Module Patents (Class 361/728)
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Patent number: 12044890Abstract: An optical module unlocking apparatus includes: a base, a sliding member, a driving piece, and an elastic piece. The sliding member is slidably disposed on the base along an insertion direction. The driving piece is rotatably connected to the base, the other end of the sliding member is connected to the driving piece, and the driving piece can rotate from a locked state to an unlocked state relative to the base under an action of external force, and drive the sliding member to move relative to the base along the insertion direction. A second connecting part is disposed on the driving piece. Because the driving piece is located outside a cage, space for disposing the elastic piece on the driving piece is sufficient, and the driving piece does not need to fit a spring plate. This simplifies a structure of the optical module and improves processing efficiency.Type: GrantFiled: June 29, 2022Date of Patent: July 23, 2024Assignee: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Yabing Zhu, Song Yang, Liang Xu, Yu Huang
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Patent number: 12046539Abstract: A semiconductor module includes a resin case housing a semiconductor element; an insulating layer extending outward from the resin case; and a first external connection terminal extending outward from the resin case, arranged above the insulating layer so as to face the insulting layer, the first external connection terminal having a non-contact portion that is not in contact with the insulating layer in a thickness direction of the insulating layer at a position overlapping the insulating layer in a plan view.Type: GrantFiled: December 6, 2021Date of Patent: July 23, 2024Assignee: FUJI ELECTRIC CO., LTD.Inventors: Yuichiro Hinata, Yuma Murata, Naoyuki Kanai, Ryoichi Kato
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Patent number: 12035515Abstract: A robust, reliable, and efficient UHD HDR Internet Protocol IP client device, such as a set top box, receives content, for example, from a cable service provider so that the content can be displayed to a compatible display device with improved visual effect. The content is 4K or higher content that requires UHD/HDR for a satisfactory user experience. The UHD provides for an improved resolution of the content while HDR provides for a more intense or greater contrast range of the content when displayed on a compatible display device.Type: GrantFiled: February 11, 2022Date of Patent: July 9, 2024Assignee: ARRIS ENTERPRISES LLCInventors: Robert Sagar, James Anderson, Brian M. Carroll, Ian Clarke, Qiang Bai
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Patent number: 12029062Abstract: A display panel and a display device are provided. The display panel includes a display area and a non-display area surrounding the display area; a first substrate and a second substrate disposed opposite to the first substrate; a plurality of supporting pillars disposed between the first substrate and the second substrate and located in the display area; and an adhesive layer disposed between the first substrate and the second substrate and located in the non-display area. The second substrate includes a plurality of film layers, the plurality of film layers include a polarizer and at least one first layer, and a thickness of a portion of the at least one first layer located in the display area is greater than a thickness of a portion of the at least one first layer located in the non-display area.Type: GrantFiled: March 18, 2022Date of Patent: July 2, 2024Assignees: Wuhan Tianma Micro-Electronics Co., Ltd., Wuhan Tianma MicroElectronics Co., Ltd. Shanghai BranchInventors: Huiping Chai, Baoyan Chai, Lijing Han, Yuantao Wu
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Patent number: 12022269Abstract: Various implementations include portable speakers configured to adjust audio output based on detected input connections. In certain cases, a portable speaker includes: an enclosure housing: at least one electro-acoustic transducer for providing an audio output; a processor coupled with the transducer; an audio input module coupled with the processor for receiving audio input signals; and a battery configured to power the at least one transducer, the processor, and the audio input module; an input channel for receiving a hard-wired audio input connection; and at least one wireless input channel for receiving an audio input from a source device via a wireless connection, where the processor is configured to: adjust an audio signal received from the hard-wired audio input connection if a source device is already connected via the wireless connection.Type: GrantFiled: January 25, 2022Date of Patent: June 25, 2024Assignee: Bose CorporationInventors: Craig Jackson, Thomas Daly, David Ostrer, Jayesh Dilip Sarode
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Patent number: 12019408Abstract: A wearable product includes a display system, a rear housing, a middle frame, a printed circuit board, and a conductive component. The rear housing is located on a non-light-emitting side of the display system. The middle frame is located between the display system and the rear housing, and is a hollow frame structure. The middle frame includes a metal frame and a plastic frame nested in the metal frame and connected to the metal frame. The plastic frame is connected to the display system and the rear housing in a sealing manner to form an accommodation cavity. The printed circuit board is located in the accommodation cavity. A part of the conductive component is located in the accommodation cavity and electrically connected to the printed circuit board, and the other part of the conductive component passes through the plastic frame to be electrically connected to the metal frame.Type: GrantFiled: April 14, 2020Date of Patent: June 25, 2024Assignee: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Rongguang Yang, Menglong Zhao, Jie Li, Bing Liu, Bin Zhang
