LIGHTING DEVICE AND METHOD FOR PRODUCING A LIGHTING DEVICE
The lighting device (100) comprises at least one semiconductor light source (103) potted with at least one first potting compound (107, 108), wherein at least one region of the lighting device comprises: at least one connection zone (104) which is electrically connected to the at least one semiconductor light source (103), and at least one electrical connection element (111) having at least one electrical line (113), wherein at least one electrical line (113) is connected to an associated connection zone (104) and faces out from the lighting device at one end and the at least one connection zone (104) and the at least one electrical connection element (111) are arranged in a cutout (109) of the first potting compound (107, 108) and are potted by means of a second potting compound (119).
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This application is a national stage entry according to 35 U.S.C. §371 of PCT application No.: PCT/EP2012/057358 filed on Apr. 23, 2012, which claims priority from German application No.: 10 2011 075 032.0 filed on Apr. 29, 2011.
TECHNICAL FIELDVarious embodiments relate to a lighting device having at least one semiconductor light source cast with at least one first casting compound, wherein at least one region of the lighting device has at least one connection area, which is electrically connected to the at least one semiconductor light source, and at least one electrical connecting element.
BACKGROUNDUntil now, LED strips have been known which have a strip-shaped printed circuit board which is populated on one side with a series of light-emitting diodes. The light-emitting diodes can be cast in silicone in order to protect against dust and/or moisture. For the electrical connection of the LED strip, until now an electrical plug-type connection has been known which is likewise arranged on the printed circuit board and which is cast first. For its use, a casting compound covering the plug-type connection in the plug-in direction needs to be removed so that plug-in contacts of the casting compound are exposed. One disadvantage with this is that this removal of the casting compound is complicated, in particular since the plug-type connection is typically not visible between the casting compound.
It is also known to solder electrical wires directly to connection areas and to then pass these wires individually out of the lighting device. Disadvantages here are a nonuniform appearance, the difficulty of soldering a plurality of the wires without short circuits and a lack of reliability of a subsequent encapsulation with casting compound, since the wires can also be subjected to tensile strain relatively easily through the casting compound on the connection area.
SUMMARYVarious embodiments consist in at least partially avoiding the disadvantages of the prior art and in particular providing a cast lighting device which is easy to produce and is visually appealing.
Various embodiments provide a lighting device, having at least one semiconductor light source cast with at least one first casting compound, wherein at least one region of the lighting device has: at least one connection area, which is electrically connected to the at least one semiconductor light source, and at least one electrical connecting element, which has at least one electrical line, wherein at least one electrical line is connected to an associated connection area and protrudes at one end out of the lighting device, and the at least one connection area and the at least one electrical connecting element are arranged in a cutout in the first casting compound and are cast by means of a second casting compound.
The lighting device can be in particular a lamp, a luminaire or a lighting module. The lighting device can be in particular a compact lighting module or a strip-shaped lighting strip.
Preferably, the at least one semiconductor light source includes at least one light-emitting diode. When a plurality of light-emitting diodes are provided, said light-emitting diodes may illuminate in the same color or in different colors. A color may be monochrome (for example red, green, blue, etc.) or multichrome (for example white). The light emitted by the at least one light-emitting diode may also be an infrared light (IR LED) or an ultraviolet (UV LED). A plurality of light-emitting diodes may produce a mixed light, for example a white mixed light. The at least one light-emitting diode can contain at least one wavelength-modifying phosphor (conversion LED). The phosphor can alternatively or additionally be arranged remotely from the light-emitting diode (“remote phosphor”). The at least one light-emitting diode may be in the form of at least one individually housed light-emitting diode or in the form of at least one LED chip. A plurality of LED chips can be mounted on a common substrate (“submount”). The at least one light-emitting diode may be equipped with at least one dedicated and/or common optical element for beam guidance, for example at least one Fresnel lens, collimator, or the like. Instead of or in addition to inorganic light-emitting diodes, for example on the basis of InGaN or AlInGaP, organic LEDs (OLEDs, for example polymer OLEDs) may generally also be used. Alternatively, the at least one semiconductor light source can have at least one diode laser, for example.
