Heat Transmitter Patents (Class 165/185)
  • Patent number: 10381120
    Abstract: A structure for dissipating heat by natural convection, intended for being provided on the periphery of packaging for transporting and/or storing radioactive materials, the structure having two adjacent half-structures each comprising primary fins which are parallel and angled relative to a height direction of the structure, the primary fins of the two half-structures forming, in pairs, fins of the general shape of an inverted V when the packaging is arranged vertically with the bottom thereof oriented downwards.
    Type: Grant
    Filed: December 13, 2016
    Date of Patent: August 13, 2019
    Assignee: TN INTERNATIONAL
    Inventors: Kévin Bance, Olivier Bardon
  • Patent number: 10383255
    Abstract: An edge sealing heat-dissipating film includes a heat radiation emitting film, a metal film and a heat radiation receiving film. The heat radiation emitting film has a first opening. The metal film is disposed to the heat radiation emitting film and the metal film has a second opening. The second opening is positioned corresponding to the first opening. The heat radiation receiving film is disposed to the metal film and the heat radiation receiving film has a third opening. Wherein, the shape of the heat radiation emitting film is the same as the shape of the heat radiation receiving film. And the area of the metal film is slightly smaller than the area of the heat radiation receiving film and the heat radiation emitting film. Therefore, the outer periphery of the heat radiation emitting film and the outer periphery of the heat radiation receiving film could be closely bonded together.
    Type: Grant
    Filed: March 5, 2018
    Date of Patent: August 13, 2019
    Assignee: GETAC TECHNOLOGY CORPORATION
    Inventor: Chi-Jung Wu
  • Patent number: 10383252
    Abstract: A heat sink device of solid state disk module includes a heat sink and at least one fixture. The heat sink includes a heat sink body heat conducting with the solid state disk and a pair of sliding slots disposed on the heat sink body. The fixture includes a bottom plate and a pair of side plates. The bottom plate has at least one rib, and the pair of side plates have pressing structures corresponding to the pair of the sliding slots. The pressing structure includes a flap being capable of pressing in the sliding slot and a pull-ab located at a side of the flap. The heat sink body is fixed on the solid state disk through the fixture, and an interval is maintained between the bottom plate and the solid state disk by the at least one rib.
    Type: Grant
    Filed: January 11, 2018
    Date of Patent: August 13, 2019
    Assignee: COMPTAKE TECHNOLOGY INC.
    Inventors: Wei-Hau Chen, Hsin-An Chen
  • Patent number: 10368937
    Abstract: A treatment system includes a fluid cooling supply system for chilling and delivering liquid coolant to a patient. The fluid cooling supply system includes a cooling device and a heat exchanger device. The heat exchanger device is biased to the cooling device and is in fluid communication with a treatment device in a patient. The fluid cooling supply system includes at least one biasing mechanism to provide a given biasing force between the heat exchanger device and the cooling device to effectuate and improve heat transfer. The liquid coolant may be circulated through an energy delivery device positioned in an airway of a patient to preserve tissue. The system is controlled to circulate liquid coolant at a given temperature and pressure for a selected amount of time during pulmonary treatment of a patient.
    Type: Grant
    Filed: March 13, 2014
    Date of Patent: August 6, 2019
    Assignee: Nuvaira, Inc.
    Inventors: Ryan Kaveckis, Edward S. Harshman, Martin L. Mayse, John Streeter, Kyle True, Richard C. Gunderson
  • Patent number: 10375853
    Abstract: In an exemplary electronic device with a cooling fan, a fan assembly is attached to a keyboard assembly of the electronic device. The fan assembly includes an impeller at least partially inside a fan enclosure. The fan enclosure has, on a surface, an inlet opening and an external protrusion. The electronic device further includes a bottom case. The fan assembly is positioned between the keyboard assembly and the bottom case and oriented such that the inlet opening and the external protrusion face the bottom case. The external protrusion maintains a passage between the fan enclosure and the bottom case that allows air to enter the inlet opening and also resists interference between the rotating impeller and the stationary bottom case.
    Type: Grant
    Filed: August 21, 2017
    Date of Patent: August 6, 2019
    Assignee: Apple Inc.
    Inventors: Anthony J. Aiello, Jonathan L. Berk, Karen Cheng, Jesse T. Dybenko, Trevor Edmonds, Kwonil D. Fleischman, Richard A. Herms, Eric A. Knopf, Arash Naghib Lahouti, Brad L. Patton
  • Patent number: 10366939
    Abstract: A system for mounting a heat sink to a printed circuit board includes a frame that is configured to be mounted to a printed circuit board and to receive a heat sink. The heat sink and the frame are formed as separate components. The frame is formed as a rigid component. The system further includes fastening elements that are configured to fix the heat sink to the frame in a mounting position after the heat sink has been inserted into the frame.
