PROFILING A MANUFACTURED PART DURING ITS SERVICE LIFE
Profiling a manufactured part during its service life, including capturing by an optical scanner images of the part, the part characterized by an expected service life and by attributes with specifications of design values, including capturing the images at more than one time during an actual service life of the part; measuring by a data processor operatively coupled to the scanner, based upon the captured images, actual values of one or more of the attributes when the images are captured; storing, in a database by the data processor operatively coupled to the scanner, the measurements of the actual values of the attributes; and making a determination, from the stored actual values by a data processor operatively coupled to the database, whether the part continues to comply with its specification during the actual service life of the part.
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This patent application claims the benefit and priority of U.S. Provisional patent application Ser. No. 61/871,002, filed Aug. 28, 2013, and entitled “Optical Systems For Measuring A Drilled Hole In A Structure And Methods Relating Thereto.”
BACKGROUNDMany manufactured parts are tested and inspected for quality control throughout their service lives. Such tests require precision metrology, very accurate measurement and inspection of mass produced and custom components, components in wind turbines, jet engines, combustion gas turbines, nuclear reactors, ships, automobiles, other aviation components, medical devices and prosthetics, 3D printers, plastics, fiber optics, other optics for telescopes, microscopes, cameras, and so on. The list is long, and the problems are large. In inspecting an airframe, for example, an inspection checks the diameter and circularity of each of thousands of holes at different depths to ensure that each hole is perpendicular to a surface, circular in cross section as opposed to elliptical, not conical, not hourglass-shaped, and so on. Such inspections are performed by human quality assurance inspectors, who inspect large groups of holes at one time, extremely laboriously.
Prior art attempts at the high precision measurement include focal microscopy for fringe pattern analysis, that is image analysis by comparison with a pre-image of a correct part, difficult to deploy and not very accurate. Other prior art includes capacitive probes such as described for example in U.S. 2012/0288336. Such capacitive probes, however, take measurements in only one direction at a time, requiring multiple measurements to assess a part, never assembling a complete image of the inside of a part. Moreover, a capacitive probe must fit tightly into or onto a part to be measured, aligned closely to the center axis of the hole, and for calibration purposes, must have the same probe-to-hole-side separation at all times—because its capacitance is calibrated according to the thickness of the layer of air between the probe and a component to be scanned or measured. When such a capacitive probe identifies a problem with a part, and the part is redrilled or remilled to a larger size, the capacitive probe must be swapped out to a larger diameter probe in order to remeasure the part.
Prior art optical scanners that otherwise might be useful for high precision, high volume measurements for quality control during the service lives of components typically are too bulky to move with respect to a part under inspection. Such optical scanners are typically mounted on a fixture with a scanned part in a jig that moves with respect to the scanner. This fixed physical orientation between the optical scanner and a part to be scanned or measured means that there are always aspects of the part that cannot be reached, measured, scanned, or imaged by such a prior art optical scanner. This limitation of prior art has given rise to so-called multi-sensor metrology devices that include both optical scan capability and also tactile sensors that attempt to measure portions of a part that optical scan illumination cannot reach—all in an attempt to build a scanner that can scan a part accurately and completely. One manufacturer of metrology equipment, for example, combines three types of sensor probes, a light section sensor, a shape-from-focus (SFF) sensor, and a tactile sensor, all of which are said to work in unison to achieve optimum measurement, even in areas where scan illumination cannot reach.
Example apparatus for profiling a manufactured part during its service life are described with reference to the accompanying drawings, beginning with
For a part that is repeatedly tested over time for continued compliance with its design specifications, sets of measurements taken and recorded during each test are stored in a profile of the part. Each such set of measurements can be used to determine whether at any given point in time the part continues to meet its specification. Observing changes in such test measurements over time can support a determination of when the part is expected to fail to comply even for a part that still meets its specification. ‘Profiling’ as the term is used here refers to the overall process of making and using profiles, including profile elements developed during manufacturing.
