Abstract: According to an embodiment, a wick structure of a heat pipe that is capable of bending while increasing a heat transferring operation limit value is provided by improving the wick structure provided inside the heat pipe.

Abstract: A thermoelectric power generation device including a thermoelectric element having a first side provided to a heating unit and a second side provided to a cooling unit, and a heat transfer pipe arranged in a passage in which a high temperature fluid flows. The heating unit and the heat transfer pipe have internal spaces communicating with each other. The internal space of the heating unit and the internal space of the heat transfer pipe form a circulation path in which a heat medium is circulated. An outlet of the heat transfer pipe from which the heat medium is discharged is provided in a position higher than an inlet of the heat transfer pipe into which the heat medium flows. The heat transfer pipe vaporizes the heat medium flowing in the circulation path by using heat of the high temperature fluid. The heating unit condenses the heat medium vaporized.

Abstract: The present invention discloses a flat heat pipe, comprising a bottom plate, a top plate, and a support plate located between the bottom plate and the top plate; a micron-level radial strip is processed on the inner surface of the bottom plate; the inner surface of the top plate is processed with superhydrophilic and superhydrophobic radial structures arranged at intervals to transport the condensate to the direction of the surrounding pipe wall; a wick is arranged on the inner side of the support plate. The present invention has the function of pumpless directional transport of liquid and convergence of refluxed condensate; thereby improving the heat exchange performance of the entire flat heat pipe.

Abstract: A heat dissipation unit includes a main body having a first and a second plate member, which are closed to each other to together define an airtight chamber in between them. A working fluid is filled in the airtight chamber. A first wick structure layer and a holding-down member are provided between the first and the second plate member and received in the airtight chamber. The holding-down member is located above the first wick structure layer, such that the first wick structure layer is held down by the holding-down member to be closely and flatly attached to the second plate member without warping.

Abstract: A thermal transfer panel is provided for transferring thermal energy to or from an ambient environment. The thermal transfer panel includes a thermal radiating plate having a plurality of spaced elongate tabs and a thermal insulating plate having a plurality of elongate grooves. The thermal transfer panel is coupled to the thermal insulating plate to form a fluid flow channel. The tabs can include a plurality of apertures, wherein the thermal insulating plate is coupled to the thermal radiating plate, by a bonding agent or a portion of the thermal insulating plate being flowed into the apertures of the tabs so as to retain the thermal insulating plate relative to the thermal radiating plate. Couplers are provided for connecting the thermal transfer panels by fluidly connecting the fluid flow channels of one thermal transfer panel to the fluid flow channels of another thermal transfer panel, or a manifold, or a fluid distribution system.

Abstract: A lighting fixture has an extruded aluminum housing, at least one light source mechanically supported by the extruded aluminum housing, and at least one copper pipe thermally coupled to the extruded aluminum housing to carry a fluid coolant. During operation of the lighting fixture, the fluid coolant flowing through the at least one copper pipe extracts heat generated by the lighting fixture, and the fluid coolant does not contact the extruded aluminum housing. In one example, a copper fluid coolant circuit is thermally coupled to the housing to contain the fluid coolant, and the lighting fixture does not contain any internal seals or internal O-rings for the fluid coolant.

Abstract: A power module is provided and includes first stack, second stack, and third stacks of layers, a heat pipe, and at least one cold plate or heat sink. The third stack of layers is disposed between the first and second stacks of layers and includes a first semiconductor die, a second semiconductor die and a center spacer layer disposed between the first semiconductor die and the second semiconductor die. The heat pipe extends at least partially into the center spacer layer. The at least one cold plate or heat sink receives thermal energy from the first stack of layers and the second stack of layers. The first stack of layers, the second stack of layers, the third stack of layers, the heat pipe and the at least one cold plate or heat sink facilitate dual sided cooling of each of the first semiconductor die and the second semiconductor die.

