HEAT SINK ASSEMBLY

Abstract

A heat sink assembly includes a heat sink. The heat sink includes a base. The base defines a hermetic space. The base includes a panel body and a plurality of magnetic posts extending from the panel body. The plurality of magnetic posts are located in the hermetic space.

Description

BACKGROUND

1. Technical Field

The present disclosure relates to a heat sink assembly.

2. Description of Related Art

A traditional computer includes a heat sink assembled to a heat generating device to dissipate heat from the heat generating device. However, the heat sink is secured to the heat generating device by screws, making the installation process laborious and time-consuming.

BRIEF DESCRIPTION OF THE DRAWINGS

Many aspects of the embodiments can be better understood with references to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.

FIG. 1 is an exploded, isometric view of one embodiment of a heat sink assembly.

FIG. 2 is the heat sink of FIG. 1 viewed from another angle.

FIG. 3 is an assembled view of the heat sink assembly of FIG. 1.

FIG. 4 is a cross-sectional view of FIG. 3 taken along line IV-IV.

DETAILED DESCRIPTION

The disclosure is illustrated by way of example and not by way of limitation in the figures of the accompanying drawings in which like references indicate similar elements. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean “at least one.”

FIGS. 1 and 2 show that a heat sink assembly, according to one embodiment, includes a printed circuit board 10, a supporting frame 30, and a heat sink 50.

The printed circuit board 10 includes a board body 11 and a heat generating device 13 mounted to the board body 11. The board body 11 defines a plurality of securing holes 15.

The supporting frame 30 is made of metal. The supporting frame 30 includes a supporting frame body 31 and a plurality of securing portions 33, extending from the supporting frame body 31. The supporting frame body 31 defines an opening 310. The supporting frame body 31 includes a support portion 311 and a flange 313 substantially perpendicularly extending from the support portion 311. The support portion 311 is rectangular and is substantially parallel to the board body 11. The support portion 311 and the flange 313 surround the opening 310. The cross sections of the support portion 311 and the flange 313 are L-shaped taken along a plane substantially perpendicular to the board body 11.

The heat sink 50 includes a base 51 and a plurality of fins 53 extending from the base 51. The fins 53 are substantially parallel to each other. The base 51 includes a soaking panel 511 and defines a hermetic space 513. The soaking panel 511 is located in the hermetic space 513. The soaking panel 511 includes a panel body 5111, a plurality of protrusions 5115 extending from the panel body 5111, and a plurality of magnetic posts 5113 around the edges of the panel body 5111 The magnetic posts 5113 surround the protrusions 5115. The protrusions 5115 prevent the panel body 5111 from being deformed in assembly.

FIGS. 3 and 4 show that in assembly, the securing portions 33 of the supporting frame 30 are aligned with the securing holes 15. The securing portions 33 pass through the securing holes to mount the supporting frame 30 to the printed circuit board 10, such that the heat generating device 13 is received in the opening 310 of the supporting frame 30. The base 51 is placed on and magnetically adheres to the support portion 311 of the supporting frame 30 because of the magnetic posts 5113. This allows the panel body 5111 to contact the heat generating device 13 and guide heat to the fins 53. The flange 313 of the supporting frame 30 prevents the heat sink 50 from moving.

The base 51 magnetically adheres to the supporting frame 30, easily securing the heat sink 50 to the supporting frame 30. In disassembly, the heat sink 50 is forcibly pulled to detach from the supporting frame 30.

It is to be understood, however, that even though numerous characteristics and advantages of the embodiments have been set forth in the foregoing description, together with details of the structure and function of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the present disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Claims

1. A heat sink assembly, comprising a heat sink, the heat sink comprises a base; the base defines a hermetic space; the base comprises a panel body and a plurality of magnetic posts extending from the panel body; and the plurality of magnetic posts are located in the hermetic space.

2. The heat sink assembly of claim 1, wherein the base further comprises a plurality of protrusions extending from the panel body; the plurality of protrusions are located in the hermetic space and surrounded by the plurality of magnetic posts.

3. The heat sink assembly of claim 1, wherein the heat sink further comprises a plurality of fins extending from the base, and the plurality of fins are substantially parallel to each other.

4. The heat sink assembly of claim 1, further comprising a printed circuit board and a supporting frame, wherein the printed circuit board comprises a board body and a heat generating element mounted to the board body; the supporting frame is mounted on the board body; the supporting frame defines an opening; the heat generating element is located in the opening; the base is mounted on the supporting frame; and the panel body contacts the heat generating element.

5. The heat sink assembly of claim 4, wherein the supporting frame comprises a supporting frame body; the supporting frame body comprises a support portion surrounding the opening; the support portion is substantially parallel to the board body; and the base is placed on the support portion.

6. The heat sink assembly of claim 5, wherein the supporting frame body further comprises a flange extending from the support portion; the flange surrounds the base; the flange is configured to prevent the base from moving along a direction substantially parallel to the board body.

7. The heat sink assembly of claim 6, wherein cross sections of the support portion and the flange are L-shaped taken along a plane substantially parallel to the board body.

8. The heat sink assembly of claim 4, wherein the supporting frame comprises a supporting frame body and a plurality of securing portions extending from the supporting frame body; the opening is defined in the supporting frame body; and the board body defines a plurality of securing holes receiving the plurality of securing portions.

9. A heat sink assembly, comprising:

a printed circuit board, the printed circuit board comprises a board body and a heat generating element mounted to the board body;

a supporting frame mounted to the board body, the supporting frame is made of metal;

a heat sink, the heat sink comprises a base placed on the supporting frame and contacting the heat generating element; the base defines a hermetic space; the base comprises a plurality of protrusions and a plurality of magnetic posts are located in the hermetic space; and the base absorbs the supporting frame via magnetic force.

10. The heat sink assembly of claim 9, wherein the plurality of protrusions are surrounded by the plurality of magnetic posts.

11. The heat sink assembly of claim 9, wherein the heat sink further comprises a plurality of fins extending from the base, and the plurality of fins are substantially parallel to each other.

12. The heat sink assembly of claim 9, wherein the supporting frame defines an opening; the heat generating element is located in the opening.

13. The heat sink assembly of claim 12, wherein the supporting frame comprises a supporting frame body; the supporting frame body comprises a support portion surrounding the opening; the support portion is substantially parallel to the board body; and the base is placed on the support portion.

14. The heat sink assembly of claim 13, wherein the supporting frame body further comprises a flange extending from the support portion; the flange surrounds the base; the flange is configured to prevent the base from moving along a direction substantially parallel to the board body.

15. The heat sink assembly of claim 14, wherein cross sections of the support portion and the flange are L-shaped taken along a plane substantially parallel to the board body.

16. The heat sink assembly of claim 12, wherein the supporting frame comprises a supporting frame body and a plurality of securing portions extending from the supporting frame body; the opening is defined in the supporting frame body; and the board body defines a plurality of securing holes receiving the plurality of securing portions.