Abstract: A package comprises an interposer, comprising an interposer substrate including at least one layer, and a plurality of RDLs formed through at least a portion of the interposer substrate. The package also includes a die device structure comprising at least one device die, and a first test line (TL) structure interposed between the interposer and the die device structure. The first TL structure includes at least one first test line electrically coupled to the at least one device die, at least a portion of the at least one first test line extending beyond a peripheral edge of the die device structure to provide an electrical interface with the at least one device die.

Abstract: A method of making a photonic device includes depositing a cladding layer over a silicon layer. The method further includes patterning the cladding layer to expose a first portion of the silicon layer, wherein a second portion of the silicon layer is covered by the patterned cladding layer, and a waveguide portion is in the second portion of the silicon layer. The method further includes depositing a low refractive index layer directly over the patterned cladding layer, wherein a refractive index of the low refractive index layer is less than a refractive index of silicon nitride.

Abstract: The present invention provides a layout pattern of static random access memory, comprising a PU1 (first pull-up transistor), a PU2 (second pull-up transistor), a PD1A (first pull-down transistor), a PD1B (second pull-down transistor), a PD2A (third pull-down transistor), a PD2B (fourth pull-down transistor), a PG1A (first access transistor), a PG1B (second access transistor), a PG2A (third access transistor) and a PG2B (fourth access transistor) located on the substrate. The PD1A and the PD1B are connected in parallel with each other, the PD2A and the PD2B are connected in parallel with each other, wherein the gate structures include a first J-shaped gate structure, and the first J-shaped gate structure is an integrally formed structure.

Abstract: A coupling system includes an optical fiber configured to carry an optical signal. The coupling system further includes a grating on a first side of a semiconductor layer, wherein the grating is configured to receive the optical signal. The coupling system further includes an interconnect structure over the grating on the first side of the semiconductor layer, wherein the interconnect structure defines a cavity aligned with the grating. The coupling system further includes a first polysilicon layer on a second side of the semiconductor layer, wherein the second side of the semiconductor layer is opposite to the first side of the semiconductor layer.

Abstract: A coil winding machine is adapted for winding a conductive flat wire onto an iron core. The coil winding machine includes a base, a tension mechanism mounted on the base and adapted for delivering the flat wire and providing tension to the flat wire, a rotary mechanism mounted on the base and including a core base that is rotatable and that is adapted to be mounted with the iron core, and at least one clamping mechanism mounted on the base, being co-rotatable with the core base, and operable for abutting the flat wire tightly against the iron core. A tension provided by the tension mechanism, a pressure provided by the clamping mechanism, and a rotational speed of the core base correspond to one another such that rotation of the core base and the at least one clamping mechanism winds the flat wire onto the iron core.

Abstract: A coupling system includes an optical fiber configured to carry an optical signal. The coupling system further includes a chip in optical communication with the optical fiber. An angle between the optical fiber and a top surface of the chip ranges from about 92-degrees to about 88-degrees. The chip includes a grating configured to receive the optical signal; and a waveguide, wherein the grating is configured to receive the optical signal and redirect the optical signal along the waveguide. ms.

Abstract: A method is provided for forming an integrated circuit (IC) chip package structure. The method includes: providing an interposer having a front surface and a back surface, the interposer comprising a substrate, at least one routing region, and at least one non-routing region; forming at least one warpage-reducing trench in the at least one non-routing region, wherein the at least one warpage-reducing trench extends from the front surface of the interposer to a first depth, the first depth smaller than a thickness between the front surface and the back surface of the interposer; depositing a warpage-relief material in the at least one warpage-reducing trench; and bonding the group of IC dies to the front surface of the interposer.

Abstract: An integrated circuit (IC) comprising an enhanced passivation scheme for pad openings and trenches is provided. In some embodiments, an interlayer dielectric (ILD) layer covers a substrate and at least partially defines a trench. The trench extends through the ILD layer from a top of the ILD layer to the substrate. A conductive pad overlies the ILD layer. A first passivation layer overlies the ILD layer and the conductive pad, and further defines a pad opening overlying the conductive pad. A second passivation layer overlies the ILD layer, the conductive pad, and the first passivation layer, and further lines sidewalls of the first passivation layer in the pad opening and sidewalls of the ILD layer in the trench. Further, the second passivation layer has a low permeability for moisture or vapor relative to the ILD layer.

Abstract: A method of making a chip includes depositing a first polysilicon layer on a top surface and a bottom surface of a substrate. The method further includes patterning the first polysilicon layer to define a recess, wherein the first polysilicon layer is completed removed from the recess. The method further includes implanting dopants into the substrate to define an implant region. The method further includes depositing a contact etch stop layer (CESL) in the recess, wherein the CESL covers the implant region. The method further includes patterning the CESL to define a CESL block. The method further includes forming a waveguide and a grating in the substrate. The method further includes forming an interconnect structure over the waveguide, the grating and the CESL block. The method further includes etching the interconnect structure to define a cavity aligned with the grating.

Abstract: A speed-command generating unit incorporated with an electric vehicle having a throttle module, a mechanical brake and a motor is disclosed and includes: a computation module for generating a computation value of a speed-command according to a throttle operating signal from the throttle module, a sensing module for detecting an activated status of the mechanical brake, a selecting module for providing a braking approach selecting signal, a trimming module for setting a trimming flag according to the activated status of the mechanical brake of last cycle, and a switching module connected therewith. The switching module generates different output values of the speed-command for the motor according to different foundations depending on the content of the trimming flag when the mechanical brake is inactivated in this cycle, and generates the output value according to the content of the braking approach selecting signal when the mechanical brake is activated in this cycle.

