Module Patents (Class 361/728)
  • Patent number: 11908607
    Abstract: A multilayer coil component includes a multilayer body that includes insulating layers that are stacked; a coil disposed in the multilayer body; and outer electrodes disposed on surfaces of the multilayer body and electrically connected to the coil. The coil includes at least two coil conductor groups that each include at least two coil conductors connected to each other in parallel through two coupling conductors. The at least two coil conductor groups are connected to each other in series through a connecting conductor. The connecting conductor connects the coil conductor between the two coupling conductors in one of the at least two coil conductor groups to the coil conductor between the two coupling conductors in another one of the at least two coil conductor groups.
    Type: Grant
    Filed: March 9, 2021
    Date of Patent: February 20, 2024
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Makoto Hiraki, Ryohei Kawabata, Katsuhisa Imada
  • Patent number: 11910544
    Abstract: A control unit having a connection structure for connecting components of the control unit to a base plate which eliminates the need for separate fasteners. The control unit includes circuitry mounted to a PCB, and the PCB is pre-assembled to a base plate, to form a pre-assembly. During assembly, the PCB and the base plate are aligned when placed in a tooling device which clamps and holds the pre-assembly in place during the over molding process. The circuitry is over molded with an epoxy material, such that the epoxy material flows from a top side of the PCB to underneath the base plate, and the PCB is fixed to the base plate without the use of fasteners such as screws, or adhesive materials.
    Type: Grant
    Filed: May 2, 2022
    Date of Patent: February 20, 2024
    Assignee: Vitesco Technologies USA, LLC
    Inventors: Uwe Stephan, Donald J. Zito
  • Patent number: 11879752
    Abstract: A sensor module as well as a method for manufacturing a sensor module for determining a property of a fluid, in particular for measuring air quality, comprises a printed circuit board, at least one sensor on the printed circuit board for measuring a parameter of the surrounding air and a housing for the printed circuit board. A part of the printed circuit board protrudes from an opening in the housing (10), wherein the at least one sensor (21, 22) is located on a front side of the protruding part of the printed circuit board. In addition, at least the front side of the protruding part of the printed circuit board, with the exception of a recess for the at least one sensor, is encapsulated with a filling compound. The sensor module can be used in an interior or an air duct of motor vehicles or buildings. In one embodiment, the sensor module measures temperature, relative humidity and gas concentration in a fluid, especially in the surrounding air.
    Type: Grant
    Filed: October 23, 2018
    Date of Patent: January 23, 2024
    Assignee: Sensirion AG
    Inventors: Stephan Braun, Tobias Schmid, Thomas Brugger, Matthias Merz, Manuel Becker
  • Patent number: 11873424
    Abstract: According to various embodiments, an electronic apparatus comprises: a housing including a first plate, a second plate facing in the opposite direction as the first plate, and side members surrounding the space between the second plate and the second plate; a printed circuit board which is disposed within the space and on which at least one electrical component is mounted; a shield can mounted on the printed circuit board and disposed to surround the at least one electrical component; and an insulating tape member attached to the inner surface of the shield can between the shield can and the electrical component. The insulating tape member may include: a first layer including a first material and formed to a first thickness; a second layer laminated on the first layer by means of an adhesive, including a second material, and formed to a second thickness that is the same as or thicker than the first thickness; and an adhesive layer formed on the second layer and for being attached to the shield can.
    Type: Grant
    Filed: May 29, 2019
    Date of Patent: January 16, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Daum Hwang, Sangin Baek
  • Patent number: 11876315
    Abstract: A pluggable network interface device is provided comprising a split-shell housing having a shielded side portion that protects a side of a circuit substrate disposed in the split-shell housing. The split-shell housing comprises a first shell portion that covers a first side of the circuit substrate and a second shell portion that covers a second side of the circuit substrate that is arranged opposite the first side. The shielded side portion is inset from a width of the split-shell housing and offset a distance from an electrical interconnection end of the circuit substrate. The shielded side portion is arranged at least partially in a notch of the circuit substrate disposed at the electrical interconnection end of the circuit substrate.
    Type: Grant
    Filed: June 29, 2021
    Date of Patent: January 16, 2024
    Assignee: MELLANOX TECHNOLOGIES, LTD.
    Inventors: Jamal Mousa, Nimer Hazin
  • Patent number: 11874512
    Abstract: An optical module includes: a module body that is configured to be inserted into a cage, at an entrance of the cage an electromagnetic wave shielding terminal being provided, and has a groove formed on one surface thereof and configured to engage with a latch part formed on the cage; and an engagement release member including a body that is provided with a pull tab, the body being slidably attached to the module body and configured to slide in response to an external force, and an arm part that extends from the body along the groove, and slides with respect to the groove in conjunction with the sliding of the body and release the engagement in a state in which the electromagnetic wave shielding terminal is pressed. The module body has a concave part on a surface of the groove, the surface being in contact with the arm part.