Abstract: An apparatus with a housing having a structure for heat dissipation is provided. The apparatus includes the housing having at least one surface, outer walls, and a plurality of fins, and an operating unit fixed to the housing, wherein the at least one surface of the housing includes a fin cover connected to the fins, a base exposed in an internal space in which the operating unit is disposed, and a refrigerant filled in a space between the fin cover and the base, wherein the fin cover and the base are connected through the outer walls, and wherein the fin cover has a flat surface.

Abstract: Provided is a heat pipe which is installed in a cold region in a bottom heat posture in which a longitudinal direction of a container is substantially in parallel with a gravitational direction, is capable of preventing the container from deforming even when a working fluid has become frozen, and has excellent heat transport properties.

Abstract: A computing rack apparatus which reduces the manufacturing cost by simplifying the structure thereof and in which the temperature of the internal air is utilized in the cooling unit is disclosed. The apparatus comprises: a rack housing which houses a server, a rack frame which is disposed inside the rack housing and on which the server is fastened and mounted; and a cooling unit which has a discharge port which is disposed inside the rack housing and discharges cooling air and a suction port which sucks the internal air through a cooling zone, wherein the discharge port is located in a first region with respect to a boundary portion defined by a front surface of the server, and the suction port is located in a second region with respect to the boundary portion, and the first and second regions form the cooling zone.

Abstract: A heat conduction device with an inner loop includes a vapor chamber having at least one hole edge and a heat pipe having an outer pipe and an inner pipe. The outer pipe has a closed end and an open end communicating with the hole edge. Two ends of the inner pipe are open. The inner pipe has one end communicating with the vapor chamber through the hole edge and the other end extended along the axial direction of the outer pipe to form at least one port for communicating the closed end of the outer pipe with the inner pipe. The inner pipe is located inside the outer pipe to form a gap annularly. The port communicates with the gap, so that the inner loop is formed between the vapor chamber and the heat pipe.

Abstract: A pumpless liquid-cooling heat dissipator includes a cooling head assembly and a condensing assembly. The cooling head assembly and the condensing assembly are connected through the connecting assembly to form a loop. The cooling head assembly and the condensing assembly both are filled with a liquid refrigerant. The use of refrigerant as a cooling medium is more effective compared with the water cooling, has better overall heat dissipation, and can overcome disadvantages of complex wiring of the water-cooling heat dissipator and poor heat dissipation of the heat pipe, and thus can quickly cool down the temperature of component. Compared with the existing water-cooling heat dissipator, the structure is simpler, the circulating cooling can be realized without mechanical drive e.g., water pump, and there is no extension of excess water pipe, which is more convenient for installation and makes the computer case cleaner.

Abstract: A three-dimensional heat exchanger including first thermally conductive plate, second thermally conductive plate, a plurality of supporting structures, at least one thermally conductive structure, at least one capillary structure and at least one heat pipe. Second thermally conductive plate has at least one through hole. Second thermally conductive plate is attached to first thermally conductive plate so that liquid-tight chamber is formed between first and second thermally conductive plate. An end of each of supporting structures is connected to first thermally conductive plate. Another end of each of supporting structures is connected to second thermally conductive plate. Thermally conductive structure is connected to at least a part of supporting structures. Capillary structure is stacked on first thermally conductive plate, at least a part of supporting structures, and thermally conductive structure. Heat pipe is disposed through the through hole.

Abstract: A cooling device has a heat receiving unit that has a space therein, liquid phase piping that supplies liquid phase refrigerant to the heat receiving unit, gas phase piping that discharges gas phase refrigerant from the heat receiving unit, and spacers that are disposed inside the heat receiving unit. The spacers have a higher specific gravity than the liquid phase refrigerant. The spacers have a shape allowing movement along the bottom face of the heat receiving unit. When the heat receiving unit tilts, the spacers move to the low side of the heat receiving unit. The spacers gather on the bottom face of the heat receiving unit on the low side. The liquid phase refrigerant spreads to the high side of the heat receiving unit by an amount equivalent to the volume removed due to the spacers, and uniform cooling can be performed.