Abstract: A power module of an electric assisted bicycle is disclosed and includes a pedal shaft, a gear-plate-output shaft, a reducer-output shaft and a motor-output shaft. The pedal shaft is arranged along an axial direction. The gear-plate-output shaft includes a first section and a second section arranged in the axial direction. The first section is concentrically sleeved on the pedal shaft through a first one-way bearing along a radial direction. When the pedal shaft is forced to rotate, the gear-plate-output shaft is driven through the first one-way bearing. The reducer-output shaft is concentrically sleeved on an outer surface of the second section through a second one-way bearing along the radial direction. The motor-output shaft is concentrically sleeved on the reducer-output shaft along the radial direction. When the motor-output shaft drives the reducer-output shaft to rotate, the gear-plate-output shaft is driven by the reducer-output shaft through the second one-way bearing.

Abstract: A system for compensating acceleration of electrical motorbike includes a throttle unit and an electro-mechanic assembly. After the electrical motorbike starts, the throttle unit receives external operation from a rider for generating a series of original throttle signal. An acceleration compensating module calculates a throttle variation rate based on the original throttle signal and variation of a throttle operation magnitude, and calculates a throttle compensating value based on the throttle variation rate when the throttle variation rate is larger than or equal to a correction threshold. A throttle compensating module receives and sums the original throttle signal and the throttle compensating value up for generating a new throttle signal. A torque controller generates a corresponding torque command based on the new throttle signal, and outputs the torque command to the electro-mechanic assembly for operation.

Abstract: A speed-command generating unit incorporated with an electric vehicle having a throttle module, a mechanical brake and a motor is disclosed and includes: a computation module for generating a computation value of a speed-command according to a throttle operating signal from the throttle module, a sensing module for detecting an activated status of the mechanical brake, a selecting module for providing a braking approach selecting signal, a trimming module for setting a trimming flag according to the activated status of the mechanical brake of last cycle, and a switching module connected therewith. The switching module generates different output values of the speed-command for the motor according to different foundations depending on the content of the trimming flag when the mechanical brake is inactivated in this cycle, and generates the output value according to the content of the braking approach selecting signal when the mechanical brake is activated in this cycle.

Abstract: A method for fabricating a carrier-free semiconductor package includes: half-etching a metal carrier to form a plurality of recess grooves and a plurality of metal studs each serving in position as a solder pad or a die pad; filing each of the recess grooves with a first encapsulant; forming on the metal studs an antioxidant layer such as a silver plating layer or an organic solderable protection layer; and performing die-bonding, wire-bonding and molding processes respectively to form a second encapsulant encapsulating the chip. The recess grooves are filled with the first encapsulant to enhance the adhesion between the first encapsulant and the metal carrier, thereby solving the conventional problem of having a weak and pliable copper plate and avoiding transportation difficulty. The invention eliminates the use of costly metals as an etching resist layer to reduce fabrication cost, and further allows conductive traces to be flexibly disposed on the metal carrier to enhance electrical connection quality.

Abstract: An electric motor controlling system used for vibration suppression of an electric vehicle is disclosed. The controlling system includes a PID-controller and a vibration suppression compensator. The PID-controller generates a basic torque command through performing a calculation based on input speed-error signal of the electric vehicle, the vibration suppression compensator generates a compensated torque command through performing a compensation gain procedure on the input speed-error signal. The vibration suppression compensator further receives a motor speed of the electric vehicle, sets its output as the compensated torque command when the motor speed is smaller than a preset active speed level, otherwise sets the output as 0. The controlling system generates an output torque command via adding up the basic torque command and the output of the vibration suppression compensator, and operates electric motor components of the electric vehicle according to the output torque command.

Abstract: An electric motor controlling system used for vibration suppression of an electric vehicle is disclosed. The controlling system includes a PID-controller and a vibration suppression compensator. The PID-controller generates a basic torque command through performing a calculation based on input speed-error signal of the electric vehicle, the vibration suppression compensator generates a compensated torque command through performing a compensation gain procedure on the input speed-error signal. The vibration suppression compensator further receives a motor speed of the electric vehicle, sets its output as the compensated torque command when the motor speed is smaller than a preset active speed level, otherwise sets the output as 0. The controlling system generates an output torque command via adding up the basic torque command and the output of the vibration suppression compensator, and operates electric motor components of the electric vehicle according to the output torque command.

Abstract: A system for compensating acceleration of electrical motorbike includes a throttle unit and an electro-mechanic assembly. After the electrical motorbike starts, the throttle unit receives external operation from a rider for generating a series of original throttle signal. An acceleration compensating module calculates a throttle variation rate based on the original throttle signal and variation of a throttle operation magnitude, and calculates a throttle compensating value based on the throttle variation rate when the throttle variation rate is larger than or equal to a correction threshold. A throttle compensating module receives and sums the original throttle signal and the throttle compensating value up for generating a new throttle signal. A torque controller generates a corresponding torque command based on the new throttle signal, and outputs the torque command to the electro-mechanic assembly for operation.