CUTTER ASSEMBLY WITH AT LEAST ONE ISLAND AND A METHOD OF MANUFACTURING A CUTTER ASSEMBLY
A cutter assembly and a method of making the cutter assembly are disclosed. A method of fabricating a cutting element having at least one island structure in at least one pocket of a substrate may comprise steps of building the substrate with at least one pocket; putting the at least one island into the at least one pocket in the substrate to form an assembly, the at least one island is not in a final state, wherein in the final state, chemical composition, shape, phase distribution and content, density and mechanical properties are finalized without changes; and subjecting the assembly to a final fabrication process to form the said cutting element and achieve the final state of the cutting element and at least one island in at least one pocket.
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This application is a continuation-in-part of, and claiming priority under 35 U.S.C. §120 to, U.S. patent application Ser. No. 13/339,483, filed on Dec. 29, 2011, U.S. patent application Ser. No. 13/339,474, filed on Dec. 29, 2011, U.S. patent application Ser. No. 13/339,838, filed on Dec. 29, 2011, U.S. patent application Ser. No. 13/339,854, filed on Dec. 29, 2011.
FIELDThe present disclosure relates to a cutter assembly with at least one island. More particularly, the present disclosure relates a cutter assembly that can include a substrate and at least one island disposed in the substrate.
BACKGROUNDIn the discussion of the background that follows, reference is made to certain structures and/or methods. However, the following references should not be construed as an admission that these structures and/or methods constitute prior art. Applicants expressly reserve the right to demonstrate that such structures and/or methods do not qualify as prior art.
Cutters can be subject to abrasion which can shorten the working life of the cutter. Thus, there is a need in the art for a cutter assembly that can provide higher abrasion resistance or longer cutter life.
SUMMARYExemplary embodiments provide a cutter assembly and a method of manufacturing a cutter assembly. In one exemplary embodiment, a method of fabricating a cutting element having at least one island structure in at least one pocket of a substrate may comprise steps of building the substrate with at least one pocket; putting the at least one island into the at least one pocket in the substrate to form an assembly, the at least one island is not in a final state, wherein in the final state, chemical composition, shape, phase distribution and content, density and mechanical properties are finalized without changes; and subjecting the assembly to a final fabrication process to form the said cutting element and achieve the final state of the cutting element and at least one island in at least one pocket.
In another exemplary embodiment, a method of fabricating a cutting element having at least one island structure in at least one pocket of a substrate may comprise steps of putting at least one island into at least one pocket in a substrate to form an assembly, the at least one island is not in a final state, wherein in the final state, chemical composition, shape, phase distribution and content, density and mechanical properties are finalized without changes; and subjecting the assembly to a high temperature high pressure sintering process to form the said cutting element and achieve the final state of the cutting element and at least one island in at least one pocket.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the invention as claimed.
The following detailed description can be read in connection with the accompanying drawings in which like numerals designate like elements and in which:
Referring to
The cutter assembly 100 . . . 1900 can comprise a substrate 102, 202, 302, 402, 502, 602, 702, 802, 902, 1002, 1102, 1202, 1302, 1402, 1502, 1602, 1702, 1802, and 1902 at least one island 150a, 150b, 250, 350, 450, 550, 650, 750, 850, 950, 1050, 1150, 1250, 1350, 1450, 1550, 1650, 1750, 1850, and 1950 disposed in the substrate 102 . . . 1902. The at least one island 150a . . . 1950 can be disposed in the substrate 102 . . . 1902. The substrate 102 . . . 1902 can have a surface 104, 204, 304, 404, 504, 604, 704, 804, 904, 1004, 1104, 1204, 1304, 1404, 1504, 1604, 1704, 1804, and 1904. The surface 104 . . . 1904 can receive one or more of the islands 150a . . . 1950. In other constructions of the cutter assembly 100 . . . 1900, the substrate 102 . . . 1902 can have a plurality of surfaces 104 . . . 1904, and each one of the plurality of surfaces 104 . . . 1904 can receive one or more of the islands 150a . . . 1950.
The at least one island 150a . . . 1950 can be disposed in the substrate 102 . . . 1902 such that the at least one island 150a . . . 1950 is spaced apart from another island 150a . . . 1950 in one exemplary embodiment. In another exemplary embodiment, islands 150a . . . 1950 may be disposed in the substrate 102 . . . 1902 such that the island 150a . . . 1950 may be integrated to form a semi continuous shape, for example. The substrate 102 . . . 1902 can be made from tungsten carbide cobalt (WC—Co), a diamond-silicon carbide composite material, binderless carbide, or polycrystalline diamond (PCD), or some other suitable materials. One example of a diamond-silicon carbide composite material is commercially available as VERSIMAX manufactured by Diamond Innovations, Inc., Worthington, Ohio USA. Binderless can refer to tungsten carbide composites with less amount of metal binder phase than a metal-WC composite cermet material, such as Co—WC composite cermet material, Ni—WC composite cermet material, Fe—WC composite cermet material, and the like. Examples of binderless carbide can include a cermet of tungsten carbide binded with a molybdenum metal and a low metal content of about 1 wt % to about 2 wt %. Binderless carbide can also include a type of tungsten carbide sintered with low metal content, such as about 1 wt % to about 2 wt %, and a binding phase that is mainly eta-phase (Co3W3O6).
The at least one island 150a . . . 1950 can be made from polycrystalline diamond (PCD), diamond, cubic boron nitride (CBN), polycrystalline cubic boron nitride (PCBN), or a diamond-silicon carbide composite material a cemented carbide, a ceramic, a metal, a metal alloy, and/or combinations thereof; a substrate; an optional coating layer, wherein the coating layer may be in direct contact with the island or the substrate, and the coating layer may be continuous or discontinuous. One example of a diamond-silicon carbide composite material is commercially available as VERSIMAX.
The at least one island 150a . . . 1950 can be a thermally stable material. The thermally stable material may be made by leaching catalyst from polycrystalline diamond in an acid solution, for example. If the at least one island 150a . . . 1950 is made from PCD, the at least one island 150a . . . 1950 made from PCD can be fully leached, partially leached, or unleached. In a construction of the cutter assembly 100 that includes fully leached PCD, the cutter assembly 100 . . . 1900 can provide thermal stability.
