HEAT-EXCHANGED CABINET STRUCTURE

Abstract

A heat-exchanged cabinet structure is used to accommodate an electronic equipment. The heat-exchanged cabinet structure includes a main body, a first heat exchanger device and a second heat exchanger device. The main body has an accommodated space and a first housing. The electronic equipment is disposed in the accommodated space. The first heat exchanger device which has a condenser is disposed on the first housing and placed in the accommodated space. The second heat exchanger device which has an evaporator is placed in the accommodated space and is adjacent the first heat exchanger.

Description

CROSS REFERENCE TO RELATED APPLICATIONS

This Non-provisional application claims priority under 35 U.S.C. §119(a) on Patent Application No(s). 101106204 filed in Taiwan, Republic of China on Feb. 24, 2012, the entire contents of which are hereby incorporated by reference.

BACKGROUND OF THE INVENTION

1. Field of Invention

The present invention relates to a heat-exchanged cabinet structure and, in particular, to a heat-exchanged cabinet structure with heat exchanger devices.

2. Related Art

Heat-exchanged cabinet structures have been widely applied to outdoor communication stations or telecommunication power equipment. FIG. 1 is a schematic diagram showing a conventional heat-exchanged cabinet structure 1, which includes a main body 11 and a heat exchanger device 12. The heat-exchanged cabinet structure 1 is used to carry an electronic equipment A. The main body 11 has an accommodating space 111, and the electronic equipment A is placed in the accommodating space 111. The heat exchanger device 12 is installed on the outer surface 112 of the main body 11 and connected to the main body 11.

Since the heat exchanger device 12 of the heat-exchanged cabinet structure 1 is installed on the outer surface 112 of the main body 11, and it can directly contact the exterior environment, the heat exchanger device 12 fails to provide good heat dissipation and air cycling. Besides, the heat exchanger device 12 is easily interfered by the climatic and environmental factors, thereby resulting bad heat dissipation and thus causing the overheating and malfunction of the electronic equipment A. In addition, this configuration not only sufficiently enlarges the total size of the heat-exchanged cabinet structure 1 but also increases the manufacturing cost and time.

Therefore, it is an important subject to provide a heat-exchanged cabinet structure that can improve the air cycling so as to enhance the heat-dissipating performance and reduce the configuration space and manufacturing cost.

SUMMARY OF THE INVENTION

In view of the foregoing subject, an objective of the present invention is to provide a heat-exchanged cabinet structure that can improve the air cycling so as to enhance the heat-dissipating performance and reduce the configuration space/size and manufacturing cost.

To achieve the above objective, the present invention discloses a heat-exchanged cabinet structure, which is used to accommodate an electronic equipment. The heat-exchanged cabinet structure includes a main body, a first heat exchanger device and a second heat exchanger device. The main body has an accommodated space and a first housing, and the electronic equipment is disposed in the accommodated space. The first heat exchanger device has a condenser and is disposed on the first housing and placed in the accommodated space. The second heat exchanger device has an evaporator and is placed in the accommodated space and adjacent the first heat exchanger.

To achieve the above objective, the present invention also discloses a heat-exchanged cabinet structure, which is used to accommodate an electronic equipment. The heat-exchanged cabinet structure includes a main body, a first heat exchanger device and a second heat exchanger device. The main body has an accommodated space, a first housing and a second housing. The first housing is disposed opposite to the second housing, and the electronic equipment is disposed in the accommodated space. The first heat exchanger device has a condenser and is disposed on the first housing and placed in the accommodated space. The second heat exchanger device has an evaporator and is disposed on the second housing and placed in the accommodated space.

To achieve the above objective, the present invention also discloses a heat-exchanged cabinet structure, which is used to accommodate an electronic equipment. The main body has an accommodated space, a first housing and a second housing. The first housing is connected to the second housing, and the electronic equipment is disposed in the accommodated space. The first heat exchanger device has a condenser and is disposed on the first housing and placed in the accommodated space. The second heat exchanger device has an evaporator, and is disposed on the second housing and placed in the accommodated space.

