Heat Transmitter Patents (Class 165/185)
  • Patent number: 11129299
    Abstract: The invention relates to a improved heat sink. In one embodiment this is accomplished by a base member and a heat radiating portion, wherein heat radiating portion includes a plurality of fins, wherein the distance between rows of the plurality of fins (fluid guide) are arranged such that they don't obstruct the horizontal flow of fluid or change the characteristic of the fluid substantially.
    Type: Grant
    Filed: March 28, 2012
    Date of Patent: September 21, 2021
    Assignee: TEJAS NETWORK LIMITED
    Inventor: Vinod Kumar Madaiah
  • Patent number: 11129271
    Abstract: The present invention relates to a motor, a circuit board and an engine cooling module including the motor. The motor includes a stator and a rotor. The stator includes a control module and a heat sink. The control module includes a circuit board and heat generating electronic components mounted on the circuit board. A bottom surface of the circuit board faces the heat sink. The heat generating electronic components are mounted on a top surface of the circuit board. Metal heat conducting members are embedded inside the circuit board at positions corresponding to the heat generating electronic components, and extend along a thickness direction of the circuit board. The heat generated by the heat generating electronic components is conducted from the top surface of the circuit board to the bottom surface of the circuit board. The present invention improves the heat dissipation effect of the motor.
    Type: Grant
    Filed: May 15, 2018
    Date of Patent: September 21, 2021
    Assignee: JOHNSON ELECTRIC INTERNATIONAL AG
    Inventors: Yue Li, Youqing Xiang, Xiaojun Yan, Nan Zheng, Minghua Xiong, Yun Chen
  • Patent number: 11122840
    Abstract: The present invention relates to heatable garments (1), comprising a garment body (3) and a heating pad (5) adhered to at least a portion of the garment body (3), wherein the heating pad (5) comprises graphene particles dispersed in a polymer matrix material. The invention also provides fabrics for making such garments, and methods of making such garments and fabrics. Also provided are heatable bedding incorporating a heating pad as described above.
    Type: Grant
    Filed: January 26, 2017
    Date of Patent: September 21, 2021
    Assignee: Haydale Graphene Industries PLC
    Inventors: Davide DeGanello, Youmna Mouhamad, Andrew Claypole
  • Patent number: 11109513
    Abstract: The present disclosure relates to a heat conductive sheet that includes a heat generation component having a large heat generation amount. The heat conductive sheet according to the present disclosure includes a heat radiation sheet having a graphite sheet, a first protective film provided on one surface side of the graphite sheet, and a second protective film provided on another surface side of the graphite sheet. The heat radiation sheet includes a bent part that is bent, and a first heat radiation part and a second heat radiation part that are coupled to each other through the bent part and overlapping with each other in a view from above. Further, a first non-adhesive area in which the first heat radiation part and the second heat radiation part are not adhered to each other is provided between the first heat radiation part and the second heat radiation part.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: August 31, 2021
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Norihiro Kawamura, Daishi Takahashi
  • Patent number: 11102912
    Abstract: A two-phase liquid immersion cooling system is described in which heat generating computer components cause a dielectric fluid in its liquid phase to vaporize. The dielectric vapor is then condensed back into a liquid phase and used to cool the computer components. Using a pressure controlled vessel and pressure controller, the disclosed system may be operated at less than ambient pressure. By controlling the pressure at which the system operates, the user may influence the temperature at which the dielectric fluid vaporizes and thereby achieve increased performance from a given computer component. Utilizing robotic arms and slot-in computing components, a self-healing computing system may be created.
    Type: Grant
    Filed: October 19, 2018
    Date of Patent: August 24, 2021
    Assignee: TMGCore, LLC
    Inventors: John David Enright, Jake Mertel
  • Patent number: 11092512
    Abstract: The invention relates to a coolable optical table with a table top and at least three table legs. Securing means for securing objects such as optical elements are provided in a table surface of the table top. The table legs are equipped with a damping device for damping vibrations.
    Type: Grant
    Filed: October 22, 2015
    Date of Patent: August 17, 2021
    Assignee: ATTOCUBE SYSTEMS AG
    Inventors: Dirk Haft, Florian Otto, Claudio Dal Savio, Khaled Karrai
  • Patent number: 11094661
    Abstract: A highly reliable bonded structure having excellent thermal fatigue resistance characteristics and thermal stress relaxation characteristics is provided. The bonded structure of the present invention comprises a first member, a second member capable of being bonded to the first member, and a bonding part interposed between a first bond surface at the first member side and a second bond surface at the second member side to bond the first member and the second member. The bonding part has at least a bonding layer, a reinforcing layer, and an intermediate layer. The bonding layer is composed of an intermetallic compound and bonded to the first bond surface.