    Type: Grant
    Filed: October 9, 2020
    Date of Patent: January 16, 2024
    Assignee: FUJITSU OPTICAL COMPONENTS LIMITED
    Inventor: Kazuyuki Kuramochi
  • Patent number: 11871505
    Abstract: Tools and techniques are described to automate line testing when wiring devices (such as equipment and sensors) to controllers. Controllers have access to databases of the devices that are controlled by them, including wiring diagrams and protocols, such that the controller can automatically check that each wire responds correctly to stimulus from the controller. After testing, a reporting device rapidly shows the results of the line testing.
    Type: Grant
    Filed: January 18, 2021
    Date of Patent: January 9, 2024
    Assignee: PassiveLogic, Inc.
    Inventors: Troy Aaron Harvey, Jeremy David Fillingim
  • Patent number: 11858332
    Abstract: The present application provides a battery, a power consumption apparatus, and a method for producing a battery. The battery includes a box body, a battery module and a mounting plate, the battery module is disposed in the box body and includes a battery cell arrangement structure and a first end plate, the battery cell arrangement structure includes a plurality of battery cells stacked and is disposed on one side of the battery cell arrangement structure, the first end plate is fixedly connected to the battery cell arrangement structure, the mounting plate is disposed between the first end plate and the box body and is fixedly connected to the box body; the first end plate has a first elastic support part configured to be capable of abutting the mounting plate, being squeezed by the battery cell arrangement structure and deforming when the battery cell arrangement structure expands.
    Type: Grant
    Filed: November 22, 2021
    Date of Patent: January 2, 2024
    Assignee: CONTEMPORARY AMPEREX TECHNOLOGY CO., LIMITED
    Inventors: Wenhui Zhang, Kangyu Wang, Mu Qian, Wencai Xu, Zengzhong Wang, Jinqing Ji
  • Patent number: 11862553
    Abstract: An object is to provide a semiconductor device capable of reducing inductance between a high potential terminal and a low potential terminal while achieving downsizing of the semiconductor device. A semiconductor device includes: the insulating substrate; the circuit pattern including a low potential circuit pattern and a high potential circuit pattern provided on a region adjacent to the low potential circuit pattern; a plurality of semiconductor chips mounted on the circuit pattern; a low potential terminal having one end portion connected to the low potential circuit pattern; and a high potential terminal having one end portion connected to the high potential circuit pattern, wherein the high potential terminal and the low potential terminal include electrode parts and constituting parallel flat plates vertically disposed in parallel to each other and extending on a side of the low potential circuit pattern and electrode parts and protruding from the insulating substrate.
    Type: Grant
    Filed: November 15, 2021
    Date of Patent: January 2, 2024
    Assignee: Mitsubishi Electric Corporation
    Inventors: Hidetaka Matsuo, Ryo Goto, Yasutaka Shimizu
  • Patent number: 11855060
    Abstract: A package structure includes a circuit substrate, a semiconductor package, a lid structure and a plurality of first spacer structures. The semiconductor package is disposed on and electrically connected to the circuit substrate. The lid structure is disposed on the circuit substrate covering the semiconductor package, wherein the lid structure is attached to the circuit substrate through an adhesive material. The plurality of first spacer structures is surrounding the semiconductor package, wherein the first spacer structures are sandwiched between the lid structure and the circuit substrate, and includes a top portion in contact with the lid structure and a bottom portion in contact with the circuit substrate.
    Type: Grant
    Filed: July 27, 2022
    Date of Patent: December 26, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tsung-Fu Tsai, Chin-Fu Kao, Pu Wang, Szu-Wei Lu
  • Patent number: 11856694
    Abstract: The disclosure provides a circuit substrate and a method for manufacturing the same. The circuit substrate includes a wiring and a substrate having a base region and a circuit region. The base region having a first pattern is constituted by a first thermoplastic material. The circuit region having a second pattern is constituted by a second thermoplastic material. The first pattern has a portion opposite to the second pattern. The wiring is formed on the circuit region along the second pattern. The first thermoplastic material is different from the second thermoplastic material, and the second thermoplastic material includes a catalyst particle.
    Type: Grant
    Filed: August 31, 2020
    Date of Patent: December 26, 2023
    Assignee: National Taiwan University of Science and Technology
    Inventors: Chen-Hao Wang, Hsueh-Yu Chen, Guan-Cheng Tong
  • Patent number: 11849638
    Abstract: A piezo-electric actuator on the side of a mobile device will enable pressure exerted by the user to be sensed at the conventional button locations, while providing a haptic feedback. Unfortunately, mechanical integration of piezo-electric actuators at the side of a mobile device is challenging. A mobile device in accordance with the present disclosure comprises a PCB; an outer frame surrounding the PCB; and a switch. The switch comprises: a first piezo-electric actuator configured to generate a first actuator voltage signal in response to a first force applied by a user, and to generate a first haptic feedback to the user in response to a first haptic voltage signal transmitted from the controller thereto; and a first virtual button in the outer frame configured to transmit the first force to the first piezo-electric actuator, and to transmit the first haptic feedback to the user.
