COOLING DEVICE
A heat-transferring member is mounted on one side of a circuit board. A heat sink is arranged farther away from the circuit board than the heat-transferring member in the thickness direction of the circuit board. The heat sink has a plurality of fins each extending in the direction of the circuit board and separated from each other by a space. Also, the heat sink includes a support portion extending in the direction of the plurality of fins and supporting the plurality of fins. A plurality of heat pipes is connected to the heat-transferring member and separated from each other by a space, each extending in the thickness direction of the circuit board and connecting to the support portion.
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The Present Disclosure claims priority to prior-filed Japanese Patent Application No. 2012-094163, entitled “Cooling Device,” filed on 17 Apr. 2012 with the Japanese Patent Office. The content of the aforementioned Patent Application is incorporated in its entirety herein.
BACKGROUND OF THE PRESENT DISCLOSUREThe Present Disclosure relates, generally, to a cooling device including a heat sink.
A cooling device has been disclosed in Japanese Patent Application No. 2008-134115, which is used to radiate the heat of a heat-generating body in an electronic device. In this cooling device, a plurality of overlapping heat sinks (comb-shaped fins in the '115 Application) are arranged, and these are connected by a column-shaped base pin which transfers the heat.
In the '115 Application, a plurality of fins extend radially from a single base pin in each heat sink. Because it is difficult to increase the number of base pins using this structure, it is difficult to improve the heat transfer efficiency from the heat-generating body to the heat sinks
SUMMARY OF THE PRESENT DISCLOSUREA purpose of the Present Disclosure is to provide a cooling device able to improve the efficiency with which heat is transferred from a heat-generating body to a heat sink.
In the cooling device of the Present Disclosure, a heat-transferring member is mounted on one side of a panel-shaped heat-generating body. A heat sink is arranged farther away from the heat-generating body than the heat-transferring member in the thickness direction of the heat-generating body. The heat sink includes a plurality of fins extending in the direction of the heat-generating body and separated from each other by a space, and a support portion extending in the direction of the fins, and connecting to and supporting the fins. A plurality of heat-transferring columns is connected to the heat-transferring member and separated from each other by a space, with the heat-transferring columns each extending in the thickness direction of the heat-generating body and connecting to the support portion. In this way, the efficiency with which heat is transferred from a heat-generating body to a heat sink can be improved.
In one aspect of the Present Disclosure, the cooling may further comprise a plurality of heat sinks arranged in the thickness direction of the heat-generating body with each functioning as a heat sink. In this way, the cooling performance of the cooling device can be improved.
In one aspect of the Present Disclosure, each of the plurality of heat sinks may have the same shape. In this way, the manufacturing productivity of the cooling device can be improved.
In one aspect of the Present Disclosure, each of the plurality of heat sinks may be offset in the circumferential direction with respect to the adjacent heat sinks and centered on the centerline of the heat-generating body in the thickness direction. In this way, the air receiving heat from the heat-generating body in each portion of the heat sinks may be discharged more readily.
In one aspect of the Present Disclosure, the support portion for each of the plurality of heat sinks may include a first extended portion extending in the direction of the heat-generating body and a second extended portion extending in a direction intersecting the direction of extension of the first extended portion. Also, each of the plurality of heat sinks may include, as the plurality of fins, a plurality of fins projecting from the first extended portion, and a plurality of fins projecting from the second extended portion. In this way, the cooling performance of the cooling device can be improved.
In one aspect of the Present Disclosure, the support portion for each of the plurality of heat sinks may include, as the second extended portion, at least two extended portions arranged symmetrically with respect to the centerline of the first extended portion. In this way, the cooling performance of the cooling device can be improved.
In one aspect of the Present Disclosure, the plurality of heat-transferring columns may include at least three heat-transferring columns, the support portion may include at least three connecting portions connected to at least three heat-transferring columns, and at least three connecting portions may be arranged at equal intervals in the circumferential direction centered on the centerline of the heat-generating body in the thickness direction. In a structure in which a plurality of heat sinks are offset in the circumferential direction, each of the heat-transferring columns can be connected to all of the heat sinks
In one aspect of the Present Disclosure, each of the plurality of heat sinks may include a first half body having a support portion and a plurality of fins, and a second half body having a support portion and a plurality of fins. Here, the first half body and the second half body may be arranged symmetrically with respect to a straight line running along the heat-generating body. This allows the size of each heat sink to be increased. As a result, the cooling performance of the cooling device can be improved.
In one aspect of the Present Disclosure, an air passage may be formed between the first half body and the second half body, and the air passage may extend radially from the centerline running through the heat-generating body in the thickness direction and be connected to the outer side of the plurality of heat sinks. In this way, the air can be sent through an air passage between the first half body and the second half body, which further improves cooling performance.
In one aspect of the Present Disclosure, the plurality of fins in the first half body may extend in the direction of the second half body, the plurality of fins in the second half body may extend in the direction of the first half body, and the air passage may be formed between the plurality of fins of the first half body and the plurality of fins of the second half body. In this way, the air can be sent to the fins through the air passage between the first half body and the second half body, which further improves cooling performance.