The fact that the at least one semiconductor light source is cast by means of at least one first casting compound can in particular include the situation where the at least one semiconductor light source is cast by means of a first casting compound or the at least one semiconductor light source is cast by means of a plurality of casting compounds, for example a plurality of layers of different first casting compounds. The casting compound may be in particular a silicone material which is advantageously inexpensive and can be configured so as to have long term stability, and so as to be flexible and optionally transparent or translucent.
The connection area may in particular be an electrical contact area, in particular a planar contact area. The electrical connection area can in particular be suitable for soldering or welding. The connection area may be provided directly at the at least one semiconductor source or may be connected to the at least one semiconductor source directly or indirectly (for example via a circuit or other electrical or electronic components) by means of an electrical wiring structure.
The at least one electrical line may be connected to the associated connection area by soldering or welding, for example.
By virtue of the fact that the at least one electrical line emerges from the lighting device at one end, said electrical line can be electrically connected externally there, for example to other lighting devices and/or to an external current source.
The fact that the at least one connection area and the at least one electrical connecting element are arranged in a cutout or recess in the first casting compound can mean that the at least one connection area and the at least one electrical connecting element were previously covered with the at least one casting compound and then said casting compound was removed. Alternatively, the at least one connection area and the at least one electrical connecting element may not have been cast with the at least one casting compound, but a cutout may have been formed in this casting.
The fact that the at least one cutout or recesses has been cast by means of a second casting compound means in particular that the semiconductor light sources are cast by means of the at least one first casting compound and the at least one connection area and the at least one electrical connecting element, adjacent to this, are cast by means of the second casting compound.
The lighting device may have one or more such regions. Each of the regions advantageously has a cut-away portion and an electrical connecting element. The electrical connecting element preferably has a plurality of electrical lines, and the number of connection areas per region preferably corresponds to the number of electrical lines of the associated electrical connecting element.
This lighting device has the advantage that the at least one electrical line can be connected (soldered, welded, etc.) to a respective connection area in a comparatively simple and reliable manner. The at least one connection area and the at least one electrical connecting element are additionally capable of being protected against dust and moisture by the second casting compound, in particular in accordance with one or more IP protection classes. The use of the cut-away portion of the first casting compound also enables simple and precise casting. Furthermore, this lighting device is variable with a level of production complexity which only changes slightly in terms of its electrical connection (for example the number of electrical lines and/or connection areas). This favors mass production of the lighting device. A visually appealing configuration is also possible. The use of a dedicated electrical connecting element also enables simple, identical positioning of the electrical lines, even lines of different lengths. In addition, strain relief on the electrical lines is also enabled in a simple manner, which increases reliability.
One configuration consists in that the at least one electrical connecting element has a body, through which at least one electrical line is passed. The electrical line is in particular introduced fixedly in the body in order to favor strain relief. The body may in particular be a plastics body, in particular a solid body. The at least one electrical line may be in particular a sheathed or bare wire, in particular as part of a cable.
A further configuration consists in that the body has at least one groove on the outside, in particular a peripheral groove. The at least one groove favors areal covering of the body with the second casting compound by virtue of producing a capillary effect. The at least one groove also enables a form-fitting connection of the body in the casting compound.
Yet a further configuration consists in that the body has at least one spacer on the outside. This at least one spacer enables covering of a side of the body which is spaced apart from the spacer with respect to an adjacent wall, in particular if this side of the body has one or more grooves.
A further configuration consists in that the body has a laterally protruding, peripheral wall on the side on which the at least one associated electrical line emerges from the lighting device. This wall enables the use of the body as a stopper or barrier, in particular when using in a channel which is closed laterally (not at the ends), with the result that the cut-away portion can be filled safely with the second casting compound and there is no risk of the second casting compound dripping out of the lighting device in the region of the body.
A further configuration consists in that the wall has a nonuniform height. Thus, the body can also safety shut off laterally open channels up to a fill height corresponding to the wall height. Alternatively, the wall has a height which is at least substantial uniform peripherally.
In addition, a configuration consists in that the at least one electrical connecting element has two or four electrical lines. The electrical lines are preferably offset laterally with respect to one another in order to enable simple fastening on the respective connection area without being impeded by an adjacent electrical line.
