Conductor Or Circuit Manufacturing Patents (Class 29/825)
  • Patent number: 10328674
    Abstract: Provided is a laminated glass including, in order: a first glass sheet; a first interlayer film; a transparent film laminated with a heat reflection film; a second interlayer film; and a second glass sheet, wherein the first interlayer film and the second interlayer film are formed of a modified hydrogenated block copolymer [E], the modified hydrogenated block copolymer [E] is a hydrogenated block copolymer [D] in which an alkoxysilyl group is incorporated, the hydrogenated block copolymer [D] being a block copolymer [C] in which 90% or more of all unsaturated bonds is hydrogenated, the block copolymer [C] is composed of at least two polymer blocks [A] including a repeat unit derived from an aromatic vinyl compound, and at least one polymer block [B] including a repeat unit derived from a linear conjugated diene compound, and the ratio of weight fraction [A]:[B] is 30:70 to 60:40.
    Type: Grant
    Filed: July 7, 2015
    Date of Patent: June 25, 2019
    Assignee: ZEON CORPORATION
    Inventors: Teiji Kohara, Daido Chiba
  • Patent number: 10311354
    Abstract: An assembly and method of manufacture of a radio frequency identification (RFID) assembly having a passive RFID semiconductor chip and a two sided planar antenna and a spacer composed of an electrically non-conducting foam material that is configured for non-absorbing of a substantial amount of energy at the predetermined operating frequency, the spacer having a predetermined thickness and that is configured for non-absorbing of a substantial amount of radio frequency energy at the predetermined operating frequency wherein the RFID tag assembly is configured to receive at a first side of the two sided planar antenna a first portion of the radio frequency energy as direct energy and is configured to receive at a second side of the planar antenna a second portion of the radio frequency energy as indirect energy responsive to the absorbing by the absorbing material body.
    Type: Grant
    Filed: September 13, 2018
    Date of Patent: June 4, 2019
    Assignee: Innovative Timing Systems, LLC
    Inventor: Kurt S. Hansen
  • Patent number: 10300531
    Abstract: The present disclosure provides a method of manufacturing a composite material. The method can include compacting a copper alloy powder into a plurality of substantially uniform compressed sub-assemblies such that the copper alloy powder has a density that is greater than 50%. The plurality of compressed sub-assemblies can be layered relative one another within an aperture of a shell, the plurality of compressed sub-assemblies to form a consecutive assembly of compacted copper alloy. The shell may include one of the following: a precipitation hardened copper alloy, copper alloy, and carbon steel. The consecutive assembly can be sealed within the shell to form a billet. The billet can be hot-extruded to form a rod, and the extruded rod can be further drawn to form a composite wire of a desired diameter. The composite wire may be used to create a composite welding electrode.
    Type: Grant
    Filed: February 10, 2016
    Date of Patent: May 28, 2019
    Assignee: LUVATA OHIO, INC.
    Inventor: Brian E. Swank
  • Patent number: 10264697
    Abstract: A protective cabinet for storage and protection of equipment, wherein the cabinet (1) includes lateral (1a), upper (1b) and lower (1c) walls, and is provided with swivel rollers (2) and leveling support feet (3), as well as with front (4) and posterior (5) doors. The upper wall (1b) of the cabinet (1) is inclined and provided with external integrated hooks (7), and the cabinet (1) is further internally provided with sets of vertical profiles (8) provided with orifices (8a), as well as with vertical supports (9) provided with shafts (9a), the orifices (8a) and shafts (9a) adapted to receive the installation and the fixing of several types of components/devices. The protective cabinet (1) is provided with a mobile rear compartment (11), which may provide accommodation for a ventilation/refrigeration/acclimatization system of the cabinet.
    Type: Grant
    Filed: October 13, 2015
    Date of Patent: April 16, 2019
    Inventor: Daniel Fazenda Freire
  • Patent number: 10237058
    Abstract: The present invention can be a method, system, and computer program product. One embodiment of the present invention provides a computer-implemented method for identifying an artificial object. The method includes receiving capacitance data which is obtained by measuring with at least one electrodes in a sensor at least one predefined surfaces of the artificial object placed against the sensor; converting each of the obtained capacitance data into an evaluation level in an evaluation system having more than two evaluation levels, to obtain a capacitance distribution on the surface of the artificial object; determining whether the obtained capacitance distribution matches a pre-registered capacitance distribution or one of pre-registered capacitance distributions; and if the determination result is positive, concluding the artificial object is identified.
