Module Patents (Class 361/728)
  • Patent number: 10389235
    Abstract: An apparatus for power conversion includes a transformation stage for transforming a first voltage into a second voltage. The transformation stage includes a switching network, a filter, and a controller. The filter is configured to connect the transformation stage to a regulator. The controller controls the switching network.
    Type: Grant
    Filed: May 9, 2017
    Date of Patent: August 20, 2019
    Assignee: pSemi Corporation
    Inventor: David Giuliano
  • Patent number: 10356908
    Abstract: An electronic component containing substrate includes a substrate, a first electronic component mounted on a main surface of the substrate, and an embedment layer provided on the main surface of the substrate and embedding the first electronic component. The first electronic component is a multilayer ceramic capacitor including a ceramic multilayer body including a layered portion and a first side portion and a second side portion between which the layered portion lies and having two end surfaces opposed to each other and side surfaces connecting the two end surfaces to each other. The first side portion is located between the layered portion and the main surface of the substrate in a direction of thickness which is a direction perpendicular to the main surface of the substrate. The embedment layer is smaller in elastic modulus than the substrate.
    Type: Grant
    Filed: February 28, 2017
    Date of Patent: July 16, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Kazuo Hattori, Isamu Fujimoto, Masaru Takahashi, Choichiro Fujii, Hirobumi Adachi
  • Patent number: 10331915
    Abstract: Tamper-respondent assemblies, electronic assembly packages, and methods of fabrication are provided which include multiple, discrete tamper-respondent sensors that overlap, at least in part, and facilitate defining a secure volume about one or more electronic components to be protected, such as an electronic assembly. The tamper-respondent sensors include a first tamper-respondent sensor and a second tamper-respondent sensor, which may be similarly constructed or differently constructed. In certain embodiments, the tamper-respondent sensors wrap, at least in part, over an electronic enclosure, and in other embodiments, the tamper-respondent sensors cover, at least in part, an inner surface of an electronic enclosure to facilitate defining a secure volume in association with a multilayer circuit board to which the electronic enclosure is mounted.
    Type: Grant
    Filed: November 21, 2017
    Date of Patent: June 25, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: William L. Brodsky, John R. Dangler, Phillip Duane Isaacs, David C. Long, Michael T. Peets
  • Patent number: 10237992
    Abstract: An electronic device housing includes a first housing, a second housing, and a foaming buffer unit. The first housing has a first inner surface, and the first inner surface has a first abutting area. The second housing has a second inner surface, where the second inner surface has a second abutting area, the second housing is connected to the first housing, and the second inner surface is opposite to the first inner surface. The foaming buffer unit is disposed between the first inner surface and the second inner surface, and abuts against the first abutting area of the first inner surface and the second abutting area of the second inner surface.
    Type: Grant
    Filed: February 8, 2018
    Date of Patent: March 19, 2019
    Assignee: PEGATRON CORPORATION
    Inventor: Chien-Sheng Lo
  • Patent number: 10226693
    Abstract: Videogame controllers with smart trigger stops may include: a housing including a trigger, the trigger movable along a path of travel; a sensor configured to detect the position of the trigger and to generate a signal representing trigger position; a processor configured to interpret signals generated by the sensor and cause an output signal to be transmitted to a gaming console; a trigger-stop that is movable between an engaged position and a disengaged position, the trigger-stop in the disengaged position allowing the trigger to move along the entire path of travel, the trigger-stop in the engaged position blocking the trigger from moving along the entire path of travel; and a switch coupled with the housing and the trigger-stop, wherein movement of the trigger-stop from the disengaged position to the engaged position flips the switch and causes the processor to map received signals to generated signals in a different manner.
    Type: Grant
    Filed: March 2, 2017
    Date of Patent: March 12, 2019
    Assignee: Performance Designed Products LLC
    Inventors: Brad Strahle, Yannik Wiggemans
  • Patent number: 10206296
    Abstract: A protective case for an electronic device includes a main housing and a lid. The main housing and lid are removably joined to define a water tight volume receiving an electronic device. The electronic device includes an earpiece having a speaker and microphone positioned thereon. The lid includes an earpiece port formed therein proximate the earpiece of the electronic device. A membrane assembly is attached to the lid by a compliant adhesive, the membrane assembly transmitting sound to the ear piece port. A noise isolating assembly attached to the lid. The noise isolating assembly is positioned about a periphery of the earpiece isolating the earpiece from an additional sound source.
