DIFFUSION BONDING MACHINE AND METHOD
An example diffusion bonding machine includes a support structure configured to receive first and second die sets. A heat transfer device is arranged near the support structure and is configured to transfer heat relative to the die sets. A mechanism is configured to separate the die sets from one another during heat transfer. In one example method of diffusion bonding, heat is transferred relative to a space between die sets. The die sets are supported on the support structure, and a load is applied to the die sets to diffusion bond a component within each of the die sets.
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This application is a divisional application of U.S. application Ser. No. 13/346,872, which was filed on Jan. 10, 2012.
BACKGROUNDThis disclosure relates to a diffusion bonding machine and method, for example, for manufacturing hollow blades.
Some hollow fan blades are manufactured by diffusion bonding two halves to one another. The blades are constructed from a titanium alloy, for example. The blade halves typically include features, such as ribs, that must precisely mate with one another to ensure desired bonding between the ribs. Uniform heating is essential to avoid introducing misalignment of the ribs due to temperature distortion. Similarly, after bonding, the dies must be uniformly cooled to avoid temperature induced distortion. Typically, two die sets are stacked vertically onto one another to increase the number of blades processed.
The halves are bonded together by radiantly preheating the blade within an enclosed set of dies before applying pressure sufficient to bond the halves to one another. The die sets are also heated during pressing. The configuration of the stacked dies requires conduction of heat from the outer sides of the die sets to the interior of the die sets where the blades are located. As a result, a very lengthy heating time is required.
One type of diffusion bonding machine includes three stations. The stack of die sets is loaded into the first station and preheated. Pressure is applied to the die stack at a second station and the die sets continue to be exposed to heat at the second station. Once bonding is complete, the die stack is transferred to a third station where the dies are cooled and then unloaded from the third station. Throughout the manufacturing process at the various stations, the die sets remain closed and stacked relative to one another.
SUMMARYIn one exemplary embodiment, a method of diffusion bonding a component includes transferring heat relative to a space between first and second die sets. The method includes supporting the first die set on the second die set; and applying a load to the die sets to diffusion bond a component within each of the die sets.
In a further embodiment of any of the above, the method includes loading the die sets onto a support structure prior to performing the heat transferring step.
In a further embodiment of any of the above, the method includes moving the die sets and support structure relative to one another to provide a space.
In a further embodiment of any of the above, the moving step includes lifting the die sets off of a platen.
In a further embodiment of any of the above, the heat transferring step includes heating the space and the die sets.
In a further embodiment of any of the above, the heat transferring step includes cooling the space and the die sets.
In a further embodiment of any of the above, the loading step includes pressing the die sets between first and second platens.
In a further embodiment of any of the above, the method includes transferring heat relative to a space between the die sets prior to and subsequent to the load applying step.
In a further embodiment of any of the above, the load applying step includes heating the die sets.
In a further embodiment of any of the above, the heat transferring step, the die sets supporting step, and the load applying step are performed at a single station.
The disclosure can be further understood by reference to the following detailed description when considered in connection with the accompanying drawings wherein:
One example of a semi-continuous diffusion bonding process is schematically illustrated in
To improve cycle times on the semi-continuous process 22, a separating mechanism 34 is used to separate the upper and lower dies from one another (shown in
The stack of die sets is preheated at Station 1 with the die sets separated. Once the desired temperature of the components 10 arranged within the stack has been achieved, the stack is transferred to Station 2, indicated at 26 in
The separating mechanism 34 illustrated in
An example single station diffusion bonding machine is shown in
With the arms 38, 40 engaging the die sets 30, 32, raising the upper platen 58 engages the arms 38, 40 with the die sets 30, 32 to separate the die sets 30, 32 and provide gaps 33 around the die sets 30, 32 and any support structure, as shown in
Although an example embodiment has been disclosed, a worker of ordinary skill in this art would recognize that certain modifications would come within the scope of the claims. For that reason, the following claims should be studied to determine their true scope and content.
Claims
1. A method of diffusion bonding a component comprising:
- transferring heat relative to a space between first and second die sets;
- supporting the first die set on the second die set; and
- applying a load to the die sets to diffusion bond a component within each of the die sets.
2. The method according to claim 1, comprising loading the die sets onto a support structure prior to performing the heat transferring step.
3. The method according to claim 2, comprising moving the die sets and support structure relative to one another to provide a space.
4. The method according to claim 3, wherein the moving step includes lifting the die sets off of a platen.
5. The method according to claim 2, wherein the heat transferring step includes heating the space and the die sets.
6. The method according to claim 2, wherein the heat transferring step includes cooling the space and the die sets.
7. The method according to claim 1, wherein the loading step includes pressing the die sets between first and second platens.
8. The method according to claim 1, comprising transferring heat relative to a space between the die sets prior to and subsequent to the load applying step.
9. The method according to claim 1, wherein the load applying step includes heating the die sets.
10. The method according to claim 1, wherein the heat transferring step, the die sets supporting step, and the load applying step are performed at a single station.
Type: Application
Filed: Nov 6, 2012
Publication Date: Jul 11, 2013
Applicant: UNITED TECHNOLOGIES CORPORATION (Hartford, CT)
Inventor: United Technologies Corporation (Hartford, CT)
Application Number: 13/669,708