    Type: Grant
    Filed: November 12, 2015
    Date of Patent: March 19, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Toru Aihara, Tadanobu Inoue, Noboru Kamijo, Takeo Nakada
  • Patent number: 10199737
    Abstract: Materials that exhibit magneto-dielectric effects with high local order in the form of distinct basic units with a defined geometry that provides orientation and spacing that prevents contact between conductive components of a basic unit are disclosed. Use of multiple basic units arranged, for example by embedment, in essentially random orientation relative to one another provides a composite material with magneto-dielectric effects that isotropic and homogeneous. Such basic units are readily manufacturable using conventional techniques.
    Type: Grant
    Filed: October 6, 2017
    Date of Patent: February 5, 2019
    Assignee: Matsing, Inc.
    Inventor: Serguei Matitsine
  • Patent number: 10177029
    Abstract: Interconnect structures and methods for forming an interconnect structure. A sacrificial layer is formed on a substrate and an interconnect opening is formed that extends vertically through the sacrificial layer into the substrate. The interconnect opening is filled with a conductor to form a conductive feature. After filling the interconnect opening with the conductor, a dielectric layer is formed on the sacrificial layer. After the dielectric layer is formed on the sacrificial layer, the sacrificial layer is removed to form an air gap layer arranged vertically between the dielectric layer and the substrate.
    Type: Grant
    Filed: October 23, 2017
    Date of Patent: January 8, 2019
    Assignee: GLOBALFOUNDRIES Inc.
    Inventors: Robert J. Fox, III, Sunil K. Singh
  • Patent number: 10165719
    Abstract: An electronic component mounting system includes: a printing apparatus; an electronic component mounting apparatus; and a mounting information storage unit which stores mounting information. The mounting information includes execution mode information in which one of a first mounting mode and a second mounting mode is set for each of electronic components. In the first mounting mode, the electronic component is placed at a mounting position corrected on the basis of a recognition result of a first recognition mark formed on a board. In the second mounting mode, the electronic component is placed at a mounting position corrected on the basis of a recognition result of a second recognition mark formed by paste printed on the board. The electronic components are mounted on the board according to mounting modes set for the respective electronic components by referring to the mounting information.
    Type: Grant
    Filed: December 19, 2013
    Date of Patent: December 25, 2018
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Katsuhiko Itoh, Daisuke Nagai, Mitsuo Nakamura
  • Patent number: 10154582
    Abstract: The invention relates to a cased electrical component comprising a carrier substrate (10), a spring device (20), which is arranged on the carrier substrate (10), a chip (30), which on a first side (31) of the chip is coupled to the spring device (20), and a cover element (100), which is arranged on the carrier substrate (10). The cover element (100) is arranged over the chip (20) such that the cover element (100) is in contact with the chip (30) at least on a second side (32) of the chip, which is different from the first side. The component has a low space requirement and is highly sealed with respect to influences from the surroundings.
    Type: Grant
    Filed: October 27, 2017
    Date of Patent: December 11, 2018
    Assignee: SnapTrack, Inc.
    Inventors: Wolfgang Pahl, Jürgen Portmann
  • Patent number: 10139970
    Abstract: A mass produced identifier providing device with sufficiently high yield, even when forming a conductive layer pattern having an extremely small thickness/minimum area using a minimum amount of silver paste. The identifier-providing device has a conductive layer pattern formed on a rear surface of a base material as an insulator. The silver paste forming the conductive layer pattern contains only silver flakes, as silver particles, that have a particle size in a range of 3.0 to 5.0 ?m and that has a thickness of 100 nm at a largest thickness portion, while having a thickness of 50 nm at a smallest thickness portion. The conductive layer pattern is formed to have a film thickness of 10 ?m or less by laminating the silver flakes in the thickness direction. The silver flakes forming the conductive layer are in a fused state or an aggregating/cohering state at the smallest thickness portion.
    Type: Grant
    Filed: June 30, 2016
    Date of Patent: November 27, 2018
    Assignee: Goggo Co., LTD.
    Inventors: Mori Masayuki, Kondo Takashi, Takagishi Susumu
  • Patent number: 10074048
    Abstract: The present invention relates to an RFID device that is intended to be used in connection with direct or indirect packaging of consumer food products, such as with the use of food trays, totes and other transport packaging for perishable items. The RFID device may include a RFID inlay assembly that has been encased in a laminate that is safe for use with food products.
    Type: Grant
    Filed: June 19, 2014
    Date of Patent: September 11, 2018
    Assignee: AVERY DENNISON RETAIL INFORMATION SERVICES, LLC
    Inventors: Bernd Selgrath, Ian James Forster
  • Patent number: 10062298
    Abstract: An open hardware education kit is provided. The open hardware education kit comprises an expansion board. The expansion board comprises a plurality of metal terminals joinable with a magnet, a plurality of conductive connection wires respectively connected with the metal terminals, and a plurality of pin headers respectively connected with the connection wires. The plurality of pin headers are joinable with an expansion header of open hardware.
