Heat Transmitter Patents (Class 165/185)
  • Patent number: 10782151
    Abstract: The present invention provides a sensor device including a rotor, a stator disposed outside the rotor, and a sensor module disposed outside the stator, wherein the rotor includes a sleeve and a magnet coupled to the sleeve, the magnet is disposed inside the sleeve, and the sleeve includes a fixing part which protrudes from a lower end of the sleeve and is in contact with the magnet, thereby providing an advantageous effect of increasing a coupling force between the magnet of the rotor and a yoke.
    Type: Grant
    Filed: July 19, 2017
    Date of Patent: September 22, 2020
    Assignee: LG INNOTEK CO., LTD.
    Inventor: Ho Chan Son
  • Patent number: 10777483
    Abstract: A die of an integrated circuit and an upper layer of a circuit assembly are thermally connected by applying a thermal interface material (TIM) on the die, such that the TIM is between the die and an upper layer. The TIM comprises an emulsion of liquid metal droplets and uncured polymer. The method further comprises compressing the circuit assembly thereby deforming the liquid metal droplets and curing the thermal interface material thereby forming the circuit assembly.
    Type: Grant
    Filed: May 13, 2020
    Date of Patent: September 15, 2020
    Assignee: ARIECA INC.
    Inventors: Navid Kazem, Carmel Majidi
  • Patent number: 10772187
    Abstract: Electronic equipment 100 includes a circuit board 10, a first housing 20, and a deformation suppressing portion 30. A heating element H is mounted on the circuit board 10. The first housing 20 is mounted on a first main surface 11 of the circuit board 10 in such a way that the heating element H and a coolant COO are sealed with respect to the first main surface 11. The deformation suppressing portion 30 suppresses deformation of the circuit board 10. According to this configuration, it is possible to suppress a failure such as leakage of a coolant and cutting of a wiring formed on a circuit board, even when a heating element and a coolant are sealed in a space surrounded by the circuit board and a housing.
    Type: Grant
    Filed: January 29, 2019
    Date of Patent: September 8, 2020
    Assignee: NEC CORPORATION
    Inventor: Tomoyuki Mitsui
  • Patent number: 10761262
    Abstract: An optoelectronic module. In some embodiments, the module includes: a housing, a substantially planar subcarrier, a photonic integrated circuit, and an analog electronic integrated circuit. The subcarrier has a thermal conductivity greater than 10 W/m/K. The photonic integrated circuit and the analog electronic integrated circuit are secured to a first side of the subcarrier, and the subcarrier is secured to a first wall of the housing. A second side of the subcarrier, opposite the first side of the subcarrier, is parallel to, secured to, and in thermal contact with, an interior side of the first wall of the housing.
    Type: Grant
    Filed: July 31, 2018
    Date of Patent: September 1, 2020
    Assignee: ROCKLEY PHOTONICS LIMITED
    Inventors: Gerald Cois Byrd, Chia-Te Chou, Karlheinz Muth
  • Patent number: 10763191
    Abstract: Systems and apparatus are provided for thermal cooling of integrated circuits, such as dual in-line memory modules (DIMMs). The apparatus includes a plurality of rows pieces that include individual leaf springs. Each of the leaf springs can exert compression to support thermal contact and a stable coupling with a received DIMM. The plurality of row pieces can be assembled to form a single structure, having a space to receive an individual DIMM for insertion. Further, each of the leaf springs are structured to allow a portion of its surface, having a conductive material disposed thereon, to support transfer of heat away from the DIMM at a point of thermal contact. The apparatus can be coupled to a printed circuit assembly (PCA) having additional cooling mechanisms installed thereon, in a manner that allows the additional cooling mechanisms to be integrated with the apparatus and provide increased thermal cooling for the DIMMs.
    Type: Grant
    Filed: June 11, 2019
    Date of Patent: September 1, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: John Franz, Harvey Lunsman, Steven Dean
  • Patent number: 10757844
    Abstract: An apparatus and method for reducing or combating bowing of an electronic display layer located behind a cover panel is provided. A rear panel is positioned behind the electronic display layer. An air pathway includes a first gas pathway between said cover panel and the electronic display layer, a cavity located between the electronic display layer and the rear panel, and a second gas pathway located behind the rear panel. The air pathway is configured to cause the pressure of air in the cavity to be lower than the pressure of air in the first gas pathway.
    Type: Grant
    Filed: July 3, 2019
    Date of Patent: August 25, 2020
    Assignee: Manufacturing Resources International, Inc.
