Heat Transmitter Patents (Class 165/185)
  • Patent number: 11510336
    Abstract: An electronic device having heat dissipation function is proposed. The electronic device includes: a heating element (60) installed in a casing (C); a heat dissipation means (70) causing an ionic wind to flow into an inner space (S) of the casing (C); and a heat dissipation bridge (95). The heat dissipation bridge (95) exchanges heat with the ionic wind flowing in the inner space (S) by protruding in a direction of the heating element (60) and at least a portion of the heat dissipation bridge is connected to a heat sink and transfers heat received from the heating element (60) to the heat sink. Accordingly, two means of the heat dissipation means (70) and the heat dissipation bridge (95) simultaneously cool the heating element (60), so cooling efficiency is improved.
    Type: Grant
    Filed: July 21, 2020
    Date of Patent: November 22, 2022
    Assignee: LG ELECTRONICS INC.
    Inventors: MinWoo Jeong, Chun Hyuk Ryu, Jongkil Shin, BongJun Kim, Minjae Park
  • Patent number: 11506961
    Abstract: A heat dissipation module includes a base, a cover and a plurality of heat dissipation fins. The cover is disposed on the base and forms an accommodation space with the base. The plurality of heat dissipation fins is disposed in the accommodation space. The cover includes a top, at least one side wall, a first opening and a second opening. The first opening and the second opening are disposed on the top or the at least one side wall. The at least one side wall surrounds the top and is connected to the base. The distances between the plurality of heat dissipation fins and one of the at least one side wall in a first direction are different. A projection apparatus is also provided, which includes a light source module, a light valve, the aforementioned heat dissipation module and a projection lens.
    Type: Grant
    Filed: October 14, 2020
    Date of Patent: November 22, 2022
    Assignee: Coretronic Corporation
    Inventors: Shi-Wen Lin, Wei-Chi Liu, Tsung-Ching Lin
  • Patent number: 11497145
    Abstract: A server (10), a server rack (50) and a data centre (100, 150) are provided. The server (10) includes a housing (12) defining a gaseous flow passage. A plurality of active components (14) and a plurality of passive components (16) are provided in the housing (12). A plurality of liquid cooling devices (18) is attached to respective ones of the active components (14).
    Type: Grant
    Filed: August 7, 2019
    Date of Patent: November 8, 2022
    Assignee: National University of Singapore
    Inventors: Poh Seng Lee, Yong Jie Chen, Matthew Lee Liong Law, Navin Raja Kuppusamy
  • Patent number: 11489216
    Abstract: A method for providing a battery arrangement for a motor vehicle, wherein a battery housing arrangement is provided, including a battery housing having at least one holding section for holding a battery module, a cooling device which provides at least part of a housing floor of the battery housing, and an underride guard which is disposed outside the battery housing at the cooling device such that a gap is created between the cooling device and the underride guard, and a viscous heat conducting element and a battery module are placed inside the holding section such that the heat conducting element is located between the underside of the battery module, which faces the cooling device, and the cooling device.
    Type: Grant
    Filed: December 12, 2019
    Date of Patent: November 1, 2022
    Assignee: AUDI AG
    Inventor: Martin Simon
  • Patent number: 11483942
    Abstract: Ruggedized avionics assemblies for use on kinetically launched space vehicles are disclosed. The avionic assemblies are able to maintain structural integrity and functionality under high acceleration forces generated during kinetic launch, including acceleration forces of >5,000 times Earth's gravity in a single direction of loading. The avionics assembly is ruggedized to withstand this level of acceleration force during launch via a plurality of constraining elements to constrain a plurality of printed circuit boards aligned in parallel to an acceleration vector. Further, a high specific strength and stiffness composition of the plurality of constraining elements aids in supporting the printed circuit boards and preventing them from bending and dislodging electronic components mounted to the printed circuit boards.
    Type: Grant
    Filed: December 18, 2019
    Date of Patent: October 25, 2022
    Assignee: SpinLaunch Inc.
    Inventors: Carl Lawhon, Maxim Clarke, Jonathan Yaney
  • Patent number: 11470748
    Abstract: A modular liquid cooling block is described for cooling high current devices deployed in power flow control systems. The liquid cooling blocks may have separate shower heads which may be configured for direct impingement, indirect impingement, or parallel flow cooling configurations. Voltage isolation of liquid cooling blocks from an enclosure of the power flow control system and from associated equipment enables serial or parallel connected power flow control units to inject substantial reactive power that may be configurable into a power transmission line. Associated power flow control systems are monitored for temperature, flow rate and pressure gradient. Redundant pumps and fan radiators contribute to reliable operation. Automatic shutdown and alarm may be provided.
    Type: Grant
    Filed: September 22, 2020
    Date of Patent: October 11, 2022
    Assignee: Smart Wires Inc.
