LIGHTING APPARATUSES AND LED MODULES FOR BOTH ILLUMINATION AND OPTICAL COMMUNICATION
Lighting apparatuses and LED modules capable of both illumination and data transmission are disclosed. An exemplifying lighting apparatus has a LED module and a modulator. The LED module comprises a plurality of LED cells connected as a LED chain having two conductive pads. The light emitted from the LED module is visible. The modulator provides driving current to the LED module to transmit data.
This application is a Continuation of co-pending Application Ser. No. 13/089,946, filed on Apr. 19, 2011, for which priority is claimed under 35 U.S.C. §120, the entire contents of all of which are hereby incorporated by reference.
BACKGROUNDThe present disclosure relates generally to optical communication and array-type light-emitting devices.
Light emitting diodes (LEDs) are an important class of solid-state devices that convert electric energy to light. They generally comprise an active layer of semiconductor material sandwiched between two oppositely-doped cladding layers. When a bias is applied across the cladding layers, electrons and holes are injected into the active layer where electrons and holes recombine to generate photons, or light. Recent advances in LEDs have resulted in highly efficient light sources that surpass the efficiency of filament-based light sources, providing light with equal or greater brightness in relation to input power.
Disadvantage of conventional LEDs used for lighting applications is that they cannot generate white light directly from their active layers. Recently, two different ways have been introduced to produce white light from conventional LEDs. One way to produce white light from conventional LEDs is to combine different wavelength of light from different LEDs. For example, white light can be produced by combining the light from red, green and blue LEDs or combining the light from blue and yellow LEDs. The other way to produce white light is using yellow phosphor, polymer or dye to downconvert portion of the light from a blue LED into yellow light. A white LED is seemly produced because it simultaneously emits both blue and yellow light, which combine to provide white light.
Since white LEDs are developed, LEDs have widely used because of their high durability, longevity, portability, low power consumption, absence of harmful substances such as mercury, and so forth. Often-seen applications of LEDs include white light illumination, indicator lights, vehicle signal and illuminating light, LCD backlight modules, projector light sources, outdoor displays, and so forth. Nevertheless, other applications might use LEDs to replace their light sources.
SUMMARYEmbodiments of the present invention disclose a lighting apparatus capable of simultaneously providing illumination and data transmission to a receiver. The lighting apparatus comprises an LED module and a modulator. The LED module comprises a plurality of LED cells connected as an LED chain having two conductive pads. The light emitted from the LED module is visible. The modulator provides driving current to the LED module to transmit data.
Embodiments of the present invention disclose an LED module, comprising LEDs and conductive pads. A first group of the LED cells is connected as a first LED chain, driven for illumination. A second group of the LED cells is connected as a second LED chain for data transmission. The conductive pads include a first pair of conductive pads connected to the first LED chain and a second pair of conductive pads connected to the second LED chain.
The invention can be more fully understood by the subsequent detailed description and examples with references made to the accompanying drawings, wherein:
The following embodiments are described in sufficient detail to enable those skilled in the art to make and use the invention. It is to be understood that other embodiments would be evident based on the present disclosure, and that proves or mechanical changes may be made without departing from the scope of the present invention.
In the following description, numerous specific details are given to provide a thorough understanding of the invention. However, it will be apparent that the invention may be practiced without these specific details. In order to avoid obscuring the present invention, some well-known configurations and process steps are not disclosed in detail.
One embodiment of the invention employs LED cells as a light source to transmit digital information over a free space optical data pathway at the same time when LED cells functions for illumination. Transmission is accomplished by modulating or varying the current flowing through LED cells.
Subject to other factors, the data transmission rate from the AC power lines to receiver 14a or 14b is limited by the signal bandwidth that the LED chips in light apparatuses 12a and 12b can support. Input capacitance of each LED chip in light apparatuses 12a and 12b could strongly affect the bandwidth supported. Hereinafter, input capacitance of an LED chain refers to the capacitance measured from two conductive pads respectively connected to n-type and p-type contact layers of the LED chain, by means of small-signal response. The less input capacitance of an LED chip, the broader bandwidth the LED chip can support.
