Module Patents (Class 361/728)
  • Patent number: 10721825
    Abstract: An electronic device including a display panel is provided. In some embodiments, the display panel includes an active display region and an electrical component. The electrical component is distinct from a touch sensor device that is adapted to receive touch input across the active display region of the display panel. An electrical conductor connects the electrical component to another component of the electronic device via the display panel, such as via a bent portion of the display panel.
    Type: Grant
    Filed: August 18, 2017
    Date of Patent: July 21, 2020
    Assignee: Google LLC
    Inventors: Brian Jon Hassemer, Paul Lynn Fordham, Mark Daniel Janninck, David Kyungtag Lim
  • Patent number: 10706344
    Abstract: A sheet with registration holes cut in it is mounted to a surface of a pallet so that its registration holes are held taught by the outer diameter of bushings while an inner diameter pin shaft of the bushings is used by registration pins during multiple manufacturing process to provide registration of the sheet.
    Type: Grant
    Filed: May 23, 2017
    Date of Patent: July 7, 2020
    Assignee: FITEQ, INC.
    Inventors: Michael Scruggs, Robert Singleton
  • Patent number: 10671009
    Abstract: A printed circuit board comprises a first mounting surface, a second mounting surface, and a piezoelectric transformer. The piezoelectric transformer has a piezoelectric substance, external electrodes, and a frame substrate. The second mounting surface has a projection region. There is a first region from a first location, where an end portion further from the output electrode out of end portions of the input electrode is projected onto the second mounting surface in the projection region, to a second location, where an end portion closer to the output electrode out of the end portions of the input electrode is projected onto the second mounting surface, the first region being a mounting allowed region where an electronic component is mounted.
    Type: Grant
    Filed: February 2, 2018
    Date of Patent: June 2, 2020
    Assignee: Canon Kabushiki Kaisha
    Inventors: Taro Minobe, Norikazu Sugiyama, Ryo Matsumura
  • Patent number: 10659234
    Abstract: In one embodiment, a computing device receives an image that has been signed with a first key, wherein the image includes a first computational value associated with it. A second computational value associated with the image is determined and the image is signed with a second key to produce a signed image that includes both the first and second computational values. Prior to loading the dual-signed image, the computing device attempts to authenticate the dual-signed image using both the first and second computational values, and, if successful, loads and installs the dual-signed image.
    Type: Grant
    Filed: December 21, 2016
    Date of Patent: May 19, 2020
    Assignee: Cisco Technology, Inc.
    Inventors: Kannan Varadhan, Chirag Shroff, Rakesh Chopra
  • Patent number: 10649604
    Abstract: An input device manufacturing method includes: a first process in which, in a state in which a sensor film is inserted into a die, the sensor film having a detection area and a non-detection area other than the detection area, the detection area and the non-detection area constituting the sensor, as well as a first surface formed into a curved surface and a second surface positioned opposite to the first surface, a material that includes a synthetic resin having a translucent property is poured into the die to form a resin layer on the same side as the second surface; and a second process in which a decorative film having a decorative area that covers the non-detection area is pasted to the first surface with an adhesive layer intervening between the decorative film and the first surface.
    Type: Grant
    Filed: March 26, 2019
    Date of Patent: May 12, 2020
    Assignee: Alps Alpine Co., Ltd.
    Inventor: Junji Hashida
  • Patent number: 10608609
    Abstract: An LC filter having a multilayer body, coil conductor patterns, a thin-film capacitor, and input/output terminal conductors. The multilayer body is formed by stacking a plurality of resin sheets. At least a portion of the coil conductor pattern is embedded in a resin sheet. The thin-film capacitor is at least partially embedded in the resin sheet, is disposed in the coil opening of the coil conductor pattern, which is spiral-shaped, and is connected to the coil conductor pattern. The thickness of the coil conductor patterns is smaller than the thickness of the resin sheets, and the thickness of the thin-film capacitor is smaller than the thickness of the resin sheets.
    Type: Grant
    Filed: July 9, 2018
    Date of Patent: March 31, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Toshiyuki Nakaiso
  • Patent number: 10607962
    Abstract: A method for manufacturing semiconductor chips (2, 3) having arranged thereon metallic shaped bodies (6), having the following steps: arranging a plurality of metallic shaped bodies (6) on a processed semiconductor wafer while forming a layer arranged between the semiconductor wafer and the metallic shaped bodies (6), exhibiting a first connection material (4) and a second connection material (5), and processing the first connection material (4) for connecting the metallic shaped bodies (6) to the semiconductor wafer without processing the second connecting material (5), wherein the semiconductor chips (2, 3) are separated either prior to arranging the metallic shaped bodies (6) on the semiconductor wafer or after processing the first connection material (4).
