Module Patents (Class 361/728)
  • Patent number: 11121088
    Abstract: A method of manufacturing a semiconductor package structure is provided. The method includes providing a first carrier, forming a patterned buffer layer over the first carrier, forming a first redistribution structure that includes forming a first dielectric layer on the patterned buffer layer, after an electrical testing by applying an electric signal towards the first redistribution structure, removing the first carrier, removing portions of the first dielectric layer, resulting in a patterned first dielectric layer, the patterned first dielectric layer exposing portions of the first circuit layer, removing the exposed portions of the first circuit layer, using the patterned first dielectric layer as a mask, resulting in a patterned first circuit layer, and forming an electric conductor in a recess defined by the patterned first dielectric layer and the patterned first circuit layer.
    Type: Grant
    Filed: October 16, 2019
    Date of Patent: September 14, 2021
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventor: Ting-Yang Chou
  • Patent number: 11114385
    Abstract: A processing method for dividing a plate-shaped workpiece into a plurality of individual packages along a plurality of crossing division lines, in which the workpiece has terminals on the back side, includes the steps of attaching a protective member to the back side of the workpiece so as to cover the terminals to thereby unite the protective member with the workpiece, dividing the workpiece with the protective member along each division line to obtain the individual packages in a condition where the protective member is attached to each package, forming a conductive shield layer on the outer surface of each package, and peeling the protective member from each package.
    Type: Grant
    Filed: March 26, 2019
    Date of Patent: September 7, 2021
    Assignee: DISCO CORPORATION
    Inventors: Youngsuk Kim, Byeongdeck Jang
  • Patent number: 11114386
    Abstract: A semiconductor device includes a single lead frame, a semiconductor element, and a mold material. The semiconductor element is joined onto one main surface of the lead frame. The lead frame includes a die-attach portion, a signal terminal portion, and a ground terminal portion. The die-attach portion, the signal terminal portion, and the ground terminal portion are disposed directly below the mold material so as to be arranged in a direction along one main surface. A groove portion is provided by partially removing the lead frame so as to allow the groove portion to pass therethrough, the groove portion being provided between the die-attach portion and the ground terminal portion adjacent to each other in the lead frame and between the signal terminal portion and the ground terminal portion adjacent to each other in the lead frame.
    Type: Grant
    Filed: April 19, 2018
    Date of Patent: September 7, 2021
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Kiyoshi Ishida, Hidenori Ishibashi, Makoto Kimura
  • Patent number: 11107776
    Abstract: A semiconductor includes a semiconductor element, a connecting terminal electrically connected to the semiconductor element, and a case including an opening space for housing the semiconductor element, a frame which surrounds the opening space and in which the connecting terminal is partially embedded, and a terminal arrangement portion protruding from the frame towards the opening space. The connecting terminal includes an internal terminal portion that extends towards the opening space with respect to the frame, the internal terminal portion having a front surface that is electrically connected to the semiconductor element and exposed to the opening space, and a rear surface that is fixed to the terminal arrangement portion.
    Type: Grant
    Filed: January 30, 2019
    Date of Patent: August 31, 2021
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventor: Seiichi Takahashi
  • Patent number: 11107626
    Abstract: This invention is directed to a corrosion resistant permanent magnet, to a method for producing a corrosion resistant permanent magnet, and to an intravascular blood pump comprising the magnet. The magnet is corrosion resistant due to a composite coating comprising a metal layer, optionally a metal oxide layer, a layer formed from poly(2-chloro-p-xylylene), and a linker layer between the metal oxide layer and the poly(2-chloro-p-xylylene) layer.
    Type: Grant
    Filed: October 25, 2017
    Date of Patent: August 31, 2021
    Assignee: Abiomed Europe GmbH
    Inventors: Thorsten Siess, Claudia Mourran
  • Patent number: 11083088
    Abstract: A micro power distribution box is provided which includes a device, a connector/housing and a cover. The device has a substrate, at least one first finger, at least one second finger, and at least one electrical component. The at least one first finger and the at least one second finger are electrically connected to one another. The at least one first finger has first, second and third portions. The at least one second finger has first and second portions. The substrate is overmolded to the first portions of the at least one first and second fingers. The substrate is not overmolded to the second portions of the at least one first and second fingers or to the third portion of the at least one first finger. The second portions of the at least one first and second fingers extend outwardly from the substrate. The second portion of the at least one first finger is a high current contact. The second portion of the at least one second finger is a contact pin.