    Type: Grant
    Filed: January 25, 2016
    Date of Patent: August 28, 2018
    Assignee: Korea University Research and Business Foundation
    Inventor: Sughui Kim
  • Patent number: 10018888
    Abstract: Improved optical interferometric modulators have a small waveguide spacing so that the waveguide pair are close to the central electrode, to enhance electro-optic interaction. Asymmetric waveguides with differential indices are used to effectively de-couple the waveguide pair. Multiple sections of asymmetric waveguide pairs with alternating differential indices are used to achieve chirp-free operation. Another version of the device utilizes transmission-line electrode that weave closer to one of the waveguide pair alternately between sections. Another version of the device utilizes waveguide structure that one of the waveguide is closer to the central electrode in alternate section. To improve efficiency further, a DC bias is provided on the outer electrodes configured as an RF-ground but DC-float electrodes. Another improvement is to have a slot is cut underneath the waveguide region to effectively reduce to thickness of the substrate. These improvements lead to higher modulator efficiency.
    Type: Grant
    Filed: June 6, 2013
    Date of Patent: July 10, 2018
    Assignee: EOSpace, Inc.
    Inventor: Suwat Thaniyavarn
  • Patent number: 9986771
    Abstract: Methods of forming garments having one or more stretchable conductive ink patterns. Described herein are method of making garments (including compression garments) having one or more highly stretchable conductive ink pattern formed of a composite of an insulative adhesive, a conductive ink, and an intermediate gradient zone between the adhesive and conductive ink. The conductive ink typically includes between about 40-60% conductive particles, between about 30-50% binder; between about 3-7% solvent; and between about 3-7% thickener. The stretchable conductive ink patterns may be stretched more than twice their length without breaking or rupturing.
    Type: Grant
    Filed: February 2, 2015
    Date of Patent: June 5, 2018
    Assignee: L.I.F.E. Corporation S.A.
    Inventors: Gianluigi Longinotti-Buitoni, Andrea Aliverti
  • Patent number: 9949404
    Abstract: An electric device having a printed circuit board fitted with components, and at least one foam component, the foam component surrounding the circuit board at least partially so as to form a housing.
    Type: Grant
    Filed: January 9, 2013
    Date of Patent: April 17, 2018
    Assignee: SEW-EURODRIVE GMBH & CO. KG
    Inventors: Josef Schmidt, Martin Schömer
  • Patent number: 9945903
    Abstract: This invention enhances reliability of an electrical test. A semiconductor device manufacturing method in which a potential (first potential) is supplied by bringing a plurality of first and second test terminals into contact with a plurality of leads, respectively in the step of supplying the potential to the leads (first leads) to carry out the electrical test. The first test terminals come into contact with the leads, individually, and the second test terminals come into contact with the leads in one batch.
    Type: Grant
    Filed: May 10, 2016
    Date of Patent: April 17, 2018
    Assignee: Renesas Electronics Corporation
    Inventors: Toshitsugu Ishii, Naohiro Makihira, Hidekazu Iwasaki, Jun Matsuhashi
  • Patent number: 9892609
    Abstract: A wearable device wearable on a body and a method and an apparatus for providing information by using the wearable device are provided. The wearable device includes at least two sensing units configured to sense detect biometric information of a wearer of the wearable device, and a connector electrically connecting the at least two sensing units to each other and having elasticity.
    Type: Grant
    Filed: May 10, 2016
    Date of Patent: February 13, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jae-hong Kim, Jin-hong Min, Jea-hyuck Lee, Jae-geol Cho, Ju-hee Kim, Jae-hong Kim, Chang-hyun Kim, Kang-jin Yoon
  • Patent number: 9855417
    Abstract: A method of manufacturing a device for brain stimulation includes forming a lead body having a distal end section and coupling at least one pre-electrode to the distal end section of the lead body. The pre-electrode defines a divider with a plurality of partitioning arms, and has a plurality of fixing lumens. A portion of the pre-electrode aligned with the portioning arms is removed to divide the pre-electrode into a plurality of segmented electrodes. Each of the plurality of segmented electrodes defines at least one of the plurality of fixing lumens at least partially disposed through the segmented electrode. A material is introduced through the at least one fixing lumen to couple the plurality of segmented electrodes to the lead body.