    Type: Grant
    Filed: July 26, 2016
    Date of Patent: March 31, 2020
    Assignee: DANFOSS SILICON POWER GMBH
    Inventors: Frank Osterwald, Martin Becker, Holger Ulrich, Ronald Eisele, Jacek Rudzki
  • Patent number: 10607775
    Abstract: An electronic component device includes an electronic component, a resin structure including the electronic component such that one main surface thereof is exposed, a through-electrode, and first and second wiring layers, in which the electronic component includes an element body, an inner electrode in the element body and connected to the first and second wiring layers, and an adjustment electrode provided in an adjustment region in the element body, the first wiring layer is continuously provided on the inner electrode, the adjustment region, and the resin structure, and a thermal expansion coefficient of the resin structure, a thermal expansion coefficient of the adjustment region, and a thermal expansion coefficient of the inner electrode satisfy an expression of the thermal expansion coefficient of the resin structure?the thermal expansion coefficient of the adjustment region?the thermal expansion coefficient of the inner electrode.
    Type: Grant
    Filed: June 26, 2019
    Date of Patent: March 31, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Masato Nomiya
  • Patent number: 10547717
    Abstract: An enclosure and a method for forming an enclosure are disclosed. The enclosure may be formed from metal, such as aluminum, and further include a non-metal portion allowing for transmission and receipt of electromagnetic waves. The non-metal portion may be interlocked to the enclosure and in particular, to a region within the enclosure including a first material having a relatively high strength and stiffness compared to the non-metal portion. Interlocking means may include forming dovetail cuts into the enclosure to receive the non-metal portion, a hole or cavity drilled into the enclosure which includes internal threads, and a rod inserted into the first material to provide a tension to the non-metal portion. Methods of assembling internal components using anodization are also disclosed.
    Type: Grant
    Filed: January 7, 2019
    Date of Patent: January 28, 2020
    Assignee: APPLE INC.
    Inventors: Matthew D. Hill, Derek C. Krass, Benjamin Shane Bustle, Lucy Elizabeth Browning, Michael Benjamin Wittenberg, James B. Smith, Ashutosh Y. Shukla, Scott A. Myers
  • Patent number: 10540032
    Abstract: A display device, including a display panel that displays an image; a flexible printed circuit board including an attaching part attached to one end of the display panel and a curved part extending from the attaching part and not overlapping with the display panel; a window assembly on an upper surface of the display panel; an adhesive part between the window assembly and the display panel to couple the display panel and the window assembly; and a compensating part not overlapping with the display panel, overlapping with the curved part, and on a same layer as the attaching part.
    Type: Grant
    Filed: August 1, 2018
    Date of Patent: January 21, 2020
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Hyeong-Cheol Ahn, Won-il Lee, Byughoon Chae
  • Patent number: 10534144
    Abstract: An optical transceiver includes a housing, a fastening component, a bail and an optical connector. The fastening component is movably disposed on the housing and configured to be detachably fastened with the cage. The bail includes a first connecting portion and a second connecting portion. The first connecting portion is pivoted with respect to the fastening component at a first pivot joint, and the second connecting portion is pivoted with respect to the fastening component at a second pivot joint. The optical connector is disposed in the housing and located between the first pivot joint and the second pivot joint.
    Type: Grant
    Filed: May 17, 2019
    Date of Patent: January 14, 2020
    Assignee: Prime World International Holdings Ltd.
    Inventors: Yu Chen, Hsuan-Chen Shiu, Che-Shou Yeh
  • Patent number: 10524390
    Abstract: An electronic device includes a top plate having a first surface and a second surface that is positioned at an elevation that is lower than an elevation of the first surface, the second surface extending from a first end part of the top plate to a second end part of the top plate, a bottom plate provided under the top plate, and a circuit board placed between the top plate and the bottom plate and mounted with an electronic component. The top plate has opposing first and second edges and opposing third and fourth edges that are perpendicular to the first and the second edges, the first end part being formed at the first edge and the second end part being formed at the second edge.
    Type: Grant
    Filed: February 23, 2018
    Date of Patent: December 31, 2019
    Assignee: Toshiba Memory Corporation
    Inventor: Akitoshi Suzuki
  • Patent number: 10490955
    Abstract: An electrical connector includes a housing having contact channels with electrical contacts received therein each having a poke-in spring beam configured to engage an electrical wire when poked-in to the housing. The electrical contact is movable between a resting position when no wire is present in the wire channel and a clearance position where the electrical contact allows the electrical wire to be removed from the wire channel. Pivot levers are held by the housing and are coupled to corresponding electrical contacts with a pivot end pivotably coupled to the housing and a push button end having a push button pressed to move the corresponding electrical contact to the clearance position. When the electrical wire is loaded into the wire channel, the electrical contact is positioned in a pinching position in which the spring beam pinches against the electrical wire in physical contact with the electrical wire.
    Type: Grant
    Filed: June 21, 2017
    Date of Patent: November 26, 2019
    Assignee: Ademco Inc.