As mentioned above, the first and second heat exchanger devices of the heat-exchanged cabinet structure are disposed in the accommodating space of the main body, and located corresponding to the electronic equipment. The first and second heat exchanger devices have a condenser and an evaporator, respectively, for dissipating the heat generated by the electronic equipment, thereby enhancing the heat-dissipation performance of the heat-exchanged cabinet structure. In addition, the installation positions of the first and second exchanger devices can be flexibly modified according to the dimension of the electronic equipment or the heat-exchanged cabinet structure. For example, the first and second exchanger devices are disposed on two opposite or connected housings of the heat-exchanged cabinet structure, respectively. These configurations can also increase the air cycling performance and thus improve the heat-dissipation performance.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention will become more fully understood from the subsequent detailed description and accompanying drawings, which are given by way of illustration only, and thus are not limitative of the present invention, and wherein:

FIG. 1 is a schematic diagram showing a conventional heat-exchanged cabinet structure;

FIG. 2 is a schematic diagram showing a heat-exchanged cabinet structure according to a first embodiment of the present invention;

FIG. 3 is a sectional side view of the heat-exchanged cabinet structure of FIG. 2;

FIG. 4 is a sectional side view of a heat-exchanged cabinet structure according to a second embodiment of the present invention; and

FIG. 5 is a sectional side view of a heat-exchanged cabinet structure according to a third embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

The present invention will be apparent from the following detailed description, which proceeds with reference to the accompanying drawings, wherein the same references relate to the same elements.

First Embodiment

FIG. 2 is a schematic diagram showing a heat-exchanged cabinet structure 2 according to a first embodiment of the present invention. The heat-exchanged cabinet structure 2 is installed at outdoor or in the equipment room for carrying an electronic equipment A. In this case, the electronic equipment A is, for example, an electronic communication equipment, a communication station or the likes. The heat-exchanged cabinet structure 2 includes a main body 21, a first heat exchanger device 22, and a second heat exchanger device 23. The first heat exchanger device 22, the second heat exchanger device 23 and the electronic equipment A are disposed in the main body 21. In addition, the heat-exchanged cabinet structure 2 may further include a heating device 24 and a control device 25. The heating device 24 is installed on the main body 21 and connected to the first exchanger device 22 or the second heat exchanger device 23. The control device 25 is connected to the heating device 24 for controlling the operation of the heating device 24 so as to adjust the temperature.

The main body 21 has an accommodated space 211 and a first housing 212. For example, the first housing 212 can be a cap, a rear plate, a side plate, a top plate, or a bottom plate. In this embodiment, the first housing 212 is, for example but not limited to, a cap. The electronic equipment A is disposed in the accommodated space 211, so that the main body 21 can protect the electronic equipment A as well as the components thereof from being damped or damaged by the environment, corrosive gas or external force.

The first heat exchanger device 22 is disposed on the first housing 212 and placed in the accommodated space 211, and the second heat exchanger device 23 is disposed adjacent to (stacked on) the first heat exchanger device 22 and also disposed in the accommodated space 211. In this embodiment, the first heat exchanger device 22 and the second heat exchanger device 23 are all installed inside the main body 21, so that they can directly perform the heat dissipation of the electronic equipment A. This configuration can reduce the environmental interference, enhance the air cycling and heat-dissipating performance, minimize the assembling dimension of the heat-exchanged cabinet structure 2, and decrease the manufacturing cost.

FIG. 3 is a sectional side view of the heat-exchanged cabinet structure 2 of FIG. 2. To be noted, the heating device 24 and the control device 25 are not shown in FIG. 3 for clearly illustrating other components, and the shown components may be not shown in the actual dimensions and are for illustrations only. The first heat exchanger device 22 includes a condenser 221, a pipe 222 and a fan 223, and the second heat exchanger device 23 includes an evaporator 231, a pipe 232 and a fan 233. The pipes 222 and 232 are connected to the condenser 221 and the evaporator 231, respectively. In more specific, the pipe 222 is configured to transfer a fluid (e.g. a liquid) from the condenser 221 to the evaporator 231, and the pipe 232 is configured to transfer a fluid (e.g. a gas) from the evaporator 231 to the condenser 221. To be noted, the lengths of the pipes 222 and 232 are not limited to this invention, and they can be adjusted based on the distance between the condenser 221 and the evaporator 231. In the heat-exchanged cabinet structure 2 of this embodiment, the first heat exchanger device 22 has two pipes 222, and the second heat exchanger device 23 has two pipes 232. The configurations of the pipes 222 and 232 are to improve the transmission efficiency of the fluid (liquid or gas) between the condenser 221 and the evaporator 231. To be noted, the numbers of the pipes 222 and 232 are not limited to this invention, and they can be adjusted according to the dimensions of the first heat exchanger device 22 or the second heat exchanger device 23.

