Module Patents (Class 361/728)
  • Patent number: 11523548
    Abstract: The invention is a power electronic system comprising at least one power electronic component implemented at least partly on at least one circuit board. The circuit boards are planar and circular or toroidal in shape with the center thereof comprising a circular opening having a diameter D cooperating with a hose for circulating a flow.
    Type: Grant
    Filed: November 28, 2018
    Date of Patent: December 6, 2022
    Assignee: IFP ENERGIES NOUVELLES
    Inventors: Alexandre Battiston, Laid Kefsi, Fabrice Le Berr
  • Patent number: 11521523
    Abstract: An example electronic device includes a housing. In addition, the electronic device includes a display panel supported by the housing. The display panel includes a planar portion and a side portion extending from the planar portion to an end of the display panel. The planar portion and the side portion are to display images. The side portion is to transition between a first position in which the side portion is co-planar with the planar portion and a second position in which the side portion is curved relative to the planar portion.
    Type: Grant
    Filed: June 17, 2021
    Date of Patent: December 6, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Kuo Lee, Hogan Hote Yeh
  • Patent number: 11501921
    Abstract: A multilayer ceramic electronic component includes multilayer ceramic electronic component bodies each including a laminate and first and second outer electrodes respectively disposed on two end surfaces of the laminate, first and second metal terminals respectively connected to the first and second outer electrodes, and first and second terminal blocks respectively connected to the first and second metal terminals. A thickness dimension of each multilayer ceramic electronic component body in a height direction is less than a width dimension of the multilayer ceramic electronic component body in a width direction. Each multilayer ceramic electronic component body is disposed such that a first or second side surface faces a mounting surface. The first and second metal terminals are respectively disposed astride the first and second outer electrodes of the multilayer ceramic electronic component bodies.
    Type: Grant
    Filed: October 11, 2019
    Date of Patent: November 15, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Tomohiro Kageyama
  • Patent number: 11495412
    Abstract: A multilayer ceramic capacitor includes a multilayer main body including an inner layer portion including dielectric layers and internal electrode layers alternately stacked, and outer layer portions on both sides of the inner layer portion in a stacking direction, two external electrodes at two end surfaces of the multilayer body in which side gap portions are provided on both sides of the multilayer main body in the width direction, and an interposer on any of the main surfaces, the side surfaces, and the end surfaces of a capacitor main body including the multilayer and the external electrodes. The difference in location between ends at side surfaces of two adjacent internal electrode layers in the stacking direction is about 0.5 ?m or less. In the two side gap portions, a portion in contact with the multilayer main body has a thickness of about 10 ?m or less.
    Type: Grant
    Filed: April 16, 2021
    Date of Patent: November 8, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Mitsuru Ikeda
  • Patent number: 11495099
    Abstract: An electronic device includes one or more sensors, one or more processors operable with the one or more sensors, and a status indicator configured to indicate whether an authorized user of the electronic device is busy, free, or somewhere in between. The status indicator can operate in at least a first state and a second state that is different from the first state. The first state indicates the authorized user is busy and should not be disturbed, while the second state indicates the authorized user is free. Red light can be emitted in the first state, and green light in the second state. The state of the status indicator can be set manually, such as with a chopping gesture, or automatically, such as from calendar events stored in a calendaring operation.
    Type: Grant
    Filed: June 24, 2020
    Date of Patent: November 8, 2022
    Assignee: Motorola Mobility LLC
    Inventor: Francis Kuzhiyil
  • Patent number: 11476054
    Abstract: A film capacitor that includes a metallized film having a metal layer on one surface of a dielectric resin film, in which, when a thermal expansion coefficient of the metallized film is ?P and a thermal expansion coefficient of the metal layer is ?M, a value of ?P/?M is 5.1 or less.
    Type: Grant
    Filed: March 10, 2020
    Date of Patent: October 18, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Tomomichi Ichikawa, Tomoki Inakura, Shinichi Kobayashi
  • Patent number: 11477880
    Abstract: A module board and a memory module are provided. The module board includes a first branch line for connecting a clock signal terminal disposed on at least one surface to a first branch point; a first signal line for connecting the first branch point to a first module clock signal terminal; a second signal line for connecting the first module clock signal terminal to the kth module clock signal terminal and a first termination resistance terminal; a third signal line for connecting the first branch point to a (k+1)th module clock signal terminal; and a fourth signal line for connecting the (k+1)th module clock signal terminal to a 2kth module clock signal terminal and the second termination resistance terminal, wherein a length of the third signal line is greater than a sum of a length of the first signal line and a length of the second signal line.
