Heat Transmitter Patents (Class 165/185)
  • Patent number: 11912890
    Abstract: The invention relates generally to liquid-repellent coatings, and in particular, to porous liquid-repellent coatings, a method of preparing the porous liquid-repellent coatings, and a method of characterizing a porous surface for the liquid-repellent coatings. The invention further relates to a porous liquid-repellent coating comprising a porous layer of a transition metal oxide and/or hydroxide and a layer of a liquid-repellent compound deposited onto the porous layer of the transition metal oxide and/or hydroxide, wherein the porous layer of the transition metal oxide and/or hydroxide is comprised of a plurality of surface pores of varying angles with an average angle that is re-entrant.
    Type: Grant
    Filed: March 22, 2022
    Date of Patent: February 27, 2024
    Assignee: The Regents of the University of California
    Inventors: Lance Brockway, Hayden Kingsley Taylor
  • Patent number: 11913703
    Abstract: A horizontal Dewar flask is used with an optical metrology device, which may advantageously reduce the vertical height of the device. A thermal transfer member provides thermal transfer between a liquefied gas cooled sensor and liquefied gas in a chamber of the Dewar flask. To compensate for the loss of thermal transfer from the sensor as the liquefied gas evaporates and changes to a gaseous state, the thermal transfer member biases heat transfer to the liquefied gas that is at the bottom of the chamber. The thermal transfer member may have a larger surface area at a bottom portion of the thermal transfer member than the upper portion. For example, the thermal transfer member may include one or more projections that extend into the liquefied gas with greater density at the bottom of the chamber than at the top of the chamber.
    Type: Grant
    Filed: April 3, 2020
    Date of Patent: February 27, 2024
    Assignee: Onto Innovation Inc.
    Inventor: James Givens
  • Patent number: 11905910
    Abstract: A cooling apparatus includes a coolant passage provided in a device to be cooled. The coolant passage is configured in such a manner that coolant passes through the coolant passage. The coolant passage includes a wall surface, first ribs, and second ribs. The first ribs and the second ribs are provided on at least a part of the wall surface. The first ribs protrude from the wall surface toward inside of the coolant passage and extend in a first direction. The second ribs protrude from the wall surface toward the inside of the coolant passage and extend in a second direction crossing the first direction. The first ribs and the second ribs are disposed alternately when viewed in at least one direction.
    Type: Grant
    Filed: December 12, 2019
    Date of Patent: February 20, 2024
    Assignee: SUBARU CORPORATION
    Inventors: Yuki Yamamoto, Misaki Saito
  • Patent number: 11910563
    Abstract: A computing device comprises a housing, a heat-generating electronic component, at least one additional electronic component, and a liquid cooling module. The heat-generating component, the at least one additional electronic component, and the liquid cooling module are all positioned inside the housing. The liquid cooling module is configured to cool the heat-generating electronic component, and includes at least one movable radiator. The at least one movable radiator is configured to move between a first position and a second position. When the at least one movable radiator is in the first position, the at least one movable radiator blocks access to the at least one additional electronic component within the housing. When the at least one movable radiator is in the second position, the at least one movable radiator allows access to the at least one additional electronic component within the housing.
    Type: Grant
    Filed: June 21, 2021
    Date of Patent: February 20, 2024
    Assignee: QUANTA COMPUTER INC.
    Inventors: Jen-Mao Chen, Wei-En Tsai, Sin-Hong Lien, Jhih-Bin Guan
  • Patent number: 11910580
    Abstract: A power conversion device includes: a housing; and a cover coupled to the housing, the cover includes a plate portion, a heat conduction portion coupled to the plate portion, and a refrigerant pipe, the plate portion includes a first groove in which the refrigerant pipe is disposed, and the depth of one end of the first groove is smaller than that of the other end.
    Type: Grant
    Filed: December 26, 2019
    Date of Patent: February 20, 2024
    Assignee: LG INNOTEK CO., LTD.
    Inventor: Yong Joo Lee
  • Patent number: 11889761
    Abstract: To provide a thermoelectric conversion module member which has a high connecting property between a thermoelectric conversion layer and a diffusion prevention layer and is also excellent in heat resistance. A thermoelectric conversion module member comprising a thermoelectric conversion layer and a diffusion prevention layer in contact with the above-described thermoelectric conversion layer, wherein the above-described thermoelectric conversion layer is a layer containing a thermoelectric conversion material having a silicon element or a tellurium element, the above-described diffusion prevention layer is a layer containing a metal and the same thermoelectric conversion material as that contained in the above-described thermoelectric conversion layer, and the amount of the above-described thermoelectric conversion material in the above-described diffusion prevention layer is 10 to 50 parts by weight with respect to 100 parts by weight of the above-described metal.