    Type: Grant
    Filed: July 5, 2017
    Date of Patent: August 3, 2021
    Assignee: Molex, LLC
    Inventors: Victor Zaderej, Rand Wilburn, David Dunham, Richard Fitzpatrick, E. H. Cheong
  • Patent number: 11070655
    Abstract: An enclosure and a method for forming an enclosure are disclosed. The enclosure may be formed from metal, such as aluminum, and further include a non-metal portion allowing for transmission and receipt of electromagnetic waves. The non-metal portion may be interlocked to the enclosure and in particular, to a region within the enclosure including a first material having a relatively high strength and stiffness compared to the non-metal portion. Interlocking means may include forming dovetail cuts into the enclosure to receive the non-metal portion, a hole or cavity drilled into the enclosure which includes internal threads, and a rod inserted into the first material to provide a tension to the non-metal portion. Methods of assembling internal components using anodization are also disclosed.
    Type: Grant
    Filed: January 13, 2020
    Date of Patent: July 20, 2021
    Assignee: APPLE INC.
    Inventors: Matthew D. Hill, Derek C. Krass, Benjamin Shane Bustle, Lucy Elizabeth Browning, Michael Benjamin Wittenberg, James B. Smith, Ashutosh Y. Shukla, Scott A. Myers
  • Patent number: 11060019
    Abstract: A composition comprising: a plurality of quantum dots; a plurality of luminous carbon nanoparticles; a carboxylic acid group-containing binder; a polymerizable monomer including a carbon-carbon double bond; and an initiator, wherein the plurality of quantum dots comprises a Group II-VI compound, a Group III-V compound, a Group IV-VI compound, or a combination thereof, the plurality of luminous carbon nanoparticles have a size of less than or equal to about 10 nanometers, and exhibit both a D band and a G band in a Raman spectrum thereof, and at least a portion of the plurality of luminous carbon nanoparticles absorb light having a wavelength of greater than or equal to about 400 nanometers and a maximum luminous peak wavelength thereof is greater than or equal to about 480 nanometers.
    Type: Grant
    Filed: October 12, 2018
    Date of Patent: July 13, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yongwook Kim, Eun Joo Jang, Tae Gon Kim, Shang Hyeun Park, Hyo Sook Jang, Young-soo Jeong
  • Patent number: 11056420
    Abstract: The present invention relates generally to a pressing-type semiconductor power device package, and more specifically to a pressing-type semiconductor power device package in which a semiconductor chip, such as a transistor or diode, is formed into a package via a pressing structure without using any conductive adhesive, such as solder, which is used in the past, thereby improving production efficiency and durability.
    Type: Grant
    Filed: December 20, 2018
    Date of Patent: July 6, 2021
    Assignee: JMJ KOREA CO., LTD.
    Inventors: Yunhwa Choi, Jeonghun Cho, Jungtae Cho
  • Patent number: 11057993
    Abstract: A printed circuit board is disclosed. The printed circuit board includes a first substrate portion, and a second substrate portion connected to the first substrate portion and having a flexible insulating layer bendable with respect to the first substrate portion. The second substrate portion includes a block member disposed in the flexible insulating layer and a circuit pattern disposed on a region of the flexible insulating layer, in which the block member is embedded.
    Type: Grant
    Filed: November 1, 2019
    Date of Patent: July 6, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Tae Hong Min
  • Patent number: 11024995
    Abstract: An electrical connector assembly including an electrical connecting member, at least one connector, and at least one metal cover is provided. The connector is disposed at and electrically connected to the electrical connecting member. The metal cover is disposed on the electrical connecting member, such that the electrical connecting member is located between the metal cover and the connector, and the connector is covered by the electrical connecting member.
    Type: Grant
    Filed: August 15, 2019
    Date of Patent: June 1, 2021
    Assignee: Advanced Connectek Inc.
    Inventors: Min-Lung Chien, Ta-Teh Meng, Wen-Yu Wang, Yu-Chai Yeh, Ping Shi, Jizhou Li
  • Patent number: 11010326
    Abstract: A method and apparatus are provided to receive a voltage at a first value at a voltage reducing adaptor, ascertain a voltage supply requirement for the memory arrangement to obtain and ascertained voltage supply requirement, reduce the voltage from the first value to the ascertained voltage supply requirement within the adaptor and supply the voltage at the ascertained voltage supply requirement to the memory arrangement.
    Type: Grant
    Filed: September 20, 2018
    Date of Patent: May 18, 2021
    Assignee: WESTERN DIGITAL TECHNOLOGIES, INC.
