Heat Dissipating Device
A heat dissipating device includes a heat conducting member and a coolant storing unit. The heat conducting member includes a surrounding wall that defines an internal space and that is adapted to be placed in contact with a heat source, and a plurality of heat conducting plates that are spacedly disposed in the internal space, that are connected to the surrounding wall, and that cooperate with the surrounding wall to define a plurality of flow channels. The coolant storing unit stores a coolant and is in fluid connection with the heat conducting member. The flow channels extend upwardly, and the coolant flows along the flow channels when the heat of the heat source is transmitted to the coolant.
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This application claims priority of Taiwanese application no. 101115573, filed on May 2, 2012.
BACKGROUND OF THE INVENTION1. Field of the Invention
The present invention relates to a heat dissipating device.
2. Description of the Related Art
Referring to
The object of the present invention is to provide a heat dissipating device for dissipating heat from a heat source with greater efficiency.
According to the present invention, there is provided a heat dissipating device. The heat dissipating device includes a heat conducting unit, which includes a heat conducting member made from a heat conducting material. The heat conducting member includes a surrounding wall that defines an internal space and that is adapted to be placed in contact with the heat source, and a plurality of heat conducting plates that are spacedly disposed in the internal space, that are connected to the surrounding wall, and that cooperate with the surrounding wall to define a plurality of flow 313.
The heat dissipating device further includes a coolant storing unit for storing a coolant and in fluid connection with the heat conducting member.
The heat conducting unit is disposed to extend upwardly such that the flow channels extend upwardly, and the coolant flows along the flow channels of the heat conducting unit when the heat of the heat source is transmitted to the coolant through the heat conducting unit.
Other features and advantages of the present invention will become apparent in the following detailed description of the preferred embodiments with reference to the accompanying drawings, of which:
Referring to
Referring to
Referring to
When in use, the heat source 9 is placed in contact with the surrounding wall 311 of the heat conducting member 31. The coolant is in the form of a liquid when in a cooled state and is received in the module 41 that is placed horizontally. When the heat of the heat source 9 is transferred via the heat conducting member 31 to the module 41 that is placed horizontally by conduction, the coolant will absorb the heat and transform from being in a liquid form to a gaseous form. The coolant in the gaseous form then moves up along the flow channels 313 of the heat conducting member 31 from the second coolant storage member 412b of the module 41 that is placed horizontally into the first coolant storage member 412a of the other module 41, and then enters the first coolant storage member 411a of the other module 41 through the plurality of conduit members 413. As the coolant is passing through the conduit members 413, the heat will be dissipated by the heat dissipating fins 414 and the gaseous coolant will transform from the gaseous form back into the liquid form and then enters the first coolant storage member 411a. The liquid coolant then enters the first coolant storage member 411b of the module 41 that is placed horizontally through the tubes 415, enabling the coolant to flow between the heat conducting member 31 and the two modules 41. To sum up, the coolant circulates in the direction of the second coolant storage member 412b, the flow channels 313 (see
By virtue of the design mentioned above, the heat dissipating device 2 provides enough space for the coolant to transform between gaseous and liquid forms, and enables the coolant to circulate between the heat conducting member 31 and the modules 41, thereby increasing the efficiency of transformation of the coolant between gaseous and liquid forms and increasing the efficiency of heat dissipation.
The second preferred embodiment of the heat dissipating device 2 according to this invention is illustrated in
When the heat of the heat source 9 is conducted from the heat conducting member 31 to the modules 41, the liquid coolant will absorb the heat and become gaseous coolant. The gaseous coolant will move upwards from the second coolant storage members 412, enters the flow channels 313 of the heat conducting member 31 via the first coolant storage members 411, and circulates in the flow channels 313 by passing through the groove 316 of the cover body 314. When the gaseous coolant is flowing in the flow channels 313, the heat of the gaseous coolant is dissipated by the heat dissipating plates 315, the gaseous coolant becomes a liquid coolant and flows downwards towards the first coolant storage members 411. The liquid coolant then flows back into the second coolant storage members 412 through the plurality of conduit members 413, whereby the remaining heat in the liquid coolant is further dissipated by the plurality of heat dissipating fins 414 connected between adjacent pairs of the conduit members 413. By virtue of such design, the coolant can be circulated within the heat dissipating device 2, and the efficiency of heat dissipation can be improved.
