front and rear ends, so that during operation heat is removed by the pipes from air flowing in the housing.
    Type: Grant
    Filed: November 27, 2013
    Date of Patent: December 18, 2018
    Assignee: Siemens Aktiengesellschaft
    Inventors: Felix Noack, Martin Sindelka, Sebastian Weiss
  • Patent number: 10145619
    Abstract: A heat pipe is disclosed in the present invention. The heat pipe includes a first pipe and at least a second pipe. The first pipe is formed with an enclosed space. The second pipe is disposed in the enclosed space. There is no wick structure disposed between the first pipe and the second pipe.
    Type: Grant
    Filed: October 13, 2017
    Date of Patent: December 4, 2018
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Shih-Lin Huang, Chiu-Kung Chen, Sien Wu, Ti-Jun Wang
  • Patent number: 10145628
    Abstract: A heat dissipation device includes a first casing, a second casing, a thin pump, and a cooling member. The second casing is connected to the first casing to form a first accommodating space and a second accommodating space adjacent to and communicating with the first accommodating space. The thin pump is disposed in the first accommodating space. The cooling member is disposed in the second accommodating space and has a plurality of spacers, and the spacers and the thin pump are disposed on the same plane of the first casing. A portable electronic device having the heat dissipation device is also disclosed.
    Type: Grant
    Filed: April 8, 2016
    Date of Patent: December 4, 2018
    Assignee: DELTA ELECTRONICS, INC.
    Inventor: Chao-Wen Lu
  • Patent number: 10121726
    Abstract: Embodiments of the present disclosure relate to a cooler for semiconductor devices. The semiconductor device may be electrically coupleable to a power source. The device may generate heat when the power source supplies power to the device during use of the device. The cooler may be coupled to one or more surfaces of the device. The cooler may include a hydrophilic material to adsorb water from ambient air. During operation of the device, the cooler may cool the device by conduction of heat away from the device to the cooler. The cooler may include water that is evaporated during use of the device to increase cooling capacity of the cooler. The cooler may be recharged with water from humidity in air when the device is not operated or operated at a lower power level. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: August 28, 2015
    Date of Patent: November 6, 2018
    Assignee: INTEL IP CORPORATION
    Inventors: Sven Albers, Klaus Reingruber, Andreas Wolter, Georg Seidemann, Christian Geissler, Alexandra Atzesdorfer, Sonja Koller
  • Patent number: 10119766
    Abstract: A heat dissipation device includes a housing and a heat pipe. The heat pipe has an open end, which is inserted into an opening on a top side of the housing, such that a heat pipe chamber of the heat pipe is communicated with a housing chamber of the housing and an extended portion extended from the open end of the heat pipe is pressed against a bottom side of the housing, as well as a heat pipe wick structure of the heat pipe is connected to a housing wick structure of the housing, so as to increase heat transfer effect.
    Type: Grant
    Filed: December 1, 2015
    Date of Patent: November 6, 2018
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Yu-Min Lin, Wen-Ji Lan
  • Patent number: 10094584
    Abstract: A discrete air conditioner controller for controlling a discrete air conditioner unit servicing a building may receive an IR code, in some cases in a raw waveform format, from a handheld remote control that is associated with the discrete air conditioner unit during a programming process. The discrete air conditioner controller may associate the IR code with the discrete air conditioner unit and store the IR code and its association in memory. In some cases, the discrete air conditioner controller may transmit the IR code and its association to a central coordinator, where the IR code may be stored in the memory of the central coordinator. The IR code may be subsequently retrieved from the memory of the central coordinator and transmitted to selected discrete air conditioner controller units for use in controlling appropriate discrete air conditioner units.
    Type: Grant
    Filed: February 1, 2016
    Date of Patent: October 9, 2018
    Assignee: Honeywell International Inc.