    Type: Grant
    Filed: September 15, 2014
    Date of Patent: January 2, 2018
    Assignee: Boston Scientific Neuromodulation Corporation
    Inventors: John Michael Barker, Aditya Vasudeo Pandit, Anne Margaret Pianca
  • Patent number: 9820513
    Abstract: Techniques to determine depth for a number of wearable devices, which may be worn in layers are provided. A wearable device can receive measurements from sensors to include sensors from a number of other wearable devices. Based on the sensor measurements, the wearable device can determine a depth for the wearable devices. The depth can include an indication of which wearable device is closest to a user, which wearable device is closest to an external environment, or the like.
    Type: Grant
    Filed: December 23, 2014
    Date of Patent: November 21, 2017
    Assignee: INTEL CORPORATION
    Inventors: John C. Weast, Wendy March, Eric Lewallen, Cory J. Booth
  • Patent number: 9797583
    Abstract: An LED strip lighting fixture having an array of LEDs mounted on a frangible rigid aluminum base having a predetermined thickness, the thickness including predetermined points of weakness, whereby the rigid, preferably aluminum, base can be broken at the predetermined points of weakness. The rigid base has disposed thereon a laminated integrated circuit on which are mounted a plurality of electrical elements including a plurality of light emitting diodes in series electrical connection on the laminated integrated circuit whereby the frangible sections of the rigid base provide for easy customization in providing predetermined length dimensions of the rigid aluminum base and LED mounted lighting fixture. A secondary benefit of the interconnectability of the integral base and LED combination is that the heat of expansion and subsequent contraction of the metal base is accommodated by the mount and housing to reduce tick and ping noise.
    Type: Grant
    Filed: November 19, 2014
    Date of Patent: October 24, 2017
    Inventor: Ryan P. Hanslip
  • Patent number: 9775988
    Abstract: A stimulation lead can include segmented electrodes arranged in a single or double helix or other helical arrangement. In one method of manufacture, an electrode carrier with segmented electrode receiving openings is used. Another method employs a connected framework of helically arranged pre-electrodes that are separated during manufacture. Yet another method employs a mold to generate a planar carrier over the segmented electrodes followed by rolling the carrier into a cylinder. A further method includes forming an electrode assembly by alternative segmented electrodes with non-conducting spacers.
    Type: Grant
    Filed: December 1, 2014
    Date of Patent: October 3, 2017
    Assignee: Boston Scientific Neuromodulation Corporation
    Inventors: Andrew Govea, Joshua Dale Howard
  • Patent number: 9741646
    Abstract: This disclosure provides a package substrate and its fabrication method. The package substrate includes: a carrier; a first wiring layer formed on the carrier; a conductive pillar layer having a plurality of metal pillars on the first wiring layer; a molding compound layer formed on the first wiring layer, covering all the first wiring layer and the metal pillars, and exposing one end face of each metal pillar; a second wiring layer formed on the molding compound layer and the exposed end faces of the metal pillars; and a protection layer formed on the second wiring layer.
    Type: Grant
    Filed: August 5, 2014
    Date of Patent: August 22, 2017
    Assignee: PHOENIX PIONEER TECHNOLOGY CO., LTD.
    Inventors: Chin-Yao Hsu, Shih-Ping Hsu
  • Patent number: 9736936
    Abstract: A system comprises an article comprising one or more fabric layers, a plurality of electronic devices, each being incorporated into or onto one of the one or more fabric layers, and one or more communication links between two or more of the plurality of electronic devices. Each of the plurality of electronic devices can comprise a flexible substrate coupled to the fabric layer, one or more metallization layers deposited on the flexible substrate, and one or more electronic components electrically coupled to the one or more metallization layers.
    Type: Grant
    Filed: February 1, 2016
    Date of Patent: August 15, 2017
    Assignee: Intel Corporation
    Inventors: Christopher Jezewski, Ravi Pillarisetty, Brian Doyle
  • Patent number: 9721944
    Abstract: A hybrid semiconductor bipolar switch in which a normally-on high-voltage wide-bandgap semiconductor bipolar switch and a normally-off field effect transistor are connected in a cascode (Baliga-pair) configuration. The switch may be constructed as a stacked hybrid device where a discrete transistor is bonded on top of a bipolar switch. Power systems may use plural switches paired with anti-parallel diodes.
    Type: Grant
    Filed: December 30, 2015
    Date of Patent: August 1, 2017
    Assignee: United Silicon Carbide, Inc.
    Inventors: Leonid Fursin, Anup Bhalla
  • Patent number: 9715065
    Abstract: A multi-functional splicing clamp for use in a fiber splicing device includes a clamp body and a clamp cover body, wherein one side of said clamp body is pivotally connected to the clamp cover body. The clamp body is provided with a fiber-carrying pad, and the clamp cover body is provided with an abutment structure that can abut said fiber-carrying pad.