An object to be scanned is represented in this example of
Optical scanners according to many embodiments of the present invention, that is, optical scanners adapted for profiling manufactured parts, have the capability of acquiring by imaging and profilometry a “full service profile” of a manufactured part. Such a full service profile optionally includes both a high precision 3D scan and also a high precision surface profile of a part. The high accuracy 3D scan achieves microresolution regarding volumetric aspects of an object, that is, linear measurement along volumetric aspects, length, width, circumference, diameter, cavity or hole depths, and so on, with precision on the order of micrometers. The surface profile is effected as optical profilometry, measurements of roughness or smoothness of surfaces, through focus detection, intensity detection, differential detection, Fourier profilometry, or the like, also typically with precision on the order of micrometers.
A profile or a full service profile in embodiments also can include ‘squeeze out’ detection. The manufactured part (202) in the example of
The manufactured part (202) in the example of
From the captured images, the processor determines measures actual values of attributes of the part when the images are captured. In this example of
Set forth just below is an example schema of a database for storing measurements of a part in a profile. Each paragraph in the schema represents a database record type having a record name followed by a description of the record. Each record includes several fields each of which is composed of a field name, indented under the record name, and a description of the data to be stored in the field. This example schema is focused on profiles for drilled holes in manufacturing aircraft, but readers will recognize the adaptability of such a database structure to any or all manufactured parts. The example schema:
-
- TopLevelAircraftPartMatch—each records matches a specific part to a specific aircraft
- Index_id—unique entry ID, foreign key relating all records in a profile
- AircraftSerialNumber—unique ID for an aircraft
- PartNumber—component ID within an aircraft
- PartSerialNumber—system-wide ID for the component
- AircraftHolePartMatch—matches holes to specific parts, related one-to-many with TopLevelAircraftPartMatch
- Index_id—same
- PartSerialNumber—same
- Hole_id—uniquely identifying a hole in the part to be scanned
- HoleClass—assigned hole identifier linking the design specifications
- HoleSliceMatch—each record represents a single captured image, these records are related many-to-one with AircraftHolePartMatch
- Index_id—same
- Hole_id—same as in AircraftHolePartMatch
- Slice_id—unique identifier of a single capture of a scan image
- ImageStore—the image data itself
- TimeStamp—time of capture of the image represented by this record
- SliceData—each record represents a point from a slice from processing ImageStore, related one-to-many with HoleSliceMatch
- Index_id—same
- Point_id—identifies a point in part space as an element of a slice, a point in an image
- X—x coordinate of the point in bore space
- Y—y coordinate of the point in bore space
- Z—z coordinate of the point in bore space
- IntensityFlag—Boolean indication of the presence of intensity values of scan illumination read from an image sensor that are outside a deviation window for a slice, possible indications of surface abnormalities, burrs, cracks, or the like.
