CONTAINER DATA CENTER

A container data center includes a container, a cooling system, and a number of heat dissipation units. The cooling system is positioned on a top of the container. The heat dissipation units are arranged on opposite sidewalls of the container respectively. Each heat dissipation unit includes an air duct attached to the sidewall and a guiding piece. The guiding piece is slantingly spaced from the sidewall. The hot air from the container flows into the air duct. The airflow around the container is guided to the air duct, to cool the air duct. The hot air in the air duct is cooled and then flows to the cooling system.

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Description
BACKGROUND

1. Technical Field

The present disclosure relates to a container data center.

2. Description of Related Art

Many container data centers may be used on a movable carrier, such as a train or a truck, to supply mobile service. When the container data center is moving, air will flow around the container, which can dissipate heat for the container data center. However the traditional container cannot utilize the airflow effectively to dissipate heat.

BRIEF DESCRIPTION OF THE DRAWINGS

Many aspects of the present embodiments can be better understood with reference to the drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.

FIG. 1 is an assembled, isometric view of a container data center according to an exemplary embodiment.

FIG. 2 is a partially isometric view of FIG. 1.

FIG. 3 is a top plan view of FIG. 1.

DETAILED DESCRIPTION

The disclosure, including the accompanying drawings, is illustrated by way of examples and not by way of limitation. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.

Referring to FIG. 1, an embodiment of a container data center includes a container 100, a cooling system 20, and two heat dissipation units 30. The container 100 is arranged on a movable carrier 200, which is moving along an A direction. A plurality of electronic elements (not shown), such as servers, is arranged in the container 100.

The container 100 includes a top wall 101, two sidewalls 102 respectively extending down from two opposite sides of the top wall 101, and two end walls 103 respectively extending down from front and rear ends of the top wall 101. The cooling system 20 is positioned on an outer surface of the top wall 101 of the container 100. The A direction is parallel to the sidewalls 102 and perpendicular to the end walls 103.

Referring to FIG. 2, the heat dissipation units 30 are respectively arranged on outer surfaces of the sidewalls 102 of the container 100. Each heat dissipation unit 30 includes an air duct 31 and a plurality of guiding pieces 33. The air duct 31 includes a plurality of U-shaped main bodies 312 juxtapositionally attached to the sidewall 102, a plurality of first connection ends 311 perpendicularly extending from first ends of the main bodies 312 adjacent to the rear end wall 103, and a plurality of second connection ends 313 extending perpendicularly from second ends of the main bodies 312 adjacent to the front end wall 103, and a connecting duct 315 connecting the second ends 313 to the cooling system 20. Each first connection end 311 is connected to the inside of the container 100. The first connection ends 311, the second connection ends 313, and the connecting ducts 315 are all attached to the outer surface of the top wall 101.

Referring to FIG. 3, each guiding piece 33 is fixed to the outer surface of the sidewall 102 through a pair of first poles 331 and a pair of second poles 333 shorter than the first poles 331. Therefore each guiding piece 33 is spaced from and slanting relative to the sidewall 102. The guiding pieces 33 are wing-shaped and arranged at the opposite sidewalls 102. A thickness of each guiding piece 33 is gradually increased along the A direction. The air duct 30 is located between the sidewall 102 and the guiding pieces 33. The distance between the sidewall 102 and each guiding piece 33 increases gradually along the A direction, to guide the airflow from the A direction to the sidewalls 102.

In use, hot air from the inside of the container 100 flows into the air ducts 30 from the first connection ends 311. The airflow around the container 100 is guided to the air ducts 30, to cool the air ducts 30. The hot air in the air ducts 30 is cooled and then flows to the cooling system 20 along the connecting ducts 315. The cooling system 20 cools the hot air further, to dissipate heat for the electronic elements in the container 100.

In the embodiment, the container 100 utilizes two heat dissipation units 30 attached to the opposite sidewalls 102, to assist heat dissipation for the container 100 through the airflow around the container 100, which can utilize natural wind effectively.

Even though numerous characteristics and advantages of the embodiments have been set forth in the foregoing description, together with details of the structure and function of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in the matters of shape, size, and arrangement of parts within the principles of the present disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Claims

1. A container data center, comprising:

a container comprising a top wall, and two sidewalls respectively extending down from two opposite sides of the top wall;
a cooling system positioned on the top wall of the container; and
two heat dissipation units respectively arranged on outer surfaces of the sidewalls of the container, wherein each heat dissipation unit comprises an air duct attached to the sidewall and a guiding piece, the guiding piece is spaced from the sidewall, the air duct is connected between an inside of the container and the cooling system;
wherein hot air from the container flows into the air duct, airflow around the container is guided to the air duct by the guiding piece, to cool the air duct, the hot air in the air duct is cooled and then flows to the cooling system to be further cooled.

2. The container data center of claim 1, wherein the air duct comprises a plurality of U-shaped main bodies juxtapositionally attached to the outer surface of the corresponding sidewall, a plurality of first connection ends perpendicularly extending from first ends of the main bodies adjacent to the rear end of the container, a plurality of second connection ends extending perpendicularly from second ends of the main bodies adjacent to the front end of the container, and a connecting duct connecting the second ends to the cooling system, each first end is connected to the inside of the container.

3. The container data center of claim 1, wherein a thickness of each guiding piece gradually increases from a rear end of the container toward a front end of the container.

4. The container data center of claim 1, wherein each guiding piece is mounted to the sidewall through a pair of first poles connected between a front end of the guiding piece and the sidewall, and a pair of second poles shorter than the first poles and connected between a rear end of the guiding piece and the sidewall.

Patent History
Publication number: 20130299127
Type: Application
Filed: Jun 7, 2012
Publication Date: Nov 14, 2013
Applicant: HON HAI PRECISION INDUSTRY CO., LTD. (Tu-Cheng)
Inventor: FENG-CHI YANG (Tu-Cheng)
Application Number: 13/491,572
Classifications
Current U.S. Class: Ported To The Chamber (165/57)
International Classification: F28D 1/02 (20060101);