In other embodiments, it is possible to configure additional condenser and/or evaporator in the in the first heat exchanger device 22 and/or the second heat exchanger device 23. For example, the first heat exchanger device 22 includes two condensers, and the second heat exchanger device 23 includes two evaporators, thereby enhancing the performance of heat dissipation and air cycling. Herein, the numbers of the condensers and evaporators are not limited in the invention.

The fans 223 and 233 of this embodiment are centrifugal fans. In other embodiments, the fans 223 and 233 can be selected from other types of fans (e.g. axial flow fans, oblique flow fans, or cross flow fans) based on the positions thereof or the shapes and volumes of the heat-exchanged cabinet structure 2. To be noted, the first heat exchanger device 22 and the second heat exchanger device 23 are individually configured, and they are separated by, for example, at least one partition and connected only through the pipes 222 and 232, which connect the condenser 221 and the evaporator 231. In the heat-exchanged cabinet structure 2 of this embodiment, the first heat exchanger device 22 and the second heat exchanger device 23 respectively include two fans 223 and two fans 233 for increasing the air input quantity. Herein, the numbers of the fans 223 and 233 are not limited in this invention.

The heating device 24 is connected to at least one of the first heat exchanger device 22 and the second heat exchanger device 23, and the control device 25 is connected to the heating device 24. In this embodiment, the heating device 24 and the control device 25 are disposed in the first housing 212. Of course, the configurations and positions of the heating device 24 and the control device 25 are not limited in this invention. In other embodiments, the heating device 24 and the control device 25 may be disposed in the same housing or different housings. The control device 25 can control the heating device 24 according to the climate or environmental temperature so as to adjust the temperatures of the first heat exchanger device 22 and the second heat exchanger device 23. Accordingly, the second heat exchanger device 23 can output cold air to cool down the electronic equipment A.

The operation of the first heat exchanger device 22 and the second heat exchanger device 23 and the heat-dissipating process of the electronic equipment A will be described hereinafter with reference to FIG. 3. The fan 223 sucks the cold air C1 from the outside into the first heat exchanger device 22. The cold air C1 flows to the condenser 221 along the path P1 in the first heat exchanger device 22, and then the cold air C1 carries the heat out from the condenser 221 to form a warm air W1, which is outputted through the output side S1. In more specific, the first housing 212 has an opening (not shown) disposed corresponding to the condenser 221, so that the warm air W1 can be outputted through the output side S1. Besides, the condenser 221 can condense the fluid to liquid, and the liquid then flows to the evaporator 231 through the pipe 222.

On the contrary, the fan 233 sucks the warm air W2 generated by the electronic equipment A into the second heat exchanger device 23. The warm air W2 flows to the evaporator 231 along the path P2 in the second heat exchanger device 23, and then the evaporator 231 can carry the heat from the warm air W2 to form a cold air C2, which is outputted through the output side S2 along a path P2. The cold air C2 is sent to the electronic equipment A for dissipating the heat generated by the electronic equipment A. Herein, the liquid fluid flowing to the evaporator 231 is evaporated into gas fluid, which then flows to the condenser 221 through the pipe 232. The established gas cycling can dissipate the heat (generated by the electronic equipment A or the main body 21) carried by the warm air W2 to the outside, thereby enhancing the heat-dissipation efficiency of the main body 21.

To be noted, the temperatures of the cold airs C1 and C2 and the warm airs W1 and W2 are not limited to this embodiment. The most important condition is to keep the temperature of the warm air W1 from the first heat exchanger device 22 to be higher than the temperature of the cold air C1 flowing into the first heat exchanger device 22. Similarly, the temperature of the warm air W2 flowing into the second heat exchanger device 23 to be higher than the temperature of the cold air C2 from the second heat exchanger device 23.