    Type: Grant
    Filed: November 15, 2016
    Date of Patent: August 17, 2021
    Assignee: KABUSHIKI KAISHA TOYOTA CHUO KENKYUSHO
    Inventors: Hirofumi Ito, Masanori Usui, Makoto Kuwahara
  • Patent number: 11094605
    Abstract: Interconnectors, interconnector assemblies, and methods for supporting components are provided. An interconnector as disclosed connects a supported component to another component or assembly securely and accurately, even where the supported component and the other component have different expansion or contraction characteristics. The interconnector includes a plurality of support elements disposed in an array. Each support element includes a support surface at a free end of the support element. The areas of the support surfaces decrease with distance from a center of the array. In a completed assembly, the free ends of the support elements in the array are joined to the supported component.
    Type: Grant
    Filed: April 9, 2020
    Date of Patent: August 17, 2021
    Assignee: Ball Aerospace & Technologies Corp.
    Inventor: Joseph Hsing-Hwa Ho
  • Patent number: 11085712
    Abstract: To provide a heat-dissipating sheet having good close-contact properties with an adherend such as a heat-generating body and being easy to handle. A heat-dissipating sheet includes a heat-dissipating member including a graphite sheet, a first thermally conductive layer, and a second thermally conductive layer stacked in this order. The first thermally conductive layer contains a thermally conductive filler dispersed in a polymer matrix and has an outer shape larger than the graphite sheet when viewed in plan. The second thermally conductive layer contains a thermally conductive filler dispersed in a polymer matrix, is more flexible than the first thermally conductive layer, and has an outer shape identical to or smaller than the first thermally conductive layer when viewed in plan.
    Type: Grant
    Filed: January 19, 2018
    Date of Patent: August 10, 2021
    Assignee: SEKISUI POLYMATECH CO., LTD.
    Inventors: Shigeru Koyano, Yoshifumi Iimuro, Yoshiya Sakaguchi
  • Patent number: 11079281
    Abstract: A cold stage actuation system employs an optical assembly having an adapter ring mounted to a flange connected to a cold finger which extends into a Dewar housing. The flange supports a detector array. A resilient cold shield extends from the adapter ring to a lens holder, the lens holder connected to the resilient cold shield distal from the adapter ring. The lens holder supports a lenslet array. An optical light shield extends from the lens holder oppositely from the resilient cold shield to proximate a window in the Dewar housing. A motor is supported within the Dewar housing. An insulating translation arm connects the motor to the optical light shield, whereby operation of the motor induces the insulating translation arm to extend or retract the optical assembly concentric with an optical axis.
    Type: Grant
    Filed: January 17, 2019
    Date of Patent: August 3, 2021
    Assignee: UVIA GROUP LLC
    Inventor: Michele Hinnrichs
  • Patent number: 11075499
    Abstract: A heat sink comprising a heat spreader (2) made from synthetic diamond and having a front surface for mounting one or more components to be cooled like a laser disc (8) and a rear surface for direct fluid cooling (10). A plurality of ribs (4,7) is bonded to the rear surface of the heat spreader (2) to stiffen the heat spreader. Both the heat spreader and the plurality of ribs are formed of synthetic diamond material. The ribs (4,7) may be fixed to the heat spreader by braze bonds (6).
    Type: Grant
    Filed: December 15, 2017
    Date of Patent: July 27, 2021
    Assignee: Element Six Technologies Limited
    Inventor: Joseph Michael Dodson
  • Patent number: 11075140
    Abstract: The disclosure provides a heat conduction structure with higher heat conductivity. This embodiment is a heat conduction structure where heat is conducted from a first member to a second member. The heat conduction structure includes at least one self-assembled monolayer and a heat dissipation grease. The self-assembled monolayer is formed on at least one surface of the first member and the second member. The heat dissipation grease is disposed between the first member and the second member. The heat dissipation grease is in contact with the self-assembled monolayer.
    Type: Grant
    Filed: June 24, 2019
    Date of Patent: July 27, 2021
    Assignees: TOYOTA JIDOSHA KABUSHIKI KAISHA, NATIONAL UNIVERSITY CORPORATION NAGOYA UNIVERSITY
    Inventors: Takeshi Bessho, Masataka Deguchi, Nagahiro Saito, Kazuo Hashimi
  • Patent number: 11076512
    Abstract: An electronic device according to various embodiments of the present disclosure may include: a printed circuit board including one face; at least one electronic component mounted on the printed circuit board; and a conductive shield can structure attached to the one face of the printed circuit board while surrounding the at least one electronic component.
    Type: Grant
    Filed: February 15, 2019
    Date of Patent: July 27, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sungyoung Lee, Changho Kim
  • Patent number: 11067796
    Abstract: A display system of a vehicle includes a display device disposed in the vehicle and operable to display heads up information for viewing by a driver of the vehicle. The display device includes a mirror, a display screen and a cooling device. The mirror is pivotally mounted at a base plate and is pivotable via a pin of a mounting arm of the mirror moving along a spiral groove of a gear element when the gear element is rotated. The pin is urged towards a side wall of the spiral groove to limit play of the mirror relative to the base plate.