    Type: Grant
    Filed: October 18, 2017
    Date of Patent: July 30, 2019
    Assignee: Harman Becker Automotive Systems GmbH
    Inventors: Valod Noshadi, Herbert Kronenwett
  • Patent number: 10356942
    Abstract: The disclosed embodiments related to a component for use in a portable electronic device. The component includes a wall of the portable electronic device, containing an intake zone that includes a set of intake vents. The wall also includes an exhaust zone containing a set of exhaust vents.
    Type: Grant
    Filed: February 26, 2018
    Date of Patent: July 16, 2019
    Assignee: Apple Inc.
    Inventors: Brett W. Degner, Bartley K. Andre, Jeremy D. Bataillou, Jay S. Nigen, Christiaan A. Ligtenberg, Ron A. Hopkinson, Charles A. Schwalbach, Matthew P. Casebolt, Nicholas A. Rundle, Frank F. Liang
  • Patent number: 10356944
    Abstract: A liquid-encapsulation heat dissipation member is prepared by encapsulating a thermally conductive fluid in a closed container nd dissipates heat transferred from an electronic device in contact with the closed container, wherein the closed container includes an elastic portion composed of a thin elastomer serving as a surface to come into contact with the electronic device and following the shape of the electronic device and a heat dissipation portion composed of a hard material for dissipating heat, and the thermally conductive fluid contains a thermally conductive powder and has a viscosity of 200,000 mPa·s to 3,000,000 mPa·s.
    Type: Grant
    Filed: September 19, 2014
    Date of Patent: July 16, 2019
    Assignee: SEKISUI POLYMATECH CO., LTD.
    Inventors: Yusuke Hattori, Jun Ishizawa
  • Patent number: 10349566
    Abstract: A shielding structure is provided. The shielding structure is adapted to be disposed on a circuit board. The shielding structure includes a main beam, a branch beam and a shielding cover. The main beam is affixed to the circuit board, wherein the main beam includes a main beam body and a main beam connection unit, the main beam connection unit is disposed on the main beam body. The branch beam includes a branch beam body and a branch beam connection unit, wherein the branch beam connection unit is disposed on the branch beam body, the branch beam connection unit is connected to the main beam connection unit, and the main beam connection unit is partially located between the branch beam connection unit and the circuit board. The shielding cover includes a cover portion and a surrounding wall which is bent from the cover portion.
    Type: Grant
    Filed: December 21, 2018
    Date of Patent: July 9, 2019
    Assignee: WISTRON NEWEB CORP.
    Inventors: Jen-Yung Chang, Tiao-Ming Hsu
  • Patent number: 10345054
    Abstract: A flexible, thermal bridge element, particularly for a space flight instrument, a satellite, a transportation device, or a machine component, includes a number of carbon fiber-reinforced plastic (CFK) layers stacked on top of one another. Each of the CFK layers is composed of a plurality of heat-conductive carbon fibers embedded in a matrix. In at least two segments, particularly opposing end segments, the CFK layers are freed of the material of the matrix so that the carbon fibers of a respective CFK layer are exposed in the at least two segments. The exposed segments of the carbon fibers are provided with an associated metallization, by way of which within the framework of a thermally assisted joining process, the bridge element is connected to a thermally conductive connector element.
    Type: Grant
    Filed: January 27, 2015
    Date of Patent: July 9, 2019
    Assignee: AIRBUS DS GMBH
    Inventors: Arne Sauer, Fabian Preller
  • Patent number: 10342160
    Abstract: Structures and methods for providing heat sink attachments on existing heat sinks. According to a device, a first heat sink comprises a first base and fins extending from the first base. The first base comprises a cutout therein and a first base bottom surface contacting a first electronic component. A second heat sink comprises a second base and fins extending from the second base. The second heat sink is located in the cutout of the first heat sink. The second base comprises a second base bottom surface contacting a second electronic component. A pressure plate is attached to the first heat sink and overlays the second heat sink. The pressure plate contacts the second heat sink and applies pressure between the second heat sink and the second electronic component.
    Type: Grant
    Filed: November 3, 2017
    Date of Patent: July 2, 2019
    Assignee: International Business Machines Corporation
    Inventors: Louis-Marie Achard, Kenneth C. Marston, Janak G. Patel, David L. Questad
  • Patent number: 10332820
    Abstract: A high efficiency satellite transmitter comprises an RF amplifier chip in thermal contact with a radiant cooling element via a heat conducting element. The RF amplifier chip comprises an active layer disposed on a high thermal conductivity substrate having a thermal conductivity greater than about 1000 W/mK, maximizing heat conduction out of the RF amplifier chip and ultimately into outer space when the chip is operating within a satellite under normal transmission conditions. In one embodiment, the active layer comprises materials selected from the group consisting of GaN, InGaN, AlGaN, and InGaAlN alloys. In one embodiment, the high thermal conductivity substrate comprises synthetic diamond.
    Type: Grant
    Filed: March 20, 2017
    Date of Patent: June 25, 2019
    Assignee: Akash Systems, Inc.
