Conductor Or Circuit Manufacturing Patents (Class 29/825)
  • Patent number: 11005388
    Abstract: A multi-level inverter includes a coupling to a DC power source and a coupling to an AC power source, a plurality of capacitors arranged to create a set of nodes, and a plurality of switches located between the capacitors and the AC power source. Switches are configured to create an AC bypass in which the capacitors coupled to the DC power source may be isolated from the AC power source. The AC bypass is utilized as one of the switching states in a switching sequence that provides enhanced performance including but not limited to reduced electromagnetic interference and ripple.
    Type: Grant
    Filed: February 28, 2019
    Date of Patent: May 11, 2021
    Assignee: sonnen, Inc.
    Inventors: Alberto Berzoy Llerena, Andres Salazar-Llinas, Carlos Restrepo
  • Patent number: 10998555
    Abstract: An electrode joining method includes: an electrode sheet conveying step of conveying the cathode electrode sheet of a size enabling a plurality of cathode electrode layers to be acquired; an anomaly detecting step of detecting anomalies in the cathode electrode sheet; a specifying step of specifying a predetermined shape from an area excluding a location having an anomaly that was detected in the anomaly detecting step; a cutting step of cutting out the cathode electrode layer of the predetermined shape specified in the specifying step; and a step of joining the cathode electrode layer of the predetermined shape that was cut out to the PEM.
    Type: Grant
    Filed: December 14, 2018
    Date of Patent: May 4, 2021
    Assignee: HONDA MOTOR CO., LTD.
    Inventor: Yoshinori Tokunaga
  • Patent number: 10996242
    Abstract: A probe card, for testing an electrical characteristic of a device under test (DUT) including a plurality of semiconductor devices, includes a substrate, a first probe pin disposed on a surface of the substrate and including a tip portion capable of contacting a pad of the DUT, and a second probe pin disposed on the surface of the substrate and including a tip portion capable of contacting the pad of the DUT. The first probe pin protrudes further than the second probe pin protrudes from the surface of the substrate in a first direction that is substantially perpendicular to the surface of the substrate.
    Type: Grant
    Filed: June 6, 2017
    Date of Patent: May 4, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Gyu-Yeol Kim, Shin-Ho Kang
  • Patent number: 10959631
    Abstract: A neural interfacing device is disclosed. The neural interfacing device may include at least one microneedle electrode. The microneedle electrode may have one or more microneedles. The one or more microneedles may be shaped and positioned such that when the neural interfacing device is applied to a nerve, the one or more microneedles penetrate a nerve epineurium without any portion of the microneedle electrode penetrating any nerve axon beyond a depth of 500 micrometers.
    Type: Grant
    Filed: February 2, 2015
    Date of Patent: March 30, 2021
    Assignees: BIOCIRCUIT TECHNOLOGIES, INC., GEORGIA TECH RESEARCH CORPORATION
    Inventors: Robert J. Butera, Yogi A. Patel, James D. Ross, Swaminathan Rajaraman, Isaac Clements
  • Patent number: 10905545
    Abstract: Ophthalmic devices having elastic electrodes are disclosed herein. An example ophthalmic device may be an intraocular lens that includes a support structure, two optical windows, two immiscible fluids, and an elastic electrode. The support structure may have an inner surface defining an aperture with first and second optical windows disposed on opposite sides of the support structure and spanning the aperture. The two immiscible liquids may be disposed in a cavity formed by the aperture and the first and second optical windows, and the elastic electrode may be disposed on the inner surface. The elastic electrode may be formed from an elastic metal alloy having a minimum yield strain of 0.25%.
    Type: Grant
    Filed: April 3, 2018
    Date of Patent: February 2, 2021
    Assignee: VERILY LIFE SCIENCES LLC
    Inventors: Daniel B. Otts, Stein Kuiper
  • Patent number: 10899293
    Abstract: A body earth structure for a vehicle includes a bolt of which a head portion is swage-joined to an aluminum vehicle body panel. The bolt is provided to fasten an earth terminal to the vehicle. The bolt includes a projection that protrudes toward the vehicle body panel, on a facing surface of the head portion of the bolt. The facing surface is provided to face the vehicle body panel.
    Type: Grant
    Filed: January 22, 2019
    Date of Patent: January 26, 2021
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Takashi Furusawa, Eiji Yoshida
  • Patent number: 10844488
    Abstract: A chuck system for performing a substrate-biased atomic layer deposition process that forms an electrically conductive film on a substrate includes an electrically conductive substrate holder configured to support the substrate and an electrically conductive base that supports the substrate holder. An electrical isolating layer is sandwiched between the substrate holder and the base. The electrical isolating layer has an outer end and an edge recess formed in and that runs around the outer edge. The edge recess is configured to prevent the electrically conductive film from coating the entire interior of the edge recess, thereby maintaining electrical isolation between the substrate holder and the base.