    Type: Grant
    Filed: October 17, 2022
    Date of Patent: December 19, 2023
    Assignee: Boréas Technologies Inc.
    Inventor: Guillaume Chauvette
  • Patent number: 11846987
    Abstract: A portable electronic device including a first body, a second body, a stand, and a hinge structure is provided. The stand has a first pivot part and a second pivot part opposite to the first pivot part, wherein the first pivot part is pivotally connected to the first body, and the second body is pivotally connected to the second pivot part. The hinge structure includes a first bracket secured to the second body, a second bracket secured to the second pivot part of the stand, a first movable base, a first shaft secured to the first bracket and pivoted to the first movable base, a second movable base, a second shaft secured to the first movable base and pivoted to the second movable base, and a sliding shaft fixed to the second movable base and slidably connected to the second bracket.
    Type: Grant
    Filed: May 26, 2022
    Date of Patent: December 19, 2023
    Assignee: Acer Incorporated
    Inventors: Chia-Bo Chen, Yi-Hsuan Yang, Hung-Chi Chen, Wu-Chen Lee
  • Patent number: 11848146
    Abstract: A stacked electronic module includes a magnetic device comprising a magnetic body with electrodes of the magnetic device being disposed on a top and bottom surface of the magnetic body, wherein a molding body encapsulates the magnetic body, wherein conductive layers are disposed on a top and bottom surface of the molding body for electrically connected to the electrodes of the magnetic device.
    Type: Grant
    Filed: May 12, 2021
    Date of Patent: December 19, 2023
    Assignee: CYNTEC CO., LTD.
    Inventors: Da-Jung Chen, Chien Ming Chen
  • Patent number: 11849549
    Abstract: The present application provides a flexible display device. A housing includes a first housing and a second housing, which are relatively slidably arranged. A first end of a flexible display screen is connected to the first support member of the first housing. A second end of the flexible display screen bypasses the second support member of the second housing and is connected to a stretching mechanism in the housing. A packaging member is disposed on at least one first side plate of the second housing and covers at least a portion of an edge of the flexible display screen. The present application prevents dust from intruding into a bottom of the flexible display.
    Type: Grant
    Filed: November 20, 2020
    Date of Patent: December 19, 2023
    Assignee: WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
    Inventor: Zikang Feng
  • Patent number: 11844185
    Abstract: The invention relates to an electrical equipment, in particular for electrical or hybrid vehicles, comprising a casing, said casing comprising a casing element comprising a side wall and defining an inner space. The side wall of the casing element comprises a material offset towards the inner space thereof forming a zone for connecting the positive terminal and the negative terminal of the electrical energy source such that said material offset overlaps the first electrical conductor and the second electrical conductor only making visible, from the outside of said side wall, the positive visible terminal and the negative visible terminal.
    Type: Grant
    Filed: February 25, 2021
    Date of Patent: December 12, 2023
    Assignee: VALEO SIEMENS EAUTOMOTIVE FRANCE SAS
    Inventors: Guillaume Tramet, Roger Deniot
  • Patent number: 11839068
    Abstract: Provided is an electric power converter that includes an inverter which includes plural electric parts, a smoothing capacitor configured to smooth electric power, a housing configured to house the inverter and the smoothing capacitor and a first conductor portion configured to connect the smoothing capacitor and the inverter. The housing includes a base portion made of a resin material and a cover portion attached to the base portion to cover the inverter and the smoothing capacitor. The inverter and the smoothing capacitor are mounted on the base portion. The first conductor portion is placed in the vicinity of or in contact with the base portion of the housing in the middle of connection between the smoothing capacitor and the inverter.
    Type: Grant
    Filed: February 18, 2019
    Date of Patent: December 5, 2023
    Assignee: NISSAN MOTOR CO., LTD.
    Inventors: Kimihiro Ono, Susumu Kumakura, Rei Takahashi
  • Patent number: 11837348
    Abstract: Systems and methods are disclosed that provide smart alerts to users, e.g., alerts to users about diabetic states that are only provided when it makes sense to do so, e.g., when the system can predict or estimate that the user is not already cognitively aware of their current condition, e.g., particularly where the current condition is a diabetic state warranting attention. In this way, the alert or alarm is personalized and made particularly effective for that user. Such systems and methods still alert the user when action is necessary, e.g., a bolus or temporary basal rate change, or provide a response to a missed bolus or a need for correction, but do not alert when action is unnecessary, e.g., if the user is already estimated or predicted to be cognitively aware of the diabetic state warranting attention, or if corrective action was already taken.
    Type: Grant
    Filed: September 19, 2022
    Date of Patent: December 5, 2023
    Assignee: Dexcom, Inc.