- SliceComputedData—each record represents a slice built up from point data, these records are related one-to-one with HoleSliceMatch and many-to-one with SliceData
- Index id—same
- Slice id—same as in HoleSliceMatch
- Z—hole depth of a slice
- Diameter—computed diameter for hole slice
- CenterX—x coordinate in bore space of the center of a slice
- CenterY—y coordinate in bore space of the center of a slice
- SizeOfLargestFlaggedPointCluster—maximum measured scan line thickness
- DeviationFlag—Boolean indication whether scan slice meets specification
- HoleComputedData—each record represents profile data for an entire hole as built up from slice data, these records are related one-to-one with AircraftHolePartMatch and many-to-one with SliceComputedData
- Index_id—same
- Hole_id—same as in AircraftHolePartMatch
- CounterSinkAngle—measured countersink slope from surface to top of hole
- CSA_Pass—Boolean indication whether countersink angle meets specification
- CS_Depth—countersink measured depth
- CSD_Pass—Boolean indication whether countersink depth meets specification
- Diameter—measured specification for hole diameter
- DiameterPass—Boolean indication whether measured diameter meets specification
- DeviationAlert—Boolean indication of usefulness of slice data for hole calculations
- TimeStamp—time when this data was computed for a hole
- AverageCircularity—average of values from slices of a hole
- Concentricity—computed with respect to top surface neighboring a hole
- Perpendicularity—maximum deviation from vertical axis among slices of a hole
- GripLength—total depth of bore from outer surface to bottom or rear
- FastenerInstall—each record represents profile data for a fastener for a hole, these records are related one-to-one with AircraftHolePartMatch
- Index_id—same
- Hole_id—same
- PointCloudStore—reflection data from fan illumination, similar to ImageStore
- HeadFlushness—height of top of fastener from surrounding surface
- HeadAngleToSurface—slope from top of fastener to surrounding surface
- HeadDepth—depth of top of fastener under surrounding surface, when applicable
- InstallPass—Boolean indication whether fastener meets specification
- HoleSpec—each record represents a set of design specifications for a hole, these records may be related one-to-many with HoleComputedData because many holes can use the same design specifications
- Index_id—same
- HoleClass—same
- Diameter—design specified diameter
- Tolerance+—design+limit
- Tolerance−—design−limit
- CSFlag—Boolean indication of the presence of a countersink
- CSDepth—design countersink depth, if applicable
- CSAngle—design countersink angle, if applicable
- CBFlag—Boolean indication of the presence of a counterbore
- CBDepth—design counterbore depth, if applicable
- CBDiameter—design counterbore diameter, if applicable
- GripLength—total depth of bore from outer surface to bottom or rear
- Perpendicularity—design perpendicularity
- Circularity—design circularity
- MultiMaterialFlag—Boolean indication of the presence of a multi material stack
- MaterialTransition1—material stack transition location 1, if applicable
- MaterialTransition2—material stack transition location 2, if applicable
- MaterialTransition3—material stack transition location 3, if applicable
- TopLevelAircraftPartMatch—each records matches a specific part to a specific aircraft
The scanner in the example of
As an aspect of determining measurements of the part, one or more of the processors establishes, for each scanned image, a set of values of a transforming tensor (100), that is, a tensor that expresses the relationship between part space and scanner space. Such a tensor can be expressed, for example, as Tensor 1.
The T values in Tensor 1 express the translation of scanner space with respect to part space, and the R value express the rotation of scanner space with respect to part space. Having the tensor values, the processor then transforms locations in scanner space of imaging pixels from each scanned image to corresponding locations of scanned points in part space. This transform of points in scanner space to points in part space is carried out according to Equation 1.
Equation 1 transforms by matrix multiplication with Tensor 1 a vector x,y,z representation of a point in scanner space into a vector representing a point x′,y′,z′ in part space. Readers will recognize this as a multiplication of one vertical matrix x,y,z,1 by a square matrix, resulting in another vertical matrix x′,y′,z′,1. The vertical matices in this example represent pixel locations in scanner space and reflection point locations in part space and therefore are characterized as vectors. The square matrix effectively implements a linear transformation, rotating and translating scanner space with respect to part space—and therefore is characterized as a tensor.
Although the position of the scanner in part space has been described as optically tracked, optical tracking is not the only way to track a scanner. A part can, for example be mounted in a fixed position with respect to one or more tactile fiducials that define part space, and an optical probe can be moved by robotic transport, CNC machine, or the like, to physically touch, with a certain orientation, a tactile fiducial, establishing an initial orientation of scanner space with respect to part space. Then the transport can track by dead reckoning the motion of the motion of the probe with respect to its initial orientation and populate a transform tensor for each captured image with values derived from dead reckoning of the motion of the scanner and probe. Alternatively, a tactile probe can be switched into deployment position on an end effector of a robotic transport, a CNC machine, or the like, the initial orientation of scanner space with respect to part space can be established by a touch of the tactile probe to a tactile fiducial defining part space, and the transport can switch the probe into deployment and track probe motion by dead reckoning. Now this specification has described three ways to track probe motion. No doubt persons of skill in the art will think of other ways, and all such ways are well within the scope of the present invention.