Second Embodiment

FIG. 4 is a sectional side view of a heat-exchanged cabinet structure 3 according to a second embodiment of the present invention. The heat-exchanged cabinet structure 3 is installed at outdoor or in the equipment room for carrying an electronic equipment A. In this case, the electronic equipment A is, for example, an electronic communication equipment, a network exchanger or a transformer apparatus. The heat-exchanged cabinet structure 3 includes a main body 31, a first heat exchanger device 32, and a second heat exchanger device 33. The first heat exchanger device 32, the second heat exchanger device 33, and the electronic equipment A are disposed in the main body 31. In addition, the heat-exchanged cabinet structure 3 may further include a heating device and a control device (not shown). The heating device is installed on the main body 31 and connected to the first exchanger device 32 or the second heat exchanger device 33. The control device is connected to the heating device for controlling the operation of the heating device so as to adjust the temperature inside the heat-exchanged cabinet structure 3.

The main body 31 has an accommodated space 311, a first housing 312 and a second housing 313. The first housing 312 and the second housing 313 are disposed opposite to each other. For example, each of the first housing 312 and the second housing 313 can be a cap, a rear plate, a side plate, a top plate, or a bottom plate. In this embodiment, the first housing 312 is, for example but not limited to, a cap, and the second housing 313 is correspondingly a rear plate.

The electronic equipment A is disposed in the accommodated space 311. The first heat exchanger device 32 is disposed on the first housing 312, and the second heat exchanger device 33 is disposed on the second housing 313 and located opposite to the first heat exchanger device 32. In this embodiment, the first heat exchanger device 32 is disposed on the first housing 312 and the second heat exchanger device 33 is disposed on the second housing 313, which are all installed inside the main body 31, so that they can directly perform the heat dissipation of the electronic equipment A. This configuration can enhance the air cycling and heat-dissipating performance and prevent the interference of external environmental factors, which can affect the normal operation of the heat exchanger devices. In addition, the positions of the first heat exchanger device 32 and the second heat exchanger device 33 can be flexibly changed based on the heat-dissipation requirement of the electronic equipment A. Furthermore, this configuration can minimize the assembling dimension of the heat-exchanged cabinet structure 3 and decrease the manufacturing cost.

The first heat exchanger device 32 includes a condenser 321, a pipe 322 and a fan 323. The condenser 321 is connected to the pipe 322, and the pipe 322 is configured to transfer a fluid (e.g. a liquid) from the condenser 321 to an evaporator 331. The fan 323 and the condenser 321 are disposed in the first housing 312. The second heat exchanger device 33 includes the evaporator 331, a pipe 332 and a fan 333. The evaporator 331 is connected to the pipe 332, and the pipe 332 is configured to transfer a fluid (e.g. a gas) from the evaporator 331 to the condenser 321. The fan 333 and the evaporator 331 are disposed in the second housing 313. In this embodiment, the fans 323 and 333 are, for example but not limited to, centrifugal fans. Of course, the fans 323 and 333 can be any applicable fan such as axial flow fans or oblique flow fans.

To be noted, the first heat exchanger device 32 and the second heat exchanger device 33 are individually configured, and they are connected only through the pipes 322 and 332, which connect the condenser 321 and the evaporator 331. Besides, the technical features of the evaporator 331, the condenser 321, the pipes 322 and 332, and the fans 323 and 333 are the same as those of the evaporator 231, the condenser 221, the pipes 222 and 232, and the fans 223 and 233 of the first embodiment, so the detailed descriptions thereof will be omitted.

Third Embodiment

FIG. 5 is a sectional side view of a heat-exchanged cabinet structure 4 according to a third embodiment of the present invention. The heat-exchanged cabinet structure 4 is used to carry an electronic equipment A. The heat-exchanged cabinet structure 4 includes a main body 41, a first heat exchanger device 42, and a second heat exchanger device 43. In addition, the heat-exchanged cabinet structure 4 may further include a heating device and a control device (not shown). The technical features of the electronic equipment A, heating device and control device of the third embodiment are the same as those of the electronic equipment A, the heating device 24 and the control device 25 of the first embodiment, so the detailed descriptions thereof will be omitted.