    Type: Grant
    Filed: February 19, 2019
    Date of Patent: January 30, 2024
    Assignee: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Atsunori Doi, Satoshi Shimano
  • Patent number: 11885571
    Abstract: A pulsating vapor chamber has an inner board, a first outer board, a second outer board, an asymmetric loop, and a working fluid. The inner board has a first surface and a second surface. The first and second outer boards are mounted on the first surface and the second surface of the inner board respectively. The asymmetric loop is located between the first and second outer boards and has multiple channels communicating with each other in sequence. A part of the channels are formed between the first outer board and the inner board, and the remaining channels are formed between the second outer board and the inner board. With the asymmetric loop, even if the vapor chamber is disposed horizontally, pressure may be changed by different amount in the channels so that the working fluid is still able to oscillate or circulate.
    Type: Grant
    Filed: November 25, 2020
    Date of Patent: January 30, 2024
    Assignee: Cooler Master Co., Ltd.
    Inventor: Jen-Chih Cheng
  • Patent number: 11882671
    Abstract: A heat dissipating device includes a power distribution assembly and two convergence delivery assemblies. The power distribution assembly includes a first cooling reservoir, a second cooling reservoir, multiple cooling pumps disposed on the first cooling reservoir, and a serial pipeline and a cooling head corresponding to each of the cooling pumps respectively. The two convergence delivery assemblies separately communicate with first cooling reservoir and the second cooling reservoir, and are separately arranged on two sides of the power distribution assembly. The serial pipeline is connected with the cooling head to communicate between the first cooling reservoir and the second cooling reservoir.
    Type: Grant
    Filed: May 7, 2021
    Date of Patent: January 23, 2024
    Assignee: NIDEC CHAUN-CHOUNG TECHNOLOGY CORPORATION
    Inventor: Yao-Tsung Chiu
  • Patent number: 11876203
    Abstract: A heat exchanger having an integrated support structure particularly suited for thermal management of heat generating components such as battery thermal management applications or thermal management of other electronic components is disclosed. The heat exchanger includes a top plate and a base tray defining a plurality of fluid channels that extend between an inlet manifold area and an outlet manifold area. The top plate has a first side defining a primary heat transfer area and a second side for effecting a sealing relationship between the top plate and the base tray. In some instances, the top plate includes a thermally conductive material while the base tray includes a non-thermally conductive material. In some instances the base tray cooperates with a cover portion to define an enclosure for housing the heat generating components.
    Type: Grant
    Filed: October 5, 2018
    Date of Patent: January 16, 2024
    Assignee: DANA CANADA CORPORATION
    Inventor: Benjamin Kenney
  • Patent number: 11871539
    Abstract: An electronic apparatus with a cooling system includes a chassis having a mounting slot, and a removable device. The removable device includes a housing detachably disposed in the mounting slot; a first pump disposed in the housing, and detachably affixed to a bottom of the housing; a second pump detachably affixed to the bottom of the housing, and connected to the first pump; and a tank disposed on the first pump and configured to store cooling liquid. when the first pump or the second pump is operating, the cooling liquid in the tank flows into the first pump, and the cooling liquid in the first pump flows into the second pump.
    Type: Grant
    Filed: September 13, 2022
    Date of Patent: January 9, 2024
    Assignee: Nanning FuLian FuGui Precision Industrial Co., Ltd.
    Inventor: Chih-Hsuan Lin
  • Patent number: 11859877
    Abstract: The present invention provides a hybrid adsorption heat exchanging device comprising: at least one tubular or micro channel structure for carrying a heat transfer fluid; the external surface of said structure being provided with extensions in at least two locations; said extensions forming a bed therebetween for providing one or more adsorbent materials; a coating of adsorbent material being provided on at least a part of said extensions.
    Type: Grant
    Filed: January 9, 2015
    Date of Patent: January 2, 2024
    Assignee: BRY-AIR [ASIA] PVT. LTD.
    Inventors: Deepak Pahwa, Bidyut Baran Saha, Anil Kumar Choudhary, Rajan Sachdev, Kuldeep Singh Malik, Kyaw Thu
  • Patent number: 11850414
    Abstract: A fluid handling system includes a console configured to connect with a first electrical interface that is configured to connect to a plurality of components of the fluid handling system, the console including a second electrical interface configured to connect with the first electrical interface, a display, and one or more hardware processors. A control system includes the one or more hardware processors and a non-transitory memory storing instructions that, when executed, cause the control system to: detect an electrical signal from a first component of the plurality of components of the fluid handling system responsive to a caretaker performing a first instruction; determine a system state of the fluid handling system based at least in part on the electrical signal from the first component; compare the system state with a predetermined state condition corresponding to said first instruction; and output an indication on the display of the system state.
    Type: Grant
    Filed: February 11, 2021
    Date of Patent: December 26, 2023
    Assignee: TC1 LLC
    Inventors: Alan L. Schenck, Paul F. Muller, Keif M. Fitzgerald
  • Patent number: 11839061
    Abstract: An electronic module assembly includes a circuit card assembly (CCA) with heat generating electronic components. A connector is electrically connected to the heat generating electronic components, wherein the connector is positioned at a connection end of the CCA. A heatsink is mounted to the CCA, connected in thermal communication with the electronic components. An undulating channel feature is defined along a lateral edge of the heatsink relative to the connector. One or more channels of the undulating channel feature are aligned with an insertion axis defined by the connector.