Having derived the scan point locations x′,y′,z′ in part space, the processor then measures actual values of attributes of the part. The point locations in part space are points in a traditional Cartesian space, and the part's attributes, which after all are disposed within part space, therefore can be determined through techniques of analytic geometry, least squares analysis, regression analysis, Tikhonov regularization, the Lasso method, minimum mean square error (Bayesian estimator), best linear unbiased estimator (BLUE), best linear unbiased prediction (BLUP), and the like. For further explanation, consider an example of measurement in part space with analytic geometry—for the particular example of a radial scan of the interior surface of a drilled hole for which each partial image forms a circle, in effect, 2D cross sections of the hole. For each image, a processor identifies the center of the image, which is carried out by taking a centroid or first moment of weighted averages of intensity values of reflected scan illumination for each point in the image, in both the X and Y directions, and taking the resulting x.y tuple as the center of the image. Then the processor draws radially from the center to edges of the image a relatively large number of radii, for example, a thousand radii, and selects from each such radius the brightest point on the radius, the set of brightest points being most likely to image the interior surface of the hole. The processor then carries out an initial regression analysis to derive a formula for the circle represented by the one thousand brightest points disposed in part space on radii from the center of the image. The processor then removes from the point set all bright points falling more than a predetermined threshold distance from the derived circle; for accuracy at this stage, a large proportion, perhaps even a majority, of the bright points may be removed, leaving perhaps a few hundred in the set, given the example of starting with a thousand. The processor then performs another regression analysis to derive a best fit formula for a circle, which gives diameter and also is used for comparison with actual part space point locations to measure circularity, perpendicularity, and so on.
Also in the example of
For further explanation,
A data processor operating according to embodiments of the present invention would determine from the measurements of the part identified with part ID 000000001 as reported in the profile of
The specification value for diameter is 10 mm±50 μm, and the most recent measurement for diameter is 10.045 mm. So the part meets its specification for diameter. The three diameter measurements read together, however, show that the diameter is deteriorating at the rate of about ⅓ of its tolerance value per inspection. With test measurements continuing to be taken at regular intervals, the part is expected to fail to meet its specification for diameter before its next test.
The specification value for circularity is the design radius of the hole or cavity for which circularity is measured, a value of 5 mm in this example, and the corresponding tolerance value of ±25 μm is the allowed variation from a perfect circle with a 5 mm radius. The most recent measurement for circularity is 0.024 mm, so the part meets its specification for circularity. The three circularity measurements read together, however, show that circularity, similar to diameter, is deteriorating at the rate of about ⅓ of its tolerance value per inspection. With test measurements continuing to be taken at regular intervals, the part is also expected to fail to meet its specification for circularity before its next test.
The specification value for perpendicularity is listed as 0, indicating that the design specification for perpendicularity is a perfectly vertical axis through a hole or cavity in a part being measured, and the corresponding tolerance value of ±25 μm is the allowed variation of a measured axis from the design axis. The most recent measurement for perpendicularity, however, 0.030 mm, or 30 μm, exceeds the tolerance value. The part fails now to meet its specification for perpendicularity. In embodiments in which failing to meet one specification justifies it, the part should be replaced or repaired now. In embodiments in which a part an expectation of failure to meet one or more specifications before a next test justifies it, the part should be replaced or repaired now.
