CONTAINER DATA CENTER WITH COOLING SYSTEM

A container data center includes a container and a cooling system. The container defines an air inlet and an air outlet. The cooling system includes a housing, a heat dissipation plate received in the housing, and a fan. The housing defines an airflow output aligning with the air inlet of the container and a number of access holes. The fan is received in the housing and aligns with the airflow output. The heat dissipation plate defines a number of through holes. The fan draws airflow to enter the housing from the access holes and extend through the through holes. The airflow enters the container from the airflow output of the housing and the air inlet of the container to be heated. The heated air is exhausted out of the container through the air outlet.

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Description
BACKGROUND

1. Technical Field

The present disclosure relates to a container data center including a cooling system.

2. Description of Related Art

Typical container data centers include a container, a number of servers, and a cooling system. The servers and the cooling system are both received in the container, occupying most of the interior space of the container. As such, less space is reserved for heat dissipation in the container, resulting in a lower heat dissipation efficiency. In addition, it is also difficult to optimize the arrangement of the servers and the cooling system which are both in the same container to obtain a high heat dissipation efficiency of the container data center.

BRIEF DESCRIPTION OF THE DRAWINGS

Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, all the views are schematic, and like reference numerals designate corresponding parts throughout the several views.

FIG. 1 is an exploded, isometric view of a first exemplary embodiment of a container data center.

FIG. 2 is an assembled, isometric view of FIG. 1.

FIG. 3 is a cross-sectional view of FIG. 2, taken along the line of III-III.

FIG. 4 is an assembled, isometric view of a second exemplary embodiment of a container data center.

FIG. 5 is a cross-sectional view of FIG. 4, taken along the line of V-V.

DETAILED DESCRIPTION

The present disclosure, including the accompanying drawings, is illustrated by way of examples and not by way of limitation. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.

FIGS. 1-3 show a first exemplary embodiment of a container data center 100. The container data center 100 includes a container 20, a row of cabinets 24, a partitioning piece 26, and a cooling system 40.

The container 20 includes a rectangular bottom wall 222, a top wall 224 opposite to the bottom wall 222, and four sidewalls 226 respectively connected between four edges of the bottom wall 222 and the top wall 224. The row of cabinets 24 are arrayed on the bottom wall 222, along the lengthwise direction of the bottom wall 222. The partitioning piece 26 is connected between the top wall 224 and tops of the cabinets 24. A cool channel 27 and a heat channel 80 are defined in the container 20, at two opposite sides of the row of cabinets 24 and the partitioning piece 26. One side of the top wall 224 of the container 20 defines a row of air inlets 227 along the lengthwise direction of the container 20, the air inlets 227 communicating with the cool channel 27. The other side of the top wall 224 defines a row of air outlets 228 along the lengthwise direction of the container 22, the air outlet 228 communicating with the heat channel 28. Four corners of the top wall 224 of the container 22 respectively define a position hole 225.

The cooling system 40 includes a housing 42, a heat dissipation apparatus 44, and a plurality of fans 46.

The housing 42 includes a rectangular bottom plate 422, a top plate 424 opposite to the bottom plate 422, and four side plates 426 respectively connected between four edges of the bottom plate 422 and the top plate 424. The bottom plate 422 defines a row of airflow outputs 4221 in one side of the bottom plate 422, and a row of airflow inputs 4222 in the other side of the bottom plate 422. A circular extending pipe 4223 extends out from a circumference bounding each of the airflow outputs 4221 and airflow inputs 4222. One of the side plates 426 adjacent to the airflow inputs 4222 defines a plurality of access holes 4262 adjacent to the top plate 422, and a plurality of vents 4263 adjacent to the bottom plate 422. An L-shaped partition plate 427 is received in the housing 42, one side of the partition plate 427 is mounted on the bottom plate 422, and the other side of the partition plate 427 is mounted on the side plate 426 defining the vents 4263. The partition plate 427, the bottom plate 422, and the side plate 426 cooperatively bound a space 428. The airflow inputs 4222 and the vents 4263 are respectively communicated with the space 428. Four position pins 429 extend out from corners of the bottom plate 422.