The at least one island 150a . . . 1950 can be coated. The coating material can comprise a metal, a metal alloy, a compound of the metal and/or combination of series thereof. The metal may comprise tungsten, titanium, niobium, zirconium, tantalum, vanadium, chromium, or molybdenum. The coating can be applied upon at least a portion of the at least one island 150a . . . 1950 via a coating method that can comprise physical vapor deposition, chemical vapor deposition, sputtering, evaporation, electroless plating, electroplating, and/or combinations or series thereof. The coating layer can have a thickness of about 0.1 μm to about 100 μm.
The at least one island 150a . . . 1950 can have a casing. In some constructions of the cutter assembly 100 . . . 1900, the at least one island 150a . . . 1950 can be press fit into the casing. The casing can be a metal casing. The metal casing can provide a medium between the at least one island 150a . . . 1950 and the substrate 102 . . . 1902 and may help to manage the deformation and stress condition between the at least one island 150a . . . 1950 and the substrate 102 . . . 1902. The casing layer can have a thickness of about 0.1 μm to about 100 μm. In another embodiment the at least one island 150 . . . 1950 can be directly fitted into the substrate 102 . . . 1902, and thus, no casing may be needed. In another exemplary embodiment, the island 150a . . . 1950 may also be coated with ceramics or CVD diamond or diamond like carbon, for example.
The at least one island 150a . . . 1950 can be coupled to the substrate 102 . . . 1902. The at least one island 150a . . . 1950 can be coupled to the substrate 102 . . . 1902 by, for example, gluing, brazing, bonding, welding, clamping, mechanical locking, or some other suitable coupling. An embodiment can include a method for brazing an island. The method for brazing the island can comprise: brazing a coated island to a substrate, wherein the island material can comprise a cemented carbide, a polycrystalline cubic boron nitride (cBN) superabrasive, a ceramic, a metal, a metal alloy, and/or combinations thereof; a substrate; an optional coating layer, wherein the coating layer may be in direct contact with the island or the substrate, and the coating layer may be continuous or discontinuous. The brazing step may comprise: heating at least one of the braze metal, the coating layer, and the substrate, to a temperature above a liquidus temperature sufficient to melt the braze metal; and bringing the melted braze metal into contact with both the island and the substrate and optionally the coating to form a braze metal layer. The braze metal layer can comprise silver, copper, magnesium, nickel, zinc, palladium, chromium, boron, titanium, tin, silicon, or an alloy or composite thereof. The substrate can comprise a second island, and the second island materials can comprise a cemented carbide, a polycrystalline cubic boron nitride (cBN) superabrasive, a ceramic, a metal, a metal alloy, and/or combinations thereof. In an embodiment of the method, the first and second island material may each independently comprise a single crystal diamond, a chemical vapor deposition diamond, a silicon carbide bonded diamond composite, a cobalt-polycrystalline diamond composite, a thermally-stable diamond composite, and/or combinations thereof. In an embodiment of the method, the coating metal may comprise tungsten, titanium, niobium, zirconium, tantalum, vanadium, chromium, molybdenum and/or combinations thereof. In an embodiment of the method, the coating metal may comprise at least one refractory metal and, optionally, at least one non-refractory metal. In an embodiment of the method, the refractory metal carbide may comprise at least one metal of the refractory metal or the refractory metal alloy. In an embodiment of the method, the refractory metal layer may have a thickness of about 0.1 μm to about 100 μm. In an embodiment of the method, the brazing step may comprise applying a heat source to heat at least the braze metal to the temperature of from about 500° C. to about 1000° C. In an embodiment of the method, the heat source may be at least one of a torch, a furnace, a microwave device, an arc welder, a laser, or an induction coil. In an embodiment of the method, the heat source may be an induction coil; and the temperature is maintained from about 700° C. to about 900° C. for a time period of at least about 5 seconds. In an embodiment of the method, the brazing step may be performed under ambient air pressure and in air. In another embodiment of the method, the brazing step may be performed under flowing or stagnant inert protection gas or gas mixtures.
The substrate 102 . . . 1902 can have any suitable shape. For example, in
The at least one island 150a . . . 1950 can have any suitable shape. As shown in
Turning to
The substrate 102 can include a pocket 110. The pocket 110 can have an opening 112. The opening 112 can be disposed on the surface 104 of the substrate 102. The pocket 110 can extend from the opening 112 on the surface 104 to an interior of the substrate 102. The pocket 110 can have a shape that can receive at least a portion of the at least one island 150.
Referring to
Referring to
In the construction shown in
Turning to
The substrate 202 can include a pocket 210. The pocket 210 can have an opening 212. The opening 212 can be disposed on the surface 204 of the substrate 202. The pocket 210 can extend from the opening 212 on the surface 204 to an interior of the substrate 202. The pocket 210 can have a shape that can receive at least a portion of the at least one island 250.
The at least one island 250 can have a generally cylindrical shape. The at least one island 250 can have an end surface 252, a flank surface 254, and an opposite end surface 256. Unlike the at least one island 150 shown in
In the construction shown in
Turning to
The substrate 302 can include a pocket 310. The pocket 310 can have an opening 312. The opening 312 can be disposed on the surface 304 of the substrate 302. The pocket 310 can extend from the opening 312 on the surface 304 to an interior of the substrate 302. The pocket 310 can have a shape that can receive at least a portion of the at least one island 350. The pocket 310 may be angled with respect to the substrate in one exemplary embodiment.
The at least one island 350 can have a generally cylindrical shape. The at least one island 350 can have an end surface 352, a flank surface 354, and an opposite end surface 356. Unlike the at least one island 150 shown in
In the construction shown in
Turning to
The substrate 402 can include a pocket 410. The pocket 410 can have an opening 412. The opening 412 can be disposed on the surface 404 of the substrate 402. The pocket 410 can extend from the opening 412 on the surface 404 to an interior of the substrate 402. The pocket 410 can have a shape that can receive at least a portion of the at least one island 450.