    Inventors: Charles Neumann, Robert P. Ryan
  • Patent number: 11006523
    Abstract: Circuit assemblies can be electrically interconnected by providing a circuit assembly having a top surface, a bottom surface, and a perimeter edge connecting the top and bottom surfaces, the perimeter edge being formed of insulative material and having a plurality of conductive features embedded in and exposed on the surface of the edge. The conductive features are arranged in contact sets, and each contact set is separated from adjacent contact sets by a portion of the perimeter edge that is free of conductive features. Each contact set includes conductive features that together form a distributed electrical connection to a single node. The insulative material is selectively removed to form recesses adjacent the conductive features exposing additional surface contact areas along lateral portions of the conductive features in the recesses.
    Type: Grant
    Filed: March 30, 2018
    Date of Patent: May 11, 2021
    Assignee: Vicor Corporation
    Inventors: Patrizio Vinciarelli, Robert Joseph Balcius, Steven P. Sadler, Mark Andrew Thompson
  • Patent number: 10998309
    Abstract: A semiconductor unit includes: a plurality of transistor chips arranged in a plurality of parallel rows, each transistor chip respectively having a first main electrode on one surface and a second main electrode on another surface; a first conductor layer electrically connected to the first main electrodes of the transistor chips, both corner portions on one end of the first conductor layer being drawn out in a direction in which the rows of transistor chips run; a second conductor layer arranged between the both corner portions of the first conductor layer; and a wiring substrate that is arranged on a side of the second main electrodes of the plurality of transistor chips and includes a wiring layer electrically connected to the second main electrodes of the plurality of transistor chips and to the second conductor layer.
    Type: Grant
    Filed: September 10, 2019
    Date of Patent: May 4, 2021
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Masashi Hoya, Katsumi Taniguchi, Naoyuki Kanai
  • Patent number: 10980150
    Abstract: A component mounting part has a width shorter than a distance between guiderails. Backside projected parts protrude in a width direction from the component mounting part at a case-backside end. A width K2 which is a sum of a width of the component mounting part and widths of the backside projected parts is greater than a distance G1 between the guiderails. A clearance is formed between the circuit board and the heat conduction member when the backside projected parts are supported by the guiderails. A distance G3 from an insertion slot to an end of the guiderail on the case backside, is shorter than a distance K4 from an end of the circuit board on the side of the insertion slot to an end of the backside projected part on the side of the insertion slot.
    Type: Grant
    Filed: September 10, 2019
    Date of Patent: April 13, 2021
    Assignee: DENSO CORPORATION
    Inventor: Hiroki Chitaka
  • Patent number: 10978240
    Abstract: A laminate substrate inductor reduces insertion loss and improves isolation while reducing the area for integrating the laminate substrate inductor. The laminate substrate includes a spiral trace. The laminate substrate also includes a first capture pad at a first end of the spiral trace. The first end is located at a corner of the spiral trace. The first capture pad is substantially within a bounding box of the spiral trace. At least a portion of the first capture pad and an outer edge of the spiral trace have a same distance from a ground.
    Type: Grant
    Filed: December 28, 2017
    Date of Patent: April 13, 2021
    Assignee: Qualcomm Incorporated
    Inventors: Daeik Daniel Kim, Babak Nejati, Husnu Ahmet Masaracioglu
  • Patent number: 10939572
    Abstract: A mid-plane assembly includes a main circuit board portion including a plurality of electrical connectors configured to releasably engage a plurality of devices, a first circuit board portion, and a first electrical coupling assembly configured to electrically couple the first circuit board portion to the main circuit board portion and position the first circuit board portion essentially orthogonal to the main circuit board portion.
    Type: Grant
    Filed: March 9, 2020
    Date of Patent: March 2, 2021
    Assignee: EMC IP Holding Company, LLC
    Inventors: Ryan C. McDaniel, Stephen E. Strickland, Brian D. Kennedy
  • Patent number: 10912195
    Abstract: A multi-embedded radio frequency board includes a plurality of printed circuit boards stacked one on the others, at least one of the printed circuit boards of the plurality of printed circuit boards being configured so as to have a different processing function than another processing function of another printed circuit board of the plurality of printed circuit boards, and an interconnection join layer disposed between adjacent printed circuit boards of the plurality of printed circuit boards so as to physically and electrically couple the adjacent printed circuit boards to each other so as to form an integrated printed circuit board module having a predetermined radio frequency communication characteristic.
    Type: Grant
    Filed: January 2, 2019
    Date of Patent: February 2, 2021
    Assignee: The Boeing Company
    Inventors: Shihchang Wu, Kyle A. Woolrich, Jay Stuart Spence
  • Patent number: 10903436
    Abstract: A display device includes: a flexible display panel; a support member below the flexible display panel and having a rigid property; a first impact absorption member below the support member and having a modulus of 0.01 Mpa to 500 Mpa; and a housing having at least a portion below the first impact absorption member and configured to accommodate the flexible display panel, the support member, and the first impact absorption member.