The heat dissipation apparatus 44 includes a support bracket 442 received in the housing 42 and a heat dissipation plate 444 installed on the support bracket 442. The support bracket 442 is connected to inner surfaces of the four side plates 426 of the housing 42. An inner space of the housing 42 is divided into a first space 425 and a second space 423 by the support bracket 442. The access holes 4262 communicate with the first space 425, and the airflow outputs 4221 communicate with the second space 423. The support bracket 442 defines a position opening 4421 for positioning the heat dissipation plate 444. The heat dissipation plate 444 defines a plurality of through holes 4442 communicating with the first and second spaces 425 and 423. A refrigerant duct 4443 is formed in the heat dissipation plate 444. The refrigerant duct 444 includes a refrigerant input end 4445 and a refrigerant output end 4446 respectively extending through two opposite edges of the heat dissipation plate 444. The heat dissipation plate 444 is made of heat conduction material, such as aluminum, steel, or copper, and is integrally formed. A refrigerant input pipe 472 is connected to the refrigerant input end 4445, and a refrigerant output pipe 474 is connected to the refrigerant output end 4446. A moisture filter apparatus 448 is mounted on the heat dissipation plate 444, in the first space 425.

The fans 46 are respectively installed on the bottom plate 422 and the side plate 426 defining the vents 4263, and respectively align with the airflow outputs 4221 and the vents 4263. The fans 46 aligning with the airflow outputs 4221 guide air to flow out of the second space 423 through the airflow outputs 4221. The fans 46 aligning with the vents 4263 guide air to flow out of the space 428 through the vents 4263.

In assembly, the housing 42 is supported on the container 20. The extending pipes 4223 at the airflow outputs 4221 and the airflow inputs 4222 are respectively inserted into the air inlets 227 and the air outlets 228, and the position pins 429 are respectively inserted into the position holes 225.

In use, a considerable heat is generated by a plurality of servers of the cabinets 24 during operation. Refrigerant flows into the refrigerant duct 4443 of the heat dissipation plate 444 from the refrigerant input end 4445, and flows out of the refrigerant duct 4443 from the refrigerant output end 4446. The refrigerant can be liquid, such as cold water, or cold air. The fans 46 draw airflow to flow into the first space 425 from the access holes 4262. The airflow flows through the moisture filter apparatus 448 and the through holes 4442 of the heat dissipation plate 444, and enters the second space 423. The airflow is cooled by the refrigerant of the heat dissipation plate 444 to become cool airflow. The cool airflow flows into the cool channel 27 of the container 20 from the airflow outputs 4221 and the air inlets 227 by the fans 46. The cool airflow flows through the row of cabinets 24, and the heat of the cabinets 24 is transferred to the cool airflow. The cool airflow is heated and flows into the heat channel 28 of the container 20. The heated airflow enters the space 428 through the air outlets 228 of the container 20, the airflow inputs 4222 of the housing 42, and is dissipated out of the housing 42 from the vents 4263 through the fans 46.

When the airflow flowing in the first space 425 has a lower temperature, the refrigerant is not needed.

FIG. 4 and FIG. 5 show a second exemplary embodiment of a container data center 100a. The container data center 100a is substantially similar to the first embodiment of the container data center 100. The container data center 100a includes a container 20a and a housing 42a located with the container 22a side by side. The housing 42a is similar to the housing 42, but omits the partition plate 427, the airflow inputs 4222, the fans 46 received in the space 428, and the vents 4263. A lower portion of the side plate of the housing 42a adjacent to the container 20a defines a plurality of airflow outputs 4221a. A lower portion of one sidewall of the container 20a adjacent to the housing 42a defines a plurality of air inlets 227a respectively aligning with the airflow outputs 4221a. An upper portion of another sidewall of the container 20a opposite to the air inlets 227a defines a plurality of air outlets 228.

Even though numerous characteristics and advantages of the embodiments have been set forth in the foregoing description, together with details of the structure and function of the embodiments, the present disclosure is illustrative only, and changes may be made in details, especially in the matters of shape, size, and arrangement of parts within the principles of the embodiments to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Claims

1. A cooling system, comprising:

a housing defining an access hole and an airflow output;
a heat dissipation apparatus comprising a heat dissipation plate received in the housing and positioned between the access hole and the airflow input; and
a first fan installed to the housing;
wherein the heat dissipation plate defines a plurality of through holes, the first fan draws airflow to enter the housing through the access hole and pass through the plurality of through holes, and flow out of the housing through the airflow output.

2. The cooling system of claim 1, wherein the heat dissipation apparatus further comprises a support bracket received in the housing between the access hole and the airflow output, an inner surface of the housing is divided into a first space and a second space by the support bracket, the access hole is communicated with the first space, and the airflow output is communicated with the second space, the support bracket defines a position opening for positioning the heat dissipation plate, the first space is communicates with the second space through the plurality of through holes.

3. The cooling system of claim 2, wherein the airflow output is defined in a bottom plate of the housing, the bottom plate of the housing defines an airflow input away from the airflow output, the access hole is defined in an upper portion of a side plate of the housing adjacent to the airflow input, a lower portion of the side plate defines a vent, a partition plate is received in the housing and is connected between the bottom plate and the side plate, the partition plate, the bottom plate, and the side plate cooperatively bound a third space, the airflow input and the vent are communicated with the third space, the first fan is mounted to the bottom plate and aligns with the airflow output.