    Type: Grant
    Filed: June 3, 2021
    Date of Patent: October 18, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Wonseop Lee, Hwanwook Park, Jeonghoon Baek, Dohyung Kim, Seunghee Mun, Dongyoon Seo, Jinoh Ahn
  • Patent number: 11470729
    Abstract: Various embodiments of the present invention relate to an electronic device which employs a flexible display and, even when a housing is changed in size or shape, can keep an antenna at the same characteristic.
    Type: Grant
    Filed: May 14, 2019
    Date of Patent: October 11, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yongyoun Kim, Kyungmoon Seol, Minsung Lee, Jinwoo Jung, Soyoung Lee, Jaebong Chun
  • Patent number: 11448531
    Abstract: A sensor component includes: a sensor part having a sensor body and a connection terminal extending from the sensor body; and a holder part for holding the sensor part, the connection terminal being resin-sealed by an exterior part that is connected to a conductor of a wire, wherein a melt part that melts during the molding of the exterior part is provided on an outer surface of the holder part that is arranged inside of the exterior part, and the melt part is arranged in a position separating the sensor body and a connection part where the connection terminal is connected to the conductor.
    Type: Grant
    Filed: September 15, 2017
    Date of Patent: September 20, 2022
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventors: Hironobu Yamamoto, Kyungwoo Kim, Toshinari Kobayashi, Masaharu Nakamura
  • Patent number: 11452246
    Abstract: A device that includes a board, a package and a patch substrate. The board includes a cavity. The package is coupled to a first side of the board. The package includes a substrate and an integrated device coupled to the substrate. The integrated device is located at least partially in the cavity of the board. The patch substrate is coupled to a second side of the board. The patch substrate is located over the cavity of the board. The patch substrate is configured as an electromagnetic interference (EMI) shield for the package.
    Type: Grant
    Filed: October 15, 2020
    Date of Patent: September 20, 2022
    Assignee: QUALCOMM Incorporated
    Inventors: Charles David Paynter, Ryan Lane, John Eaton, Amit Mano
  • Patent number: 11439030
    Abstract: A display device is disclosed. The display device includes a flexible display panel, a panel roller, a first pipe extending in a longitudinal direction of the panel roller, wherein the first pipe is located adjacent to the panel roller, a second pipe extending in the longitudinal direction of the panel roller and located adjacent to the panel roller, a third pipe extending in the longitudinal direction of the panel roller and located adjacent to the panel roller, the first pipe and the second pipe, a guide roller extending in the longitudinal direction of the panel roller and located opposite to the third pipe with respect to the panel roller, and a correction unit located at the first pipe and comprising a correction roller rotatable on the first pipe and a roll plate curved that is perpendicular to a longitudinal direction of the panel roller.
    Type: Grant
    Filed: November 20, 2020
    Date of Patent: September 6, 2022
    Assignee: LG ELECTRONICS INC.
    Inventor: Jonggil Pyo
  • Patent number: 11435795
    Abstract: A cooling system comprises one or more hyperbaric fans and an electromagnetic interference (EMI) shield protecting selected components in a sealed chassis. The EMI shield comprises vents configured to allow airflow through the shield but prevent direct transmission of electromagnetic energy through the EMI shield. Airflow generated by a hyperbaric fan in the sealed chassis is able to flow through the vents to cool components surrounded by the EMI shield and the EMI shield prevents electromagnetic energy generated by some components from interfering with other components.
    Type: Grant
    Filed: April 14, 2021
    Date of Patent: September 6, 2022
    Assignee: Dell Products L.P.
    Inventors: Qinghong He, Allen B. McKittrick, Changsoo Kim
  • Patent number: 11428892
    Abstract: An optical apparatus may include a housing having an opened front face, an optical unit freely movable into and out of an internal space of the housing through the front face, and a positioning portion disposed on a back side of the optical unit in the internal space. A base plate of the optical unit may include first and second convex portions disposed on a base end face of the base plate. The second convex portion may be disposed at a position different from the first convex portion in a width direction of the base plate. The positioning portion may include a V block having a V groove shape at a part contacting the first convex portion, and a flat block having a flat surface shape at a part contacting the second convex portion. The optical unit may be positioned in the internal space through the contact.
    Type: Grant
    Filed: August 26, 2020
    Date of Patent: August 30, 2022
    Assignee: Gigaphoton Inc.