    Type: Grant
    Filed: September 1, 2017
    Date of Patent: February 12, 2019
    Assignee: Catalyst Lifestyle Limited
    Inventors: Joshua Wright, June Lai
  • Patent number: 10194552
    Abstract: An enclosure for holding a printed circuit board includes a housing portion of metal containing at least about 90% magnesium and formed by a semi-solid metal casting process of thixomolding, and including a wall defining an opening to form a spring arm including a tabular portion and a contact pad. The spring arm may be deflected from the wall to provide a contact pressure biasing the first contact pad in physical and electrical contact with the printed circuit board and to provide an electrical grounding connection therebetween. Alternative embodiments are also provided with the spring arm transverse to the wall and with a two spring arms on opposite sides of the printed circuit board. A method of forming a housing portion of an enclosure for holding a printed circuit board is also provided, and which includes steps of thixomolding magnesium to form the housing portion including a spring arm.
    Type: Grant
    Filed: January 18, 2018
    Date of Patent: January 29, 2019
    Assignee: Visteon Global Technologies, Inc.
    Inventors: Chakrapani Nandyala, Marcus Walter Koch
  • Patent number: 10194540
    Abstract: A supporting device of a flexible display panel, and display apparatus are provided. The supporting device includes a plate-like support component and a curvature adjusting component combined with the plate-like support component, wherein the plate-like support component includes two opposite outer peripheral portions, at least one portion of the curvature adjusting component is disposed between the two outer peripheral portions, and a structure of the curvature adjusting component is configured to enable the two outer peripheral portions of the plate-like support component to be bent toward the side of the plate surface provided with the plate-like support component, such that a curved support surface having a varying curvature can be obtained.
    Type: Grant
    Filed: September 9, 2016
    Date of Patent: January 29, 2019
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventor: Li Sun
  • Patent number: 10191520
    Abstract: An electronic apparatus having function of switching node modules includes at least two node modules, a shared I/O module having a first I/O interface connected with an external device, a second I/O interface electrically connected with the at least two node modules and a switching module connecting the at least two node modules. The shared I/O module is used to cause the shared I/O module to communicate with one node module in the at least two node modules through the second I/O interface according to a selection signal when receiving the selection signal. The shared I/O module integrates multiple communication ports and switches the node module communicating with the shared I/O module according to a selection signal, the shared I/O module also can be designed as a shared I/O module combined by multiple different ports in advance to perform corresponding replacement according to user needs.
    Type: Grant
    Filed: January 19, 2016
    Date of Patent: January 29, 2019
    Assignee: CELESTICA TECHNOLOGY CONSULTANCY (SHANGHAI) CO. LTD
    Inventors: Hank Dao, Guangcheng Dai
  • Patent number: 10153230
    Abstract: An improvement is achieved in the performance of a semiconductor device. The semiconductor device includes a metal plate having an upper surface (first surface), a lower surface (second surface) opposite to the upper surface, and a plurality of side surfaces located between the upper and lower surfaces and having a semiconductor chip mounted thereover. A portion of the metal plate is exposed from a sealing body sealing the semiconductor chip. The exposed portion is covered with a metal film. The side surfaces of the metal plate include a first side surface covered with the sealing body and a side surface (second side surface) provided opposite to the first side surface and exposed from the sealing body. Between the upper and side surfaces of the metal plate, an inclined surface inclined with respect to each of the upper and side surfaces and covered with the metal film is interposed.
    Type: Grant
    Filed: November 17, 2017
    Date of Patent: December 11, 2018
    Assignee: Renesas Electronics Corporation
    Inventor: Shoji Hashizume
  • Patent number: 10148625
    Abstract: A protected memory source device including removable non-volatile memory durably stores a signature such as a serial number or identifier, which is used to mark protected multimedia content legally stored on the protected memory device. The protected multimedia content is moved from the source device to another device, such as a target device used to aggregated protected content in a library. Moving the protected multimedia content involves replacing a source-specific header, comprising digital rights management metadata and/or other security metadata allowing only a device having the source device signature access to the content, with a target-specific header comprising digital rights management metadata and/or other security metadata allowing only a device having the target device signature access to the content. The transfer is done using one of a variety of transfer methods with either a trusted or un-trusted host system connecting the source device to the target device.
    Type: Grant
    Filed: May 9, 2017
    Date of Patent: December 4, 2018
    Assignee: MO-DV, INC.
    Inventors: Robert D. Widergren, Martin Paul Boliek
  • Patent number: 10120824
    Abstract: A bridge hoard includes a printed circuit board (PCB) and a protocol converter mounted on the PCB to perform a conversion operation converting between a first communication protocol and a second communication protocol different from the first communication protocol. The bridge board further includes a first connector configured to communicate according to the first communication protocol and a second connector configured to communicate according to the second communication protocol. The bridge board additionally includes a hole formed in the PCB. The PCB is shaped as a concave polygon. The concave polygon includes a first region and a second region. The first region includes a first edge and a second edge, which extends in parallel to the first edge, along a first direction. The second region includes a third edge and a fourth edge, which extends in parallel to the third edge, along a second direction perpendicular to the first direction.