    Type: Grant
    Filed: February 15, 2017
    Date of Patent: July 20, 2021
    Assignee: MAGNA ELECTRONICS INC.
    Inventor: Norbert Kunze
  • Patent number: 11069595
    Abstract: A water cooling module includes a flow-guiding main body and a pump set. The flow-guiding main body includes a first inlet, a first outlet and a flow-guiding passage set. The flow-guiding passage set includes a plurality of flow-guiding passages, and the first inlet and the first outlet are respectively communicable with one of the flow-guiding passages. The pump set includes a first pump having a first water inlet and a first water outlet, and a second pump having a second water inlet and a second water outlet. The first water inlet and the first water outlet are respectively communicable with one of the flow-guiding passages; the second water inlet and the second water outlet are also respectively communicable with one of the flow-guiding passages.
    Type: Grant
    Filed: July 16, 2019
    Date of Patent: July 20, 2021
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventor: Wen-Ji Lan
  • Patent number: 11058030
    Abstract: An apparatus includes a top wall and a bottom wall. The top wall and the bottom wall define and enclose a first fin area; a second fin area; and a flex region joining the first fin area to the second fin area. The flex region is connected in fluid communication with the interior of the first fin area and the interior of the second fin area. The flex region is bent or twisted at a nonzero angle around at least one axis relative to the broadest surfaces of the first and second fin areas.
    Type: Grant
    Filed: April 22, 2019
    Date of Patent: July 6, 2021
    Assignee: International Business Machines Corporation
    Inventors: Shurong Tian, Todd E. Takken
  • Patent number: 11056735
    Abstract: A heat exchanger and battery unit structure is provided for cooling battery units (or cells) where the thermally conductive nature of the battery forms a cooling path. The heat exchanger is in the form of a cooling element provided with an engaging device formed on or attached to an outer surface of the cooling plate for receiving a battery unit (or cell). The interconnection between the battery unit (or cell) and heat exchanger creates a mechanical interlock between the two components that results in improved heat transfer properties between the two components.
    Type: Grant
    Filed: April 3, 2017
    Date of Patent: July 6, 2021
    Assignee: DANA CANADA CORPORATION
    Inventors: John G. Burgers, Michael A. Martin
  • Patent number: 11058033
    Abstract: Receptacle assembly includes a receptacle cage and a thermal-transfer module that is coupled to a thermal side of the receptacle cage. The thermal-transfer module has a base portion and a plurality of heat-transfer fins coupled to the base portion. The thermal-transfer module is configured to absorb thermal energy from a pluggable transceiver in the receptacle cage and transfer the thermal energy through the base portion and to the heat-transfer fins. The receptacle assembly also includes a retention clip configured to hold the thermal-transfer module to the receptacle cage. The retention clip includes a resilient beam that extends across the thermal-transfer module. The resilient beam directly engages at least some of the heat-transfer fins and applies a resilient force against the heat-transfer fins.
    Type: Grant
    Filed: September 25, 2019
    Date of Patent: July 6, 2021
    Assignees: TE CONNECTIVITY CORPORATION, TYCO ELECTRONICS (SHANGHAI) CO., LTD.
    Inventors: Hongqiang Han, Jiwang Jin, Wenyu Liu, Nikhil Shankar, Alex Michael Sharf, Chenxi Wang
  • Patent number: 11047240
    Abstract: CMC components having microchannels and methods for forming microchannels in CMC components are provided. For example, a method for forming microchannels in a CMC component comprises laying up a plurality of body plies for forming a body of the CMC component; laying up a microchannel ply on the plurality of body plies that has at least one void therein for forming at least one microchannel; laying up a cover ply on the microchannel ply to define an outer layer of the CMC component; and processing the laid up body plies, microchannel ply, and cover ply to form the CMC component. In another embodiment, the method comprises applying an additive matrix to the body plies to define at least one microchannel. In still other embodiments, the method comprises machining at least one microchannel in the plurality of body plies.
    Type: Grant
    Filed: May 11, 2017
    Date of Patent: June 29, 2021
    Assignee: General Electric Company
    Inventors: David Alan Frey, Kirk Douglas Gallier, Herbert Chidsey Roberts
  • Patent number: 11051430
    Abstract: An electronic control unit includes a substrate, a plurality of electronic components, and a heat sink. The plurality of electronic components are mounted on the substrate, and include an integrated circuit and a plurality of tall components. The plurality of tall components are taller than the integrated circuit. The heat sink includes a recess collectively accommodating the plurality of tall components, and is provided on a side on which the plurality of tall components are mounted on the substrate.