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Patent number: 12016110Abstract: An electronic device is provided that includes a PCB and a cooling system adapted to pull heat away from a first side of the PCB and dissipate the heat through a back surface of the electronic device. The cooling system includes a heat pipe that wraps around PCB. The cooling system further includes an active heat transfer device positioned adjacent to a second portion of the heat pipe, the active heat transfer device being adapted to absorb heat through a first surface and release the heat through a second surface of the active heat transfer device. The cooling system further includes a first passive heat transfer element that forms the back surface of the electronic device and that conducts the heat received from the active heat transfer device out of the electronic device.Type: GrantFiled: January 31, 2022Date of Patent: June 18, 2024Assignee: Microsoft Technology Licensing, LLCInventors: Kang-Ming Chuang, Yi-Ming Kao
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Patent number: 11997822Abstract: A chassis assembly includes a rack chassis and a block assembly. The rack chassis includes a left side panel and a right side panel that are made from one continuous single material. The left side panel includes a left rail guide, and the right side panel includes a right rail guide. The block assembly is adapted to slide into the rack chassis and includes a top cover, a left sidewall, and a right sidewall that are interconnected. The left sidewall of the block assembly includes a left rail adapted to slide into the left rail guide when the block assembly is located leftmost of the rack chassis. The right sidewall of the block assembly includes a right rail that is adapted to slide into the right rail guide when the block assembly is located rightmost of the rack chassis.Type: GrantFiled: October 25, 2021Date of Patent: May 28, 2024Assignee: Dell Products L.P.Inventors: Jean Marie Doglio, Richard W. Guzman, Sean P. O'Donnell, Nicholas Adam Kelly, Robert G. Bassman
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Patent number: 11993247Abstract: An intelligent power module includes: a heat radiation device; an attachment frame disposed on a mounting surface of the heat radiation device; a power semiconductor module mounted on the attachment frame and configured to seal a semiconductor device; and a drive circuit part mounted on the power semiconductor module via a heat insulating sheet and configured to drive the power semiconductor module.Type: GrantFiled: February 7, 2022Date of Patent: May 28, 2024Assignee: ROHM CO., LTD.Inventor: Hideki Sawada
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Patent number: 11974420Abstract: A solid state drive apparatus includes a case including a base and side walls extending upward along a circumference of the base, an electrostatic prevention structure of a metal pillar spaced apart from the side walls and protruding from at least a partial surface of the base and an electrostatic absorbing member on at least a partial surface of the metal pillar, a package substrate module mounted on the electrostatic prevention structure in the case, and a cover covering the case and the package substrate module.Type: GrantFiled: January 4, 2023Date of Patent: April 30, 2024Assignee: Samsung Electronics Co., Ltd.Inventors: Sung-ki Lee, In-sub Kwak, Il-han Yun
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Patent number: 11973036Abstract: A method of manufacturing a semiconductor package structure is provided. The method includes providing a first carrier, forming a patterned buffer layer over the first carrier, forming a first redistribution structure that includes forming a first dielectric layer on the patterned buffer layer, after an electrical testing by applying an electric signal towards the first redistribution structure, removing the first carrier, removing portions of the first dielectric layer, resulting in a patterned first dielectric layer, the patterned first dielectric layer exposing portions of the first circuit layer, removing the exposed portions of the first circuit layer, using the patterned first dielectric layer as a mask, resulting in a patterned first circuit layer, and forming an electric conductor in a recess defined by the patterned first dielectric layer and the patterned first circuit layer.Type: GrantFiled: September 13, 2021Date of Patent: April 30, 2024Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventor: Ting-Yang Chou
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Patent number: 11968807Abstract: A computing device includes a bezel and an enclosure. The bezel includes an air circulation component and a heater apparatus. The enclosure includes a plurality of hardware components, and the bezel is affixed to a frontside of the enclosure and configured to heat an internal volume of the enclosure.Type: GrantFiled: January 14, 2022Date of Patent: April 23, 2024Assignee: Dell Products L.P.Inventors: Eric Michael Tunks, Ayedin Nikazm, Richard Mark Eiland, Tyler Baxter Duncan
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Patent number: 11961825Abstract: Disclosed is a microelectronic device assembly comprising a substrate having conductors exposed on a surface thereof. Two or more stacks of microelectronic devices are located on the substrate, and microelectronic devices of the stacks are connected to vertical conductive paths external to the stacks and extending to the substrate and to lateral conductive paths extending between the stacks. Methods of fabrication are also disclosed.Type: GrantFiled: June 7, 2022Date of Patent: April 16, 2024Assignee: Micron Technology, Inc.Inventors: Aparna U. Limaye, Dong Soon Lim, Randon K. Richards, Owen R. Fay