    Inventors: Felix Ejeckam, Tyrone D Mitchell, Jr., Paul Saunier
  • Patent number: 10330394
    Abstract: The disclosure generally relates to compositions, methods, and systems for heat transfer and methods of preparing heat transfer mediums. In various embodiments are described heat transfer mediums comprising a plurality of microparticles suspended in a bulk material with each microparticle containing a phase change material. In other embodiments are described fluids comprising of a slurry of microparticles containing phase change fluid in a carrier liquid for a fast charger system.
    Type: Grant
    Filed: June 16, 2017
    Date of Patent: June 25, 2019
    Assignee: FORD GLOBAL TECHNOLOGIES, LLC
    Inventors: Larry Dean Elie, Allan Roy Gale
  • Patent number: 10330395
    Abstract: An assembly for liquid cooling is provided herein. The assembly 8 includes a thermal member, a support member, and a gasket. The thermal member includes an array of cooling pins formed of a thermally conductive material to extend from the thermal member. The support member includes an inlet channel and an outlet channel. The inlet channel to provide a fluid to the array of cooling pins. The outlet channel to receive the fluid from the array of cooling pins. The gasket between the thermal member and the support member to form a cooling channel with a fluid tight seal therebetween.
    Type: Grant
    Filed: November 21, 2017
    Date of Patent: June 25, 2019
    Assignee: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
    Inventors: John P. Franz, Tahir Cader, Michael L. Sabotta, David A. Moore
  • Patent number: 10327357
    Abstract: A canister system having a cylindrical housing and a modular electronic rack system disposed within the cylindrical housing. The modular electronic rack system includes a thermal contact member that is in at least selective physical contact with an interior surface of the cylindrical housing to permit conductive heat transfer there through. An input/output device extends along at least a portion of the modular electronic rack system and includes a power input and a signal output electrically coupled thereto. A plurality of electronic slots disposed at a position generally along the modular electronic rack system is provided.
    Type: Grant
    Filed: September 18, 2014
    Date of Patent: June 18, 2019
    Assignee: Artesyn Embedded Computing, Inc.
    Inventors: Martin Peter John Cornes, Suzanne Marye Wong, Ross L. Armstrong, Douglas L. Sandy
  • Patent number: 10314201
    Abstract: A liquid-cooled heat sink head includes a metal substrate, a first cover, and a plurality of heat dissipation fins. The first cover covers the metal substrate to form a heat exchange chamber and includes a first liquid inlet and a liquid outlet to allow a working fluid to flow in the heat exchange chamber. The heat dissipation fins are disposed on the metal substrate, are placed between the first liquid inlet and the liquid outlet, and are arranged sequentially from the first liquid inlet toward the liquid outlet. A liquid passage is disposed between each two adjacent heat dissipation fins. A portion of the heat dissipation fins are connected to the heat exchange portion, and at least one heat dissipation fin includes one opening to communicate with the liquid passages at two sides of the at least one heat dissipation fin.
    Type: Grant
    Filed: December 18, 2015
    Date of Patent: June 4, 2019
    Assignee: COOLER MASTER CO., LTD.
    Inventor: Shui-Fa Tsai
  • Patent number: 10310198
    Abstract: The disclosed apparatus may include (1) a housing unit that houses an optical transducer within a telecommunications device, (2) a heatsink that is coupled to a movable shaft secured to a joint within the telecommunications device, and (3) a coil spring that (A) is coupled to the movable shaft secured to the joint within the telecommunications device and, when released, (B) applies a force that presses the heatsink against the optical transducer to ensure that the heatsink is thermally coupled to the optical transducer. Various other apparatuses, systems, and methods are also disclosed.
    Type: Grant
    Filed: March 27, 2018
    Date of Patent: June 4, 2019
    Assignee: Juniper Networks, Inc
    Inventors: Alexander I. Yatskov, Eeshitw Kaushal Singh
  • Patent number: 10314164
    Abstract: According to some aspects of the present disclosure, circuit board assemblies are disclosed. Example circuit board assemblies include a printed circuit board having a first surface and a second surface, and defining an opening having at least one side extending from the first surface to the second surface. The assembly also includes a bus bar having a first surface, a second surface, and at least one side. The bus bar is secured in the opening of the printed circuit board via a press-fit, such that a slot is defined between the at least one side of the bus bar and the at least one side of the opening defined by the printed circuit board. The assembly further includes an electrical lead positioned in the slot, and solder disposed between the electrical lead and the bus bar to electrically couple the electrical lead and the bus bar.
    Type: Grant
    Filed: December 21, 2017
    Date of Patent: June 4, 2019
    Assignee: Astec International Limited
    Inventors: Edgardo Hernando Vergara, Adriane Cabral Ginez, Joel Cadiente Macadangdang
  • Patent number: 10304754
    Abstract: A heat dissipation structure of a semiconductor device is provided, the semiconductor device including: an electrical bonding surface electrically connected to a substrate; and a heat dissipation surface as an opposite side of the electrical bonding surface. The heat dissipation surface makes contact with a heat spreader via a conductive TIM while the heat spreader makes contact with a heat sink via an insulating TIM. A surface of the heat spreader facing the semiconductor device includes a recess part formed in at least one part in a vicinity of an outer periphery of the semiconductor device.
