Abstract: A focal plane array includes a mosaic integrated circuit device having a plurality of discrete integrated circuit tiles mounted on a motherboard. The focal plane array includes an optically continuous detector array electrically connected to the mosaic integrated circuit device with an interposer disposed therebetween. The interposer is configured to adjust a pitch of the continuous detector array to match a pitch of each of the plurality of discrete integrated circuit tiles so that the optical gaps between each of the plurality of integrated circuit tiles on the motherboard are minimized and the detector array is optically continuous, having high yield over the large format focal plane array.

Abstract: A wall-plate system having a wall-plate adapted to accommodate a printed circuit board assembly (PCBA) coupled with the wall-plate and may comprise a mounting bracket. The PCBA may include one or more chip packages and/or other components that extend into cavities in the mounting bracket after installation, the cavities located on the mounting bracket to accommodate chip packages and/or other components. The wall-plate may include snaps to couple with the mounting bracket, the snaps extending from an interior surface of the wall-plate, the snaps located away from edges of the wall-plate towards a center of the wall-plate. The mounting bracket may comprise openings to couple with a device in a junction box and/or with the junction box. The wall-plate may comprise, e.g., one or more battery mounts and the mounting bracket may have a shape to accommodate extension by the battery mounts into a plane of the mounting bracket.

Abstract: An electronic control device includes a plurality of drive control components and a substrate. The plurality of drive control components are grouped into systems. Each of systems is configured to control a control target independently. The substrate is divided into areas, corresponding to the systems, on which at least a part of the drive control components is mounted by each of the systems, and has layers stacked.

Abstract: A bonding structure includes: a plurality of carbon nanotubes; a first bonded member; and a first metal sintered compact bonding first end portions of the plurality of carbon nanotubes and the first bonded member, wherein the first metal sintered compact enters spaces between the first end portions of the plurality of carbon nanotubes, and bonds to the plurality of carbon nanotubes while covering side faces and end faces of the first end portions of the plurality of carbon nanotubes.

Abstract: A programmable logic controller capable of maintaining waterproofness or dustproofness includes a base unit with a substrate, a base case housing the substrate, and at least one holding part to hold a connection unit which is one of a plurality of module units. The connection unit includes a module-side connector, an engagement mechanism to be detachably engaged with the at least one holding part, and a module case with a fitting tenon to be engaged with the base case. The programmable logic controller includes an elastic member to apply a force in a first direction, which is a direction in which the connection unit moves away from the base unit, thereby pressing the engagement mechanism of the connection unit against the at least one holding part of the base unit, and a sealing member to seal a gap between the base case and the fitting tenon of the module case.

Abstract: A portable electronic device including a first body, a second body, a stand, and a hinge structure is provided. The stand has a first pivot part and a second pivot part opposite to the first pivot part, wherein the first pivot part is pivotally connected to the first body, and the second body is pivotally connected to the second pivot part. The hinge structure includes a first bracket secured to the second body, a second bracket secured to the second pivot part of the stand, a first movable base, a first shaft secured to the first bracket and pivoted to the first movable base, a second movable base, a second shaft secured to the first movable base and pivoted to the second movable base, and a sliding shaft fixed to the second movable base and slidably connected to the second bracket.

Abstract: A protective enclosure for an electronic control unit (ECU) to minimize risk of environmental intrusion includes a base portion, a first housing, a second housing, a first gasket, a vibration attenuating insert, a first electrical connector, a second electrical connector, a third electrical connector, and a tether. The first housing is sealably assembled onto the base portion, and the first housing and the base portion define a first chamber to house the telematics module. The second housing and the base portion define a second chamber. The tether attaches the base portion and the second housing.

Abstract: An autonomous mobile vehicle includes an AGV having a base, a motor coupled to the base, a wheel driven by the motor for moving the AGV, a battery coupled to the motor to power the motor, and an AGV controller for controlling movement of the AGV. The autonomous mobile vehicle includes a platform assembly coupled to the base. The platform assembly includes a frame defining a cavity and a support plate supported by the frame configured to support a collaborative manipulator. The platform assembly includes a collaborative manipulator controller received in the cavity configured to be operably coupled to the collaborative manipulator to actuate the collaborative manipulator in accordance with a control scheme. The platform assembly includes a safety controller received in the cavity electrically coupled to the battery of the AGV to control a power supply to the collaborative manipulator controller.