4. The cooling system of claim 3, wherein an extending pipe extends out from an edge bounding each of the airflow output and the airflow input.

5. The system of claim 3, further comprising a second fan received in the third space and aligning with the vent, to guide air flowing out of the third space through the vent.

6. The cooling system of claim 2, wherein the airflow output is defined in a side plate of the housing, the access hole is defined in an opposite side plate of the housing, the first fan is mounted to the side plate and aligns with the airflow output.

7. The cooling system of claim 1, wherein the heat dissipation plate is made of heat conduction material.

8. The cooling system of claim 1, wherein the heat dissipation plate forms a refrigerant duct for receiving refrigerant.

9. The cooling system of claim 8, wherein the refrigerant duct comprises a refrigerant input end and a refrigerant output end respectively extending through two edges of the heat dissipation plate, a refrigerant input pipe is connected to the refrigerant input end, and a refrigerant output pipe is connected to the refrigerant output end.

10. A container data center, comprising:

a container defining an air inlet and an air outlet; and
a cooling system comprising a housing attached to the container, a heat dissipation plate received in the housing, and a first fan;
wherein the housing defines an airflow output aligning with the air inlet of the container and a plurality of access holes, the first fan is mounted in the housing and aligns with the airflow output, the heat dissipation plate defines a plurality of through holes, the first fan draws airflow to enter the housing through the plurality of access holes and pass through the plurality of through holes of the heat dissipation plate, the airflow enters the container from the airflow output of the housing and the air inlet of the container to be heated, and the heated airflow is exhausted out of the container through the air outlet of the container.

11. The container data center of claim 10, wherein the cooling system further comprises a heat dissipation apparatus, the heat dissipation apparatus comprises a support bracket received in the housing between the plurality of access holes and the airflow output, an inner surface of the housing is divided into a first space and a second space by the support bracket, the plurality of access hole is communicated with the first space, and the airflow output is communicated with the second space, the support bracket defines a position opening for positioning the heat dissipation plate.

12. The container data center of claim 10, wherein the heat dissipation plate forms a refrigerant duct, refrigerant is received in the refrigerant duct.

13. The container data center of claim 12, wherein the refrigerant duct comprises a refrigerant input end and a refrigerant output end respectively extending through two edges of the heat dissipation plate, a refrigerant input pipe is connected to the refrigerant input end, and a refrigerant output pipe is connected to the refrigerant output end.

14. The container data center of claim 10, wherein a row of cabinets is arrayed in the container along a lengthwise direction of the container, and a partition piece is connected between tops of the cabinets and the container, a cool channel and a heat channel are defined in the container at two opposite sides of the row of cabinets and the partition piece, the air outlet communicates with the cool channel, and the air inlet communicates with the heat channel.

15. The container data center of claim 14, wherein the housing is supported on a top wall of the container, the air inlet and the air outlet are respectively defined in two opposite sides of the top wall of the container, the airflow output is defined in a bottom plate of the housing, the bottom plate of the housing defines an airflow input aligning with the air outlet of the container, the plurality of access holes is defined in an upper portion of a side plate of the housing adjacent to the airflow input, a lower portion of the side plate defines a vent, a partition plate is received in the housing and is connected between the bottom plate and the side plate, the partition plate, the bottom plate, and the side plate cooperatively bound a third space, the airflow input and the vent are communicated with the third space.

16. The container data center of claim 15, wherein an extending pipe extends out from an edge bounding each of the airflow input and the airflow output, and is inserted into a corresponding one of the air inlet and the air outlet of the container.

17. The container data center of claim 15, wherein the cooling system further comprises a second fan received in the third space and aligning with the vent.

18. The container data center of claim 14, wherein the housing and the container are positioned side by side, the air outlet is defined in a sidewall of the container adjacent to the housing, the air outlet is defined in an opposite sidewall of the container away from the housing, the airflow output is define in a side plate of the housing and aligns with the air inlet, and the plurality of access holes is defined an opposite plate of the housing away from the container.

19. The container data center of claim 18, wherein an extending pipe extends out from an edge bounding the airflow output, and is inserted into the air inlet of the container.

Patent History
Publication number: 20140150999
Type: Application
Filed: Dec 11, 2012
Publication Date: Jun 5, 2014
Applicant: HON HAI PRECISION INDUSTRY CO., LTD. (New Taipei)
Inventor: CHAO-KE WEI (New Taipei)
Application Number: 13/711,492
Classifications
Current U.S. Class: Mechanical Gas Pump (165/121)
International Classification: F28F 13/12 (20060101);