    Type: Grant
    Filed: October 26, 2016
    Date of Patent: November 6, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Han Hong Lee, Jae Hong Park, Jung Hyun Woo, Sung Woo Joo, Chang Hoon Han
  • Patent number: 10091900
    Abstract: According to an embodiment, an implantable medical device is disclosed. The device includes a sealed housing enclosing an electronic circuitry, a plurality of feedthrough conductors, each conductor of the plurality of feedthrough conductors includes a proximal end part connected to the enclosed electronic circuitry and a distal end part available external to the housing. The device further includes a plurality of spatially separated feedthrough connectors configured to provide terminal connections, away from the plurality of feedthrough conductors, for a plurality of electrical wires. Each connector of the plurality of spatially separated feedthrough connectors includes a first end section adapted to be connected with the distal end part of a feedthrough conductor of the plurality of feedthrough conductors and a second end section adapted to be connected with one of the plurality of electrical wires.
    Type: Grant
    Filed: June 29, 2016
    Date of Patent: October 2, 2018
    Assignee: OTICON MEDICAL A/S
    Inventors: Pierre-Yves Clair, Hervé Ibanez, Frederic Bessoule, Adrien Thomas
  • Patent number: 10090255
    Abstract: The present disclosure relates to semiconductor structures and, more particularly, to dicing channels used in the singulatation process of interposers and methods of manufacture. The structure includes: one or more redistribution layers; a glass interposer connected to the one or more redistribution layers; a channel formed through the one or more redistribution layers and the glass interposer core, forming a dicing channel; and polymer material conformally filling the channel.
    Type: Grant
    Filed: January 29, 2016
    Date of Patent: October 2, 2018
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Brittany L. Hedrick, Vijay Sukumaran, Christopher L. Tessler, Richard F. Indyk, Sarah H. Knickerbocker
  • Patent number: 10083946
    Abstract: A bottom package includes a molding compound, a buffer layer over and contacting the molding compound, and a through-via penetrating through the molding compound. A device die is molded in the molding compound. A guiding trench extends from a top surface of the buffer layer into the buffer layer, wherein the guiding trench is misaligned with the device die.
    Type: Grant
    Filed: April 24, 2017
    Date of Patent: September 25, 2018
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Po-Hao Tsai, Feng-Cheng Hsu, Li-Hui Cheng, Jui-Pin Hung, Jing-Cheng Lin
  • Patent number: 10082842
    Abstract: One embodiment of the present disclosure set forth a system for hot swapping an expansion card. The system includes a fastener mechanism for coupling an expansion card to a motherboard. The system further includes a switch for controlling voltage supply to the expansion card. When the fastener mechanism is in an activated state, the fastener mechanism secures the expansion card to the motherboard and the switch causes voltage to be supplied to the expansion card. When the fastener mechanism is in a partially activated state, the fastener mechanism secures the expansion card to the motherboard and the switch prevents voltage from being supplied to the expansion card.
    Type: Grant
    Filed: August 10, 2017
    Date of Patent: September 25, 2018
    Assignee: SUPER MICRO COMPUTER, INC.
    Inventor: Dwight Looi
  • Patent number: 10076040
    Abstract: A packaging structure and a packaging method of an electronic product are disclosed. The packaging structure of an electronic product includes a supporting structure, a flexible board and a covering layer. The supporting structure has a shape. The flexible board is stacked on the supporting structure, and has an electronic device disposed thereon. The covering layer is attached on the stacked supporting structure and flexible board and covering the electronic device. The shapes of the flexible board and the covering layer conform to the shape of the supporting structure, and the flexible board and the electronic device are tightly interposed between the covering layer and the supporting structure. The covering layer includes a thermoforming film and at least a function film stacked on the thermoforming film.
    Type: Grant
    Filed: March 16, 2017
    Date of Patent: September 11, 2018
    Assignees: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED, LITE-ON TECHNOLOGY CORPORATION
    Inventors: Yi-Feng Pu, Po-Yu Cheng, Tzu-Shu Lin
  • Patent number: 10076021
    Abstract: Techniques and mechanisms for providing efficient heat dissipation by a circuit assembly. In an embodiment, the circuit assembly includes an inductor and a packaged device coupled thereto, where the inductor forms heat dissipation structures on various respective sides of a ferromagnetic body. The packaged assembly includes a circuit board disposed in a mold material, where a metal core of the circuit board is thermally coupled to transfer heat from one or more circuit components of the packaged device to the inductor via one or more conductors extending from the package mold. In another embodiment, portions of the metal core have different respective vertical spans which contribute to different thermal conductivity characteristics across various regions of the circuit board.
    Type: Grant
    Filed: April 12, 2017
    Date of Patent: September 11, 2018
    Assignee: Intel Corporation
    Inventor: Arvind Sundaram
  • Patent number: 10062620
    Abstract: A die device includes a die including an active layer; and an interconnect feature configured for electrical connection of the active layer, wherein the interconnect feature is in contact with a substrate in the die; and a bump, independent of the die, configured for electrical connection of the active layer.