The example profile of
For further explanation,
The scanner (118) in the example of
The method of
Measuring (303) attributes of the part in the example of
Measuring (303) attributes of the part in the example of
Measuring (303) attributes of the part in the example of
The method of
For further explanation,
The optical probe (106) in the example of
The optical probe includes light conducting apparatus (119) disposed so as to conduct scan illumination (123) from a source (182) of scan illumination through the probe. The light conducting apparatus in this example is a tubular wall of the probe itself, composed of optical glass, quartz crystal, or the like, that conducts scan illumination from a source (182) of such illumination to line forming apparatus (224) or reflecting apparatus (226) in the probe. The scan illumination may be conducted from a source (182) to the probe wall (119) for transmission to a line former or reflector by, as in the example here, optical fiber (121), or through optical glass, a conical reflector, a reflaxicon, and in other ways as will occur to those of skill in the art. The sources (182) themselves may be implemented with LEDs (186), lasers (184), or with other sources of scan illumination as may occur to those of skill in the art.
The optical probe (106) in the example of
The example apparatus of
The optical probe (106) in the example of
The optical probe (106) in the example of
The example apparatus of
In the example apparatus of
The example apparatus of
The controller (156) is coupled through a memory bus (157) to computer memory (168), which in this example is used to store the controller's measurements (314) or captured images (315) of a scanned object. Measurements (314) of a scanned object can include for example:
-
- diameter, circularity, and perpendicularity of drilled or milled holes and other cavities,
- countersink dimensions, depth and diameter,
- fastener flushness with respect to a surface of a scanned object,
- dimensions of milled cavities having irregular internal structures,
- measurements indicating manufacturing defects in scanned objects, cracks, burrs, or the like, and
- measurements indicating defects in tools, drill bits, mill heads, and the like,
- and so on.
Regarding manufacturing defects, the controller in example embodiments is programmed to determine according to image processing algorithms the location of a light source and probe in an image, and the light source and probe are configured for an expected surface finish for material of which a scanned object is composed. If there is a significant deviation in surface finish indicating a crack or if there are burrs, reflected scan illumination does not appear as radially symmetric on the sensor. Rather it will have significant local variations in its appearance. That these variations are greater than a threshold is an indicator of a manufacturing defect such as a burr or crack. Burrs can also be identified from white light images of the entrance and exit of a drilled or milled cavity because the edge of the cavity will not appear smooth.
For further explanation,
The example apparatus of
The optical probe includes light conducting apparatus (119) disposed so as to conduct scan illumination (123) from a source (182) of scan illumination through the probe. The light conducting apparatus in this example is a tubular wall of the probe itself, composed of optical glass, quartz crystal, or the like, that conducts scan illumination from a source (182) of such illumination to line reflecting apparatus (226) in the probe. The scan illumination may be conducted from a source (182) to the probe wall (119) for transmission to a line former or reflector by optical fiber, through optical glass, a conical reflector, a reflaxicon, and in other ways as will occur to those of skill in the art. The sources (182) themselves may be implemented with LEDs (186), lasers (184), or with other sources of scan illumination as may occur to those of skill in the art.
The optical probe (106) in the example of
The optical probe (106) in the example of
In the example apparatus of
For further explanation,
The example apparatus of
The optical probe includes light conducting apparatus (119) disposed so as to conduct scan illumination (123) from a source (182) of scan illumination through the probe. The light conducting apparatus in this example is a tubular wall of the probe itself, composed of optical glass, quartz crystal, or the like, that conducts scan illumination from a source (182) of such illumination to line forming apparatus (224) in the probe. The scan illumination may be conducted from a source (182) to the probe wall (119) for transmission to a line former by optical fiber, optical glass, a conical reflector, a reflaxicon, and in other ways as will occur to those of skill in the art. The sources (182) themselves may be implemented with LEDs (186), lasers (184), or with other sources of scan illumination as may occur to those of skill in the art.
