Heat dissipating protective cover

A heat dissipating protective cover for electronic devices includes a bottom plate, a protective edge disposed around the periphery of the bottom plate, a containing space defined by an enclosure jointly formed by the bottom plate and the protective edge for containing an electronic device, and a heat dissipating plate installed in the bottom plate, so that the heat generated by the electronic device installed with the protective cover is dissipated through the heat dissipating plate to the outside to achieve a good heat dissipation effect during the operation of the electronic device without the need of removing the protective cover and assure the service life of the electronic device. Meanwhile, the electronic device can be operated without removing the protective cover, so that the protective cover will not be lost easily, and this design can eliminate the trouble and inconvenience of the users.

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Description
FIELD OF THE INVENTION

The present invention relates to the technical field of protective covers for electronic devices, in particular to a heat dissipating protective cover that provides better heat dissipation and convenience of use.

BACKGROUND OF THE INVENTION

As science and technology advance rapidly and human beings have increasingly higher demand on life quality, various different electronic products are developed. To maximize the performance of electronic products, all kinds of portable electronic products with handheld operating functions are introduced. Among these electronic products, palm devices including mobile phones, PDAs, palm game players and notebook computers are basically electronic processing devices, and their related input devices include thin keyboards, touch pads or trackballs, and a cable or wireless transmission technology is adopted between the electronic processing device and the electronic input device, and the common cable transmission technology uses a USB or PS2 transmission line for data registration, and the wireless transmission technology uses a radio frequency (RF) or Bluetooth module for the wireless communication and data transmission with the electronic processing device. However, the present existing palm devices are high precision devices that do not allow any improper collision, so that it is necessary pay much attention when carrying or using these palm devices. Therefore, related protective covers are developed and introduced to the market, and the protective covers can prevent surfaces of the electronic devices such as the notebook computers from being scratched. In general, the protective covers of this sort are attached closely to upper and lower surfaces of the electronic device to prevent these surfaces from being scratched.

However, the heat dissipation issue must be taken into consideration for the use of these electronic devices such as the notebook computers. The heat generated by the electronic devices must be eliminated quickly, not only maintaining a smooth operation of the notebook computers, but also extending the service life of the notebook computers, When the protective cover is mounted onto the notebook computer, the protective cover is attached closely to the bottom of the notebook computer. As a result, the heat dissipation is poor when the notebook computer is used. Therefore, users are recommended to remove the protective cover from the electronic device before use, and such arrangement may cause trouble and inconvenience of use to users, and the protective cover removed from the electronic device may be lost easily.

SUMMARY OF THE INVENTION

It is a primary objective of the present invention to overcome the aforementioned drawbacks of the prior art by providing a heat dissipating protective cover capable of protecting the casing of an electronic device and improving the heat dissipation effect while using the electronic device.

To achieve the aforementioned and other objectives, the present invention provides a heat dissipating protective cover, comprising a bottom plate, a protective edge disposed around the periphery of the bottom plate, a containing space defined by an enclosure by the bottom plate and the protective edge and provided for containing an electronic device, and a heat dissipating plate installed in the bottom plate. When the electronic device contained in the heat dissipating protective cover of the present invention is operated, the produced heat is passed through the heat dissipating plate and transmitted to the outside, and the good heat dissipation effect can dissipate the heat generated by the operation of the electronic device without the need of removing the protective cover to assure the service life of the electronic device. In the meantime, the electronic device can be operated without the need of removing the protective cover, so that the protective cover will not be lost easily, and this design can eliminate the trouble and inconvenience of the users.

Preferably, the protective edge is an elastic structure, so that the electronic device can be installed in the protective cover easily to provide a convenient installation.

Preferably, the bottom plate has a cooling groove corresponding to the heat dissipating plate, and the heat dissipating plate is coupled to the cooling groove correspondingly.

Preferably, the heat dissipating plate is adhered into the cooling groove to provide a secured structure.

Preferably, the protective edge of the bottom plate has an opening formed thereon and provided for facilitating user to connect the electronic device with external connection lines.

Preferably, the protective edge has a free end inwardly bent to form a snap portion for securing the electronic device.

Preferably, the protective edge is a plastic protective edge.

Preferably, the bottom plate is a metal bottom plate.

Compared with the prior art, the present invention includes a heat dissipating plate installed in the bottom plate, so that the protective cover is installed onto an notebook computer such as the electronic device, the heat generated by the electronic device can be dissipated to the outside through the heat dissipating plate to achieve a good heat dissipation effect and perform the heat dissipation of the electronic device without the need of removing the protective cover and assure the service life of the electronic device. IN the meantime, the electronic device can be operated without removing the protective cover, so that the protective cover will not be lost or missing easily to reduce the trouble and inconvenience of users.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a rear view of the present invention;

FIG. 2 is a front view of the present invention;

FIG. 3 is a cross-sectional view of the present invention; and

FIG. 4 is a schematic view of a heat dissipating plate of the present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

The objects, characteristics and effects of the present invention will become apparent with the detailed description of the preferred embodiments and the illustration of related drawings as follows.