    Type: Grant
    Filed: June 17, 2019
    Date of Patent: January 26, 2021
    Assignee: Samsung Display Co., Ltd.
    Inventor: Jaiku Shin
  • Patent number: 10890565
    Abstract: Inventive features of a portable ultrasonic phased array test instrument are disclosed. The instrument has a battery rack that can be repurposed to host a re-programming module for testing and re-programming electronic components.
    Type: Grant
    Filed: June 19, 2018
    Date of Patent: January 12, 2021
    Assignee: Olympus America Inc.
    Inventors: Benjamin Spay, Francois Houde, Christian Gauvin, Jean-Sebastien Langlois, Eric Bharucha
  • Patent number: 10892226
    Abstract: A power semiconductor module may include a first plate, a second plate configured to include first and second device receiving portions thereinside, and coupled to one side of the first plate, first and second power semiconductor devices arranged in the first and second device receiving portions, first and second input bus bars coupled to an outside of the second plate, a third plate configured to include third and fourth device receiving portions thereinside, and coupled to the other side of the first plate, third and fourth power semiconductor devices arranged in the third and fourth device receiving portions, and third and fourth input bus bars coupled to an outside of the third plate.
    Type: Grant
    Filed: February 15, 2019
    Date of Patent: January 12, 2021
    Assignee: LSIS CO., LTD.
    Inventor: Teagsun Jung
  • Patent number: 10888006
    Abstract: A housing structure of an optical module with self-sinking unlocking comprises: a base, an upper cover, a rotating lug, a support rod and a pull ring; wherein the rotating lug comprises a first connecting piece a lug, a second connecting piece and a stem, wherein the first connecting piece and the second connecting piece are respectively horizontally disposed at two ends of the stem, and the lug is disposed on the stem; and the pull ring comprises a fixing shaft, a rotating shaft and a side rod; wherein the second connecting piece of the rotating lug is disposed on the bas; the first connecting piece of the rotating lug is coupled to a right connecting piece of the support rod; a left hole of the support rod is coupled to the rotating shaft of the pull ring.
    Type: Grant
    Filed: May 23, 2019
    Date of Patent: January 5, 2021
    Assignee: WUHAN TELECOMMUNICATION DEVICES CO., LTD.
    Inventors: Kai Mei, Yi Jiang, Benqing Quan
  • Patent number: 10859779
    Abstract: An optoelectronic module may include a housing enclosing at least one optical transmitter or receiver and a slider configured to move with respect to the housing. The slider may include at least one protrusion configured to engage a cage sized and shaped to receive the housing. The optoelectronic module may include a handle coupled to the slider to actuate the slider, and a retainer configured to engage both the handle and the housing to retain the handle and the slider with respect to the housing. The retainer may include at least one occlusion member sized and shaped to be positioned inside a port of the optoelectronic module.
    Type: Grant
    Filed: March 4, 2020
    Date of Patent: December 8, 2020
    Assignee: II-VI Delaware Inc.
    Inventors: William H. Wang, Bill S. Wang
  • Patent number: 10829064
    Abstract: Provided is a highly reliable electronic control device which has not only an effect of reducing costs but also an effect of facilitating a manufacturing process. To include a control board; a connector including a terminal connected to the control board; and a housing case to which the control board and the connector are fixed. The control board has a part sealed with a sealing resin. The connector is disposed at a position facing another part of the control board, being isolated from the sealing resin by the control board and the housing case.
    Type: Grant
    Filed: November 20, 2019
    Date of Patent: November 10, 2020
    Assignee: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Yujiro Kaneko, Yoshio Kawai
  • Patent number: 10827049
    Abstract: A bar-type mobile terminal can include a wireless communication unit including one or more components which permit wireless communications between the bar type mobile terminal and a wireless communication system; a plurality of antennas configured to transmit or receive radio signals; a metallic frame having a front side and a rear side, the metallic frame including a base portion, an edge portion forming an appearance of the bar-type mobile terminal, an upper through hole disposed in an upper portion of the metallic frame, and a lower through hole disposed in a lower portion of the metallic frame; an upper non-metallic coupling disposed in the upper through hole of the metallic frame; a lower non-metallic coupling disposed in the lower through hole of the metallic frame; a window disposed on the front side of the metallic frame; a display module disposed between the window and the front side of the metallic frame; a first waterproof layer disposed between the window and a front side of the edge portion of th
    Type: Grant
    Filed: December 18, 2019
    Date of Patent: November 3, 2020
    Assignee: LG ELECTRONICS INC.