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Patent number: 11956020Abstract: An apparatus and method for signaling and transmitting data through an optical link is described. The apparatus may include a connector including a first plurality of contacts compatible with an enhanced SFP (SFP+) connector. The connector further includes an additional contact formed at a space adjacent to the first plurality of contacts. A tone generator couples to the additional contact to receive a first signal and to generate a first distinct tone indicative of the first signal for transmission via the additional contact. The method may include generating a first distinct tone indicative of a first signal providing control or status of an apparatus and transmitting or receiving a differential data signal over a portion of a first plurality of contacts compatible with an enhanced SFP (SFP+) connector. The first distinct tone is transmitted over the additional contact formed in a space adjacent to the first plurality of contacts.Type: GrantFiled: January 27, 2022Date of Patent: April 9, 2024Assignee: II-VI DELAWARE, INC.Inventors: Giuliano Coli, Stephen T. Nelson, Henry M. Daghighian
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Patent number: 11953946Abstract: A portable keyboard structure includes a plastic substrate, multiple metal support plates, a plastic bottom cover and multiple buffer members. The plastic substrate has a mounting surface, the metal support plates are mounted on corners of the mounting surface, the plastic bottom cover is disposed corresponding to the mounting surface and in conjunction with the plastic substrate clamps and secures the metal support plates, and the buffer members are respectively configured corresponding to the metal support plates. Each buffer member includes a fixing portion and a protection portion, the fixing portion are respectively disposed at the corresponding metal support plates, and the protection portions respectively envelop corners of the plastic substrate. Thus, the weight of the keyboard structure is significantly reduced, the production cost is lowered, and certain structural strength and fall-resistance are maintained at the same time.Type: GrantFiled: January 27, 2022Date of Patent: April 9, 2024Assignee: GETAC TECHNOLOGY CORPORATIONInventor: Yao-Kun Cheng
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Patent number: 11956493Abstract: The disclosure relates to modem and router modules for use with digital display systems, including televisions. A modem module is configurable to attach to a set-top box, a set-back box, directly to a digital display, or may even be integrated into display equipment. Router functions and ports can be integrated into the module to provide for networking of additional devices in proximity to the module and/or display, using either or both wired and wireless access technologies. Systems including the module convert power to the appropriate forms for delivery to the different devices, hardware, and components associated with the module. The modem and routing functions are configurable to provide separate security domains to isolate or direct traffic among the various networked devices.Type: GrantFiled: October 7, 2020Date of Patent: April 9, 2024Assignee: Blonder Tongue Laboratories, Inc.Inventors: Joshua T. Blanton, Robert J. Palle, Nezam T. Nikoo
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Patent number: 11951700Abstract: A method for encapsulating electronic devices comprises, successively, placing a profiled strip on a conveyor belt, the profiled strip comprising a base, at least one flap protruding with respect to said base; positioning an electronic device, in the longitudinal direction, on the receiving zone of the profiled strip; and plastically deforming the flap by application of an application force in a predetermined direction.Type: GrantFiled: April 9, 2020Date of Patent: April 9, 2024Assignee: COMPAGNIE GENERALE DES ETABLISSEMENTS MICHELINInventors: Guillaume Portier, Nicolas Eyroulet, Claude Lallement, Baptiste Forichon
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Patent number: 11949393Abstract: This application relates to an independent active electromagnetic interference filter module. In one aspect, the filter module includes a first element group including a noise sensing unit provided to sense electromagnetic noise, and a second element group including a compensating unit provided to generate a compensation signal for the electromagnetic noise. The first group and the second group may be respectively mounted on different substrates. According to some embodiments, the filter module can reduce a volume of each element constituting an electromagnetic interference filter module, implement a single modularization of a compact structure. The filter module can also improve electromagnetic interference noise reduction performance and a manufacturing method thereof.Type: GrantFiled: September 27, 2021Date of Patent: April 2, 2024Assignees: EM Coretech Co., Ltd., UNIST (Ulsan National Institute of Science and Technology)Inventors: Sang Yeong Jeong, Jin Gook Kim
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Patent number: 11940854Abstract: A replacement device includes a replacement module and a slider. The replacement module includes a sliding portion. The sliding portion is provided with a limiting column, which is formed with a fixing hole. The slider includes a slider body. The slider body is provided with a first latch, a limiting hole and a fixing element, wherein the first latch is arranged on a first side edge of the slider body. The slider is correspondingly arranged on the sliding portion of the replacement module, and the limiting column of the sliding portion passes through the limiting hole. The fixing element has a top portion, and is fixed in the fixing hole. The size of the top portion is greater than the size of the limiting hole, so that the slider moves relative to the replacement module within a limit range of the limiting hole.Type: GrantFiled: November 4, 2022Date of Patent: March 26, 2024Assignee: GETAC TECHNOLOGY CORPORATIONInventors: Hsin-Chih Chou, Wan-Lin Hsu, Juei-Chi Chang