    Inventors: Hiroshi Someya, Yukio Watanabe
  • Patent number: 11432414
    Abstract: A back cover ejection structure is applied in an electronic device. The electronic device includes a back cover and a middle frame, the back cover ejection structure can eject the back cover from the middle frame. The back cover ejection structure includes a housing, a moving plate, and a rotating cover. The moving plate is received in the housing and can move in a first direction. The moving plate includes a plate body and a first groove defined in the plate body. The first groove includes a first section, the first section inclined with the first direction. The rotating cover is rotatably connected to the housing. The rotating cover includes a sliding rod slidably received in the first section. The sliding rod can push the rotating cover to rotate when sliding in the first section, causing the rotating cover to eject the back cover from the middle frame.
    Type: Grant
    Filed: April 15, 2021
    Date of Patent: August 30, 2022
    Assignee: Chiun Mai Communication Systems, Inc.
    Inventor: Chia-Ju Lin
  • Patent number: 11412632
    Abstract: A modular I/O device includes a terminal base with a terminal block that includes a plurality of wiring connectors. An auxiliary wiring device includes a plurality of auxiliary wiring connectors and is selectively physically connectable to the terminal base in an operative position and selectively physically removable from the terminal base. The terminal block and auxiliary wiring connector can be coupled to an I/O module. One or more of the I/O module terminal block and auxiliary wiring connector can include electrical or electronic components included converters, fuses, switches, etc.
    Type: Grant
    Filed: June 11, 2019
    Date of Patent: August 9, 2022
    Assignee: Rockwell Automation Asia Pacific Business Center Pte. Ltd.
    Inventors: Rajiv Chakraborty, Soon Seng Kang, Srinivasan Melkote, Przemyslaw Plesowicz, Rosh Chathoth Sreedharan, Yedi Supriadi
  • Patent number: 11375616
    Abstract: A radio frequency signal repeater includes, a first communication printed circuit board, a second communication printed circuit board, at least one embedded radio frequency module printed circuit board disposed between and communicably coupled to both the first communication printed circuit board and the second communication printed circuit board. The at least one embedded radio frequency module printed circuit board, the first communication printed circuit board, and the second communication printed circuit board are stacked one board on top of the others, and adjacent boards of the at least one embedded radio frequency module printed circuit board, the first communication printed circuit board, and the second communication printed circuit board are electrically coupled by a respective interconnection join layer so as to form an integrated printed circuit board module, where the adjacent boards are electrically coupled to each other through vias that extend through the interconnection join layer.
    Type: Grant
    Filed: December 16, 2020
    Date of Patent: June 28, 2022
    Assignee: The Boeing Company
    Inventors: Shihchang Wu, Kyle A. Woolrich, Jay Stuart Spence
  • Patent number: 11357106
    Abstract: According to one embodiment, in a memory system, a printed circuit board a first end portion and a second end portion. The second end portion is a portion arranged in an opposite side of the first end portion. Both of a semiconductor memory and a controller are disposed on the first surface. A edge connector is connectable to a host device and is disposed in the first end portion. Plural through-hole portions are disposed in the second end portion. Each of the plural through-hole portions penetrates from the first surface to the second surface. Each of the plural through-hole portions has an inner surface covered with an electrically-conductive film. Plural pad electrodes are disposed on the second surface in the second end portion. At least some of the plural through-hole portions are electrically connected to the controller. At least some of the plural pad electrodes are electrically connected to the controller.
    Type: Grant
    Filed: December 14, 2020
    Date of Patent: June 7, 2022
    Assignee: Kioxia Corporation
    Inventor: Hiroaki Komaki
  • Patent number: 11346538
    Abstract: An LED lighting module has a main body section on which LED lights are mounted and informational wiring data and electrical power wiring which extends through the module. The module has first and second cavities, each cavity having two prongs located therein, the two prongs in the first cavity being electrically connected to the electrical power wiring and the two prongs in the second cavity being connected to the informational data wiring. Female connection members having informational data and electrical power wiring are inserted into the two cavities and plugged into the prongs to provide informational data and establish electrical power into the module. Multiple LED modules can be connected in one system having a single electrical power source and a single informational data processor by attaching the female connectors between multiple LED modules.
    Type: Grant
    Filed: May 17, 2021
    Date of Patent: May 31, 2022
    Inventor: Sikai Chen
  • Patent number: 11349574
    Abstract: A construction and configuration for the receiving function of a high speed optical communication system with reduced manufacturing cost and improved performance. In an aspect, mounting the cover and lens provides a self-alignment behaviour that advantageously positions the cover and the lens to be in the optimum position for the photodiode. An assembly of electronic components receives data using an optical fibre. In one aspect, the assembly includes a photodiode, an amplifier coupled to the photodiode, and a printed circuit board on which the photodiode and amplifier are physically mounted, The printed circuit board has areas of a first material to which components may be attached using a fixing agent, and areas of a second material to which components will not attach using the fixing agent. Conductive bond wires are configured to directly couple the amplifier and the photodiode to conductive traces on an opposite side of the printed circuit board.