    Inventors: David J. Emmons, Travis Read, Steven L. Wolff, Eric Barton, Ladislav Janovec
  • Patent number: 10468353
    Abstract: A semiconductor package and a method of fabricating the same, the method including mounting semiconductor chips on a substrate; forming a mold layer that covers the semiconductor chips on the substrate; forming external terminals on a bottom surface of the substrate; forming a separation layer on the external terminals and the bottom surface of the substrate; cutting the substrate and the mold layer to separate the semiconductor chips from each other; and forming a shield surrounding the mold layer and a side surface of the substrate.
    Type: Grant
    Filed: April 27, 2017
    Date of Patent: November 5, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: JaeWook Yoo
  • Patent number: 10468765
    Abstract: An antenna bracket for electronic devices includes a solid bracket having an aperture formed therethrough. The solid antenna bracket has side walls that are rounded to a predetermined radius, and at least one antenna pocket positioned on said side walls. The antenna pocket receives and secures at least one antenna. The antenna bracket has a polygon shape that follows the contours of the electronic device housing.
    Type: Grant
    Filed: July 20, 2018
    Date of Patent: November 5, 2019
    Assignee: INTERDIGITAL CE PATENT HOLDINGS
    Inventors: Mickey J. Hunt, Julianne Luna So, William P. Dernier, Randy Wayne Craig, Darin Bradley Ritter, Kevin M. Williams, Michael Francis Barry
  • Patent number: 10457231
    Abstract: An electronics installation system, especially for an aircraft or spacecraft, includes at least one mechanical installation structure having a plurality of installation slots each configured to receive an electronic module and at least one wiring configuration slot configured to receive a wiring configuration module, and a connection matrix comprising a plurality of data connections, wherein at least one data connection is provided between each one of the installation slots and at least one wiring configuration slot.
    Type: Grant
    Filed: November 19, 2015
    Date of Patent: October 29, 2019
    Assignee: AIRBUS OPERATIONS GMBH
    Inventors: Stefan Osternack, Nicholas E. Brownjohn, Poulain Stéphane
  • Patent number: 10440864
    Abstract: A power conversion device such that heat dissipation can be improved is obtained. The power conversion device includes a power conversion circuit unit that converts direct current into alternating current using a semiconductor switching element, a heatsink on which the power conversion circuit unit is mounted, and which has a first passage through which a cooling medium is caused to pass, and a frame body that houses the power conversion circuit unit, seals the power conversion circuit unit between the frame body and the heatsink, and has a second passage through which a cooling medium is caused to pass, wherein the first passage and second passage are connected at an interface between the heatsink and frame body, thereby configuring a cooling passage.
    Type: Grant
    Filed: June 16, 2017
    Date of Patent: October 8, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventors: Ryohei Hayashi, Goki Furuya, Kohei Ando
  • Patent number: 10433448
    Abstract: Power electronics device, such as a frequency converter, comprising power units (REC1, INU1, INU2, CDC1), a metal frame (31) and a DC bus arrangement in which the power units are connected. The power units may be assembled inside the metal frame (31) wherein the shape of the metal frame is elongated with rectangular cross-sectional shape, consisting of a bottom part (33) and from that essentially vertical oriented side wall parts (32). The DC bus arrangement is arranged on top of the bottom part (33) of the metal frame (31) and separated by an insulator layer (S1) from the metal frame (31). The DC bus arrangement comprises a first DC bus current conductor (DC+) and a second DC bus current conductor (DC?) which are arranged apart from each other. The DC bus current conductors (DC+, DC?) have a flat shape in such a way that their thickness dimension is essentially shorter than their width dimension.
    Type: Grant
    Filed: April 26, 2016
    Date of Patent: October 1, 2019
    Assignee: Vacon Oy
    Inventors: Jukka Jaskari, Osmo Miettinen, Magnus Hortans, Stefan Strandberg
  • Patent number: 10418767
    Abstract: An adjustable impedance high speed data connector, and methods for assembling and operating thereof. The adjustable impedance high speed data connector of this invention includes a printed circuit board accommodated within, or printed or stamped onto, a tray, the printed circuit board including sets of terminals respectively extending on opposite ends of the printed circuit board. Mounted onto the printed circuit board and electrically connected thereto is at least one electric module having a fixed or adjustable capacitance or a fixed or adjustable inductance, which may be combined in any desired combination to achieve a desired impedance for the connector. By adjusting the variable capacitance or inductance of the electric module (or the variable combinations of capacitance and/or inductance of a plurality of electric modules), the impedance within the connector is adjustable for allowing the connector to operate at various ranges of bandwidths.
    Type: Grant
    Filed: May 31, 2018
    Date of Patent: September 17, 2019
    Assignee: J.S.T. CORPORATION
    Inventor: Vikas Azad
  • Patent number: 10389235
    Abstract: An apparatus for power conversion includes a transformation stage for transforming a first voltage into a second voltage. The transformation stage includes a switching network, a filter, and a controller. The filter is configured to connect the transformation stage to a regulator. The controller controls the switching network.