    Inventors: Anna Leigh Davis, Scott M. Belliveau, Naresh C. Bhavaraju, Leif N. Bowman, Rita M. Castillo, Alexandra Elena Constantin, Rian W. Draeger, Laura J. Dunn, Gary Brian Gable, Arturo Garcia, Thomas Hall, Hari Hampapuram, Christopher Robert Hannemann, Anna Claire Harley-Trochimczyk, Nathaniel David Heintzman, Andrea Jean Jackson, Lauren Hruby Jepson, Apurv Ullas Kamath, Katherine Yerre Koehler, Aditya Sagar Mandapaka, Samuel Jere Marsh, Gary A. Morris, Subrai Girish Pai, Andrew Attila Pal, Nicholas Polytaridis, Philip Thomas Pupa, Eli Reihman, Ashley Anne Rindfleisch, Sofie Wells Schunk, Peter C. Simpson, Daniel S. Smith, Stephen J. Vanslyke, Matthew T. Vogel, Tomas C. Walker, Benjamin Elrod West, Atiim Joseph Wiley
  • Patent number: 11821916
    Abstract: An electrical ground connector for use as part of a test connector in an integrated circuit (IC) device testing apparatus having a resilient connector for electrical grounding and comprising a dual elastomer contact stacked vertically above a rigid ground block. The height of the ground block can be adjusted to compensate for the lack of height of the dual elastomer contacts, so that the entire connector has enough height to maintain electrical connection between a load board of the testing apparatus and the IC device.
    Type: Grant
    Filed: March 31, 2022
    Date of Patent: November 21, 2023
    Assignee: JF MICROTECHNOLOGY SDN. BHD.
    Inventors: Wei Kuong Foong, Kok Sing Goh, Shamal Mundiyath, Eng Kiat Lee, Fadzhirul Ridhzwan Azry Bin Sulaiman
  • Patent number: 11822707
    Abstract: A tamper detection system may include organic material and a tamper detection circuit embedded in the organic material. A portion of the organic material is ablated away to form an incision in the organic material. A portion of the tamper detection circuit obstructs a fragment of the ablation path. The tamper detection circuit remains intact. The incision enables a gas flow between a first side of the organic material and a second side of the organic material.
    Type: Grant
    Filed: June 1, 2021
    Date of Patent: November 21, 2023
    Assignee: International Business Machines Corporation
    Inventors: William Santiago-Fernandez, Russell A. Budd, James Busby, Arthur J Higby, Michael Fisher, Silvio Dragone, Stefano Sergio Oggioni, David Clifford Long
  • Patent number: 11824575
    Abstract: A protective cover for a tablet computer includes a main body, a peripheral device and a protective cover signal transmission member. The main body includes a first supporting member and a second supporting member connected to each other and can be opened and closed relative to each other. The peripheral device is disposed on the first supporting member. The protective cover signal transmission member is disposed on the second supporting member and electrically connected with the peripheral device. The second supporting member supports the tablet computer. The tablet computer includes a computer signal transmission member. The protective cover signal transmission member is used to dock with the computer signal transmission member to perform signal transmission. One of the computer signal transmission member and the protective cover signal transmission member is an electrical block, and the other is an electrical guide rail. A portable electronic device is also provided.
    Type: Grant
    Filed: September 6, 2021
    Date of Patent: November 21, 2023
    Assignee: DARFON ELECTRONICS CORP.
    Inventors: Yu Chih Chang, Chin Lung Chan
  • Patent number: 11805617
    Abstract: A carrier for a storage device is provided. The carrier includes an accommodation bracket, a panel and an electromagnetic shielding element. The accommodation bracket has an open space. The panel has a handle. The electromagnetic shielding element is disposed between the accommodation bracket and the panel. The electromagnetic shielding element is engaged with the accommodation bracket.
    Type: Grant
    Filed: April 21, 2022
    Date of Patent: October 31, 2023
    Assignee: LITE-ON TECHNOLOGY CORPORATION
    Inventors: Cheng-Hsuen Chien, Yi-Feng Pu, Chen-Yuan Liu, Pei-Hsuan Huang
  • Patent number: 11791723
    Abstract: An apparatus for power conversion includes a transformation stage for transforming a first voltage into a second voltage. The transformation stage includes a switching network, a filter, and a controller. The filter is configured to connect the transformation stage to a regulator. The controller controls the switching network.
    Type: Grant
    Filed: December 22, 2021
    Date of Patent: October 17, 2023
    Assignee: pSemi Corporation
    Inventor: David Giuliano
  • Patent number: 11784112
    Abstract: An integrated circuit package is formed by positioning an integrated circuit die on a die pad of a leadframe; connecting a bond wire between the die and a bond pad of the leadframe; encapsulating the bond wire, die, and bond pad with an encapsulant material to form a first mold cap of the integrated circuit package; after the encapsulating, bending one or more leads of the leadframe to form one or more bent leads; and encapsulating the first mold cap and a portion of a bend of the one or more bent leads with the encapsulant material to form a second mold cap.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: October 10, 2023
    Assignee: NXP USA, Inc.