    Type: Grant
    Filed: April 13, 2017
    Date of Patent: August 28, 2018
    Assignee: Nanya Technology Corporation
    Inventors: Jui-Chung Hsu, Wu-Der Yang, Chia-Chi Hsu
  • Patent number: 10049801
    Abstract: Systems, and apparatus for aligning structures are provided. One of the apparatus includes a first communication module including: a printed circuit board, one or more integrated circuit packages mounted on the printed circuit board, and one or more magnets positioned relative to the one or more integrated circuit packages, wherein the one or more magnets are configured to attractively couple the first communication module to a second communication module positioned in proximity to the first communication module.
    Type: Grant
    Filed: October 16, 2015
    Date of Patent: August 14, 2018
    Assignee: Keyssa Licensing, Inc.
    Inventors: Stephen Robert Venuti, Steve Novak
  • Patent number: 10050374
    Abstract: A device with waterproof structure includes a case, a waterproof cover, and a fixed element. The case has an opening and a waterproof wall surrounding the opening. The waterproof cover is screwed to the case and is selectively covered or moved away from the opening. The fixed element includes a fixed portion and a waterproof plate. The waterproof plate covers the outer edge and one side surface of the fixed portion. The fixed element is detachably disposed to the waterproof cover through the fixed portion. When the waterproof cover covers on the opening, the outer edge of the waterproof plate is close contacted to the waterproof wall. Therefore, using the waterproof plate which could close contact to the waterproof wall to replace the O-ring also could achieve the purpose of waterproofing.
    Type: Grant
    Filed: June 1, 2017
    Date of Patent: August 14, 2018
    Assignee: GETAC TECHNOLOGY CORPORATION
    Inventor: Kun-Cheng Lee
  • Patent number: 10037949
    Abstract: A semiconductor package that includes EMI shielding and a fabricating method thereof are disclosed. In one embodiment, the fabricating method of a semiconductor package includes forming a substrate, attaching semiconductor devices to a top portion of the substrate, encapsulating the semiconductor devices using an encapsulant, forming a trench in the encapsulant, and forming a shielding layer on a surface of the encapsulant.
    Type: Grant
    Filed: March 2, 2017
    Date of Patent: July 31, 2018
    Assignee: Amkor Technology, Inc.
    Inventors: Hee Sung Kim, Yeoung Beom Ko, Dae Byoung Kang, Jae Jin Lee, Joon Dong Kim, Dong Jean Kim
  • Patent number: 9996120
    Abstract: A printed circuit board (PCB) module that includes a processor package, an upper PCB and a lower PCB. The processor package includes a processor substrate and a processor. An upper socket is disposed on a lower surface of the upper PCB, and the upper socket electrically connects to a top electrical interface on the upper surface of the processor substrate. The lower PCB electrically interfaces with a bottom electrical interface on a lower surface of the processor substrate.
    Type: Grant
    Filed: March 31, 2016
    Date of Patent: June 12, 2018
    Assignee: EMC IP Holding Company LLC
    Inventor: Jean-Philippe Fricker
  • Patent number: 9954316
    Abstract: A module retracting type installing and uninstalling device, including a base, a slide block, a pressing cover and a bail. The slide block includes a long-strip-shaped slide block base body, and U-shaped grooves are respectively formed in the middle part of two side walls of the slide block base body. A square hole is formed at the rear end of the slide block base body, and is sheathed onto a triangular lock catch of the base. First and second rotating shafts of the bail are respectively located in two snapping grooves at the front end of the base, and third and fourth rotating shafts are respectively located in the U-shaped grooves. The pressing cover includes a square pressing cover base body, and a pressure resilient sheet attached to the upper surface of the slide block and being pressed to the base.
    Type: Grant
    Filed: December 18, 2014
    Date of Patent: April 24, 2018
    Assignee: Wuhan Telecommunication Devices Co., Ltd.
    Inventors: Beili Song, Benqing Quan, Yi Jiang
  • Patent number: 9905303
    Abstract: In one implementation, flash memory chips are provided with an operating power supply voltage to substantially match a power supply voltage expected at an edge connector of a dual inline memory module. The one or more of the flash memory chips and a memory support application integrated circuit (ASIC) may be mounted together into a multi-chip package for integrated circuits. The one or more flash memory chips and the memory support ASIC may be electrically coupled together by routing one or more conductors between each in the multi-chip package. The multi-chip package may be mounted onto a printed circuit board (PCB) of a flash memory DIMM to reduce the number of packages mounted thereto and reduce the height of the flash memory DIMM. The number of printed circuit board layers may also be reduced, such as by integrating address functions into the memory support ASIC.