Abstract: A heat dissipation device includes a body including a first metal sheet and a second metal sheet coupled to the first metal sheet. The first metal sheet at least partially defines a first channel including a first plurality of curves, a second channel including a second plurality of curves, and an interconnecting channel fluidly coupled to the first channel and the second channel. The first channel and the interconnecting channel at least partially surround the second channel, a unit volume of the first channel is a same as a unit volume of the interconnecting channel, and the unit volumes of the first channel and the interconnecting channel are different from a unit volume of the second channel.

Abstract: The present invention provides a stack-type vertical heat dissipation device comprising an evaporator unit and a condenser unit. The evaporator unit has a side configured for direct or indirect contact with, and thereby receiving heat from, a high-temperature device in order for the heat to convert a heat conduction medium inside the evaporator unit into a gaseous state. The condenser unit is stacked on a top side of a housing of the evaporator unit, and is provided therein with a flow channel that is in communication with the evaporator unit and allows passage of the heat conduction medium so that the heat conduction medium is able to return to the evaporator unit under a force of gravity after condensing from the gaseous state into a liquid state and thereby complete a thermal cycle.

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a hybrid thermal management system. The hybrid thermal management system can include a heat source, an air mover, a heat sink coupled to the air mover, a thermal electric cooling device (TEC), and a heat pipe. The heat pipe can couple the heat source to the heat sink and to the TEC and transfer heat from the heat source to the heat sink and to the TEC.

Abstract: A refrigerator includes a main body defining a storage space, a cryogenic freezing compartment having an insulation space that is independent with respect to the storage space, an evaporator disposed inside the storage space to cool the storage space, and a thermoelectric module assembly disposed at one side of the cryogenic freezing compartment so that the cryogenic freezing compartment is cooled to a temperature less than that of the storage space. The thermoelectric module assembly includes a thermoelectric module, a cold sink coming into contact with a heat absorption surface of the thermoelectric module and disposed in the cryogenic freezing compartment, and a heat sink coming into contact with a heat generation surface of the thermoelectric module. The heat sink is cooled by introducing a refrigerant supplied to the evaporator.

Abstract: A partition member has a thickness direction and a surface direction perpendicular to the thickness direction, and which separates single cells that make up an assembled battery in the thickness direction, or a single cell that makes up the assembled battery in the thickness direction and a member other than the single cells. The partition member includes, in the interior thereof, a fluid having a boiling point at normal pressure of 80° C. to 250° C., and a flow channel of the fluid extending along the surface direction. The fluid is held in a fluid holding part, and the fluid holding part is hermetically sealed by a packaging material.

Abstract: A liquid-cooling radiator module includes a first reservoir, a second reservoir, a heat dissipation stacked structure, a radiator inlet and a radiator outlet. The first reservoir includes a first chamber and a second chamber. The second reservoir includes a third chamber and a fourth chamber. A fin tube layer of the heat dissipation stacked structure is sandwiched between the first reservoir and the second reservoir. The radiator inlet is connected to the first reservoir and the first chamber. The radiator outlet is connected to the second reservoir and the fourth chamber. A part of fin tubes of the fin tube layer communicates with the first chamber and the third chamber, another part of the fin tubes communicates with the third chamber and the second chamber, and one another part of the fin tubes communicates with the second chamber and the fourth chamber.

Abstract: A capillary structure of vapor chamber and the vapor chamber. The capillary structure of vapor chamber includes a sintered main body. The sintered main body has multiple perforations and multiple extension sections integrally extending from one side of the sintered main body. The extension sections are arranged at intervals or not arranged at intervals to support the sintered main body. The vapor chamber includes a first plate body and a second plate body. The first and second plate bodies are correspondingly mated with each other to together define an airtight chamber. The second plate body has a heated section and a first capillary structure. The sintered main body is correspondingly disposed in the heated section and supported on (overlapped with) the first capillary structure. By means of the extension sections, the sintered main body and the first capillary structure define therebetween a gap.