    Inventors: Jian Song, Jun Li, Xingshou Pang, Mingchuan Han, Jinzhong Yao, Xuesong Xu
  • Patent number: 11776892
    Abstract: A semiconductor device according to an embodiment includes: an insulating substrate having a first metal layer and a second metal layer on a surface of the insulating substrate; a semiconductor chip including an upper electrode and a lower electrode, the upper electrode being electrically connected to the first metal layer, the lower electrode being electrically connected to the second metal layer; a first main terminal including a first end and a second end, the first end being electrically connected to the first metal layer; a second main terminal including a third end and a fourth end, the third end being electrically connected to the second metal layer; a first detection terminal being electrically connected between the first end and the second end of the first main terminal; and a second detection terminal being electrically connected to the first metal layer.
    Type: Grant
    Filed: August 24, 2020
    Date of Patent: October 3, 2023
    Assignees: Kabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
    Inventors: Tomohiro Iguchi, Tatsuya Hirakawa
  • Patent number: 11776919
    Abstract: A semiconductor package includes a multilayer substrate, a device die, an insulating encapsulant, and a shielding structure. The multilayer substrate has a first surface and a second surface opposite to the first surface. The multilayer substrate includes through holes, and each of the through holes extends from the first surface to the second surface. The device die is disposed on the first surface of the multilayer substrate. The insulating encapsulant is disposed on the first surface of the multilayered substrate and encapsulating the device die. The shielding structure is disposed over the first surface of the multilayer substrate. The shielding structure includes a cover body and conductive pillars. The cover body covers the device die and the insulating encapsulant. The conductive pillars are connected to the cover body and fitted into the through holes of the multilayer substrate.
    Type: Grant
    Filed: August 5, 2022
    Date of Patent: October 3, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yang-Che Chen, Victor Chiang Liang, Chen-Hua Lin, Chwen-Ming Liu, Huang-Wen Tseng
  • Patent number: 11769762
    Abstract: A semiconductor package includes a lower redistribution layer having a plurality of lower ball pads forming a plurality of lower ball pad groups, a semiconductor chip on the lower redistribution layer, an expanded layer surrounding the semiconductor chip on the lower redistribution layer, and an upper redistribution layer on the semiconductor chip and the expanded layer and having a plurality of upper ball pads forming a plurality of upper ball pad groups. The number of the plurality of upper ball pad groups may be the same as the number of the of the plurality lower ball pad groups. Each of the upper ball pads in one of the plurality of upper ball pad groups, from among the plurality of upper ball pads, may be a dummy ball pad.
    Type: Grant
    Filed: January 28, 2021
    Date of Patent: September 26, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Daeho Lee, Kilsoo Kim
  • Patent number: 11756733
    Abstract: A ceramic electronic device includes a multilayer chip having a plurality of dielectric layers and a plurality of internal electrode layers that are stacked, and having a first main face and a second main face, and a plurality of external electrodes, the plurality of external electrodes being spaced from each other, each of the plurality of external electrodes being connected to a part of the plurality of internal electrode layers, the plurality of external electrodes having a predetermined area in the planar view. On at least one of the first main face and the second main face, at least one of the plurality of external electrodes has an extension portion extending along a side of the rectangular shape toward at least one of external electrodes adjacent to the at least one of the plurality of external electrodes.
    Type: Grant
    Filed: December 14, 2020
    Date of Patent: September 12, 2023
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Takumi Chigira, Jun Nishikawa
  • Patent number: 11742577
    Abstract: Microwave antenna systems include a parabolic reflector antenna having a feed bore and a feed assembly. The feed assembly includes a coaxial waveguide structure that extends through the feed bore, a sub-reflector, and a first dielectric block that is positioned between the coaxial waveguide structure and the sub-reflector. The coaxial waveguide structure includes a central waveguide and an outer waveguide that circumferentially surrounds the central waveguide. One of the central waveguide and the outer waveguide extends further from the feed bore towards the sub-reflector than the other of the central waveguide and the outer waveguide.
    Type: Grant
    Filed: July 15, 2022
    Date of Patent: August 29, 2023
    Assignee: CommScope Technologies LLC
    Inventors: Craig Mitchelson, Ronald J. Brandau, Thomas C. Tulloch, Griogair Whyte
  • Patent number: 11742253
    Abstract: An integrated circuit (IC) package that is to be incorporated into a computing device may include a metallization structure with circuits and/or other elements such as capacitors or inductors thereon. Pads for input/output (I/O) (or other) purposes may also be present at different locations on the metallization structure. Exemplary aspects of the present disclosure allow mold material to be placed over the circuits and/or other elements in readily-customizable configurations so as to allow placement of the I/O pads in any desired location on the metallization structure. Specifically, before the mold material is applied to the metallization structure, a mask material such as tape may be applied to portions of the metallization structure that contain I/O pads or otherwise have reasons to not have mold material thereon. The mold material is applied, and the mask material is removed, taking unwanted mold material with the mask material.