    Type: Grant
    Filed: May 9, 2017
    Date of Patent: August 20, 2019
    Assignee: pSemi Corporation
    Inventor: David Giuliano
  • Patent number: 10356908
    Abstract: An electronic component containing substrate includes a substrate, a first electronic component mounted on a main surface of the substrate, and an embedment layer provided on the main surface of the substrate and embedding the first electronic component. The first electronic component is a multilayer ceramic capacitor including a ceramic multilayer body including a layered portion and a first side portion and a second side portion between which the layered portion lies and having two end surfaces opposed to each other and side surfaces connecting the two end surfaces to each other. The first side portion is located between the layered portion and the main surface of the substrate in a direction of thickness which is a direction perpendicular to the main surface of the substrate. The embedment layer is smaller in elastic modulus than the substrate.
    Type: Grant
    Filed: February 28, 2017
    Date of Patent: July 16, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Kazuo Hattori, Isamu Fujimoto, Masaru Takahashi, Choichiro Fujii, Hirobumi Adachi
  • Patent number: 10331915
    Abstract: Tamper-respondent assemblies, electronic assembly packages, and methods of fabrication are provided which include multiple, discrete tamper-respondent sensors that overlap, at least in part, and facilitate defining a secure volume about one or more electronic components to be protected, such as an electronic assembly. The tamper-respondent sensors include a first tamper-respondent sensor and a second tamper-respondent sensor, which may be similarly constructed or differently constructed. In certain embodiments, the tamper-respondent sensors wrap, at least in part, over an electronic enclosure, and in other embodiments, the tamper-respondent sensors cover, at least in part, an inner surface of an electronic enclosure to facilitate defining a secure volume in association with a multilayer circuit board to which the electronic enclosure is mounted.
    Type: Grant
    Filed: November 21, 2017
    Date of Patent: June 25, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: William L. Brodsky, John R. Dangler, Phillip Duane Isaacs, David C. Long, Michael T. Peets
  • Patent number: 10237992
    Abstract: An electronic device housing includes a first housing, a second housing, and a foaming buffer unit. The first housing has a first inner surface, and the first inner surface has a first abutting area. The second housing has a second inner surface, where the second inner surface has a second abutting area, the second housing is connected to the first housing, and the second inner surface is opposite to the first inner surface. The foaming buffer unit is disposed between the first inner surface and the second inner surface, and abuts against the first abutting area of the first inner surface and the second abutting area of the second inner surface.
    Type: Grant
    Filed: February 8, 2018
    Date of Patent: March 19, 2019
    Assignee: PEGATRON CORPORATION
    Inventor: Chien-Sheng Lo
  • Patent number: 10226693
    Abstract: Videogame controllers with smart trigger stops may include: a housing including a trigger, the trigger movable along a path of travel; a sensor configured to detect the position of the trigger and to generate a signal representing trigger position; a processor configured to interpret signals generated by the sensor and cause an output signal to be transmitted to a gaming console; a trigger-stop that is movable between an engaged position and a disengaged position, the trigger-stop in the disengaged position allowing the trigger to move along the entire path of travel, the trigger-stop in the engaged position blocking the trigger from moving along the entire path of travel; and a switch coupled with the housing and the trigger-stop, wherein movement of the trigger-stop from the disengaged position to the engaged position flips the switch and causes the processor to map received signals to generated signals in a different manner.
    Type: Grant
    Filed: March 2, 2017
    Date of Patent: March 12, 2019
    Assignee: Performance Designed Products LLC
    Inventors: Brad Strahle, Yannik Wiggemans
  • Patent number: 10206296
    Abstract: A protective case for an electronic device includes a main housing and a lid. The main housing and lid are removably joined to define a water tight volume receiving an electronic device. The electronic device includes an earpiece having a speaker and microphone positioned thereon. The lid includes an earpiece port formed therein proximate the earpiece of the electronic device. A membrane assembly is attached to the lid by a compliant adhesive, the membrane assembly transmitting sound to the ear piece port. A noise isolating assembly attached to the lid. The noise isolating assembly is positioned about a periphery of the earpiece isolating the earpiece from an additional sound source.
    Type: Grant
    Filed: September 1, 2017
    Date of Patent: February 12, 2019
    Assignee: Catalyst Lifestyle Limited
    Inventors: Joshua Wright, June Lai
  • Patent number: 10194552
    Abstract: An enclosure for holding a printed circuit board includes a housing portion of metal containing at least about 90% magnesium and formed by a semi-solid metal casting process of thixomolding, and including a wall defining an opening to form a spring arm including a tabular portion and a contact pad. The spring arm may be deflected from the wall to provide a contact pressure biasing the first contact pad in physical and electrical contact with the printed circuit board and to provide an electrical grounding connection therebetween. Alternative embodiments are also provided with the spring arm transverse to the wall and with a two spring arms on opposite sides of the printed circuit board. A method of forming a housing portion of an enclosure for holding a printed circuit board is also provided, and which includes steps of thixomolding magnesium to form the housing portion including a spring arm.