Abstract: A liquid collection assembly positionable between a fill material and a fan of a cooling tower for collecting liquid gravitating through the fill material while allowing air to pass up to the fill material. The liquid collection assembly includes a plurality of trough assemblies supported in a spaced apart, vertically overlapping relationship to provide a uniform path for rising air, to capture the down flowing liquid, to provide a barrier between the liquid distribution system and the fan, and to carry the liquid into the at least one gutter. The trough assemblies are supported by a first end plate and a second end plate through which trough assemblies extend.

Abstract: Devices, systems, and methods are disclosed for cooling using both air and/or liquid cooling sub circuits. A vapor compression cooling system having both an air and liquid cooling sub circuit designed to service high sensible process heat loads that cannot be solely cooled by either liquid or air is provided.

Abstract: A vapor chamber that includes a housing having a first sheet and a second sheet that oppose each other and that are joined to each other in a peripheral region of the housing; a working liquid enclosed within the housing; and a wick structure on an inside surface of the first sheet or the second sheet. In the vapor chamber, the wick structure includes multiple protruding portions and a grid portion integral with the protruding portions. In addition, surfaces of the protruding portions and a surface of the grid portion opposite the inside surface of the first sheet or the second sheet are positioned on a same flat surface.

Abstract: A cooling system includes an evaporator, connected through fluid lines to a first condenser, a second condenser, a compressor, and a thermal expansion valve. One or more valves are arranged in the fluid lines. The one or more valves operated to, in a first mode, circulate fluid between the evaporator the first condenser; in a second mode, circulate the fluid between a) the evaporator and the first condenser, and b) the evaporator, the second condenser, and the thermal expansion valve, and; in a third mode, circulate the fluid between a) the evaporator and the first condenser, and c) the evaporator, the compressor, the second condenser, and the thermal expansion valve.

Abstract: A evaporator of a loop heat pipe includes a liquid inlet side portion that extends in a widthwise direction crossing with a lengthwise direction from a liquid inlet side to a vapor outlet side, a plurality of portions that continue to the liquid inlet side portion and extend in the lengthwise direction, a plurality of vapor flow paths that are provided between the plurality of portions and extend in the lengthwise direction, and a vapor outlet side vapor flow path that extends in the widthwise direction and continues to the vapor flow paths. Each of the plurality of portions includes a first groove communicating two adjacent ones of the vapor flow paths.

Abstract: An enhanced gravity-driven, thin film condensation heat transfer condenser is disclosed for use in a thermosyphon performing in two perpendicular orientations, as well as orientations in between. The thermosyphon includes an evaporator fluidly coupled to a first condenser configured with a plurality of fins, with each of the plurality of fins having notches adjacent to flanges, the notches forming vapor flow channels through the plurality of fins. The first condenser is fluidly coupled to a second condenser, and vapor flowing from the evaporator must first pass through the first condenser before entering the second condenser.

Abstract: A heat rejection panel comprising a first and a second plate. The first plate comprises an oscillating heat pipe face having a plurality of first opened elongated recesses formed therein, and the second plate comprises an oscillating heat pipe face having a plurality of second open elongated recesses formed therein. The first plate oscillating heat pipe face is hermetically sealed to the second plate oscillating heat pipe face forming a bond joint therebetween. The first plate caps the second open elongated recesses and the second plate caps the first open elongated recesses such that first open elongated recesses are physically and fluidly connected to the second open elongated recesses, thereby forming at least one non-planar oscillating heat pipe channel within the panel that reciprocates back and forth across the bond joint having the bond joint as a longitudinal axis.

Abstract: An information handling system includes a computing device, a computing component of the computing device that is housed in a chassis, and a chilled air filter that reduces a humidity level of a portion of an airflow when the chilled air filter is in an active state. The portion of the airflow thermally manages the computing component. The airflow is received by the chassis via an air receiving exchange and exhausted by the chassis via an air expelling exchange.