A further configuration consists in that the at least one connection area is exposed with respect to the at least one first casting compound by means of the at least one cutout, and/or the at least one electrical connecting element is accommodated in a laterally closed (tubular) channel which leads outward and closes the channel, in particular on the outside. The fact that the at least one connection area is exposed, can be reached in particular directly with a tool, enables fastening of the electrical line(s) on the connection area(s) with a low level of complexity involved in the handling. The provision of the channel enables easy introduction and defined positioning of the connecting element with at the same time drip-free casting.
In addition, a configuration consists in that the at least one connection area is exposed with respect to the at least one first casting compound by means of the at least one cutout, and the at least one electrical connecting element is accommodated in an open channel which leads outward and shuts off or closes the channel, in particular from the outside or in an outer region. This enables easier removal or cutting away of the first casting compound and safer casting of the connecting element.
Yet a further configuration consists in that the at least one connection area is inhibited with respect to the first casting compound directly covering the at least one connection area (but in particular not with respect to the second casting compound). This enables simple and in particular residue-free removal of the first casting compound from the at least one connection area, which in turn improves reliability of the connection with an electrical line to be connected later. The inhibiting therefore suppresses in particular adhesion of the first casting compound to the connection area.
Another configuration consists in that a first casting compound directly covering the at least one connection area and the second casting compound are different. Thus, the inhibiting may not be effective with respect to the second casting compound.
Quite generally, at least one first casting compound and the second casting compound may have an identical material. Alternatively, at least one first casting compound and the second casting compound can have an identical base material, for example silicone, but different fillers. In yet another alternative, at least one first casting compound and the second casting compound may have a different base material, for example silicone or ABS, for example with identical or different filler(s).
The at least one first casting compound may have a single first casting compound or a plurality of different first casting compounds which are arranged differently physically, for example a plurality of layers of casting compounds.
In addition, a configuration consists in that the at least one first casting compound has a lower (first first) casting compound, by means of which the at least one semiconductor light source is cast up to below its emitter face, and an upper (second first) casting compound, by means of which the emitter face is cast. A view onto the at least one semiconductor light source and a substrate therebeneath can be influenced, in particular prevented, by the lower casting compound, which improves the appearance of the lighting device. The lower casting compound can in particular be opaque. The upper casting compound can in particular be transparent in order to suppress optical losses. The upper casting compound can in particular be translucent for homogenization of the emitted light.
The at least one semiconductor light source may be arranged on a substrate. A plurality of semiconductor light sources may be arranged on a common substrate. The substrate may in particular be a printed circuit board. The printed circuit board may in particular be a printed circuit board in the form of a circular disk or a strip-shaped printed circuit board.
The printed circuit board may be in particular a mechanically flexible printed circuit board, in particular a strip-shaped flexible printed circuit board. In particular, lighting strips from the LINEARlight Flex series by Osram may be used. In particular together with elastic casting compounds, an overall elastically deformable lighting device can thus be provided, in particular in the sense of an encapsulated lighting strip.
In addition, a configuration consists in that the lighting device is a lighting strip (with a strip-shaped, flexible or inflexible substrate), and the regions of the lighting device (which each have at least one connection area) are end regions, to be precise at one or both ends.
Various embodiments also provide a method for producing a lighting device, having at least the following steps: providing a lighting device, which has at least one semiconductor light source and at least one connection area, which is electrically connected to the at least one semiconductor light source, which semiconductor light sources are cast by means of at least one first casting compound, removing some of the first casting compound, with the result that the at least one connection area is exposed and is connected to an outer side via a channel; inserting an electrical connecting element with at least one electrical line into the channel, with the result that the electrical connecting element shuts off the channel and the electrical line protrudes outward; connecting at least one electrical line of the electrical connecting element to a respective connection area; and casting the at least one connection area and the at least one electrical connecting element with at least one second casting compound.
As a result, the same advantages as in the above described lighting device are achieved. The method may also be configured analogously to the lighting device.
For example, one configuration may consist in that the method has the following proceeding steps: inhibiting the at least one connection area; casting the at least one semiconductor light source and the at least one connection area to the at least one first casting compound, wherein inhibiting the at least one connection area includes inhibiting with respect to the first casting compound which directly covers the at least one connection area.