    Type: Grant
    Filed: January 23, 2018
    Date of Patent: November 24, 2020
    Assignee: Veeco Instruments Inc.
    Inventors: Michael J. Sershen, Adam Bertuch
  • Patent number: 10815002
    Abstract: The present disclosure relates to a structural component of an aircraft wing body and an aircraft including the structural component. According to an aspect of the present disclosure, a structural component of an aircraft wing body is provided. The structural component includes a body part and a profile. The body part includes an edge portion formed by end portions of a first skin and a second skin of the body part superposed together. The profile is attached to the edge portion. The profile has an outer profile conforming to an outer profile of the body part such that the structural component, as a whole, exhibits an aerodynamic outer profile after the profile is attached to the edge portion. The profile is attached to the edge portion via a plurality of separate intermediate members or by contacting the edge portion.
    Type: Grant
    Filed: May 22, 2017
    Date of Patent: October 27, 2020
    Assignee: AIRBUS (S.A.S.)
    Inventor: Mei Ding
  • Patent number: 10773664
    Abstract: A bracket-equipped conductive path A, comprising: a conductive path main body; a protector that is tubular, is made of a synthetic resin, and surrounds the conductive path main body; a bracket that is made of a metal, includes a plate-shaped base portion, and is formed as a single body with the protector in a state in which at least a portion of the base portion is embedded in the protector; and a displacement restricting portion that the bracket is provided with, and that restricts displacement of the conductive path main body by abutting the conductive path main body.
    Type: Grant
    Filed: January 7, 2020
    Date of Patent: September 15, 2020
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventors: Toshinari Kobayashi, Kyungwoo Kim, Moriyuki Shimizu, Hironobu Yamamoto
  • Patent number: 10748773
    Abstract: Disclosed are a laser bonding apparatus and a laser bonding method capable of bonding an electronic component to a three-dimensional structure having a regular or irregular shape in a curved portion such as an automobile tail lamp or a headlamp. The laser bonding apparatus and method for a three-dimensional structure may prevent misalignment and poor bonding of the electronic component with respect to the three-dimensional structure.
    Type: Grant
    Filed: June 22, 2017
    Date of Patent: August 18, 2020
    Assignee: LASERSSEL CO., LTD.
    Inventors: Jae Joon Choi, Byung Rock Kim
  • Patent number: 10727953
    Abstract: A package for an optical receiver module is disclosed. The package includes a housing having electrically conductive walls including a rear and a pair of side walls, and a feed-through provided in the rear wall. The feed-through includes an internal portion, and an external portion protruding from the internal portion. The internal portion has a top face and a back face, the top face including ground lines, the back face including transmission lines with signal lines and ground lines.
    Type: Grant
    Filed: January 24, 2019
    Date of Patent: July 28, 2020
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Kazuaki Mii, Hiroshi Hara
  • Patent number: 10685851
    Abstract: The disclosure describes a method for making a hybrid cloth integrated column and further making TSV substrates, which comprises the key processing steps: forming a hybrid cloth by using metal wires and supportive wires, which contains at least one 2D array of parallel metal wires in one direction; forming a column of layered structure, which contains at least a plurality of layers of hybrid cloths, wherein all the 2D arrays of parallel metal wires are fixed in the column of layered structure and are arranged into a 3D array of parallel metal wires; making all the layers of the column of layered structure into a solid entity so as to form a hybrid cloth integrated column; and slicing the hybrid cloth integrated column to make TSV substrates.
    Type: Grant
    Filed: January 27, 2018
    Date of Patent: June 16, 2020
    Inventor: Yuci Shen
  • Patent number: 10680571
    Abstract: A conductive path with noise filter that enables an effective reduction in a surge noise in a specific frequency band is provided. A conductive path with noise filter includes conductive path main, an insulating holder, inductors provided in the holder, receiving terminal fittings provided in the holder, insertion-side terminal fittings capable of being fitted to the receiving terminal fittings, a U-phase capacitor provided between the U-phase wire and the U-phase insertion-side terminal fitting, a V-phase capacitor provided between the V-phase wire and the V-phase insertion-side terminal fitting, and a W-phase capacitor provided between the W-phase wire and the W-phase insertion-side terminal fitting.
    Type: Grant
    Filed: August 27, 2015
    Date of Patent: June 9, 2020
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Keiji Hirata, Takeshi Aizawa
  • Patent number: 10629371
    Abstract: A method of manufacturing a coil component, includes forming a conductive pattern on a substrate; forming an opening portion over a surface of the substrate so as to be disposed between neighboring conductors of the conductive pattern, the opening portion having a depth that is equivalent to or greater than a clearance dimension between the neighboring conductors; and forming a coil pattern by growing the conductive pattern including by plating.