    Type: Grant
    Filed: April 4, 2016
    Date of Patent: June 29, 2021
    Assignee: DENSO CORPORATION
    Inventor: Shinji Shibata
  • Patent number: 11040372
    Abstract: A light weight component, the light weight component including: a metallic foam core formed into a desired configuration; an external metallic shell applied to an exterior surface of the metallic foam core after it has been formed into the desired configuration; an inlet opening and an outlet opening formed in the external metallic shell in order to provide a fluid path through the metallic foam core; and a thermoplastic material injected into the metallic foam core via the inlet opening.
    Type: Grant
    Filed: April 8, 2019
    Date of Patent: June 22, 2021
    Assignee: RAYTHEON TECHNOLOGIES CORPORATION
    Inventor: Gary D. Roberge
  • Patent number: 11033857
    Abstract: A counter-current cross-flow heat exchanger for heating a first gas and cooling a second gas, includes modules in fluid communication with one another, each module being positioned on a plane, the planes mutually overlapping. Conduits allow entry and exit of the first and second gases into and out of the exchanger. Each module has heat exchange plates, with heating and cooling faces. The plates are orthogonal to the module plane and parallel to define alternating heating and cooling spaces. The first gas crosses each heating space with a direction substantially parallel to the plane of each module and the second gas crosses each cooling space with a direction substantially orthogonal to the plane of each module. The cooling spaces between adjacent modules are in direct fluid communication. The heating spaces between adjacent modules are in fluid communication with one another by conduits/conveyors, creating a serpentine path.
    Type: Grant
    Filed: September 19, 2017
    Date of Patent: June 15, 2021
    Assignee: SAIPEM S.P.A.
    Inventors: Lorenzo Bruno, Rosario Galati, Lino Carlessi
  • Patent number: 11038308
    Abstract: A connector housing includes a housing body having a socket adapted to receive an external electronic module inserted in an insertion direction and a shielding sheet having a first elastic sheet disposed on an inner side of the housing body, a second elastic sheet disposed on an outer side of the housing body, and a first bent portion connected between the first elastic sheet and the second elastic sheet and adapted to be clamped on an edge of the socket. The housing body has an outer wall with a mounting passageway. A free end of the first elastic sheet and/or the second elastic sheet has a pair of lap portions on a pair of sides parallel to the insertion direction. The free end of the first elastic sheet and/or the second elastic sheet is slidably engaged with the mounting passageway in the insertion direction.
    Type: Grant
    Filed: November 8, 2019
    Date of Patent: June 15, 2021
    Assignees: Tyco Electronics (Shanghai) Co. Ltd., Tyco Electronics (Zhuhai) Ltd
    Inventors: Jikang Wei, Hongwen Yang, Shufeng Jia, Qiang Yu, Hongqiang Han
  • Patent number: 11032947
    Abstract: An apparatus includes a coldplate configured to be thermally coupled to a structure to be cooled and to remove thermal energy from the structure. The coldplate includes (i) first and second outer layers having at least one first material and (ii) a third layer embedded in the outer layers and having at least one second material. The first and second materials have different coefficients of thermal expansion (CTEs). The third layer is embedded non-uniformly in the outer layers so that different zones of the coldplate have different local CTEs. The third layer may include openings extending through the second material(s), and projections of the first material(s) from at least one of the first and second outer layers may partially or completely fill the openings. The first and second outer layers may include aluminum or an aluminum alloy, and the third layer may include aluminum silicon carbide or thermal pyrolytic graphite.
    Type: Grant
    Filed: February 17, 2020
    Date of Patent: June 8, 2021
    Assignee: Raytheon Company
    Inventors: Craig H. McCordic, Joseph R. Ellsworth, Todd E. Southard, Ethan S. Heinrich, Dimitry Zarkh
  • Patent number: 11031312
    Abstract: A heat sink comprising a heat exchange device having a large scale morphology over a scale range and a small scale texture over a scale range, wherein at least one of the large scale morphology and the small scale texture has a fractal-like self-similarity over a scale range. The large scale morphology and small scale texture may be independently defined and implemented, or be provided with a transitional range. The large scale morphology may be algorithmically optimized according to a set of geometrically constraints. The small scale texture may be optimized according to aerodynamic parameters and constraints. The heat sink may be dynamically varying, and/or operated in conjunction with a dynamically varying heat transfer medium supply.