The optical probe (106) in the example of
The optical probe (106) in the example of
In the example apparatus of
For further explanation of line forming apparatus,
The apparatus in the example of
The apparatus in the example of
For further explanation,
For further explanation,
For further explanation,
For further explanation,
In the example of
In the example of
In the example of
In the example of
In the example of
For further explanation,
The method of
The method of
The method of
The method of
Example embodiments of the present invention are described largely in the context of fully functional apparatus that profiles a manufactured part during manufacturing and service. Readers of skill in the art will recognize, however, that the present invention also may be embodied in one or more methods of use, methods of manufacture, and in a computer program product disposed upon computer readable storage media for use with any suitable data processing system. Such computer readable storage media may be any storage medium for machine-readable information, including magnetic media, optical media, or other suitable media. Examples of such media include magnetic disks in hard drives or diskettes, compact disks for optical drives, magnetic tape, and others as will occur to those of skill in the art. Persons skilled in the art will immediately recognize that any computer system having suitable programming means will be capable of executing the steps of the method of the invention as embodied in a computer program product. Persons skilled in the art will recognize also that, although some of the example embodiments described in this specification are oriented to software installed and executing on computer hardware, nevertheless, alternative embodiments implemented as firmware or as hardware are well within the scope of the present invention. The flowcharts and block diagrams in the Figures illustrate the architecture, functionality, and operation of possible implementations of computer apparatus, methods, and computer program products according to various embodiments of the present invention.
It will be understood from the foregoing description that modifications and changes may be made in various embodiments of the present invention without departing from its true spirit. The descriptions in this specification are for purposes of illustration only and are not to be construed in a limiting sense. The scope of the present invention is limited only by the language of the following claims.
Claims
1. Apparatus for profiling a manufactured part during manufacturing and service, the apparatus comprising:
- an optical scanner configured so that the scanner captures images of the part, the part characterized by an expected service life and by attributes with a specification of design values, with the images captured at more than one time during an actual service life of the part;
- a data processor operatively coupled to the scanner and configured so that it measures, based upon the captured images, actual values of one or more of the attributes when the images are captured;
- a database operatively coupled to the processor so that the database stores the measurements of the actual values of the attributes; and
- a data processor operatively coupled to the database and configured so that it makes a determination from the stored actual values whether the part continues to comply with its specification during the actual service life of the part.
2. The apparatus of claim 1 wherein the part comprises a hole drilled in a larger part.
3. The apparatus of claim 1 wherein the determination whether the part continues to comply with its specification is made in real time, immediately after a test scan of the part and before the part is returned to service after test.
4. The apparatus of claim 1 further comprising the data processor operatively coupled to the database further configured so that it makes a determination from the stored actual values of when the part is expected to fail to comply with its specification.
5. The apparatus of claim 1 wherein the optical scanner further comprises:
- a source of scan illumination;
- optical apparatus disposed within the scanner so as to project scan illumination onto the part;
- a lens disposed within the scanner so as to conduct to an optical sensor scan illumination reflected from the part; and
- the optical sensor disposed within the scanner so as to capture, from the scan illumination reflected through the lens from the part, the images of the part.
6. The apparatus of claim 1 further comprising the data processor operatively coupled to the scanner further configured to:
- establish, for each scanned image, transforming tensor values for a transforming tensor that expresses a relationship between a coordinate system defining object space and a coordinate system defining part space;
- transform according to the transforming tensor values locations in scanner space of imaging pixels from each scanned image to corresponding scanned points in part space; and
- measure the actual values of the attributes of the part in dependence upon the locations of the scanned points in part space.
7. The apparatus of claim 5 wherein: [ R 11 R 12 R 13 T 1 R 21 R 22 R 23 T 2 R 31 R 32 R 33 T 3 0 0 0 1 ],
- the tensor comprises
- the T values in the tensor express the translation of scanner space with respect to part space, and the R values express the rotation of scanner space with respect to part space.
8. A method of profiling a manufactured part during manufacturing and service, the method comprising:
- capturing by an optical scanner images of the part, the part characterized by an expected service life and by attributes with a specification of design values, including capturing the images at more than one time during an actual service life of the part;
- measuring, by a data processor operatively coupled to the scanner based upon the captured images, actual values of one or more of the attributes when the images are captured;
- storing, in a database by the data processor operatively coupled to the scanner, the measurements of the actual values of the attributes; and
- making a determination, from the stored actual values by a data processor operatively coupled to the database, whether the part continues to comply with its specification during the actual service life of the part.