    Type: Grant
    Filed: April 19, 2016
    Date of Patent: February 27, 2018
    Assignee: Virident Systems, LLC
    Inventors: Ruban Kanapathippillai, Kenneth Alan Okin
  • Patent number: 9867297
    Abstract: According to one embodiment, a storage device includes an enclosure, and a circuit board assembly in the enclosure. The circuit board assembly includes a first circuit board, a second circuit board opposed to the first circuit board, a third circuit board opposed to the second circuit board, a first connector connecting the first and second circuit boards to each other, a second connector connecting the second and third circuit boards to each other, and is offset to the first connector in a plane direction, a first spacer between the first and second circuit boards, and a second spacer between the second and third circuit boards. The first spacer includes a support body at a position opposed to the second connector and in contact with the first and second circuit boards.
    Type: Grant
    Filed: February 22, 2016
    Date of Patent: January 9, 2018
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventors: Akitoshi Suzuki, Yoshiharu Matsuda
  • Patent number: 9812187
    Abstract: A memory system includes a memory controller and a memory module. The memory controller is arranged for selectively generating at least a clock signal and an inverted clock signal. The memory module includes a first termination resistor, a second termination resistor and a switch module, where a first node of the first termination resistor is to receive the clock signal, a second termination resistor, wherein a first node of the second termination resistor is to receive the inverted clock signal, and the switch module is arranged for selectively connecting or disconnecting a second node of the second termination resistor to a second node of the first termination resistor.
    Type: Grant
    Filed: February 5, 2017
    Date of Patent: November 7, 2017
    Assignee: MEDIATEK INC.
    Inventors: Shang-Pin Chen, Bo-Wei Hsieh
  • Patent number: 9780471
    Abstract: A printed circuit board arrangement and a method for mounting a product to a main printed circuit board (100) at a substantially perpendicular angle, the printed circuit board arrangement comprises a main printed circuit board (100) comprising an elongated slot (102), and a product (128) comprising a connector portion (130) configured to be inserted into the elongated slot (102). The connector portion (130) is such that the product (128) may be attached at a substantially perpendicular angle to the main printed circuit board (100). The elongated slot (102) comprises a protrusion (104), and the connector portion (130) comprises a spring portion (132) configured to engage with the protrusion (104) when the connector portion (130) is inserted into the elongated slot (102). This results in a force pressing the connector portion (130) of the product (128) to at least one side wall of the elongated slot (102).
    Type: Grant
    Filed: May 18, 2015
    Date of Patent: October 3, 2017
    Assignee: PHILIPS LIGHTING HOLDING B.V.
    Inventor: Nicolaas Antonie Van Rijswijk
  • Patent number: 9755686
    Abstract: A method for preparing an alloy encapsulation mobile phone protective case is provided, which includes steps of: selecting an alloy material as an edging material; CNC machining; making a surface treatment; drying; spraying and molding for shaping. The alloy encapsulated mobile phone protective case is formed after shaping the alloy outer frame and the soft rubber inner molding layer, which not only simplifies the assembly, but also strengthens the strength and hardness of the structure, thus effectively avoiding the splitting phenomenon caused by strong impact. Due to the combination of the alloy material with the soft rubber inner molding layer, the protective case has a certain flexibility, abrasion resistance, high strength and high formability. The rigidity of the protective case is in a range from 50° to 90°and has strong resilient force and curvature, which not only can effectively protect the mobile phone, but also has long service life.
    Type: Grant
    Filed: July 2, 2015
    Date of Patent: September 5, 2017
    Assignee: Shenzhen Qilixin Plastic Precision Mould Co., Ltd.
    Inventor: Qifeng Zhang
  • Patent number: 9720189
    Abstract: An optical fiber connector includes a cartridge, a latch and a pair of elastic members. The cartridge has two opposite sidewalls and a wire terminal, and each sidewall has a runner and a containing slot disposed on a side of the wire terminal. The latch includes a pull handle, a sliding member having two opposite extending arms, and a stop portion disposed at each extending arm. The pull handle is capable of rotatably connecting the sliding member, and each extending arm is slidably combined with the cartridge through each runner. Each elastic member has an end abutting each containing slot and the other end abutting each stop portion. Therefore, the space of the cartridge is increased, and the total volume of the optical fiber connector is reduced.
    Type: Grant
    Filed: August 1, 2016
    Date of Patent: August 1, 2017
    Inventor: Chen-Yueh Shih
  • Patent number: 9699909
    Abstract: A wiring board with a built-in electronic component includes a core substrate, an electronic component in the substrate, a first upper-layer structure on first surface of the substrate, a second upper-layer structure on second surface of the substrate, and via conductors in the substrate and first upper-layer structure such that the via conductors are connected to an electrode of the component. The substrate has an accommodating layer, a first connection layer on first surface of the accommodating layer, and a second connection layer on second surface of the accommodating layer, the accommodating layer includes inner wiring and insulation layers and has cavity accommodating the component, the first connection layer includes inner wiring and insulation layers, and the second connection layer includes inner wiring and insulation layers such that the second connection layer includes greater number of inner wiring and insulation layers than the first connection layer.