Abstract: A semiconductor device includes: an insulated circuit substrate including first and second conductive layers on a top surface side; a first semiconductor chip mounted on the first conductive layer; a second semiconductor chip mounted on the second conductive layer; a printed circuit board including a first lower-side wiring layer arranged to be opposed to the first semiconductor chip, and a second lower-side wiring layer arranged to be opposed to the second semiconductor chip, the printed circuit board being provided with a curved part curved toward the insulated circuit substrate; a first connection member arranged to connect the first semiconductor chip with the first lower-side wiring layer; a second connection member arranged to connect the second semiconductor chip with the second lower-side wiring layer; and a third connection member arranged to connect the first conductive layer with the second lower-side wiring layer at the curved part.

Abstract: A semiconductor package includes a circuit substrate, a die, a frame structure, and a heat sink lid. The die is disposed on the circuit substrate and electrically connected with the circuit substrate. The die includes two first dies disposed side by side and separate from each other with a gap between two facing sidewalls of the two first dies. The frame structure is disposed on the circuit substrate and surrounding the die. The heat sink lid is disposed on the die and the frame structure. The head sink lid has a slit that penetrates through the heat sink lid in a thickness direction and exposes the gap between the two facing sidewalls of the two first dies.

Abstract: An electrical circuit device comprises at least one first power electronics module, at least one second power electronics module, a circuit board and a supporting structure, wherein the power electronics modules each lie by a contact side against an associated contact surface of the supporting structure and have one or more terminal pins connected to the circuit board on and/or next to a connection side situated opposite the contact side, wherein the first power electronics module has a lesser thickness between the contact side and the connection side than the second power electronics module, wherein the contact surface against which the contact side of the first power electronics module bears has a lesser distance from the circuit board than the contact surface against which the contact side of the second power electronics module bears, and/or wherein the terminal pins of the first power electronics module are longer than the terminal pins of the second power electronics module.

Abstract: A sub-module is disclosed. A sub-module according to an embodiment of the present invention comprises a short-circuiting control part. The short-circuiting control part comprises a movable member slidably coupled to a frame on which capacitor assemblies are seated. A variable connector is coupled to the movable member. Moreover, a plurality of short-circuiting blocks are arranged on the frame while being spaced away from each other. When the movable member has slid, the variable connector comes into contact with one or more short-circuiting blocks adjacent to each other to be electrically conductive. The short-circuiting blocks are connected to the capacitor assemblies, respectively, to be electrically conductive. Therefore, a plurality of capacitor elements can be short-circuited simultaneously only by moving the movable member.

Abstract: A detachable extension socket assembly includes an extension socket body and a frame. The frame is configured for fixing to an external component. The frame is provided with a perforating hole. The extension socket body is equipped with a position limiting part. The extension socket body at least partially passes through the perforating hole. The position limiting part abuts against the frame. In the present invention, the frame is configured for fixing to a table, and the extension socket body is detachably connected to the frame. Therefore, when the extension socket body is needed in other positions, the extension socket body can be separated from the frame, facilitating movement of the extension socket body, and solving the existing problems that installing the extension socket on a wooden table with screws can easily cause the table to crack around the screws and the installation is cumbersome.

Abstract: A package that includes a substrate, an integrated device coupled to the substrate, an encapsulation layer located over the substrate, at least one encapsulation layer interconnect located in the encapsulation layer, and a metal layer located over the encapsulation layer. The substrate includes at least one dielectric layer and a plurality of interconnects. The encapsulation layer interconnect is coupled to the substrate. The metal layer is configured as an electromagnetic interference (EMI) shield for the package. The metal layer is located over a backside of the integrated device.

Abstract: A semiconductor device package and a method for manufacturing the semiconductor device package are provided. The semiconductor device package includes a first substrate, a second substrate and an interconnection. The second substrate is arranged above the first substrate and has an opening. The interconnection passes through the opening and connects to the first substrate and the second substrate.

Abstract: Data storage systems may include a chassis with a first end and a second end. One or more fans may be positioned at the first end of the chassis. At least one storage media device may be positioned inside the chassis and behind the at least one fan relative to the first end of the chassis. A carrier including a frame may be coupled to the at least one storage media device, where the frame includes an elongated member extending away from the storage media device toward the first end of the chassis. Other aspects, embodiments, and features are also included.

Abstract: A power module that includes a semiconductor chip configured to generate heat, a metal layer electrically connected to the semiconductor chip to allow current to flow therethrough, a cooling channel facing the metal layer for dissipating heat out of the semiconductor chip, and a resin layer interposed between the metal layer and the cooling channel and integrally formed in an internal space of the power module.