    Type: Grant
    Filed: June 18, 2020
    Date of Patent: May 31, 2022
    Assignee: HiLight Semiconductor Limited
    Inventors: Carl Carley, William Redman-White
  • Patent number: 11297746
    Abstract: A high-frequency module (1a) includes a multilayer wiring substrate (2), a plurality of components (3a, 3b) mounted on an upper surface (20a) of the multilayer wiring substrate (2), a sealing resin layer (4) laminated on the upper surface (20a) of the multilayer wiring substrate (2) and sealing the plurality of components (3a, 3b), and a shield (5). The shield (5) is composed of shield walls (5a, 5b) arranged in grooves (12) and (13), respectively, formed between the first component (3a) and the second component (3b) in the sealing resin layer (4) and a connecting conductor (11) coupling both the shield walls (5a, 5b). A first region (40a) and a second region (40b) in the sealing resin layer (4) split by the shield (5) are contiguous at the location of the connecting conductor (11) as seen from a direction perpendicular to the upper surface (20a) of the multilayer wiring substrate (2).
    Type: Grant
    Filed: July 2, 2020
    Date of Patent: April 5, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yoshihito Otsubo, Yuta Morimoto
  • Patent number: 11287449
    Abstract: A shunt resistor having sufficient bonding strength includes a resistor, a pair of bases which are integrally formed with the resistor so as to sandwich the resistor, recessed holes which are respectively formed in the bases, and measurement terminals which are inserted into the recessed holes and are affixed to the bases. Each measurement terminal has a shaft part and a flange part that protrudes outwardly in the circumferential direction of the shaft part. Each recessed hole is formed to have a diameter smaller than the diameter of the flange part, and the shaft parts are respectively inserted into the recessed holes.
    Type: Grant
    Filed: January 8, 2021
    Date of Patent: March 29, 2022
    Inventor: Kenji Murakami
  • Patent number: 11281255
    Abstract: Disclosed is an electronic device that realizes improved, reliable waterproof performance by sealing the perimeter of an electronic component disposed simultaneously over both a black mask (BM) region and a display region of the electronic device, thereby securing the continuity of a waterproof loop around the electronic device.
    Type: Grant
    Filed: April 8, 2020
    Date of Patent: March 22, 2022
    Inventors: Sangmin Kim, Daeyoung Noh, Minchang Shim, Soonwoong Yang, Seunghoon Lee, Daehyeong Park, Byounguk Yoon
  • Patent number: 11273818
    Abstract: An intelligent power module includes: a heat radiation device; an attachment frame disposed on a mounting surface of the heat radiation device; a power semiconductor module mounted on the attachment frame and configured to seal a semiconductor device; and a drive circuit part mounted on the power semiconductor module via a heat insulating sheet and configured to drive the power semiconductor module.
    Type: Grant
    Filed: May 19, 2017
    Date of Patent: March 15, 2022
    Assignee: ROHM CO., LTD.
    Inventor: Hideki Sawada
  • Patent number: 11277934
    Abstract: In accordance with the embodiments of the present disclosure, a rack comprising a frame having first vertical posts on a first side and second vertical posts on a second side, between which a plurality of RF amplifier modules are mounted, is provided. The RF power outputs of the RF amplifier modules are connected to inputs of an RF power combiner to deliver a combined RF power output. The RF power combiner is arranged at least partially in at least one of a first volume between the first vertical posts of the frame or a second volume between the second vertical posts of the frame, thereby reducing a footprint of the rack.
    Type: Grant
    Filed: July 30, 2020
    Date of Patent: March 15, 2022
    Assignee: Ion Beam Applications S.A.
    Inventors: Michel Abs, Denis Joassin
  • Patent number: 11277925
    Abstract: A wiring board includes core substrate, a first build-up layer on first surface of the substrate and including conductive and insulating resin layers, and a second build-up layer on second surface of the substrate and including conductive and insulating resin layers. The first build-up is formed such that each conductive layer includes a metal foil layer and a plating layer on the foil layer and the foil layer of a conductive layer on an outermost resin layer has thickness greater than thickness of the foil layer of a conductive layer on a non-outermost resin layer, and the second build-up is formed such that each conductive layer includes a metal foil layer and a plating layer on the foil layer and the foil layer of a conductive layer on an outermost resin layer has thickness greater than thickness of the foil layer of a conductive layer on a non-outermost resin layer.
    Type: Grant
    Filed: May 29, 2020
    Date of Patent: March 15, 2022
    Assignee: IBIDEN CO., LTD.