    Type: Grant
    Filed: August 8, 2014
    Date of Patent: July 4, 2017
    Assignee: IBIDEN CO., LTD.
    Inventors: Naohito Ishiguro, Yasushi Inagaki
  • Patent number: 9671582
    Abstract: A pluggable optical transceiver module for being plugged in a housing is provided. The housing has a cover and an elastic piece, and the cover has an accommodating space. One end of the elastic piece is connected to the cover while the other end has a first fastening portion. The first fastening portion is located on one side of the accommodating space. The pluggable optical transceiver module comprises a base and a sliding member. The base comprises a base body and a second fastening portion. The base body has a guide surface, and the second fastening portion is next to the guide surface. The base is for being plugged in the accommodating space, and the second fastening portion is fastened with the first fastening portion. The sliding member comprises a body section and a push section connected to each other. The body section is slidably disposed on the base.
    Type: Grant
    Filed: April 28, 2014
    Date of Patent: June 6, 2017
    Assignee: Applied Optoelectronics, Inc.
    Inventors: Che-Shou Yeh, Chao-Hung Tsai, Chien-Te Lin
  • Patent number: 9673566
    Abstract: An electronic device including a first body, a first connecting assembly, a second body, and a second connecting assembly is provided. The first body has a recess, and the first connecting assembly is disposed at the first body and hidden in the recess. The second connecting assembly is disposed on the second body in protruding manner. The second connecting assembly is fit to be assembled in the recess and electrically connected to the first connecting assembly, such that the first and the second bodies are detachably assembled to each other.
    Type: Grant
    Filed: May 13, 2015
    Date of Patent: June 6, 2017
    Assignee: Acer Incorporated
    Inventors: Hung-Chi Chen, Jian-Siang Wang, Yi-Chang Yeh, Chi-Hung Lai, Wu-Chen Lee
  • Patent number: 9674115
    Abstract: An exemplary system includes a plurality of connector assemblies. Each of the connector assemblies includes a plurality of ports. Each of the connector assemblies is configured to read information stored on or in physical communication media that is connected to the ports of the respective connector assembly. An aggregation point is communicatively coupled to the plurality of connector assemblies. The aggregation point is configured to automatically discover the connector assemblies and cause each of the connector assemblies to send to the aggregation point at least some of the information read from the physical communication media that is connected to its ports. The aggregation point is configured to store at least some of the information sent by the connector assemblies to the aggregation point. The aggregation point can also be configured to provide at least some of the information it stores to at least one other device via the network.
    Type: Grant
    Filed: February 12, 2010
    Date of Patent: June 6, 2017
    Assignee: CommScope Technologies LLC
    Inventors: Mohammad H. Raza, Kamlesh G. Patel, John P. Anderson, Joseph C. Coffey
  • Patent number: 9647992
    Abstract: A protected memory source device including removable non-volatile memory durably stores a signature such as a serial number or identifier, which is used to mark protected multimedia content legally stored on the protected memory device. The protected multimedia content is moved from the source device to another device, such as a target device used to aggregated protected content in a library. Moving the protected multimedia content involves replacing a source-specific header, comprising digital rights management metadata and/or other security metadata allowing only a device having the source device signature access to the content, with a target-specific header comprising digital rights management metadata and/or other security metadata allowing only a device having the target device signature access to the content. The transfer is done using one of a variety of transfer methods with either a trusted or un-trusted host system connecting the source device to the target device.
    Type: Grant
    Filed: June 4, 2014
    Date of Patent: May 9, 2017
    Assignee: MO-DV, INC.
    Inventors: Robert D. Widergren, Martin Paul Boliek
  • Patent number: 9622293
    Abstract: A modular Radio Frequency transceiver includes a frequency synthesizer module arranged to generate a local oscillator signal. At least one transmitter module and/or at least one receiver module are arranged adjacent to the frequency synthesizer module. Each transmitter module and receiver module is arranged to mix at least one respective input signal with the local oscillator signal. Adjacently arranged modules are electrically connected to each other with respect to at least data signals, the local oscillator signal and a power supply.
    Type: Grant
    Filed: September 26, 2014
    Date of Patent: April 11, 2017
    Assignee: Imagination Technologies Limited
    Inventors: Martin Lantz, Pontus Andren, Joakim Landmark
  • Patent number: 9582050
    Abstract: An electronic apparatus includes a replaceable device, an apparatus casing, a supporting structure, an abutting structure, and a removable carrier. The supporting structure, the abutting structure, and the removable carrier function as an installation mechanism for installing the replaceable device into the apparatus casing. The supporting structure and the abutting structure are disposed in the apparatus casing. The abutting structure has two side walls oppositely disposed. The removable carrier includes a fixing frame and an actuation part pivotally connected to the fixing frame. The replaceable device is fixed on the fixing frame. When the removable carrier is disposed on the supporting structure, the actuation part can be rotated relative to the fixing frame and alternatively abut against one side wall so that the fixing frame moves on the supporting structure and a connector of the replaceable device is engaged with or disengaged from a connector of the electronic apparatus respectively.