    Inventors: William Dunn, Andrew Lincoln, Mike Brown, Marcos Diaz
  • Patent number: 10757809
    Abstract: A stacked electronic arrangement provides independent upgradability of active component boards and radiator boards, enabling quick changes in chip set and alternate polarizations, and includes: an active tile circuit card assembly (CCA); a passive radiator CCA; a tile frame; and a heat exchanger. The active tile CCA includes transmit/receive modules that accept, amply and transmit radar signals. The passive radiator CCA includes patch radiator plugins that receive and then radiate the amplified signal from the modules. The tile frame separates the active tile and the passive radiator CCAs. An elongated casing of the heat exchanger creates an accommodating space for air flow, and forms a first inlet, a second inlet, and a central exhaust plenum between the first and second inlets. High density tins are positioned within the accommodating space between the first and second inlets, and which have openings to the exhaust outlet.
    Type: Grant
    Filed: November 29, 2018
    Date of Patent: August 25, 2020
    Assignee: Telephonics Corporation
    Inventors: George McPartland, Aleksander Vaysman
  • Patent number: 10752505
    Abstract: A method for making a carbon nanotube film includes providing an original carbon nanotube film and an angle control unit. The original carbon nanotube film includes a plurality of carbon nanotubes joined end-to-end by van der Waals force, and the angle control unit defines a through hole. A first end of the original carbon nanotube film is converged to form a carbon nanotube wire structure and a carbon nanotube triangle structure having an open angle adjacent to the carbon nanotube wire structure. The carbon nanotube wire structure is passed through the through hole of the angle control unit. The carbon nanotube triangle structure is cut. The carbon nanotube film is also provided.
    Type: Grant
    Filed: March 11, 2019
    Date of Patent: August 25, 2020
    Assignee: Beijing FUNATE Innovation Technology Co., LTD.
    Inventors: Yu-Quan Wang, Chen Feng, Liang Liu, Li Qian
  • Patent number: 10744603
    Abstract: A heat exchanger has a thermally conductive first plate with a flat first surface for thermal contact with a heat transfer fluid, and a flat second surface for thermal contact with an object to be heated or cooled, such as an electronic component. The first surface is provided with a first surface pattern having a plurality of first grooves, and the second surface is provided with a second surface pattern with a plurality of second grooves. The surface patterns may be configured and applied such that the amount of elongation along the first surface produced by application of the first surface pattern substantially corresponds to or offsets the amount of elongation along the second surface produced by application of the second surface pattern, such that the degree of flatness of the first plate prior to formation of the first and second surface patterns will be preserved, maintained or improved.
    Type: Grant
    Filed: March 16, 2016
    Date of Patent: August 18, 2020
    Assignee: DANA CANADA CORPORATION
    Inventors: Meinrad K. A. Machler, Michael A. Martin, Domen M. S. Lo, Carlos Enrique Rozas Herrera
  • Patent number: 10739086
    Abstract: The invention relates to a heat exchanger (10) for heat-exchange between a first fluid and a second fluid, comprising a membrane separating the two fluids and a heat-conductive element (17) in thermal contact with the membrane and with the first fluid, characterised in that said heat-conductive element (17) moves between an active position and an inactive position, such that the capacity of heat exchange with the first fluid is weaker in the inactive position than in the active position. The exchanger is applied, in particular, for the cooling of fluid in the secondary stream of a turbofan.
    Type: Grant
    Filed: October 23, 2015
    Date of Patent: August 11, 2020
    Assignee: SAFRAN AIRCRAFT ENGINES
    Inventors: Gilles Yves Aouizerate, Benjamin Boudsocq, Gerard Philippe Gauthier
  • Patent number: 10734306
    Abstract: A heat sink mounting configuration is provided that is configured to prevent the heat sink from damaging ball grid arrays (BGA) of an application specific integrated circuit (ASIC) mounted on a printed circuit board (PCB) when the line card is subjected to vibrations and shocks. The heat sink mounting configuration may include a set of screws configured to be at least partially disposed within the apertures of the heat sink to secure the heat sink to the PCB. The mounting configuration includes a resilient member and a spacer disposed around the screws proximate to the apertures. The resilient members are configured to bias the heat sink against the ASIC to maintain the heat sink in contact with the ASIC. The spacers are configured to prevent the heat sink from impacting the ASIC with forces large enough to damage the BGA when the line card is subjected to vibrations and shocks.
    Type: Grant
    Filed: September 21, 2018
    Date of Patent: August 4, 2020
    Assignee: Cisco Technology, Inc.
    Inventors: Vic Chia, Hong Huynh, Steven A. Hanssen, Robert Gregory Twiss
  • Patent number: 10723437
    Abstract: A thermal management system for transferring heat from a heat load includes a first composite structural member that supports a heat load source, a second composite structural member, and a heat transfer member positioned between the first composite structural member and the second composite structural member and in thermal contact with at least the first composite structural member, and in thermal contact with a heat sink. The system further includes at least one thermally-conductive first fastener that is in thermal contact with the heat transfer member, couples the heat load source to at least the first composite structural member, and conducts heat from the heat load source into the heat transfer member. The heat transfer member conducts heat from the thermally-conductive first fastener to the heat sink.