    Inventors: Haroon Inam, Ali Farahani
  • Patent number: 11469154
    Abstract: An IGBT module with a heat dissipation structure having a specific layer thickness ratio includes a layer of IGBT chips, an upper bonding layer, a circuit layer, an insulating layer, and a heat dissipation layer. The insulating layer is disposed on the heat dissipation layer, the circuit layer is disposed on the insulating layer, the upper bonding layer is disposed on the circuit layer, and the layer of IGBT chips is disposed on the upper bonding layer. A thickness of the insulating layer is less than 0.2 mm, a thickness of the circuit layer is between 1.5 mm and 3 mm, and a thickness ratio of the circuit layer to the insulating layer is greater than or equal to 7.5:1.
    Type: Grant
    Filed: January 17, 2021
    Date of Patent: October 11, 2022
    Assignee: AMULAIRE THERMAL TECHNOLOGY, INC.
    Inventors: Shih-Hsi Tai, Tze-Yang Yeh
  • Patent number: 11449111
    Abstract: A microprocessor loading mechanism, comprising a bolster plate surrounding an aperture, wherein the opening is to receive a microprocessor socket, one or more torsion bars coupled to the bolster plate, and a stud coupled to each of the one or more torsion bars, wherein each stud is to receive a nut to secure a microprocessor package to the microprocessor socket within the aperture and wherein each stud is secured to the bolster plate by each corresponding torsion bar.
    Type: Grant
    Filed: March 30, 2018
    Date of Patent: September 20, 2022
    Assignee: Intel Corporation
    Inventors: Eric W. Buddrius, Ralph V. Miele, Mohanraj Prabhugoud, David Shia, Jeffory L. Smalley
  • Patent number: 11439048
    Abstract: An electronic component housing that internally houses an electronic component includes a portion formed of a resin material and a portion formed of a metallic material. The portion formed of the resin material is a connection side portion opposed to a member as a connection partner of the electronic component housing, or an opposite portion opposed to the connection side portion. The electronic component housing further includes an electromagnetic shield member that covers an outer surface of the portion formed of the resin material.
    Type: Grant
    Filed: March 12, 2018
    Date of Patent: September 6, 2022
    Assignee: Nissan Motor Co., Ltd.
    Inventor: Kimihiro Ono
  • Patent number: 11432422
    Abstract: An electrical device including a skeleton-like frame structure and at least one electrical module is provided. The skeleton-like frame structure has a low rigidity, while the at least one electrical module provides an increased rigidity when mounted.
    Type: Grant
    Filed: October 25, 2019
    Date of Patent: August 30, 2022
    Assignee: ROHDE & SCHWARZ GMBH & CO. KG
    Inventors: Stefan Aman, Johannes Steffens
  • Patent number: 11414553
    Abstract: A fouling-proof structure is applicable to synthetic leather or fabric and it includes an alcohol-resistant layer; and a water-based fouling-proof layer disposed on the alcohol-resistant layer, wherein the alcohol-resistant layer is formed by curing an alcohol-resistant combination, and the alcohol-resistant combination comprises polyurethane resin, wherein the water-based fouling-proof layer is formed by curing a water-based fouling-proof combination, and the water-based fouling-proof combination comprises polyurethane resin, water, polymerized siloxanes, water-based PTFE and silicone oil.
    Type: Grant
    Filed: March 6, 2020
    Date of Patent: August 16, 2022
    Assignee: JANTEC CORP.
    Inventors: Ching-Hsiang Chang, Kuo-Hsing Yeh, Chun-Chieh Wang
  • Patent number: 11410909
    Abstract: A fluid channel for a power semiconductor module includes a die carrier configured to carry a plurality of semiconductor dies on a first side, a plurality of cooling elements arranged on a second side of the die carrier opposite the first side, and a channel wall arranged opposite the second side of the die carrier and forming a cavity. The cooling elements are arranged in the cavity. The cooling elements are attached to the die carrier at attachment points. A majority of the attachment points are positioned vertically in alignment with positions of the semiconductor dies.
    Type: Grant
    Filed: November 24, 2020
    Date of Patent: August 9, 2022
    Assignee: Infineon Technologies AG
    Inventors: Christian Schweikert, Alexander Kospach, Sebastian Paul Hans Moeller, Benedikt Rabl
  • Patent number: 11376649
    Abstract: The present invention discloses a method for preparing an evaporator for reducing water condensing capacity and an evaporator. The preparation method comprises steps of: step A: selecting fins; step B: stacking; step C: arranging tubes; and, step D: expanding tubes. In accordance with the present invention, the existing fins and devices can be used to produce an evaporator in which the distance between two adjacent fins satisfies the requirements of the freezing operation, ensuring the normal operation of an air conditioner when the refrigeration temperature is below 0° C.