In the drawings, like reference characters generally refer to the same parts throughout the different views. The drawings are not necessarily to scale, emphasis instead generally being placed upon illustrating the principles of the disclosed embodiments. In the following description, various embodiments described with reference to the following drawings, in which:
The following detailed description refers to the accompanying drawing that show, by way of illustration, specific details and embodiments in which the disclosure may be practiced.
The connection areas 104 are offset equidistantly laterally (with respect to a width B of the printed circuit board 101). In addition, the connection areas 104 are offset alternately in two rows with respect to a length L of the printed circuit board 101. Such an arrangement simplifies a mechanically secure fastening of connection elements and prevents possible short circuits whilst maintaining a compact arrangement.
The light-emitting diode 103 is in this case an upwardly emitting light-emitting diode (“Top LED”) with an upper emitter face 106.
The connection areas 104 are inhibited at this production stage, as indicated by the zigzag arrows. As a result, the adhesion capacity of these connection areas is reduced in comparison with a casting compound subsequently cast thereon.
The lighting strip F is cast by means of two first casting compounds 107, 108, namely a lower casting compound 107 and an upper casting compound 108. The lower casting compound 107 is in this case opaque silicone and covers the sides, but not the emitter faces 106 of the light-emitting diodes 103. The lower casting compound 107 also covers the rest of the printed circuit board 101 including the connection areas 104. A layer of the upper casting compound 108, which covers the emitter faces 106, is provided on the lower casting compound 107. The upper casting compound 108 consists of transparent or translucent silicone. The mount 105, the lower casting compound 107 and the upper casting compound 108 protrude at the front end or at the end beyond the printed circuit board 101 or the lighting strip F (towards the right in
The body 112 has three laterally peripheral grooves 115 in order to assist flat casting of the body 112, in particular by means of a capillary effect.
In addition, the body 112 has spacers 116 on each of its sides (the lateral surface) in order to thus assist casting of the body 112 on all sides.
At an end position of the body 112 which is provided for external arrangement, the body 112 has a laterally protruding, peripheral wall 117. This wall serves to be placed on the outside on the channel 109b and can close said channel.
The finished lighting device 100 can be bent to a high degree without any destruction with respect to its longitudinal alignment. The electrical connecting element 111 in this case enables a connection with strain relief between the electrical lines 113 and the connection areas 104 in the case of a bent lighting device 100.
The channel 209b may be passed in particular through a side wall of a mount 105 which is U-shaped in profile.
In this case, the electrical lines 113 protrude on the connection area side out of the lateral surface of the connecting element 411 and run substantially at right angles in the body 412.
In this lighting device 600, it is preferred that it is combined detachably with one or more moldings (not depicted) in its preliminary stage, in which the casting compound 119 has not yet been introduced, in order to be able to cast (or inject) the second casting compound 119 in a defined manner.
In this lighting device 700 as well, it is preferred that it is combined detachably with one or more moldings (not depicted) in its preliminary stage, in which the casting compound 119 has not yet been introduced, in order to be able to cast (or inject) the second casting compound 119 in a defined manner, to be precise also in the case of a laterally aligned electrical connecting element 711.
The disclosure is of course not restricted to the embodiments shown.
Thus, the connection element for all lighting devices can in principle be passed out or aligned at the front end, at the bottom or at a side wall.
The disclosure is not restricted to lighting strips either.
While the disclosed embodiments has been particularly shown and described with reference to specific embodiments, it should be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the disclosed embodiments as defined by the appended claims. The scope of the disclosed embodiments is thus indicated by the appended claims and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced.