    Type: Grant
    Filed: June 9, 2017
    Date of Patent: April 21, 2020
    Assignee: FUJITSU LIMITED
    Inventors: Masayuki Itoh, Hiroshi Kurosawa
  • Patent number: 10609800
    Abstract: A light string, an automatic assembly apparatus and an automatic assembly method thereof are provided. The method includes steps of: arranging lamp housings in a lamp housing carrier by using an assembly machine; actuating a holder to move horizontally by using the assembly machine to align light-emitting elements with accommodating spaces of the lamp housings, respectively; actuating the holder to move vertically toward the lamp housing carrier by using the assembly machine to move the light-emitting elements into the accommodating spaces to be bonded to the lamp housings, respectively; removing a first wire and a second wire together with the light-emitting elements from the holder by the assembly machine; passing the first wire and the second wire through lamp housing through holes of the lamp housings by using the assembly machine; and taking out the light string from the lamp housing carrier by using the assembly machine.
    Type: Grant
    Filed: September 26, 2018
    Date of Patent: March 31, 2020
    Assignee: COSMO LIGHTING INC.
    Inventor: Nai-Chen Tsai
  • Patent number: 10597771
    Abstract: A rare earth thin-film magnet of a Nd—Fe—B film deposited on a Si substrate, wherein, when the film thickness of the rare earth thin film is 70 ?m or less, the Nd content satisfies the conditional expression of 0.15?Nd/(Nd+Fe)?0.25 in terms of an atomic ratio; when the film thickness of the rare earth thin film is 70 ?m to 115 ?m (but excluding 70 ?m), the Nd content satisfies the conditional expression of 0.18?Nd/(Nd+Fe)?0.25 in terms of an atomic ratio; and when the film thickness of the rare earth thin film is 115 ?m to 160 ?m (but excluding 115 ?m), the Nd content satisfies the conditional expression of 0.20?Nd/(Nd+Fe)?0.25 in terms of an atomic ratio. An object of the present invention is to provide a rare earth thin-film magnet having a maximum film thickness of 160 ?m and which is free from film separation and substrate fracture, and a method of producing such a rare earth thin-film magnet by which the thin film can be stably deposited.
    Type: Grant
    Filed: October 19, 2015
    Date of Patent: March 24, 2020
    Assignee: JX NIPPON MINING & METALS CORPORATION
    Inventors: Masaki Nakano, Hirotoshi Fukunaga, Takeshi Yanai, Hironobu Sawatari
  • Patent number: 10574039
    Abstract: A peeling apparatus 1 includes a first peeling die and a second peeling die respectively including a pair of cutting blades 251 that peels the insulating film by being moved in a direction perpendicular to an axial direction of the conductive wire material 2 to cut the insulating film, and a support die 253 that supports a side surface of the conductive wire material 2 from a downstream side in a moving direction of the cutting blades 251 at the time of cutting by the cutting blades 251, the support die 253 of the first peeling die including a convex portion 2533 protruding toward the conductive wire material 2.
    Type: Grant
    Filed: September 18, 2017
    Date of Patent: February 25, 2020
    Assignees: HONDA MOTOR CO., LTD, SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Hideki Shigematsu, Masafumi Saito, Keita Miyashita, Ryuzo Sakamoto, Hiroyuki Miyajima, Akio Komamura
  • Patent number: 10549179
    Abstract: The subject disclosure provides for obtaining marker data representing marker movement with reduced displacement from game rig joint centers using a motion capture compression suit deployed and form-fitted onto target participants in order to reduce excess marker movement during a motion capture shooting cycle. The motion capture suit includes a first layer having a first type of material with seams defining one or more predetermined regions on the first layer. In some aspects, the first layer applies an amount of compression onto a surface of a subject when the motion capture suit is worn by the subject. The motion capture suit includes a second layer having a second type of material for non-permanent fastening of one or more marker elements on a surface of the second layer. In some aspects, the second layer is arranged on the first layer within the one or more predetermined regions of the first layer.
    Type: Grant
    Filed: April 3, 2018
    Date of Patent: February 4, 2020
    Assignee: Electronic Arts Inc.
    Inventor: Megan Jeanne Moreau
  • Patent number: 10545621
    Abstract: A mass produced electrically conductive device with sufficiently high yield, even when forming a conductive layer pattern having an extremely small thickness/minimum area using a minimum amount of silver paste. The identifier-providing device has a conductive layer pattern formed on a rear surface of a base material as an insulator. The silver paste forming the conductive layer pattern contains only silver flakes, as silver particles, that have a particle size in a range of 3.0 to 5.0 ?m and that has a thickness of 100 nm at a largest thickness portion, while having a thickness of 50 nm at a smallest thickness portion. The conductive layer pattern is formed to have a film thickness of 10 ?m or less by laminating the silver flakes in the thickness direction. The silver flakes forming the conductive layer are in a fused state or an aggregating/cohering state at the smallest thickness portion.
    Type: Grant
    Filed: October 17, 2018
    Date of Patent: January 28, 2020
    Assignee: Gocco Co., LTD.