    Type: Grant
    Filed: May 30, 2017
    Date of Patent: July 28, 2020
    Assignee: The Boeing Company
    Inventor: Edward V. White
  • Patent number: 10727154
    Abstract: A component coupled to a heat dissipation unit, allowing a screwing element to be pivotally coupled to a heat dissipation unit, includes a body, a stop portion, a first inner engagement portion, a second inner engagement portion and a first outer engagement portion. The body has a first part and a second part and forms therein a through hole which extends axially. The stop portion is circumferentially disposed at the rim of the first or second part. The first inner engagement portion has checking plates and corresponds in position to the stop portion. The second inner engagement portion has stop blocks disposed at the first or second part. The first outer engagement portion is disposed at the rim of the body and opposite the stop portion. The screwing element is fixed to the heat dissipation unit temporarily but firmly, thereby preventing disintegration and disconnection during transport.
    Type: Grant
    Filed: September 25, 2018
    Date of Patent: July 28, 2020
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Sheng-Huang Lin, Yuan-Yi Lin
  • Patent number: 10714829
    Abstract: Phased array antenna systems are disclosed. An antenna system as disclosed herein can include a plurality of antenna or radiating elements formed on a common plane comprising a first surface of a circuit board. Each antenna element has one or more feeds. Integrated circuits are placed on a second surface of the circuit board. Each integrated circuit is associated with one or more of the antenna elements. Signal lines connecting an integrated circuit to a feed of an antenna element can be shielded using interlayer ground planes and interlayer conductive plugs. In addition, back surfaces of the integrated circuits can be connected to a common heatsink using a thermally conductive medium.
    Type: Grant
    Filed: May 9, 2018
    Date of Patent: July 14, 2020
    Assignee: Ball Aerospace & Technologies Corp.
    Inventors: Gary A. Raney, Peter J. Moosbrugger, Bryce W. Unruh
  • Patent number: 10712102
    Abstract: A cold plate structure, wherein a thermally active region includes fins metal injection molded in a single piece with a fin base sufficiently thin so that the active region mechanically conforms to the heat generating device that the cold plate cools. The fin base is formed as a common structure with a bottom wall of the cold plate, reducing thermal resistance between the device and the fins and also enhancing mechanical flexibility. Another cold plate structure can include multiple thermally active regions, with flexible outer walls and a reduced thickness between active regions, allowing for position variation between multiple heat generation devices that are cooled by the common cold plate. A common base having multiple physically separate active regions can be metal injection molded in a single step, or bases of multiple active regions can be formed individually and joined later to form a common single cold plate structure.
    Type: Grant
    Filed: December 29, 2017
    Date of Patent: July 14, 2020
    Assignee: International Business Machines Corporation
    Inventors: Todd E. Takken, Shurong Tian
  • Patent number: 10707770
    Abstract: An on-board fluid machine includes a housing configured to allow fluid to flow into the housing, an electric motor accommodated in the housing, and a driver that is supplied with DC power and drives the electric motor. The driver includes a low-pass filter circuit and an inverter circuit. The low-pass filter circuit includes a common mode choke coil and a capacitor. The driver further includes a damping unit located at a position where magnetic field lines produced by the common mode choke coil generate eddy current.
    Type: Grant
    Filed: January 9, 2018
    Date of Patent: July 7, 2020
    Assignee: KABUSHIKI KAISHA TOYOTA JIDOSHOKKI
    Inventors: Shunsuke Ambo, Fumihiro Kagawa, Yoshiki Nagata
  • Patent number: 10704997
    Abstract: The present invention relates to a method for evaluating the properties of a plastic resin molded product, more specifically to a novel method for evaluating the properties of a plastic resin molded product that can exactly derive impact resistance of practically prepared molded products, using the property measurement values by the existing ASTM.
    Type: Grant
    Filed: March 9, 2017
    Date of Patent: July 7, 2020
    Assignee: LG CHEM, LTD.
    Inventors: Bog Ki Hong, Sung Hyun Park, Hyun Sup Lee, Yi Young Choi, Myung Han Lee, Soon Ho Sun
  • Patent number: 10695872
    Abstract: Heat spreaders can help promote heat distribution at the surface of a heat sink. However, overly isotropic or anisotropic heat conduction through heat spreaders can limit their effectiveness. Heat spreaders providing for lateral distribution of heat can include a tapered structure containing a metal-diamond composite. The metal-diamond composite includes a continuous metallic phase and a plurality of micron-scale diamond particles located in spaced apart regions of the continuous metallic phase. An interlayer containing the continuous metallic phase but lacking micron-scale diamond particles is disposed between each of the spaced apart regions, and the metal-diamond composite increases in lateral size in a direction of increased tapering. Heat spreaders can be formed by disposing a first mixture containing micron-scale diamond particles and metal nanoparticles in first regions that are vertically spaced apart from each other, and at least partially fusing the metal nanoparticles to form a tapered structure.
