Abstract: An electric axle arrangement for a drive train of a motor vehicle includes a drivable axle that is or can be drivingly connected to an electric machine, a coolant sump with liquid coolant, and an elevated tank, wherein the liquid coolant is delivered from the coolant sump into the elevated tank via a gearwheel attached to the axle. The elevated tank is connected to a cooling system for cooling the electric machine via a switchable valve. When the valve is closed during an idling operation, the return flow of the coolant into the coolant sump via the cooling system is prevented, and drag losses in the idling operation of the electric machine are reduced, because more coolant collects in the elevated tank and the gearwheel therefore encounters a reduced quantity of coolant in the sump.

Abstract: A heat dissipation structure, for a heat-generating electric component, includes: a heat dissipator disposed along a surface of the electric component; and a porous material held between the electric component and the heat dissipator. The porous material of the heat dissipation structure is impregnated with heat-transfer fluid. The heat-transfer fluid may include liquid metal.

Abstract: An electronic control device includes a conductive casing; a circuit board which is provided in the casing, and on which an electronic component including an integrated circuit is mounted; and a conductive conductor component that is provided on the circuit board, is disposed at a position higher than the electronic component, and has an elongated shape, in which a distance between the conductor component and the casing is shorter than a distance between the conductor component and the circuit board.

Abstract: A thermal device comprises a first layer of a non-metallic material that is a good conductor of heat and electricity, that includes a first terminal and a second terminal, and that has a first surface and a second surface; a metallic material disposed on the first surface of the first layer; a first plastic layer disposed on the metallic material; and a second plastic layer disposed on the second surface of the first layer. The first plastic layer and the second plastic layer include a plastic material that is a good conductor of heat.

Abstract: An electrical connector assembly includes: a printed circuit board; an electrical connector seated upon the printed circuit board; an electronic package coupled to the electrical connector; a frame structure affixed to the printed circuit board; a metallic securing seat affixed to the frame structure and having plural securing posts; a heat sink positioned upon the electronic package and having plural through holes aligned with the securing posts; plural fasteners each extending through a corresponding through hole to engage a corresponding securing post and plural springs each compressed between an associated fastener and the heat sink; and a retention member mounted to a corresponding securing post for engaging the heat sink, wherein the retention member has a mounting part and a latching part pivoted to the mounting part.

Abstract: An adjustable, customizable, and configurable heat transfer element is structured for facilitating hear transfer in pipe systems having process pipes. The heat transfer element is configured for transferring heat between a process pipe and a corresponding tracer tube in order to maintain a fluid within the process pipe within a predetermined temperature range. In this regard, the heat transfer element may comprise a body having a nested portion that forms a cavity therein, each extending in a longitudinal direction. The body is configured for operative coupling to the process pipe. The cavity of the nested portion is configured to receive a tracer tube therein such that the tracer tube is positioned in between, and at least partially surrounded by the body and the process pipe. Moreover, the body may comprise a spine that is utilized to aid in bending the heat transfer element in one or more planes.

Abstract: Systems and methods for improved geoheat harvesting enhancements are presented in which a wellbore contains a closed loop geoheat harvesting system that is thermally coupled to a hot and dry rock formation via thermal reach enhancement structures that extend from the wellbore into the formation and that are filled with a thermally conductive filler. Preferred configurations and/or operational parameters are determined by a model that calculates heat flow in a three-dimensional system considering time changes and the influence of the thermal reach enhanced intrinsic thermal conductivity of the rock.

Abstract: A method for evacuating a volume below a substrate in a substrate processing system includes arranging the substrate on a lift mechanism of a substrate support to define the volume below the substrate between the substrate and an upper surface of the substrate support. An evacuation step is initiated to evacuate the volume below the substrate. The evacuation step includes pumping down the volume below the substrate at least one of through and around the lift mechanism. The lift mechanism is lowered during the evacuation step to position the substrate on the upper surface of the substrate support and the evacuation step is terminated.