The organization and manner of the structure and operation of the Present Disclosure, together with further objects and advantages thereof, may best be understood by reference to the following Detailed Description, taken in connection with the accompanying Figures, wherein like reference numerals identify like elements, and in which:
While the Present Disclosure may be susceptible to embodiment in different forms, there is shown in the Figures, and will be described herein in detail, specific embodiments, with the understanding that the Present Disclosure is to be considered an exemplification of the principles of the Present Disclosure, and is not intended to limit the Present Disclosure to that as illustrated.
As such, references to a feature or aspect are intended to describe a feature or aspect of an example of the Present Disclosure, not to imply that every embodiment thereof must have the described feature or aspect. Furthermore, it should be noted that the description illustrates a number of features. While certain features have been combined together to illustrate potential system designs, those features may also be used in other combinations not expressly disclosed. Thus, the depicted combinations are not intended to be limiting, unless otherwise noted.
In the embodiments illustrated in the Figures, representations of directions such as up, down, left, right, front and rear, used for explaining the structure and movement of the various elements of the Present Disclosure, are not absolute, but relative. These representations are appropriate when the elements are in the position shown in the Figures. If the description of the position of the elements changes, however, these representations are to be changed accordingly.
Referring to the Figures, and, specifically, as shown in
The heat-transferring member 20 may be mounted on one side of a panel-shaped heat-generating body such as an integrated circuit, a printed circuit board on which integrated circuits have been mounted, an IC chip, or an active/passive element. In the example explained here and shown in
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A space is formed between each of the plurality of fins 13, and the support portion 12 extends in the arrangement direction of the fins 13 and is connected to them. In this way, the plurality of fins 13 are supported by the support portion 12. Like the fins 13, the support portion 12 is wall-like and is erected on a plane parallel to the circuit board 90. In other words, the support portion 12 is wall-like and has vertical lines that are parallel to the circuit board 90. Each of the fins 13 projects from the side face of the support portion 12, and is formed orthogonally with respect to the support portion 12.
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In this example, the heat sinks 10 are divided into two heat sink half bodies 11. In other words, as shown in
In this example, the eight heat sink half bodies 11 constituting the four heat sinks 10 have the same shape. This improves the manufacturing productivity of the heat sinks 10. Because the two heat sink half bodies 11 constituting a single heat sink 10 are divided, the heat sink 10 is easy to manufacture even when the heat sink is large. The two heat sink half bodies 11 constituting a single heat sink 10 are arranged symmetrically along the centerline C1 and a line orthogonal to the centerline C1. Each heat sink half body 11 is an integrally molded member. The heat sink half bodies 11 can be extrusion molded or cast in the thickness direction of the circuit board 90.
The four heat sinks 10 are offset in the circumferential direction with respect to adjacent heat sinks 10 and are centered on the centerline C1. In this example, as shown in
As mentioned above, a plurality of connecting holes H are formed in the heat sinks 10 for insertion of heat pipes 31. As shown in
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As explained above, a single heat sink 10 has two heat sink half bodies 11. As shown in
Also, the support portion 12 has extended portions intersecting the first extended portion 12a, and fins 13 are formed on these two extended portions. In this example, as shown in
As mentioned above, two adjacent heat sinks 10 are arranged at a 90° angle with respect to each other. Therefore, the second extended portion 12b and the third extended portion 12c on one heat sink 10 of the two adjacent heat sinks 10 extend in direction X1-X2, and the second extended portion 12b and the third extended portion 12c on the other heat sink 10 extend in direction Y1-Y2 (see
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The support portion 12 in this example has two second extended portions 12b and two third extended portions 12c. The two second extended portions 12b are formed symmetrically with respect to the center of the first extended portion 12a. Similarly, the two third extended portions 12c are formed symmetrically with respect to the center of the first extended portion 12a. The two third extended portions 12c are formed at the two ends of the first extended portion 12a.
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As mentioned above, the heat-transferring member 20 includes four heat-dissipating plates 21. In this example, the four heat-dissipating plates 21 are arranged in two rows and two columns (see
The cooling device 1 can be assembled in the following manner. First, the end portions of heat pipes 31 are fixed to four heat-transferring members 20. In other words, the end portions of the heat pipes 31 are inserted into holes formed in the sockets 22 of the heat-transferring members 20. The ends of the heat pipes 31 are fixed to the sockets 22 using soldering, an adhesive, or forced insertion. Four heat-transferring members 20 are arranged in two rows and two columns. Afterwards, the plurality of heat pipes 31 are inserted into the plurality of connecting holes H in the first heat sink 10. The heat sink 10 is then soldered or bonded to the heat pipes 31. Next, the second heat sink 10 is rotated 90° with respect to the first heat sink 10, and inserted into the plurality of heat pipes 31. The second heat sink 10 is then fixed to the heat pipes 31. The third heat sink 10 and the fourth heat sink 10 are inserted into the heat pipes 31 in the same manner.