LIST OF REFERENCE SYMBOLS100 Lighting device
101 Printed circuit board
102 Front side of the printed circuit board
103 Light-emitting diode
104 Connection area
105 Mount
106 Emitter face of light-emitting diode
107 First, lower casting compound
108 First, upper casting compound
109 Cut-away portion of first casting compound
109a Upwardly open subregion of cut-away portion
109b Channel
111 Connecting element
112 Body of connecting element
113 Electrical line of connecting element
114 End of electrical line
115 Groove in body
116 Spacer of body
117 Laterally protruding wall of body
118 Solder
119 Second casting compound
200 Lighting device
209 Cut-away portion
209b Channel of cut-away portion
300 Lighting device
301 Longitudinal side of lighting device
400 Lighting device
411 Electrically connecting element
412 Body of connecting element
500 Lighting device
509 Cut-away portion
511 Electrical connecting element
512 Body
517 Wall
517a Region of wall with the highest height
600 Lighting device
611 Electrical connecting line
612 Body
617 Wall
617a Region of wall with highest height
700 Lighting device
711 Electrical connecting element
B Width of printed circuit board
F Lighting strip
L Length of printed circuit board
Claims
1. A lighting device, comprising at least one semiconductor light source cast with at least one first casting compound,
- wherein at least one region of the lighting device has: at least one connection area, which is electrically connected to the at least one semiconductor light source, and at least one electrical connecting element, which has at least one electrical line,
- wherein at least one electrical line is connected to an associated connection area and protrudes at one end out of the lighting device, and the at least one connection area and the at least one electrical connecting element are arranged in a cutout in the first casting compound and are cast by means of a second casting compound.
2. The lighting device as claimed in claim 1, wherein the at least one electrical connecting element has a body, through which at least one electrical line is passed.
3. The lighting device as claimed in claim 2, wherein the body has at least one groove on the outside.
4. The lighting device as claimed in claim 2, wherein the body has at least one spacer on the outside.
5. The lighting device as claimed in claim 2, wherein the body has a laterally protruding, peripheral wall on the side on which the at least one associated electrical line emerges from the lighting device.
6. The lighting device as claimed in claim 5, wherein the wall has a nonuniform height.
7. The lighting device as claimed in claim 1, wherein the at least one electrical connecting element has two or four electrical lines.
8. The lighting device as claimed in claim 1, wherein the at least one connection area is exposed with respect to the at least one first casting compound by means of the at least one cutout, and the at least one electrical connecting element is accommodated in a laterally closed channel which leads outward and closes the channel on the outside.
9. The lighting device as claimed in claim 1, wherein the at least one connection area is exposed with respect to the at least one first casting compound by means of the at least one cutout, and the at least one electrical connecting element is accommodated in an open channel which leads outward and closes the channel on the outside.
10. The lighting device as claimed in claim 1, wherein the at least one connection area is inhibited with respect to a first casting compound directly covering the at least one connection area.
11. The lighting device as claimed in claim 1, wherein the at least one first casting compound has a lower casting compound, by means of which the at least one semiconductor light source is cast up to below its emitter face, and an upper casting compound, by means of which the emitter face is cast.
12. The lighting device as claimed in claim 1, wherein the lighting device is a lighting strip, and the regions of the lighting device are end regions.
13. A method for producing a lighting device, wherein the method comprising:
- providing a lighting device, which has at least one semiconductor light source and at least one connection area, which is electrically connected to the at least one semiconductor light source, which semiconductor light sources are cast by means of at least one first casting compound;
- removing some of the first casting compound, with the result that the at least one connection area is exposed and is connected to an outer side via a channel;
- inserting an electrical connecting element with at least one electrical line into the channel, with the result that the electrical connecting element shuts off the channel and the at least one electrical line protrudes outward;
- connecting at least one electrical line of the electrical connecting element to a respective connection area; and
- casting the at least one connection area and the at least one electrical connecting element with at least one second casting compound.
14. The method as claimed in claim 13, further comprising: wherein inhibiting the at least one connection area comprises inhibiting with respect to the first casting compound which directly covers the at least one connection area.
- inhibiting the at least one connection area;
- casting the at least one semiconductor light source and the at least one connection area to the at least one first casting compound,
Type: Application
Filed: Apr 23, 2012
Publication Date: Feb 13, 2014
Patent Grant number: 9249940
Applicant: OSRAM GMBH (Muenchen)
Inventors: Martin Reiss (Sinzing), Gerhard Holzapfel (Rain), Steffen Strauss (Nittendorf)
Application Number: 14/112,942
International Classification: F21S 4/00 (20060101); F21V 23/00 (20060101);