Abstract: The structural integrity and viscoelastic performance of boron nitride nanotube (BNNT) materials may be improved through forming a compressed BNNT buckyweave. The BNNT buckyweave may be formed from a BNNT buckypaper having a bulk nanotube alignment (partial alignment) that may be maintained when forming the BNNT buckyweave, and compression may be parallel to and/or perpendicular to the partial alignment. The BNNT material may be viscoelastically-enhanced through, e.g., selection of synthesized BNNT material, impurity removal/reduction, BNNT alignment, isotopically enhancement, and compression relative to alignment. BNNT buckyweave s are introduced. The present approach provides viscoelastic behavior over temperatures from near absolute zero to near 1900 K. The transport of phonons along the BNNT molecules may be enhanced by utilizing isotopically enhanced BNNTs.

Abstract: A semiconductor structure includes a circuit substrate, a semiconductor die, and a cover. The semiconductor die is disposed on the circuit substrate. The cover is disposed over the semiconductor die and over the circuit substrate. The cover comprises a lid portion and a support portion. The structure includes a first adhesive bonding the support portion to the circuit substrate and a second adhesive bonding the support portion and the lid portion.

Abstract: An information handling system includes a hardware processor, a memory device, a video display device, and a power management unit (PMU). The information handling system further includes an uneven thickness heat spreader cooling system including an uneven thickness heat spreader having a first thickness along a first portion of the uneven thickness heat spreader and a second thickness along a second portion of the uneven thickness heat spreader wherein the second thickness along a second portion of the uneven thickness heat spreader is formed at an information handling system chassis location where a width of the uneven thickness heat spreader is narrower than at the first portion of the uneven thickness heat spreader to transfer heat from a warmer portion of the information handling system chassis to a cooling portion of the information handling system chassis.

Abstract: A shared optic assembly for combined flood and dot illumination modules is disclosed. The shared optic assembly includes a first high-powered VCSEL element for providing a flood beam and a second high-powered VCSEL element for providing a dot beam, where both the first and second VCSEL elements share the same optics and are incorporated onto the same module for space savings.

Abstract: A system including a cooling element and a support structure is described. The cooling element has a first side and a second side opposite to the first side. The cooling element is configured to undergo vibrational motion when actuated to drive a fluid from the first side to the second side. The support structure thermally couples the cooling element to a heat-generating structure via thermal conduction.

Abstract: A composite connector includes modular data connectors, electrical power connectors, a fluid exchange connector, an alignment feature, and a housing. The modular data connectors include electrical data connectors and optical data connectors and are configured to carry data. The electrical power connectors are configured to carry electrical power, and the fluid exchange connector is configured to carry cooling fluid. The composite connector includes an alignment feature to align the composite connector with a complementary connector. The housing of the composite connector is configured to contain the modular data connectors, the electrical power connectors, the fluid exchange connector, and the alignment feature in a confined physical space.

Abstract: A thermoelectric element according to one embodiment of the present disclosure includes a first substrate, a first insulating layer disposed on the first substrate, a second insulating layer disposed on the first insulating layer, a first electrode disposed on the second insulating layer, and a semiconductor structure disposed on the first electrode, wherein the first insulating layer includes an uneven portion, a partial region of the first electrode is buried in the second insulating layer, the second insulating layer includes a concave portion which is concave in a direction toward the first insulating layer from a side surface of the first electrode, and the concave portion vertically overlaps the uneven portion.

Abstract: A vapor chamber includes a bottom cover, a top cover, a crate element, and at least one porous pillar. The bottom cover is configured to receive waste heat from an electronic component. The top cover is arranged on the bottom cover, and the bottom cover and the top cover are formed such that a vapor cavity configured to accommodate a liquid is formed between the bottom and top cover. The crate element is configured to provide mechanical strength to the vapor chamber, and has at least one compartment. The compartment(s) are formed by at least three side panels that are connected to each other, where the at least three side panels extend from the bottom cover to the top cover. The porous pillar(s) are configured to transfer the liquid from the top cover to the bottom cover and are arranged in the compartment.

Abstract: A hybrid heat sink includes a solid heat dissipation module and a TS heat dissipation module. The solid heat dissipation module includes a solid substrate and solid fins. The solid substrate has a first side surface and a second side surface opposite to each other. The first side surface is for contacting a heat source, and the solid fins are connected to the second side surface. The TS heat dissipation module includes a TS substrate and TS fins fixed to the TS substrate. A receiving cavity for receiving a phase-change working medium is formed in the TS substrate, condensation reflux cavities are formed in the TS fins and are communicated with the receiving cavity. The TS substrate is fixed at a mounting opening of the solid substrate with a side surface of the TS substrate being exposed to the first side surface for contacting the heat source.