    Type: Grant
    Filed: March 9, 2016
    Date of Patent: June 30, 2020
    Assignee: LOCKHEED MARTIN CORPORATION
    Inventors: Alfred A. Zinn, Jyotsna Iyer, Ike C. Hsu
  • Patent number: 10692748
    Abstract: The present invention relates to a high-tech temperature control device for a semiconductor manufacturing facility and, more specifically, to a high-tech temperature control device for an electrostatic chuck, which supports a wafer and maintains the temperature in a semiconductor wafer processing process. It is possible to very precisely control a temperature of an electrostatic chuck by maintaining temperatures and a mixing flow rate of a heating heat medium and a cooling heat medium constant and adjusting a mixing ratio. Meanwhile, the heat medium after heating and cooling is collected and reused, thereby efficiently using energy.
    Type: Grant
    Filed: December 1, 2017
    Date of Patent: June 23, 2020
    Assignee: GLOBAL STANDARD TECHNOLOGY CO., LTD.
    Inventors: Jong Bae Kim, Seung Jin Yang, Jae Suk Heo, Chi Won Choi, Je Min Kim, Hyeung Kwan Kim, Yong Ho Choi
  • Patent number: 10694490
    Abstract: In cell-based wireless network systems supporting subscriber device communication, any movement of a cell's antenna may interrupt service. As cell sizes decrease and transmission frequencies increase, especially with 5G systems, cell transceivers that were once tower or building based are being mounted on smaller structures including the strand of a wired network infrastructure. However, smaller structures may be subject to movement due to weather, nearby traffic, surf, or other conditions. A cell apparatus, particularly one mounted on a structure subject to movement may include a motion detector to report motion of the cell apparatus. A wired or wireless network channel apart from the wireless network system may be used to transport movement data to a network service center or performance analysis server.
    Type: Grant
    Filed: April 19, 2019
    Date of Patent: June 23, 2020
    Assignee: T-Mobile USA, Inc.
    Inventor: Daniel Artuso
  • Patent number: 10682734
    Abstract: A manifold structure and method of forming a manifold structure includes using an ultrasonic additive manufacturing (UAM) process to build up a solid structure, machining the solid structure to form a cavity and free-standing support pillars within the cavity, and using a UAM process to build up a finstock layer over the cavity. The support pillars formed by machining have yield strengths high enough to support UAM of the finstock layer over the cavity. A plurality of finstock layers are built up within the cavity to segment the cavity into a plurality of cavities. UAM of the finstock layers enables the finstock layers to be stacked in a direction normal to a direction of flow through the cavity for efficiently transferring heat through the manifold structure.
    Type: Grant
    Filed: June 8, 2016
    Date of Patent: June 16, 2020
    Assignee: Raytheon Company
    Inventors: Michael L. Andersen, Travis L. Mayberry, James A. Pruett, John S. Moore
  • Patent number: 10685854
    Abstract: A structure includes a thermal interface material, and a Perforated Foil Sheet (PFS) including through-openings therein, with a first portion of the PFS embedded in the thermal interface material. An upper layer of the thermal interface material is overlying the PFS, and a lower layer of thermal interface material is underlying the PFS. The thermal interface material fills through-openings in the PFS.
    Type: Grant
    Filed: May 15, 2017
    Date of Patent: June 16, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventor: Wensen Hung
  • Patent number: 10685904
    Abstract: A packaging device including a first semiconductor device, a thermal dissipating component, an encapsulation layer, a via, and a pad. The first semiconductor device includes a substrate, an active region, and an electrode. The active region is disposed between the substrate and the electrode. The substrate has a first surface opposite to the active region, and the electrode has a second surface opposite to the active region. The thermal dissipating component is disposed on the first surface of the substrate. The encapsulation layer encloses the second surface of the electrode and a part of the thermal dissipating component, such that another part of the thermal dissipating component is exposed by the encapsulation layer. The pad is disposed on the encapsulation layer. The via is disposed in the encapsulation layer and connects the pad to the electrode.