    Type: Grant
    Filed: April 25, 2022
    Date of Patent: December 5, 2023
    Assignee: Hamilton Sundstrand Corporation
    Inventors: Alexander Trotman, Judy Schwartz, Josh Kamp, Robert J. DeFelice, Michael Doe, Jr., Anthony Matthew DeLugan
  • Patent number: 11825968
    Abstract: An adjustable vessel holder, such as an adjustable beverage container holder, is adjustable between a first position and a second position and includes a sleeve and at least one closure coupled to the sleeve. The at least one closure is configured to have a closed position and an open position. In the closed position, the adjustable vessel holder is in the first position and is configured to receive a vessel having a first size. In the open position of the closure, the adjustable vessel holder is in the second position and is configured to receive a different vessel having a second size. In some vessel holders, in the first position, a top end has a first internal perimeter, and in the second position, the top end has a second internal perimeter that is larger than the first internal perimeter.
    Type: Grant
    Filed: December 6, 2021
    Date of Patent: November 28, 2023
    Inventor: Lacie Leatherman
  • Patent number: 11832421
    Abstract: The present disclosure discloses a control device, which comprises: a circuit board; a heat dissipation cover comprising a heat dissipation cover plate and a plurality of heat dissipation fins arranged on the heat dissipation cover plate, wherein the heat dissipation cover plate covers the circuit board, and a groove is formed between the plurality of heat dissipation fins; a thermally conductive strip disposed between the circuit board and the heat dissipation cover plate; and a fan arranged in the groove. The heat dissipation cover disclosed herein covers the circuit board as a holistic upper cover, the heat of the circuit board is conducted to the heat dissipation cover through the thermally conductive strip, and the fan in the through groove generate an airflow to dissipate heat, thereby realizing sealing, dustproof and heat dissipation of the circuit board simultaneously.
    Type: Grant
    Filed: February 4, 2022
    Date of Patent: November 28, 2023
    Assignee: BEIJING TUSEN ZHITU TECHNOLOGY CO., LTD.
    Inventors: Weiwei Huang, Yu Zhang, Jianan Hao
  • Patent number: 11828549
    Abstract: An electronic device includes an integrated circuit and a heat exchanger. The heat exchanger includes a heat pipe and a first plurality of cooling fins and a second plurality of cooling fins. The heat pipe is thermally coupled to the integrated circuit and has an evaporator portion and a condenser portion, where the condenser portion extends away from the evaporator portion. The first plurality of cooling fins are attached to the condenser portion and proximate to the evaporation portion and form a plenum having a first associated pressure drop when a cooling fluid flows across the first plurality of cooling fins at a first velocity. The second plurality of cooling fins are attached to the condenser portion and distal from the evaporation portion and form a flow path having a second associated pressure drop when the cooling fluid flows across the second plurality of cooling fins at the first velocity.
    Type: Grant
    Filed: August 29, 2019
    Date of Patent: November 28, 2023
    Assignee: NVIDIA Corporation
    Inventors: Susheela Narasimhan, Sanjay Choudhry
  • Patent number: 11819963
    Abstract: A shared mold manufacturing method for industrial lighting devices includes the following steps: putting a metal material in a mold to execute a casting molding step to generate a semi-finished product; the semi-finished product has a plate portion and a box portion disposed on the plate portion; taking the semi-finished product from the mold and performing a cooling step to cool the semi-finished product; performing a separating step to separate the plate portion from the box portion; executing a re-processing step for the plate portion and the box portion in order to obtain a heat sink and a driver; and performing a combining step to combine the heat sink with the driver.
    Type: Grant
    Filed: May 24, 2023
    Date of Patent: November 21, 2023
    Assignee: Xiamen PVTECH Co., Ltd.
    Inventors: Haibo Hong, Fuxing Lu, Liangliang Cao
  • Patent number: 11815315
    Abstract: A flexible heat dissipation device includes an evaporator, a vapor tube, a liquid tube and a condenser. The evaporator has at least one vapor chamber. A capillary structure and a working fluid are received in the vapor chamber. Two ends of the vapor tube is respectively in communication with one end of the evaporator and the condenser. Two ends of the liquid tube are respectively in communication with the evaporator and the condenser, whereby the evaporator, the vapor tube, the condenser and the liquid tube form a loop for the working fluid to flow through. At least one bellows section is disposed on one or both of the vapor tube and the liquid tube. The bellows section has multiple waved stripes. More than one of the heights, widths and pitches of the multiple waved stripes are equal to or unequal to each other.
    Type: Grant
    Filed: February 18, 2021
    Date of Patent: November 14, 2023
    Assignee: Asia Vital Components (China) Co., Ltd.