The third preferred embodiment of the heat dissipating device 2 according to this invention is illustrated in
While the present invention has been described in connection with what are considered the most practical and preferred embodiments, it is understood that this invention is not limited to the disclosed embodiments but is intended to cover various arrangements included within the spirit and scope of the broadest interpretation so as to encompass all such modifications and equivalent arrangements.
Claims
1. A heat dissipating device for dissipating heat from a heat source, said heat dissipating device comprising:
- a heat conducting unit including a heat conducting member made from a heat conducting material, said heat conducting member including a surrounding wall that defines an internal space and that is adapted to be placed in contact with the heat source, and a plurality of heat conducting plates that are spacedly disposed in said internal space, that are connected to said surrounding wall, and that cooperate with said surrounding wall to define a plurality of flow channels; and
- a coolant storing unit for storing a coolant and in fluid connection with said heat conducting member;
- wherein said heat conducting unit is disposed to extend upwardly such that said flow channels extend upwardly, and said coolant flows along said flow channels of said heat conducting unit when the heat of the heat source is transmitted to said coolant through said heat conducting unit.
2. The heat dissipating device as claimed in claim 1,
- wherein said coolant storing unit includes two modules in fluid connection with each other, each of said modules including a first coolant storage member, a second coolant storage member, a plurality of conduit members fluidly connecting said first coolant storage member and said second coolant storage member, and a plurality of heat dissipating fins connected between adjacent pairs of said conduit members;
- wherein said first coolant storage members of said two modules are in fluid connection with each other.
3. The heat dissipating device as claimed in claim 2,
- wherein said first coolant storage members of said two modules are disposed side by side with each other, and a distance between said second coolant storage members of said two modules is greater than a distance between said first coolant storage members of said two modules;
- wherein each of said flow channels of said heat conducting member has a lower end in fluid connection with said second coolant storage member of one of said two modules, and an upper end in fluid connection with said second coolant storage member of the other one of said two modules; and
- wherein said heat conducting member extends between said second coolant storage members of said two modules and cooperates with said coolant storing unit to configure said heat dissipating device to have a substantially triangular shape.
4. The heat dissipating device as claimed in claim 2,
- wherein said first coolant storage members of said two modules are disposed side by side with each other, and a distance between said second coolant storage members of said two modules is greater than a distance between said first coolant storage members of said two modules;
- wherein each of said flow channels of said heat conducting member has a lower end in fluid connection with said first coolant storage member of one of said two modules, and said heat conducting unit is disposed to extend upwardly from said first coolant storage member of said one of said two modules and cooperates with said coolant storing unit to configure said heat dissipating device to have a substantially inverted Y shape; and
- wherein each of said flow channels of said heat conducting member further has an upper end, and said heat conducting member further includes a cover body disposed to seal said upper ends of said flow channels of said heat conducting member, said cover body having a groove in fluid connection with said flow channels.
5. The heat dissipating device as claimed in claim 4, wherein said heat conducting member further includes a plurality of heat dissipating plates extending outwardly from said surrounding wall.
6. The heat dissipating device as claimed in claim 8, wherein said heat conducting unit further includes a fan disposed on said heat dissipating plates.
7. The heat dissipating device as claimed in claim 1,
- wherein said coolant storing unit includes a module, said module including a first coolant storage member, a second coolant storage member, and a plurality of conduit members fluidly connecting said first coolant storage member and said second coolant storage member;
- wherein said first coolant storage member is disposed above said second coolant storage member;
- wherein each of said flow channels of said heat conducting member has a lower end in fluid connection with said first coolant storage member, and said heat conducting unit is disposed to extend upwardly from said first coolant storage member; and
- wherein each of said flow channels of said heat conducting member further has an upper end, and said heat conducting member further includes a cover body disposed to seal said upper ends of said flow channels of said heat conducting member, said cover body having a groove in fluid connection with said flow channels.
8. The heat dissipating device as claimed in claim 5, wherein said heat conducting member further includes a plurality of heat dissipating plates extending outwardly from said surrounding wall.
9. The heat dissipating device as claimed in claim 6, wherein said heat conducting unit further includes a fan disposed on said heat dissipating plates.
Type: Application
Filed: Apr 30, 2013
Publication Date: Nov 7, 2013
Applicant: MICROTIPS ELECTRONICS CO., LTD. (Kaohsiung)
Inventors: Takeshi Omori (Kaohsiung City), Hsin-Hung Lin (Pingtung City)
Application Number: 13/873,484
International Classification: F28F 3/00 (20060101);