    Inventors: Karthick Dasu Rajan, Raman Subramaniam, Channabasappa Gunari, Mohit Jain, Rana Bhattacharya, Balaji Sundaravadivelu, Balakrishna Gudi
  • Patent number: 10088186
    Abstract: A building control system includes a central coordinator and one or more discrete air conditioner controllers configured to communicate with one or more discrete air conditioner units servicing the building. In some instances, a discrete air conditioner controller may be configured to transition between a sleep mode and an active mode. The discrete air conditioner controller may also be configured to transmit over a mesh network in the active mode and to not transmit over the mesh network in the sleep mode. The discrete air conditioner controller may be configured to transition between the sleep mode and the active mode according to a schedule dictated by the central coordinator. Alternatively, or in addition, the discrete air conditioner controller may be configured to transition between the sleep and active modes in accordance with a beacon signal received from the central coordinator.
    Type: Grant
    Filed: February 1, 2016
    Date of Patent: October 2, 2018
    Assignee: Honeywell International Inc.
    Inventors: Sharath Babu Malve, Arun Vijayakumari Mahasenan, Guhapriyan Thanikachalam
  • Patent number: 10082851
    Abstract: A cooling apparatus includes an assembly including an electronic device and a potting material that covers a side portion and an upper portion of the electronic device, the assembly having a conical upper portion, and a cooling plate including a conical hole, into which the upper portion of the assembly is fitted, and a flow path, through which a coolant flows.
    Type: Grant
    Filed: July 12, 2017
    Date of Patent: September 25, 2018
    Assignee: FUJITSU LIMITED
    Inventors: Koichi Onodera, Naofumi Kosugi
  • Patent number: 10077945
    Abstract: A heat dissipation device includes a first and a second housing, at least one pipe, and a working fluid. The first and the second housing internally respectively defines a first and a second chamber, in which a first and a second wick structure is respectively formed, and has at least one first and second opening communicated with the first and the second chamber respectively. The pipe has a pipe body, and a first and second extended portion, which respectively has a first and a second open end, and a first and a second through opening, and is inserted into and connected to the first and the second chamber via the first and the second opening respectively. The pipe internally defines a pipe chamber, in which a pipe wick structure is formed. The working fluid is provided in the first and the second, and the pipe chamber.
    Type: Grant
    Filed: May 27, 2016
    Date of Patent: September 18, 2018
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventor: Wen-Ji Lan
  • Patent number: 10076065
    Abstract: A liquid cooling system for a server includes a heat pipe and a displacement appendage fluidly coupled to the heat pipe. The displacement appendage includes a displacement element which is compressible under pressure.
    Type: Grant
    Filed: January 4, 2017
    Date of Patent: September 11, 2018
    Assignee: DELL PRODUCTS, LP
    Inventors: Chin-An Huang, Austin M. Shelnutt, Chia-Chuan Yu
  • Patent number: 10073500
    Abstract: Techniques of managing heat within an electronic device involve providing a vapor chamber in a ring shape within an electronic device. In some implementations, the vapor chamber forms an outer case wall of an enclosure of the electronic device. In further implementations, the vapor chamber has a fill port attached to the inner edge of the vapor chamber. Advantageously, by using a vapor chamber with a ring geometry in an electronic device according to the improved techniques, a form factor of the electronic device (e.g., a laptop, a tablet, etc.) is not affected by the introduction of the vapor chamber as an outer case wall.
    Type: Grant
    Filed: October 4, 2016
    Date of Patent: September 11, 2018
    Assignee: GOOGLE LLC
    Inventors: William Riis Hamburgen, Joshua Norman Lilje, James Cooper
  • Patent number: 10018427
    Abstract: A vapor chamber structure includes an upper metal casing, a lower metal casing, a partition plate and a working fluid. The lower metal casing is engaged and sealed with the upper metal casing, and a containing chamber is formed between the upper metal casing and the lower metal casing. The partition plate is laid inside the containing chamber and includes a gas channel configured to be facing the upper metal casing. The working fluid is filled in the containing chamber. Therefore, the gas evaporated in the vapor chamber will move along a fixed path to prevent the occurrence of turbulence effectively.