    Type: Grant
    Filed: January 25, 2017
    Date of Patent: May 28, 2019
    Assignee: OMRON Corporation
    Inventors: Takeo Nishikawa, Takayoshi Tawaragi, Eiichi Omura
  • Patent number: 10302371
    Abstract: The invention provides a lighting device comprising a light source and a heat sink (200). The heat sink (200) is configured to dissipate thermal energy from the light source when in operation. The heat sink comprises a plurality of pin-shaped fins (210) and a support (220), wherein each fin (210) has a fin height (h) relative to the support (220), a bottom part (213) associated with the support (220) and a top part (214), a cross-section having a first width (d1) and a second width (d2) having a ratio d1/d2 selected from the range of 1.2-10, and a first width axis, wherein the first width axes of the pin-shaped fins (210) are arranged parallel, and wherein the pin-shaped fins (210) are hollow over at least part of their fin height (h).
    Type: Grant
    Filed: October 13, 2015
    Date of Patent: May 28, 2019
    Assignee: SIGNIFY HOLDING B.V.
    Inventors: Simon Eme Kadijk, Mohammad Mirsadeghi, Dirk Gehrels
  • Patent number: 10297525
    Abstract: A base plate for a heat sink as well as a heat sink and an IGBT module having the same are provided. The base plate includes: a base plate body, including a body part; and a first surface layer and a second surface layer disposed respectively on two opposing surfaces of the body part; and N pins disposed on the first surface layer and spaced apart from one another, each pin having a first end fixed on the first surface layer and a second end configured as a free end, in which the first surface layer and the N pins are configured to contact a coolant, an area of a first portion of the first surface layer contacting the coolant is denoted as S1, and an area of a second portion of the first surface layer contacting each pin is denoted as S2, in which 180?S1/S2?800, and 300?N<650.
    Type: Grant
    Filed: October 28, 2016
    Date of Patent: May 21, 2019
    Assignee: BYD COMPANY LIMITED
    Inventors: Qing Gong, Yaxuan Sun, Xinping Lin, Shuming Zhao, Bo Wu, Jingjing Luo, Donghai Cheng
  • Patent number: 10297517
    Abstract: A manufacturing method of a package carrier is provided. A substrate having a through hole is provided, wherein a profile of the through hole from top view is a first rounded rectangular. A heat conducting slug is disposed inside the through hole, wherein the heat conducting slug and an inner wall of the through hole are separated with a gap, and a profile of the heat conducting slug from top view is a second rounded rectangular. An insulating material is filled in the through hole so as to fix the heat conducting slug in the through hole. A conductive through hole structure, a first and a second patterned circuit layers are formed. The first and the second patterned circuit layers are respectively formed on two opposite sides of the substrate. The conductive through hole structure penetrates the substrate and connects portions of the first and the second patterned circuit layers.
    Type: Grant
    Filed: October 3, 2017
    Date of Patent: May 21, 2019
    Assignee: Subtron Technology Co., Ltd.
    Inventor: Chih-Hsien Cheng
  • Patent number: 10297836
    Abstract: A catalyst layer including an electrocatalyst and an oxygen evolution catalyst, wherein the oxygen evolution catalyst includes a crystalline metal oxide including: (i) one of more first metals selected from the group consisting of yttrium, lanthanum, cerium, praseodymium, neodymium, promethium, samarium, europium, gadolinium, terbium, dysprosium, holmium, erbium, thulium, ytterbium, lutetium, magnesium, calcium, strontium, barium, sodium, potassium, indium, thallium, tin, lead, antimony and bismuth; (ii) one or more second metals selected from the group consisting of Ru, Ir, Os and Rh; and (iii) oxygen characterized in that: (a) the atomic ratio of first metal(s):second metal(s) is from 1:1.5 to 1.5:1 (b) the atomic ratio of (first metal(s)+second metal(s)):oxygen is from 1:1 to 1:2 is disclosed.
    Type: Grant
    Filed: December 14, 2011
    Date of Patent: May 21, 2019
    Assignee: Johnson Matthey Fuel Cells Limited
    Inventors: David Thompsett, Edward Anthony Wright, Janet Mary Fisher, Enrico Petrucco
  • Patent number: 10299407
    Abstract: A thermal conduit configured to conduct heat from a heat source to a heat sink and method of forming said conduit are disclosed herein. The thermal conduit may comprise a plurality of stacked sheets formed of an anisotropically thermally conductive material, a non-limiting example of which is graphite, each sheet with a respective orientation of thermal conduction. The orientations of thermal conduction of the plurality of sheets may change stepwise in a stacking direction to form a curved thermal flow path.
    Type: Grant
    Filed: June 29, 2015
    Date of Patent: May 21, 2019
    Assignee: MICROSOFT TECHNOLOGY LICENSING, LLC
    Inventors: Erin Hurbi, Michael Nikkhoo, Douglas L. Heirich
  • Patent number: 10299403
    Abstract: Various modular thermal management systems for a computing device and methods of using the same are disclosed. In one aspect, a method of providing thermal management for a heat generating component is provided. The method includes placing a heat sink in thermal contact with the heat generating component and coupling a shroud to the heat sink. The shroud has a first opening to direct air in a first direction past the heat sink and a second opening to direct air in a second direction past the heat sink. Air is moved through the first opening or the second opening.