    Inventors: Jaehyuk Kang, Jinho Jang, Hyunseok Kim
  • Patent number: 10813232
    Abstract: A wiring board includes core substrate, a first build-up layer on first surface of the substrate and including conductive and insulating resin layers, and a second build-up layer on second surface of the substrate and including conductive and insulating resin layers. The first build-up is formed such that each conductive layer includes a metal foil layer and a plating layer on the foil layer and the foil layer of a conductive layer on an outermost resin layer has thickness greater than thickness of the foil layer of each conductive layer on a non-outermost resin layer, and the second build-up is formed such that each conductive layer includes a metal foil layer and a plating layer on the foil layer and the foil layer of a conductive layer on an outermost resin layer has thickness greater than thickness of the foil layer of each conductive layer on a non-outermost resin layer.
    Type: Grant
    Filed: August 8, 2017
    Date of Patent: October 20, 2020
    Assignee: IBIDEN CO., LTD.
    Inventors: Toshihide Makino, Hidetoshi Noguchi
  • Patent number: 10802233
    Abstract: A communication module handle may include a base, a grasp, a hinge, and a detent. The hinge may connect the base and the grasp. The detent may be configured to maintain a position of the grasp relative to the base in an extended position. In response to the detent being subjected to a detent-releasing force, the detent may release the grasp from the extended position to a collapsed position. The grasp may be rotatable relative to the base by way of the hinge in the collapsed position.
    Type: Grant
    Filed: May 2, 2018
    Date of Patent: October 13, 2020
    Assignee: II-VI Delaware Inc.
    Inventors: Derek Soon, Tat Ming Teo, William H. Wang, Siu Wee Hon
  • Patent number: 10797028
    Abstract: Embodiments of three-dimensional (3D) memory devices with stacked device chips using interposers and fabrication methods thereof are disclosed. In an example, a 3D memory device includes first and second device chips and an interposer therebetween. The first device chip includes a peripheral device and a first chip contact on a surface of the first device chip and electrically connected to the peripheral device. The second device chip includes an alternating conductor/dielectric stack, a memory string extending vertically through the alternating conductor/dielectric stack, and a second chip contact on a surface of the second device chip and electrically connected to the memory string. The interposer includes an interposer substrate, first and second interposer contacts on opposite surfaces of the interposer and electrically connected to one another through the interposer substrate. The first and second interposer contacts are attached to the first and second chip contacts, respectively.
    Type: Grant
    Filed: September 23, 2018
    Date of Patent: October 6, 2020
    Assignee: YANGTZE MEMORY TECHNOLOGIES CO., LTD.
    Inventors: Jun Liu, Li Hong Xiao
  • Patent number: 10798475
    Abstract: A display device including a display surface for displaying an image; and a speaker unit located on the display surface, the speaker unit generating a sound and emitting the generated sound to the outside. The speaker unit may detect a fingerprint of a user.
    Type: Grant
    Filed: July 27, 2018
    Date of Patent: October 6, 2020
    Assignee: Samsung Display Co., Ltd.
    Inventors: Yong Han Park, Young Seok Seo, Sang Min Kim, Seung Ho Baek, Seung Hoon Lee
  • Patent number: 10784230
    Abstract: A semiconductor device package comprises a substrate, a first component, a second component, a package body and a conductive material. The substrate has a surface. The first component is on the surface of the substrate. The second component is on the surface of the substrate. The package body comprises a first portion, a second portion and a third portion. The first portion encapsulates the first component and has a side surface. The second portion encapsulates the second component and has a side surface. The third portion connects the first portion and the second portion and has a top surface. The side surface of the first portion, the side surface of the second portion and the top surface of the third portion define a space separating the side surface of the first portion from the side surface of the second portion. The conductive material is disposed in the space.
    Type: Grant
    Filed: November 15, 2016
    Date of Patent: September 22, 2020
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventor: Jenchun Chen
  • Patent number: 10779433
    Abstract: In accordance with the embodiments of the present disclosure, a rack comprising a frame having first vertical posts on a first side and second vertical posts on a second side, wherein the first side is opposite the second side, between which a plurality of RF amplifier modules are mounted, is provided. The RF power outputs of the RF amplifier modules are connected to inputs of an RF power combiner to deliver a combined RF power output. The RF power combiner is arranged at least partially in at least one of a first volume between the first vertical posts of the frame or a second volume between the second vertical posts of the frame, thereby reducing a footprint of the rack.
