Semiconductor Equipment
Semiconductor equipment is provided to include a reaction chamber, a movable frame, and at least one cleaning brush head. The cleaning brush head is configured to operate on at least one dirty portion to be cleaned within the reaction chamber. The movable frame is disposed within the reaction chamber. The movable frame is capable of carrying a susceptor. The cleaning brush head is capable of touching the dirty portion. The cleaning brush head is capable of moving relative to the dirty portion for removing the residue which is attached to the portion to be cleaned.
This application is a continuation application of U.S. application Ser. No. 13/856,092 (Att. Docket HE8370DIV), filed on Apr. 3, 2013 and entitled Semiconductor Equipment, which is a divisional application of U.S. application Ser. No. 12/726,183 (Att. Docket HE8370P), filed on Mar. 17, 2010 and entitled Semiconductor Equipment, which claims the priority benefit of Taiwan Patent Application No. 099102839, filed on Feb. 1, 2010, the entire contents all of which are incorporated herein by reference.
BACKGROUND OF THE INVENTION1. Field of the Invention
The present invention generally relates to semiconductor equipment, and more particularly to semiconductor equipment having an auto cleaning function.
2. Description of Related Art
Semiconductor manufacturing equipment is commonly used in the production of semiconductor components. The semiconductor manufacturing equipment typically has a reaction chamber. The reaction gases required by the semiconductor manufacturing process can be provided into the reaction chamber by a showerhead of the reaction chamber. The residues, such as deposited material or contaminants, may be attached within the reaction chamber after several executions of semiconductor manufacturing processes. Thus, process results and the process yields are affected by the residues.
Generally speaking, the residues within the reaction chamber can be removed by specific reaction gases. On the other hand, the residues within the reaction chamber can be removed manually when the reaction chamber is opened. However, using specific reaction gases to remove the residues within the reaction chamber is usually ineffective. Removing the residues within the reaction chamber manually with the reaction chamber opened usually leads to bad results, such as long maintenance times, unstable process results, and so on.
For the reason that there are some disadvantages of the prior art as mentioned above, a need exists to propose semiconductor equipment having an auto cleaning function. The semiconductor equipment should be capable of removing the residues within the reaction chamber by a cleaning brush.
SUMMARY OF THE INVENTIONAccordingly, the present invention has been made in order to meet such a need as described above, it being an object of the present invention to provide semiconductor equipment having an auto cleaning function. The semiconductor equipment is capable of removing residues within a reaction chamber with a cleaning brush.
In order to achieve the above object, the present invention provides improved semiconductor equipment. The semiconductor equipment includes a reaction chamber, a movable frame, and at least one cleaning brush head. The cleaning brush head is configured to operate on at least one dirty portion to be or in need of being cleaned within the reaction chamber. The movable frame is disposed within the reaction chamber. The movable frame is capable of carrying a susceptor. The cleaning brush head is capable of touching the dirty portion. The cleaning brush head is capable of moving relative to the dirty portion for removing the residue which is attached to the portion to be cleaned.
A detailed description of the present invention will be provided in connection with the following embodiments, which are not intended to limit the scope of the present invention and which can be adapted for other applications. While the drawings are illustrated in detail, it is appreciated that the quantity of the disclosed components may be greater or less than that disclosed except for instances expressly restricting the amount of the components.
The semiconductor equipment 200 can further include a first frame 214, a second frame 213, a third frame 212, a transmission device 290, and a flexible catheter 281. The transmission device 290 in turn includes a linear transmission device 291. The linear transmission device 291 is disposed between the first frame 214 and the second frame 213. Hence, by way of the linear transmission device 291, the second frame 213 can move vertically relative to the first frame 214. The movable frame 220 is disposed on the second frame 213. When the second frame 213 moves vertically, the movable frame 220 also moves vertically. The flexible catheter 281 is disposed between the third frame 212 and the second frame 213. The flexible catheter 281 is used to prevent the gases within the reaction chamber 210 from leaking to the outside of the reaction chamber 210. The transmission device 290 includes a rotation transmission device. In this embodiment, the rotation transmission device includes a motor 292 and a gear assembly 293. Power from the motor 292 is transmitted to the movable frame 220 by the gear assembly 293 so as to make the movable frame 220 rotate.
By using the semiconductor equipment of the present invention, a cleaning brush head can provide the capability of removing residue attached within the reaction chamber without the need for having to open the reaction chamber. Thus, maintenance time is decreased, with the process and its result being improved.
The present invention contemplates and provides a method for cleaning semiconductor equipment. The method includes the following steps. Referring to
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Although specific embodiments have been illustrated and described, it will be appreciated by those skilled in the art that various modifications may be made without departing from the scope of the present invention, which is intended to be limited solely by the appended claims.
Claims
1. A method for cleaning semiconductor equipment, comprising:
- providing semiconductor equipment, said semiconductor equipment having a reaction chamber, wherein at least one dirty portion to be cleaned is positioned within said reaction chamber; and
- providing at least one cleaning brush head, said cleaning brush head being provided for touching said dirty portion, and said cleaning brush head being provided for moving relative to said dirty portion to remove residue attached to said dirty portion.
2. The method for cleaning semiconductor equipment according to claim 1, wherein said dirty portion is positioned on an upper portion of said reaction chamber, said cleaning brush head is disposed on said susceptor, said movable frame moves vertically so as to make said cleaning brush head touch said dirty portion, and said movable frame rotates so as to make said cleaning brush head move relative to said dirty portion to remove said residue attached to said dirty portion.
3. The method for cleaning semiconductor equipment according to claim 2, wherein said dirty portion comprises a showerhead.
4. The method for cleaning semiconductor equipment according to claim 1, wherein said cleaning brush head is disposed on a cleaning device, said cleaning device has a driving device, and said driving device makes said cleaning brush head move or rotate.
5. The method for cleaning semiconductor equipment according to claim 4, further comprising a robot arm, wherein said robot arm moves said cleaning device to the inside of said reaction chamber so as to make said cleaning brush head touch said dirty portion.
6. The method for cleaning semiconductor equipment according to claim 1, further comprising a robot arm, wherein said cleaning brush head is disposed on said robot arm, and said robot arm makes said cleaning brush head touch said dirty portion.
7. The method for cleaning semiconductor equipment according to claim 6, wherein said dirty portion is positioned on a lower portion of said reaction chamber, and said movable frame rotates so as to make said cleaning brush head move relative to said dirty portion for removing said residue attached to said dirty portion.
8. The method for cleaning semiconductor equipment according to claim 7, wherein said dirty portion comprises said susceptor.
Type: Application
Filed: Sep 5, 2013
Publication Date: Jan 2, 2014
Inventors: Chien-Ping HUANG (Tainan County), Tsan-Hua Huang (Tainan City), Tsung-Hsun HAN (Kaohsiung)
Application Number: 14/018,928
International Classification: H01L 21/67 (20060101);