INTEGRATED MODULE, INTEGRATED SYSTEM BOARD, AND ELECTRONIC DEVICE
Embodiments of the present invention provide an integrated module. The integrated module includes a printed circuit board PCB and a modular device, where the modular device is mounted on the PCB; a group of front pin pads is disposed at four edges of a front surface of the PCB and the front pin pads are located around a mounted position of the modular device; and a group of bottom pin pads is disposed at four edges of a bottom surface of the PCB. Positions where the front pin pads are disposed are symmetric to positions where the bottom pin pads are disposed; and network properties of the front pin pads and those of the bottom pin pads are the same.
Latest Huawei Device Co., Ltd. Patents:
- Method, user equipment, server, and apparatus for implementing information sharing
- Method for sharing application between terminals, and terminal
- Application display method and terminal
- Method and apparatus for processing contact information using a wireless terminal
- Control method based on vertical synchronization signal and electronic device
This application claims priority to Chinese Patent Application No. 201210013815.4, filed on Jan. 17, 2012, which is hereby incorporated by reference in its entirety.
FIELD OF THE INVENTIONThe present invention relates to communications technologies, and in particular, to an integrated module, an integrated system board, and an electronic device.
BACKGROUND OF THE INVENTIONWith continuous development and advancement of science and technology, an integrated module with a high degree of integration is increasingly adopted in an electronic product in the communications field, where the integrated module is directly assembled to a mainboard of a whole machine, providing great convenience and generality to the applications of the whole machine. The design of an ordinary integrated module is generally a land grid array (Land Grid Array, LGA for short) or pinless chip carrier (Pinless Chip Carrier, LCC for short) castle-type packaging. The LGA is manufactured with electrode contacts in array status on a bottom surface, where metal contact packaging is adopted to replace original needle pins so as to overcome signal interference caused by the contact of pins. The LCC refers to surface mounted packaging where four sides of a ceramic baseboard only have electrode contacts but no pins, and is used to package a high-speed and high-frequency integrated circuit (Integrated Circuit, IC for short). Because the four sides in this packaging manner have no pins, a mounted area is relatively small and the height is relatively low. Generally, miniaturization packaging is further performed through the integrated module, that is, system in package, (System In Package, SIP for short) which is similar to package of a chip, is formed.
In the prior art, the integrated module adopts a surface mounted technology (Surface Mounted Technology, SMT for short) to perform assembly, where a group of pin pads is designed at four edges of the bottom surface of a printed circuit board (Printed Circuit Board, PCB for short) of the integrated module, so as to mount a modular device on the front surface of the PCB.
However, when the integrated module in the prior art is tested, an additional line needs to be added to connect the integrated module and a test circuit, which increases the complexity of a test process.
SUMMARY OF THE INVENTIONEmbodiments of the present invention provide an integrated module, an integrated system board, and an electronic device, so as to improve the convenience for testing the integrated module without adding an additional test line.
In a first aspect, an embodiment of the present invention provides an integrated module, including a printed circuit board PCB and a modular device, where
the modular device is mounted on the PCB; a group of front pin pads is disposed at four edges of a front surface of the PCB and the front pin pads are located around a mounted position of the modular device; a group of bottom pin pads is disposed at four edges of a bottom surface of the PCB; and
positions where the front pin pads are disposed are symmetric to positions where the bottom pin pads are disposed; and network properties of the front pin pads and those of the bottom pin pads are the same.
In another aspect, an embodiment of the present invention provides an integrated module, including a printed circuit board PCB and a modular device, where
the modular device and the PCB are plastically packaged into a whole body; a group of front pin pads is disposed at four edges of a front surface of the integrated module and the front pin pads are located around a mounted position of the modular device; a group of bottom pin pads is disposed at four edges of a bottom surface of the integrated module; and
positions where the front pin pads are disposed are symmetric to positions where the bottom pin pads are disposed; and network properties of the front pin pads and those of the bottom pin pads are the same.