    Type: Grant
    Filed: December 3, 2020
    Date of Patent: August 29, 2023
    Assignee: QUALCOMM INCORPORATED
    Inventors: Sayok Chattopadhyay, Rajneesh Kumar, Srikanth Kulkarni
  • Patent number: 11736089
    Abstract: A quartz crystal resonator unit includes a quartz crystal resonator that includes a quartz crystal blank. A pair of excitation electrodes are disposed on opposed main surfaces of the quartz crystal blank so as to face each other. A pair of connection electrodes are electrically connected to respective ones of the pair of excitation electrodes. A base member has a surface on which the quartz crystal resonator is mounted. A lid member is joined to the surface of the base member via a joining member. The quartz crystal resonator is accommodated in an inner space defined by the lid member and the base member on the surface of the base member. Parts of the joining member that cover protruding portions are in contact with a side wall of the lid member so as to restrain movement of the lid member when seen in a plan view in a direction normal to the surface of the base member.
    Type: Grant
    Filed: March 5, 2019
    Date of Patent: August 22, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hiroshi Ibaragi, Hiroaki Kaida
  • Patent number: 11721193
    Abstract: Embodiments of the disclosure provide for a system and method for determining a circuit breaker position in a power distribution/load center. In one embodiment, the load center includes a plurality of circuit breakers. Each circuit breaker includes a base and a plurality of contact components coupled to the base. In that regard, an activation of a combination of the contact components indicates a position of the circuit breaker within the load center. The activation of the combination indicates that one or more of the contact components is in contact with one or more pegs coupled to the load center. When this occurs, a data transceiver coupled to each of the contact components transmits a data signal. The data signal includes a plurality of data bits, where each data bit indicates whether a corresponding contact component of the combination is activated or not activated.
    Type: Grant
    Filed: June 7, 2021
    Date of Patent: August 8, 2023
    Assignee: Schneider Electric USA, Inc.
    Inventors: Daniel Martin, Gregory Harrison, John Charles Foust, Matthew Furnari, Amy Gau
  • Patent number: 11723161
    Abstract: A frame for installing an arc-shaped LED display screen composed of a plurality of LED display modules. The top partition panel and the bottom partition panel have arc edges with the same arc, and are parallel to and spaced apart from each other and both fixed to the primary support, the secondary support, the plurality of module supports, the left support, and the right support. The left support, the right support, and the plurality of module supports are equally spaced apart and fixed along the arc edge of each of the top partition panel and the bottom partition panel, and are configured to connect the plurality of LED display modules, to achieve a seamless assemblage of the arc-shaped LED display screen.
    Type: Grant
    Filed: October 20, 2021
    Date of Patent: August 8, 2023
    Assignee: YAHAM OPTOELECTRONICS CO., LTD.
    Inventors: Weiqi Jiao, Xiaodong Wei, Zhenquan Fan, You Zeng
  • Patent number: 11719379
    Abstract: A position adjustment device for a display module and a display device including the same are provided. A position adjustment device for a display module includes: a first direction control module including a first stage to which a display module is fixable, the first stage being movable in a first direction; a second direction control module coupled to the first direction control module and including a second stage movable in a second direction perpendicular to the first direction, and a first controller coupled to the second stage; and a third direction control module coupled to the second direction control module and including a third stage movable in a third direction perpendicular to the first direction and crossing the second direction, and a second controller coupled to the third stage.
    Type: Grant
    Filed: August 31, 2021
    Date of Patent: August 8, 2023
    Assignee: Samsung Display Co., Ltd.
    Inventors: Jee-Na Lee, Junhee Son, Mansoo Kim
  • Patent number: 11694962
    Abstract: Embodiments may relate to a microelectronic package that includes an overmold material, a redistribution layer (RDL) in the overmold material, and a die in the overmold material electrically coupled with the RDL on an active side of the die. The RDL is configured to provide electrical interconnection within the overmold material and includes at least one mold interconnect. The microelectronic package may also include a through-mold via (TMV) disposed in the overmold material and electrically coupled to the RDL by the mold interconnect. In some embodiments, the microelectronics package further includes a surface mount device (SMD) in the overmold material. The microelectronics package may also include a substrate having a face on which the overmold is disposed.
    Type: Grant
    Filed: April 14, 2021
    Date of Patent: July 4, 2023
    Assignee: Intel Corporation
    Inventors: Georgios Dogiamis, Aleksandar Aleksov, Feras Eid, Telesphor Kamgaing, Johanna M. Swan
  • Patent number: 11688713
    Abstract: A method for fabricating a semiconductor die package includes: providing a semiconductor transistor die, the semiconductor transistor die having a first contact pad on a first lower main face and/or a second contact pad on an upper main face; fabricating a frontside electrical conductor onto the second contact pad and a backside electrical conductor onto the first contact pad; and applying an encapsulant covering the semiconductor die and at least a portion of the electrical conductor, wherein the frontside electrical conductor and/or the backside electrical conductor is fabricated by laser-assisted structuring of a metallic structure.