    Inventors: Han-Min Liu, Xiao-Xiang Zhou, Shi-Lei Wei
  • Patent number: 11812584
    Abstract: A device for transferring heat from a device component to an environment includes a heat plate connected to a spring. A first fastener attaches the spring to the heat plate at a first location. A second fastener, such as a rivet, attaches the spring to the heat plate at each of a second and a third location. The second fastener includes a tab on and extending above the heat plate and corresponding tab slot on the spring. The spring is riveted to the heat plate at the first location and a second spring member accepts the tab at each of the second location and the third location. Ribs on a top surface of spring facilitate thermal coupling of the spring to the component when the device is assembled. One or more spring curvatures facilitate vertical deflection and horizontal extension of the spring during device assembly.
    Type: Grant
    Filed: June 9, 2020
    Date of Patent: November 7, 2023
    Assignee: DISH Technologies L.L.C.
    Inventor: Svitlana Trygubova
  • Patent number: 11808504
    Abstract: A cryogenic device includes: a hermetic container; a cryocooler including a mounting portion mounted on the container, a connecting part extending from the mounting portion into the container in an axial direction of the cryocooler, and a cooling stage attached to the connecting part and disposed in the container; and a member to be cooled that is disposed in the container with a gap, which is configured to allow heat to be exchanged, between the cooling stage and the member. The cooling stage includes a cold fin extending in a direction perpendicular to the axial direction. A fin receiving groove recessed in the direction perpendicular to the axial direction is formed in the member to be cooled and extends in the axial direction, and the member to be cooled receives the cold fin in the fin receiving groove with the gap.
    Type: Grant
    Filed: November 19, 2021
    Date of Patent: November 7, 2023
    Assignee: SUMITOMO HEAVY INDUSTRIES, LTD.
    Inventor: Mingyao Xu
  • Patent number: 11802527
    Abstract: A heat exchanger includes a housing having a heat exchanger core and a precooling flow structure disposed therein. The heat exchanger core is configured for exchanging heat between a first fluid and a second fluid. The precooling flow structure is coupled to each of the housing and an inlet end of the heat exchanger core with respect to a flow of the first fluid. An interior of the precooling flow structure is configured to convey the first fluid therethrough, The precooling flow structure includes at least one precooling tube extending through the interior of the precooling flow structure with each of the at least one precooling tubes configured to convey the second fluid therethrough in order to precool the first fluid before the first fluid enters the inlet end of the heat exchanger core.
    Type: Grant
    Filed: March 19, 2020
    Date of Patent: October 31, 2023
    Assignee: HANON SYSTEMS
    Inventors: Sunil Kumar Harihar Onkarachari, Steven C. White, Dale Martin Pickelman, Jr.
  • Patent number: 11800686
    Abstract: A solid state drive (SSD) apparatus includes a case including an air tunnel disposed between an inner plate and an upper wall and an accommodation space between the inner plate and a lower wall. The air tunnel extends in a first direction, and both end parts of the air tunnel are exposed to the outside. A substrate is disposed in the accommodation space. At least one semiconductor chip is disposed on the substrate.
    Type: Grant
    Filed: April 19, 2022
    Date of Patent: October 24, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sungchul Hur, Jaehong Park, Bumjun Kim, Yusuf Cinar, Hanhong Lee, Youngseok Hong, Doil Kong, Jaeheon Ma
  • Patent number: 11789220
    Abstract: Various apparatus are disclosed for lifting heat sinks during insertion of optical modules into transceiver cages (e.g., housings). The apparatus also provide for lifting of the heat sink during removal of the optical modules from the transceiver cages. While the heat sink is lifted during insertion or removal, the heat sink is in contact with the surface of the optical module when the optical module is fully inserted in the transceiver cage. Lifting of the heat sink during insertion and removal of the optical module allows a thermal interface material (TIM) to be placed on the surface of the heat sink in contact with the optical module to improve thermal conduction between the optical module and the heat sink.
    Type: Grant
    Filed: March 28, 2022
    Date of Patent: October 17, 2023
    Assignee: Amazon Technologies, Inc.
    Inventors: Tri Nguyen, Hogan Lew, Srinivas S. Chebrolu
  • Patent number: 11787157
    Abstract: Provided is a high heat radiation thin film. The high heat radiation thin film may comprise a metal substrate, and a carbon layer which is disposed on the metal substrate and is thicker than 2.5 nm and thinner than 10 nm.
    Type: Grant
    Filed: December 30, 2019
    Date of Patent: October 17, 2023
    Assignee: SOLUETA
    Inventors: Eui Hong Min, Sang Ho Cho, Buck Keun Choi
  • Patent number: 11786959
    Abstract: A double-sided expanded plate riveting structure and a double-sided expanded plate riveting method are disclosed. By providing an upright portion, a bottom end of the upright portion is bent toward at least one side to form a folded portion, and at least one side of the folded portion partially extends beyond a plane corresponding to an outer side of an expanded structure for a press head to perform a pressing operation, which effectively avoids a bend and deformation of a double-sided expanded plate in the riveting process.
    Type: Grant
    Filed: October 21, 2019
    Date of Patent: October 17, 2023
    Assignee: HUIZHOU HANXU HARDWARE & PLASTIC TECHNOLOGY CO., LTD.