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Patent number: 11937396Abstract: A computing device includes a top cover, a heater apparatus, a plurality of temperature sensors, and a heating control component. The heater apparatus includes a heater component and a connector, and the heater component is affixed to the top cover. The plurality of temperature sensors are operatively connected to the heating control component. The heating control component configured to manage the heater apparatus using the plurality of temperature sensors.Type: GrantFiled: January 14, 2022Date of Patent: March 19, 2024Assignee: Dell Products L.P.Inventors: Eric Michael Tunks, Ayedin Nikazm, Joseph Andrew Vivio
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Patent number: 11930602Abstract: A shell structure includes a shell and a shielding cover. The shell has an accommodating space, the accommodating space has an inner wall, and the inner wall has a first buckling portion. The shielding cover is arranged in the accommodating space, the shielding cover has an outer wall, the outer wall corresponds to the inner wall, and the outer wall has a second buckling portion corresponding to the first buckling portion. The first buckling portion and the second buckling portion are buckled with each other to limit relative degrees of freedom of the shell and the shielding cover.Type: GrantFiled: March 3, 2021Date of Patent: March 12, 2024Inventor: Po-Sheng Lee
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Patent number: 11908607Abstract: A multilayer coil component includes a multilayer body that includes insulating layers that are stacked; a coil disposed in the multilayer body; and outer electrodes disposed on surfaces of the multilayer body and electrically connected to the coil. The coil includes at least two coil conductor groups that each include at least two coil conductors connected to each other in parallel through two coupling conductors. The at least two coil conductor groups are connected to each other in series through a connecting conductor. The connecting conductor connects the coil conductor between the two coupling conductors in one of the at least two coil conductor groups to the coil conductor between the two coupling conductors in another one of the at least two coil conductor groups.Type: GrantFiled: March 9, 2021Date of Patent: February 20, 2024Assignee: Murata Manufacturing Co., Ltd.Inventors: Makoto Hiraki, Ryohei Kawabata, Katsuhisa Imada
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Patent number: 11910544Abstract: A control unit having a connection structure for connecting components of the control unit to a base plate which eliminates the need for separate fasteners. The control unit includes circuitry mounted to a PCB, and the PCB is pre-assembled to a base plate, to form a pre-assembly. During assembly, the PCB and the base plate are aligned when placed in a tooling device which clamps and holds the pre-assembly in place during the over molding process. The circuitry is over molded with an epoxy material, such that the epoxy material flows from a top side of the PCB to underneath the base plate, and the PCB is fixed to the base plate without the use of fasteners such as screws, or adhesive materials.Type: GrantFiled: May 2, 2022Date of Patent: February 20, 2024Assignee: Vitesco Technologies USA, LLCInventors: Uwe Stephan, Donald J. Zito
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Patent number: 11879752Abstract: A sensor module as well as a method for manufacturing a sensor module for determining a property of a fluid, in particular for measuring air quality, comprises a printed circuit board, at least one sensor on the printed circuit board for measuring a parameter of the surrounding air and a housing for the printed circuit board. A part of the printed circuit board protrudes from an opening in the housing (10), wherein the at least one sensor (21, 22) is located on a front side of the protruding part of the printed circuit board. In addition, at least the front side of the protruding part of the printed circuit board, with the exception of a recess for the at least one sensor, is encapsulated with a filling compound. The sensor module can be used in an interior or an air duct of motor vehicles or buildings. In one embodiment, the sensor module measures temperature, relative humidity and gas concentration in a fluid, especially in the surrounding air.Type: GrantFiled: October 23, 2018Date of Patent: January 23, 2024Assignee: Sensirion AGInventors: Stephan Braun, Tobias Schmid, Thomas Brugger, Matthias Merz, Manuel Becker
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Patent number: 11874512Abstract: An optical module includes: a module body that is configured to be inserted into a cage, at an entrance of the cage an electromagnetic wave shielding terminal being provided, and has a groove formed on one surface thereof and configured to engage with a latch part formed on the cage; and an engagement release member including a body that is provided with a pull tab, the body being slidably attached to the module body and configured to slide in response to an external force, and an arm part that extends from the body along the groove, and slides with respect to the groove in conjunction with the sliding of the body and release the engagement in a state in which the electromagnetic wave shielding terminal is pressed. The module body has a concave part on a surface of the groove, the surface being in contact with the arm part.Type: GrantFiled: October 9, 2020Date of Patent: January 16, 2024Assignee: FUJITSU OPTICAL COMPONENTS LIMITEDInventor: Kazuyuki Kuramochi