    Type: Grant
    Filed: February 23, 2018
    Date of Patent: September 15, 2020
    Assignee: Ion Beam Applications S.A.
    Inventors: Michel Abs, Denis Joassin
  • Patent number: 10772244
    Abstract: The characteristics of a shield wall that prevents the mutual interference of the noise between components are improved by lowering the resistance of the shield wall. A high-frequency module 1a includes a wiring board 2, a plurality of components 3a to 3e mounted on an upper surface 2a of the wiring board 2, a sealing resin layer 4 stacked on the upper surface 2a of the wiring board 2 to seal the components 3a to 3e, and a shield wall 5 disposed between the adjacent components in the sealing resin layer 4. A part of the shield wall 5 is constituted of metal pins 5a standing on the upper surface 2a of the wiring board 2.
    Type: Grant
    Filed: November 10, 2017
    Date of Patent: September 8, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yoshihito Otsubo, Issei Yamamoto
  • Patent number: 10770852
    Abstract: A circuit interconnecting device includes a circuit connection board and a circuit board which is detachable. The circuit connection board includes an input terminal, an output terminal and an onboard slot member. The input terminal is coupled to the onboard slot member through a first circuit, and the output terminal is coupled to the onboard slot member through a second circuit; and the circuit board is inserted into the onboard slot member to connect the first circuit and the second circuit.
    Type: Grant
    Filed: May 11, 2017
    Date of Patent: September 8, 2020
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Jiali Wang, Jiangtao Zhang, Peng Wang
  • Patent number: 10735569
    Abstract: Electronic devices may be provided with convex displays. A convex display may be used to maximize the internal volume of a device. Convex displays may be formed from one or more flexible layers. A flexible display layer may be mounted to a rigid support structure or a rigid cover layer. Flexible display layers that conform to the curved shape of a rigid structure may provide additional internal volume in which internal components of the device may be positioned.
    Type: Grant
    Filed: January 24, 2018
    Date of Patent: August 4, 2020
    Assignee: Apple Inc.
    Inventor: Stephen Brian Lynch
  • Patent number: 10721825
    Abstract: An electronic device including a display panel is provided. In some embodiments, the display panel includes an active display region and an electrical component. The electrical component is distinct from a touch sensor device that is adapted to receive touch input across the active display region of the display panel. An electrical conductor connects the electrical component to another component of the electronic device via the display panel, such as via a bent portion of the display panel.
    Type: Grant
    Filed: August 18, 2017
    Date of Patent: July 21, 2020
    Assignee: Google LLC
    Inventors: Brian Jon Hassemer, Paul Lynn Fordham, Mark Daniel Janninck, David Kyungtag Lim
  • Patent number: 10706344
    Abstract: A sheet with registration holes cut in it is mounted to a surface of a pallet so that its registration holes are held taught by the outer diameter of bushings while an inner diameter pin shaft of the bushings is used by registration pins during multiple manufacturing process to provide registration of the sheet.
    Type: Grant
    Filed: May 23, 2017
    Date of Patent: July 7, 2020
    Assignee: FITEQ, INC.
    Inventors: Michael Scruggs, Robert Singleton
  • Patent number: 10671009
    Abstract: A printed circuit board comprises a first mounting surface, a second mounting surface, and a piezoelectric transformer. The piezoelectric transformer has a piezoelectric substance, external electrodes, and a frame substrate. The second mounting surface has a projection region. There is a first region from a first location, where an end portion further from the output electrode out of end portions of the input electrode is projected onto the second mounting surface in the projection region, to a second location, where an end portion closer to the output electrode out of the end portions of the input electrode is projected onto the second mounting surface, the first region being a mounting allowed region where an electronic component is mounted.
    Type: Grant
    Filed: February 2, 2018
    Date of Patent: June 2, 2020
    Assignee: Canon Kabushiki Kaisha
    Inventors: Taro Minobe, Norikazu Sugiyama, Ryo Matsumura
  • Patent number: 10659234
    Abstract: In one embodiment, a computing device receives an image that has been signed with a first key, wherein the image includes a first computational value associated with it. A second computational value associated with the image is determined and the image is signed with a second key to produce a signed image that includes both the first and second computational values. Prior to loading the dual-signed image, the computing device attempts to authenticate the dual-signed image using both the first and second computational values, and, if successful, loads and installs the dual-signed image.
    Type: Grant
    Filed: December 21, 2016
    Date of Patent: May 19, 2020
    Assignee: Cisco Technology, Inc.