    Type: Grant
    Filed: December 30, 2014
    Date of Patent: February 28, 2017
    Assignee: Wistron Corporation
    Inventors: Tien-Chung Tseng, Wei-Yi Lee
  • Patent number: 9541779
    Abstract: A display device includes a display panel, a bottom case, and a curvature maintaining bar. The display panel has a first curvature. The display panel is disposed in the bottom case. The bottom case has a locking projection and a second curvature substantially a same shape or radius as that of the first curvature. The curvature maintaining bar is coupled to the locking projection. The curvature maintaining bar includes a first protrusion. The bottom case has a coupling hole into which the first protrusion is inserted.
    Type: Grant
    Filed: May 1, 2015
    Date of Patent: January 10, 2017
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventor: Weejoon Jeong
  • Patent number: 9531099
    Abstract: The invention relates to a connector which includes basic parts that can be assembled and nested together, forming a high-density connector technology for hermaphroditic contacts.
    Type: Grant
    Filed: April 23, 2012
    Date of Patent: December 27, 2016
    Assignee: FISCHER CONNECTORS HOLDING S.A.
    Inventors: Nicolas Convert, Jean-Marie Buchilly, Stéphane Rohrbach
  • Patent number: 9478477
    Abstract: A semiconductor device includes a semiconductor element having a semiconductor chip and connection terminals, a cooling fin to which the semiconductor element is fixed, and an external cooling body having a passage for cooling medium, the cooling fin being fixed to the external cooling body. The semiconductor element has a protruding cooling block that is inserted and fixed to the cooling fin, which in turn is fixed to the external cooling body such that the cooling fin is in contact with the cooling medium.
    Type: Grant
    Filed: July 14, 2014
    Date of Patent: October 25, 2016
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventor: Yuji Iizuka
  • Patent number: 9444153
    Abstract: A composite molding comprises an insulative molded body molded into a prescribed shape; an insulative transfer layer covering at least part of a front surface of the molded body; an electrode pattern layer formed between the molded body and the transfer layer; an electrically conductive contact pin having one end side buried in the molded body and fixed thereto and an other end stuck out from the molded body; and an electrically conductive bonding agent formed between the electrode pattern layer and the molded body and bonding to the electrode pattern layer and the contact pin to form an electrical connection between the electrode pattern layer and the contact pin. This arrangement prevents defects caused by embedding a contact pin in a molded body and reliably makes an electrical connection between the contact pin and an electrode pattern layer.
    Type: Grant
    Filed: July 17, 2014
    Date of Patent: September 13, 2016
    Assignee: NISSHA PRINTING CO., LTD.
    Inventors: Seiichi Yamazaki, Toshihiro Higashikawa
  • Patent number: 9424980
    Abstract: A laminate in which plural insulator layers are stacked includes an external electrode that is exposed to the exterior of the laminate and includes a plurality of conductive layers stacked in a staking direction and passing through some of the plural insulator layers in the stacking direction. At least one side of the external electrode facing in the stacking direction is overlaid with rest of the plural insulator layers. At least one side surface of the external electrode facing in the stacking direction is uneven with another portion of the side surface.
    Type: Grant
    Filed: July 31, 2014
    Date of Patent: August 23, 2016
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Atsushi Seko
  • Patent number: 9396145
    Abstract: A single integrated circuit comprises one or more functional modules; a bus port; a bus in communication with the one or more functional modules and the bus port; and a bus tracer disposed within the integrated circuit and configured to capture activity on the bus. A method for a single integrated circuit comprising a bus comprises capturing, in a bus tracer disposed within the single integrated circuit, activity on the bus; and providing, through a bus port of the single integrated circuit, the activity captured by the bus tracer.
    Type: Grant
    Filed: July 25, 2013
    Date of Patent: July 19, 2016
    Assignee: Marvell International Ltd.
    Inventors: Chee Hoe Chu, Ping Zheng, Wei Zhou
  • Patent number: 9355782
    Abstract: A capacitor assembly comprises a plurality of capacitor elements, a clamping assembly, and a conductive path. The clamping assembly retains the plurality of capacitor elements longitudinally perpendicular to an adjacent mounting surface. The conductive path electrically connects the plurality of capacitor elements to one or more circuit elements disposed proximate the adjacent mounting surface. The clamping assembly includes a base with a central strut and a plurality of peripheral struts projecting perpendicularly therefrom, and the clamping assembly also includes a central conductive path.