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Patent number: 11876315Abstract: A pluggable network interface device is provided comprising a split-shell housing having a shielded side portion that protects a side of a circuit substrate disposed in the split-shell housing. The split-shell housing comprises a first shell portion that covers a first side of the circuit substrate and a second shell portion that covers a second side of the circuit substrate that is arranged opposite the first side. The shielded side portion is inset from a width of the split-shell housing and offset a distance from an electrical interconnection end of the circuit substrate. The shielded side portion is arranged at least partially in a notch of the circuit substrate disposed at the electrical interconnection end of the circuit substrate.Type: GrantFiled: June 29, 2021Date of Patent: January 16, 2024Assignee: MELLANOX TECHNOLOGIES, LTD.Inventors: Jamal Mousa, Nimer Hazin
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Patent number: 11873424Abstract: According to various embodiments, an electronic apparatus comprises: a housing including a first plate, a second plate facing in the opposite direction as the first plate, and side members surrounding the space between the second plate and the second plate; a printed circuit board which is disposed within the space and on which at least one electrical component is mounted; a shield can mounted on the printed circuit board and disposed to surround the at least one electrical component; and an insulating tape member attached to the inner surface of the shield can between the shield can and the electrical component. The insulating tape member may include: a first layer including a first material and formed to a first thickness; a second layer laminated on the first layer by means of an adhesive, including a second material, and formed to a second thickness that is the same as or thicker than the first thickness; and an adhesive layer formed on the second layer and for being attached to the shield can.Type: GrantFiled: May 29, 2019Date of Patent: January 16, 2024Assignee: Samsung Electronics Co., Ltd.Inventors: Daum Hwang, Sangin Baek
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Patent number: 11871505Abstract: Tools and techniques are described to automate line testing when wiring devices (such as equipment and sensors) to controllers. Controllers have access to databases of the devices that are controlled by them, including wiring diagrams and protocols, such that the controller can automatically check that each wire responds correctly to stimulus from the controller. After testing, a reporting device rapidly shows the results of the line testing.Type: GrantFiled: January 18, 2021Date of Patent: January 9, 2024Assignee: PassiveLogic, Inc.Inventors: Troy Aaron Harvey, Jeremy David Fillingim
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Patent number: 11862553Abstract: An object is to provide a semiconductor device capable of reducing inductance between a high potential terminal and a low potential terminal while achieving downsizing of the semiconductor device. A semiconductor device includes: the insulating substrate; the circuit pattern including a low potential circuit pattern and a high potential circuit pattern provided on a region adjacent to the low potential circuit pattern; a plurality of semiconductor chips mounted on the circuit pattern; a low potential terminal having one end portion connected to the low potential circuit pattern; and a high potential terminal having one end portion connected to the high potential circuit pattern, wherein the high potential terminal and the low potential terminal include electrode parts and constituting parallel flat plates vertically disposed in parallel to each other and extending on a side of the low potential circuit pattern and electrode parts and protruding from the insulating substrate.Type: GrantFiled: November 15, 2021Date of Patent: January 2, 2024Assignee: Mitsubishi Electric CorporationInventors: Hidetaka Matsuo, Ryo Goto, Yasutaka Shimizu
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Patent number: 11858332Abstract: The present application provides a battery, a power consumption apparatus, and a method for producing a battery. The battery includes a box body, a battery module and a mounting plate, the battery module is disposed in the box body and includes a battery cell arrangement structure and a first end plate, the battery cell arrangement structure includes a plurality of battery cells stacked and is disposed on one side of the battery cell arrangement structure, the first end plate is fixedly connected to the battery cell arrangement structure, the mounting plate is disposed between the first end plate and the box body and is fixedly connected to the box body; the first end plate has a first elastic support part configured to be capable of abutting the mounting plate, being squeezed by the battery cell arrangement structure and deforming when the battery cell arrangement structure expands.Type: GrantFiled: November 22, 2021Date of Patent: January 2, 2024Assignee: CONTEMPORARY AMPEREX TECHNOLOGY CO., LIMITEDInventors: Wenhui Zhang, Kangyu Wang, Mu Qian, Wencai Xu, Zengzhong Wang, Jinqing Ji
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Patent number: 11856694Abstract: The disclosure provides a circuit substrate and a method for manufacturing the same. The circuit substrate includes a wiring and a substrate having a base region and a circuit region. The base region having a first pattern is constituted by a first thermoplastic material. The circuit region having a second pattern is constituted by a second thermoplastic material. The first pattern has a portion opposite to the second pattern. The wiring is formed on the circuit region along the second pattern. The first thermoplastic material is different from the second thermoplastic material, and the second thermoplastic material includes a catalyst particle.Type: GrantFiled: August 31, 2020Date of Patent: December 26, 2023Assignee: National Taiwan University of Science and TechnologyInventors: Chen-Hao Wang, Hsueh-Yu Chen, Guan-Cheng Tong