    Type: Grant
    Filed: November 21, 2014
    Date of Patent: June 16, 2020
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Hsin-Chang Tsai, Chia-Yen Lee, Peng-Hsin Lee
  • Patent number: 10685947
    Abstract: The present disclosure is directed to systems and methods of conductively coupling a plurality of relatively physically small core dies to a relatively physically larger base die using an electrical mesh network that is formed in whole or in part in, on, across, or about all or a portion of the base die. Electrical mesh networks beneficially permit the positioning of the cores in close proximity to support circuitry carried by the base die. The minimal separation between the core circuitry and the support circuitry advantageously improves communication bandwidth while reducing power consumption. Each of the cores may include functionally dedicated circuitry such as processor core circuitry, field programmable logic, memory, or graphics processing circuitry. The use of core dies beneficially and advantageously permits the use of a wide variety of cores, each having a common or similar interface to the electrical mesh network.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: June 16, 2020
    Assignee: Intel Corporation
    Inventors: Wilfred Gomes, Mark T. Bohr, Rajesh Kumar, Robert L. Sankman, Ravindranath V. Mahajan, Wesley D. Mc Cullough
  • Patent number: 10681837
    Abstract: An electronic assembly support system includes a frame having a plurality of side rails side rails to be positioned along a longitudinal axis of an electronic assembly, a plurality of cross rails connected between the side rails, positioned to surround predetermined components of the electronic assembly, and a first fastener interface for attaching the plurality of side rails and cross rails to the electronic assembly.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: June 9, 2020
    Assignee: United States of America as represented by the Administrator of NASA
    Inventors: Milton C. Davis, David J. Petrick
  • Patent number: 10680507
    Abstract: A multiphase regulator having a variable number of phases in operation and nominal current thresholds for indicating when to add or drop a phase is provided. A digital controller for the regulator includes digital circuitry configured to adjust the nominal current thresholds based on a measured or estimated temperature of the regulator, to yield adjusted current thresholds which are a function of temperature. The digital circuitry is further configured to modify the number of phases in operation based on the adjusted current thresholds and a measured or estimated current in the regulator. The regulator can be included in an electronic component having a load, power stages for providing phase currents to the load, and at least one fan for cooling the power stages and load. The digital controller controls operation of the regulator, including adaptive control of the number of phases in operation. Corresponding control methods are also provided.
    Type: Grant
    Filed: April 28, 2017
    Date of Patent: June 9, 2020
    Assignee: Infineon Technologies Austria AG
    Inventor: Benjamim Tang
  • Patent number: 10674596
    Abstract: An electronic component includes a board on which a heat generating member is mounted, and a mechanical component that covers the upper side of the board and has an opening at a position corresponding to the heat generating member. The mechanical component has a connection part dissipating heat of the heat generating member to the mechanical component via the board, in the vicinity of the opening.
    Type: Grant
    Filed: December 31, 2018
    Date of Patent: June 2, 2020
    Assignee: NEC CORPORATION
    Inventor: Yuki Matsumoto
  • Patent number: 10674608
    Abstract: There is provided a printed circuit board including: a first insulating layer; a first circuit pattern formed on a first surface of the first insulating layer; an adhesive layer provided on a second surface of the first insulating layer; and an electronic component disposed on the adhesive layer and enclosed by the first insulating layer and a second insulating layer formed on the first insulating layer.
    Type: Grant
    Filed: July 12, 2018
    Date of Patent: June 2, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jung Hyun Park, Yong Ho Baek, Jae Hoon Choi
  • Patent number: 10674632
    Abstract: A narrow-bezel display device. A bezel in outer peripheral portions of the display device is reduced. A plurality of circuit films, a printed circuit board, and the like, connected to a display panel, are protected. Heat dissipation performance is improved.
    Type: Grant
    Filed: November 19, 2017
    Date of Patent: June 2, 2020
    Assignee: LG Display Co., Ltd.
    Inventors: JongYoung Park, JinYoung Bang, Jikwang Jang
  • Patent number: 10672679
    Abstract: A heat spreader for use in a memory system is provided, including a thermally conductive body having a first planar side surface and a second planar side surface opposite the first planar side surface, the first planar side surface configured to attach to a first plurality of co-planar semiconductor devices of a first memory module of the memory system, the second planar side surface configured to attach to a second plurality of co-planar semiconductor devices of a second memory module of the memory system, wherein the first planar side surface and the second planar side surface are separated by a body width w substantially equal to a distance between the first plurality of co-planar semiconductor devices and the second plurality of co-planar semiconductor devices.
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: June 2, 2020
    Assignee: Micron Technology, Inc.
    Inventor: Xiaopeng Qu
  • Patent number: 10667432
    Abstract: In some examples, an electronic device includes an outer housing and a heat spreader inside an inner chamber defined by the outer housing. The heat spreader is structurally engaged to the outer housing to provide structural support for the outer housing, and the heat spreader is to spread heat along two different directions. Electronic components are in thermal contact with a surface of the heat spreader to transfer heat produced by the electronic components to the heat spreader.