The main body 41 has an accommodated space 411, a first housing 412 and a second housing 413. The first housing 412 and the second housing 413 are connected to each other. For example, each of the first housing 412 and the second housing 413 can be a cap, a rear plate, a side plate, a top plate, or a bottom plate. In this embodiment, the first housing 412 is disposed adjacent to and connected to the second housing 413. Besides, the first housing 412 is, for example but not limited to, a cap, and the second housing 413 is correspondingly a top plate. Otherwise, in another aspect, the first housing 412 is a side plate, and the second housing 413 is a bottom plate connected to the side plate. Alternatively, in still another aspect, the first housing 412 is a top plate, and the second housing 413 is a side plate connected to the top plate.

The electronic equipment A is disposed in the accommodated space 411. The first heat exchanger device 42 is disposed on the second housing 413, and the second heat exchanger device 43 is disposed on the first housing 412 and located adjacent to the first heat exchanger device 42. In this embodiment, the positions of the first heat exchanger device 42 and the second heat exchanger device 43 can be flexibly changed based on the heat-dissipation requirement of the electronic equipment A. Furthermore, since the first heat exchanger device 42 and the second heat exchanger device 43 are both disposed inside the main body, the assembling dimension and volume of the heat-exchanged cabinet structure 4 can minimized, thereby decreasing the manufacturing cost.

The first heat exchanger device 42 includes a condenser 421, a pipe 422 and a fan 423. The condenser 421 is connected to the pipe 422, and the pipe 422 is configured to transfer a fluid (e.g. a liquid) from the condenser 421 to an evaporator 431. The fan 423 and the condenser 421 are disposed in the second housing 413. The second heat exchanger device 43 includes the evaporator 431, a pipe 432 and a fan 433. The evaporator 431 is connected to the pipe 432, and the pipe 432 is configured to transfer a fluid (e.g. a gas) from the evaporator 431 to the condenser 421. The fan 433 and the evaporator 431 are disposed in the first housing 412. In this embodiment, the fans 423 and 433 are, for example, centrifugal fans. Of course, based on the heat-dissipation requirement of the electronic equipment A or the positions of the fans 423 and 433, the fans 423 and 433 can be any applicable fan such as axial flow fans or oblique flow fans.

To be noted, the first heat exchanger device 42 and the second heat exchanger device 43 are individually configured, and they are connected only through the pipes 422 and 432, which connect the condenser 421 and the evaporator 431. Besides, the technical features of the evaporator 431, the condenser 421, the pipes 422 and 432, and the fans 423 and 433 are the same as those of the evaporator 231, the condenser 221, the pipes 222 and 232, and the fans 223 and 233 of the first embodiment, so the detailed descriptions thereof will be omitted.

In summary, the first and second heat exchanger devices of the heat-exchanged cabinet structure are disposed in the accommodating space of the main body, and located corresponding to the electronic equipment. The first and second heat exchanger devices have a condenser and an evaporator, respectively, for dissipating the heat generated by the electronic equipment, thereby enhancing the heat-dissipation performance of the heat-exchanged cabinet structure. Compared with the conventional art, the heat-exchanged cabinet structure of the invention can improve the issues of poor heat-dissipation performance and interference of external environmental factors, and minimize the installation volume and space so as to decrease the manufacturing cost. In addition, the installation positions of the first and second exchanger devices can be flexibly modified according to the dimension of the electronic equipment or the heat-exchanged cabinet structure. For example, the first and second exchanger devices are disposed on two opposite or connected housings of the heat-exchanged cabinet structure, respectively. These configurations can also increase the air cycling performance and thus improve the heat-dissipation performance.

Although the present invention has been described with reference to specific embodiments, this description is not meant to be construed in a limiting sense. Various modifications of the disclosed embodiments, as well as alternative embodiments, will be apparent to persons skilled in the art. It is, therefore, contemplated that the appended claims will cover all modifications that fall within the true scope of the present invention.