    Inventor: Tsung-Hsien Huang
  • Patent number: 11779976
    Abstract: A cooling section (2) is situated in a rolling line or upstream or downstream of the rolling line. A hot metal rolled material (1) is cooled in the cooling section. A control device (13) of the cooling section (2) dynamically determines setpoint actuation states (S1*) for control valves (10) situated in supply lines (8) and actuates the control valves (10) accordingly. Main flows (F1) of a liquid, water-based coolant (7) are supplied to application devices (6) of the cooling section (2) via the supply lines (8) in accordance with the actuation. The supply lines (8) conduct the main flows (F1) to buffer regions (12) of the application devices (6). Proceeding from there, cooling flows (F) of the coolant (7) are applied to the hot rolled material (1). The control device (13) also dynamically determines setpoint actuation states (S2*) for active devices (16) and actuates the active devices (16) accordingly.
    Type: Grant
    Filed: July 30, 2019
    Date of Patent: October 10, 2023
    Inventor: Klaus Weinzierl
  • Patent number: 11785704
    Abstract: Provided is a cover for pressing a printed circuit board on a heat sink, the cover comprising a metal sheet and one or more domes arranged in the metal sheet, wherein each dome is associated with one or more slits in the shape of ring segments in the metal sheet, the ring segment-shaped slits being provided in the metal sheet side by side and spaced apart from each other, the ring segment-shaped slits surrounding the dome they are associated with. At least at one end of each ring segment-shaped slit a slit extension may be provided in the metal sheet, the slit extension at least in part pointing away from the dome the ring segment-shaped slit is associated with. Further provided is an electronic appliance that includes such a cover, a heat sink and an electronic circuit board sandwiched there between.
    Type: Grant
    Filed: July 30, 2021
    Date of Patent: October 10, 2023
    Assignee: Harman Becker Automotive Systems GMBH
    Inventors: Hans-Juergen Regl, Alexander Mieslinger
  • Patent number: 11776794
    Abstract: Embodiments of the present disclosure generally relate to an electrostatic chuck assembly suitable for use in cryogenic applications. In one or more embodiments, an electrostatic chuck assembly is provided and includes an electrostatic chuck having a substrate supporting surface opposite a bottom surface, a cooling plate having a top surface, where the cooling plate contains an aluminum alloy having a coefficient of thermal expansion (CTE) of less than 22 ppm/° C., and a bonding layer securing the bottom surface of the electrostatic chuck and the top surface of the cooling plate, where the bonding layer contains a silicone material.
    Type: Grant
    Filed: May 11, 2021
    Date of Patent: October 3, 2023
    Assignee: APPLIED MATERIALS, INC.
    Inventor: Vijay D. Parkhe
  • Patent number: 11778786
    Abstract: A thermal bridge includes an upper bridge assembly including upper plates arranged in an upper plate stack and a lower bridge assembly including lower plates arranged in a lower plate stack. Outer ends of the lower plates face and thermally couple to an electrical component. The upper plates and the lower plates are arranged in plate pairs. A spring element forces the upper plates and the lower plates of the plate pairs apart. The upper plates include upper limit tabs and the lower plates include lower limit tabs. The upper limit tabs and the lower limit tabs operate to limit spreading apart of the upper plates and the lower plates against the opening forces of the spring element.
    Type: Grant
    Filed: December 22, 2021
    Date of Patent: October 3, 2023
    Assignee: TE CONNECTIVITY SOLUTIONS GmbH
    Inventor: Alan Weir Bucher
  • Patent number: 11765856
    Abstract: A fan tray for an enclosure containing devices to be cooled is provided. The fan tray includes a top cover having a top surface and a bottom surface facing opposite the top surface, wherein, when the fan tray is mated to the enclosure, (i) the top surface is exposed relative to outside the enclosure and (ii) the bottom surface is contained within the enclosure, a fan-receiving portion extending from the bottom surface of the top cover and configured to receive one or more fans, and one or more electrical connectors configured to provide electrical power to the one or more fans.
    Type: Grant
    Filed: September 2, 2021
    Date of Patent: September 19, 2023
    Assignee: Spirent Communications, Inc.
    Inventors: Frank Dikken, Don Chi Duong
  • Patent number: 11761693
    Abstract: Embodiments include heat pump systems with gas bypasses and related methods. In one embodiment, a system may include a gas bypass tank having a bypass inlet, a liquid outlet, and a vapor outlet, and a first splitting valve having a first splitter outlet in fluid communication with the bypass inlet, a first splitter inlet in fluid communication with the liquid outlet, and a first switching path configured to switch between a first conduit path in fluid communication with a first coil system and a second conduit path in fluid communication with a second coil system.
    Type: Grant
    Filed: October 31, 2022
    Date of Patent: September 19, 2023
    Assignee: RHEEM MANUFACTURING COMPANY
    Inventor: Yang Zou
  • Patent number: 11758664
    Abstract: An apparatus includes a motherboard with a processor socket, a load frame connected to the motherboard adjacent to at least two sides of the processor socket, and a processor retainer rotatably connected to the load frame, the processor retainer being positionable in a closed position, an opened position, and an installation position. The processor retainer extends over the processor socket when the processor retainer is in the closed position.