    Type: Grant
    Filed: March 27, 2020
    Date of Patent: July 5, 2022
    Assignee: Wuyi University
    Inventor: Min Wu
  • Patent number: 11380946
    Abstract: A coolant includes a refrigerant, a porous plate-shaped heat insulator, and an enclosure in which the refrigerant and the heat insulator are enclosed in a sealed state, and the heat insulator has a thermal conductivity per unit area of 300 W/(K·m2) or less and a thickness equal to or greater than 0.5 mm and equal to or less than 10.0 mm.
    Type: Grant
    Filed: September 13, 2018
    Date of Patent: July 5, 2022
    Assignees: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., AUTONETWORKS TECHNOLOGIES, LTD.
    Inventors: Koma Numata, Masatoshi Majima, Kazuki Okuno, Hiroki Hirai, Tetsuji Tanaka, Makoto Higashikozono, Junichi Ono
  • Patent number: 11375607
    Abstract: The disclosed technology relates to a power supply circuit that utilizes a double-sided printed circuit board (PCB) that has a first surface and a second surface. The second surface is disposed opposite the first surface. Mounted on the first surface is a first power stage and a first inductor. Mounted on the second surface is a second power stage and a second inductor. The second power stage is disposed opposite the first power stage. The second inductor is disposed opposite the first inductor.
    Type: Grant
    Filed: August 26, 2019
    Date of Patent: June 28, 2022
    Assignee: APPLE INC.
    Inventors: Kejiu Zhang, Sunil M. Akre
  • Patent number: 11375639
    Abstract: A thermal management device includes a single contiguous component. The single contiguous component includes a first portion made of a first thermally conductive plastic, and a second portion extending away from the first portion. The second portion is made of a second thermally conductive plastic. The second thermally conductive plastic is different than the first thermally conductive plastic. The second portion has a greater hardness than the first portion.
    Type: Grant
    Filed: June 3, 2019
    Date of Patent: June 28, 2022
    Assignee: TCPOLY INC.
    Inventors: Thomas Lloyd Bougher, Matthew Kirby Smith
  • Patent number: 11370057
    Abstract: A friction welding machine for radiating fins is disclosed, which mainly uses a moving unit to drive a friction joint unit to approach the plurality of radiating fins, and a friction rod provided in the moving unit rotates at a high speed to penetrate the radiating fins. The radiating fins are then welded together through the heat generated by high-speed rotation friction to achieve the purpose of improving the welding quality of the radiating fins and reducing the cost.
    Type: Grant
    Filed: November 30, 2020
    Date of Patent: June 28, 2022
    Assignee: TIANLE INTERNATIONAL CO., LTD.
    Inventor: Li-Huang Hsu
  • Patent number: 11369046
    Abstract: An electrical controller includes a housing, wherein the housing has cooling air openings on two different housing sides. A heat sink is arranged inside the housing, in particular so as to be protected against contact, and forms a cooling air channel, wherein the cooling air channel runs between the cooling air openings of the different housing sides. An electrically insulating holding element is designed to mechanically fix the heat sink inside the housing in a manner electrically insulated from the housing. A number of components to be cooled are provided, wherein the components are thermally conductively coupled to the heat sink and are held by the heat sink.
    Type: Grant
    Filed: April 18, 2018
    Date of Patent: June 21, 2022
    Assignee: Lenze Automation GmbH
    Inventors: Christof Schneggenburger, Bernhard Laeng, Alex Itten, Tobias Diefenbacher
  • Patent number: 11369047
    Abstract: A heat sink for use with a heat generating component such as an electronic power module comprises a first substrate having a serpentine slot, a second substrate secured to a first side of the first substrate to form a combined substrate, surfaces of the first and second substrates at least partially forming a serpentine passageway within the combined substrate for containing a fluid. The serpentine passageway has a non-circular cross-sectional shape.
    Type: Grant
    Filed: May 20, 2019
    Date of Patent: June 21, 2022
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: Paul J. Grosskreuz, Jeffrey W. Dujmovic, Avijit Bhunia, Seongchul Jun
  • Patent number: 11355411
    Abstract: A heat sink including a heat sink body having a heat-absorbing surface that absorbs heat transferred from a heat-generating body, and a heat-dissipating surface that externally radiates the heat; a holding member that is held against the heat-absorbing surface; and a fixation portion that is provided on the heat sink body, that fixes the holding member so as to be incapable of coming loose from the heat sink body, and that suppresses displacement in a planar direction in which the heat-absorbing surface extends.
    Type: Grant
    Filed: February 4, 2019
    Date of Patent: June 7, 2022
    Assignee: NEC Platforms, Ltd.