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Patent number: 11855060Abstract: A package structure includes a circuit substrate, a semiconductor package, a lid structure and a plurality of first spacer structures. The semiconductor package is disposed on and electrically connected to the circuit substrate. The lid structure is disposed on the circuit substrate covering the semiconductor package, wherein the lid structure is attached to the circuit substrate through an adhesive material. The plurality of first spacer structures is surrounding the semiconductor package, wherein the first spacer structures are sandwiched between the lid structure and the circuit substrate, and includes a top portion in contact with the lid structure and a bottom portion in contact with the circuit substrate.Type: GrantFiled: July 27, 2022Date of Patent: December 26, 2023Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Tsung-Fu Tsai, Chin-Fu Kao, Pu Wang, Szu-Wei Lu
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Patent number: 11848146Abstract: A stacked electronic module includes a magnetic device comprising a magnetic body with electrodes of the magnetic device being disposed on a top and bottom surface of the magnetic body, wherein a molding body encapsulates the magnetic body, wherein conductive layers are disposed on a top and bottom surface of the molding body for electrically connected to the electrodes of the magnetic device.Type: GrantFiled: May 12, 2021Date of Patent: December 19, 2023Assignee: CYNTEC CO., LTD.Inventors: Da-Jung Chen, Chien Ming Chen
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Patent number: 11849638Abstract: A piezo-electric actuator on the side of a mobile device will enable pressure exerted by the user to be sensed at the conventional button locations, while providing a haptic feedback. Unfortunately, mechanical integration of piezo-electric actuators at the side of a mobile device is challenging. A mobile device in accordance with the present disclosure comprises a PCB; an outer frame surrounding the PCB; and a switch. The switch comprises: a first piezo-electric actuator configured to generate a first actuator voltage signal in response to a first force applied by a user, and to generate a first haptic feedback to the user in response to a first haptic voltage signal transmitted from the controller thereto; and a first virtual button in the outer frame configured to transmit the first force to the first piezo-electric actuator, and to transmit the first haptic feedback to the user.Type: GrantFiled: October 17, 2022Date of Patent: December 19, 2023Assignee: Boréas Technologies Inc.Inventor: Guillaume Chauvette
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Patent number: 11849549Abstract: The present application provides a flexible display device. A housing includes a first housing and a second housing, which are relatively slidably arranged. A first end of a flexible display screen is connected to the first support member of the first housing. A second end of the flexible display screen bypasses the second support member of the second housing and is connected to a stretching mechanism in the housing. A packaging member is disposed on at least one first side plate of the second housing and covers at least a portion of an edge of the flexible display screen. The present application prevents dust from intruding into a bottom of the flexible display.Type: GrantFiled: November 20, 2020Date of Patent: December 19, 2023Assignee: WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.Inventor: Zikang Feng
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Patent number: 11846987Abstract: A portable electronic device including a first body, a second body, a stand, and a hinge structure is provided. The stand has a first pivot part and a second pivot part opposite to the first pivot part, wherein the first pivot part is pivotally connected to the first body, and the second body is pivotally connected to the second pivot part. The hinge structure includes a first bracket secured to the second body, a second bracket secured to the second pivot part of the stand, a first movable base, a first shaft secured to the first bracket and pivoted to the first movable base, a second movable base, a second shaft secured to the first movable base and pivoted to the second movable base, and a sliding shaft fixed to the second movable base and slidably connected to the second bracket.Type: GrantFiled: May 26, 2022Date of Patent: December 19, 2023Assignee: Acer IncorporatedInventors: Chia-Bo Chen, Yi-Hsuan Yang, Hung-Chi Chen, Wu-Chen Lee
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Patent number: 11844185Abstract: The invention relates to an electrical equipment, in particular for electrical or hybrid vehicles, comprising a casing, said casing comprising a casing element comprising a side wall and defining an inner space. The side wall of the casing element comprises a material offset towards the inner space thereof forming a zone for connecting the positive terminal and the negative terminal of the electrical energy source such that said material offset overlaps the first electrical conductor and the second electrical conductor only making visible, from the outside of said side wall, the positive visible terminal and the negative visible terminal.Type: GrantFiled: February 25, 2021Date of Patent: December 12, 2023Assignee: VALEO SIEMENS EAUTOMOTIVE FRANCE SASInventors: Guillaume Tramet, Roger Deniot
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Patent number: 11839068Abstract: Provided is an electric power converter that includes an inverter which includes plural electric parts, a smoothing capacitor configured to smooth electric power, a housing configured to house the inverter and the smoothing capacitor and a first conductor portion configured to connect the smoothing capacitor and the inverter. The housing includes a base portion made of a resin material and a cover portion attached to the base portion to cover the inverter and the smoothing capacitor. The inverter and the smoothing capacitor are mounted on the base portion. The first conductor portion is placed in the vicinity of or in contact with the base portion of the housing in the middle of connection between the smoothing capacitor and the inverter.Type: GrantFiled: February 18, 2019Date of Patent: December 5, 2023Assignee: NISSAN MOTOR CO., LTD.Inventors: Kimihiro Ono, Susumu Kumakura, Rei Takahashi