Abstract: An apparatus incorporating a multi-surface heat sink may comprise an integrated circuit die, a heat spreader, a plate element, and a heat sink. The heat spreader may be positioned above the IC die. The plate element may be positioned above the heat spreader. A bottom surface of the heat sink may have a first region positioned above the plate element. One or more spring elements may be positioned between the plate element and the first region of the bottom surface of the heat sink. The one or more spring elements may be under a compressive load between the plate element and the heat sink. One or more thermal conduit elements may be secured to both the plate element and the heat sink. The one or more thermal conduit elements may apply at least a part of the compressive load between the plate element and the heat sink.

Abstract: A refrigerator 10 comprises at least one box-shaped storage compartment 14 and a heat radiating member 23. The storage compartment 14 is formed in such a way that one side of a frame formed by a wall member is closed and the other thereof is provided with an opening surface configured to be opened or closed by a door. The wall member includes a hollow structure composed of a plurality of plate members 21 and 22 and a foam insulation 25 filled in the hollow structure. The heat radiating member 23 is arranged in the wall member. In the wall member, a pressure member 24 configured to press the heat radiating member against the plate member is provided. The pressure member 24 is a material configured to press the heat radiating member 23 under predetermined conditions.

Abstract: A heat transfer device such as a heat sink includes one or more fins for dissipating heat received from a heat source, such as an integrated circuit or other electronic component. A thermosiphon component including a tube that defines a closed, continuous loop and contains a working fluid is attached to a face of a corresponding fin and is arranged to operate as a two-phase thermosiphon to transfer heat across areas of the fin. The heat transfer may equalize temperatures across the fin, enhancing efficiency.

Abstract: A protection element for vapor chamber includes a main body and a protection element. The main body is divided into a working zone and a sealing zone. The sealing zone is located around an outer periphery of the working zone and is provided with a notch area, to which a fluid-adding and air-evacuating pipe is connected. The protection element is correspondingly mounted to the notch area to contact with the sealing zone of the main body. With the arrangement of the protection element, the fluid-adding and air-evacuating pipe is protected against collision and impact and accordingly, the main body of the vapor chamber is protected against vacuum and working fluid leakage.

Abstract: An system and method for cooling of electronic equipment, for example a computer system, in a subsurface environment including a containment vessel in at least partial contact with subsurface liquid or solid material. The containment vessel may be disposed in a variety of subsurface environments, including boreholes, man-made excavations, subterranean caves, as well as ponds, lakes, reservoirs, oceans, or other bodies of water. The containment vessel may be installed with a subsurface configuration allowing for human access for maintenance and modification. Cooling is achieved by one or more fluids circulating inside and/or outside the containment vessel, with a variety of configurations of electronic devices disposed within the containment vessel. The circulating fluid(s) may be cooled in place by thermal conduction or by active transfer of the fluid(s) out of the containment vessel to an external heat exchange mechanism, then back into the containment vessel.

Abstract: A heat exchanger, a heat exchanger unit, and a refrigeration cycle apparatus are provided where heat exchange performance is improved, and drainage properties and resistance against frost formation are improved. A flat tube and a plurality of fins that are each a plate having a plate surface extending in a longitudinal direction and in a width direction orthogonal to the longitudinal direction are provided. The plate surface intersects a pipe axis of the flat tube, and the plurality of fins are arranged at an interval from one another. The plurality of fins each have a first spacer formed in the plate and maintaining the interval. The flat tube has a longitudinal axis of a section perpendicular to the pipe axis, and the longitudinal axis is inclined to the width direction by an inclination angle ?. The first spacer has a standing surface extending in a direction intersecting the plate surface.

Abstract: An air-conditioning device that allows sufficient power to be reliably supplied to an imaging device is provided. The air-conditioning device includes a control unit that makes an imaging device capture an image while at least one predetermined component of the air-conditioning device is at rest.