In another aspect, an embodiment of the present invention provides an integrated system board, including an integrated module and a mainboard, where the integrated module includes a printed circuit board PCB and a modular device;
the modular device is mounted on the PCB; a group of front pin pads is disposed at four edges of a front surface of the PCB; a group of bottom pin pads is disposed at four edges of a bottom surface of the PCB;
positions where the front pin pads are disposed are symmetric to positions where the bottom pin pads are disposed; and network properties of the front pin pads and those of the bottom pin pads are the same; and
the mainboard is disposed with mainboard pin pads; and the integrated module is assembled to the mainboard through the mainboard pin pads.
In still another aspect, an embodiment of the present invention provides an electronic device, including the foregoing integrated system board.
The technical effects according to the embodiments of the present invention are: a group of front pin pads is disposed at four edges of the front surface of the PCB, and a group of bottom pin pads is disposed at four edges of the bottom surface of the PCB, where the network properties of the front pin pads and those of the bottom pin pads are the same. Compared with the solution in the prior art, in the embodiments of the present invention, an additional test line does not need to be added, and the test may be performed directly through the front pin pads or the bottom pin pads, thereby improving the convenience of testing the integrated module; because both of the front pin pads and the bottom pin pads of the integrated module may be assembled to the mainboard, the embodiments improve the convenience of the assembly.
To illustrate the technical solutions in the embodiments of the present invention or in the prior art more clearly, accompanying drawings needed for describing the embodiments or the prior art are introduced briefly below. Apparently, the accompanying drawings in the following description merely show some embodiments of the present invention, and persons skilled in the art may further obtain other drawings according to the accompanying drawings without creative efforts.
In order to make the objectives, technical solutions, and advantages of the present invention more comprehensible, the technical solutions of the embodiments of the present invention are clearly described in the following with reference to the accompanying drawings. Apparently, the embodiments in the following description are merely a part rather than all of the embodiments of the present invention. All other embodiments obtained by persons skilled in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.
Specifically,
Specifically,
This embodiment provides an integrated module. A group of front pin pads is disposed at four edges of the front surface of the PCB, and a group of bottom pin pads is disposed at four edges of the bottom surface of the PCB, where the network properties of the front pin pads and those of the bottom pin pads are the same. Compared with the solution in the prior art, in this embodiment, an additional test line does not need to be added, and the test may be performed directly through the front pin pads or the bottom pin pads, thereby improving the convenience of testing the integrated module; because both of the front pin pads and the bottom pin pads of the integrated module may be assembled to the mainboard, this embodiment improves the convenience of the assembly.
Specifically, in this embodiment, the bottom pin pads 12 are specifically used to assemble the integrated module to a mainboard of an integrated system board. In this embodiment, the integrated module and the mainboard are assembled together through the bottom pin pads, and the front pin pads 11 are used to test the integrated module, that is, serve as the test points for a function test.
Specifically, in this embodiment, the front pin pads 11 are specifically used to assemble the integrated module to the mainboard of the integrated system board. In this embodiment, the integrated module and the mainboard are assembled together through the front pin pads, and the bottom pin pads 12 are used to test the integrated module, that is, serve as the test points for a function test.
This embodiment provides an integrated module. A group of front pin pads is disposed at four edges of the front surface of the integrated module, and a group of bottom pin pads is disposed at four edges of the bottom surface of the integrated module, where the network properties of the front pin pads and those of the bottom pin pads are the same. Compared with the solution in the prior art, in this embodiment, an additional test line does not need to be added, and the test may be performed directly through the front pin pads or the bottom pin pads, thereby improving the convenience of testing the integrated module; because both of the front pin pads and the bottom pin pads of the integrated module may be assembled to the mainboard, this embodiment improves the convenience of the assembly.
This embodiment further provides an integrated system board, which may specifically include an integrated module and a mainboard. The integrated module, specifically as shown in
In addition, in this embodiment, the mainboard 2 is disposed with the assembly slot 22, and the assembly slot 22 is opened within an area encircled by the mainboard pin pads 21. It may be seen from
This embodiment provides an integrated system board, which is formed of an integrated module and a mainboard. A group of front pin pads is disposed at four edges of the front surface of the PCB of the integrated module, and a group of bottom pin pads is disposed at four edges of the bottom surface of the PCB, where the network properties of the front pin pads and those of the bottom pin pads are the same. Compared with the solution in the prior art, in this embodiment, an additional test line does not need to be added, and the test may be performed directly through the front pin pads or the bottom pin pads, thereby improving the convenience of testing the integrated module. In addition, in this embodiment, pin pads are disposed on both the front surface and the bottom surface of the integrated module, so as to implement two assembly manners of the integrated system board. Moreover, the assembly manner in which the integrated module faces down may obviously decreases the overall thickness of the integrated system board, so as to implement the miniaturization of the electronic device.