    Inventor: Naoki Sakakibara
  • Patent number: 11355284
    Abstract: The invention relates to a cooling device for cooling a power component, the cooling device having a one-piece cooling housing with a base, a first end face, a second end face, a first lateral face, and a second lateral face, which define a receiving area for receiving the power component. The cooling device further includes an inlet for supplying a cooling medium, an outlet for discharging a cooling medium, a first cooling channel, a second cooling channel, a third cooling channel, and a fourth cooling channel. The first cooling channel is arranged on the first end face, the second cooling channel is arranged on the second end face, the third cooling channel is arranged on the first lateral face, the fourth cooling channel is arranged on the second lateral face, and the first and the second cooling channel are each fluidically connected to the third and fourth cooling channel.
    Type: Grant
    Filed: January 17, 2019
    Date of Patent: June 7, 2022
    Assignee: Robert Bosch GmbH
    Inventors: Wolfram Kienle, Alexandre Lehr
  • Patent number: 11348856
    Abstract: A memory sub-system can include multiple memory devices and a thermal cooling element. The thermal cooling element includes a bottom surface that is coupled to a top surface of each of the memory devices. Furthermore, the thermal cooling element further has a top surface that includes a protrusions that extend above the top surface of the thermal cooling element to dissipate heat that is generated from the memory devices.
    Type: Grant
    Filed: December 20, 2019
    Date of Patent: May 31, 2022
    Assignee: Micron Technology, Inc.
    Inventor: Rolf Thornton Munson
  • Patent number: 11343940
    Abstract: A cold plate that is configurable and for a datacenter liquid cooling system is disclosed. The cold plate includes a first section, a second section, and an intermediate layer, which is changeable and has first channels to enable flow of a coolant through the intermediate layer, and has second channels or at least one adapted second channel to concentrate the coolant or the flow of the coolant to at least one area within the configurable cold plate corresponding to at least a heat generating feature of an associated computing device.
    Type: Grant
    Filed: August 27, 2020
    Date of Patent: May 24, 2022
    Assignee: NVIDIA CORPORATION
    Inventor: Ali Heydari
  • Patent number: 11343945
    Abstract: A combined liquid and air cooling system is provided over a printed circuit board (PCB) of an electronic device, where the PCB includes an integrated circuit package including an application specific integrated circuit (ASIC) die and a plurality of high bandwidth memory (HBM) modules located proximate the ASIC die, and the combined liquid and air cooling system includes a liquid cooling system located over the integrated circuit package and an air cooling system integrated with the liquid cooling system and a portion of the PCB. The system operates in a normal mode, where both liquid and air cooling systems provide cooling to components of the PCB, and a fail-safe mode, where the liquid cooling system is not operating (e.g., due to a detected condition) but the air cooling system operation is adjusted such that it provides sufficient cooling to PCB components which facilitates continuous operation of the electronic device.
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: May 24, 2022
    Assignee: CISCO TECHNOLOGY, INC.
    Inventors: M. Baris Dogruoz, Joel Goergen
  • Patent number: 11337299
    Abstract: An electronic assembly has a printed circuit board with first and second component sides. A cooling element on the first component side is cooled by forced convection produced by a convection unit. A majority of electronic components are arranged on the second component side. Non-current-conducting plated-through holes are used to transport thermal energy generated by an electronic component from the second component side to the first component side. The thermal energy can be transported away from the printed circuit board and dissipated by means of the forced convection. A corresponding method for dissipating heat from an electronic assembly is also disclosed.
    Type: Grant
    Filed: January 29, 2020
    Date of Patent: May 17, 2022
    Assignee: Siemens Aktiengesellschaft
    Inventors: Fabian Diepold, Alexander Kiesel, Benno Weis, Johannes Fürst
  • Patent number: 11335964
    Abstract: A cold plate for a battery module comprising a plurality of cells that produces heat as charging and discharging is disclosed. The cold plate includes a plurality of first fins distributed in a first subarea of the cold plate; and a plurality of second fins distributed in a second subarea of the cold plate; wherein a second fin coverage of the plurality of second fins distributed in the second subarea is smaller than a first fin coverage of the plurality of first fins distributed in the first subarea when an amount of heat absorption of the second subarea from the plurality of cells is greater than an amount of heat absorption of the first subarea from the plurality of cells.
    Type: Grant
    Filed: December 4, 2019
    Date of Patent: May 17, 2022
    Assignee: National Chung-Shan Institute of Science and Technology
    Inventors: Fu-Min Fang, Kuo-Kuang Jen, Gwo-Huei You, Kuo-An Liang
  • Patent number: 11326837
    Abstract: A heat exchanger adapted to support a plurality of battery cells on the outer surface thereof is disclosed. The heat exchanger includes first and second plates disposed in opposed, facing relation to one another such that portions of the inner surface of the first and second plates are spaced apart from one another. A manifold region is enclosed between the first and second plates for receiving an incoming heat transfer fluid. A main fluid flow region is enclosed between the first and second plates and is configured for receiving heat transfer fluid discharged from the manifold region and transmitting the heat transfer fluid through the heat exchanger to an outlet port. At least one bypass port for establishing fluid communication between the manifold region and the main fluid flow region is disposed at a location within the manifold region that is upstream of the manifold region outlet end.