Claims

1. A heat-exchanged cabinet structure, which is used to accommodate an electronic equipment, comprising:

a main body having an accommodated space and a first housing, wherein the electronic equipment is disposed in the accommodated space;

a first heat exchanger device disposed on the first housing and placed in the accommodated space, wherein the first heat exchanger device has a condenser; and

a second heat exchanger device placed in the accommodated space and adjacent the first heat exchanger, wherein the second heat exchanger device has an evaporator.

2. The heat-exchanged cabinet structure of claim 1, wherein the first heat exchanger device further has a pipe and a fan, and the pipe connects the condenser and the evaporator for transmitting a fluid from the condenser to the evaporator.

3. The heat-exchanged cabinet structure of claim 1, wherein the second heat exchanger device further has a pipe and a fan, and the pipe connects the condenser and the evaporator for transmitting a fluid from the evaporator to the condenser.

4. The heat-exchanged cabinet structure of claim 2, wherein the fan is a centrifugal fan.

5. The heat-exchanged cabinet structure of claim 3, wherein the fan is a centrifugal fan.

6. The heat-exchanged cabinet structure of claim 1, further comprising:

a heating device connecting to the first heat exchanger device or the second heat exchanger device; and

a control device connecting to and controlling the heating device.

7. The heat-exchanged cabinet structure of claim 1, wherein the first housing is a cap, a rear plate, a side plate, a top plate, or a bottom plate.

8. A heat-exchanged cabinet structure, which is used to accommodate an electronic equipment, comprising:

a main body having an accommodated space, a first housing and a second housing, wherein the first housing is disposed opposite to the second housing, and the electronic equipment is disposed in the accommodated space;

a first heat exchanger device disposed on the first housing and placed in the accommodated space, wherein the first heat exchanger device has a condenser; and

a second heat exchanger device disposed on the second housing and placed in the accommodated space, wherein the second heat exchanger device has an evaporator.

9. The heat-exchanged cabinet structure of claim 8, wherein the first heat exchanger device further has a pipe and a fan, and the pipe connects the condenser and the evaporator for transmitting a fluid from the condenser to the evaporator.

10. The heat-exchanged cabinet structure of claim 8, wherein the second heat exchanger device further has a pipe and a fan, and the pipe connects the condenser and the evaporator for transmitting a fluid from the evaporator to the condenser.

11. The heat-exchanged cabinet structure of claim 9, wherein the fan is a centrifugal fan.

12. The heat-exchanged cabinet structure of claim 10, wherein the fan is a centrifugal fan.

13. The heat-exchanged cabinet structure of claim 8, further comprising:

a heating device connecting to the first heat exchanger device or the second heat exchanger device; and

a control device connecting to and controlling the heating device.

14. The heat-exchanged cabinet structure of claim 8, wherein the first housing is a cap, a rear plate, a side plate, a top plate, or a bottom plate.

15. A heat-exchanged cabinet structure, which is used to accommodate an electronic equipment, comprising:

a main body having an accommodated space, a first housing and a second housing, wherein the first housing is connected to the second housing, and the electronic equipment is disposed in the accommodated space;

a first heat exchanger device disposed on the first housing and placed in the accommodated space, wherein the first heat exchanger device has a condenser; and

a second heat exchanger device disposed on the second housing and placed in the accommodated space, wherein the second heat exchanger device has an evaporator.

16. The heat-exchanged cabinet structure of claim 15, wherein the first heat exchanger device further has a pipe and a fan, and the pipe connects the condenser and the evaporator for transmitting a fluid from the condenser to the evaporator.

17. The heat-exchanged cabinet structure of claim 15, wherein the second heat exchanger device further has a pipe and a fan, and the pipe connects the condenser and the evaporator for transmitting a fluid from the evaporator to the condenser.

18. The heat-exchanged cabinet structure of claim 17, wherein the fan is a centrifugal fan.

19. The heat-exchanged cabinet structure of claim 15, further comprising:

a heating device connecting to the first heat exchanger device or the second heat exchanger device; and

a control device connecting to and controlling the heating device.

20. The heat-exchanged cabinet structure of claim 15, wherein the first housing is a cap, a rear plate, a side plate, a top plate, or a bottom plate.