The at least one island 450 can have a generally cylindrical shape. The at least one island 450 can have an end surface 452, a flank surface 454, and an opposite end surface 456. Unlike the at least one island 150 shown in
In the construction shown in
Turning to
The substrate 502 can include a pocket 510. The pocket 510 can have an opening 512. The opening 512 can be disposed on the surface 504 of the substrate 502. The pocket 510 can extend from the opening 512 on the surface 504 to an interior of the substrate 502. The pocket 510 can have a shape that can receive at least a portion of the at least one island 550.
The at least one island 550 can have a generally cylindrical shape. The at least one island 550 can have an end surface 552, a flank surface, and an opposite end surface. Unlike the at least one island 150 shown in
In the construction shown in
Turning to
The substrate 602 can include a pocket 610. The pocket 610 can have an opening 612. The opening 612 can be disposed on the surface 604 of the substrate 602. The pocket 610 can extend from the opening 612 on the surface 604 to an interior of the substrate 602. The pocket 610 can have a shape that can receive at least a portion of the at least one island 650.
The at least one island 650 can have a generally cylindrical shape. The at least one island 650 can have an end surface 652, a flank surface, and an opposite end surface. Unlike the at least one island 150 shown in
In the construction shown in
Turning to
The substrate 702 can include a pocket 710. The pocket 710 can have an opening 712. The opening 712 can be disposed on the surface 704 of the substrate 702. The pocket 710 can extend from the opening 712 on the surface 704 to an interior of the substrate 702. The pocket 710 can have a shape that can receive at least a portion of the at least one island 750.
The at least one island 750 can have a generally cylindrical shape in one exemplary embodiment. The at least one island 750 may have a generally polygonal shape in another exemplary embodiment. The at least one island 750 can have an end surface 752, a flank surface, and an opposite end surface. Unlike the at least one island 150 shown in
In the construction shown in
Turning to
The substrate 802 can include a pocket 810. The pocket 810 can have an opening 812. The opening 812 can be disposed on the surface 804 of the substrate 802. The pocket 810 can extend from the opening 812 on the surface 804 to an interior of the substrate 802. The pocket 810 can have a shape that can receive at least a portion of the at least one island 850.
The at least one island 850 can have a generally cylindrical shape. The at least one island 850 can have an end surface 852, a flank surface 854, and an opposite end surface 856. Unlike the cutter assembly 100 shown in
In the construction shown in
Turning to
The substrate 902 can include a pocket 910. The pocket 910 can have an opening 912. The opening 912 can be disposed on the surface 904 of the substrate 902. The pocket 910 can extend from the opening 912 on the surface 904 to an interior of the substrate 902. The pocket 910 can have a shape that can receive at least a portion of the at least one island 950.
The at least one island 950 can have a generally cylindrical shape. The at least one island 950 can have an end surface 952, a flank surface 954, and an opposite end surface 956. Unlike the cutter assembly 100 shown in
In the construction shown in
Turning to
The substrate 1002 can include a pocket 1010. The pocket 1010 can have an opening 1012. The opening 1012 can be disposed on the surface 1004 of the substrate 1002. The pocket 1010 can extend from the opening 1012 on the surface 1004 to an interior of the substrate 1002. The pocket 1010 can have a shape that can receive at least a portion of the at least one island 1050.
The at least one island 1050 can have a generally cylindrical shape. The at least one island 1050 can have an end surface 1052, a flank surface 1054, and an opposite end surface 1056. Unlike the cutter assembly 100 shown in
In the construction shown in
Turning to
The substrate 1102 can include a pocket 1110. The pocket 1110 may have an opening 1112. The opening 1112 may be disposed on the surface 1104 of the substrate 1102. The pocket 1110 may extend from the opening 1112 on the surface 1104 to an opposite opening 1114 on an opposite end surface 1116 of the substrate 1102. The pocket 1110 can have a shape that can receive at least a portion of the at least one island 1150.
The at least one island 1150 can have a generally truncated conical shape. The at least one island 1150 can have an end surface 1152, a flank surface 1154, and an opposite end surface 1156. Unlike the cutter assembly 100 shown in
In the construction shown in
Turning to
The at least one island 1250 can have a generally ring-like shape. The at least one island 1250 can have an end surface 1252, a flank surface 1254, and an opposite end surface 1256. The flank surface 1254 can be substantially perpendicular to the end surface 1252, the opposite end surface 1256, or both. Unlike the cutter assembly 100 shown in
In the construction shown in
Turning to
The substrate 1302 can include one or more pockets 1310. The one or more pockets 1310 can each have an opening 1312. The openings 1312 can be disposed on the surface 1304 of the substrate 1302. The openings 1312 can be disposed such that one of the openings 1312 is surrounded by another of the openings 1312. The one or more pockets 1310 can extend from the openings 1312 on the surface 1304 to an interior of the substrate 1302. The one or more pockets 1310 can have a shape that can receive at least a portion of the at least one island 1350.
The at least one island 1350 can have a generally ring-like shape. The at least one island 1350 can have an end surface 1352, a flank surface 1354, and an opposite end surface 1356. The flank surface 1354 can be substantially perpendicular to the end surface 1352, the opposite end surface 1356, or both. Unlike the cutter assembly 100 shown in
In the construction shown in
Turning to
The at least one island 1450 can have a generally ring-like shape. The at least one island 1450 can have an end surface 1452, a flank surface 1454, and an opposite end surface 1456. The flank surface 1454 can be substantially perpendicular to the end surface 1452, the opposite end surface 1456, or both. Unlike the cutter assembly 100 shown in
In the construction shown in
Turning to
The substrate 1502 can include a pocket 1510. The pocket 1510 can have an opening 1512. The opening 1512 can be disposed on the surface 1504, the edge 1508, and the flank surface 1506 of the substrate 1502. The pocket 1510 can extend from the opening 1512 on the surface 1504, the edge 1508, and the flank surface 1506 to an interior of the substrate 1502. The pocket 1510 can have a shape that can receive at least a portion of the at least one island 1550.