    Type: Grant
    Filed: July 17, 2018
    Date of Patent: June 8, 2021
    Assignee: Fractal Heatsink Technologies, LLC
    Inventor: Alexander Poltorak
  • Patent number: 11022383
    Abstract: A thermal-interface-material (TIM)-free thermal management apparatus includes a thermally-conductive unitary structure having an integrated circuit (IC) side and cooling system side, the thermally-conductive unitary structure including a plurality of high aspect ratio micro-pillars or porous structures extending from the IC side and a cooling system extending from the cooling system side. The cooling system may be selected from the group consisting of: a vapor chamber, micro-channel cooler, jet-impingement chamber, and air-cooled heat sink. The cooling system and the plurality of high aspect ratio micro-pillars form part of the same homogenous and thermally-conductive unitary structure.
    Type: Grant
    Filed: June 16, 2016
    Date of Patent: June 1, 2021
    Assignee: TELEDYNE SCIENTIFIC & IMAGING, LLC
    Inventors: Steve Q. Cai, Avijit Bhunia, Tadej Semenic
  • Patent number: 11020884
    Abstract: A solid thermal balancing composite material with lightweight is formed by a reinforced composite material pressured by a molding machine after going through a powder filling equipment. The reinforced composite material is a mixture of inorganic filler powders and polymer adhesives after granulation. The specific gravity of the solid thermal balancing composite material is no greater than 2.0. In addition, the present invention is adjustable in different shapes for various applications of heat dissipation.
    Type: Grant
    Filed: August 12, 2019
    Date of Patent: June 1, 2021
    Assignees: M-Victory Specific Material Co., Ltd., Wha Yueb Technology Co., Ltd.
    Inventors: Ching-I Chou, Yu-Chia Chen
  • Patent number: 11026348
    Abstract: Provided is an electronic device including a metal plate that is exposed on at least one of a plurality of side surfaces of the electronic device so as to absorb heat from a heat generating component that generates heat inside the electronic device and guide the heat to an outside of the electronic device. In addition, an outer surface of the metal plate exposed to the outside is formed further inside the electronic device than a first member and a second member.
    Type: Grant
    Filed: October 1, 2019
    Date of Patent: June 1, 2021
    Assignee: SHARP KABUSHIKI KAISHA
    Inventors: Hiroki Tanabe, Hidenori Kuwajima
  • Patent number: 11013141
    Abstract: A heat sink may include a base having a first surface in a first plane configured to contact a system on chip (SoC) located on a circuit board. The heat sink may include a plurality of heat transfer members connected to and extending from the base. The plurality of heat transfer members are configured to extend along a longitudinal length in a second plane having a first spacing from the first plane. The plurality of heat transfer members respectively include opposing internal walls that define a second spacing between the plurality of heat transfer members. The heat sink may include an enclosure surrounding the plurality of heat transfer members. The enclosure may include a base plate that contacts the base of the heat sink to form a cold-plate. The enclosure may partially surround the length of the heat transfer members, allowing airflow through the enclosure in a cross direction.
    Type: Grant
    Filed: July 12, 2019
    Date of Patent: May 18, 2021
    Assignee: MICROSOFT TECHNOLOGY LICENSING, LLC
    Inventor: Brandon Gary
  • Patent number: 11011451
    Abstract: In an embodiment, a device includes: an integrated circuit die; a redistribution structure over a front-side surface of the integrated circuit die; a socket over the redistribution structure; a mechanical brace over the socket, the mechanical brace having an opening exposing the socket, edge regions of the socket overlapping edge regions of the mechanical brace at the opening; a first standoff screw disposed in the edge regions of the mechanical brace, the first standoff screw physically contacting the socket, the first standoff screw extending a first distance between the socket and the mechanical brace; and a bolt extending through the mechanical brace and the redistribution structure.
    Type: Grant
    Filed: April 4, 2019
    Date of Patent: May 18, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yuan Sheng Chiu, Chih-Kai Cheng, Tsung-Shu Lin
  • Patent number: 11009294
    Abstract: A device for cooling an electrical energy storage unit includes at least one tube exchanger and one plate exchanger, the tube exchanger and the plate exchanger being in fluid communication such as to form a circuit for circulation of a cooling fluid.
    Type: Grant
    Filed: July 20, 2017
    Date of Patent: May 18, 2021
    Assignee: Valeo Systemes Thermiques
    Inventors: Lionel Robillon, Jean Damien Muller, Mohamed Ibrahimi, Alain Pourmarin, Boris Barre
  • Patent number: 11002498
    Abstract: An aluminum alloy fin material for a heat exchanger in the present invention comprises an aluminum alloy having a composition containing Mn: 1.2 to 2.0%, Cu: 0.05 to 0.20%, Si: 0.5 to 1.30%, Fe: 0.05 to 0.5%, and Zn: 1.0 to 3.0% by mass and a remainder comprising Al and an unavoidable impurity, further containing one or two or more of Ti: 0.01 to 0.20%, Cr: 0.01 to 0.20% and Mg: 0.01 to 0.20% by mass as desired, and, after heating in brazing, has a tensile strength of 140 MPa or more, a proof stress of 50 MPa or more, an electrical conductivity of 42% IACS or more, an average grain diameter of 150 ?m or more and less than 700 ?m, and a potential of ?800 mV or more and ?720 mV or less.