    Type: Grant
    Filed: July 14, 2021
    Date of Patent: September 12, 2023
    Assignee: International Business Machines Corporation
    Inventors: Jason R. Eagle, Scott R. LaPree
  • Patent number: 11755079
    Abstract: A computer includes a casing, an electronic assembly, and a water cooling assembly. The casing, forms an accommodation space. The casing has an interior fluid channel located at at least one side of the casing, and a fluid inlet and a fluid outlet which are in fluid communication with the interior fluid channel. The electronic assembly is located in the accommodation space. The water cooling assembly includes a first water block and a radiator. The first water block is in thermal contact with the electronic assembly, the first water block, the radiator, and the interior fluid channel located at the at least one side of the casing are in fluid communication with each other so as to form a circulation channel, and the fluid inlet and the fluid outlet of the casing are respectively in fluid communication with the radiator and the first water block.
    Type: Grant
    Filed: December 21, 2021
    Date of Patent: September 12, 2023
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Ying-Chun Chen, Yu-Te Wei, Tsung-Wei Lin
  • Patent number: 11747026
    Abstract: Provided is an outdoor unit of an air conditioner. The outdoor unit of the air conditioner includes a heat exchanger, a base arranged below the heat exchanger and including a first part including a drain hole formed to correspond to the heat exchanger to discharge water generated from the heat exchanger, and a second part formed to have a stepped portion with the first part, and a leg provided below the base and including a panel formed to slope while being spaced apart from the base such that the water is discharged through the drain hole.
    Type: Grant
    Filed: April 21, 2021
    Date of Patent: September 5, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Changsoo Lim, Kyusang Park, Hyeonu Park, Chungwan Yuk, Junwoo Kim, Jeimin Choi, Hansuk Lee, Duju Hwang
  • Patent number: 11735557
    Abstract: A power module according implementations of the present disclosure includes a bonding layer for bonding two adjacent members. The bonding layer is formed by melting, applying, and solidifying a bonding material that has excellent thermal conductivity and electrical conductivity. The melted bonding material includes a plurality of anti-tilting members. The two members bonded during the process of solidifying the melted bonding material are supported by the plurality of anti-tilting members. This may allow tilting caused during the formation of the bonding layer to be suppressed.
    Type: Grant
    Filed: March 19, 2021
    Date of Patent: August 22, 2023
    Assignee: LG MAGNA E-POWERTRAIN CO., LTD.
    Inventors: Siho Choi, Seongmoo Cho, Kwangsoo Kim, Gun Lee
  • Patent number: 11715675
    Abstract: A semiconductor device includes a circuit substrate, a semiconductor package, and a metallic cover. The semiconductor package is disposed on the circuit substrate. The metallic cover is disposed over the semiconductor package and over the circuit substrate. The metallic cover comprises a lid and outer flanges. The lid overlies the semiconductor package. The outer flanges are disposed at edges of the lid, are connected with the lid, extend from the lid towards the circuit substrate, and face side surfaces of the semiconductor package. The lid has a first region that is located over the semiconductor package and is thicker than a second region that is located outside a footprint of the semiconductor package.
    Type: Grant
    Filed: March 8, 2022
    Date of Patent: August 1, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wensen Hung, Ping-Kang Huang, Sao-Ling Chiu, Tsung-Yu Chen, Tsung-Shu Lin, Chien-Yuan Huang, Chen-Hsiang Lao
  • Patent number: 11716829
    Abstract: A head-mountable device can provide a cooling module that effectively manages heat while also minimizing noise, vibration, leakage, power consumption, size, and weight. To dissipate heat, the cooling module with a fan can be operated to move air through a chamber within the head-mountable device. An integrated heat sink can provide heat dissipation properties by drawing heat away from heat-generating components and into the chamber. The integrated heat sink can include a base plate that defines at least a portion of the chamber in which the blades of the fan are positioned. The integrated heat sink can further include fins between the chamber and an outlet. The fins can be integrated with the base plate to maximize heat dissipation and reduce the number of interfaces between separate parts.
    Type: Grant
    Filed: February 2, 2021
    Date of Patent: August 1, 2023
    Assignee: Apple Inc.
    Inventors: Cheng P. Tan, Sivesh Selvakumar, Jesse T. Dybenko, Enoch Mylabathula, Jason C. Sauers, Phil M. Hobson, Laura M. Campo, Dragos Moroianu
  • Patent number: 11711905
    Abstract: An apparatus includes at least one heat pipe that is adapted to be thermally coupled to an integrated circuit and has an evaporator portion and a first condenser portion, wherein the first condenser portion extends away from the evaporator portion; a first plurality of cooling fins that is attached to the first condenser portion; a first movable support that is thermally coupled to the first condenser portion and is configured to move a second plurality of cooling fins relative to the first plurality of cooling fins; and the second plurality of cooling fins, which is attached to the first movable support.