    Type: Grant
    Filed: July 6, 2016
    Date of Patent: May 26, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventor: Timothy J Sutherland
  • Patent number: 10662705
    Abstract: The invention is a track system for a retractable wall. The track system includes rigid outer guide tracks and flexible inner track inserts that are connected to the guide tracks by means of flanges located on both. The flexible inserts include a channel that engages with a side edge of a retractable wall, holding the wall in place. The flexible nature of the track inserts allows the inserts to bend, which in turn allows the retractable wall to flex when force is exerted on the retractable wall without breaking the tracks or tearing the wall. When excessive force is applied, the channel of the flexible insert, the walls of which are thicker than the rest of the flexible insert, bend open, so that the side edge of the retractable wall disengages from the channel by means of an opening in the channel.
    Type: Grant
    Filed: April 14, 2017
    Date of Patent: May 26, 2020
    Assignee: Hall Labs LLC
    Inventors: David R. Hall, Joe Fox, Andrew Priddis, Jackson Priddis
  • Patent number: 10655540
    Abstract: A surface cooler includes a conduit, a body having an external surface, and a plurality of fin members arranged in an array of fin members. The conduit defines an inlet, an outlet, and an internal flow path extending between the inlet and the outlet. The conduit is configured to channel a flow of fluid to be cooled from the inlet to said outlet. The conduit extends through the body. Each fin member of the array of fin members extends from the external surface of the body. Each fin member is fabricated from a thermally conductive, resilient, and pliable material.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: May 19, 2020
    Assignee: General Electric Company
    Inventors: Jorge Alejandro Carretero Benignos, William Joseph Antel, Jr., William Dwight Gerstler
  • Patent number: 10655920
    Abstract: A thermosiphon device including one or more multi-port tubes that form both an evaporator section and a condenser section for the device. The one or more tubes may be flat tubes with multiple, parallel flow channels, and may be bent to form a bend between the evaporator and condenser sections of the tube(s). One or more flow channels of the tube at the bend may provide a vapor flow path or a liquid flow path between the evaporator and condenser sections.
    Type: Grant
    Filed: September 10, 2015
    Date of Patent: May 19, 2020
    Assignee: Aavid Thermalloy, LLC
    Inventors: Morten Søegaard Espersen, Maria Luisa Angrisani, Dennis N. Jensen, Sukhvinder S. Kang
  • Patent number: 10652995
    Abstract: The invention relates to an electronic module (100) mounted on a transmission component (112). The electronic module (100) comprises a printed circuit board element (102) that has component side (104) with at least one electronic component (108) and a contact side (106) lying opposite the component side (104), and a heat conducting film (110) that is placed between a surface section of the contact side (106) lying opposite the component (108) and a surface section of the transmission component (112). The printed circuit board element (102) can be or is tightened to the transmission component (112) such that the heat conducting film (110) is pressed against the surface section of the contact side (106) and the surface section of the transmission component (112).
    Type: Grant
    Filed: May 16, 2019
    Date of Patent: May 12, 2020
    Assignee: ZF Friedrichshafen AG
    Inventors: Hermann Josef Robin, Martin Hempen, Thomas Maier
  • Patent number: 10653038
    Abstract: In an embodiment, a heat spreader is disclosed. In an embodiment, the device comprises an electronic device, comprising: an electronic component as a heat source; and a heat conductive sheet, comprising; a folded section having at least two folds of the sheet establishing at least three superimposed layers of the sheet between the folds, wherein the folded section is configured to conduct heat from the heat source; and a layer of sheet, other than that of the three superimposed layers, wherein the layer of sheet is configured to spread heat across the electronic device, and wherein the layer of sheet receives the heat from the folded section; wherein the superimposed layers are closer to the heat source than the layer of sheet. An embodiment relates to a mobile device and another embodiment to a manufacturing method.
    Type: Grant
    Filed: April 14, 2016
    Date of Patent: May 12, 2020
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Sakari Soini, Esa Määttä
  • Patent number: 10644215
    Abstract: A thermoelectric generator has a heat conducting body that exchanges heat with the environment according to environmental temperature changes, a heat storing body, and a thermoelectric conversion unit and thermal resistance body arranged between the heat conducting body and the heat storing body. One end of the thermal resistance body and one end of the thermoelectric conversion unit are in contact with each other. The other end of the thermal resistance body is in contact with the heat conducting body, and the other end of the thermoelectric conversion unit is in contact with the heat storing body. The surface of the heat storing body is covered by a covering layer having certain heat insulation properties. The temperature difference generated between the heat conducting body and the heat storing body is utilized to extract electric energy from the thermoelectric conversion unit.