    Type: Grant
    Filed: January 15, 2021
    Date of Patent: June 27, 2023
    Assignee: Infineon Technologies Austria AG
    Inventors: Edward Fuergut, Irmgard Escher-Poeppel, Martin Gruber, Ivan Nikitin, Hans-Joachim Schulze
  • Patent number: 11682631
    Abstract: The present disclosure provides a semiconductor device package including a substrate having a first surface and a second surface opposite to the first surface, a first package body disposed on the first surface, and a conductive layer covering the first package body and the substrate. The conductive layer includes a first portion on the top surface of the first package body and a second portion on the lateral surface of the first package body and a sidewall of the substrate. The second portion of the conductive layer has a tapered shape. A method for manufacturing a semiconductor device package is also provided.
    Type: Grant
    Filed: June 11, 2021
    Date of Patent: June 20, 2023
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Ming-Hung Chen, Zheng Wei Wu
  • Patent number: 11682285
    Abstract: Embodiments of the disclosure provide for a system and method for determining a circuit breaker position in a power distribution/load center. In one embodiment, the load center includes a plurality of circuit breakers. Each circuit breaker includes a base and a plurality of contact components coupled to the base. In that regard, an activation of a combination of the contact components indicates a position of the circuit breaker within the load center. The activation of the combination indicates that one or more of the contact components is in contact with one or more pegs coupled to the load center. When this occurs, a data transceiver coupled to each of the contact components transmits a data signal. The data signal includes a plurality of data bits, where each data bit indicates whether a corresponding contact component of the combination is activated or not activated.
    Type: Grant
    Filed: June 7, 2021
    Date of Patent: June 20, 2023
    Assignee: Schneider Electric USA, Inc.
    Inventors: Daniel Martin, Gregory Harrison, John Charles Foust, Matthew Furnari, Amy Gau
  • Patent number: 11647602
    Abstract: A radar sensor for a vehicular radar sensing system includes a housing structure and at least one printed circuit board (PCB). The housing structure includes a front housing and a rear housing. The PCB is accommodated between the front housing and the rear housing in a cavity established when the front housing and the rear housing are joined together. The rear housing may be joined to the front housing via an intermediate frame disposed between the front housing and the rear housing, with the rear housing secured to the intermediate frame via a plurality of fasteners and with the front housing secured to the intermediate frame via welding.
    Type: Grant
    Filed: August 16, 2021
    Date of Patent: May 9, 2023
    Assignee: MAGNA ELECTRONICS INC.
    Inventor: Christian Mai
  • Patent number: 11615994
    Abstract: A module includes an electronic component, an enclosure at least partially enclosing the electronic component and defining a module interface at which the module is configured to be mounted on a mounting base, and a gas flow-inhibiting sealing at the module interface and configured to inhibit gas from propagating from an exterior of the module towards the electronic component. An electronic device that includes the module and a method of manufacturing the module are also described.
    Type: Grant
    Filed: March 15, 2021
    Date of Patent: March 28, 2023
    Assignee: Infineon Technologies AG
    Inventors: Johannes Uhlig, Sven Hagebusch, Marco Ludwig, Ulrich Nolten
  • Patent number: 11611182
    Abstract: An interface having a frame with a plurality of slots, a first pass-through insert in the frame and a second pass-through insert in the frame. The first pass-through insert and the second pass-through insert each have a housing and a contact with the type of contact in the first pass-through insert is different than the type of contact in the second pass-through housing.
    Type: Grant
    Filed: November 9, 2020
    Date of Patent: March 21, 2023
    Assignee: Virginia Panel Corporation
    Inventors: David L Rocker, Randall L Herron, Randall C Garman, Darryl M Ashby
  • Patent number: 11605602
    Abstract: The disclosed current-distribution inductor may include (1) a magnetic core and (2) a conductor electrically coupled between a power source and an electrical component of a circuit board, wherein the conductor comprises (A) a bend that passes through the magnetic core and (B) a flying lead that extends from the bend to the electrical component of the circuit board and runs parallel with the circuit board. Various other apparatuses, systems, and methods are also disclosed.
    Type: Grant
    Filed: March 31, 2020
    Date of Patent: March 14, 2023
    Assignee: Juniper Networks, Inc.
    Inventors: Marshall J. Lise, Anupama Padminidevi Karthikeyan Nair, David K. Owen
  • Patent number: 11605840
    Abstract: A battery provided with at least one battery cell electrically coupled to a battery management circuitry, a power regulation and supply circuitry, a USB-C port controller, an E-marker integrated circuit and a USB interface. The E-marker integrated circuit provided in-line along a CC conductor between the USB-C port controller and the USB interface. The USB-C port controller is configured to enable the E-marker integrated circuit upon reception of a vendor defined message via the USB interface which enables a high power delivery mode between the battery and a device without the presence of a separate interconnecting E-marker cable there between.
    Type: Grant
    Filed: March 25, 2021
    Date of Patent: March 14, 2023
    Assignee: Xentris Wireless LLC
    Inventors: Vivek Patel, Rick Nowinski
  • Patent number: 11606887
    Abstract: A drive carrier for retaining a persistent storage drive in an enclosure. The drive carrier includes a mounting bracket, a handle coupled to the mounting bracket, and an electromagnetic interference (“EMI”) shielding apparatus disposed between mounting bracket and at least a portion of the handle. The mounting bracket is shaped to be coupled to the persistent storage drive. The EMI-shielding apparatus includes a plurality of EMI-shielding fingers. Each EMI-shielding finger includes a lower surface, an upper surface that is approximately parallel to the lower surface, and a contoured surface extending between the lower surface and the upper surface.