With reference to FIGS. 1 to 3 for a heat dissipating protective cover of the present invention, the heat dissipating protective cover 10 comprises a bottom plate 1, a protective edge 2 disposed around the periphery of the bottom plate 1, a containing space 3 defined by an enclosure jointly formed by the bottom plate 1 and the protective edge 2 and provided for containing an electronic device, wherein the bottom plate 1 has a heat dissipating plate 4 installed therein, so that the heat generated by the operation of the electronic device installed with the protective cover can be dissipated through the heat dissipating plate 4 to the outside, and the good heat dissipation effect can dissipate the heat generated by the operation of the electronic device without the need of removing the protective cover 10 to assure the service life of the electronic device. In the meantime, the electronic device can be operated without the need of removing the protective cover 10o that the protective cover will not be lost easily, and this design can eliminate the trouble and inconvenience of the users.

Preferably, the protective edge 2 is an elastic structure, such that the electronic device can be installed into the protective cover 10 easily to provide a convenient installation. More specifically, the protective edge 2 is a plastic protective edge with good elasticity. Of course, the entire backside of the bottom plate 1 can be coated with a plastic layer (not shown in the figure). Preferably, the bottom plate 1 has a cooling groove 11 formed thereon and at a position corresponding to the heat dissipating plate 4, and the heat dissipating plate 4 is coupled to the cooling groove 11. In this preferred embodiment, the heat dissipating plate 4 is adhered and secured into the cooling groove 11. Further, the bottom plate 1 is a metal bottom plate, and the good thermal conductivity of the metal of the heat dissipating plate 4 provides a good heat dissipation effect at the bottom plate 1, and such metal can be aluminum, silver, copper, or any other good conductive materials such as thermally conductive colloid.

In this preferred embodiment, the heat dissipating plate 4 has an area equal to 80%-90% of the bottom plate 1, so that the heat dissipating area of the protective cover 10 is large to achieve the good heat dissipation effect. In addition, a thin film (not shown in the figure) is preferred coated onto the heat dissipating plate 4, wherein the thin film can be a metal thin film such as a silver thin film. Of course, the invention is not limited to this material only, but other thin films with good thermal conductivity can be used as well.

Preferably, the protective edge 2 of the bottom plate 1 has an opening 21 formed thereon and provided for facilitating user to connect the electronic device with external connection lines or used for other purposes such as a speaker jack. In this preferred embodiment, there are several openings 21. In FIG. 3, the protective edge 2 has a free end inwardly bent to form a snap portion 22 for fixing the electronic device, so that the protective cover 10 will not be detached from the electronic device easily.

In the present invention, the heat dissipating plate 4 installed in the bottom plate 1 can dissipate the heat generated from the operation of the electronic device such as a notebook computer to the outside through the heat dissipating plate 4 effectively to achieve a good heat dissipation effect and dissipate heat generated by the electronic device without the need of removing the protective cover 10 and assure the service life of the electronic device. In the meantime, the electronic device can be operated without removing the protective cover, so that the protective cover 10 will not be lost easily, and this design can eliminate the trouble and inconvenience of the users.

While the invention has been described by means of specific embodiments, numerous modifications and variations could be made thereto by those skilled in the art without departing from the scope and spirit of the invention set forth in the claims.

Claims

1. A heat dissipating protective cover, comprising:

a bottom plate, a protective edge disposed around the periphery of the bottom plate, a containing space defined by an enclosure jointly formed by the bottom plate and the protective edge and provided for containing an electronic device, and a heat dissipating plate installed in the bottom plate.

2. The heat dissipating protective cover of claim 1, wherein the protective edge is an elastic structure.

3. The heat dissipating protective cover of claim 1, wherein the bottom plate has a cooling groove formed thereon and at a position corresponding to the heat dissipating plate and provided for coupling the heat dissipating plate.

4. The heat dissipating protective cover of claim 3, wherein the heat dissipating plate is adhered into the cooling groove.

5. The heat dissipating protective cover of claim 1, wherein the protective edge has an opening formed thereon.

6. The heat dissipating protective cover of claims 1, wherein the protective edge has a free end inwardly bent to form a snap portion for securing the electronic device.

7. The heat dissipating protective cover of claims 2, wherein the protective edge has a free end inwardly bent to form a snap portion for securing the electronic device.

8. The heat dissipating protective cover of claims 3, wherein the protective edge has a free end inwardly bent to form a snap portion for securing the electronic device.

9. The heat dissipating protective cover of claims 4, wherein the protective edge has a free end inwardly bent to form a snap portion for securing the electronic device.

10. The heat dissipating protective cover of claims 5, wherein the protective edge has a free end inwardly bent to form a snap portion for securing the electronic device.

11. The heat dissipating protective cover of claim 1, wherein the protective edge is a plastic protective edge.

12. The heat dissipating protective cover of claim 1, wherein the bottom plate is a metal bottom plate or a thermally conductive plastic body.

13. The heat dissipating protective cover of claim 1, wherein the heat dissipating plate has a thin film disposed on a surface of the heat dissipating plate.

14. The heat dissipating protective cover of claim 3, wherein the heat dissipating plate has a thin film disposed on a surface of the heat dissipating plate.

15. The heat dissipating protective cover of claim 14, wherein the thin film is a metal thin film.

Patent History
Publication number: 20140110083
Type: Application
Filed: Oct 22, 2012
Publication Date: Apr 24, 2014
Inventor: HONG-CHANG, CHENG (New Taipei City)
Application Number: 13/657,081
Classifications
Current U.S. Class: Structural Installation (165/47)
International Classification: F28F 9/00 (20060101);