    Type: Grant
    Filed: June 19, 2019
    Date of Patent: May 10, 2022
    Assignee: Dana Canada Corporation
    Inventors: Farbod Vakilimoghaddam, Jiang Feng Yu
  • Patent number: 11328975
    Abstract: A semiconductor device including a substrate, a semiconductor package, a plurality of pillars and a lid is provided. The semiconductor package is disposed on the substrate and includes at least one semiconductor die. The plurality of pillars are disposed on the semiconductor package. The lid is disposed on the substrate and covers the semiconductor package and the plurality of pillars. The lid includes an inflow channel and an outflow channel to allow a coolant to flow into and out of a space between the substrate, the semiconductor package, the plurality of pillars and the lid. An inner surface of the lid, which faces and overlaps the plurality of pillars along a stacking direction of the semiconductor package and the lid, is a flat surface.
    Type: Grant
    Filed: July 29, 2020
    Date of Patent: May 10, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Hua Yu, Chun-Hui Yu, Jeng-Nan Hung, Kuo-Chung Yee, Po-Fan Lin
  • Patent number: 11320876
    Abstract: A portable information handling system housing has a handle to aid an end user in carrying of the system. A heat pipe loop passes through the handle and couples to a processing component heat sink to transfer excess thermal energy from within the housing to the handle for rejection to the ambient environment. Thermal wax disposed in the handle stores energy with a phase change from a solid to a liquid state. A color indicator disposed on the handle provides an end user with an indication of a temperature of the handle.
    Type: Grant
    Filed: December 7, 2020
    Date of Patent: May 3, 2022
    Assignee: Dell Products L.P.
    Inventors: Travis C. North, Jace W. Files, John Trevor Morrison
  • Patent number: 11317537
    Abstract: An electronic device includes a body having a receiving housing and an opening, a function module disposed in the receiving housing, a transmission module configured to transmit a signal between a first end of the transmission module and a second end of the transmission module, and a heat dissipation module disposed along the transmission module. The first end of the transmission module is located in the receiving housing, and the second end of the transmission module is located outside the receiving housing. The heat dissipation module is configured to transfer heat generated by the function module to the second end of the transmission module.
    Type: Grant
    Filed: March 27, 2020
    Date of Patent: April 26, 2022
    Assignee: LENOVO (BEIJING) CO., LTD.
    Inventor: Fuxing Ma
  • Patent number: 11316439
    Abstract: An inverter has at least three phases for supplying current to an electrical machine. The inverter also has a control unit and at least one power output stage connected to the control unit on an input side. The control unit is configured to generate pulse-width-modulated control signals for activating the power output stage. The inverter further has a heat sink and, for each phase, an intermediate circuit capacitor and a semiconductor switch half bridge. The heat sink has a flat thermal contact surface. The thermal contact surface is connected in a thermally conductive manner to the control unit and to the semiconductor switch half bridges. The heat sink has a recess for each of the intermediate circuit capacitors, and the intermediate circuit capacitors are each arranged in one of the recesses in the heat sink.
    Type: Grant
    Filed: December 13, 2018
    Date of Patent: April 26, 2022
    Assignee: Robert Bosch GmbH
    Inventors: Stephan Binhack, Jochen Kurfiss
  • Patent number: 11310937
    Abstract: Systems and methods for chip cooling with near edge jets in a direct liquid cooled module are disclosed. One of the functions of a direct liquid cooled module is to provide cooling liquid to components located on a chip. Jet impingement directly onto the back side of a chip is one cooling method that can provide more efficient cooling. An orifice plate includes an array of small diameter holes that correspond to high velocity jet locations and large diameter holes for the insertion of tubes to connect to lower pressure cavities.
    Type: Grant
    Filed: May 29, 2020
    Date of Patent: April 19, 2022
    Assignee: Google LLC
    Inventors: Jeremy Rice, Jeffrey Scott Spaulding, Evan Fraisse
  • Patent number: 11306980
    Abstract: A heat sink includes a bottom plate, a liquid barrier structure and a microstructure used for heat dissipation. The liquid barrier wall is arranged on the bottom plate. The liquid barrier wall is closed on the bottom plate to form a container. The microstructure for heat dissipation is arranged in the container and includes porous materials or 3D-structures with small sizes.