9. The method of claim 8 wherein the part comprises a hole drilled in a larger part.
10. The method of claim 8 wherein the determination whether the part continues to comply with its specification is made in real time, immediately after a test scan of the part and before the part is returned to service after test.
11. The method of claim 8 further comprising making a determination, from the stored actual values by the data processor operatively coupled to the database, when the part is expected to fail to comply with its specification.
12. The method of claim 8 wherein the optical scanner further comprises:
- a source of scan illumination;
- optical apparatus disposed within the scanner so as to project scan illumination onto the part;
- a lens disposed within the scanner so as to conduct to an optical sensor scan illumination reflected from the part; and
- the optical sensor disposed within the scanner so as to capture, from the scan illumination reflected through the lens from the part, the images of the part.
13. The method of claim 8 wherein measuring actual values further comprises:
- establishing, for each scanned image, transforming tensor values for a transforming tensor that expresses a relationship between a coordinate system defining object space and a coordinate system defining part space;
- transforming according to the transforming tensor values locations in scanner space of imaging pixels from each scanned image to corresponding scanned points in part space; and
- measuring the actual values of the attributes of the part in dependence upon the locations of the scanned points in part space.
14. The method of claim 13 wherein: [ R 11 R 12 R 13 T 1 R 21 R 22 R 23 T 2 R 31 R 32 R 33 T 3 0 0 0 1 ],
- the tensor comprises
- the T values in the tensor express the translation of scanner space with respect to part space, and the R values express the rotation of scanner space with respect to part space.
15. A computer program product for profiling a manufactured part during manufacturing and service, the computer program product comprising computer program instructions that, when installed on a computer and executed by one or more data processors, cause the processors to function by:
- measuring, based upon images of the part captured by an optical scanner at more than one time during an actual service life of the part, actual values of one or more of attributes of the part, with the part characterized by an expected service life and by the attributes with specified design values;
- making a determination, from the measured values, whether the part continues to comply with its specification during the actual service life of the part.
16. The computer program product of claim 15 wherein the part comprises a hole drilled in a larger part.
17. The computer program product of claim 15 wherein the determination whether the part continues to comply with its specification is made in real time, immediately after a test scan of the part and before the part is returned to service after test.
18. The computer program product of claim 15 further comprising making a determination, from the stored actual values by the data processor operatively coupled to the database, when the part is expected to fail to comply with its specification.
19. The computer program product of claim 15 wherein the optical scanner further comprises:
- a source of scan illumination;
- optical apparatus disposed within the scanner so as to project scan illumination onto the part;
- a lens disposed within the scanner so as to conduct to an optical sensor scan illumination reflected from the part; and
- the optical sensor disposed within the scanner so as to capture, from the scan illumination reflected through the lens from the part, the images of the part.
20. The computer program product of claim 15 wherein measuring actual values further comprises:
- establishing, for each scanned image, transforming tensor values for a transforming tensor that expresses a relationship between a coordinate system defining object space and a coordinate system defining part space;
- transforming according to the transforming tensor values locations in scanner space of imaging pixels from each scanned image to corresponding scanned points in part space; and
- measuring the actual values of the attributes of the part in dependence upon the locations of the scanned points in part space.
Type: Application
Filed: Dec 6, 2013
Publication Date: Mar 5, 2015
Applicant: UNITED SCIENCES, LLC (ATLANTA, GA)
Inventors: KEITH A. BLANTON (ALPHARETTA, GA), KAROL HATZILIAS (ATLANTA, GA), STEFAN T. POSEY (AUSTELL, GA), WESS ERIC SHARPE (VININGS, GA)
Application Number: 14/099,567
International Classification: G01N 21/01 (20060101);