The at least one island 1550 can have a generally cylindrical shape. The at least one island 1550 can have an end surface 1552, a flank surface 1554, and an opposite end surface 1556. The end surface 1552 can be a planar surface that can be substantially perpendicular to the flank surface 1554. The opposite end surface 1556 can also be a planar surface that is substantially perpendicular to the flank surface 1554. The at least one island 1550 can be disposed in the pocket 1510 of the substrate 1502. The at least one island 1550 can be disposed in the pocket 1510 of the substrate 1502 so that the end surface 1552 of the at least one island 1550 is substantially co-planar with surface 1504 of the substrate 1502, the flank surface 1554 extends into the interior of the substrate 1502 and protrudes beyond the flank surface 1506 of the substrate 1502, and the opposite end surface 1556 is at least partially disposed within the interior of the substrate 1502. The end surface 1552 can alternatively have a convexity such that the end surface 1552 can protrude from the surface 1504 of the substrate 1502. In a further alternative, the end surface 1552 can have a concavity such that the end surface 1552 can sag from the surface 1504 toward an interior of the substrate 1502. The end surface 1552 can be a cutting surface, or the end surface 1552 and the flank surface 1554 together can form a cutting surface. In another exemplary embodiment, at least one island 1550 may intersect the periphery edge.
In the construction shown in
For example, turning to
Turning to
The substrate 1602 can include a pocket 1610 and portion 1614 that can extend the pocket 1610 beyond the flank surface 1606 of the substrate 1602. The portion 1614 can be shaped to receive a portion of the at least one island 1650. As best seen in
The at least one island 1650 can have a generally cylindrical shape. The at least one island 1650 can have an end surface 1652, a flank surface 1654, and an opposite end surface 1656. The end surface 1652 can be a planar surface that can be substantially perpendicular to the flank surface 1654. The opposite end surface 1656 can also be a planar surface that is substantially perpendicular to the flank surface 1654. The at least one island 1650 can be disposed in the pocket 1610 of the substrate 1602. The at least one island 1650 can be disposed in the pocket 1610 of the substrate 1602 so that the end surface 1652 of the at least one island 1650 is substantially co-planar with surface 1604 of the substrate 1602. The at least one island 1650 can also be disposed in the pocket 1610 of the substrate 1602 so that the flank surface 1654 extends into the interior of the substrate 1602 and protrudes beyond the flank surface 1606 of the substrate 1602. The at least one island 1650 can be further disposed in the pocket 1610 of the substrate 1602 so that the opposite end surface 1656 is at least partially disposed within the interior of the substrate 1602 and partially disposed on the portion 1614. The end surface 1652 can alternatively have a convexity such that the end surface 1652 can protrude from the surface 1604 of the substrate 1602. In a further alternative, the end surface 1652 can have a concavity such that the end surface 1652 can sag from the surface 1604 toward an interior of the substrate 1602. The end surface 1652 can be a cutting surface, or the end surface 1652 and the flank surface 1654 together can form a cutting surface.
In the construction shown in
Turning to
The substrate part 1702b can have a surface 1704b. The surface 1704b can be an end surface. The surface 1704b can be shaped to receive surface 1705a of substrate part 1702a. The substrate 1702b can also have a flank surface 1706b. The surface 1704b can be substantially perpendicular to the flank surface 1706b. The flank surface 1706b can meet the surface 1704b so that a common boundary between the surface 1704b and the flank surface 1706b defines a peripheral edge 1708b of the surface 1704b. The surface 1704b can be a substantially planar surface. The flank surface 1706b can provide the substrate part 1702b with a generally circular cross-sectional shape. In other embodiments, the substrate part 1702b can have a cross-sectional shape that can be triangular, can be similar to a polygon, and/or can have any regular or irregular shape besides circular.
The substrate par 1702a can include a pocket 1710. The pocket 1710 can have an opening 1712. The opening 1712 can be disposed on the surface 1705a of the substrate part 1702a. The pocket 1710 can extend from the opening 1712 on the surface 1704 to an interior of the substrate part 1702a. The pocket 1710 can have a shape that can receive at least a portion of the at least one island 1750.
The at least one island 1750 can have a generally cylindrical shape. The at least one island 1750 can have an end surface 1752, a flank surface 1754, and an opposite end surface 1756. The end surface 1752 can be a planar surface that can be substantially perpendicular to the flank surface 1754. The opposite end surface 1756 can also be a planar surface that is substantially perpendicular to the flank surface 1754. The at least one island 1750 can be disposed in the pocket 1710 of the substrate part 1702a. The at least one island 1750 can be disposed in the pocket 1710 of the substrate part 1702a so that the opposite end surface 1756 of the at least one island 1750 is substantially co-planar with surface 1705a of the substrate part 1702a, the flank surface 1754 extends into the interior of the substrate part 1702a, and the end surface 1752 is disposed within the interior of the substrate part 1702a. The end surface 1752 can be a cutting surface, or the end surface 1752 and the flank surface 1754 together can form a cutting surface.
In the construction shown in
Turning to
The substrate 1802 can include a pocket 1810. The pocket 1810 can have an opening 1812. The opening 1812 can be disposed on the surface 1804 of the substrate 1802. The pocket 1810 can extend from the opening 1812 on the surface 1804 to an interior of the substrate 1802. The pocket 1810 can have a shape that can receive at least a portion of the at least one island 1850.