    Type: Grant
    Filed: July 19, 2021
    Date of Patent: March 14, 2023
    Assignee: Dell Products L.P.
    Inventors: Eduardo Escamilla, Bernard D. Strmiska
  • Patent number: 11600960
    Abstract: Disclosed herein are various implementations of communications connectors. In some implementations, a communications plug may include a housing and a body positioned in the housing. A flexible printed circuit board (PCB) may be wrapped at least partially around the body, a and a plurality of metal contact pads may be positioned on the flexible PCB to mate with plug interface contacts (PICs) of a communications jack when the communications plug is inserted into the communications jack.
    Type: Grant
    Filed: April 3, 2018
    Date of Patent: March 7, 2023
    Assignee: Panduit Corp.
    Inventors: Masud Bolouri-Saransar, Ronald A. Nordin, Paul W. Wachtel, Surendra Chitti Babu
  • Patent number: 11594517
    Abstract: A semiconductor device includes a first lead, a second lead, a control element, an insulating element, and a driver element. The control element and insulating element are mounted on a first pad portion of the first lead, while the driver element on a second pad portion of the second lead. In plan view, the first pad portion has a first edge adjacent to the second pad portion in a first direction and extending in a second direction perpendicular to the first direction. The first edge has first and second ends opposite in the second direction. The second pad portion has a second edge adjacent to the first edge and extending in the second direction. The second edge has third and fourth ends opposite in the second direction. One of the third and fourth end is located between the first and second end in the second direction.
    Type: Grant
    Filed: June 26, 2019
    Date of Patent: February 28, 2023
    Assignee: ROHM CO., LTD.
    Inventor: Tomohira Kikuchi
  • Patent number: 11594903
    Abstract: A power storage system of the present technology includes a battery board configured to accommodate a secondary battery, a branch board, a first frame on which the battery board is placed, a second frame on which the branch board is placed, and a plurality of connection wirings that are disposed in the first frame and the second frame and connects the battery board and the branch board. The plurality of connection wirings are aggregated in the second frame.
    Type: Grant
    Filed: February 21, 2020
    Date of Patent: February 28, 2023
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Naoyuki Sugeno, Koji Umetsu
  • Patent number: 11587594
    Abstract: Provided is a heat-dissipating, shock-absorbing structure which is applicable to an electronic module with a hard disk drive. The heat-dissipating, shock-absorbing structure includes a heat-dissipating frame, an elastomer, and a plurality of heat conduction layers. The heat-dissipating frame has a fixing segment and two extending segments. The extending segments connect with two ends of the fixing segment. The fixing segment connects with one side of the hard disk drive. The distance between the extending segments is greater than the thickness of the hard disk drive. At least a portion of the elastomer is disposed at the extending segments. The heat conduction layers cover the elastomer.
    Type: Grant
    Filed: July 8, 2021
    Date of Patent: February 21, 2023
    Assignee: GETAC TECHNOLOGY CORPORATION
    Inventor: Hung-Chan Cheng
  • Patent number: 11588213
    Abstract: Implantable medical devices that include a battery to power circuitry utilize a battery connector to electrically interconnect the battery to the circuitry. The battery connector may be mounted directly to a device housing to have the battery connector a fixed position within the device. Battery terminals of the battery are electrically connected to terminals on the battery connector, and the terminals on the battery connector are electrically connected to power terminals of the circuitry. The battery connector may include various features such as mounting grooves formed in a connector body, tapered pins to connect to power terminals on a circuit board, as well as plates to engage the battery terminals. The device housing may provide mounting features that allow the battery connector to be affixed directly to the device housing.
    Type: Grant
    Filed: May 3, 2021
    Date of Patent: February 21, 2023
    Assignee: MEDTRONIC, INC.
    Inventors: Steven Deininger, Jeffrey Clayton, Randy Roles, Darren Janzig, Paul Eichstaedt
  • Patent number: 11576278
    Abstract: Example implementations relate to a dual-sided fan tray assembly of an electronic system. The fan tray assembly includes a housing having a front panel, a back panel, and a pair of side walls coupled to the front and back panels. The fan tray assembly further includes a handle assembly pivotably connected to the pair of side walls such that the handle assembly is at least rotatable around the housing to at least first and second positions spaced apart from each other. When the handle assembly is rotated to the first position, the fan tray assembly is slidably insertable into a chassis of an electronic system with the front panel facing the chassis to install the fan tray assembly to the electronic system. When the handle assembly is rotated to the second position, the fan tray assembly is slidably insertable into the chassis with the back panel facing the chassis.
    Type: Grant
    Filed: January 8, 2021
    Date of Patent: February 7, 2023
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: See Yun Yow, Hong Yi Wee, Kelly Khe Liq Khoo