    Inventors: Kannan Varadhan, Chirag Shroff, Rakesh Chopra
  • Patent number: 10649604
    Abstract: An input device manufacturing method includes: a first process in which, in a state in which a sensor film is inserted into a die, the sensor film having a detection area and a non-detection area other than the detection area, the detection area and the non-detection area constituting the sensor, as well as a first surface formed into a curved surface and a second surface positioned opposite to the first surface, a material that includes a synthetic resin having a translucent property is poured into the die to form a resin layer on the same side as the second surface; and a second process in which a decorative film having a decorative area that covers the non-detection area is pasted to the first surface with an adhesive layer intervening between the decorative film and the first surface.
    Type: Grant
    Filed: March 26, 2019
    Date of Patent: May 12, 2020
    Assignee: Alps Alpine Co., Ltd.
    Inventor: Junji Hashida
  • Patent number: 10608609
    Abstract: An LC filter having a multilayer body, coil conductor patterns, a thin-film capacitor, and input/output terminal conductors. The multilayer body is formed by stacking a plurality of resin sheets. At least a portion of the coil conductor pattern is embedded in a resin sheet. The thin-film capacitor is at least partially embedded in the resin sheet, is disposed in the coil opening of the coil conductor pattern, which is spiral-shaped, and is connected to the coil conductor pattern. The thickness of the coil conductor patterns is smaller than the thickness of the resin sheets, and the thickness of the thin-film capacitor is smaller than the thickness of the resin sheets.
    Type: Grant
    Filed: July 9, 2018
    Date of Patent: March 31, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Toshiyuki Nakaiso
  • Patent number: 10607775
    Abstract: An electronic component device includes an electronic component, a resin structure including the electronic component such that one main surface thereof is exposed, a through-electrode, and first and second wiring layers, in which the electronic component includes an element body, an inner electrode in the element body and connected to the first and second wiring layers, and an adjustment electrode provided in an adjustment region in the element body, the first wiring layer is continuously provided on the inner electrode, the adjustment region, and the resin structure, and a thermal expansion coefficient of the resin structure, a thermal expansion coefficient of the adjustment region, and a thermal expansion coefficient of the inner electrode satisfy an expression of the thermal expansion coefficient of the resin structure?the thermal expansion coefficient of the adjustment region?the thermal expansion coefficient of the inner electrode.
    Type: Grant
    Filed: June 26, 2019
    Date of Patent: March 31, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Masato Nomiya
  • Patent number: 10607962
    Abstract: A method for manufacturing semiconductor chips (2, 3) having arranged thereon metallic shaped bodies (6), having the following steps: arranging a plurality of metallic shaped bodies (6) on a processed semiconductor wafer while forming a layer arranged between the semiconductor wafer and the metallic shaped bodies (6), exhibiting a first connection material (4) and a second connection material (5), and processing the first connection material (4) for connecting the metallic shaped bodies (6) to the semiconductor wafer without processing the second connecting material (5), wherein the semiconductor chips (2, 3) are separated either prior to arranging the metallic shaped bodies (6) on the semiconductor wafer or after processing the first connection material (4).
    Type: Grant
    Filed: July 26, 2016
    Date of Patent: March 31, 2020
    Assignee: DANFOSS SILICON POWER GMBH
    Inventors: Frank Osterwald, Martin Becker, Holger Ulrich, Ronald Eisele, Jacek Rudzki
  • Patent number: 10547717
    Abstract: An enclosure and a method for forming an enclosure are disclosed. The enclosure may be formed from metal, such as aluminum, and further include a non-metal portion allowing for transmission and receipt of electromagnetic waves. The non-metal portion may be interlocked to the enclosure and in particular, to a region within the enclosure including a first material having a relatively high strength and stiffness compared to the non-metal portion. Interlocking means may include forming dovetail cuts into the enclosure to receive the non-metal portion, a hole or cavity drilled into the enclosure which includes internal threads, and a rod inserted into the first material to provide a tension to the non-metal portion. Methods of assembling internal components using anodization are also disclosed.
    Type: Grant
    Filed: January 7, 2019
    Date of Patent: January 28, 2020
    Assignee: APPLE INC.
    Inventors: Matthew D. Hill, Derek C. Krass, Benjamin Shane Bustle, Lucy Elizabeth Browning, Michael Benjamin Wittenberg, James B. Smith, Ashutosh Y. Shukla, Scott A. Myers
  • Patent number: 10540032
    Abstract: A display device, including a display panel that displays an image; a flexible printed circuit board including an attaching part attached to one end of the display panel and a curved part extending from the attaching part and not overlapping with the display panel; a window assembly on an upper surface of the display panel; an adhesive part between the window assembly and the display panel to couple the display panel and the window assembly; and a compensating part not overlapping with the display panel, overlapping with the curved part, and on a same layer as the attaching part.