The at least one island 1850 can have a generally cylindrical shape. The at least one island 1850 can have an end surface 1852, a flank surface 1854, and an opposite end surface 1856. The end surface 1852 can be a planar surface that can be substantially perpendicular to the flank surface 1854. The opposite end surface 1856 can also be a planar surface that is substantially perpendicular to the flank surface 1854. The at least one island 1850 can be disposed in the pocket 1810 of the substrate 1802. The at least one island 1850 can be disposed in the pocket 1810 of the substrate 1802 so that the end surface 1852 of the at least one island 1850 is not co-planar with surface 1804 of the substrate 1802 but below the surface 1804 of the substrate. A substrate part 1858 can be disposed in the pocket 1810 on the end surface 1852 of the at least one island 1850. The substrate part 1858 can also extend to the opening 1812 of the pocket 1810 and can be substantially co-planar with the surface 1804 of the substrate 1802. The substrate part 1858 can be made of the same material as the substrate 1802. Alternatively, the substrate part 1858 and the substrate 1802 can be made from different materials. The at least one island 1850 can also be disposed in the pocket 1810 of the substrate 1802 so that the flank surface 1854 extends into the interior of the substrate 1802 and the end surface 1852 is disposed within the interior of the substrate 1802. The end surface 1852 can alternatively have a convexity such that the end surface 1852 can protrude from the surface 1804 of the substrate 1802. In a further alternative, the end surface 1852 can have a concavity such that the end surface 1852 can sag from the surface 1804 toward an interior of the substrate 1802. The end surface 1852 can be a cutting surface, or the end surface 1852 and the flank surface 1854 together can form a cutting surface.
In the construction shown in
Turning to
The substrate 1902 can include a groove 1914. The groove 1914 may be able to delay contact of the substrate 1902 when the at least one island 1950 is substantially worn. The groove 1914 can disposed on the flank surface 1906. The groove 1914 can penetrate towards an interior of the substrate 1902. The groove 1914 can be shaped like the letter “V”, an open polygonal shape, or an open semi-circle as shown in
The substrate 1902 can include a pocket 1910. The pocket 1910 can have an opening 1912. The opening 1912 can be disposed on the surface 1904 of the substrate 1902. The pocket 1910 can extend from the opening 1912 on the surface 1904 to an interior of the substrate 1902. The pocket 1910 can have a shape that can receive at least a portion of the at least one island 1950.
The at least one island 1950 can have a generally cylindrical shape. The at least one island 1950 can have an end surface 1952, a flank surface 1954, and an opposite end surface 1956. The end surface 1952 can be a planar surface that can be substantially perpendicular to the flank surface 1954. The opposite end surface 1956 can also be a planar surface that is substantially perpendicular to the flank surface 1954. The at least one island 1950 can be disposed in the pocket 1910 of the substrate 1902. The at least one island 1950 can be disposed in the pocket 1910 of the substrate 1902 so that the end surface 1952 of the at least one island 1950 is substantially co-planar with surface 1904 of the substrate 1902, the flank surface 1954 extends into the interior of the substrate 1902, and the opposite end surface 1956 is disposed within the interior of the substrate 1902. The end surface 1952 can alternatively have a convexity such that the end surface 1952 can protrude from the surface 1904 of the substrate 1902. In a further alternative, the end surface 1952 can have a concavity such that the end surface 1952 can sag from the surface 1904 toward an interior of the substrate 1902. The end surface 1952 can be a cutting surface, or the end surface 1952 and the flank surface 1954 together can form a cutting surface.
In the construction shown in
Referring to
The step of providing the at least one island can further comprise forming the at least one island from a polycrystalline diamond, a cemented carbide, a polycrystalline cubic boron nitride (cBN) superabrasive, a ceramic, a metal, a metal alloy, and/or combinations thereof made from at least one of a high pressure high temperature process, a chemical vapor deposition process, and a physical vapor deposition process. The step of providing the at least one island can further comprise forming the at least one island from a portion of a polycrystalline diamond.
The method 2000 can further comprise coating the at least one island. The method 2000 can alternatively further comprise encasing the at least one island. The method can further comprise coupling the at least island to the at least one pocket. The at least one island can be coupled to the at least one pocket by press fit, gluing, brazing, bonding, clamping, mechanical interlocking, or welding.
The step of treating the at least one island can further comprise partially leaching the at least one island. Alternatively, the step of treating the at least one island can further comprise substantially fully leaching the at least one island.
The step of disposing the at least one island in the at least one pocket can further comprise disposing the at least one island such that a cutting surface of the at least one island is substantially flush with the surface of the substrate. The step of disposing the at least one island in the at least one pocket can further comprise disposing the at least one island such that a cutting surface of the at least one island protrudes outward from the surface of the substrate. The step of disposing the at least one island in the at least one pocket further comprises disposing the at least one island such that a cutting surface of the at least one island projects towards the interior of the substrate.
The method 2000 can also further comprise providing a cutting surface that has a generally circular shape on the at least one island. Alternatively, the method 2000 can further comprise providing a cutting surface that has a generally ovalular shape on the at least one island. In another alternative, the method 2000 can further comprise
providing a cutting surface that has a generally triangular shape. In yet another alternative, the method 2000 can further comprise providing a cutting surface that has a generally polygonal shape.
The method 2000 can further comprise forming at least one other pocket on the surface symmetrically with respect to the at least one pocket; and disposing at least one other island in the at least one other pocket. Alternatively, the method 2000 can further comprise forming at least one other pocket on the surface unsymmetrically with respect to the at least one pocket and disposing at least one other island in the at least one other pocket. In another alternative, the method 2000 can further comprise forming at least one other pocket on the surface spaced apart from the at least one pocket and disposing at least one other island in the at least one other pocket. In yet another alternative, the method 2000 can further comprise forming at least one other pocket on the surface with a second opening conjoined with the opening of the at least one pocket and disposing at least one other island in the at least one other pocket.
The method 2000 can further include forming a planar surface, a concave surface, a dome-shaped surface, a chiseled surface, or a wavy surface with the surface of the substrate and a cutting surface of the at least one island.
The step of providing the substrate can include forming the substrate so as to provide a substrate 102 . . . 1902, as described above and as shown in
The step of providing the at least one pocket can be include forming the at least one pocket so as to provide at least one pocket 110 . . . 1910, as described above and as shown in
The step of providing the at least one island can be include forming the at least one island so as to provide at least one island 150 . . . 1950, as described above and as shown in
Referring to
More specifically, the fabrication process or method may be categorized into a first group (Group I) which may comprise methods of preparing the individual components in a final state. The final state herein may refer to the component's chemical composition, shape, mechanical properties, density phase distribution and content may be finalized with little changes, assembling them together to form a final embodiment. Another group (Group II) may adopt another route to pre-assemble the semi-made components (in green body form, not the final state), then followed by one-step sintering or fabricating the pre-assembly.