    Type: Grant
    Filed: April 6, 2012
    Date of Patent: July 25, 2017
    Assignees: Inno Instrument (China), Inc., Inno Instrument, Inc.
    Inventor: Yangri Zhao
  • Patent number: 9700719
    Abstract: A device to relieve hemorrhoid inflammation using electrotherapy including a capsule insertable into a user's anus a predetermined depth, a control unit having a power indicator and power button, the control unit including modulating means for a user to control the intensity and duration of the therapy session. The device also includes a wire that connects the control unit to the capsule. In an alternate embodiment, the device can implement Bluetooth technology to send instructions from the control unit to the capsule wirelessly to actuate it so that it can deliver electrotherapy to a user's anus. A mobile application on a mobile device can be used to control the electrotherapy being sent to a user through the capsule.
    Type: Grant
    Filed: June 21, 2016
    Date of Patent: July 11, 2017
    Inventor: Yamil Dominguez
  • Patent number: 9704417
    Abstract: A breadboard includes a panel having a top side and a bottom side, a first and second plurality of spaced component receiving openings extend through the top side surface and communicate with a larger first and second terminal receiving open surfaces extending from the bottom side surface which are configured to receive a first and second conductive terminals, respectively, and on a side of at least one of the first and second plurality of spaced openings in the top side surface is formed a raised surface and spanning a length approximate the larger terminal receiving open surfaces and parallel thereto and which forms part of the top side surface thereby defining a row of said plurality of spaced component receiving openings in which the conductive terminals lie.
    Type: Grant
    Filed: August 14, 2015
    Date of Patent: July 11, 2017
    Inventor: Michael T. Neal
  • Patent number: 9690329
    Abstract: A display module includes a window member, a display panel, and a protective member. The window member includes a front surface, a rear surface facing the front surface in a thickness direction, and a connection surface coupling the front surface to the rear surface. The display panel includes a display part disposed to be spaced apart from the rear surface of the window member and to display an image toward the window member, and an edge part bent from the display part toward the window member. The protective frame accommodates the display panel and is coupled to at least one of the rear surface of the window member and the connection surface.
    Type: Grant
    Filed: January 23, 2015
    Date of Patent: June 27, 2017
    Assignee: Samsung Display Co., Ltd.
    Inventors: Taehyeog Jung, Taehoon Yang, Kiyong Lee, Sang Wol Lee
  • Patent number: 9671206
    Abstract: A detonator which, in response to a command, uses a first modulation process to generate a first signal and, in response to an event, uses a second modulation process to generate a second signal.
    Type: Grant
    Filed: October 12, 2015
    Date of Patent: June 6, 2017
    Assignee: DETNET SOUTH AFRICA (PTY) LTD
    Inventor: Craig Charles Schlenter
  • Patent number: 9620841
    Abstract: A radio frequency coupling structure is arranged to couple a radio frequency signal between a first side of the radio frequency coupling structure to a second side of the radio frequency coupling structure opposite to the first side. The radio frequency coupling structure comprises a dielectric layer, a first electrically conductive layer comprising a first transition structure, a second electrically conductive layer comprising a second transition structure, and an integrated waveguide structure formed by an array of electrically conductive vias extending through the dielectric layer from the first to the second electrically conductive layer to enclose a portion of the dielectric layer. The portion is arranged to guide the radio frequency signal between the first transition structure and the second transition structure.
    Type: Grant
    Filed: June 13, 2014
    Date of Patent: April 11, 2017
    Assignee: NXP USA, Inc.
    Inventors: Ziqiang Tong, Ralf Reuter
  • Patent number: 9601743
    Abstract: Provided are: a first-group accommodation part (21) and a second-group accommodation part (22) in each of which accommodation parts (2) each of which accommodates at least one of a bus bar (3), a terminal (4), and an electric wire (5) connected to the terminal (4) are arranged; a linkage part (8) linking the first-group accommodation part (21) and the second-group accommodation part (22) to each other; and an electric wire routing part (9) provided in the linkage part (8) and accommodating the electric wires (5).
    Type: Grant
    Filed: August 29, 2013
    Date of Patent: March 21, 2017
    Assignees: Yazaki Corporation, TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Shigeyuki Ogasawara, Shinsuke Azuma, Shinichi Yanagihara, Michio Ota, Akihiro Kosaki, Isao Nakagawa
  • Patent number: 9549708
    Abstract: Described herein are microelectrode array devices, and methods of fabrication, assembly and use of the same, to provide highly localized neural recording and/or neural stimulation to a neurological target. The device includes multiple microelectrode elements arranged protruding shafts. The protruding shafts are enclosed within an elongated probe shaft, and can be expanded from their enclosure. The microelectrode elements, and elongated probe shafts, are dimensioned in order to target small volumes of neurons located within the nervous system, such as in the deep brain region. Beneficially, the probe can be used to quickly identify the location of a neurological target, and remain implanted for long-term monitoring and/or stimulation.