Abstract: A system for the assembly of circuit boards is shown. The system includes an assembly device and a circuit board. The assembly device comprises a substantially planar base plate and guide members. The circuit board includes multiple rigid portions connected by flexible members. The guide members extend into a space partially or completely enclosed in the horizontal direction by the circuit board, and determine the position and orientation of the rigid portions relative to the base plate.

Abstract: A power semiconductor apparatus provided with a first conductor section connected to a direct-current terminal for transmitting direct-current power; a second conductor section connected to an alternating-current terminal for transmitting alternating-current power; a semiconductor element which is disposed between the first conductor section and the second conductor section and is for converting the direct-current power to the alternating-current power; and an interposition section disposed between the first conductor section and the second conductor section, in which the interposition section has a first conductor layer connected to the first conductor section, a second conductor layer connected to the second conductor section, and a plurality of insulation layers disposed between the first conductor layer and the second conductor layer, with one or a plurality of third conductor layers sandwiched between the plurality of insulation layers.

Abstract: Electronic equipment includes an option equipment attachment portion at a bottom portion of the electronic equipment. The electronic equipment includes an optional printed circuit board and a lower shield member covering the optional printed circuit board with a part of the optional printed circuit board exposed from the lower shield member. The lower shield member includes a recess including walls as inner walls. A region of the optional printed circuit board exposed from the lower shield member 34 is located at a bottom portion of the recess and is surrounded by the walls of the lower shield member.

Abstract: A method for producing a package substrate for mounting a semiconductor device includes: forming a first substrate by forming a laminate in which a first metal layer that has a thickness of 1 ?m to 70 ?m and that is peelable from a core resin layer, a first insulating resin layer, and a second metal layer are arranged on both sides of the core resin layer having a thickness of 1 ?m to 80 ?m, and heating and pressurizing the laminate simultaneously; forming a pattern on the second metal layer; forming a second substrate by heating and pressurizing a laminate formed by arranging a second insulating resin layer and a third metal layer on a surface of the second metal layer; and peeling, from the core resin layer, a third substrate including the first metal and insulating resin layers, the second metal and insulating layers, and the third metal layer.

Abstract: The embodiment of the disclosure relates to an elastic wave stress tensor double-dot product seismic imaging method and device. The method comprises: obtaining a decoupled particle vibration velocity vector wavefield by utilizing the existing decoupled wave equation method for the receiver wavefield; then obtaining a decoupled pseudo-stress wavefield by constructing the decoupled pseudo-stress equation by using the obtained decoupled particle vibration velocity vector wavefield; and finally computing a source second-order stress tensor wavefield and the decoupled receiver second-order stress tensor wavefield by using the double-dot product cross-correlation imaging condition algorithm, to obtain the final scalar imaging results. With the embodiment of the present disclosure, the combined P-wave and S-wave stress exploration can be realized, therefore, the obtained imaging results can be used to accurately predict the risk of gas exploration.

Abstract: A power semiconductor module has a base plate with a housing and a switching device. The switching device has a substrate and a connecting device with a first and a second main face. A group of power semiconductor components is arranged on a conductor track of the substrate, and has a group midpoint. A pressure device is formed on the substrate in the normal direction to exert pressure, which pressure device has a pressure body and a pressure inducing body, wherein a pressure element is arranged protruding from the pressure body, wherein the pressure element presses onto a pressure section of the second main face of the connecting device, and wherein the pressure inducing body has a pressure transmission section with a pressure transmission point.

Abstract: An antenna assembly includes a base, a modem, a top lid and a housing. The base is composed of an aluminum material. The modem is disposed on the base. The top lid is for the base, and the top lid includes at least one antenna element disposed on an exterior surface. The housing covers the top lid and base. The top lid acts as an electro-magnetic barrier for the modem. A communication cable is connected to the modem at one end and extending to and connected to a vehicle internal router with a vehicle modem at the other end.

Abstract: A heat dissipation system for an antenna assembly for a vehicle is disclosed that provides enhanced heat removal attributes and that provides heat transfer from various components to a heat sink through different heat transfer flow paths to reduce the transfer of heat from high heat producing components to heat sensitive components. Improved heat insulation components can be added to maximize the thermal isolation between heat producing components and to prevent heat transferred from the vehicle into the antenna assembly.