In group I method or process, a pocket in substrate, such as a pocket in the sintered carbide which may be made of Co—WC, Ni—WC, or WC based materials containing other cubic carbides, such as titanium carbide, niobium carbide, tantalum carbide, vanadium carbide, chromium carbide, molybdenum carbide, for example, may be machined with the methods such as wire electro discharge machining (EDM), electro discharge grinding (EDG), milling, drilling, grinding, turning, laser ablation and/or laser cutting. The pocket thus made may be to a specific size to house the island.
Another exemplary method to form the pocket or housing cavity may be to form a net shape during the fabrication process of the substrate. The fabrication process may proceed as follows: at least one displacement may be to fabricate with the similar shape of the island from a sacrificial material. The sacrificial materials may comprise graphite, hexagonal boron nitride (h-BN), salt, ceramics, minerals and/or the mixtures thereof. The displacement part may be pre-fabricated with any of the methods including: machining, sintering, pressing, gluing. The displacement part thus fabricated may have a similar shape as the island but not exactly the same dimension in order to account for the dimensional changes during fabrication process (like shrinkage during HPHT pressing/sintering). The displacement part may then be assembled into the substrate green body and may go through the same fabrication process such as sintering. After the process, the displacement part may be removed from the finished substrate body to form a cavity, a notch, a housing or a pocket for the island. The removal methods may include, water dissolving of soluble displacement materials like salt/h-BN, milling/grinding insolvable materials like ceramics, graphite. Necessary successive cleaning process like sand blasting, grinding, machining may be needed to clean the cavity thus formed to a desirable dimension.
Another exemplary method to fabricate the substrate with at least one pocket to house the island may be to build a substrate with the cavity in it in a single step. To do this, the substrate green body prior to final sintering stage may have the at least one cavity/pocket in it. The shape of the green body is the same as that of the final sintered substrate while there is difference in the absolute dimensions between the substrate green body and the final sintered substrate part. This difference is to account for the volumetric shrinkage during the sintering process. The green body may be made from a method like pre-compaction, die-pressing, extrusion, slurry casting. Necessary binder agents might be adopted in the fabrication process to provide the green body with a desired strength. The binder agents may include, wax, polyvinyl butyrate (PVB), polyvinyl acetate (PVA), polyvinyl chloride (PVC), polyethylene glycol (PEG). Other machining steps upon the green body aforementioned may also include if necessary, i.e. milling, drilling, turning, grinding, or coring. The substrate green body may be subjected to the carbide fabrication process like sintering to achieve the final geometric dimension and physical/chemical properties. The method may be a one-step method to have the pocket built into the substrate. Successive cleaning process might be needed to clean the burrs and/or other debris from the pocket wall/bottom also to a desired final dimension.
All the aforementioned methods of fabricating the substrate may also be applied to fabricate a partial substrate. The partial substrate may be later on assembled to the other part of the substrate and make up the whole substrate. However, the same idea and essence of the invention may be applied to the whole substrate and/or part of the substrate. Also the substrate materials may be WC containing materials. The substrate may be made of materials including single crystalline diamond, polycrystalline diamond, single crystalline cubic boron nitride, polycrystalline cubic boron nitride, WC, VersiMax®, thermally stable diamond, cermet and/or ceramics.
One of the methods to form the net shape of islands may be to use a preformed foil barrier, such as metal barriers. The preformed foil barriers may be made of materials that may function as the separation walls between the islands during the high-pressure high-temperature (HPHT) process. Such materials may comprise a refractory metal, such as Zr, Ta, Mo, V, Nb, stainless steel, graphite, minerals and grafoil, casting solidified slurry, plastically formed borders, or mechanically oppressed the mixture thereof. The barrier are arranged or preformed in such a way as to form compartments to house island materials or pre-made island green bodies into it. The island materials may be loaded into the compartments in powder form, or slurry, or colloidal form. The pre-made island green bodies may be made from pre-compaction, die-pressing, extrusion and/or slurry casting. Then the island materials and/or green bodies together with the preformed barriers are subject to the HPHT process to achieve the desired shape and chemical/physical properties. The islands thus formed may be separated with successive processing.
Another way of forming island is to first fabricate a dense chunk of island materials. The fabrication methods may include HPHT sintering, atmospheric pressure sintering, pressurized sintering, press sintering, CVD, PVD. The island may be machined or cut from the chunk into the final desired shape and dimensions. The machining methods and the cutting methods comprise sawing, coring, slicing, drilling, turning, grinding, milling, wire EDM cutting, EDG, laser cutting.
The island aforementioned may comprise a single crystalline diamond, polycrystalline diamond, single crystalline cubic boron nitride, and polycrystalline cubic boron nitride, WC, VersiMax®, thermally stable diamond, cermet, ceramics and/or WC.
There may be several ways to assemble the pre-formed island and substrate. In one exemplary embodiment for the pre-formed substrate having at least one pocket and the at least one island, the final island cutter may be assembled via brazing, welding or soldering. To assure the adherence between the substrate pocket and the island coating on either the island and or substrate, brazing, welding, soldering process may be used. Such coating may comprise tungsten, silicon, titanium, silver, copper, chromium, tantalum, vanadium, niobium, zirconium, molybdenum, iron, nickel, cobalt. The brazing, welding, soldering agent may contain gold, silver, copper, zinc, tin, silicon, titanium, chromium, vanadium, nickel, cobalt, iron, platinum, palladium, tungsten, for example.
The brazing, welding, soldering temperature may be in the range of 500° C. to 1500° C., for example. The range may be 650° C. to 1250° C. in one exemplary embodiment. In another exemplary embodiment the range may be 700° C. to 1000° C., for example. The at least one island with optional coating is seated in the at least one pocket of the substrate as per the desired orientation to form an assembly with at least one island in the substrate. In another exemplary embodiment, coating may be on an intermediate layer between the substrate and the island. Brazing, welding or soldering agent and heat may be applied to the assembly. The intimate bonding may form between the at least one island and the at least one substrate to a desirable mechanical strength or chemical properties. The heat source or heating method may be from radiation heating, microwave heating, torch heating, laser heating, electrical arc heating, infrared heating, induction heating, electrical resistance heating, conduction heating, ultrasonic heating, convection heating for example.