    Inventors: Toshihide Makino, Hidetoshi Noguchi
  • Patent number: 11212453
    Abstract: A vehicular camera module includes a main circuit board electrically connected with an imager circuit board via a flexible ribbon cable, an imager disposed on the imager circuit board, a housing, and a lens barrel accommodating at least one lens. Image data captured by the imager is provided via the flexible ribbon cable to circuitry disposed at a main PCB of the main circuit board. The main circuit board is accommodated within front and rear portions of the housing, while the imager is disposed within the rear portion and is not accommodated within the front portion. The lens barrel, as disposed at the camera module, is tilted at an acute angle upward relative to the plane of the main PCB of the main circuit board. The electronic circuitry disposed at the main PCB includes an electrical socket connector for electrical connection to a plug connector of a vehicular wire harness.
    Type: Grant
    Filed: September 7, 2020
    Date of Patent: December 28, 2021
    Assignee: MAGNA ELECTRONCS INC.
    Inventors: Jianguo Wang, Garret Achenbach, Ove Salomonsson, Tom H. Toma, Edward R. Ahlquist, Jr., Brian J. Winden, Christopher L. Van Dan Elzen
  • Patent number: 11208211
    Abstract: The present specification describes a replaceable connection module. The replaceable connection module includes a port to receive signals and power from a controller and at least one receptacle to provide received signals and power to a connected electronic device. The module also includes a plurality of conductors connecting the port with at least one receptacle. Control of the signals and power at the at least one receptacle is performed by the controller.
    Type: Grant
    Filed: April 26, 2019
    Date of Patent: December 28, 2021
    Assignee: Burrana IP and Assets, LLC
    Inventors: Arda Yilmaz, Joshua Kelly, Stuart Ketchion
  • Patent number: 11201420
    Abstract: Herein described are apparatuses and systems for facilitating alignment of computer component connectors. A package protector may include a body to at least partially surround an integrated circuit package of a circuit card when the package protector is mounted to the circuit card. The package protector may further include a guide pin component that extends from a side of the body, wherein the guide pin component is to be located adjacent to a header of the circuit card when the package protector is mounted to the circuit card, wherein a connector uses the guide pin component to align with the header via a guide pin.
    Type: Grant
    Filed: June 22, 2018
    Date of Patent: December 14, 2021
    Assignee: Intel Corporation
    Inventors: Jun Lu, Wei Liao, Guangying Zhang, Liguang Du, Guoliang Ying, Fangbo Zhu, Song Kok Hang, Juan A. Orozco Ramirez, Wesley B. Morgan
  • Patent number: 11139094
    Abstract: Provided is a power inductor. The power inductor includes a body, at least one base material disposed within the body, at least one coil pattern disposed on at least one surface of the base material, an insulation layer disposed between the coil pattern and the body, and an external electrode disposed outside the body and connected to the coil pattern. The body includes a magnetic pulverized material and an insulation material.
    Type: Grant
    Filed: November 22, 2016
    Date of Patent: October 5, 2021
    Inventors: In Kil Park, Gyeong Tae Kim, Jun Ho Jung, Seung Hun Cho, Ki Joung Nam
  • Patent number: 11121088
    Abstract: A method of manufacturing a semiconductor package structure is provided. The method includes providing a first carrier, forming a patterned buffer layer over the first carrier, forming a first redistribution structure that includes forming a first dielectric layer on the patterned buffer layer, after an electrical testing by applying an electric signal towards the first redistribution structure, removing the first carrier, removing portions of the first dielectric layer, resulting in a patterned first dielectric layer, the patterned first dielectric layer exposing portions of the first circuit layer, removing the exposed portions of the first circuit layer, using the patterned first dielectric layer as a mask, resulting in a patterned first circuit layer, and forming an electric conductor in a recess defined by the patterned first dielectric layer and the patterned first circuit layer.
    Type: Grant
    Filed: October 16, 2019
    Date of Patent: September 14, 2021
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventor: Ting-Yang Chou
  • Patent number: 11114386
    Abstract: A semiconductor device includes a single lead frame, a semiconductor element, and a mold material. The semiconductor element is joined onto one main surface of the lead frame. The lead frame includes a die-attach portion, a signal terminal portion, and a ground terminal portion. The die-attach portion, the signal terminal portion, and the ground terminal portion are disposed directly below the mold material so as to be arranged in a direction along one main surface. A groove portion is provided by partially removing the lead frame so as to allow the groove portion to pass therethrough, the groove portion being provided between the die-attach portion and the ground terminal portion adjacent to each other in the lead frame and between the signal terminal portion and the ground terminal portion adjacent to each other in the lead frame.