    Type: Grant
    Filed: September 24, 2020
    Date of Patent: April 19, 2022
    Assignees: Inventec (Pudong) Technology Corporation, INVENTEC CORPORATION
    Inventors: Kai-Yang Tung, Hung-Ju Chen
  • Patent number: 11310905
    Abstract: Provided is a memory device. The memory device includes a module board on which one or more semiconductor devices are disposed and a conductive plate mounted on a first side of the module board. The conductive plate includes a shielding region and a non-shielding region. A pad is disposed in the shielding region of the conductive plate.
    Type: Grant
    Filed: March 18, 2020
    Date of Patent: April 19, 2022
    Assignee: SAMSUNG ELECTRONICS CO, LTD.
    Inventors: Chung Hyun Ryu, In Sub Kwak, Min Woo Gu
  • Patent number: 11302599
    Abstract: A heat dissipation device may be formed as a thermally conductive structure having at least one thermal isolation structure extending at least partially through the thermally conductive structure. The heat dissipation device may be thermally connected to a plurality of integrated circuit devices, such that the at least one thermal isolation structure is positioned between at least two integrated circuit devices. The heat dissipation device allows for heat transfer away from each of the plurality of integrated circuit devices, such as in a z-direction within the thermally conductive structure, while substantially preventing heat transfer in either the x-direction and/or the y-direction within the thermally isolation structure, such that thermal cross-talk between integrated circuit devices is reduced.
    Type: Grant
    Filed: April 19, 2018
    Date of Patent: April 12, 2022
    Assignee: Intel Corporation
    Inventors: Feras Eid, Adel Elsherbini, Johanna Swan
  • Patent number: 11303059
    Abstract: The present disclosure provides an electrical connector comprising: an electrical connector housing comprising an upper surface, a lower surface, and two opposite sidewalls; at least one positioning component disposed on an upper surface of the electrical connector housing; a plurality of heat sinks are disposed on the upper surface of the electrical connector housing; the plurality of the heat sinks are respectively disposed on two sides of the corresponding positioning component; each heat sink comprises at least one securing groove; the securing grooves of the heat sinks disposed correspondingly; the plurality of securing grooves correspond to the positioning components; and a securing structure is secured to the at least one the positioning component and the two sidewalls of the electrical connector housing. The securing structure presses the plurality of the heat sinks against the upper surface of the electrical connector housing.
    Type: Grant
    Filed: September 22, 2020
    Date of Patent: April 12, 2022
    Assignee: DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD
    Inventors: BaiYu Duan, Zhen Luo, XiaoKai Wang, XiaoPing Wu
  • Patent number: 11287862
    Abstract: The invention relates to a cooling system for a computer system, said computer system comprising at least one unit such as a central processing unit (CPU) generating thermal energy and said cooling system intended for cooling the at least one processing unit and comprising a reservoir having an amount of cooling liquid, said cooling liquid intended for accumulating and transferring of thermal energy dissipated from the processing unit to the cooling liquid. The cooling system has a heat exchanging interface for providing thermal contact between the processing unit and the cooling liquid for dissipating heat from the processing unit to the cooling liquid. Different embodiments of the heat exchanging system as well as means for establishing and controlling a flow of cooling liquid and a cooling strategy constitutes the invention of the cooling system.
    Type: Grant
    Filed: February 20, 2020
    Date of Patent: March 29, 2022
    Assignee: Asetek Danmark A/S
    Inventor: André Sloth Eriksen
  • Patent number: 11287171
    Abstract: Heat switches are presented herein for controlling a flow of heat between thermal stages of a cryostat. In one aspect, a heat switch for a cryostat includes a thermal linkage configured to simultaneously contact a first thermal stage and a second thermal stage of the cryostat and define a thermal pathway therebetween. The thermal linkage includes a superconducting element disposed along a portion of the thermal pathway that is capable of transitioning between a superconducting state and a non-superconducting state. A thermal conductivity of the superconducting state is lower than a thermal conductivity of the non-superconducting state. Other types of heat switches are presented, including methods for controlling a flow of heat between thermal stages of a cryostat.
    Type: Grant
    Filed: July 5, 2018
    Date of Patent: March 29, 2022
    Assignee: Rigetti & Co, LLC
    Inventors: Jean-Philip Paquette, Damon Stuart Russell
  • Patent number: 11291140
    Abstract: A heat sink assembly includes a plate stack including fin plates and spacer plates with bottom edges forming a compliant thermal interface configured to interface with an electrical component. Upper edges of the fin plates are located above the spacer plates to form airflow channels between the fin plates. The heat sink assembly includes a support frame supporting the fin plates and the spacer plates in the plate stack. The support frame includes a spring support member engaging a spring element to locate the spring element relative to the support frame. The spring element engages the fin plates and the spacer plates to bias the fin plates and the spacer plates in a first biasing direction generally toward the electrical component to press the bottom edges of the fin plates and the spacer plates against the electrical component.