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Patent number: 11837348Abstract: Systems and methods are disclosed that provide smart alerts to users, e.g., alerts to users about diabetic states that are only provided when it makes sense to do so, e.g., when the system can predict or estimate that the user is not already cognitively aware of their current condition, e.g., particularly where the current condition is a diabetic state warranting attention. In this way, the alert or alarm is personalized and made particularly effective for that user. Such systems and methods still alert the user when action is necessary, e.g., a bolus or temporary basal rate change, or provide a response to a missed bolus or a need for correction, but do not alert when action is unnecessary, e.g., if the user is already estimated or predicted to be cognitively aware of the diabetic state warranting attention, or if corrective action was already taken.Type: GrantFiled: September 19, 2022Date of Patent: December 5, 2023Assignee: Dexcom, Inc.Inventors: Anna Leigh Davis, Scott M. Belliveau, Naresh C. Bhavaraju, Leif N. Bowman, Rita M. Castillo, Alexandra Elena Constantin, Rian W. Draeger, Laura J. Dunn, Gary Brian Gable, Arturo Garcia, Thomas Hall, Hari Hampapuram, Christopher Robert Hannemann, Anna Claire Harley-Trochimczyk, Nathaniel David Heintzman, Andrea Jean Jackson, Lauren Hruby Jepson, Apurv Ullas Kamath, Katherine Yerre Koehler, Aditya Sagar Mandapaka, Samuel Jere Marsh, Gary A. Morris, Subrai Girish Pai, Andrew Attila Pal, Nicholas Polytaridis, Philip Thomas Pupa, Eli Reihman, Ashley Anne Rindfleisch, Sofie Wells Schunk, Peter C. Simpson, Daniel S. Smith, Stephen J. Vanslyke, Matthew T. Vogel, Tomas C. Walker, Benjamin Elrod West, Atiim Joseph Wiley
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Patent number: 11822707Abstract: A tamper detection system may include organic material and a tamper detection circuit embedded in the organic material. A portion of the organic material is ablated away to form an incision in the organic material. A portion of the tamper detection circuit obstructs a fragment of the ablation path. The tamper detection circuit remains intact. The incision enables a gas flow between a first side of the organic material and a second side of the organic material.Type: GrantFiled: June 1, 2021Date of Patent: November 21, 2023Assignee: International Business Machines CorporationInventors: William Santiago-Fernandez, Russell A. Budd, James Busby, Arthur J Higby, Michael Fisher, Silvio Dragone, Stefano Sergio Oggioni, David Clifford Long
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Patent number: 11821916Abstract: An electrical ground connector for use as part of a test connector in an integrated circuit (IC) device testing apparatus having a resilient connector for electrical grounding and comprising a dual elastomer contact stacked vertically above a rigid ground block. The height of the ground block can be adjusted to compensate for the lack of height of the dual elastomer contacts, so that the entire connector has enough height to maintain electrical connection between a load board of the testing apparatus and the IC device.Type: GrantFiled: March 31, 2022Date of Patent: November 21, 2023Assignee: JF MICROTECHNOLOGY SDN. BHD.Inventors: Wei Kuong Foong, Kok Sing Goh, Shamal Mundiyath, Eng Kiat Lee, Fadzhirul Ridhzwan Azry Bin Sulaiman
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Patent number: 11824575Abstract: A protective cover for a tablet computer includes a main body, a peripheral device and a protective cover signal transmission member. The main body includes a first supporting member and a second supporting member connected to each other and can be opened and closed relative to each other. The peripheral device is disposed on the first supporting member. The protective cover signal transmission member is disposed on the second supporting member and electrically connected with the peripheral device. The second supporting member supports the tablet computer. The tablet computer includes a computer signal transmission member. The protective cover signal transmission member is used to dock with the computer signal transmission member to perform signal transmission. One of the computer signal transmission member and the protective cover signal transmission member is an electrical block, and the other is an electrical guide rail. A portable electronic device is also provided.Type: GrantFiled: September 6, 2021Date of Patent: November 21, 2023Assignee: DARFON ELECTRONICS CORP.Inventors: Yu Chih Chang, Chin Lung Chan
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Patent number: 11805617Abstract: A carrier for a storage device is provided. The carrier includes an accommodation bracket, a panel and an electromagnetic shielding element. The accommodation bracket has an open space. The panel has a handle. The electromagnetic shielding element is disposed between the accommodation bracket and the panel. The electromagnetic shielding element is engaged with the accommodation bracket.Type: GrantFiled: April 21, 2022Date of Patent: October 31, 2023Assignee: LITE-ON TECHNOLOGY CORPORATIONInventors: Cheng-Hsuen Chien, Yi-Feng Pu, Chen-Yuan Liu, Pei-Hsuan Huang
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Patent number: 11791723Abstract: An apparatus for power conversion includes a transformation stage for transforming a first voltage into a second voltage. The transformation stage includes a switching network, a filter, and a controller. The filter is configured to connect the transformation stage to a regulator. The controller controls the switching network.Type: GrantFiled: December 22, 2021Date of Patent: October 17, 2023Assignee: pSemi CorporationInventor: David Giuliano