    Inventors: Mori Masayuki, Kondo Takashi, Takagishi Susumu
  • Patent number: 10515758
    Abstract: A method of manufacturing a coil component includes the steps of disposing a dummy metal layer on a base; laminating a base insulating resin on the dummy metal layer; exposing the dummy metal layer by disposing an opening part in the base insulating resin; disposing a spiral wiring on the base insulating resin and disposing a sacrificial conductor on the dummy metal layer in the opening part of the base insulating resin; enlarging the sacrificial conductor by plating by energizing the dummy metal layer; covering the spiral wiring and the sacrificial conductor with an insulating resin; exposing the sacrificial conductor by disposing an opening part in the insulating resin; forming a hole part by removing the sacrificial conductor by etching from the opening part of the insulating resin; and constructing the inner magnetic path of a magnetic resin by filling the hole part with the magnetic resin.
    Type: Grant
    Filed: December 19, 2017
    Date of Patent: December 24, 2019
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Akinori Hamada, Kenji Nishiyama, Shinji Yasuda
  • Patent number: 10505172
    Abstract: A current collecting board includes a base board, a conductive board mounted on the base board, a number of conductive plates, and a number of security elements. The base board includes a first surface, a second surface, and a number of receiving protrusions extending upwardly from the first surface. The base board defines a number of first through holes, each receiving protrusion surrounds a first through hole. Each conductive plate defines a second through hole. The receiving protrusion includes a number of leading blocks and a number of clamping blocks; each conductive plate is received in a receiving protrusion and clamped between the leading blocks and the clamping blocks. One end of each security element is solder to and electrically connected to a conductive plate, the other end of each security element is soldered to the conductive board. A battery module using the current collecting board is also provided.
    Type: Grant
    Filed: March 15, 2018
    Date of Patent: December 10, 2019
    Assignee: Shenzhen Anding New Energy Technology Development Co., Ltd.
    Inventors: Xiaoming Yu, Shirong Wu, Hao Xu, Haizhou Yan, Zhijian Cai
  • Patent number: 10480106
    Abstract: Embodiments relate to conductive textiles and methods of their production, as well as systems for electronically connecting devices through conductive textiles. An example textile comprises a first electrically conductive track; a second electrically conductive track; and at least one non-conductive portion. At least a portion of the first electrically conductive track overlaps or is in close proximity to at least a portion of the second electrically conductive track. At least said portions of the respective tracks are separated by an insulating material so that there is no electrical coupling between the first and second tracks.
    Type: Grant
    Filed: December 18, 2015
    Date of Patent: November 19, 2019
    Assignee: Commonwealth Scientific and Industrial Research Organisation
    Inventors: Andrzej Stanislaw Krajewski, Laurence Michael Staynes, Ilias Louis Kyratzis, Douglas James Dower, Peter Ralph Herwig
  • Patent number: 10481360
    Abstract: A telecommunications cable jacket insertion system operates to insert a telecommunication cable into a jacket after the jacket has been separately extruded. The system includes a jacket having structures for easily inserting a cable therein over a long distance in a field location. The system can further include a tool for facilitating the insertion of the cable into the jacket. Further, a cabling system includes a cable assembly that is disaggregated into a robust outer jacketing portion and a manageable fiber optic cable portion. For regions of a cable installation where a robust cable construction is desired, the manageable fiber optic cable portion is sheathed or otherwise contained within the robust outer jacketing portion. For regions of a cable installation where a robust cable construction is not needed, the manageable fiber optic cable portion extends beyond or outside of the robust outer jacketing portion.
    Type: Grant
    Filed: November 16, 2017
    Date of Patent: November 19, 2019
    Assignee: CommScope Technologies LLC
    Inventors: Eric Emmanuel Alston, Julian S. Mullaney, William Alan Carrico
  • Patent number: 10445637
    Abstract: An assembly and method of manufacture of a radio frequency identification (RFID) assembly having a passive RFID semiconductor chip and a two sided planar antenna and a spacer composed of an electrically non-conducting foam material that is configured for non-absorbing of a substantial amount of energy at the predetermined operating frequency, the spacer having a predetermined thickness and that is configured for non-absorbing of a substantial amount of radio frequency energy at the predetermined operating frequency wherein the RFID tag assembly is configured to receive at a first side of the two sided planar antenna a first portion of the radio frequency energy as direct energy and is configured to receive at a second side of the planar antenna a second portion of the radio frequency energy as indirect energy responsive to the absorbing by the absorbing material body.
    Type: Grant
    Filed: April 17, 2019
    Date of Patent: October 15, 2019
    Assignee: Innovative Timing Systems, LLC
    Inventor: Kurt S. Hansen
  • Patent number: 10406350
    Abstract: Described herein are microelectrode array devices, and methods of fabrication and use of the same, to provide highly localized and efficient electrical stimulation of a neurological target. The device includes multiple microelectrode elements arranged along an elongated probe shaft. The microelectrode elements are dimensioned and shaped so as to target individual neurons, groups of neurons, and neural tissue as may be located in an animal nervous system, such as deep within a human brain. Beneficially, the neurological probe can be used to facilitate location of the neurological target and remain implanted for long-term monitoring and/or stimulation.