    Type: Grant
    Filed: January 18, 2018
    Date of Patent: January 29, 2019
    Assignee: Visteon Global Technologies, Inc.
    Inventors: Chakrapani Nandyala, Marcus Walter Koch
  • Patent number: 10194540
    Abstract: A supporting device of a flexible display panel, and display apparatus are provided. The supporting device includes a plate-like support component and a curvature adjusting component combined with the plate-like support component, wherein the plate-like support component includes two opposite outer peripheral portions, at least one portion of the curvature adjusting component is disposed between the two outer peripheral portions, and a structure of the curvature adjusting component is configured to enable the two outer peripheral portions of the plate-like support component to be bent toward the side of the plate surface provided with the plate-like support component, such that a curved support surface having a varying curvature can be obtained.
    Type: Grant
    Filed: September 9, 2016
    Date of Patent: January 29, 2019
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventor: Li Sun
  • Patent number: 10191520
    Abstract: An electronic apparatus having function of switching node modules includes at least two node modules, a shared I/O module having a first I/O interface connected with an external device, a second I/O interface electrically connected with the at least two node modules and a switching module connecting the at least two node modules. The shared I/O module is used to cause the shared I/O module to communicate with one node module in the at least two node modules through the second I/O interface according to a selection signal when receiving the selection signal. The shared I/O module integrates multiple communication ports and switches the node module communicating with the shared I/O module according to a selection signal, the shared I/O module also can be designed as a shared I/O module combined by multiple different ports in advance to perform corresponding replacement according to user needs.
    Type: Grant
    Filed: January 19, 2016
    Date of Patent: January 29, 2019
    Assignee: CELESTICA TECHNOLOGY CONSULTANCY (SHANGHAI) CO. LTD
    Inventors: Hank Dao, Guangcheng Dai
  • Patent number: 10153230
    Abstract: An improvement is achieved in the performance of a semiconductor device. The semiconductor device includes a metal plate having an upper surface (first surface), a lower surface (second surface) opposite to the upper surface, and a plurality of side surfaces located between the upper and lower surfaces and having a semiconductor chip mounted thereover. A portion of the metal plate is exposed from a sealing body sealing the semiconductor chip. The exposed portion is covered with a metal film. The side surfaces of the metal plate include a first side surface covered with the sealing body and a side surface (second side surface) provided opposite to the first side surface and exposed from the sealing body. Between the upper and side surfaces of the metal plate, an inclined surface inclined with respect to each of the upper and side surfaces and covered with the metal film is interposed.
    Type: Grant
    Filed: November 17, 2017
    Date of Patent: December 11, 2018
    Assignee: Renesas Electronics Corporation
    Inventor: Shoji Hashizume
  • Patent number: 10148625
    Abstract: A protected memory source device including removable non-volatile memory durably stores a signature such as a serial number or identifier, which is used to mark protected multimedia content legally stored on the protected memory device. The protected multimedia content is moved from the source device to another device, such as a target device used to aggregated protected content in a library. Moving the protected multimedia content involves replacing a source-specific header, comprising digital rights management metadata and/or other security metadata allowing only a device having the source device signature access to the content, with a target-specific header comprising digital rights management metadata and/or other security metadata allowing only a device having the target device signature access to the content. The transfer is done using one of a variety of transfer methods with either a trusted or un-trusted host system connecting the source device to the target device.
    Type: Grant
    Filed: May 9, 2017
    Date of Patent: December 4, 2018
    Assignee: MO-DV, INC.
    Inventors: Robert D. Widergren, Martin Paul Boliek
  • Patent number: 10120824
    Abstract: A bridge hoard includes a printed circuit board (PCB) and a protocol converter mounted on the PCB to perform a conversion operation converting between a first communication protocol and a second communication protocol different from the first communication protocol. The bridge board further includes a first connector configured to communicate according to the first communication protocol and a second connector configured to communicate according to the second communication protocol. The bridge board additionally includes a hole formed in the PCB. The PCB is shaped as a concave polygon. The concave polygon includes a first region and a second region. The first region includes a first edge and a second edge, which extends in parallel to the first edge, along a first direction. The second region includes a third edge and a fourth edge, which extends in parallel to the third edge, along a second direction perpendicular to the first direction.