    Type: Grant
    Filed: December 26, 2012
    Date of Patent: May 5, 2020
    Inventor: Tadashi Nakanuma
  • Patent number: 10641557
    Abstract: A combined heat sink has multiple dissipation fins serially mounted together. Each one of the dissipation fins has a body and two flanges. The body has at least one through hole formed through the body. The two flanges are respectively formed on one of two surfaces of the body, and have at least one connecting arm. Multiple protrusions protrude on the at least one connecting arm, and a width of the at least one through hole is smaller than a total width of the at least one connecting arm and the multiple protrusions. When the multiple dissipation fins are mounted together, the protrusions of the at least one connecting arm of each dissipation fin pass through the at least one through hole of an adjacent one of the dissipation fins, and abut an area near the at least one through hole to avoid separations of the dissipation fins.
    Type: Grant
    Filed: October 1, 2018
    Date of Patent: May 5, 2020
    Assignee: Cooler Master Co., Ltd.
    Inventor: Chang-han Tsai
  • Patent number: 10634435
    Abstract: A heat dissipation module used for an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator, a pipe, and a working fluid. The evaporator has a recess at an exterior surface of the evaporator, and the heat source is thermally contacted with the recess to transfer a heat generated from the heat source to the recess of the evaporator. The pipe is connected to an inner space of the evaporator and forms a loop. The working fluid is filled in the loop, wherein the working fluid in liquid passing through a portion of the inner space of the evaporator corresponding to the recess absorbs the heat and is transformed into vapor.
    Type: Grant
    Filed: October 30, 2017
    Date of Patent: April 28, 2020
    Assignee: Acer Incorporated
    Inventors: Yung-Chih Wang, Jau-Han Ke, Wen-Neng Liao, Cheng-Wen Hsieh
  • Patent number: 10631411
    Abstract: There is provided a printed circuit board including: a first insulating layer; a first circuit pattern formed on a first surface of the first insulating layer; an adhesive layer provided on a second surface of the first insulating layer; and an electronic component disposed on the adhesive layer and enclosed by the first insulating layer and a second insulating layer formed on the first insulating layer.
    Type: Grant
    Filed: July 12, 2018
    Date of Patent: April 21, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jung Hyun Park, Yong Ho Baek, Jae Hoon Choi
  • Patent number: 10627173
    Abstract: A flow path member includes a lid portion, a bottom plate portion, and side walls provided between the lid portion and the bottom plate portion, a flow path in which a fluid flows is configured with the lid portion, the side walls, and the bottom plate portion, a portion of a surface of the side walls on the flow path side includes a coarse portion that is coarser than the other portions.
    Type: Grant
    Filed: May 30, 2013
    Date of Patent: April 21, 2020
    Assignee: KYOCERA Corporation
    Inventors: Keiichi Sekiguchi, Kazuhiko Fujio, Yuusaku Ishimine
  • Patent number: 10627093
    Abstract: Embodiments may utilize a series of exposed fins, which increase the surface area of the heat sink creating additional air flow. As hotter air rises within the system, cooler is drawn into the heatsink. The fins may be exposed on both sides of the longitudinal axis, allowing cooler air to be drawn towards the longitudinal axis above the heatsink and flow upward. This process may cool the fins. Additionally, the spacing between the fins may have to be wide enough to allow for air to freely enter the heatsink.
    Type: Grant
    Filed: July 17, 2017
    Date of Patent: April 21, 2020
    Assignee: Fluence Bioengineering, Inc.
    Inventors: Dung Duong, Randall Johnson, Nicholas Klase
  • Patent number: 10631438
    Abstract: An assembled circuit board has a topology that defines positions, dimensions and power dissipation of components mounted to the circuit board, including a high power component and one or more low power components. A cold plate makes thermal contact to the high power component through a thermal interface material. A thermally conductive sheet overlays the circuit board and is formed to match the topology of the low power component or components. The sheet has a first portion that makes thermal contact with the cold plate and a second portion that overlays the low power component or components. The cold plate removes heat directly from the high power component and indirectly through the thermally conductive sheet from the low power component or components. The thermally conductive sheet conforms to the topology of the low power components either by preforming or by flexibility.
    Type: Grant
    Filed: December 23, 2017
    Date of Patent: April 21, 2020
    Assignee: International Business Machines Corporation
    Inventors: Paul W. Coteus, Mark D. Schultz, Todd E. Takken, Shurong Tian
  • Patent number: 10631445
    Abstract: An electronic assembly with RFI shielding including a circuit board, a high frequency electromagnetic radiation device, and a shielding cover is provided. The circuit board includes a connector. The high frequency electromagnetic radiation device is detachably inserted to the connector of the circuit board to be electrically connected with the circuit board. The shielding cover is detachably assembled to the connector to be opened or closed relative to the circuit board. The shielding cover shields high frequency radiation generated by the high frequency electromagnetic radiation device when the shielding cover is in a closed state, and at least a portion of the shielding cover contacts the circuit board in the closed state, and the shielding cover is electrically connected to a grounding portion of the circuit board via the connector.