    Type: Grant
    Filed: September 8, 2016
    Date of Patent: July 10, 2018
    Assignee: TAIWAN MICROLOOPS CORP.
    Inventor: Chun-Hung Lin
  • Patent number: 9982867
    Abstract: A wavelength converting member includes a sealed housing which is at least partially light transmissive, a coolant enclosed in the sealed housing, a cooling part provided on a part of an external surface of the sealed housing, and a channel having a plurality of micro-passages allowing a liquid coolant flowing therein. At least a portion of the micro-passages are formed by gaps between particles, and phosphor particles are contained in the particles.
    Type: Grant
    Filed: May 27, 2016
    Date of Patent: May 29, 2018
    Assignee: NICHIA CORPORATION
    Inventor: Tadaaki Miyata
  • Patent number: 9983466
    Abstract: A cooling device includes a duct with one opened end and another opened end; a fan disposed inside the duct, the fan being configured to send air present inside the duct in an air-sending direction; a heat sink disposed outside the duct, the heat sink including a base part having an opposed surface opposed to a mouth of the another end of the duct, and heat-sink fins including a plurality of thin plates extending from the opposed surface along the air-sending direction; a heat source in contact with the base part; a heat pipe connected to the heat source or the heat sink; and heat-pipe fins disposed between the fan and the one end of the duct inside the duct, the heat-pipe fins including a plurality of thin plates extending from the heat pipe along the air-sending direction.
    Type: Grant
    Filed: March 9, 2017
    Date of Patent: May 29, 2018
    Assignee: JVC KENWOOD Corporation
    Inventor: Mitsuharu Fukuda
  • Patent number: 9975415
    Abstract: Various methods and systems are provided for an electric motor arrangement in a chassis of a battery electric vehicle. In one embodiment, a front chassis for a battery electric vehicle comprises a structural frame including two parallel sidewalls and a first portion of a vehicle articulation joint and an electric motor coupled between and in face-sharing contact with each of the two parallel sidewalls.
    Type: Grant
    Filed: February 16, 2016
    Date of Patent: May 22, 2018
    Assignee: General Electric Company
    Inventors: Patrick Lee Jansen, Gregory Benton Badders, Paul Deahl
  • Patent number: 9974208
    Abstract: Pool boiling systems, cooling systems configured to cool one or more heat generating portions of a vehicle, and methods of maintaining a functional orientation of a pool boiling unit are disclosed. A pool boiling system may include the pool boiling unit and a stabilizing unit coupled to the pool boiling unit. The stabilizing unit maintains the pool boiling unit in a functional orientation across a plurality of operating orientations of the pool boiling system.
    Type: Grant
    Filed: March 24, 2015
    Date of Patent: May 15, 2018
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Shailesh N. Joshi, Ercan Mehmet Dede
  • Patent number: 9958213
    Abstract: The invention relates to a heat exchanger comprising a base plate for receiving a heat load from one or more electric components, an evaporator being in thermal contact with a surface of the base plate for transferring said heat load into a first fluid in the evaporator channels, and a condenser dissipating heat from the first fluid. In order to provide an efficient heat exchanger the heat exchanger comprises a collector space receiving first fluid from the condenser, and the collector space which is located higher than the lower ends of the evaporator channels is in fluid communication with lower ends of the evaporator channels for passing first fluid received from the condenser to the lower ends of the evaporator channels.
    Type: Grant
    Filed: July 7, 2016
    Date of Patent: May 1, 2018
    Assignee: ABB Schweiz AG
    Inventors: Bruno Agostini, Daniele Torresin, Francesco Agostini, Mathieu Habert
  • Patent number: 9939204
    Abstract: In a heat spreading module, a plurality of hollow paths is formed in a thin plate-shaped main body so as to pass though the heating portion, and the hollow paths communicate with each other in a heating portion, a working fluid is enclosed in the hollow paths, a wick is disposed in each of the hollow paths such that a vapor flow path in which vapor of the working fluid flows is formed in each of the hollow paths, a part of each wick is positioned at the heating portion, and the vapor flow paths formed in the hollow paths communicate with each other in the heating portion.