    Type: Grant
    Filed: June 17, 2016
    Date of Patent: September 10, 2019
    Assignee: ECOLE POLYTECHNIQUE FEDERALE DE LAUSANNE
    Inventors: Andre Mercanzini, Philippe Renaud
  • Patent number: 10381809
    Abstract: A device for removing a sheath of electrical conductors of a preferably multicore cable (K), preferably comprises at least one holding arrangement/clamping device for clamping the cable (K), and a blade arrangement (1), which can preferably be rotated about the longitudinal cable axis, for the sheath. A pull-off device (A) for the at least partially cut sheath is integrated into the device. This pull-off device (A) comprises pull-off mechanism (5), which is designed for connection to the sheath and for exertion of a force on the sheath parallel to the cable axis. The invention further relates to a method of removing an inner sheath of electrical conductors of a multicore cable (K).
    Type: Grant
    Filed: November 13, 2017
    Date of Patent: August 13, 2019
    Assignee: SCHLEUNIGER HOLDING AG
    Inventors: Carmelo Messina, Jörg Furrer, Klemens Imholz, Roman Widmer
  • Patent number: 10328674
    Abstract: Provided is a laminated glass including, in order: a first glass sheet; a first interlayer film; a transparent film laminated with a heat reflection film; a second interlayer film; and a second glass sheet, wherein the first interlayer film and the second interlayer film are formed of a modified hydrogenated block copolymer [E], the modified hydrogenated block copolymer [E] is a hydrogenated block copolymer [D] in which an alkoxysilyl group is incorporated, the hydrogenated block copolymer [D] being a block copolymer [C] in which 90% or more of all unsaturated bonds is hydrogenated, the block copolymer [C] is composed of at least two polymer blocks [A] including a repeat unit derived from an aromatic vinyl compound, and at least one polymer block [B] including a repeat unit derived from a linear conjugated diene compound, and the ratio of weight fraction [A]:[B] is 30:70 to 60:40.
    Type: Grant
    Filed: July 7, 2015
    Date of Patent: June 25, 2019
    Assignee: ZEON CORPORATION
    Inventors: Teiji Kohara, Daido Chiba
  • Patent number: 10311354
    Abstract: An assembly and method of manufacture of a radio frequency identification (RFID) assembly having a passive RFID semiconductor chip and a two sided planar antenna and a spacer composed of an electrically non-conducting foam material that is configured for non-absorbing of a substantial amount of energy at the predetermined operating frequency, the spacer having a predetermined thickness and that is configured for non-absorbing of a substantial amount of radio frequency energy at the predetermined operating frequency wherein the RFID tag assembly is configured to receive at a first side of the two sided planar antenna a first portion of the radio frequency energy as direct energy and is configured to receive at a second side of the planar antenna a second portion of the radio frequency energy as indirect energy responsive to the absorbing by the absorbing material body.
    Type: Grant
    Filed: September 13, 2018
    Date of Patent: June 4, 2019
    Assignee: Innovative Timing Systems, LLC
    Inventor: Kurt S. Hansen
  • Patent number: 10300531
    Abstract: The present disclosure provides a method of manufacturing a composite material. The method can include compacting a copper alloy powder into a plurality of substantially uniform compressed sub-assemblies such that the copper alloy powder has a density that is greater than 50%. The plurality of compressed sub-assemblies can be layered relative one another within an aperture of a shell, the plurality of compressed sub-assemblies to form a consecutive assembly of compacted copper alloy. The shell may include one of the following: a precipitation hardened copper alloy, copper alloy, and carbon steel. The consecutive assembly can be sealed within the shell to form a billet. The billet can be hot-extruded to form a rod, and the extruded rod can be further drawn to form a composite wire of a desired diameter. The composite wire may be used to create a composite welding electrode.
    Type: Grant
    Filed: February 10, 2016
    Date of Patent: May 28, 2019
    Assignee: LUVATA OHIO, INC.
    Inventor: Brian E. Swank
  • Patent number: 10264697
    Abstract: A protective cabinet for storage and protection of equipment, wherein the cabinet (1) includes lateral (1a), upper (1b) and lower (1c) walls, and is provided with swivel rollers (2) and leveling support feet (3), as well as with front (4) and posterior (5) doors. The upper wall (1b) of the cabinet (1) is inclined and provided with external integrated hooks (7), and the cabinet (1) is further internally provided with sets of vertical profiles (8) provided with orifices (8a), as well as with vertical supports (9) provided with shafts (9a), the orifices (8a) and shafts (9a) adapted to receive the installation and the fixing of several types of components/devices. The protective cabinet (1) is provided with a mobile rear compartment (11), which may provide accommodation for a ventilation/refrigeration/acclimatization system of the cabinet.