    Type: Grant
    Filed: October 26, 2016
    Date of Patent: November 6, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Han Hong Lee, Jae Hong Park, Jung Hyun Woo, Sung Woo Joo, Chang Hoon Han
  • Patent number: 10091900
    Abstract: According to an embodiment, an implantable medical device is disclosed. The device includes a sealed housing enclosing an electronic circuitry, a plurality of feedthrough conductors, each conductor of the plurality of feedthrough conductors includes a proximal end part connected to the enclosed electronic circuitry and a distal end part available external to the housing. The device further includes a plurality of spatially separated feedthrough connectors configured to provide terminal connections, away from the plurality of feedthrough conductors, for a plurality of electrical wires. Each connector of the plurality of spatially separated feedthrough connectors includes a first end section adapted to be connected with the distal end part of a feedthrough conductor of the plurality of feedthrough conductors and a second end section adapted to be connected with one of the plurality of electrical wires.
    Type: Grant
    Filed: June 29, 2016
    Date of Patent: October 2, 2018
    Assignee: OTICON MEDICAL A/S
    Inventors: Pierre-Yves Clair, Hervé Ibanez, Frederic Bessoule, Adrien Thomas
  • Patent number: 10090255
    Abstract: The present disclosure relates to semiconductor structures and, more particularly, to dicing channels used in the singulatation process of interposers and methods of manufacture. The structure includes: one or more redistribution layers; a glass interposer connected to the one or more redistribution layers; a channel formed through the one or more redistribution layers and the glass interposer core, forming a dicing channel; and polymer material conformally filling the channel.
    Type: Grant
    Filed: January 29, 2016
    Date of Patent: October 2, 2018
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Brittany L. Hedrick, Vijay Sukumaran, Christopher L. Tessler, Richard F. Indyk, Sarah H. Knickerbocker
  • Patent number: 10083946
    Abstract: A bottom package includes a molding compound, a buffer layer over and contacting the molding compound, and a through-via penetrating through the molding compound. A device die is molded in the molding compound. A guiding trench extends from a top surface of the buffer layer into the buffer layer, wherein the guiding trench is misaligned with the device die.
    Type: Grant
    Filed: April 24, 2017
    Date of Patent: September 25, 2018
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Po-Hao Tsai, Feng-Cheng Hsu, Li-Hui Cheng, Jui-Pin Hung, Jing-Cheng Lin
  • Patent number: 10082842
    Abstract: One embodiment of the present disclosure set forth a system for hot swapping an expansion card. The system includes a fastener mechanism for coupling an expansion card to a motherboard. The system further includes a switch for controlling voltage supply to the expansion card. When the fastener mechanism is in an activated state, the fastener mechanism secures the expansion card to the motherboard and the switch causes voltage to be supplied to the expansion card. When the fastener mechanism is in a partially activated state, the fastener mechanism secures the expansion card to the motherboard and the switch prevents voltage from being supplied to the expansion card.
    Type: Grant
    Filed: August 10, 2017
    Date of Patent: September 25, 2018
    Assignee: SUPER MICRO COMPUTER, INC.
    Inventor: Dwight Looi
  • Patent number: 10076040
    Abstract: A packaging structure and a packaging method of an electronic product are disclosed. The packaging structure of an electronic product includes a supporting structure, a flexible board and a covering layer. The supporting structure has a shape. The flexible board is stacked on the supporting structure, and has an electronic device disposed thereon. The covering layer is attached on the stacked supporting structure and flexible board and covering the electronic device. The shapes of the flexible board and the covering layer conform to the shape of the supporting structure, and the flexible board and the electronic device are tightly interposed between the covering layer and the supporting structure. The covering layer includes a thermoforming film and at least a function film stacked on the thermoforming film.
    Type: Grant
    Filed: March 16, 2017
    Date of Patent: September 11, 2018
    Assignees: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED, LITE-ON TECHNOLOGY CORPORATION
    Inventors: Yi-Feng Pu, Po-Yu Cheng, Tzu-Shu Lin
  • Patent number: 10076021
    Abstract: Techniques and mechanisms for providing efficient heat dissipation by a circuit assembly. In an embodiment, the circuit assembly includes an inductor and a packaged device coupled thereto, where the inductor forms heat dissipation structures on various respective sides of a ferromagnetic body. The packaged assembly includes a circuit board disposed in a mold material, where a metal core of the circuit board is thermally coupled to transfer heat from one or more circuit components of the packaged device to the inductor via one or more conductors extending from the package mold. In another embodiment, portions of the metal core have different respective vertical spans which contribute to different thermal conductivity characteristics across various regions of the circuit board.
    Type: Grant
    Filed: April 12, 2017
    Date of Patent: September 11, 2018
    Assignee: Intel Corporation
    Inventor: Arvind Sundaram
  • Patent number: 10062620
    Abstract: A die device includes a die including an active layer; and an interconnect feature configured for electrical connection of the active layer, wherein the interconnect feature is in contact with a substrate in the die; and a bump, independent of the die, configured for electrical connection of the active layer.