    Type: Grant
    Filed: March 31, 2011
    Date of Patent: January 24, 2017
    Assignee: ECOLE POLYTECHNIQUE FEDERALE DE LAUSANNE
    Inventors: André Mercanzini, Philippe Renaud, Claudio Pollo
  • Patent number: 9545207
    Abstract: A temporary implantable medical device lead includes a connector configured to connect the lead to an external control module. A helically coiled conductor includes a proximal end that is mechanically and electrically connected to the connector. The conductor includes a plurality of insulated filars. An insulative layer is removed from an uninsulated portion of each of the filars near a distal end of the conductor. The uninsulated portion of each of the filars is exposed at an outer surface of the conductor such that the exposed uninsulated portions of the filars define a plurality of electrodes at longitudinally spaced sections near the distal end of the conductor.
    Type: Grant
    Filed: July 9, 2013
    Date of Patent: January 17, 2017
    Assignee: Cardiac Pacemakers, Inc.
    Inventors: Bryan A. Clark, Timothy R. Jackson, Benjamin J. Haasl
  • Patent number: 9502340
    Abstract: A method for manufacturing a wiring board according to the present invention includes the steps of preparing a supporting substrate having a product forming region and a marginal region; preparing a separable metal foil whose area is larger than that of the product forming region and is smaller than that of the supporting substrate; fixing the separable metal foil to the supporting substrate by burying into the supporting substrate; forming a build-up section on the buried separable metal foil; integrally cutting out the supporting substrate, the separable metal foil and the build-up section; obtaining a laminated body for wiring board composed of the second metal foil and the build-up section by separating the first metal foil and the second metal foil; and forming the wiring conductor layer by removing a part of the second metal foil.
    Type: Grant
    Filed: December 10, 2013
    Date of Patent: November 22, 2016
    Assignee: KYOCERA CORPORATION
    Inventors: Daisuke Narumi, Yoshinori Nakatomi, Masaharu Yasuda
  • Patent number: 9497597
    Abstract: Methods and systems for determining the motion of an object by capturing motion data. The methods and systems may comprise the use of motion sensor tags adapted for disposal on an object, wherein motion data may be collected by said motion sensor tags and transmitted via radio frequency signal for processing of collected data comprising the motion data, direction of arrival data, amplitude data, and phase data. The same system may also be adapted to determine the position of a UAV or aircraft by intercepting radio frequency communications signals emanating from the object.
    Type: Grant
    Filed: December 21, 2015
    Date of Patent: November 15, 2016
    Assignee: Oahu Group, LLC
    Inventors: Robert Haruo Nakata, Isar Mostafanezhad, Robert Jeffrey Nakata
  • Patent number: 9480929
    Abstract: A playmate toy or similar children's toy is provided having associated wireless, batteryless ID tag that can be read from and/or written to using a radio-frequency communication protocol. The tag is mounted internally within a cavity of the toy and thereby provides wireless communication of stored information without requiring removal and reinsertion of the tag. In this manner, a stuffed animal or other toy can be quickly and easily identified non-invasively, without damaging the toy. Additional information (e.g., unique personality traits, special powers, skill levels, etc.) can also be stored on the ID tag, thus providing further personality enhancement, input/output programming, simulated intelligence and/or interactive gaming possibilities.
    Type: Grant
    Filed: March 21, 2016
    Date of Patent: November 1, 2016
    Assignee: MQ Gaming, LLC
    Inventor: Denise Chapman Weston
  • Patent number: 9485876
    Abstract: A method of manufacturing at least a portion of a printed circuit board. The method includes: applying a lamination adhesive on a first plural-layer substrate that includes a plurality of circuit layers with at least one first metal pad on a first side of the first plural-layer substrate; applying a protective film on the lamination adhesive; forming at least one via into the lamination adhesive to expose the at least one metal pad on the first side of the first plural-layer substrate; filling at least one conductive paste into the at least one via formed in the lamination adhesive; removing the protective film to expose the lamination adhesive on the first plural-layer substrate; and attaching the first plural-layer substrate with a second plural-layer substrate that includes a plurality of circuit layers with at least one second metal pad on a second side of the second plural-layer substrate.
    Type: Grant
    Filed: October 20, 2014
    Date of Patent: November 1, 2016
    Assignee: Viasystems Technologies Corp., L.L.C.