    Type: Grant
    Filed: September 23, 2015
    Date of Patent: May 21, 2019
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Chris Janak, Christopher Jaggers, Ali Akbar Merrikh
  • Patent number: 10292253
    Abstract: A heat-dissipation and shielding structure, including a shielding case, a thermal pad, and a heat sink. The bottom of the shielding case is connected to a circuit board used to carry a heat emitting element, the heat sink is disposed on the top of the shielding case, the top of the shielding case is provided with an opening, the thermal pad runs through the opening, a bottom surface of the thermal pad is attached to the heat emitting element, and a top surface of the thermal pad is attached to the heat sink; and the heat-dissipation and shielding structure further includes a metal spring plate, where the metal spring plate is located on a periphery of the opening and encircles the opening, and the metal spring plate is elastically connected between the shielding case and the heat sink.
    Type: Grant
    Filed: October 17, 2014
    Date of Patent: May 14, 2019
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Xiaoqing Li, Jinjing Jiang, Zhiguo Zhang, Bin Wang
  • Patent number: 10287166
    Abstract: A carbon nanotube film includes a first end and a second end. The second end is opposite to the first end. The carbon nanotube film includes a number of carbon nanotube wires and at least one first carbon nanotube film connected adjacent carbon nanotube wires of the number of carbon nanotube wires. The carbon nanotube wires fan out from the first end to the second end such that a distance between the adjacent carbon nanotube wires gradually increases from the first end to the second end. The carbon nanotube film defines an open angle. A method for making the above-mentioned carbon nanotube film is also provided.
    Type: Grant
    Filed: April 2, 2012
    Date of Patent: May 14, 2019
    Assignee: Beijing FUNATE Innovation Technology Co., LTD.
    Inventors: Yu-Quan Wang, Chen Feng, Liang Liu, Li Qian
  • Patent number: 10290620
    Abstract: A semiconductor package includes a processor die (e.g., an SoC) and one or more memory die (e.g., DRAM) coupled to a ball grid array (BGA) substrate. The processor die and the memory die are coupled to opposite sides of the BGA substrate using terminals (e.g., solder balls). The package may be coupled to a printed circuit board (PCB) using one or more terminals positioned around the perimeter of the processor die. The PCB may include a recess with at least part of the processor die being positioned in the recess. Positioning at least part of the processor die in the recess reduces the overall height of the semiconductor package assembly. A voltage regulator may also be coupled to the BGA substrate on the same side as the processor die with at least part of the voltage regulator being positioned in the recess a few millimeters from the processor die.
    Type: Grant
    Filed: January 31, 2017
    Date of Patent: May 14, 2019
    Assignee: Apple Inc.
    Inventors: John Bruno, Jun Zhai, Timothy J. Millet
  • Patent number: 10291220
    Abstract: A level shift circuit includes: an electrothermal converter converting a first electric signal with a first reference potential as a reference to heat; a thermoelectric converter converting the heat from the electrothermal converter to a second electric signal with a second reference potential which is different from the first reference potential as a reference; and an insulating region electrically insulating the electrothermal converter from the thermoelectric converter.
    Type: Grant
    Filed: September 7, 2017
    Date of Patent: May 14, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventors: Kazuya Hokazono, Akihisa Yamamoto, Dong Wang
  • Patent number: 10278569
    Abstract: There is provided a medical camera head including: a first casing configured to accommodate an imaging element; a heat-generating section accommodated in the first casing; a connection section provided in the first casing, an external signal transmission section being connected to one end of the connection section; and a heat transfer member interposed between the heat-generating section and the other end of the connection section.
    Type: Grant
    Filed: April 7, 2016
    Date of Patent: May 7, 2019
    Assignee: Sony Olympus Medical Solutions Inc.
    Inventor: Kohtaro Amano
  • Patent number: 10281521
    Abstract: Techniques for thermal management of a device under test are discussed. In an example, an apparatus may include a pedestal having a device-specific surface configured to exchange heat with the integrated circuit while the device-specific surface is in contact with a surface of the integrated circuit or separated from the surface of the integrated circuit by a layer of thermally conductive material, and a heat generating element configured to heat the device-specific surface. In certain examples, the pedestal may include a plurality of channels configured to couple to a manifold and to route thermal material from the manifold through an interior of the pedestal for maintaining temperature control of the surface of an integrated circuit under test.
    Type: Grant
    Filed: December 2, 2016
    Date of Patent: May 7, 2019
    Assignee: Intel Corporation
    Inventors: David Won-jun Song, James R. Hastings, Akhilesh P. Rallabandi, Morten S. Jensen, Christopher Wade Ackerman, Christopher R. Schroeder, Nader N. Abazarnia, John C. Johnson
  • Patent number: 10272643
    Abstract: A multi-layer synthetic graphite conductor. The multi-layer synthetic graphite conductor can include: a set of synthetic graphite sheets; and a perimeter wall for protecting the synthetic graphite sheets.