    Type: Grant
    Filed: April 13, 2017
    Date of Patent: August 28, 2018
    Assignee: Nanya Technology Corporation
    Inventors: Jui-Chung Hsu, Wu-Der Yang, Chia-Chi Hsu
  • Patent number: 10049801
    Abstract: Systems, and apparatus for aligning structures are provided. One of the apparatus includes a first communication module including: a printed circuit board, one or more integrated circuit packages mounted on the printed circuit board, and one or more magnets positioned relative to the one or more integrated circuit packages, wherein the one or more magnets are configured to attractively couple the first communication module to a second communication module positioned in proximity to the first communication module.
    Type: Grant
    Filed: October 16, 2015
    Date of Patent: August 14, 2018
    Assignee: Keyssa Licensing, Inc.
    Inventors: Stephen Robert Venuti, Steve Novak
  • Patent number: 10050374
    Abstract: A device with waterproof structure includes a case, a waterproof cover, and a fixed element. The case has an opening and a waterproof wall surrounding the opening. The waterproof cover is screwed to the case and is selectively covered or moved away from the opening. The fixed element includes a fixed portion and a waterproof plate. The waterproof plate covers the outer edge and one side surface of the fixed portion. The fixed element is detachably disposed to the waterproof cover through the fixed portion. When the waterproof cover covers on the opening, the outer edge of the waterproof plate is close contacted to the waterproof wall. Therefore, using the waterproof plate which could close contact to the waterproof wall to replace the O-ring also could achieve the purpose of waterproofing.
    Type: Grant
    Filed: June 1, 2017
    Date of Patent: August 14, 2018
    Assignee: GETAC TECHNOLOGY CORPORATION
    Inventor: Kun-Cheng Lee
  • Patent number: 10037949
    Abstract: A semiconductor package that includes EMI shielding and a fabricating method thereof are disclosed. In one embodiment, the fabricating method of a semiconductor package includes forming a substrate, attaching semiconductor devices to a top portion of the substrate, encapsulating the semiconductor devices using an encapsulant, forming a trench in the encapsulant, and forming a shielding layer on a surface of the encapsulant.
    Type: Grant
    Filed: March 2, 2017
    Date of Patent: July 31, 2018
    Assignee: Amkor Technology, Inc.
    Inventors: Hee Sung Kim, Yeoung Beom Ko, Dae Byoung Kang, Jae Jin Lee, Joon Dong Kim, Dong Jean Kim
  • Patent number: 9996120
    Abstract: A printed circuit board (PCB) module that includes a processor package, an upper PCB and a lower PCB. The processor package includes a processor substrate and a processor. An upper socket is disposed on a lower surface of the upper PCB, and the upper socket electrically connects to a top electrical interface on the upper surface of the processor substrate. The lower PCB electrically interfaces with a bottom electrical interface on a lower surface of the processor substrate.
    Type: Grant
    Filed: March 31, 2016
    Date of Patent: June 12, 2018
    Assignee: EMC IP Holding Company LLC
    Inventor: Jean-Philippe Fricker
  • Patent number: 9954316
    Abstract: A module retracting type installing and uninstalling device, including a base, a slide block, a pressing cover and a bail. The slide block includes a long-strip-shaped slide block base body, and U-shaped grooves are respectively formed in the middle part of two side walls of the slide block base body. A square hole is formed at the rear end of the slide block base body, and is sheathed onto a triangular lock catch of the base. First and second rotating shafts of the bail are respectively located in two snapping grooves at the front end of the base, and third and fourth rotating shafts are respectively located in the U-shaped grooves. The pressing cover includes a square pressing cover base body, and a pressure resilient sheet attached to the upper surface of the slide block and being pressed to the base.
    Type: Grant
    Filed: December 18, 2014
    Date of Patent: April 24, 2018
    Assignee: Wuhan Telecommunication Devices Co., Ltd.
    Inventors: Beili Song, Benqing Quan, Yi Jiang
  • Patent number: 9905303
    Abstract: In one implementation, flash memory chips are provided with an operating power supply voltage to substantially match a power supply voltage expected at an edge connector of a dual inline memory module. The one or more of the flash memory chips and a memory support application integrated circuit (ASIC) may be mounted together into a multi-chip package for integrated circuits. The one or more flash memory chips and the memory support ASIC may be electrically coupled together by routing one or more conductors between each in the multi-chip package. The multi-chip package may be mounted onto a printed circuit board (PCB) of a flash memory DIMM to reduce the number of packages mounted thereto and reduce the height of the flash memory DIMM. The number of printed circuit board layers may also be reduced, such as by integrating address functions into the memory support ASIC.
    Type: Grant
    Filed: April 19, 2016
    Date of Patent: February 27, 2018
    Assignee: Virident Systems, LLC
    Inventors: Ruban Kanapathippillai, Kenneth Alan Okin
  • Patent number: 9867297
    Abstract: According to one embodiment, a storage device includes an enclosure, and a circuit board assembly in the enclosure. The circuit board assembly includes a first circuit board, a second circuit board opposed to the first circuit board, a third circuit board opposed to the second circuit board, a first connector connecting the first and second circuit boards to each other, a second connector connecting the second and third circuit boards to each other, and is offset to the first connector in a plane direction, a first spacer between the first and second circuit boards, and a second spacer between the second and third circuit boards. The first spacer includes a support body at a position opposed to the second connector and in contact with the first and second circuit boards.