    Type: Grant
    Filed: October 13, 2015
    Date of Patent: April 16, 2019
    Inventor: Daniel Fazenda Freire
  • Patent number: 10237058
    Abstract: The present invention can be a method, system, and computer program product. One embodiment of the present invention provides a computer-implemented method for identifying an artificial object. The method includes receiving capacitance data which is obtained by measuring with at least one electrodes in a sensor at least one predefined surfaces of the artificial object placed against the sensor; converting each of the obtained capacitance data into an evaluation level in an evaluation system having more than two evaluation levels, to obtain a capacitance distribution on the surface of the artificial object; determining whether the obtained capacitance distribution matches a pre-registered capacitance distribution or one of pre-registered capacitance distributions; and if the determination result is positive, concluding the artificial object is identified.
    Type: Grant
    Filed: November 12, 2015
    Date of Patent: March 19, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Toru Aihara, Tadanobu Inoue, Noboru Kamijo, Takeo Nakada
  • Patent number: 10199737
    Abstract: Materials that exhibit magneto-dielectric effects with high local order in the form of distinct basic units with a defined geometry that provides orientation and spacing that prevents contact between conductive components of a basic unit are disclosed. Use of multiple basic units arranged, for example by embedment, in essentially random orientation relative to one another provides a composite material with magneto-dielectric effects that isotropic and homogeneous. Such basic units are readily manufacturable using conventional techniques.
    Type: Grant
    Filed: October 6, 2017
    Date of Patent: February 5, 2019
    Assignee: Matsing, Inc.
    Inventor: Serguei Matitsine
  • Patent number: 10177029
    Abstract: Interconnect structures and methods for forming an interconnect structure. A sacrificial layer is formed on a substrate and an interconnect opening is formed that extends vertically through the sacrificial layer into the substrate. The interconnect opening is filled with a conductor to form a conductive feature. After filling the interconnect opening with the conductor, a dielectric layer is formed on the sacrificial layer. After the dielectric layer is formed on the sacrificial layer, the sacrificial layer is removed to form an air gap layer arranged vertically between the dielectric layer and the substrate.
    Type: Grant
    Filed: October 23, 2017
    Date of Patent: January 8, 2019
    Assignee: GLOBALFOUNDRIES Inc.
    Inventors: Robert J. Fox, III, Sunil K. Singh
  • Patent number: 10165719
    Abstract: An electronic component mounting system includes: a printing apparatus; an electronic component mounting apparatus; and a mounting information storage unit which stores mounting information. The mounting information includes execution mode information in which one of a first mounting mode and a second mounting mode is set for each of electronic components. In the first mounting mode, the electronic component is placed at a mounting position corrected on the basis of a recognition result of a first recognition mark formed on a board. In the second mounting mode, the electronic component is placed at a mounting position corrected on the basis of a recognition result of a second recognition mark formed by paste printed on the board. The electronic components are mounted on the board according to mounting modes set for the respective electronic components by referring to the mounting information.
    Type: Grant
    Filed: December 19, 2013
    Date of Patent: December 25, 2018
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Katsuhiko Itoh, Daisuke Nagai, Mitsuo Nakamura
  • Patent number: 10154582
    Abstract: The invention relates to a cased electrical component comprising a carrier substrate (10), a spring device (20), which is arranged on the carrier substrate (10), a chip (30), which on a first side (31) of the chip is coupled to the spring device (20), and a cover element (100), which is arranged on the carrier substrate (10). The cover element (100) is arranged over the chip (20) such that the cover element (100) is in contact with the chip (30) at least on a second side (32) of the chip, which is different from the first side. The component has a low space requirement and is highly sealed with respect to influences from the surroundings.
    Type: Grant
    Filed: October 27, 2017
    Date of Patent: December 11, 2018
    Assignee: SnapTrack, Inc.
    Inventors: Wolfgang Pahl, Jürgen Portmann
  • Patent number: 10139970
    Abstract: A mass produced identifier providing device with sufficiently high yield, even when forming a conductive layer pattern having an extremely small thickness/minimum area using a minimum amount of silver paste. The identifier-providing device has a conductive layer pattern formed on a rear surface of a base material as an insulator. The silver paste forming the conductive layer pattern contains only silver flakes, as silver particles, that have a particle size in a range of 3.0 to 5.0 ?m and that has a thickness of 100 nm at a largest thickness portion, while having a thickness of 50 nm at a smallest thickness portion. The conductive layer pattern is formed to have a film thickness of 10 ?m or less by laminating the silver flakes in the thickness direction. The silver flakes forming the conductive layer are in a fused state or an aggregating/cohering state at the smallest thickness portion.
    Type: Grant
    Filed: June 30, 2016
    Date of Patent: November 27, 2018
    Assignee: Goggo Co., LTD.