    Type: Grant
    Filed: April 19, 2018
    Date of Patent: September 7, 2021
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Kiyoshi Ishida, Hidenori Ishibashi, Makoto Kimura
  • Patent number: 11114385
    Abstract: A processing method for dividing a plate-shaped workpiece into a plurality of individual packages along a plurality of crossing division lines, in which the workpiece has terminals on the back side, includes the steps of attaching a protective member to the back side of the workpiece so as to cover the terminals to thereby unite the protective member with the workpiece, dividing the workpiece with the protective member along each division line to obtain the individual packages in a condition where the protective member is attached to each package, forming a conductive shield layer on the outer surface of each package, and peeling the protective member from each package.
    Type: Grant
    Filed: March 26, 2019
    Date of Patent: September 7, 2021
    Assignee: DISCO CORPORATION
    Inventors: Youngsuk Kim, Byeongdeck Jang
  • Patent number: 11107626
    Abstract: This invention is directed to a corrosion resistant permanent magnet, to a method for producing a corrosion resistant permanent magnet, and to an intravascular blood pump comprising the magnet. The magnet is corrosion resistant due to a composite coating comprising a metal layer, optionally a metal oxide layer, a layer formed from poly(2-chloro-p-xylylene), and a linker layer between the metal oxide layer and the poly(2-chloro-p-xylylene) layer.
    Type: Grant
    Filed: October 25, 2017
    Date of Patent: August 31, 2021
    Assignee: Abiomed Europe GmbH
    Inventors: Thorsten Siess, Claudia Mourran
  • Patent number: 11107776
    Abstract: A semiconductor includes a semiconductor element, a connecting terminal electrically connected to the semiconductor element, and a case including an opening space for housing the semiconductor element, a frame which surrounds the opening space and in which the connecting terminal is partially embedded, and a terminal arrangement portion protruding from the frame towards the opening space. The connecting terminal includes an internal terminal portion that extends towards the opening space with respect to the frame, the internal terminal portion having a front surface that is electrically connected to the semiconductor element and exposed to the opening space, and a rear surface that is fixed to the terminal arrangement portion.
    Type: Grant
    Filed: January 30, 2019
    Date of Patent: August 31, 2021
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventor: Seiichi Takahashi
  • Patent number: 11083088
    Abstract: A micro power distribution box is provided which includes a device, a connector/housing and a cover. The device has a substrate, at least one first finger, at least one second finger, and at least one electrical component. The at least one first finger and the at least one second finger are electrically connected to one another. The at least one first finger has first, second and third portions. The at least one second finger has first and second portions. The substrate is overmolded to the first portions of the at least one first and second fingers. The substrate is not overmolded to the second portions of the at least one first and second fingers or to the third portion of the at least one first finger. The second portions of the at least one first and second fingers extend outwardly from the substrate. The second portion of the at least one first finger is a high current contact. The second portion of the at least one second finger is a contact pin.
    Type: Grant
    Filed: July 5, 2017
    Date of Patent: August 3, 2021
    Assignee: Molex, LLC
    Inventors: Victor Zaderej, Rand Wilburn, David Dunham, Richard Fitzpatrick, E. H. Cheong
  • Patent number: 11070655
    Abstract: An enclosure and a method for forming an enclosure are disclosed. The enclosure may be formed from metal, such as aluminum, and further include a non-metal portion allowing for transmission and receipt of electromagnetic waves. The non-metal portion may be interlocked to the enclosure and in particular, to a region within the enclosure including a first material having a relatively high strength and stiffness compared to the non-metal portion. Interlocking means may include forming dovetail cuts into the enclosure to receive the non-metal portion, a hole or cavity drilled into the enclosure which includes internal threads, and a rod inserted into the first material to provide a tension to the non-metal portion. Methods of assembling internal components using anodization are also disclosed.
    Type: Grant
    Filed: January 13, 2020
    Date of Patent: July 20, 2021
    Assignee: APPLE INC.
    Inventors: Matthew D. Hill, Derek C. Krass, Benjamin Shane Bustle, Lucy Elizabeth Browning, Michael Benjamin Wittenberg, James B. Smith, Ashutosh Y. Shukla, Scott A. Myers
  • Patent number: 11060019
    Abstract: A composition comprising: a plurality of quantum dots; a plurality of luminous carbon nanoparticles; a carboxylic acid group-containing binder; a polymerizable monomer including a carbon-carbon double bond; and an initiator, wherein the plurality of quantum dots comprises a Group II-VI compound, a Group III-V compound, a Group IV-VI compound, or a combination thereof, the plurality of luminous carbon nanoparticles have a size of less than or equal to about 10 nanometers, and exhibit both a D band and a G band in a Raman spectrum thereof, and at least a portion of the plurality of luminous carbon nanoparticles absorb light having a wavelength of greater than or equal to about 400 nanometers and a maximum luminous peak wavelength thereof is greater than or equal to about 480 nanometers.