Abstract: An apparatus for securing an electronic component to a DIN rail including an electronic component, a latching system positioned on an end of the electronic component adapted for attachment to the DIN rail, wherein the latching system is made of a plastic material, wherein the DIN rail has a flat upper surface with two legs extending downwardly from, and perpendicular to, the flat upper surface, and a flange extends outwardly from each leg, wherein the latching system includes a recess, an upper surface above the recess having an angled slot positioned in the upper surface adapted to receive an upper flange of the DIN rail, and a lower surface below the recess adapted to have an end of a lower flange of the DIN rail positioned thereover.

Abstract: A power electronic arrangement has a power converter module including a switching device with a substrate with a first and a second DC voltage conductor track and a first and a second DC voltage terminal element connected in an electrically conducting manner with the correct polarity, and has a first and a second DC voltage connection element. The first DC voltage terminal element is connected to the first DC voltage connection element in an electrically conducting manner with the correct polarity by means of a first materially-bonded connection. The second DC voltage terminal element is connected to the second DC voltage connection element in an electrically conducting manner with the correct polarity by means of a second materially-bonded connection. The second DC voltage terminal element or the second DC voltage connection element has a continuous welding cavity in the region of the first connection.

Abstract: A method for implementing a programmable device is provided. The method may include extracting an underlay from an existing routing network on the programmable device and then mapping a user design to the extracted underlay. The underlay may represent a subset of fast routing wires satisfying predetermined constraints. The underlay may be composed of multiple repeating adjacent logic blocks, each implementing some datapath reduction operation. Implementing circuit designs in this way can dramatically improve circuit performance while cutting down compile times by more than half.

Abstract: Packaged semiconductor devices are disclosed, comprising: a semiconductor die having a top major surface with a plurality of contact pads thereon, and four sides, wherein the sides are stepped such that a lower portion of each side extends laterally beyond a respective upper portion; encapsulating material encapsulating the top major surface and the upper portion of each of the sides wherein the semiconductor die is exposed at the lower portion of each of the sides; a contact-redistribution structure on the encapsulating material over the top major surface of the semiconductor die; a plurality of metallic studs extending through the encapsulating material, and providing electrical contact between the contact pads and the contact-redistribution structure. Corresponding methods are also disclosed.

Abstract: A compound acoustic wave filter device comprises a support substrate having an including two or more circuit connection pads. An acoustic wave filter includes a piezoelectric filter element and two or more electrodes. The acoustic wave filter is micro-transfer printed onto the support substrate. An electrical conductor electrically connects one or more of the circuit connection pads to one or more of the electrodes.

Abstract: A memory device that may include a primary PCB that is configured to support one or more SSD units and one or more volatile memory units; a secondary PCB that is configured to mechanically support multiple supercapacitors; wherein the secondary PCB comprises an aperture and an array of heat different reduction elements configured to reduce temperature differences between different parts of the secondary PCB; a board to board connector for electrically coupling at least one electrical conductor of the primary PCB to at least one electrical conductor of the secondary PCB; a mechanical interface that has a base, a top section and a threaded hole that passes through the base and the top section; wherein the base is wider than the top section; wherein the top section is shaped and sized to enter the aperture of the secondary PCB; wherein the base is configured to support the secondary PCB when the top section enters the aperture.

Abstract: A method for manufacturing a multilayer ceramic electronic device includes punching out a ceramic sheet by one of left and right side surfaces of a laminated body so as to form a side margin part on the one of the left and right side surfaces of said laminated body; and punching out another ceramic sheet by another of the left and right side surfaces of the laminated body so as to form a side margin part on the another of the left and right side surfaces of said laminated body, thereby forming a ceramic main body having the laminated body and the pair of side margin parts that respectively cover the left and right side surfaces of the laminated body. The width W is greater than the length L in the multilayer ceramic electronic device.

Abstract: A housing with an open receiving chamber which has a circumferential edge in the form of a creepage barrier at an open upper face is disclosed. The receiving chamber is filled with a casting compound, and the hardened casting compound forms a concave surface relative to the circumferential edge at the open upper face. A sensor is also disclosed that includes such a housing. In addition, a method for casting an open receiving chamber of such a housing is disclosed. The open receiving chamber has an opening at one end leading to an enclosed interior adjoining the open receiving chamber. The enclosed interior is filled with the casting compound, and the open upper face of the receiving chamber has a varying height where the upper face transitions into the enclosed interior.