    Type: Grant
    Filed: December 28, 2015
    Date of Patent: May 11, 2021
    Assignees: MITSUBISHI ALUMINUM CO., LTD., DENSO CORPORATION
    Inventors: Shigeki Nakanishi, Shohei Iwao, Masakazu Edo, Hayaki Teramoto, Manabu Hasegawa, Michiyasu Yamamoto, Shoei Teshima
  • Patent number: 10998781
    Abstract: A rotating electric machine includes a rotor, a stator, a housing, a plurality of control modules and a joining member. The stator includes a stator coil. The housing accommodates both the rotor and the stator therein. The control modules are capable of supplying multi-phase alternating current to the stator coil and rectifying multi-phase alternating current generated in the stator coil into direct current. The control modules include a first control module and a second control module that are arranged adjacent to each other. The first and second control modules are joined, by the joining member, to be in surface contact with each other.
    Type: Grant
    Filed: March 5, 2019
    Date of Patent: May 4, 2021
    Assignee: DENSO CORPORATION
    Inventors: Ryohei Oba, Nobuo Isogai
  • Patent number: 10993352
    Abstract: A pluggable module assembly includes a housing having a top wall, a bottom wall and sidewalls between the top wall and the bottom wall forming a cavity configured to hold an electrical component therein. The top wall has an opening above the cavity aligned with the electrical component receiving a thermal transfer device that is separate and discrete from the housing. The thermal transfer device transmits heat from the electrical component to fins separated by channels at an upper thermal interface. The upper thermal interface is exposed from above the housing for interfacing with an external heat sink for transferring heat from the thermal transfer device.
    Type: Grant
    Filed: January 8, 2019
    Date of Patent: April 27, 2021
    Assignee: TE CONNECTIVITY CORPORATION
    Inventor: Alan Weir Bucher
  • Patent number: 10980152
    Abstract: A data storage device includes a heat source including a memory, and an enclosure within which the heat source is installed. The data storage device also includes a heat spreader within the enclosure and surrounding the heat source. The data storage device further includes a thermal interface material within the enclosure. The thermal interface material is coupled to the heat source and to the heat spreader, thereby providing a first low thermal resistance path between the heat source and the heat spreader. A phase change material is coupled to the thermal interface material such that the thermal interface material provides a second low thermal resistance path between the heat source and the phase change material.
    Type: Grant
    Filed: November 11, 2019
    Date of Patent: April 13, 2021
    Assignee: SEAGATE TECHNOLOGY LLC
    Inventor: Michael Morgan
  • Patent number: 10976787
    Abstract: This disclosure relates to an external liquid cooling device including at least one radiator, at least one airflow generator, a water block and a mount head module. The at least one airflow generator and the water block are respectively disposed at two adjacent sides of the at least one radiator. The mount head module includes two connectors which are respectively connected to the at least one radiator and the water block via piping. The mount head module and the water block are respectively located at two opposite sides of the at least one radiator.
    Type: Grant
    Filed: January 23, 2019
    Date of Patent: April 13, 2021
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Chien-Liang Lin, Wen-Hsien Lin
  • Patent number: 10980158
    Abstract: An electronic device according to various embodiments of the present disclosure may include: a printed circuit board including one face; at least one electronic component mounted on the printed circuit board; and a conductive shield can structure attached to the one face of the printed circuit board while surrounding the at least one electronic component.
    Type: Grant
    Filed: February 15, 2019
    Date of Patent: April 13, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sungyoung Lee, Changho Kim
  • Patent number: 10980103
    Abstract: A method for cooling power electronics circuits, in which a printed circuit board is produced according to a prescribed circuit board process and is populated with at least one power electronics components. Contact connecting at least one location on at least one metallic conductor track running on a surface of the printed circuit board that includes at least one metal element, which is both electrically conductive and heat-conductive and the physical height of which is designed to be at least as large as that of the at least one power electronics component. A cooling plate is placed in a planar manner onto the at least one power electronics component and/or the at least one metal element.
    Type: Grant
    Filed: March 27, 2019
    Date of Patent: April 13, 2021
    Inventors: Stefan Götz, Eduard Specht
  • Patent number: 10971422
    Abstract: A semiconductor die assembly in accordance with an embodiment of the present technology includes a first semiconductor die, a package substrate underlying the first semiconductor die, an interposer between the package substrate and the first semiconductor die, and a second semiconductor die between the package substrate and the interposer. The semiconductor die assembly further comprises a heat spreader including a cap thermally coupled to the first semiconductor die at a first elevation, and a pillar thermally coupled to the second semiconductor die at a second elevation different than the first elevation. The heat spreader is configured to transfer heat away from the first and second semiconductor dies via the cap and the pillar, respectively. The interposer extends around at least 75% of a perimeter of the pillar in a plane between the first and second elevations.