Abstract: The present invention refers to a heat sink (5) for bi-facial photovoltaic modules (3) configured to be secured to the back side (3b) of at least one bi-facial photovoltaic module (3) wherein the heat sink (5) comprises a plurality of rods (11) having a thermal conductivity higher than 10 W·m?1·K?1 and arranged as a mesh configured to be in contact with the back side (3b) of the bi-facial photovoltaic module (3).

Abstract: Information is communicated to a process control device by performing a process that includes the step of heating a component, the component having structured volumetric regions. When the component is heated, structures present in the volumetric regions radiate in the infrared spectrum, allowing the structures to be distinguished by an infrared sensor. The structures, formed by elevations or depressions, form a machine-readable identifier, which can be used as an originality identification means for the component. Since the identifier can be determined in situ during a heating process, the process control device can recognize whether correction values are to be used for the thermal treatment of a substrate.

Abstract: This application provides a fan and an electronic device. The fan includes a body, and an air duct, an air outlet and a flow guiding inlet are formed in the body; the air duct includes an air inlet area and an air outlet area, and a flow guiding member is disposed in the air outlet area; the flow guiding member and the body form a first channel, a second channel, and a third channel. After a main airflow in the air inlet area enters the first channel and the third channel, a negative pressure area is formed at the flow guiding outlet, a differential pressure exists between air pressures in the negative pressure area and the second channel, and the differential pressure enables air to enter the flow guiding cavity from the flow guiding inlet to form an induced airflow, thereby increasing an air output.

Abstract: A technique to additively print onto a dissimilar material, especially ceramics and glasses (e.g., semiconductors, graphite, diamond, other metals) is disclosed herein. The technique enables manufacture of heat removal devices and other deposited structures, especially on heat sensitive substrates. It also enables novel composites through additive manufacturing. The process enables rapid bonding, orders-of-magnitude faster than conventional techniques.

Abstract: In a method, cell placement is performed to place a plurality of cells into a region of an integrated circuit (IC). A thermal analysis is performed to determine whether the region of the IC is thermally stable at an operating condition. In response to a determination that the region of the IC is thermally unstable, at least one of a structure or the operating condition of the region of the IC is changed. After the thermal analysis, routing is performed to route a plurality of nets interconnecting the placed cells. At least one of the cell placement, the thermal analysis, the changing or the routing is executed by a processor.

Abstract: An apparatus includes a chimney cooler having a housing. The housing includes a base and sidewalls. The base is configured to support one or more heat-generating components. The sidewalls extend from the base, and each sidewall includes multiple channels. Each channel defines a serpentine flow path configured to receive a fluid coolant. The sidewalls may be lofted away from the heat-generating component(s) as the sidewalls extend from the base. An inlet for each channel may be contoured to promote inertial flow of the fluid coolant into the serpentine flow path. An outlet for each channel may be contoured to promote inertial flow of the fluid coolant exiting the serpentine flow path. Channels at and adjacent to primary objective surfaces of the housing may share a common inlet. The channels at the primary objective surfaces of the housing may have larger outlets relative to the channels adjacent to the primary objective surfaces of the housing.

Abstract: An electronic module assembly includes a circuit card assembly (CCA) including heat generating electronic components. A connector is electrically connected to the heat generating electronic components. The connector is positioned at a connection end of the CCA. A heatsink is mounted to the CCA and is connected in thermal communication with the electronic components. A wedge feature is defined along a lateral edge of the heatsink relative to the connector.

Abstract: An apparatus includes a printed circuit board (PCB), an integrated circuit (IC) component connected with a surface of the PCB, and a heat sink. The heat sink includes a base plate disposed directly over the IC component, and a plurality of cooling fins extending transversely from the base plate. The heat sink includes at least one component including a bimetallic material that distorts when heated above a threshold temperature so as to modify a flow of air directed toward and contacting the cooling fins or maintain contact between a surface of the IC component and a facing surface of the base plate.

Abstract: A heat sink according to one embodiment of the present invention comprises: a main heat sink; a heat pipe mounted in a groove formed on one surface of the main heat sink; a heat dissipation member which is formed above the heat pipe and transfers heat generated from a heat generation component to the heat pipe; and an elastic member which is mounted in a space formed inside the heat dissipation member and applies pressure to the main heat sink.