Abstract: A method for attaching a heat-emitting device and a capillary heat pipe to a panel of a spacecraft wall is disclosed including the steps of: a) positioning a capillary heat pipe on a portion of the panel; attaching female attachment bodies to the panel, the female attachment bodies protruding relative to the capillary heat pipe; c) placing a thermally-conductive and self-curing paste over a portion of the capillary heat pipe or over a heat-emitting device; d) placing a heat-emitting device on the thermally-conductive and self-curing paste and on the female attachment bodies, said heat-emitting device bearing against and being in direct contact with the female attachment bodies, and e) attaching the heat-emitting device and said capillary heat pipe to the panel by attaching male attachment members to the female attachment bodies.

Abstract: A heat dissipation structure and a manufacturing method thereof and a display device. The heat dissipation structure includes: a heat dissipation plate body, including an evaporation part and a condensation part; a plurality of micro-cavity structures, disposed in the heat dissipation plate body, two ports of each of the micro-cavity structures being sealed, and the micro-cavity structures being filled with liquid. Each of the micro-cavity structures extends from the evaporation part to the condensation part, and after the liquid absorbs heat at the evaporation part to change into vapor, the vapor moves toward the condensation part, and the vapor moved to the condensation part is condensed and liquefied and moves toward the evaporation part to achieve heat dissipation.

Abstract: A heat exchanger, a heat exchanger unit, and a refrigeration cycle apparatus are provided where heat exchange performance is improved, and drainage properties and resistance against frost formation are improved. A flat tube and a plurality of fins that are each a plate having a plate surface extending in a longitudinal direction and in a width direction orthogonal to the longitudinal direction are provided. The plate surface intersects a pipe axis of the flat tube, and the plurality of fins are arranged at an interval from one another. The plurality of fins each have a first spacer formed in the plate and maintaining the interval. The flat tube has a longitudinal axis of a section perpendicular to the pipe axis, and the longitudinal axis is inclined to the width direction by an inclination angle ?. The first spacer has a standing surface extending in a direction intersecting the plate surface.

Abstract: Embodiments may utilize a series of exposed fins, which increase the surface area of the heat sink creating additional air flow. As hotter air rises within the system, cooler is drawn into the heatsink. The fins may be exposed on both sides of the longitudinal axis, allowing cooler air to be drawn towards the longitudinal axis above the heatsink and flow upward. This process may cool the fins. Additionally, the spacing between the fins may have to be wide enough to allow for air to freely enter the heatsink.

Abstract: The embodiments of the present disclosure relates a cryopump including a pump housing including a suction port, a cold head located within the pump housing, a shielding element located within the pump housing and covering the cold head, a baffle at the suction port, the baffle including a gas passage with an inlet and an outlet, an orthographic projection of the baffle to the cross section of the pump housing completely covers an orthographic projection of the suction port thereto, the gas passage includes a first portion and a second portion intersecting with each other, the inlet is defined by one end of the first portion, the outlet is defined by one end of the second portion.

Abstract: An example apparatus is disclosed that includes a base and a wickless capillary driven constrained vapor bubble heat pipe carried by the base. The wickless capillary driven constrained vapor bubble heat pipe includes a capillary, and the capillary has a longitudinal axis and a cross-sectional shape orthogonal to the longitudinal axis. The cross-sectional shape includes a first curved wall, a second curved wall, a first corner between a first straight wall and a second straight wall, and a second corner between a third straight wall and a fourth straight wall.

Abstract: The present disclosure provides a heat pipe capable of preventing deformation of even a thin container and having excellent heat transfer characteristics by preventing freezing of a working fluid even if the longitudinal direction of the container is set substantially parallel to the direction of gravity in cold regions. A heat pipe includes a container having a tubular shape with both ends sealed, a wick structure stored in the container, and a working fluid sealed in the container, wherein, in at least one of cross sections perpendicular to the longitudinal direction of the container, the wick structure is in contact with the inner surface of the container at two points but both side surfaces of the wick structure are not in contact with any inner surface of the container, and a sintered metal layer is formed on the container inner surface being not in contact with the wick structure.