    Type: Grant
    Filed: February 22, 2016
    Date of Patent: January 9, 2018
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventors: Akitoshi Suzuki, Yoshiharu Matsuda
  • Patent number: 9812187
    Abstract: A memory system includes a memory controller and a memory module. The memory controller is arranged for selectively generating at least a clock signal and an inverted clock signal. The memory module includes a first termination resistor, a second termination resistor and a switch module, where a first node of the first termination resistor is to receive the clock signal, a second termination resistor, wherein a first node of the second termination resistor is to receive the inverted clock signal, and the switch module is arranged for selectively connecting or disconnecting a second node of the second termination resistor to a second node of the first termination resistor.
    Type: Grant
    Filed: February 5, 2017
    Date of Patent: November 7, 2017
    Assignee: MEDIATEK INC.
    Inventors: Shang-Pin Chen, Bo-Wei Hsieh
  • Patent number: 9780471
    Abstract: A printed circuit board arrangement and a method for mounting a product to a main printed circuit board (100) at a substantially perpendicular angle, the printed circuit board arrangement comprises a main printed circuit board (100) comprising an elongated slot (102), and a product (128) comprising a connector portion (130) configured to be inserted into the elongated slot (102). The connector portion (130) is such that the product (128) may be attached at a substantially perpendicular angle to the main printed circuit board (100). The elongated slot (102) comprises a protrusion (104), and the connector portion (130) comprises a spring portion (132) configured to engage with the protrusion (104) when the connector portion (130) is inserted into the elongated slot (102). This results in a force pressing the connector portion (130) of the product (128) to at least one side wall of the elongated slot (102).
    Type: Grant
    Filed: May 18, 2015
    Date of Patent: October 3, 2017
    Assignee: PHILIPS LIGHTING HOLDING B.V.
    Inventor: Nicolaas Antonie Van Rijswijk
  • Patent number: 9755686
    Abstract: A method for preparing an alloy encapsulation mobile phone protective case is provided, which includes steps of: selecting an alloy material as an edging material; CNC machining; making a surface treatment; drying; spraying and molding for shaping. The alloy encapsulated mobile phone protective case is formed after shaping the alloy outer frame and the soft rubber inner molding layer, which not only simplifies the assembly, but also strengthens the strength and hardness of the structure, thus effectively avoiding the splitting phenomenon caused by strong impact. Due to the combination of the alloy material with the soft rubber inner molding layer, the protective case has a certain flexibility, abrasion resistance, high strength and high formability. The rigidity of the protective case is in a range from 50° to 90°and has strong resilient force and curvature, which not only can effectively protect the mobile phone, but also has long service life.
    Type: Grant
    Filed: July 2, 2015
    Date of Patent: September 5, 2017
    Assignee: Shenzhen Qilixin Plastic Precision Mould Co., Ltd.
    Inventor: Qifeng Zhang
  • Patent number: 9720189
    Abstract: An optical fiber connector includes a cartridge, a latch and a pair of elastic members. The cartridge has two opposite sidewalls and a wire terminal, and each sidewall has a runner and a containing slot disposed on a side of the wire terminal. The latch includes a pull handle, a sliding member having two opposite extending arms, and a stop portion disposed at each extending arm. The pull handle is capable of rotatably connecting the sliding member, and each extending arm is slidably combined with the cartridge through each runner. Each elastic member has an end abutting each containing slot and the other end abutting each stop portion. Therefore, the space of the cartridge is increased, and the total volume of the optical fiber connector is reduced.
    Type: Grant
    Filed: August 1, 2016
    Date of Patent: August 1, 2017
    Inventor: Chen-Yueh Shih
  • Patent number: 9699909
    Abstract: A wiring board with a built-in electronic component includes a core substrate, an electronic component in the substrate, a first upper-layer structure on first surface of the substrate, a second upper-layer structure on second surface of the substrate, and via conductors in the substrate and first upper-layer structure such that the via conductors are connected to an electrode of the component. The substrate has an accommodating layer, a first connection layer on first surface of the accommodating layer, and a second connection layer on second surface of the accommodating layer, the accommodating layer includes inner wiring and insulation layers and has cavity accommodating the component, the first connection layer includes inner wiring and insulation layers, and the second connection layer includes inner wiring and insulation layers such that the second connection layer includes greater number of inner wiring and insulation layers than the first connection layer.
    Type: Grant
    Filed: August 8, 2014
    Date of Patent: July 4, 2017
    Assignee: IBIDEN CO., LTD.
    Inventors: Naohito Ishiguro, Yasushi Inagaki