This embodiment further provides an electronic device, which may specifically include the integrated system board shown in
Finally, it should be noted that the embodiments are merely provided for describing the technical solutions of the present invention, but not intended to limit the present invention. It should be understood by persons skilled in the art that although the present invention has been described in detail with reference to the embodiments, modifications may be made to the technical solutions described in the embodiments, or equivalent replacements may be made to some or all the technical features in the technical solutions, as long as such modifications or replacements do not depart from the scope of the technical solutions of the embodiments of the present invention.
Claims
1. An integrated module, comprising a printed circuit board PCB and a modular device, wherein:
- the modular device is mounted on the PCB; a group of front pin pads are disposed at four edges of a front surface of the PCB and the front pin pads are located around a mounted position of the modular device; a group of bottom pin pads are disposed at four edges of a bottom surface of the PCB; and
- positions where the front pin pads are disposed are symmetric to positions where the bottom pin pads are disposed; and network properties of the front pin pads and those of the bottom pin pads are the same.
2. The integrated module according to claim 1, wherein the bottom pin pads are used to assemble the integrated module to a mainboard of an integrated system board, and the front pin pads are used to test the integrated module.
3. The integrated module according to claim 1, wherein the front pin pads are used to assemble the integrated module to a mainboard of an integrated system board, and the bottom pin pads are used to test the integrated module.
4. An integrated system board, comprising the integrated module according to claim 1 and a mainboard, wherein
- the mainboard is disposed with mainboard pin pads; and the integrated module is assembled to the mainboard through the mainboard pin pads.
5. The integrated system board according to claim 4, wherein the integrated module is assembled to the mainboard through a soldering connection between the mainboard pin pads and the bottom pin pads; and
- the front pin pads are used to test the integrated module.
6. The integrated system board according to claim 4, wherein the mainboard is disposed with an assembly slot, and the assembly slot is opened within an area encircled by the mainboard pin pads;
- the integrated module is assembled to the mainboard through a soldering connection between the mainboard pin pads and the front pin pads, and the modular device is disposed in a penetration manner in the assembly slot disposed on the mainboard; and
- the bottom pin pads are used to test the integrated module.
7. An electronic device, comprising the integrated system board according to claim 4.
8. The electronic device of claim 7, wherein the integrated module is assembled to the mainboard through a soldering connection between the mainboard pin pads and the bottom pin pads; and
- the front pin pads are used to test the integrated module.
9. The electronic device of claim 7, wherein the mainboard is disposed with an assembly slot, and the assembly slot is opened within an area encircled by the mainboard pin pads;
- the integrated module is assembled to the mainboard through a soldering connection between the mainboard pin pads and the front pin pads, and the modular device is disposed in a penetration manner in the assembly slot disposed on the mainboard; and
- the bottom pin pads are used to test the integrated module.
10. The integrated module according to claim 1, wherein
- the modular device and the PCB are plastically packaged into a whole body; a group of front pin pads are disposed at four edges of a front surface of the integrated module; a group of bottom pin pads are disposed at four edges of a bottom surface of the integrated module.
11. The integrated module according to claim 10, wherein the bottom pin pads are used to assemble the integrated module to a mainboard of an integrated system board; and the front pin pads are used to test the integrated module.
12. The integrated module according to claim 10, wherein the front pin pads are used to assemble the integrated module to a mainboard of an integrated system board; and the bottom pin pads are used to test the integrated module.
Type: Application
Filed: Sep 20, 2012
Publication Date: Jul 18, 2013
Applicant: Huawei Device Co., Ltd. (Shenzhen)
Inventor: Huawei Device Co., Ltd. (Shenzhen)
Application Number: 13/623,731