    Type: Grant
    Filed: October 12, 2018
    Date of Patent: July 13, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yongwook Kim, Eun Joo Jang, Tae Gon Kim, Shang Hyeun Park, Hyo Sook Jang, Young-soo Jeong
  • Patent number: 11056420
    Abstract: The present invention relates generally to a pressing-type semiconductor power device package, and more specifically to a pressing-type semiconductor power device package in which a semiconductor chip, such as a transistor or diode, is formed into a package via a pressing structure without using any conductive adhesive, such as solder, which is used in the past, thereby improving production efficiency and durability.
    Type: Grant
    Filed: December 20, 2018
    Date of Patent: July 6, 2021
    Assignee: JMJ KOREA CO., LTD.
    Inventors: Yunhwa Choi, Jeonghun Cho, Jungtae Cho
  • Patent number: 11057993
    Abstract: A printed circuit board is disclosed. The printed circuit board includes a first substrate portion, and a second substrate portion connected to the first substrate portion and having a flexible insulating layer bendable with respect to the first substrate portion. The second substrate portion includes a block member disposed in the flexible insulating layer and a circuit pattern disposed on a region of the flexible insulating layer, in which the block member is embedded.
    Type: Grant
    Filed: November 1, 2019
    Date of Patent: July 6, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Tae Hong Min
  • Patent number: 11024995
    Abstract: An electrical connector assembly including an electrical connecting member, at least one connector, and at least one metal cover is provided. The connector is disposed at and electrically connected to the electrical connecting member. The metal cover is disposed on the electrical connecting member, such that the electrical connecting member is located between the metal cover and the connector, and the connector is covered by the electrical connecting member.
    Type: Grant
    Filed: August 15, 2019
    Date of Patent: June 1, 2021
    Assignee: Advanced Connectek Inc.
    Inventors: Min-Lung Chien, Ta-Teh Meng, Wen-Yu Wang, Yu-Chai Yeh, Ping Shi, Jizhou Li
  • Patent number: 11010326
    Abstract: A method and apparatus are provided to receive a voltage at a first value at a voltage reducing adaptor, ascertain a voltage supply requirement for the memory arrangement to obtain and ascertained voltage supply requirement, reduce the voltage from the first value to the ascertained voltage supply requirement within the adaptor and supply the voltage at the ascertained voltage supply requirement to the memory arrangement.
    Type: Grant
    Filed: September 20, 2018
    Date of Patent: May 18, 2021
    Assignee: WESTERN DIGITAL TECHNOLOGIES, INC.
    Inventors: Charles Neumann, Robert P. Ryan
  • Patent number: 11006523
    Abstract: Circuit assemblies can be electrically interconnected by providing a circuit assembly having a top surface, a bottom surface, and a perimeter edge connecting the top and bottom surfaces, the perimeter edge being formed of insulative material and having a plurality of conductive features embedded in and exposed on the surface of the edge. The conductive features are arranged in contact sets, and each contact set is separated from adjacent contact sets by a portion of the perimeter edge that is free of conductive features. Each contact set includes conductive features that together form a distributed electrical connection to a single node. The insulative material is selectively removed to form recesses adjacent the conductive features exposing additional surface contact areas along lateral portions of the conductive features in the recesses.
    Type: Grant
    Filed: March 30, 2018
    Date of Patent: May 11, 2021
    Assignee: Vicor Corporation
    Inventors: Patrizio Vinciarelli, Robert Joseph Balcius, Steven P. Sadler, Mark Andrew Thompson
  • Patent number: 10998309
    Abstract: A semiconductor unit includes: a plurality of transistor chips arranged in a plurality of parallel rows, each transistor chip respectively having a first main electrode on one surface and a second main electrode on another surface; a first conductor layer electrically connected to the first main electrodes of the transistor chips, both corner portions on one end of the first conductor layer being drawn out in a direction in which the rows of transistor chips run; a second conductor layer arranged between the both corner portions of the first conductor layer; and a wiring substrate that is arranged on a side of the second main electrodes of the plurality of transistor chips and includes a wiring layer electrically connected to the second main electrodes of the plurality of transistor chips and to the second conductor layer.