During the heating process optional atmospheric condition may be needed to facilitate the brazing, welding or soldering. Such atmospheric condition includes inert gas, reforming gas, reducing atmosphere, ambient atmosphere, oxidizing atmosphere, high-pressure atmosphere, or vacuum atmosphere. External pressure may also be applied to facilitate the brazing, welding or soldering.
Another method to assemble the at least one island and the substrate with at least one pocket into an embodiment may be with press fitting. The island may be slightly bigger than the pocket in the substrate. With the negative interference between the island and the pocket in the substrate, a net force may be applied to retain the island in the substrate once the island is pressed into the pocket of the substrate. To facilitate the process, certain heating or cooling upon the substrate with at least one pocket or the island might be adopted. Also coating or intermediate layer between the substrate and the island may be employed to manage the local stress condition between the island and the substrate.
Yet another method to achieve the assembly of island and substrate may be to use mechanical locking. The substrate and island geometries are designed in such that after the island fits in the pocket of the substrate, the island may be secured with mechanical locking. Such geometries may include trenches, steps, slopes, curves. Other than the locking from the geometric design of island and/or substrate, the external mechanical locking methods may also be adopted, such as pins, screws, caps. The mechanical locking may be realized via geometric designs on the substrate and the island like trenches, steps, slopes, or curves.
There may be many ways to fabricate island cutter from island and substrate green bodies. One exemplary embodiment to build a substrate with the cavity in it. To do this, the substrate green body prior to the final HPHT sintering stage may have the at least one cavity/pocket in it. The shape of the green body is the same as that of the sintered substrate while there is difference in the absolute dimensions between the substrate green body and the final sintered substrate part. The difference may be to account for the volumetric shrinkage during the final HPHT sintering process. The green body thus made may be made from any known methods like pre-compaction, die-pressing, extrusion, slurry casting. Necessary binder agents might be adopted in the fabrication process to provide the green body with desired strength. The binder agents may include wax, PVB, PVA, PVC, PEG. Other machining steps upon the substrate green body aforementioned may also be included if necessary, i.e. milling, drilling, turning, grinding, coring.
The aforementioned methods of fabrication of the substrate green body may also be applied to fabricate partial substrate green body. The partial substrate green body may later be assembled to the other parts of the substrate green bodies and make up the whole substrate green body. However, the same idea and essence of the invention may be applied to the whole substrate or part of the substrate. Also the substrate materials may be Co—WC, Ni—WC and WC based materials containing other cubic carbides like titanium carbide, niobium carbide, tantalum carbide, vanadium carbide, chromium carbide, molybdenum carbide. The substrate may be made of any materials including single crystalline diamond, polycrystalline diamond, single crystalline cubic boron nitride, polycrystalline cubic boron nitride, WC, Versimax®, thermally stable diamond, cermet and/or ceramics.
To fabricate the at least one island green body, the shape of the at least one island green body may be the same as that of the final sintered island while there is difference in the absolute dimensions between the island green body and the final sintered island part. This difference may be to account for the volumetric shrinkage during the final HPHT sintering process. The green body may be made from a method like pre-compaction, die-pressing, extrusion, slurry casting. Necessary binder agents might be adopted in the fabrication process to provide the green body with a desired strength. The binder agents include wax, PVB, PVA, PVC, PEG. Other machining steps upon the island green body aforementioned may also be included if necessary, i.e. milling, drilling, turning, grinding, coring. The aforementioned methods of fabrication of the island green body may also be applied to fabricate the partial island green body. The partial island green body may later on be assembled to the other parts of the island green bodies and make up the whole island green body. However the same idea and essence of the invention may be applied to the whole island and/or part of the island.
Also the island materials may not be limited to single crystalline diamond, polycrystalline diamond, single crystalline cubic boron nitride, polycrystalline cubic boron nitride, WC, VersiMax®, thermally stable diamond, cermet and/or ceramics. The island may be made of any materials including Co—WC, Ni—WC and WC based materials containing other cubic carbides like titanium carbide, niobium carbide, tantalum carbide, vanadium carbide, chromium carbide, molybdenum carbide.
The substrate green body with at least one pocket and the at least one island green body may be assembled into a cutter green body assembly. The assembly may then be subjected to HPHT process to be sintered into one embodiment. Optional sintering additives or aids may be added to facilitate the sintering process. The sintering additive and/or aid may comprise Group VIII metals, cobalt, iron, nickel or metalloid silicon, for example. The sintering temperature range may be between 900° C. to 2300° C. in one exemplary embodiment. In another exemplary embodiment, the sintering temperature may be between 1000° C. to 2000° C. In yet another exemplary embodiment, the sintering temperature may be from 1200° C. to 1800° C. In further another exemplary embodiment, the sintering temperature may range from 1300° C. to 1600° C. Pressure range may be 5 GPa to 20 GPa in one exemplary embodiment. In another exemplary embodiment, the pressure range may be between 6 GPa to 15 GPa. In yet another exemplary embodiment, the pressure range may be from 6.5 GPa to 10 GPa, for example. The sintered embodiment might go through successive finishing steps to the desired final dimension like grinding, lapping, turning, polishing, bonding, heat treatment and/or chamfering.
In an exemplary embodiment of fabricating island cutters from island green body or powder and sintered substrate, the at least one island green body or island powder may be put into the at least one pocket of the sintered substrate to form a pre-sintering cutter assembly. The assembly may be then subjected to HPHT process to be sintered into one embodiment. Optional sintering additives and/or aids may be added to facilitate the sintering process. The sintering additive or aid may comprise of Group VIII metals, cobalt, iron, nickel or metalloid silicon. The sintering temperature range may be between 900° C. to 2300° C. in one exemplary embodiment. In another exemplary embodiment, the sintering temperature may be between 1000° C. to 2000° C. In yet another exemplary embodiment, the sintering temperature may be from 1200° C. to 1800° C. In further another exemplary embodiment, the sintering temperature may range from 1300° C. to 1600° C. Pressure range may be 5 GPa to 20 GPa in one exemplary embodiment. In another exemplary embodiment, the pressure range may be between 6 GPa to 15 GPa. In yet another exemplary embodiment, the pressure range may be from 6.5 GPa to 10 GPa, for example. The sintered embodiment might go through successive finishing steps to the desired final dimension like grinding, lapping, turning, polishing, bonding, heat treatment and/or chamfering.