    Inventors: Mori Masayuki, Kondo Takashi, Takagishi Susumu
  • Patent number: 10074048
    Abstract: The present invention relates to an RFID device that is intended to be used in connection with direct or indirect packaging of consumer food products, such as with the use of food trays, totes and other transport packaging for perishable items. The RFID device may include a RFID inlay assembly that has been encased in a laminate that is safe for use with food products.
    Type: Grant
    Filed: June 19, 2014
    Date of Patent: September 11, 2018
    Assignee: AVERY DENNISON RETAIL INFORMATION SERVICES, LLC
    Inventors: Bernd Selgrath, Ian James Forster
  • Patent number: 10062298
    Abstract: An open hardware education kit is provided. The open hardware education kit comprises an expansion board. The expansion board comprises a plurality of metal terminals joinable with a magnet, a plurality of conductive connection wires respectively connected with the metal terminals, and a plurality of pin headers respectively connected with the connection wires. The plurality of pin headers are joinable with an expansion header of open hardware.
    Type: Grant
    Filed: January 25, 2016
    Date of Patent: August 28, 2018
    Assignee: Korea University Research and Business Foundation
    Inventor: Sughui Kim
  • Patent number: 10018888
    Abstract: Improved optical interferometric modulators have a small waveguide spacing so that the waveguide pair are close to the central electrode, to enhance electro-optic interaction. Asymmetric waveguides with differential indices are used to effectively de-couple the waveguide pair. Multiple sections of asymmetric waveguide pairs with alternating differential indices are used to achieve chirp-free operation. Another version of the device utilizes transmission-line electrode that weave closer to one of the waveguide pair alternately between sections. Another version of the device utilizes waveguide structure that one of the waveguide is closer to the central electrode in alternate section. To improve efficiency further, a DC bias is provided on the outer electrodes configured as an RF-ground but DC-float electrodes. Another improvement is to have a slot is cut underneath the waveguide region to effectively reduce to thickness of the substrate. These improvements lead to higher modulator efficiency.
    Type: Grant
    Filed: June 6, 2013
    Date of Patent: July 10, 2018
    Assignee: EOSpace, Inc.
    Inventor: Suwat Thaniyavarn
  • Patent number: 9986771
    Abstract: Methods of forming garments having one or more stretchable conductive ink patterns. Described herein are method of making garments (including compression garments) having one or more highly stretchable conductive ink pattern formed of a composite of an insulative adhesive, a conductive ink, and an intermediate gradient zone between the adhesive and conductive ink. The conductive ink typically includes between about 40-60% conductive particles, between about 30-50% binder; between about 3-7% solvent; and between about 3-7% thickener. The stretchable conductive ink patterns may be stretched more than twice their length without breaking or rupturing.
    Type: Grant
    Filed: February 2, 2015
    Date of Patent: June 5, 2018
    Assignee: L.I.F.E. Corporation S.A.
    Inventors: Gianluigi Longinotti-Buitoni, Andrea Aliverti
  • Patent number: 9945903
    Abstract: This invention enhances reliability of an electrical test. A semiconductor device manufacturing method in which a potential (first potential) is supplied by bringing a plurality of first and second test terminals into contact with a plurality of leads, respectively in the step of supplying the potential to the leads (first leads) to carry out the electrical test. The first test terminals come into contact with the leads, individually, and the second test terminals come into contact with the leads in one batch.
    Type: Grant
    Filed: May 10, 2016
    Date of Patent: April 17, 2018
    Assignee: Renesas Electronics Corporation
    Inventors: Toshitsugu Ishii, Naohiro Makihira, Hidekazu Iwasaki, Jun Matsuhashi
  • Patent number: 9949404
    Abstract: An electric device having a printed circuit board fitted with components, and at least one foam component, the foam component surrounding the circuit board at least partially so as to form a housing.
    Type: Grant
    Filed: January 9, 2013
    Date of Patent: April 17, 2018
    Assignee: SEW-EURODRIVE GMBH & CO. KG
    Inventors: Josef Schmidt, Martin Schömer
  • Patent number: 9892609
    Abstract: A wearable device wearable on a body and a method and an apparatus for providing information by using the wearable device are provided. The wearable device includes at least two sensing units configured to sense detect biometric information of a wearer of the wearable device, and a connector electrically connecting the at least two sensing units to each other and having elasticity.
    Type: Grant
    Filed: May 10, 2016
    Date of Patent: February 13, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jae-hong Kim, Jin-hong Min, Jea-hyuck Lee, Jae-geol Cho, Ju-hee Kim, Jae-hong Kim, Chang-hyun Kim, Kang-jin Yoon
  • Patent number: 9855417
    Abstract: A method of manufacturing a device for brain stimulation includes forming a lead body having a distal end section and coupling at least one pre-electrode to the distal end section of the lead body. The pre-electrode defines a divider with a plurality of partitioning arms, and has a plurality of fixing lumens. A portion of the pre-electrode aligned with the portioning arms is removed to divide the pre-electrode into a plurality of segmented electrodes. Each of the plurality of segmented electrodes defines at least one of the plurality of fixing lumens at least partially disposed through the segmented electrode. A material is introduced through the at least one fixing lumen to couple the plurality of segmented electrodes to the lead body.