    Type: Grant
    Filed: December 20, 2017
    Date of Patent: April 21, 2020
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Chin-Hsien Chang, Shang-Chu Chien, Ting-Tuan Chang, Chi-Chu Chen
  • Patent number: 10624244
    Abstract: An automotive power electronics assembly, including: a cover plate, a cooling pipe received in a groove extending along a first surface of the cover plate, a plurality of metallic heat sink bodies provided on a second, opposite surface of the cover plate wherein first end faces of the hear sink bodies are in heat conducting contact with the cover plate, each heat sink body carrying on a side surface at least one semiconductor component to be cooled, and a printed circuit board providing electronic contacts to the semiconductor components, where the printed circuit board is in contact with second end faces of the heat sink bodies. Each heat sink body tapers from the first end face to the second end face such that the contact area with the cover plate is larger than the contact area with the printed circuit board.
    Type: Grant
    Filed: November 4, 2015
    Date of Patent: April 14, 2020
    Assignee: PREH GMBH
    Inventor: Adam Theander
  • Patent number: 10617036
    Abstract: A computing device includes a housing having an inner surface, a first outer surface, a second outer surface, and a side extending between the first outer surface and the second outer surface. The computing device also includes a heat generating electronic device, a first heat spreader, and a second heat spreader. At least a portion of the first heat spreader abuts or is adjacent to the inner surface of the housing. The second heat spreader extends from a first position within the housing, at or adjacent to the heat generating electronic device to a second position within the housing. The second position is closer to the side of the housing than the first position. A first portion of the second heat spreader abuts the first heat spreader, and a second portion of the second heat spreader is at a distance from the first heat spreader.
    Type: Grant
    Filed: January 28, 2019
    Date of Patent: April 7, 2020
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Andrew Hill, Robyn Rebecca Reed McLaughlin, James Michael Bonicatto, Kenneth Charles Boman, Jeffrey Taylor Stellman, Avi Pinchas Hecht
  • Patent number: 10617021
    Abstract: An electronic assembly comprises a circuit board having one or more electronic components mounted on the circuit board. The circuit board has a first side and a second side opposite the first side. The electronic assembly has a lower enclosure and an upper enclosure for mating with the lower enclosure to form a housing to hold the circuit board. A frame overlies the first side or the second side of the circuit board. The frame comprises a first retainer for retaining coaxial cable. The first retainer comprises a first pair of opposing arcuate members extending from the frame.
    Type: Grant
    Filed: April 30, 2019
    Date of Patent: April 7, 2020
    Assignee: DEERE & COMPANY
    Inventors: Pablo G. Olivieri, Stephen Piltingsrud
  • Patent number: 10617020
    Abstract: An electronic assembly comprises a circuit board having one or more electronic components mounted on the circuit board. The circuit board has a first side and a second side opposite the first side. The electronic assembly has a lower enclosure and an upper enclosure for mating with the lower enclosure to form a housing to hold the circuit board. A frame overlies the first side or the second side of the circuit board. The frame comprises a first retainer for retaining coaxial cable. The first retainer comprises a first pair of opposing arcuate members extending from the frame.
    Type: Grant
    Filed: March 15, 2019
    Date of Patent: April 7, 2020
    Assignee: DEERE & COMPANY
    Inventors: Pablo G. Olivieri, Stephen Piltingsrud
  • Patent number: 10617035
    Abstract: A manifold structure is provided to cool a heat-dissipating surface and includes an inlet fluid passage, an outlet fluid passage, and at least one cooling channel that is connected between the inlet fluid passage and the outlet fluid passage and extends along a length of the heat-dissipating surface. Additively manufactured fins are arranged in the cooling channel. The fins are configured to provide a geometry transition area between fins having a first geometry and fins having a second geometry, and a material transition area between fins formed of a first material and fins formed of a second material. The manifold structure is configured to provide a gradient convection coefficient by way of the geometry transition area and a gradient thermal conductivity by way of the material transition area across the length of the heat-dissipating surface.
    Type: Grant
    Filed: May 29, 2018
    Date of Patent: April 7, 2020
    Assignee: Raytheon Company
    Inventors: Travis L. Mayberry, Michael J. Arthur, James A. Pruett
  • Patent number: 10609260
    Abstract: An assistance system of a motor vehicle, with a camera comprises a camera housing having a first cooling body with first cooling fins, a cap covering the camera housing, wherein the cap has a second cooling body with second cooling fins, and wherein the second cooling fins are arranged at least partially between the first cooling fins.
    Type: Grant
    Filed: November 18, 2016
    Date of Patent: March 31, 2020
    Assignee: Conti Temic microelectronic GmbH
    Inventor: Gerhard Müller