    Type: Grant
    Filed: July 13, 2020
    Date of Patent: March 29, 2022
    Assignee: TEC CONNECTIVITY SERVICES GmbH
    Inventors: Alan Weir Bucher, Leo Joseph Graham
  • Patent number: 11274859
    Abstract: Examples of heat exchanger systems for active radiative cooling are described. In one example, the system includes a heat exchanger and a spectrally selective surface material on at least one surface of the heat exchanger. The spectrally selective surface material exhibits high reflectivity at shorter wavelengths and high emissivity at longer wavelengths. The system can also include an active cooling system in some cases to actively transfer heat to the heat exchanger. The use of spectrally selective surfaces that operate at temperatures exceeding that of the outdoor ambient for which convective losses augment radiation losses have advantages over passive cooling, such as but not limited to: providing a better match to cooling loads, reducing the heat rejection surface area required to achieve a desired cooling rate, and increasing the heat transferred to deep space through the atmospheric window so as to simultaneously cool infrastructure, devices, buildings, and Earth.
    Type: Grant
    Filed: December 10, 2018
    Date of Patent: March 15, 2022
    Assignee: UNIVERSITY OF KANSAS
    Inventor: Theodore L. Bergman
  • Patent number: 11277945
    Abstract: This invention discloses a rackless modular power electronic system that optimizes thermal management, modularity, manufacturability, transportation, and installation. Such a power electronic converter system consists of one or more modular power electronic converters mounted one-on-top-of-another and/or one-next-to-another through mounting units, such as screws, nuts and bolts. Each modular power electronic converter is built with a case with heat-dissipating fins on the exterior surface and with vertical and horizontal mounting mechanisms, such as holes, bolts, nuts and screws, which are aligned vertically and horizontally, respectively, for easy mounting. One or more electric fans can be mounted to the system to enhance heat dissipation. Possible applications include any field that adopts power electronic converters, e.g., in wind power, solar power, storage systems, home appliances, IT equipment, motor drives, electric vehicles, more-electric aircraft, and all-electric ships.
    Type: Grant
    Filed: December 4, 2020
    Date of Patent: March 15, 2022
    Inventor: Qingchang Zhong
  • Patent number: 11268909
    Abstract: In one embodiment, an apparatus includes a module for use in installing a heatsink, the module comprising a fastener, a first indicator member comprising a first visual indicator surface, and a second indicator member comprising a second visual indicator surface, the first and second indicator members defining an opening for receiving the fastener. The first visual indicator surface is visible when the fastener is not fully installed and the second visual indicator surface is visible when the fastener is fully installed. A method for installing the heatsink with the module is also disclosed herein.
    Type: Grant
    Filed: October 23, 2018
    Date of Patent: March 8, 2022
    Assignee: CISCO TECHNOLOGY, INC.
    Inventors: Le Gao, Yang Sun, Rudong Shi, Bruce Chen
  • Patent number: 11266044
    Abstract: An electronic control device includes a heating element, a substrate, and a housing. The heating element includes an electronic component. The heating element is mounted to the substrate. The substrate is fixed to the housing via a substrate fixing portion. The housing includes a plurality of projecting portions projecting to the substrate side from a reference surface. The plurality of projecting portions have mutually different heights from the reference surface. The reference surface is a surface opposing the substrate and a reference of a height of the housing. The projecting portion highest in the height from the reference surface among the plurality of projecting portions is in contact with a surface of the substrate via a heat dissipation member. The surface of the substrate is on an opposite side of a surface where the heating element is mounted.
    Type: Grant
    Filed: October 12, 2018
    Date of Patent: March 1, 2022
    Assignee: Hitachi Astemo, Ltd.
    Inventors: Isamu Yoshida, Masaru Kamoshida, Toshikazu Shigyo, Shiro Yamashita
  • Patent number: 11262821
    Abstract: A portable information handling system rejects excess thermal energy from within a housing by blowing a cooling airflow with a cooling fan across first and second sets of cooling fins and out an exhaust. The cooling fins have an interleaved position with higher impedance and a separated position with a lower impedance that can increase cooling airflow. In one example embodiment, a central processing unit couples to a first circuit board and the first set of cooling fins and a graphics processor couples to a second circuit board and the second set of cooling fins so that movement of the circuit boards moves the cooling fins between the interleaved and separated positions.
    Type: Grant
    Filed: December 7, 2020
    Date of Patent: March 1, 2022
    Assignee: Dell Products L.P.
    Inventors: Travis C. North, Jace W. Files, John Trevor Morrison
  • Patent number: 11262140
    Abstract: A heat sink includes a heat sink body having a plurality of stacked fins and a mounting base including a heat dissipation plate. A first surface of the heat dissipation plate is connected to a lower portion of the heat sink body. A protrusion protruding away from the heat sink body is disposed on a portion of a second surface of the heat dissipation plate opposite to the first surface. The protrusion is formed by stamping or bending the heat dissipation plate away from the heat sink body from the first surface of the heat dissipation plate.