    Inventors: Raj Kumar, Monte P. Dreyer, Michael J. Taylor
  • Patent number: 9444213
    Abstract: A structure for wireless communication having a plurality of insulator layers, a conductor layer separating each of the insulator layers, and at least one connector connecting two conductor layers wherein an electrical resistance is reduced when an electrical signal is induced in the resonator at a predetermined frequency.
    Type: Grant
    Filed: October 21, 2013
    Date of Patent: September 13, 2016
    Assignee: NuCurrent, Inc.
    Inventors: Vinit Singh, Christine A. Frysz, Matthew Geary, Eitan Babcock, Justin Derbas, Alberto Peralta
  • Patent number: 9433787
    Abstract: A flexible-base electrode array for implantation within neural tissue, method of making the electrode array and use thereof, is provided. A surrogate neural tissue, method of making same and use thereof, is further provided. The use of the present flexible-base electrode array for implantation into the surrogate neural tissue for stimulation or recording neural activity, wherein the array is biocompatible with the surrogate tissue.
    Type: Grant
    Filed: October 22, 2012
    Date of Patent: September 6, 2016
    Assignee: The Governors of the University of Alberta
    Inventors: Anastasia Elias, Vivian Mushahwar, Walied Moussa, Cheng Cheng, Imad Khaled, Kathryn Todd
  • Patent number: 9433776
    Abstract: A method for forming a cochlear electrode array with a plurality of electrodes which are spaced so as to stimulate sites within a cochlea includes shaping a sheet of electrically conductive material to form a support structure and a plurality of electrodes, in which the electrodes are tethered to the support structure at the spacing of the cochlear electrode array. A cochlear lead includes a flexible body that has frictional characteristics that vary about its circumference. A cochlear lead includes a flexible body with a first region and a second region with different surface textures. This generates differential sliding forces during insertion of the cochlear lead which influence a motion of the cochlear lead during insertion. The cochlear lead having an electrode array with varying stiffness along its length is also provided.
    Type: Grant
    Filed: February 11, 2014
    Date of Patent: September 6, 2016
    Assignee: ADVANCED BIONICS LLC
    Inventors: Timothy Beerling, Chuladatta Thenuwara
  • Patent number: 9358825
    Abstract: In a gravure printing plate, a ratio of an area ratio of part of a second portion excluding second protrusions to the second portion, to an area ratio of a part of a portion excluding first protrusions to a portion that is part of a first portion that is located closer to the second portion than a line-shaped portion of a first protrusion located closest to the second portion ((an area ratio of the part of the second portion excluding the second protrusions to the second portion)/(an area ratio of the part of the portion excluding the first protrusions to the portion, the portion being a part of the first portion that is located closer to the second portion than the line-shaped portion of the first protrusion located closest to the second portion)) is about 0.3 or more and about 0.9 or less.
    Type: Grant
    Filed: January 21, 2016
    Date of Patent: June 7, 2016
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Takashi Sawada, Yasuyuki Shimada
  • Patent number: 9338899
    Abstract: A method of manufacturing a rigid-flexible printed circuit board includes providing a base substrate in which coverlays are respectively formed on two sides of a flexible copper foil laminate on both sides of which inner circuit patterns and a first window are respectively formed; layering insulation layers and copper foil layers on portions of coverlays which are to be a rigid region of the base substrate; forming a via hole in the rigid region, and, simultaneously, forming a via hole to correspond to the first window in a flexible region; forming outer circuit patterns including areas adjacent to the first window; and applying solder resists in the rigid region to expose portions of external circuit patterns. The region adjacent to the via holes in the flexible region includes additional plating portions for covering the coverlays.
    Type: Grant
    Filed: December 13, 2013
    Date of Patent: May 10, 2016
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Yang Je Lee, Il Woon Shin, Going Sik Kim, Doo Pyo Hong, Ha Il Kim, Dong Gi An
  • Patent number: 9287514
    Abstract: Disclosed is an device having high light-emitting efficiency. A metal complex represented by the following formula (1). In the formula (1), n represents an integer of 1 to 3. LA and LB each independently represent the moiety of a group bonded to an iridium atom, except for coordinating atoms. When n is 3, a metal complex represented by the following formula (1-3): wherein Me represents a methyl group) is excluded.
    Type: Grant
    Filed: September 12, 2011
    Date of Patent: March 15, 2016
    Assignees: SUMITOMO CHEMICAL COMPANY, LIMITED, NATIONAL UNIVERSITY CORPORATION HOKKAIDO UNIVERSITY
    Inventors: Noboru Kitamura, Eri Sakuda, Akitaka Ito, Takeo Hirokawa, Chizu Sekine, Yusuke Ishii
  • Patent number: 9227268
    Abstract: Methods, systems, and apparatuses are disclosed for improving fatigue strength and damage tolerance of metal materials. For example, a system is provided for laser shock peening a metal material, the system comprising: a momentum trap material; a laser; an actuator, capable of pressing the momentum trap material into intimate contact with a first side of the metal material; and an advancer, capable of advancing the momentum trap material relative to the first side of the metal material.