As explained above, the cooling device 1 has a heat-transferring member 20 mounted on one side of a circuit board 90, a panel-shaped heat-generating body, and has a heat sink 10 arranged closer to the heat-transferring member 20 than the circuit board 90 in the thickness direction of the circuit board 90. The heat sink 10 has a plurality of fins 13 extending in the direction of the circuit board 90 with space formed between them. Also, the heat sink 10 includes a support portion 12 which extends in the arrangement direction of the fins 13, and which connects to and supports the plurality of fins 13. The cooling device 1 has a plurality of heat pipes 31 arranged at some distance from each other and connected to a heat-transferring member 20. Each heat pipe 13 extends in the thickness direction of the circuit board 90 and is connected to the support portion 12. In this way, heat can be transferred efficiently to the heat sink 10.
A plurality of connecting holes H are formed in the two support portions 112 (three in this example). As in the cooling device 1, a heat-transferring column (for example, a heat pipe) is passed through each connecting hole H. In this way, the support portions 112 of the three heat sinks 110 are connected by a plurality of heat-transferring columns.
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As mentioned above, a plurality of connecting holes H are formed in the support portion 112 for the insertion of heat pipes. As shown in
In the cooling device 1, the heat sink half bodies 11 of the heat sinks 10 all have the same shape. However, the heat sink half bodes 11 do not have to have the same shape. For example, the two heat sink half bodies constituting a single heat sink 10 can have different shapes.
While a preferred embodiment of the Present Disclosure is shown and described, it is envisioned that those skilled in the art may devise various modifications without departing from the spirit and scope of the foregoing Description and the appended Claims.
Claims
1. A cooling device, the cooling device comprising:
- a heat-transferring member, the heat-transferring member being mounted on one side of a panel-shaped heat-generating body;
- a heat sink, the heat sink being arranged farther away from the heat-generating body than the heat-transferring member in the thickness direction of the heat-generating body, the heat sink including a plurality of fins and a support portion, each fin extending in the direction of the heat-generating body and separated from each other by a space, the support portion extending in the direction of the fins and connecting to and supporting the fins; and
- a plurality of heat-transferring columns, each heat-transferring column being connected to the heat-transferring member and separated from each other by a space, and extending in the thickness direction of the heat-generating body and connecting to the support portion.
2. The cooling device of claim 1, further comprising a plurality of heat sinks
3. The cooling device of claim 2, wherein each heat sink is arranged in the thickness direction of the heat-generating body.
4. The cooling device of claim 3, wherein each heat sink has the same shape.
5. The cooling device of claim 4, wherein each heat sink is offset in the circumferential direction with respect to an adjacent heat sink.
6. The cooling device of claim 5, wherein each heat sink is centered on the centerline of the heat-generating body in the thickness direction.
7. The cooling device of claim 6, wherein the support portion for each heat sink includes a first extended portion extending in the direction of the heat-generating body.
8. The cooling device of claim 7, wherein the support portion for each heat sink further includes a second extended portion extending in a direction intersecting the direction of extension of the first extended portion.
9. The cooling device of claim 8, wherein a portion of the fins on each heat sink projects from the first extended portion.
10. The cooling device of claim 9, wherein a portion of the fins on each heat sink projects from the second extended portion.
11. The cooling device of claim 10, wherein the second extended portion includes at least two extended portions arranged symmetrically with respect to the centerline of the first extended portion.
12. The cooling device of claim 11, wherein the plurality of each heat-transferring columns comprises at least three heat-transferring columns.
13. The cooling device of claim 12, wherein the support portion comprises at least three connecting portions.
14. The cooling device of claim 13, wherein each connecting portion is connected to one heat-transferring column and arranged at equal intervals in the circumferential direction centered on the centerline of the heat-generating body in the thickness direction.
15. The cooling device of claim 14, wherein each heat sink includes a first half body and a second half body.
16. The cooling device of claim 15, wherein both bodies including a support portion and a plurality of fins and being arranged symmetrically with respect to a straight line running along the heat-generating body.
17. The cooling device of claim 16, wherein an air passage is formed between the first half body and the second half body.
18. The cooling device of claim 17, wherein the air passage extends radially from the centerline running through the heat-generating body in the thickness direction.
19. The cooling device of claim 18, wherein the air passage is linked to the outside of each heat sink.
20. The cooling device of claim 19, wherein the fins in the first half body extend in the direction of the second half body, the fins in the second half body extend in the direction of the first half body, and the air passage is formed between the fins of the first half body and the fins of the second half body.
Type: Application
Filed: Apr 17, 2013
Publication Date: Oct 17, 2013
Applicant: Molex Incorporated (Lisle, IL)
Inventors: Kousuke TAKETOMI (Yamato), Rinkou Fukunaga (Kagoshima)
Application Number: 13/864,409