Abstract: A strengthening member for use with a plug-in module assembly includes a planar portion which extends across a width of a portion of a circuit board of the plug-in module assembly. The planar portion has a leading edge which approximately aligns with a leading surface of the circuit board, a trailing edge, and side edges which extend between the leading edge and the trailing edge. First mounting portions extend from the side edges and have first mounting openings. A second mounting portion extends from the trailing edge and has second mounting openings. First mounting hardware is positioned in the first mounting openings. The first mounting hardware cooperates with the first mounting portions and the circuit board. Second mounting hardware is positioned in the second mounting openings. The second mounting hardware cooperates with the second mounting portions, the circuit board and a cover of the plug-in module assembly.

Abstract: A semiconductor module includes a resin case housing a semiconductor element; an insulating layer extending outward from the resin case; and a first external connection terminal extending outward from the resin case, arranged above the insulating layer so as to face the insulting layer, the first external connection terminal having a non-contact portion that is not in contact with the insulating layer in a thickness direction of the insulating layer at a position overlapping the insulating layer in a plan view.

Abstract: An optical module unlocking apparatus includes: a base, a sliding member, a driving piece, and an elastic piece. The sliding member is slidably disposed on the base along an insertion direction. The driving piece is rotatably connected to the base, the other end of the sliding member is connected to the driving piece, and the driving piece can rotate from a locked state to an unlocked state relative to the base under an action of external force, and drive the sliding member to move relative to the base along the insertion direction. A second connecting part is disposed on the driving piece. Because the driving piece is located outside a cage, space for disposing the elastic piece on the driving piece is sufficient, and the driving piece does not need to fit a spring plate. This simplifies a structure of the optical module and improves processing efficiency.

Abstract: A robust, reliable, and efficient UHD HDR Internet Protocol IP client device, such as a set top box, receives content, for example, from a cable service provider so that the content can be displayed to a compatible display device with improved visual effect. The content is 4K or higher content that requires UHD/HDR for a satisfactory user experience. The UHD provides for an improved resolution of the content while HDR provides for a more intense or greater contrast range of the content when displayed on a compatible display device.

Abstract: A display panel and a display device are provided. The display panel includes a display area and a non-display area surrounding the display area; a first substrate and a second substrate disposed opposite to the first substrate; a plurality of supporting pillars disposed between the first substrate and the second substrate and located in the display area; and an adhesive layer disposed between the first substrate and the second substrate and located in the non-display area. The second substrate includes a plurality of film layers, the plurality of film layers include a polarizer and at least one first layer, and a thickness of a portion of the at least one first layer located in the display area is greater than a thickness of a portion of the at least one first layer located in the non-display area.

Abstract: A wearable product includes a display system, a rear housing, a middle frame, a printed circuit board, and a conductive component. The rear housing is located on a non-light-emitting side of the display system. The middle frame is located between the display system and the rear housing, and is a hollow frame structure. The middle frame includes a metal frame and a plastic frame nested in the metal frame and connected to the metal frame. The plastic frame is connected to the display system and the rear housing in a sealing manner to form an accommodation cavity. The printed circuit board is located in the accommodation cavity. A part of the conductive component is located in the accommodation cavity and electrically connected to the printed circuit board, and the other part of the conductive component passes through the plastic frame to be electrically connected to the metal frame.

Abstract: Various implementations include portable speakers configured to adjust audio output based on detected input connections. In certain cases, a portable speaker includes: an enclosure housing: at least one electro-acoustic transducer for providing an audio output; a processor coupled with the transducer; an audio input module coupled with the processor for receiving audio input signals; and a battery configured to power the at least one transducer, the processor, and the audio input module; an input channel for receiving a hard-wired audio input connection; and at least one wireless input channel for receiving an audio input from a source device via a wireless connection, where the processor is configured to: adjust an audio signal received from the hard-wired audio input connection if a source device is already connected via the wireless connection.

Abstract: An electronic device is provided that includes a PCB and a cooling system adapted to pull heat away from a first side of the PCB and dissipate the heat through a back surface of the electronic device. The cooling system includes a heat pipe that wraps around PCB. The cooling system further includes an active heat transfer device positioned adjacent to a second portion of the heat pipe, the active heat transfer device being adapted to absorb heat through a first surface and release the heat through a second surface of the active heat transfer device. The cooling system further includes a first passive heat transfer element that forms the back surface of the electronic device and that conducts the heat received from the active heat transfer device out of the electronic device.