    Type: Grant
    Filed: August 1, 2019
    Date of Patent: April 6, 2021
    Assignee: Micron Technology, Inc.
    Inventor: Thomas H. Kinsley
  • Patent number: 10971427
    Abstract: Thermal coupling with between an electrical component, such as a CPU, and a heatsink can be provided by a movable heatsink insert separate from the heatsink. This movable heatsink insert can be placed on the electrical component. The heatsink can be thermally coupled to that additional thermal conductor. The heatsink, which is attached to the printed circuit board, is not in direct contact with the electrical component, reducing the likelihood that the heatsink could cause bending of the printed circuit board by pressing down on the electrical component. Further, a spring coupled between the heatsink and the movable heatsink insert can provide further pressure relief such that the heatsink assembly can be attached to an electrical component without applying excessive force to the electrical component.
    Type: Grant
    Filed: February 4, 2019
    Date of Patent: April 6, 2021
    Assignee: Dell Products L.P.
    Inventors: Qinghong He, Edward Davis Geist
  • Patent number: 10969615
    Abstract: An electronic display assembly is provided. The electronic display assembly comprises a backlight module, a transparent plate, a liquid crystal panel, an internal heat exchange path and an external heat dissipation path with ambient air flowing through. The liquid crystal panel is disposed between the transparent plate and the backlight module. The internal heat exchange path comprises a first pathway, a second pathway and a third pathway. The first pathway is arranged between the transparent plate and the liquid crystal panel. The second pathway is arranged between the liquid crystal panel and backlight module. The third pathway is located directly behind the backlight module. The external heat dissipation path carries heat conducted from air flowing through the third pathway.
    Type: Grant
    Filed: February 13, 2020
    Date of Patent: April 6, 2021
    Assignee: DYNASCAN TECHNOLOGY CORP.
    Inventors: Tsun-I Wang, Ching-Chun Wu, Chia-Liang Yang
  • Patent number: 10963024
    Abstract: Electronic devices have a PCB with a heat-generating component (e.g., POP or SOC), a heat sink, and an EMI shielding structure. A combination structure can include a top heat spreader/EMI shield located above and in thermal contact with the POP/SOC top, a bottom heat spreader/EMI shield located below and in thermal contact with the POP/SOC bottom, and a heat-directing component located on the PCB, laterally surrounding a majority of the POP/SOC sides, and between and in thermal contact with the top and bottom heat spreaders. Resulting heat paths for the POP/SOC include one through its top to the top heat spreader, another through its bottom to the bottom heat spreader, and others through its sides through the PCB through the heat-directing component to the top and bottom heat spreaders. The heat-directing component can be a metal horseshoe shaped pad integrally formed onto the PCB.
    Type: Grant
    Filed: July 23, 2018
    Date of Patent: March 30, 2021
    Assignee: Apple Inc.
    Inventors: Jonathan A. Matheson, Vinh H. Diep, Brian L. Chuang, Judith C. Segura, Frank F. Liang, Leanne Bach Lien T. Ly, Kevin Z. Lo, Po W. Chiu, Lukose Ninan, Chong Li
  • Patent number: 10945352
    Abstract: A cooling device of a heating element for an immersion type liquid cooling server, and a manufacturing method for the cooling device. The cooling device comprises: a metal substrate provided on the heating element and covering same. The metal substrate is adjacent to the surface of the heating element. The surface of the metal substrate distant to the heating element comprises a porous metal covering layer located above the heating element and covering same. The porous metal covering layer is exposed on the surface of the metal substrate remote from the heating element and has a thickness of less than 3 mm. By providing a metal substrate having a porous metal covering layer on the surface of a heating element, vaporization cores are improved, the boiling performance of the heating element is improved, and an efficient heat-dissipating effect on the surface of the heating element is achieved.
    Type: Grant
    Filed: April 28, 2017
    Date of Patent: March 9, 2021
    Assignee: Dawning Information Industry (Beijing) Co., Ltd
    Inventors: Weidong Shen, Chen Wang, Hongjie Wu, Xing Li, Jingnan Peng, Zhen Sun, Xintao Cui, Jin Chen
  • Patent number: 10935227
    Abstract: Embodiments may utilize a series of exposed fins, which increase the surface area of the heat sink creating additional air flow. As hotter air rises within the system, cooler is drawn into the heatsink. The fins may be exposed on both sides of the longitudinal axis, allowing cooler air to be drawn towards the longitudinal axis above the heatsink and flow upward. This process may cool the fins. Additionally, the spacing between the fins may have to be wide enough to allow for air to freely enter the heatsink.