As an example, LED chip 8a has LED cells 8a(1, 1)˜8a(3, 3), arranged as an LED array with 3 columns and 3 rows. Label WW(N, M) refers to the LED cell located at Nth column and Mth row of LED chip WW. LED cells 8a(1, 1)˜8a(3, 3) are connected in series as an LED chain having two conductive pads IN+ and IN−, which are located at two diagonal corners of LED cells 8a(1, 1) and 8a(3, 3), respectively. The physical orientation for each LED cell in 1st and 3rd column is opposite to that of each LED cell in 2nd column. If one LED cell in an LED chain is forward biased, all LED cells in the LED chain are forward biased, and vice versa. In one embodiment, LED cells 8a(1, 1)˜8a(3, 3) are epitaxial grown on a monolithic substrate through MOCVD process and other semiconductor process, such as sputtering, lithography, and etching process, such that the active layers therein are formed at the same time and made of substantially the same material. As the operation voltage of LED chip 8a is the summation of the operation voltages of individual LED cells, LED chip 8a is sometimes referred as a high-voltage (HV) LED chip. The number of the LED cells of the LED chip is around 3˜80, or preferred 8-40, depending on the operation voltage to be applied.
In order to provide the function of illumination, an LED chip should have enough number of LED cells emitting at the same time. LED cells connected in parallel could emit light at the same time, but the input capacitance for the LED cells as a whole increases as the number of the LED cells increases. Supposed that there are K1 identical LED cells connected in parallel and each individual LED cell has input capacitance of F farad, the capacitance of the LED cells as a whole will be K1*F farad. As mentioned before, increased input capacitance might reduce the bandwidth and the data transmission rate, such that LED cells connected in parallel are not suitable for data communication. Nevertheless, LED cells connected in series as an LED chain emit at the same time, and the input capacitance for the LED cells as a whole decreases as the number of the LED cells connected in series increases. The input capacitance for K1 identical LED cells as a whole will be F/K1 farad if they are connected in series wherein each individual one has input capacitance of F farad. Thus, an LED chain is suitable for both illumination and data transmission. In the embodiment of
There is another advantage that series connection surpasses parallel connection. Each and every LED in an LED chain of an LED chip will be driven with the same driving current even if there are slight differences between the characteristics of the LED cells in the LED chain. In other words, the LED cells in an LED chain of an LED chip emit power evenly. LED cells connected in parallel acts differently, however. Most of the driving current for the LED cells connected in parallel crowds to the LED cell with the least resistance, such that the LED cell with the least resistance emits higher power in comparison with others, therefore downgrading the reliability of the LED chip.
As an example,
Two conductive pads IN−, IN+ are provided for electric connection between the LED chip 8a and an electric circuit outside the chip through external wires. The two conductive pads IN−, IN+ are respectively formed on the monolithic substrate 60 outside the array area for LED cells 8a(1, 1)˜8a(1, 3), and preferably at different corners or borders of the LED chip 8a. The conductive pads IN−, IN+ are electrically coupled to the LED cells 8a(1,1)˜8a(1,3) via the electric circuit layer 78 as in
As LED cells 8a(1,1)˜8a(3,3) are epitaxial grown on monolithic substrate 60 using MOCVD process and other semiconductor process, such as sputtering, lithography, and etching process, the compositions of the active layers 66 therein are substantially the same to emit lights with the same or similar wavelength spectrum. Nevertheless, wavelength conversion layers 72 may be different or absent for some LED cells. For example, in one embodiment, all LED cells 8a(1, 1)˜8a(3, 3) are white LED cells each having an active layer emitting blue light and a wavelength conversion layer downconverting the blue light into yellow light. In another embodiment, some of LED cells 8a(1,1)˜8a(3,3) are white LED cells each having a wavelength conversion layer downconverting the blue light into yellow light, and others are blue LED cells having a wavelength conversion layer downconverting the blue light into red light. In another embodiment, some of LED cells 8a(1,1)˜8a(3,3) are white LED cells each having a wavelength conversion layer and others are blue LED cells having no wavelength conversion layer. In one embodiment, the wavelength conversion layer is formed a layered structure bonded to the contact layer through a glue bonding layer under chip process for the foregoing embodiments. In another embodiment, the wavelength conversion layer is formed by encapsulating the LED chip by an encapsulating material containing a wavelength conversion material under packaging process.