Abstract: We herein describe a semiconductor device sub-assembly comprising at least two power semiconductor devices and a contact of a first type. A first power semiconductor device is located on a first side of the contact of a first type, and a second power semiconductor device is located on a second side of the contact of a first type, where the second side is opposite to the first side.

Abstract: A hot-forming die has a heatable lower die and a heatable upper die. The lower die and the upper die have spacer elements to permit flexing. A plate stack including two plate elements is inside the hot-forming die. The plate stack is on the spacer elements in the lower die. The lower die and the upper die are displaced relative to each other when the hot-forming die is closed. The spacer elements of the upper die come into contact with the plate stack. As the closing movement continues, the spacer elements, are displaced into the lower die and the upper die, respectively, and the plate stack is clamped between the lower die and the upper die. The plate stack is then heated by the lower die and the upper die and an internal pressure is applied to an intermediate space between the plate elements by feeding in an active medium.

Abstract: A heat dissipation structure includes a heat dissipation member and a fixed member. The fixed member has a first surface and a second surface oppositely. The heat dissipation member is disposed on the first surface, and one part of the second surface corresponds to one side of at least one heat generating source and is disposed adjacent to the one side of the heat generating source. The first surface has a first zone surrounded by a second zone. The heat dissipation member is disposed on the first zone corresponding to the heat generating source. The second zone has at least one groove arranged around one part of the first zone. A distance between one side of the groove adjacent to the first zone and the first zone is less than 1.0 mm, and a volume ratio of the groove to the heat dissipation member is 0.9 to 1.6.

Abstract: Various technologies described herein pertain to a sensor for an autonomous vehicle that includes one or more heat dissipation features. A sensor includes a top cover and a bottom cover, where the top cover and the bottom cover form at least a portion of a casing of the sensor. The sensor includes a coldplate, a first printed circuit board, and a second printed circuit board. A top side of the first printed circuit board is coupled to the top cover and a bottom side of the first printed circuit board is coupled to a top side of the coldplate. A top side of the second printed circuit board is coupled to a bottom side of the coldplate and a bottom side of the second printed circuit board is coupled to the bottom cover. Various features described herein enhance heat transfer from components on the first and second printed circuit boards.

Abstract: A cooling apparatus includes: a plurality of cooling units each including a plurality of tube main bodies and a plurality of headers, each tube main body defining a cooling flow path that passes through an inside of the tube main body, and each header being disposed at both sides of the tube main body and vertically assembled based on the plurality of tube main bodies being stacked to thereby connect the cooling flow paths, a double-sided chip module disposed between at least two cooling units, and a heat-radiating adhesion portion attaching the double-sided chip module to the cooling unit. A set distance between the cooling unit and the double-sided chip module is maintained based on the plurality of headers being vertically assembled in contact with each other and equal to or less than a thickness of the heat-radiating adhesion portion.

Abstract: Embodiments of the present disclosure generally relate to an electrostatic chuck assembly suitable for use in cryogenic applications. In one or more embodiments, an electrostatic chuck assembly is provided and includes an electrostatic chuck having a substrate supporting surface opposite a bottom surface, a cooling plate having a top surface, where the cooling plate contains an aluminum alloy having a coefficient of thermal expansion (CTE) of less than 22 ppm/° C., and a bonding layer securing the bottom surface of the electrostatic chuck and the top surface of the cooling plate, where the bonding layer contains a silicone material.

Abstract: A heat dissipating device includes a power distribution assembly and two convergence delivery assemblies. The power distribution assembly includes a first cooling reservoir, a second cooling reservoir, multiple cooling pumps disposed on the first cooling reservoir, and a serial pipeline and a cooling head corresponding to each of the cooling pumps respectively. The two convergence delivery assemblies separately communicate with first cooling reservoir and the second cooling reservoir, and are separately arranged on two sides of the power distribution assembly. The serial pipeline is connected with the cooling head to communicate between the first cooling reservoir and the second cooling reservoir.

Abstract: A chip package assembly and method for fabricating the same are provided which utilize a plurality of posts in mold compound for improved resistance to delamination. In one example, a chip package assembly is provided that includes a first integrated circuit (IC) die, a substrate, a redistribution layer, a mold compound and a plurality of posts. The redistribution layer provides electrical connections between circuitry of the first IC die and circuitry of the substrate. The mold compound is disposed in contact with the first IC die and spaced from the substrate by the redistribution layer. The plurality of posts are disposed in the mold compound and are laterally spaced from the first IC die. The plurality of posts are not electrically connected to the circuitry of the first IC die.