    Type: Grant
    Filed: October 26, 2015
    Date of Patent: April 30, 2019
    Assignee: Jones Tech (USA), Inc.
    Inventor: Xiaoning Wu
  • Patent number: 10274266
    Abstract: A fluid heat exchanger includes: a heat spreader plate including an intended heat generating component contact region; a plurality of microchannels for directing heat transfer fluid over the heat spreader plate, the plurality of microchannels each having a first end and an opposite end and each of the plurality of microchannels extending substantially parallel with each other microchannel and each of the plurality of microchannels having a continuous channel flow path between their first end and their opposite end; a fluid inlet opening for the plurality of microchannels and positioned between the microchannel first and opposite ends, a first fluid outlet opening from the plurality of microchannels at each of the microchannel first ends; and an opposite fluid outlet opening from the plurality of microchannels at each of the microchannel opposite ends, the fluid inlet opening and the first and opposite fluid outlet openings providing that any flow of heat transfer fluid that passes into the plurality of microc
    Type: Grant
    Filed: March 5, 2018
    Date of Patent: April 30, 2019
    Assignee: CoolIT Systems, Inc
    Inventor: Geoff Sean Lyon
  • Patent number: 10278278
    Abstract: A circuit structure includes an electronic component, a circuit board having a conductive path, the electronic component being mounted on the circuit board, a heat dissipation member on top of which the circuit board is placed and which dissipates heat of the circuit board, a sheet-like spacer sheet provided in a predetermined region between the circuit board and the heat dissipation member, and a bonding portion for bonding the circuit board and the heat dissipation member to each other, the bonding portion having adhesive properties or tackiness and being provided in a region between the circuit board and the heat dissipation member where the spacer sheet is not provided.
    Type: Grant
    Filed: December 15, 2014
    Date of Patent: April 30, 2019
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventor: Tou Chin
  • Patent number: 10269678
    Abstract: Microelectronic systems having integrated heat dissipation posts are disclosed, as are methods for fabricating such microelectronic systems. In various embodiments, the method includes the step or process of obtaining a microelectronic component from which a heat dissipation post projects. The microelectronic component is placed or seated on a substrate, such as a multilayer printed circuit board, having a socket cavity therein. The heat dissipation post is received in the socket cavity as the microelectronic component is seated on the substrate. Concurrent with or after seating the microelectronic component, the microelectronic component and the heat dissipation post are bonded to the substrate. In certain embodiments, the heat dissipation post may be dimensioned or sized such that, when the microelectronic component is seated on the substrate, the heat dissipation post occupies a volumetric majority of the socket cavity.
    Type: Grant
    Filed: December 5, 2017
    Date of Patent: April 23, 2019
    Assignee: NXP USA, Inc.
    Inventors: Lakshminarayan Viswanathan, Mahesh K. Shah, Lu Li, David Abdo, Geoffrey Tucker, Carl Emil D'Acosta, Jaynal A. Molla, Justin Eugene Poarch, Paul Hart
  • Patent number: 10257961
    Abstract: An apparatus and system for a heat sink assembly, and a procedure for forming a heat sink assembly. The heat sink assembly includes a heat sink having a base and fins extending from the base, and a spring clip disposed on the heat sink between the fins. The spring clip includes a first tab that forms a first angle with respect to the base of the heat sink and including a second tab that forms a second angle with respect to the base of the heat sink. The first and second tabs are attached to the circuit board. By virtue thereof, a heat sink attachment to cage is provided that is space-efficient and permits a higher density of cages on a circuit board than do conventional arrangements.
    Type: Grant
    Filed: June 8, 2017
    Date of Patent: April 9, 2019
    Assignee: Coriant Operations, Inc.
    Inventors: Zhen Lei, Qinzhen Ba, Zongxian Duan, HuiHui Yu
  • Patent number: 10256578
    Abstract: A cable, system, and method for cooling a semiconductor chip on an active cable. The active cable includes a heat sink that is thermally coupled to the semiconductor chip and movable from a retracted position to an extended position. The heat sink is in the retracted position when the active cable is not installed in a card connector in a computer case. After the active cable is installed in the card connector, the heat sink is urged to the extended position in which the heat sink is exposed to air flow circulation within the computer case.
    Type: Grant
    Filed: November 1, 2017
    Date of Patent: April 9, 2019
    Assignee: International Business Machines Corporation
    Inventors: Tyler Jandt, Phillip V. Mann, Mark D. Plucinski, Sandra J. Shirk/Heath
  • Patent number: 10249551
    Abstract: An electronic component includes one or more semiconductor dice embedded in a first dielectric layer, a heat-spreader embedded in a second dielectric layer and a heat-sink thermally coupled to the heat-spreader. The heat-spreader has a higher thermal conductivity in directions substantially parallel to the major surface of the one or more semiconductor dice than in directions substantially perpendicular to the major surface of the one or more semiconductor dice. The heat-sink has a thermal conductivity in directions substantially perpendicular to the major surface of the one or more semiconductor dice that is higher than the thermal conductivity of the heat-spreader in directions substantially perpendicular to the major surface of the one or more semiconductor dice. The heat-spreader and the heat-sink provide a heat dissipation path from the one or more semiconductor dice having a lateral thermal resistance which increases with increasing distance from the one or more semiconductor devices.