Abstract: Apparatus and methods directed to an assembly associated with a downhole tool, and including: a thermal housing; at least one internal component inside the thermal housing, wherein the at least one internal component comprises at least one thermally sensitive component; and a thermal isolation support connecting the at least one internal component to the tool. The thermal isolation support may comprise an additive manufacturing structural framework connected to the tool. The structural framework may include a plurality of structural members, with a majority of the plurality of structural members substantially non-parallel with a longitudinal axis of the downhole tool.

Abstract: An electronic device according to various embodiments of the present invention can comprise: a housing including a first plate facing a first direction, a second plate facing a second direction opposite to the first direction, and a side member for encompassing a space between the first plate and the second plate; a circuit board arranged inside the housing and including at least one heating element; a first vapor chamber for receiving, through conduction, and dispersing, in at least a partial space between the first plate and the circuit board, heat released from the at least one heating element; a heat sink for receiving, through conduction, and absorbing, in at least a partial space between the circuit board and the second plate, heat released from the at least one heating element; and a fan for supplying air such that the heat absorbed by the heat sink is forcibly convected toward the outside of the electronic device. Additional various embodiments are possible.

Abstract: The present invention relates to a thermal control device of a component, the control device including: a power source, a converter able to convert a temperature variation into a resistance variation, and a cooling module including two faces, a first face at a first temperature and a second face at a second temperature, the difference between the first temperature and the second temperature depending on the current supplying the cooling module, the first face being in, contact with the component, the cooling module, the converter and the power source being arranged electrically so that the current supplying the converter decreases with a temperature increase and the current supplying the cooling module remains constant.

Abstract: The present invention provides a substrate stage and a substrate processing apparatus that appropriately control a temperature of a staging surface on which a substrate is placed. The substrate stage includes a stage base including a cooling surface therein, and a supply flow path forming member formed of a material having a lower thermal conductivity than that of the stage base and including cooling nozzles configured to spray a coolant toward the cooling surface.

Abstract: An evaporator includes an inlet in a lower manifold, an outlet in an upper manifold, and a multiport tube extending between the lower manifold and the upper manifold. The multiport tube provides a flow path between the lower manifold and the upper manifold. One of the outer side walls of the multiport tube is provided with a first evaporator section with a first heat receiving surface and a second evaporator section with a second heat receiving surface, the first and second evaporator sections passing a heat load received via the respective first and second heat receiving surfaces to a fluid in said multiport tube. The first and second heat receiving surfaces form an angle with each other to align with and contact different surfaces of an object to be cooled.

Abstract: Provided are a phase change cooler with enhanced cooling performance and enhanced pressure resistance performance, and an electronic device using such a phase change cooler. The phase change cooler includes a heat receiving unit, a heat dissipating unit, a vapor pipe and a liquid pipe that interconnect the heat receiving unit and the heat dissipating unit to form a loop, and refrigerant encapsulated inside the phase change cooler. The heat receiving unit has an approximately semicircular cross section, and the vapor pipe is coupled to an inclined face of the heat receiving unit.

Abstract: A stem cell manufacturing system for manufacturing stem cells from somatic cells includes: one or more closed production device(s) configured to produce stem cells from somatic cells; one or more drive device(s) configured to be connected with the production device(s) and drive the production device(s) in such a manner as to maintain the production device(s) in an environment suitable for producing stem cells; one or more cryopreservation device(s) configured to cryopreserve the produced stem cells; a first memory device configured to store whether or not somatic cells have been introduced to the production device(s), as a first state; a second memory device configured to store whether or not the production device(s) is/are connected with the drive device(s), as a second state; and a third memory device configured to store whether or not the produced stem cells can be placed in the cryopreservation device(s), as a third state.