Abstract: A battery module includes: a plurality of battery cells stacked on each other in a first direction and forming a stacked structure; a pair of end plates in surface contact with a first and a second ends of the stacked structure in the first direction; a pair of bus bar assemblies disposed at the first and second ends of the stacked structure in a second direction and bonding electrodes of the battery cells; a first cover covering a surface of the stacked structure in a third direction; a first clamp including a first and a second ends respectively bonded to the pair of end plates across an outer surface of the first cover; and a second clamp including a first and a second ends respectively bonded to the pair of end plates across a surface, facing a surface on which the first cover is disposed, of the stacked structure.

Abstract: Embodiments described herein relate generally to continuous flow photoreactors with easily replaceable and adjustable components. The photoreactor includes a reactor flow system, a lighting system, and a temperature control system. The reactor flow system includes a reactor inlet port, a reactor outlet port, and a length of reactor tubing fluidically coupled to the reactor inlet port and reactor outlet port. The lighting system includes a light emitting apparatus (e.g., a plurality of LEDs) configured to emit light in a defined wavelength range toward the length of reactor tubing. The temperature control system includes an inlet port, an outlet port, and a length of temperature control tubing fluidically coupled to the inlet port and the outlet port. In some embodiments, the temperature control system can be configured to circulate a fluid to cool the lighting system.

Abstract: A heat sink includes a heat sink body having a plurality of stacked fins and a mounting base. The mounting base has a first heat dissipation plate and a second heat dissipation plate. A first surface of the first heat dissipation plate is connected to a bottom of the heat sink body. The second heat dissipation plate is mounted on a second surface of the first heat dissipation plate opposite to the first surface.

Abstract: A portable information handling system structure located between housing hinges along one side of the housing has first and second antenna disposed at opposing ends with a cooling fan between the first and second antenna and over the antenna structure to isolate the first and second antenna. In one embodiment, a parasitic element disposed between the first and second antenna and under the cooling fan has resonance tuned to isolate wireless signals of a frequency supported by the first and second antenna.

Abstract: A heat dissipation sheet includes a first sheet composed of a plurality of first carbon nanotubes, and a second sheet composed of a plurality of second carbon nanotubes, wherein the first sheet and the second sheet are coupled in a stacked state, and the first carbon nanotubes and the second carbon nanotubes are different in an amount of deformation when pressure is applied.

Abstract: An electronic apparatus includes: a chassis; a heat generating element provided in the chassis; and a cooling device that has a cooling fin, a heat pipe connecting the cooling fin and the heat generating element, and a pressing assembly pressing the heat pipe against the heat generating element, and is provided in the chassis. The heat pipe has: a heat absorbing section that absorbs heat generated by the heat generating element; and a thin plate section having a thickness which is smaller than that of the heat absorbing section. The pressing assembly has: a base assembly relatively fixed to the chassis; and a bridge section that is provided integrally with the base assembly and placed on a surface of the thin plate section in such a manner as to extend over the heat pipe in a width direction.

Abstract: A heat distribution device comprising a main body, a recessed cavity positioned within the main body, the recessed cavity having an interior surface, a peripheral wall extending around and defining the interior surface, and a central point within the recessed cavity. A plurality of ribs may extend away from the interior surface of the recessed cavity. The plurality of ribs may be concentrically arranged around the central point and define a plurality of channels therebetween. Each of the plurality of ribs may have a top surface that slopes toward or away from the central point. The plurality of ribs may be arranged so that the top surfaces of the plurality of ribs collectively form a collective sloped surface within the heat distribution device.

Abstract: An IC die includes a temperature control element suitable for three-dimensional IC package with enhanced thermal control and management. The temperature control element may assist temperature control of the IC die when in operation. In one example, the temperature control element may have a plurality of thermal dissipating features disposed on a first surface of the IC die to efficiently control and dissipate the thermal energy from the IC die when in operation. A second surface opposite to the first surface of the IC die may include a plurality of devices, such as semiconductors transistors, devices, electrical components, circuits, or the like, that may generate thermal energy when in operation. The temperature control element may provide an IC die with high efficiency of heat dissipation that is suitable for 3D IC package structures and requirements.