    Type: Grant
    Filed: July 20, 2017
    Date of Patent: April 2, 2019
    Assignee: Infineon Technologies Austria AG
    Inventor: Martin Standing
  • Patent number: 10248172
    Abstract: A spectrally selective radiation emission device is described. In one or more implementations, an apparatus includes a housing, one or more electrical components disposed within the housing, and a spectrally selective radiation emission device. The one or more electrical components are configured to generate heat during operation. The spectrally selective radiation emission device is disposed on the housing and configured to emit radiation when heated by the one or more electrical components at one or more wavelengths of electromagnetic energy and reflect radiation at one or more other wavelengths of electromagnetic energy.
    Type: Grant
    Filed: May 2, 2016
    Date of Patent: April 2, 2019
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Andrew Douglas Delano, Timothy Allen Jakoboski
  • Patent number: 10238274
    Abstract: There is provided a medical camera head including: a first casing configured to accommodate an imaging element; a heat-generating section accommodated in the first casing; a connection section provided in the first casing, an external signal transmission section being connected to one end of the connection section; and a heat transfer member interposed between the heat-generating section and the other end of the connection section.
    Type: Grant
    Filed: April 7, 2016
    Date of Patent: March 26, 2019
    Assignee: Sony Olympus Medical Solutions Inc.
    Inventor: Kohtaro Amano
  • Patent number: 10242931
    Abstract: A heat sink and method for using the same for use in cooling an integrated circuit (IC) chip is provided herein. The heat sink includes a manifold block, a liquid-filled cooling system, and a compliant foil affixed to the manifold block and backed by a liquid in the closed loop cooling system. The pressure provided by the liquid behind the foil causes the foil to bow, and to conform to non-planarities in the surface of the IC chip, thus reducing air gaps and increasing thermal coupling between the IC chip and the heat sink.
    Type: Grant
    Filed: November 10, 2015
    Date of Patent: March 26, 2019
    Assignee: International Business Machines Corporation
    Inventors: Raschid J. Bezama, David C. Long, Govindarajan Natarajan, Thomas Weiss
  • Patent number: 10234915
    Abstract: A graphite thermal conductor includes graphite bands laminated in the thickness direction. The thermal conductivity coefficient of each graphite band in the extending path is greater than the thermal conductivity coefficient thereof in the thickness direction. The extending path of each graphite band has at least one first bend in a plane which is perpendicular to the thickness direction. An electronic device applying the above graphite thermal conductor and a method for manufacturing graphite thermal conductor are also provided.
    Type: Grant
    Filed: September 9, 2015
    Date of Patent: March 19, 2019
    Assignee: HTC Corporation
    Inventors: Chin-Kai Sun, Jen-Cheng Lai, Jia-Yuan Hsu, Yi-Chang Huang, Chieh-Pei Chou
  • Patent number: 10237966
    Abstract: An electronic assembly including a cooling device comprises a cooling plate equipped, on its upper face, with a plurality of pin-fins; a first printed circuit board including at least one heat-generating zone bearing against the lower face of the cooling plate; each pin including a blowing means comprising a hub equipped with blades, the blades being arranged axially along each pin so as to be able to rotate about the pin, thus creating a flow of air for cooling the pins.
    Type: Grant
    Filed: March 7, 2018
    Date of Patent: March 19, 2019
    Assignee: Aptiv Technologies Limited
    Inventors: Timo Feismann, Matthias Rieke
  • Patent number: 10236189
    Abstract: A heat sink can be attached to a heat-producing electronic device by aligning an adhesive material to a surface of the heat sink, applying the adhesive material to the surface to form an outer perimeter and applying, within the outer perimeter, a thermally conductive material to the surface. The surface of the heat sink and a surface of the heat-producing electronic device can then be aligned, and the heat sink can be assembled to the heat-producing electronic device by bringing the heat-producing electronic device surface into contact with the adhesive material. The heat sink can then be affixed to the heat-producing electronic device by applying a compressive force to the assembly to activate the adhesive material.
    Type: Grant
    Filed: October 27, 2017
    Date of Patent: March 19, 2019
    Assignee: International Business Machines Corporation
    Inventors: Karl Stathakis, Phillip V. Mann, Mark K. Hoffmeyer
  • Patent number: 10229864
    Abstract: An integrated circuit is provided that comprises a thermal sink layer, a first ground plane associated with a first set of circuits that have a first operational temperature requirement, and a first thermally conductive via that couples the first ground plane to the thermal sink layer. The circuit further comprises a second ground plane associated with a second set of circuits that have a second operational temperature requirement that is higher than the first operational temperature requirement, and a second thermally conductive via that couples the second ground plane to the thermal sink layer, wherein the first thermally conductive via has a greater volume of thermal conductive material than the second thermally conductive via to remove heat from the first set of circuits with less gradient than the second set of circuits.