    Type: Grant
    Filed: September 30, 2019
    Date of Patent: March 1, 2022
    Assignees: Tyco Electronics (Shanghai) Co. Ltd., Tyco Electronics AMP Guangdong Ltd.
    Inventors: WenYu Liu, Hongqiang Han, Jinsheng Lai, Yan Lee, Lei Liu
  • Patent number: 11264306
    Abstract: Structural combinations of TIMs and methods of combining these TIMs in semiconductor packages are disclosed. An embodiment forms the structures by selectively metallizing a backside of a semiconductor chip (chip) on chip hot spots, placing a higher performance thermal interface material (TIM) on the metallized hot spots, selectively metalizing an underside of a lid in one or more metalized lid locations, and assembling a lid over the backside of the chip to create an assembly so that metalized lid locations are in contact with the higher performance TIMs. A lower performance TIM fills the region surrounding the higher performance TIM on the underside of the lid enclosing the chips. Disclosed are methods of disposing both solid and dispensable TIMs, curing and not curing the thermal interface, and structures to keep the TIMs in place while assembly the package and compressing dispensable TIMs.
    Type: Grant
    Filed: September 27, 2019
    Date of Patent: March 1, 2022
    Assignee: International Business Machines Corporation
    Inventors: Kamal K. Sikka, Piyas Bal Chowdhury, James J. Kelly, Jeffrey Allen Zitz, Sushumna Iruvanti, Shidong Li
  • Patent number: 11262815
    Abstract: Systems, apparatuses, and methods described herein provide heat sinks that can be incorporated into chassis, yet be compatible with edge devices that contain many different combinations of hardware that can be arranged in many different ways on circuit boards. In one example, a pattern of fittings on an interior-facing side of the heat sink are configured to mate with fittings on a first side of an adapter pedestal. A second side of the adapter pedestal is configured to thermally couple with an electronic component housed within the chassis when the heat sink is fully seated and the pedestal is properly coupled to the heat sink.
    Type: Grant
    Filed: November 1, 2019
    Date of Patent: March 1, 2022
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Chanh V. Hua, Sunil Rao Ganta Papa Rao Bala
  • Patent number: 11259410
    Abstract: A three-dimensional molded circuit component, includes: a base member which includes a metal part and a resin part; a circuit pattern which is formed on the resin part; and a mounted component which is mounted on the base member, and is electrically connected to the circuit pattern. The resin part includes a resin thin film as a portion thereof, which includes a thermoplastic resin, of which a thickness is in the range of 0.01 mm to 0.5 mm, and which is formed on the metal part. The mounted component is arranged on the metal part via the resin thin film.
    Type: Grant
    Filed: October 25, 2018
    Date of Patent: February 22, 2022
    Assignee: MAXELL, LTD.
    Inventors: Atsushi Yusa, Satoshi Yamamoto, Akiko Kito, Hironori Ota, Hideto Goto, Naoki Usuki
  • Patent number: 11252841
    Abstract: The heat sink with slotted pin fins includes a thermally conductive base and a plurality of pin fins, which may be substantially cylindrical. Each pin fin has axially opposed upper and lower ends, the lower ends being attached to the base. Each of the pin fins is formed of a thermally conductive material and extends from the base. Each of the pin fins has a slot formed therein extending both diametrically and axially through the pin fin, such that a surrounding fluid medium can flow through the slot formed through pin fin, thus reducing the drag force on the surrounding fluid medium as it impinges upon and flows through the pin fins, increasing the rate of thermal transfer.
    Type: Grant
    Filed: February 18, 2021
    Date of Patent: February 15, 2022
    Assignee: GIFTEDNESS AND CREATIVITY COMPANY
    Inventor: Sultan M S M Z Alhamed Alshareef
  • Patent number: 11252842
    Abstract: A composite pin fin heat sink configured to dissipate heat generated by a heating element including a background region and a hot spot region having a higher temperature than the background region while the heating element is generating heat, the heat sink including a base plate having a first surface and a second surface, the first surface being configured to contact the heating element; and an array of pin fins protruding from the second surface and arranged at regular intervals. The base plate and the array of pin fins are divided into a first heat sink region corresponding to the hot spot region of the heating element, and a second heat sink region corresponding to the background region of the heating element. The first heat sink region is made of a material having a higher thermal conductivity than a material of which the second heat sink region is made.
    Type: Grant
    Filed: October 13, 2020
    Date of Patent: February 15, 2022
    Assignee: Pusan National University Industry-University Cooperation Foundation
    Inventors: Ji Hwan Jeong, Danish Ansari