    Type: Grant
    Filed: September 15, 2014
    Date of Patent: May 31, 2016
    Assignee: Hamilton Sundstrand Corporation
    Inventor: Dale W. Massolle, Jr.
  • Patent number: 9326410
    Abstract: The invention relates to a communication cartridge (1) characterized in that—it is adapted to be integrated in a removable manner into a recess (25) of a host equipment (2), during normal operation, an external front part (13) of the cartridge being intended to be external to the recess (25) of the host equipment (2), and in that—it comprises at least one front port, placed in an internal space of the cartridge (1) and intended to cooperate with a wireless communication module also placed in the internal space of the cartridge (1), during normal operation, the front port being moreover adapted to have an adjustable position in the internal space, so that the module is at least partially positioned in the external front part (13) of the cartridge (1), during normal operation. The invention also relates to an equipment, an assembly and a system corresponding thereto.
    Type: Grant
    Filed: July 12, 2012
    Date of Patent: April 26, 2016
    Assignee: SAGEM DEFENSE SECURITE
    Inventors: Jean-Marie Courteille, Pierre Guivarch, Francois Guillot, Bruno Larois
  • Patent number: 9261922
    Abstract: A system for the management of rack-mounted field replaceable units (FRUs) that affords the enhanced availability and serviceability of FRUs provided by blade-based systems but in a manner that accommodates different types of FRUs (e.g., in relation to form factors, functionality, power and cooling requirements, and/or the like) installed within a rack or cabinet.
    Type: Grant
    Filed: February 28, 2013
    Date of Patent: February 16, 2016
    Assignee: Oracle International Corporation
    Inventor: Carl L. Meert
  • Patent number: 9253882
    Abstract: An electronic component built-in multi-layer wiring board that comprises collectively stacked therein a plurality of first printed wiring boards by thermal compression bonding, and that comprises an electronic component package built in thereto, wherein the electronic component package comprises a first electronic component built in thereto and a plurality of second printed wiring boards stacked to have electrodes on an outermost surface of the package at a pitch that is wider than the electrode pitch of the first electronic component and that is matched to the wiring pitch of the first printed wiring boards, the electronic component built-in multi-layer wiring board includes a second electronic component having a thickness which is greater than that of the first electronic component, and the electronic component package having a thickness which is 80% to 125% of the thickness of the second electronic component.
    Type: Grant
    Filed: August 4, 2014
    Date of Patent: February 2, 2016
    Assignee: FUJIKURA LTD.
    Inventor: Hirokazu Nanjo
  • Patent number: 9246252
    Abstract: A connector system includes a plurality of housing mounted on a circuit board and a plurality of cages are provided, each cage enclosing one of the housings, each of the cages including a front face that defines a first port, the cages being spaced apart a predetermined distance. A thermal washer is positioned around the cages, the thermal washer including a front portion and a main portion with air apertures that allow air to flow through the thermal washer and along a gap between the cages.
    Type: Grant
    Filed: May 6, 2013
    Date of Patent: January 26, 2016
    Assignee: Molex, LLC
    Inventors: Jerry D. Kachlic, Philip J. Dambach, Emanuel G. Banakis
  • Patent number: 9220172
    Abstract: A method of manufacturing an electronic component includes a first step of preparing a mounting member formed by bonding a peripheral region of a base body having an outer terminal connected with a wiring member, and a frame body, while heating the base body and the frame body; a second step of fixing the electronic device to the base body; and a third step of bonding the lid body and the frame body. A condition ?L, ?F, ?B<?C is satisfied, where ?L is a thermal expansion coefficient of the lid body, ?F is a thermal expansion coefficient of the frame body, ?B is a thermal expansion coefficient of the base body, and ?C is a thermal expansion coefficient of the wiring member.
    Type: Grant
    Filed: April 24, 2013
    Date of Patent: December 22, 2015
    Assignee: Canon Kabushiki Kaisha
    Inventors: Koji Tsuduki, Takanori Suzuki, Tadashi Kosaka, Yasuhiro Matsuki, Shin Hasegawa, Fujio Ito, Hisatane Komori, Yasushi Kurihara
  • Patent number: 9201482
    Abstract: In a modular structure of independent output/input socket for UPS, when UPS needs to be repaired, the bypass switch of the detachable socket is turned on, so that the input power is directly connected with power output sockets through the power input wire. The detachable socket is then removed from the UPS host, and the UPS host is sent to be repaired. Load equipment plugs do not need to be unplugged from the power output jacks one by one, and moved to the power socket on the wall. If there are not enough power sockets on the wall, then additional extension wire sockets having multi-jacks need to be utilized for electrical connection. The action of unplugging and plugging in load plugs into the different power sources can be tedious and even dangerous. The detachable output/input sockets are also replaceable with different plug adapters for use with the different power plug standards around the world.
    Type: Grant
    Filed: October 5, 2012
    Date of Patent: December 1, 2015
    Inventor: Ruei Feng Lin