    Type: Grant
    Filed: August 12, 2020
    Date of Patent: July 25, 2023
    Assignee: NVIDIA Corporation
    Inventors: Susheela Narasimhan, Michal L. Sabotta
  • Patent number: 11704447
    Abstract: A system for designing a circuitry configuration of heat-exchanger units includes an interface to acquire design parameters the heat-exchanger units, a memory to store computer-executable programs including a relaxed decision diagram formation module, and a processor, in connection with the memory, configured to perform the computer-executable programs. The computer-executable programs include steps of providing a configuration of the heat-exchanger units, providing the design parameters of the heat-exchanger units acquired via the interface, generating a relaxed decision diagram based on the design parameters, creating constraints with respect to connections of the heat-exchanger units according to the relaxed decision diagram, and generating feasible configurations of the heat-exchanger units by a mixed-integer-programing method using the constraints.
    Type: Grant
    Filed: March 12, 2019
    Date of Patent: July 18, 2023
    Assignee: Mitsubishi Electric Research Laboratories, Inc.
    Inventors: Arvind Raghunathan, Christopher Laughman
  • Patent number: 11697180
    Abstract: An aluminum alloy brazing sheet may include a sacrificial material having a function of a brazing material on at least one surface of a core material, wherein the sacrificial material has a composition containing: in a mass %, 2% to 5% of Si; 3% to 5% of Zn; and an Al balance with inevitable impurities the core material is made of an Al—Mn-based alloy, an in the core material before brazing, Al—Mn based secondary particles having an equivalent circle diameter of 100 to 400 nm are distributed with a number density of 0.3 to 5 particles/?m2.
    Type: Grant
    Filed: August 19, 2019
    Date of Patent: July 11, 2023
    Assignee: MA ALUMINUM CORPORATION
    Inventors: Shun Maruno, Michihide Yoshino, Shohei Iwao
  • Patent number: 11684537
    Abstract: A human-interface device and a guiding apparatus for a visually impaired user including such human-interface device. The human-interface device includes a tactile module arranged to provide a set of haptic signals to a user, wherein the tactile module has a plurality of tactile units each arranged to provide at least a first haptic signal and operable to cooperate with one or more of other tactile units to provide different haptic signals.
    Type: Grant
    Filed: July 6, 2021
    Date of Patent: June 27, 2023
    Assignee: City University of Hong Kong
    Inventors: Arshad Nasser, Kening Zhu
  • Patent number: 11683917
    Abstract: In a housing of a vehicle control device are formed a suction port for taking outdoor air and a discharge port for discharging air taken in through the suction port. A flow passage that connects the suction port and the discharge port is formed inside the housing. A blocking member, a radiator, and a blower are provided in the flow passage. The blocking member is provided at a position where the blocking member faces at least a portion of an opening face of the suction port in the flow passage and a distance between the blocking member and the suction port is in a predetermined range.
    Type: Grant
    Filed: January 17, 2017
    Date of Patent: June 20, 2023
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Kentaro Yano, Morito Oh
  • Patent number: 11672101
    Abstract: A thermal management system for use in a sealed communications module and associated systems and methods are disclosed herein. In some embodiments, the communications model includes a sealed housing and a circuit board assembly having one or more heat-generating electronic components positioned within the housing. The thermal management system is coupled to the circuit board assembly and positioned to disperse heat from the one or more electronic components. The thermal management system includes a first thermal pathway, a second thermal pathway, and a third thermal pathway. The first thermal pathway has a first end attached to the circuit board assembly and a second end positioned near the side wall of the housing. The second thermal pathway is coupled to the second end of the first thermal pathway. The third thermal pathway is coupled to the second end of the first thermal pathway.
    Type: Grant
    Filed: October 26, 2020
    Date of Patent: June 6, 2023
    Assignee: PACIFIC STAR COMMUNICATIONS, INC.
    Inventor: Dalton Dawkins
  • Patent number: 11665856
    Abstract: An electronic device may include a circuit board, a heat generating component carried by the circuit board, a heat sink body, and a heat transfer assembly between the heat generating component and the heat sink body. The heat transfer assembly may include a flexible, heat conductive layer having a first portion in thermal contact with the heat generating component and a second portion in thermal contact with the heat sink body. The first and second portions are thermally coupled, and a compressible layer is between the first and second portions of the flexible, heat conductive layer.
    Type: Grant
    Filed: October 26, 2021
    Date of Patent: May 30, 2023
    Assignee: EAGLE TECHNOLOGY, LLC
    Inventors: Jason Thompson, Marcus Ni, Voi Nguyen
  • Patent number: 11642105
    Abstract: An ultrasonic transducer (200) includes: a piezoelectric vibrator assembly (10), an acoustic matching layer (20), a heat sink (30), and an acoustic absorption layer (40). The heat sink (30) comprises a body (31), and a head portion (32) and a tail portion (33). The body (31) has a central axis extending in a direction from the head portion (32) to the tail portion (33). A surface of the tail portion (33) of the heat sink (30) disposed away from the head portion (32) is a first surface (331). The first surface (331) is an oblique surface or a tapered surface. The angle between the first surface (331) and the central axis is an acute angle. The acoustic absorption layer (40) at least covers the first surface (331).