    Type: Grant
    Filed: January 4, 2019
    Date of Patent: March 2, 2021
    Assignee: Flurence Bioengineering, Inc.
    Inventors: Dung Duong, Randall Johnson, Nicholas Klase
  • Patent number: 10939538
    Abstract: A circuit board structure includes a circuit board, at least a through hole, and at least a heat dissipating structure. The circuit board has two opposite surfaces. A metal layer is disposed on each of the opposite surfaces of the circuit board. The through hole is disposed in the circuit board, and the through hole penetrates through the circuit board. The heat dissipating structure is disposed in the through hole. The heat dissipating structure includes a first metal block and a second metal block. The first metal block and the second metal block are joined together in the through hole and have an interface.
    Type: Grant
    Filed: June 21, 2020
    Date of Patent: March 2, 2021
    Assignee: Unimicron Technology Corp.
    Inventors: Ming-Hao Wu, Shao-Chien Lee
  • Patent number: 10923435
    Abstract: A semiconductor package includes a substrate having at least one semiconductor chip on a top surface of the substrate; a ground ring, on the top surface of the substrate, surrounding the at least one semiconductor chip; a metal-post reinforced glue wall disposed on the ground ring, surrounding the at least one semiconductor chip; a molding compound surrounding the at least one semiconductor chip, wherein a rear surface of the at least one semiconductor chip is flush with an upper surface of the molding compound; a conductive layer disposed on the molding compound and in direct contact with the rear surface of the semiconductor chip and the metal-post reinforced glue wall; a solder layer disposed on the conductive layer; and a heat sink disposed on the solder layer.
    Type: Grant
    Filed: February 24, 2020
    Date of Patent: February 16, 2021
    Inventors: Shiann-Tsong Tsai, Hsien-Chou Tsai, Hsien-Wei Tsai, Yen-Mei Tsai Huang
  • Patent number: 10914531
    Abstract: The present invention relates to a heat-sink base provided with heat-sink fin portions, it manufacturing method and a motor provided with the heat-sink base. The base is produced by pouring cast metal into a mold cavity to replace a pattern having a predetermined sublimation temperature. The base includes a preformed heat-sink member comprising a plurality of heat-sink fin portions and at least one anchor portion embedded at least partially in the pattern, and a base body comprising an enclosed base portion and a holder portion for receiving and holding the at least one anchor portion. By virtue of the invented method, the heat-sink member having an extremely thin thickness can be mounted on the base body and the overall surface area of the heat-sink base is increased considerably.
    Type: Grant
    Filed: July 11, 2013
    Date of Patent: February 9, 2021
    Assignee: Atieva, Inc.
    Inventor: Chia-Ming Chuang
  • Patent number: 10914539
    Abstract: A heat sink includes an extruded component, a cast component, and an interface layer. The extruded component includes a first aluminum material and is configured to be coupled to a solid state light source. The cast component includes a second aluminum material overmolded onto a portion of the extruded component to form the interface layer. The interface layer is formed of at least one of the first and the second aluminum materials and abuts against and couples the extruded component to the cast component.
    Type: Grant
    Filed: May 15, 2013
    Date of Patent: February 9, 2021
    Assignee: OSRAM SYLVANIA INC.
    Inventor: Thomas Tessnow
  • Patent number: 10910905
    Abstract: The invention relates to an electric motor having a stator and an electronics compartment which receives electric/electronic structural parts. Said electric motor is accommodated in an electronics housing and can be closed by a housing cover. In order to maintain leakage paths and/or air paths between the housing cover and the electric/electronic structural parts, the electric motor has an intermediate insulating part (1) which is made of an electrically insulating plastic and has a supporting part as hard component and at least one soft component as sealing part (14, 25). The soft component is connected cohesively and/or by positive engagement to the hard component. The intermediate insulating part (1) has at least one pressing element (33) by which at least one heat-generating structural part is pressed against a cooling surface. The intermediate insulating part (1) has a hood-shaped support which is made of a hard, electrically insulating plastic.
    Type: Grant
    Filed: March 17, 2015
    Date of Patent: February 2, 2021
    Assignee: Ziehl-Abegg SE
    Inventors: Paul Zechalko, Thorsten Sturm
  • Patent number: 10905030
    Abstract: A system includes a coolant reservoir, a coolant pump, and a heat exchanger. The coolant reservoir is at least in part included in a data center rack and configured to hold a coolant. The coolant pump is configured to pump the coolant to a manifold configured to distribute the coolant to a plurality of different rack mounted devices. The heat exchanger is configured to cool the coolant via an ambient air of a data center.
    Type: Grant
    Filed: July 24, 2019
    Date of Patent: January 26, 2021
    Assignee: Facebook, Inc.
    Inventors: John Edward Fernandes, Jacob Na