    Type: Grant
    Filed: August 1, 2018
    Date of Patent: January 21, 2020
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Hyeong-Cheol Ahn, Won-il Lee, Byughoon Chae
  • Patent number: 10534144
    Abstract: An optical transceiver includes a housing, a fastening component, a bail and an optical connector. The fastening component is movably disposed on the housing and configured to be detachably fastened with the cage. The bail includes a first connecting portion and a second connecting portion. The first connecting portion is pivoted with respect to the fastening component at a first pivot joint, and the second connecting portion is pivoted with respect to the fastening component at a second pivot joint. The optical connector is disposed in the housing and located between the first pivot joint and the second pivot joint.
    Type: Grant
    Filed: May 17, 2019
    Date of Patent: January 14, 2020
    Assignee: Prime World International Holdings Ltd.
    Inventors: Yu Chen, Hsuan-Chen Shiu, Che-Shou Yeh
  • Patent number: 10524390
    Abstract: An electronic device includes a top plate having a first surface and a second surface that is positioned at an elevation that is lower than an elevation of the first surface, the second surface extending from a first end part of the top plate to a second end part of the top plate, a bottom plate provided under the top plate, and a circuit board placed between the top plate and the bottom plate and mounted with an electronic component. The top plate has opposing first and second edges and opposing third and fourth edges that are perpendicular to the first and the second edges, the first end part being formed at the first edge and the second end part being formed at the second edge.
    Type: Grant
    Filed: February 23, 2018
    Date of Patent: December 31, 2019
    Assignee: Toshiba Memory Corporation
    Inventor: Akitoshi Suzuki
  • Patent number: 10490955
    Abstract: An electrical connector includes a housing having contact channels with electrical contacts received therein each having a poke-in spring beam configured to engage an electrical wire when poked-in to the housing. The electrical contact is movable between a resting position when no wire is present in the wire channel and a clearance position where the electrical contact allows the electrical wire to be removed from the wire channel. Pivot levers are held by the housing and are coupled to corresponding electrical contacts with a pivot end pivotably coupled to the housing and a push button end having a push button pressed to move the corresponding electrical contact to the clearance position. When the electrical wire is loaded into the wire channel, the electrical contact is positioned in a pinching position in which the spring beam pinches against the electrical wire in physical contact with the electrical wire.
    Type: Grant
    Filed: June 21, 2017
    Date of Patent: November 26, 2019
    Assignee: Ademco Inc.
    Inventors: David J. Emmons, Travis Read, Steven L. Wolff, Eric Barton, Ladislav Janovec
  • Patent number: 10468353
    Abstract: A semiconductor package and a method of fabricating the same, the method including mounting semiconductor chips on a substrate; forming a mold layer that covers the semiconductor chips on the substrate; forming external terminals on a bottom surface of the substrate; forming a separation layer on the external terminals and the bottom surface of the substrate; cutting the substrate and the mold layer to separate the semiconductor chips from each other; and forming a shield surrounding the mold layer and a side surface of the substrate.
    Type: Grant
    Filed: April 27, 2017
    Date of Patent: November 5, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: JaeWook Yoo
  • Patent number: 10468765
    Abstract: An antenna bracket for electronic devices includes a solid bracket having an aperture formed therethrough. The solid antenna bracket has side walls that are rounded to a predetermined radius, and at least one antenna pocket positioned on said side walls. The antenna pocket receives and secures at least one antenna. The antenna bracket has a polygon shape that follows the contours of the electronic device housing.
    Type: Grant
    Filed: July 20, 2018
    Date of Patent: November 5, 2019
    Assignee: INTERDIGITAL CE PATENT HOLDINGS
    Inventors: Mickey J. Hunt, Julianne Luna So, William P. Dernier, Randy Wayne Craig, Darin Bradley Ritter, Kevin M. Williams, Michael Francis Barry
  • Patent number: 10457231
    Abstract: An electronics installation system, especially for an aircraft or spacecraft, includes at least one mechanical installation structure having a plurality of installation slots each configured to receive an electronic module and at least one wiring configuration slot configured to receive a wiring configuration module, and a connection matrix comprising a plurality of data connections, wherein at least one data connection is provided between each one of the installation slots and at least one wiring configuration slot.
    Type: Grant
    Filed: November 19, 2015
    Date of Patent: October 29, 2019
    Assignee: AIRBUS OPERATIONS GMBH
    Inventors: Stefan Osternack, Nicholas E. Brownjohn, Poulain St├ęphane