    Type: Grant
    Filed: December 13, 2020
    Date of Patent: May 9, 2023
    Assignee: EDAN INSTRUMENTS, INC.
    Inventors: Dan Zhou, Lulu Chen, Hua Luo, Jianhua Liu, Bo Ouyang, Jianhua Mo
  • Patent number: 11639828
    Abstract: A heat exchanger for a gas turbine engine comprising a compressor, a combustor and a turbine. The heat exchanger comprising alternating hot and cold channels. Compressed air from the compressor flows through the cold channels and exhaust gas from the turbine flows through the hot channels. Each cold channel comprises first and second opposing surfaces conveying compressed air along a first path. Each cold channel comprises rows of vortex generators and pin fins extending from the first or second surfaces along the first path. The rows extend substantially perpendicular to the first path. Each hot channel is defined by a first and second opposing surfaces conveying exhaust gas along a second path substantially perpendicular to the first path. Each hot channel comprises rows of vortex generators and pin fins extending from the first or second surfaces along the second path. The rows extend substantially perpendicularly to the second path.
    Type: Grant
    Filed: June 23, 2021
    Date of Patent: May 2, 2023
    Assignee: Turbine Aeronautics IP Pty Ltd
    Inventors: Alex Wright, Ali Mahallati
  • Patent number: 11637000
    Abstract: The present invention relates to a coating device comprising a vacuum coating chamber for conducting vacuum coating processes, said vacuum coating chamber comprising: —one or more cooled chamber walls 1 having an inner side 1 b and a cooled side 1 a, —protection shields being arranged in the interior of the chamber as one or more removable shielding plates 2, which cover at least part of the surface of the inner side 1 b of the one or more cooled chamber walls 1, wherein at least one removable shielding plate 2 is placed forming a gap 8 in relation to the surface of the inner side 1 b of the cooled chamber wall 1 that is covered by said removable shielding plate 2, wherein: —thermal conductive means 9 are arranged filling the gap 8 in an extension corresponding to at least a portion of the total surface of the inner side 1 b of the cooled chamber wall 1 that is covered by said removable shielding plate 2, wherein the thermal conductive means 9 enable conductive heat transfer between said removable shielding p
    Type: Grant
    Filed: August 2, 2018
    Date of Patent: April 25, 2023
    Assignee: Oerlikon Surface Solutions AG, Pfäffikon
    Inventors: Siegfried Krassnitzer, Sebastien Guimond
  • Patent number: 11632875
    Abstract: A wireless device charger configured to produce an alternating magnetic field, thereby inducing an alternating electrical current within a capture coil of a personal electronic device proximate to the wireless device charger, said wireless device charger includes a source coil having a ferrite element configured to generate the alternating magnetic field, a housing formed of a thermally conductive material in thermal communication with the ferrite element, and an air movement device configured to produce an air flow across a surface of the housing flowing from an air inlet to an air outlet, thereby reducing a housing temperature. The surface of the housing defines a plurality of fins extending along the housing in a direction of the air flow. At least one fin in the plurality of fins has a non-symmetric surface, thereby creating turbulence in the air flow.
    Type: Grant
    Filed: August 31, 2021
    Date of Patent: April 18, 2023
    Assignee: APTIV TECHNOLOGIES LIMITED
    Inventors: Andrew F. Pinkos, John Mecca
  • Patent number: 11629919
    Abstract: The present invention relates to a method of manufacturing a cooling device using a heat pipe in which, using casting, the heat pipe is embedded inside a housing, and the method includes a filling step in which a predetermined support member is filled inside a pipe to prevent deformation of the pipe by a pressure of a melt being injected into a cavity of a mold that is closeable, a pipe seating step in which the pipe filled with the predetermined support member is seated in the cavity, a melt injecting step in which the melt is injected into the cavity to surround the pipe, a cooling and withdrawing step in which the injected melt is cooled and a molded product is withdrawn, an injecting step in which a working fluid is injected into the pipe through an injection end, and a finishing step in which, after the injecting step, the pipe is sealed.
    Type: Grant
    Filed: November 18, 2020
    Date of Patent: April 18, 2023
    Assignee: MH TECHNOLOGIES INC.
    Inventor: Jin-Ho Yoo
  • Patent number: 11624880
    Abstract: An optical transceiver having a locking assembly that prevents undesirable movement of the optical transceiver when engaged with another device is described. The locking assembly includes a slide with a projection, lift, and weighted stops. In a first configuration, the slide and weighted stops can sustain contact between a thermal interface material of the optical transceiver and the other device while locking the optical transceiver to prevent movement. In a second configuration mode, the locking assembly disengages the thermal interface material from the other device and unlocks the weighted stops to permit disconnection from the other device.
    Type: Grant
    Filed: July 31, 2020
    Date of Patent: April 11, 2023
    Assignee: Infinera Corporation
    Inventors: Franklin Wall, Jr., Paul Gavrilovic, Walter Shakespeare