    Type: Grant
    Filed: September 10, 2019
    Date of Patent: May 4, 2021
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Masashi Hoya, Katsumi Taniguchi, Naoyuki Kanai
  • Patent number: 10978240
    Abstract: A laminate substrate inductor reduces insertion loss and improves isolation while reducing the area for integrating the laminate substrate inductor. The laminate substrate includes a spiral trace. The laminate substrate also includes a first capture pad at a first end of the spiral trace. The first end is located at a corner of the spiral trace. The first capture pad is substantially within a bounding box of the spiral trace. At least a portion of the first capture pad and an outer edge of the spiral trace have a same distance from a ground.
    Type: Grant
    Filed: December 28, 2017
    Date of Patent: April 13, 2021
    Assignee: Qualcomm Incorporated
    Inventors: Daeik Daniel Kim, Babak Nejati, Husnu Ahmet Masaracioglu
  • Patent number: 10980150
    Abstract: A component mounting part has a width shorter than a distance between guiderails. Backside projected parts protrude in a width direction from the component mounting part at a case-backside end. A width K2 which is a sum of a width of the component mounting part and widths of the backside projected parts is greater than a distance G1 between the guiderails. A clearance is formed between the circuit board and the heat conduction member when the backside projected parts are supported by the guiderails. A distance G3 from an insertion slot to an end of the guiderail on the case backside, is shorter than a distance K4 from an end of the circuit board on the side of the insertion slot to an end of the backside projected part on the side of the insertion slot.
    Type: Grant
    Filed: September 10, 2019
    Date of Patent: April 13, 2021
    Assignee: DENSO CORPORATION
    Inventor: Hiroki Chitaka
  • Patent number: 10939572
    Abstract: A mid-plane assembly includes a main circuit board portion including a plurality of electrical connectors configured to releasably engage a plurality of devices, a first circuit board portion, and a first electrical coupling assembly configured to electrically couple the first circuit board portion to the main circuit board portion and position the first circuit board portion essentially orthogonal to the main circuit board portion.
    Type: Grant
    Filed: March 9, 2020
    Date of Patent: March 2, 2021
    Assignee: EMC IP Holding Company, LLC
    Inventors: Ryan C. McDaniel, Stephen E. Strickland, Brian D. Kennedy
  • Patent number: 10912195
    Abstract: A multi-embedded radio frequency board includes a plurality of printed circuit boards stacked one on the others, at least one of the printed circuit boards of the plurality of printed circuit boards being configured so as to have a different processing function than another processing function of another printed circuit board of the plurality of printed circuit boards, and an interconnection join layer disposed between adjacent printed circuit boards of the plurality of printed circuit boards so as to physically and electrically couple the adjacent printed circuit boards to each other so as to form an integrated printed circuit board module having a predetermined radio frequency communication characteristic.
    Type: Grant
    Filed: January 2, 2019
    Date of Patent: February 2, 2021
    Assignee: The Boeing Company
    Inventors: Shihchang Wu, Kyle A. Woolrich, Jay Stuart Spence
  • Patent number: 10903436
    Abstract: A display device includes: a flexible display panel; a support member below the flexible display panel and having a rigid property; a first impact absorption member below the support member and having a modulus of 0.01 Mpa to 500 Mpa; and a housing having at least a portion below the first impact absorption member and configured to accommodate the flexible display panel, the support member, and the first impact absorption member.
    Type: Grant
    Filed: June 17, 2019
    Date of Patent: January 26, 2021
    Assignee: Samsung Display Co., Ltd.
    Inventor: Jaiku Shin
  • Patent number: 10892226
    Abstract: A power semiconductor module may include a first plate, a second plate configured to include first and second device receiving portions thereinside, and coupled to one side of the first plate, first and second power semiconductor devices arranged in the first and second device receiving portions, first and second input bus bars coupled to an outside of the second plate, a third plate configured to include third and fourth device receiving portions thereinside, and coupled to the other side of the first plate, third and fourth power semiconductor devices arranged in the third and fourth device receiving portions, and third and fourth input bus bars coupled to an outside of the third plate.
    Type: Grant
    Filed: February 15, 2019
    Date of Patent: January 12, 2021
    Assignee: LSIS CO., LTD.
    Inventor: Teagsun Jung
  • Patent number: 10890565
    Abstract: Inventive features of a portable ultrasonic phased array test instrument are disclosed. The instrument has a battery rack that can be repurposed to host a re-programming module for testing and re-programming electronic components.
    Type: Grant
    Filed: June 19, 2018
    Date of Patent: January 12, 2021
    Assignee: Olympus America Inc.
    Inventors: Benjamin Spay, Francois Houde, Christian Gauvin, Jean-Sebastien Langlois, Eric Bharucha