    Type: Grant
    Filed: March 31, 2008
    Date of Patent: January 5, 2016
    Assignee: LSP Technologies, Inc.
    Inventors: Nickolas K. McCoy, Jeff L. Dulaney, Steven M. Toller
  • Patent number: 9227049
    Abstract: A method for constructing a plug for an electrical connection to a multipolar lead for an active implantable medical device includes providing a plug body having an insulating monobloc central core, the monobloc central core having a generally cylindrical shape, a cylindrical side surface, and a housing, providing a connection wire and a conductive pod, attaching the connection wire to the conductive pod, placing the conductive pod into the housing with connection wire extending therefrom, placing a conductive cylindrical ring on the cylindrical side surface, wherein the cylindrical side surface centers the conductive cylindrical ring coaxially about the monobloc central core, attaching the conductive pod to the cylindrical ring to create an electrical contact zone on a cylindrical outer surface of the plug body.
    Type: Grant
    Filed: December 23, 2013
    Date of Patent: January 5, 2016
    Assignee: SORIN CRM S.A.S.
    Inventors: Willy Regnier, Hélène Viatgé
  • Patent number: 9161704
    Abstract: The invention is directed to a method of making an implantable insulated electrical circuit that utilizes polyparaxylylene, preferably as Parylene, a known polymer that has excellent living tissue implant characteristics, to provide for chronic implantation of conductive electrical devices, such as stimulators and sensors. The device is thin, flexible, electrically insulated, and stable after long exposure to living tissue. Layers of Parylene may be combined with layers of a polymer, such as polyimide, to yield greater design flexibility in the circuit. Multiple electrical conduction layers may be stacked in the circuit to increase packing density.
    Type: Grant
    Filed: February 18, 2015
    Date of Patent: October 20, 2015
    Assignee: Second Sight Medical Products, Inc.
    Inventors: Robert J Greenburg, Jordan M Neysmith, Neil H Talbot, Jerry Ok
  • Patent number: 9162053
    Abstract: Leads having directional electrodes thereon. Also provided are leads having directional electrodes as well as retention ledges to secure the electrodes to the leads. Also provided are leads with directional electrodes where all the electrodes have the same surface area. Methods of manufacturing leads and methods of treating conditions and selectively stimulating regions of the nervous system are also provided.
    Type: Grant
    Filed: March 31, 2011
    Date of Patent: October 20, 2015
    Assignee: Boston Scientific Neuromodulation Corporation
    Inventors: Gregory T. Schulte, Scott Kokones
  • Patent number: 9142520
    Abstract: Various semiconductor chip solder bump and underbump metallization (UBM) structures and methods of making the same are disclosed. In one aspect, a method is provided that includes depositing a layer of a first metallic material on a semiconductor chip. The first layer has a first physical quantity. A layer of a second metallic material is deposited on the layer of the first metallic material. The second layer has a second physical quantity. The first and second layers are reflowed to form a solder structure with a desired ratio of the first metallic material to the second metallic material.
    Type: Grant
    Filed: August 30, 2011
    Date of Patent: September 22, 2015
    Assignees: ATI Technologies ULC, Advanced Micro Devices, Inc.
    Inventors: Roden R. Topacio, Neil McLellan
  • Patent number: 9105459
    Abstract: A microchannel plate assembly includes a plurality of microchannel plates that are aligned along a common axis and coupled together. The microchannel plates each have an object-side surface and an image-side surface and the assembly has respective interfaces between the image-side surface and the object-side surface of adjacent microchannel plates. At least one ion barrier film is disposed on at least one of the microchannel plates, but only on the object-side surfaces in the interfaces.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: August 11, 2015
    Assignee: Exelis Inc.
    Inventor: Richard F. Floryan
  • Publication number: 20150143678
    Abstract: The present invention relates to a method of manufacturing an optical device for a back light unit, and an optical device and an optical device array manufactured by the method, in which optical device chips constituting the optical device array are each laid the sides thereof on a printed circuit board in such a manner that light can be emitted from the optical device chips in a lateral direction, thus reducing the overall thickness of the back light unit.
    Type: Application
    Filed: January 30, 2015
    Publication date: May 28, 2015
    Inventors: Bum Mo Ahn, Seung Ho Park, Ki Myung Nam