For the purposes of promoting an understanding of the principles of the invention, reference has been made to the embodiments illustrated in the drawings, and specific language has been used to describe these embodiments. However, no limitation of the scope of the invention is intended by this specific language, and the invention should be construed to encompass all embodiments that would normally occur to one of ordinary skill in the art. The terminology used herein is for the purpose of describing the particular embodiments and is not intended to be limiting of exemplary embodiments of the invention.
The use of any and all examples, or exemplary language (e.g., “such as”) provided herein, is intended merely to better illuminate the invention and does not pose a limitation on the scope of the invention unless otherwise claimed. No item or component is essential to the practice of the invention unless the element is specifically described as “essential” or “critical”. The words “mechanism” and “element” are used broadly and are not limited to mechanical or physical embodiments, but may include software routines in conjunction with processors, etc. It will also be recognized that the terms “comprises,” “comprising,” “includes,” “including,” “has,” and “having,” as used herein, are specifically intended to be read as open-ended terms of art. The use of the terms “a” and “an” and “the” and similar referents in the context of describing the invention (especially in the context of the following claims) are to be construed to cover both the singular and the plural, unless the context clearly indicates otherwise. In addition, it should be understood that although the terms “first,” “second,” etc. may be used herein to describe various elements, these elements should not be limited by these terms, which are only used to distinguish one element from another. Furthermore, recitation of ranges of values herein are merely intended to serve as a shorthand method of referring individually to each separate value falling within the range, unless otherwise indicated herein, and each separate value is incorporated into the specification as if it were individually recited herein.
Numerous modifications and adaptations will be readily apparent to those of ordinary skill in this art without departing from the spirit and scope of the present invention as defined by the following claims. Therefore, the scope of the invention is defined not by the detailed description of the invention but by the following claims, and all differences within the scope will be construed as being included in the invention.
Although described in connection with preferred embodiments thereof, it will be appreciated by those skilled in the art that additions, deletions, modifications, and substitutions not specifically described may be made without department from the spirit and scope of the invention as defined in the appended claims.
Claims
1. A method of fabricating a cutting element having at least one island structure in at least one pocket of a substrate, comprising:
- building the substrate with at least one pocket;
- putting the at least one island into the at least one pocket in the substrate to form an assembly, the at least one island is not in a final state, wherein in the final state, chemical composition, shape, phase distribution and content, density and mechanical properties are finalized without changes; and
- subjecting the assembly to a final fabrication process to form the said cutting element and achieve the final state of the cutting element and at least one island in at least one pocket.
2. The method according to claim 1, wherein the at least one island is island material powder.
3. The method according to claim 1, wherein the at least one island material is an island green body.
4. The method according to claim 1, wherein the final fabrication process is an HPHT process.
5. The method according to claim 4, wherein the HPHT process uses sintering additive or aid to facilitate the HPHT process.
6. The method according to claim 5, wherein the sintering additive or aid comprises Group VIII metals, cobalt, iron, nickel or metalloid silicon.
7. The method according to claim 4, wherein the HTHP process is under temperature range of from 900° C. to 2300° C.
8. The method according to claim 4, wherein the HTHP process is under pressure range of from 3 GPa to 20 GPa.
9. The method according to claim 4, wherein the HTHP process is under pressure range of from 0.01 GPa to 20 GPa.
10. The method according to claim 1, wherein the substrate is at least one of WC, polycrystalline diamond, single crystalline diamond, polycrystalline cubic boron nitride, single crystalline boron nitride, cermet, ceramics, thermally stable diamond, and diamond composite.
11. The method according to claim 1, wherein the at least one pocket in the substrate is formed by at least one of EDM, EDG, milling, drilling, grinding, turning, laser ablation and laser cutting.
12. The method according to claim 1, wherein the at least one pocket in the substrate is formed by removal of a pre-formed displacement part in the substrate after a fabrication process.
13. The method according to claim 12, wherein the pre-formed displacement is made of at least one of graphite, hexagonal boron nitride (h-BN), salt, ceramics, minerals.
14. The method according to claim 12, wherein the removal includes at least one of dissolving soluble displacement materials, milling, and grinding insolvable materials.
15. The method according to claim 1, wherein the substrate green body with at least one pocket is pre-formed with at least one method of pre-compaction, die-pressing, extrusion, slurry casting.
16. The method according to claim 9, wherein the at least one pocket in the substrate green body is pre-formed with at least one method of milling, drilling, turning, grinding, coring.
17. A method of fabricating a cutting element having at least one island structure in at least one pocket of a substrate, comprising:
- putting at least one island into at least one pocket in a substrate to form an assembly, the at least one island is not in a final state, wherein in the final state, chemical composition, shape, phase distribution and content, density and mechanical properties are finalized without changes; and
- subjecting the assembly to a high temperature high pressure sintering process to form the said cutting element and achieve the final state of the cutting element and at least one island in at least one pocket.
18. The method according to claim 17, wherein the at least one island material is an island green body.
19. The method according to claim 17, wherein the HPHT sintering process uses sintering additive or aid to facilitate the HPHT process.
20. The method according to claim 19, wherein the sintering additive or aid comprises Group VIII metals, cobalt, iron, nickel or metalloid silicon.
Type: Application
Filed: Mar 14, 2013
Publication Date: Oct 3, 2013
Applicant: DIAMOND INNOVATIONS, INC. (Worthington, OH)
Inventors: Yuanbo Lin (Houston, TX), Bruce Jake Reierson (Delaware, OH), Joseph Michael Rhodes (Heath, OH), John W. Lucek (Powell, OH)
Application Number: 13/826,182
International Classification: E21B 10/567 (20060101);