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Patent number: 11784112Abstract: An integrated circuit package is formed by positioning an integrated circuit die on a die pad of a leadframe; connecting a bond wire between the die and a bond pad of the leadframe; encapsulating the bond wire, die, and bond pad with an encapsulant material to form a first mold cap of the integrated circuit package; after the encapsulating, bending one or more leads of the leadframe to form one or more bent leads; and encapsulating the first mold cap and a portion of a bend of the one or more bent leads with the encapsulant material to form a second mold cap.Type: GrantFiled: August 30, 2021Date of Patent: October 10, 2023Assignee: NXP USA, Inc.Inventors: Jian Song, Jun Li, Xingshou Pang, Mingchuan Han, Jinzhong Yao, Xuesong Xu
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Patent number: 11776919Abstract: A semiconductor package includes a multilayer substrate, a device die, an insulating encapsulant, and a shielding structure. The multilayer substrate has a first surface and a second surface opposite to the first surface. The multilayer substrate includes through holes, and each of the through holes extends from the first surface to the second surface. The device die is disposed on the first surface of the multilayer substrate. The insulating encapsulant is disposed on the first surface of the multilayered substrate and encapsulating the device die. The shielding structure is disposed over the first surface of the multilayer substrate. The shielding structure includes a cover body and conductive pillars. The cover body covers the device die and the insulating encapsulant. The conductive pillars are connected to the cover body and fitted into the through holes of the multilayer substrate.Type: GrantFiled: August 5, 2022Date of Patent: October 3, 2023Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yang-Che Chen, Victor Chiang Liang, Chen-Hua Lin, Chwen-Ming Liu, Huang-Wen Tseng
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Patent number: 11776892Abstract: A semiconductor device according to an embodiment includes: an insulating substrate having a first metal layer and a second metal layer on a surface of the insulating substrate; a semiconductor chip including an upper electrode and a lower electrode, the upper electrode being electrically connected to the first metal layer, the lower electrode being electrically connected to the second metal layer; a first main terminal including a first end and a second end, the first end being electrically connected to the first metal layer; a second main terminal including a third end and a fourth end, the third end being electrically connected to the second metal layer; a first detection terminal being electrically connected between the first end and the second end of the first main terminal; and a second detection terminal being electrically connected to the first metal layer.Type: GrantFiled: August 24, 2020Date of Patent: October 3, 2023Assignees: Kabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage CorporationInventors: Tomohiro Iguchi, Tatsuya Hirakawa
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Patent number: 11769762Abstract: A semiconductor package includes a lower redistribution layer having a plurality of lower ball pads forming a plurality of lower ball pad groups, a semiconductor chip on the lower redistribution layer, an expanded layer surrounding the semiconductor chip on the lower redistribution layer, and an upper redistribution layer on the semiconductor chip and the expanded layer and having a plurality of upper ball pads forming a plurality of upper ball pad groups. The number of the plurality of upper ball pad groups may be the same as the number of the of the plurality lower ball pad groups. Each of the upper ball pads in one of the plurality of upper ball pad groups, from among the plurality of upper ball pads, may be a dummy ball pad.Type: GrantFiled: January 28, 2021Date of Patent: September 26, 2023Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Daeho Lee, Kilsoo Kim
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Patent number: 11756733Abstract: A ceramic electronic device includes a multilayer chip having a plurality of dielectric layers and a plurality of internal electrode layers that are stacked, and having a first main face and a second main face, and a plurality of external electrodes, the plurality of external electrodes being spaced from each other, each of the plurality of external electrodes being connected to a part of the plurality of internal electrode layers, the plurality of external electrodes having a predetermined area in the planar view. On at least one of the first main face and the second main face, at least one of the plurality of external electrodes has an extension portion extending along a side of the rectangular shape toward at least one of external electrodes adjacent to the at least one of the plurality of external electrodes.Type: GrantFiled: December 14, 2020Date of Patent: September 12, 2023Assignee: TAIYO YUDEN CO., LTD.Inventors: Takumi Chigira, Jun Nishikawa
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Patent number: 11742577Abstract: Microwave antenna systems include a parabolic reflector antenna having a feed bore and a feed assembly. The feed assembly includes a coaxial waveguide structure that extends through the feed bore, a sub-reflector, and a first dielectric block that is positioned between the coaxial waveguide structure and the sub-reflector. The coaxial waveguide structure includes a central waveguide and an outer waveguide that circumferentially surrounds the central waveguide. One of the central waveguide and the outer waveguide extends further from the feed bore towards the sub-reflector than the other of the central waveguide and the outer waveguide.Type: GrantFiled: July 15, 2022Date of Patent: August 29, 2023Assignee: CommScope Technologies LLCInventors: Craig Mitchelson, Ronald J. Brandau, Thomas C. Tulloch, Griogair Whyte