In one embodiment, LED chains 22 and 24 emit light of different colors. For example, LED cells in chain 22 comprises white LED cells and LED cell 8b(3,3) in chain 24 is a blue LED cell.
It is unnecessary that the LED chain only for illumination must shares a common conductive pad with the LED chain for data transmission.
All the previously-mentioned LED chains that function, partially or fully, for illumination provide visible light. Nevertheless, the previously-mentioned LED chains that function only for data transmission could provide visible or invisible light.
While the invention has been described by way of example and in terms of preferred embodiment, it is to be understood that the invention is not limited thereto. To the contrary, it is intended to cover various modifications and similar arrangements (as would be apparent to those skilled in the art). Therefore, the scope of the appended claims should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements.
Claims
1. An LED module, comprising:
- a modulator;
- a first LED chain, connected to the modulator, comprising a first group of LED cells and configured to emit a first light, wherein the first light comprises a digital data over a signal carrier;
- a driver independent from the modulator in controlling an emission of light;
- a second LED chain, connected to the driver, comprising a second group of LED cells, and configured to emit a second light which is independent from an emission of the first light; and
- a wavelength conversion layer associated with the first LED chain and disassociated with the second LED chain.
2. The LED module of claim 1, further comprising first conductive pads connected to the first LED chain and second conductive pads connected to the second LED chain, wherein the first conductive pads and the second conductive pads share a common conductive pad.
3. The LED module of claim 2, wherein the first LED chain comprises a first-type contact layer, the second LED chain comprises a second-type contact layer, the first-type and the second-type contact layers are electrically coupled to the common conductive pad.
4. The LED module of claim 2, wherein the first LED chain comprises a p-type contact layer, the second LED chain comprises an n-type contact layer, the p-type contact layer and the n-type contact layer are electrically coupled to the common conductive pad under which an insulating layer is formed.
5. The LED module of claim 1, wherein the second LED chain comprises an LED cell having an area of not greater than 121 mil2.
6. The LED module of claim 1, wherein the first LED chain is capable of emitting a color light which is different from that emitted from the second LED chain.
7. The LED module of claim 1, wherein the first LED chain comprises at least one LED cell capable of emitting a color light different from that emitted from another LED cell in the second LED chain.
8. The LED module of claim 1, wherein the second LED chain has less LED cells than the first LED chain.
9. The LED module of claim 1, further comprising a substrate having an area between 1.21*102 and 1*105 mil2.
10. The LED module of claim 1, wherein the signal carrier has a frequency imperceptible to human eyes.
11. The LED module of claim 1, wherein the LED module is capable of receiving data in a way of power line communication.
12. The LED module of claim 1, wherein the first LED chain comprises a first LED, the second LED chain comprises a second LED, wherein the second LED has an area greater than that of the first LED.
13. The LED module of claim 1, wherein the first light has a wavelength spectrum having a peak which is not affected by the second light.
14. An LED module, comprising:
- a modulator;
- an LED module configured to emit a light comprising a digital data over a signal carrier by the modulator; and
- a wavelength conversion layer bonded to the LED module.
Type: Application
Filed: Jun 10, 2015
Publication Date: Oct 1, 2015
Inventors: Steve M. HONG (Hsinchu), Min-Hsun HSIEH (Hsinchu)
Application Number: 14/735,572