    Type: Grant
    Filed: September 15, 2014
    Date of Patent: January 2, 2018
    Assignee: Boston Scientific Neuromodulation Corporation
    Inventors: John Michael Barker, Aditya Vasudeo Pandit, Anne Margaret Pianca
  • Patent number: 9820513
    Abstract: Techniques to determine depth for a number of wearable devices, which may be worn in layers are provided. A wearable device can receive measurements from sensors to include sensors from a number of other wearable devices. Based on the sensor measurements, the wearable device can determine a depth for the wearable devices. The depth can include an indication of which wearable device is closest to a user, which wearable device is closest to an external environment, or the like.
    Type: Grant
    Filed: December 23, 2014
    Date of Patent: November 21, 2017
    Assignee: INTEL CORPORATION
    Inventors: John C. Weast, Wendy March, Eric Lewallen, Cory J. Booth
  • Patent number: 9797583
    Abstract: An LED strip lighting fixture having an array of LEDs mounted on a frangible rigid aluminum base having a predetermined thickness, the thickness including predetermined points of weakness, whereby the rigid, preferably aluminum, base can be broken at the predetermined points of weakness. The rigid base has disposed thereon a laminated integrated circuit on which are mounted a plurality of electrical elements including a plurality of light emitting diodes in series electrical connection on the laminated integrated circuit whereby the frangible sections of the rigid base provide for easy customization in providing predetermined length dimensions of the rigid aluminum base and LED mounted lighting fixture. A secondary benefit of the interconnectability of the integral base and LED combination is that the heat of expansion and subsequent contraction of the metal base is accommodated by the mount and housing to reduce tick and ping noise.
    Type: Grant
    Filed: November 19, 2014
    Date of Patent: October 24, 2017
    Inventor: Ryan P. Hanslip
  • Patent number: 9775988
    Abstract: A stimulation lead can include segmented electrodes arranged in a single or double helix or other helical arrangement. In one method of manufacture, an electrode carrier with segmented electrode receiving openings is used. Another method employs a connected framework of helically arranged pre-electrodes that are separated during manufacture. Yet another method employs a mold to generate a planar carrier over the segmented electrodes followed by rolling the carrier into a cylinder. A further method includes forming an electrode assembly by alternative segmented electrodes with non-conducting spacers.
    Type: Grant
    Filed: December 1, 2014
    Date of Patent: October 3, 2017
    Assignee: Boston Scientific Neuromodulation Corporation
    Inventors: Andrew Govea, Joshua Dale Howard
  • Patent number: 9741646
    Abstract: This disclosure provides a package substrate and its fabrication method. The package substrate includes: a carrier; a first wiring layer formed on the carrier; a conductive pillar layer having a plurality of metal pillars on the first wiring layer; a molding compound layer formed on the first wiring layer, covering all the first wiring layer and the metal pillars, and exposing one end face of each metal pillar; a second wiring layer formed on the molding compound layer and the exposed end faces of the metal pillars; and a protection layer formed on the second wiring layer.
    Type: Grant
    Filed: August 5, 2014
    Date of Patent: August 22, 2017
    Assignee: PHOENIX PIONEER TECHNOLOGY CO., LTD.
    Inventors: Chin-Yao Hsu, Shih-Ping Hsu
  • Patent number: 9736936
    Abstract: A system comprises an article comprising one or more fabric layers, a plurality of electronic devices, each being incorporated into or onto one of the one or more fabric layers, and one or more communication links between two or more of the plurality of electronic devices. Each of the plurality of electronic devices can comprise a flexible substrate coupled to the fabric layer, one or more metallization layers deposited on the flexible substrate, and one or more electronic components electrically coupled to the one or more metallization layers.
    Type: Grant
    Filed: February 1, 2016
    Date of Patent: August 15, 2017
    Assignee: Intel Corporation
    Inventors: Christopher Jezewski, Ravi Pillarisetty, Brian Doyle
  • Patent number: 9721944
    Abstract: A hybrid semiconductor bipolar switch in which a normally-on high-voltage wide-bandgap semiconductor bipolar switch and a normally-off field effect transistor are connected in a cascode (Baliga-pair) configuration. The switch may be constructed as a stacked hybrid device where a discrete transistor is bonded on top of a bipolar switch. Power systems may use plural switches paired with anti-parallel diodes.
    Type: Grant
    Filed: December 30, 2015
    Date of Patent: August 1, 2017
    Assignee: United Silicon Carbide, Inc.
    Inventors: Leonid Fursin, Anup Bhalla