    Type: Grant
    Filed: May 26, 2016
    Date of Patent: April 10, 2018
    Assignee: FUJIKURA LTD.
    Inventors: Thanhlong Phan, Youji Kawahara, Yuichi Yokoyama, Yuji Saito, Mohammad Shahed Ahamed, Koichi Mashiko
  • Patent number: 9930806
    Abstract: Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.
    Type: Grant
    Filed: November 21, 2013
    Date of Patent: March 27, 2018
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Timothy J. Chainer, David P. Graybill, Madhusudan K. Iyengar, Vinod Kamath, Bejoy J. Kochuparambil, Roger R. Schmidt, Mark E. Steinke
  • Patent number: 9926919
    Abstract: A cryopump has a simple-to-manufacture frontal baffle plate with improved gas distribution and has a large-area second-stage array plate to capture Type II gases. The cryopump has a first-stage frontal baffle plate having orifices and flaps bent from and attached to the orifices. The cryopump has a second-stage top plate that is larger in area than cooling baffles of the second stage array.
    Type: Grant
    Filed: February 1, 2016
    Date of Patent: March 27, 2018
    Assignee: Brooks Automation, Inc.
    Inventors: Sergei Syssoev, Allen J. Bartlett, John J. Casello, Jeffrey A. Wells, Michael J. Eacobacci, Jr.
  • Patent number: 9920963
    Abstract: The invention presents air-conditioning system with chiller that provides, when operated in the cooling mode, cooling hardware for conditioning space and a heat exchanger for cooling and dehumidification of ambient air in supply air stream with cold liquid. In addition, the invention offers a method and design of a heat utilization system. The method incorporates refrigeration cycle with two consecutive expansions, two expansion devices, and a heat exchanger operating as a second condenser. The method can be used for air conditioners and chillers reheating over-chilled for dehumidification indoor and supply air. The method and design allow energy efficient heat utilization with variable amount of utilized heat.
    Type: Grant
    Filed: January 12, 2017
    Date of Patent: March 20, 2018
    Inventors: Alexander P Rafalovich, Vladimir G Bulygin
  • Patent number: 9921621
    Abstract: An electronic apparatus having a detachable cooling device is disclosed. The electronic apparatus includes a portable information device having a heating body contained therein. The portable information device also includes a heat sink disposed on a bottom surface of the portable information device and thermally connected to the heating body. The detachable cooling device includes a mount surface on which the bottom surface of the portable information device is mounted, a heat-receiving heat sink disposed on the mount surface and thermally connected to the heat sink, and an up-and-down mechanism that moves the heat-receiving heat sink towards the heat sink and causes the heat-receiving heat sink to contact the heat sink when the portable information device is mounted on the mount surface.
    Type: Grant
    Filed: December 7, 2016
    Date of Patent: March 20, 2018
    Assignee: LENOVO (SINGAPORE) PTE LTD
    Inventors: Yoshiyuki Shibayama, Hiroaki Agata, Eiji Shinohara
  • Patent number: 9915483
    Abstract: A small-sized fluid heating/cooling apparatus for heating or cooling a large amount of gas or liquid at a low cost. Structures where a flow passage for a fluid is formed in a heated or cooled base formed in a plate shape or a column shape, and a fluid which has passed through the narrowed flow passage impinges on a wall of a side face of the base vertically to perform heat exchange are connected in series. Heat exchange is instantaneously performed in a small space and manufacture of a mechanism performing such an operation is easy. A material constituting the flow passage may be a metal or ceramics, and a small-sized fluid heat exchanging apparatus can be manufactured at a low cost.
    Type: Grant
    Filed: December 11, 2014
    Date of Patent: March 13, 2018
    Assignee: PHILTECH, INC.
    Inventors: Yuji Furumura, Naomi Mura, Shinji Nishihara, Noriyoshi Shimizu