Abstract: A heat dissipation device includes a plurality of fins, at least one first heat pipe and at least one second heat pipe. Each of the fins includes a main body and two first deflectors. The main body has an inflow side, an outflow side and two first communication openings. The first communication openings are located between the inflow side and the outflow side. The first deflectors are arranged obliquely relative to the main body and respectively located on sides of the first communication openings. Air flowing out of the first communication openings is guided by the first deflectors to flow into an area between the first deflectors. The first heat pipe is located between the first deflectors. The second heat pipe is located on one side of one of the first deflectors located relatively far away from the other one of the first deflectors.

Abstract: A converter includes a housing; a heat-generating component disposed inside the housing; and a heat-dissipating module disposed on the heat-generating component and having a heat-dissipating member, an inlet adjacently disposed on one side of the heat-dissipating member, and an outlet adjacently disposed on the other side of the heat-dissipating member. The heat-dissipating member includes a plurality of heat-dissipating fins and a plurality of flow paths disposed in a direction from the inlet toward the outlet, and the plurality of flow paths are disposed overlapping with the heat-generating component in the vertical direction. A distance between two outermost heat-dissipating fins in a second direction of the heat-dissipating member, among the plurality of heat-dissipating fins, is greater at a central region between the inlet and the outlet of the heat-dissipating member than at a first region near the outlet of the heat-dissipating.

Abstract: A composite substrate includes a base layer formed of a composite material containing diamond and a metal, the base layer a first surface, and a second surface opposite to the first surface; a flat layer having a lower surface bonded to the first surface of the base layer, and an upper surface having a surface roughness Ra of 10 nm or less; and an insulating layer directly bonded to the upper surface of the flat layer.

Abstract: A computing device includes a heat dissipation component, a heating or cooling apparatus, and a printed circuit board. The heating or cooling apparatus includes a heating or cooling component and a wire, and the heating or cooling component is affixed to a surface of the heat dissipation component. The printed circuit board includes a printed circuit board component, and the heat dissipation component is affixed to the printed circuit board component and configured to heat or cool the printed circuit board component.

Abstract: The invention relates generally to liquid-repellent coatings, and in particular, to porous liquid-repellent coatings, a method of preparing the porous liquid-repellent coatings, and a method of characterizing a porous surface for the liquid-repellent coatings. The invention further relates to a porous liquid-repellent coating comprising a porous layer of a transition metal oxide and/or hydroxide and a layer of a liquid-repellent compound deposited onto the porous layer of the transition metal oxide and/or hydroxide, wherein the porous layer of the transition metal oxide and/or hydroxide is comprised of a plurality of surface pores of varying angles with an average angle that is re-entrant.

Abstract: A horizontal Dewar flask is used with an optical metrology device, which may advantageously reduce the vertical height of the device. A thermal transfer member provides thermal transfer between a liquefied gas cooled sensor and liquefied gas in a chamber of the Dewar flask. To compensate for the loss of thermal transfer from the sensor as the liquefied gas evaporates and changes to a gaseous state, the thermal transfer member biases heat transfer to the liquefied gas that is at the bottom of the chamber. The thermal transfer member may have a larger surface area at a bottom portion of the thermal transfer member than the upper portion. For example, the thermal transfer member may include one or more projections that extend into the liquefied gas with greater density at the bottom of the chamber than at the top of the chamber.

Abstract: A power conversion device includes: a housing; and a cover coupled to the housing, the cover includes a plate portion, a heat conduction portion coupled to the plate portion, and a refrigerant pipe, the plate portion includes a first groove in which the refrigerant pipe is disposed, and the depth of one end of the first groove is smaller than that of the other end.

Abstract: A computing device comprises a housing, a heat-generating electronic component, at least one additional electronic component, and a liquid cooling module. The heat-generating component, the at least one additional electronic component, and the liquid cooling module are all positioned inside the housing. The liquid cooling module is configured to cool the heat-generating electronic component, and includes at least one movable radiator. The at least one movable radiator is configured to move between a first position and a second position. When the at least one movable radiator is in the first position, the at least one movable radiator blocks access to the at least one additional electronic component within the housing. When the at least one movable radiator is in the second position, the at least one movable radiator allows access to the at least one additional electronic component within the housing.