    Type: Grant
    Filed: September 14, 2017
    Date of Patent: March 12, 2019
    Assignee: NORTHROP GRUMMAN SYSTEMS CORPORATION
    Inventors: Patrick Loney, Robert Miles Young, Daniel Robert Queen, Aaron Ashley Hathaway, John X. Przybysz
  • Patent number: 10228119
    Abstract: A light source module includes at least one light source emitting light, and a body supporting the light source. The body includes a heat sink supporting the light source on a top surface thereof, an electrical insulating part provided on the heat sink, and a plating part provided on the insulating part. The plating part includes a contact heat dissipation part contacting a portion of a bottom surface of the light source to receive heat generated from the light source, and a diffusion heat dissipation part connected to the contact heat dissipation part for receiving heat from the contact heat dissipation part to discharge the heat to the heat sink. Accordingly, quick heat dissipation is performed.
    Type: Grant
    Filed: October 31, 2016
    Date of Patent: March 12, 2019
    Assignee: LG ELECTRONICS INC.
    Inventors: Jaepyo Hong, Jaechan Kim, Injoong Kim
  • Patent number: 10225952
    Abstract: A first fluid is heated in a preheating section and passes into an evaporator coupled to a first electronic component. Operational heat from the first electronic component vaporizes the first fluid. A second fluid passes into a cold plate coupled to a second electronic component. Operational heat from the second electronic component heats the second fluid. First and second portions of the second fluid output from the cold plate pass through first and second routes, respectively. The first portion becomes thermally coupled to the preheating section and the second portion bypasses the preheating section. Heat transfer from the first portion to the preheating section causes the heating of the first fluid in the preheating section.
    Type: Grant
    Filed: October 28, 2015
    Date of Patent: March 5, 2019
    Assignee: International Business Machines Corporation
    Inventors: Timothy J. Chainer, Pritish R. Parida
  • Patent number: 10222047
    Abstract: The invention relates to a heat sink (1) for cooling a heat source, the heat sink comprising a heat distributor (12) comprising a 3-dimensional body with a side wall (13) arranged around a main axis (14), and a plurality of plates (11) coupled to and extending from the side wall, each of the plurality of plates being curved in a cross section perpendicular to the main axis, wherein the plates are twisted along the main axis (14) of the heat distributor. The present invention solves the excessive fin length issue that is needed for higher values of the external diameter vs. the internal diameter of the fins section. The fins have curvature in all directions, which is referred to as double curvature. This double curvature is the result of two curving of each fin in a radial direction and twisting of the fins along the axial direction.
    Type: Grant
    Filed: July 20, 2015
    Date of Patent: March 5, 2019
    Assignee: PHILIPS LIGHTING HOLDING B.V.
    Inventors: Simon Eme Kadijk, Dirk Gehrels
  • Patent number: 10217688
    Abstract: An electronic component includes one or more semiconductor dice embedded in a first dielectric layer, a heat-spreader embedded in a second dielectric layer and a heat-sink thermally coupled to the heat-spreader. The heat-spreader has a higher thermal conductivity in directions substantially parallel to the major surface of the one or more semiconductor dice than in directions substantially perpendicular to the major surface of the one or more semiconductor dice. The heat-sink has a thermal conductivity in directions substantially perpendicular to the major surface of the one or more semiconductor dice that is higher than the thermal conductivity of the heat-spreader in directions substantially perpendicular to the major surface of the one or more semiconductor dice. The heat-spreader and the heat-sink provide a heat dissipation path from the one or more semiconductor dice having a lateral thermal resistance which increases with increasing distance from the one or more semiconductor devices.
    Type: Grant
    Filed: July 20, 2017
    Date of Patent: February 26, 2019
    Assignee: Infineon Technologies Austria AG
    Inventor: Martin Standing
  • Patent number: 10215504
    Abstract: An apparatus for cooling an electronic component has a planar top member of a thermal energy conductive material and a parallel planar bottom member of the material, the planar bottom member including a surface having regions configured for heat exchange contact with the electronic component. The joined planar top and bottom members have a sidewall structure of reduced height (and generally the height of the cold plate) between active areas in order to improve flexibility. The stiffness of the sidewalls is reduced by very advantageously reduce the height of the sidewalls. In one embodiment, the sidewalls are shorter in height corresponding to regions only between active areas. Alternatively, the sidewalls are of reduced height everywhere by insetting the active areas within the top and/or bottom sheets.
    Type: Grant
    Filed: August 4, 2015
    Date of Patent: February 26, 2019
    Assignee: International Business Machines Corporation
    Inventors: Paul W. Coteus, Shawn A. Hall, Mark D. Schultz, Todd E. Takken, Shurong Tian