Abstract: An intelligent power module includes: a heat radiation device; an attachment frame disposed on a mounting surface of the heat radiation device; a power semiconductor module mounted on the attachment frame and configured to seal a semiconductor device; and a drive circuit part mounted on the power semiconductor module via a heat insulating sheet and configured to drive the power semiconductor module.

Abstract: A chassis assembly includes a rack chassis and a block assembly. The rack chassis includes a left side panel and a right side panel that are made from one continuous single material. The left side panel includes a left rail guide, and the right side panel includes a right rail guide. The block assembly is adapted to slide into the rack chassis and includes a top cover, a left sidewall, and a right sidewall that are interconnected. The left sidewall of the block assembly includes a left rail adapted to slide into the left rail guide when the block assembly is located leftmost of the rack chassis. The right sidewall of the block assembly includes a right rail that is adapted to slide into the right rail guide when the block assembly is located rightmost of the rack chassis.

Abstract: A solid state drive apparatus includes a case including a base and side walls extending upward along a circumference of the base, an electrostatic prevention structure of a metal pillar spaced apart from the side walls and protruding from at least a partial surface of the base and an electrostatic absorbing member on at least a partial surface of the metal pillar, a package substrate module mounted on the electrostatic prevention structure in the case, and a cover covering the case and the package substrate module.

Abstract: A method of manufacturing a semiconductor package structure is provided. The method includes providing a first carrier, forming a patterned buffer layer over the first carrier, forming a first redistribution structure that includes forming a first dielectric layer on the patterned buffer layer, after an electrical testing by applying an electric signal towards the first redistribution structure, removing the first carrier, removing portions of the first dielectric layer, resulting in a patterned first dielectric layer, the patterned first dielectric layer exposing portions of the first circuit layer, removing the exposed portions of the first circuit layer, using the patterned first dielectric layer as a mask, resulting in a patterned first circuit layer, and forming an electric conductor in a recess defined by the patterned first dielectric layer and the patterned first circuit layer.

Abstract: A computing device includes a bezel and an enclosure. The bezel includes an air circulation component and a heater apparatus. The enclosure includes a plurality of hardware components, and the bezel is affixed to a frontside of the enclosure and configured to heat an internal volume of the enclosure.

Abstract: Disclosed is a microelectronic device assembly comprising a substrate having conductors exposed on a surface thereof. Two or more stacks of microelectronic devices are located on the substrate, and microelectronic devices of the stacks are connected to vertical conductive paths external to the stacks and extending to the substrate and to lateral conductive paths extending between the stacks. Methods of fabrication are also disclosed.

Abstract: A portable keyboard structure includes a plastic substrate, multiple metal support plates, a plastic bottom cover and multiple buffer members. The plastic substrate has a mounting surface, the metal support plates are mounted on corners of the mounting surface, the plastic bottom cover is disposed corresponding to the mounting surface and in conjunction with the plastic substrate clamps and secures the metal support plates, and the buffer members are respectively configured corresponding to the metal support plates. Each buffer member includes a fixing portion and a protection portion, the fixing portion are respectively disposed at the corresponding metal support plates, and the protection portions respectively envelop corners of the plastic substrate. Thus, the weight of the keyboard structure is significantly reduced, the production cost is lowered, and certain structural strength and fall-resistance are maintained at the same time.

Abstract: An apparatus and method for signaling and transmitting data through an optical link is described. The apparatus may include a connector including a first plurality of contacts compatible with an enhanced SFP (SFP+) connector. The connector further includes an additional contact formed at a space adjacent to the first plurality of contacts. A tone generator couples to the additional contact to receive a first signal and to generate a first distinct tone indicative of the first signal for transmission via the additional contact. The method may include generating a first distinct tone indicative of a first signal providing control or status of an apparatus and transmitting or receiving a differential data signal over a portion of a first plurality of contacts compatible with an enhanced SFP (SFP+) connector. The first distinct tone is transmitted over the additional contact formed in a space adjacent to the first plurality of contacts.

Abstract: The disclosure relates to modem and router modules for use with digital display systems, including televisions. A modem module is configurable to attach to a set-top box, a set-back box, directly to a digital display, or may even be integrated into display equipment. Router functions and ports can be integrated into the module to provide for networking of additional devices in proximity to the module and/or display, using either or both wired and wireless access technologies. Systems including the module convert power to the appropriate forms for delivery to the different devices, hardware, and components associated with the module. The modem and routing functions are configurable to provide separate security domains to isolate or direct traffic among the various networked devices.