Shielding Unit and Plating Apparatus Including the Same

Abstract

A shielding unit for a plating apparatus may include a shielding plate, a controlling plate and a rotary actuator. The shielding plate may have a plurality of holes configured to permit a passage of an electrolyte therethrough. The controlling plate may make contact with the shielding plate. The controlling plate may have a plurality of controlling holes for controlling an opening ratio of the plurality of holes of the shielding plate. The rotary actuator may rotate the controlling plate to control the opening ratio of the plurality of holes shielding plate.

Description

CROSS-RELATED APPLICATION

This application claims priority under 35 USC §119 to Korean Patent Application No. 10-2015-0115155, filed on Aug. 17, 2015, the contents of which are hereby incorporated by reference in their entirety.

BACKGROUND

1. Field

Example embodiments relate to a shielding unit and a plating apparatus including the same. More particularly, example embodiments relate to a shielding unit configured to selectively shield an electrolyte, and a plating apparatus including the shielding unit.

2. Description of the Related Art

Generally, a plating apparatus may include a plating bath, an anode and a cathode. The plating bath may be configured to receive an electrolyte. The anode and the cathode may be arranged in the plating bath. The cathode may be arranged facing the anode. The cathode may be configured to hold an object. A current may be supplied from the anode to the cathode through the electrolyte to plate a metal layer on the object.

According to related arts, the current may flow through the electrolyte. Thus, a distribution of the electrolyte may determine a thickness uniformity of the plated layer. In order to uniformly distribute the electrolyte, a shielding plate may be arranged between the anode and the cathode. The shielding plate may have a plurality of holes through which the electrolyte may pass.

However, the holes of the shielding plate may not uniformly distribute the electrolyte. Further, it may be required to exchange the shielding plate for another shielding plate when a different object is being plated.

SUMMARY

Example embodiments provide a shielding unit for a plating apparatus that may be capable of uniformly distribute an electrolyte without change of a shielding plate in accordance with kinds of objects.

Example embodiments also provide a plating apparatus including the above-mentioned shielding unit.

According to example embodiments, there may be provided a shielding unit for a plating apparatus. The shielding unit for the plating apparatus may include a shielding plate, a controlling plate and a rotary actuator. The shielding plate may have a plurality of holes configured to permit a passage of an electrolyte therethrough. The controlling plate may make contact with the shielding plate. The controlling plate may have a plurality of controlling holes for controlling an opening ratio of the plurality of holes of the shielding plate. The rotary actuator may rotate the controlling plate to control the opening ratio of the plurality of holes shielding plate.

In example embodiments, each of the plurality of holes of the shielding plate may have a size substantially the same as a size of each of the plurality of controlling holes.

In example embodiments, the plurality of holes of the shielding plate may be arranged spaced apart from each other by substantially the same interval. The plurality of controlling holes may be arranged spaced apart from each other by an interval substantially the same as the interval between the plurality of holes of the shielding plate.

In example embodiments, the shielding plate may have a circular shape. The controlling plate may have a rectangular shape.

In example embodiments, the rotary actuator may rotate the controlling plate with respect to a center point of the controlling plate.

In example embodiments, the shielding plate is a first shielding plate and the plurality of holes are a plurality of first holes, and the shielding unit may further include a second shielding plate configured to make contact with the controlling plate. The second shielding plate may have a plurality of second holes configured to permit a passage of an electrolyte therethrough.

In example embodiments, each of the plurality of second holes may have a size substantially the same as the size of each of the plurality of first holes. The plurality of first holes may be arranged spaced apart from each other by substantially the same interval. The plurality of second holes may be arranged spaced apart from each other by an interval substantially the same as the interval between the plurality of first holes.

According to example embodiments, there may be provided a shielding unit for a plating apparatus. The shielding unit for the plating apparatus may include a shielding plate, a first controlling plate and a second controlling plate. The shielding plate may have a plurality of holes configured to permit a passage of an electrolyte therethrough. The first controlling plate may make contact with a first region of the shielding plate. The first controlling plate may have a plurality of first controlling holes for controlling an opening ratio of the plurality of holes in the first region of the shielding plate. The second controlling plate may make contact with a second region of the first shielding plate. The second controlling plate may have a plurality of second controlling holes for controlling an opening ratio of the plurality of holes in the second region of the shielding plate.

In example embodiments, the first region may include an at least central region of the shielding plate. The second region may include an edge region of the shielding plate. The first controlling plate may include a single plate configured to make contact with the central region of the shielding plate. The second controlling plate may include a pair of plates arranged at opposing sides of the first controlling plate and configured to make contact with the edge region of the shielding plate.

In example embodiments, the shielding unit may further include a third controlling plate arranged between the first controlling plate and the second controlling plates. The third controlling plate may be configured to make contact with a third region of the shielding plate. The third controlling plate may have a plurality of third controlling holes configured to control an opening ratio of the plurality of holes in the third region of the shielding plate.

In example embodiments, the first region and the second region may be defined by a radius line of the shielding plate.

In example embodiments, the plurality of holes of the shielding plate, the first controlling holes and the second controlling holes may have a substantially same size.

In example embodiments, the shielding unit may further include a linear actuator configured to move the first controlling plate and the second controlling plate linearly and individually for controlling the opening ratio of the plurality of holes of the shielding plate.

In example embodiments, the shielding unit may further include a second shielding plate configured to make contact with the first controlling plate and the second controlling plate. The second shielding plate may have a plurality of second holes through which the electrolyte may pass.

According to example embodiments, there may be provided a plating apparatus. The plating apparatus may include a plating bath, an anode, a cathode and a shielding unit. The plating bath may be configured to receive an electrolyte. The anode may be arranged in the plating bath. The cathode may be arranged in the plating bath. The cathode may be arranged facing the anode. The cathode may be configured to hold an object. The shielding unit may include a shielding plate, a controlling plate and a rotary actuator. The shielding plate may be arranged between the anode and the cathode. The shielding plate may have a plurality of shielding holes through which the electrolyte may pass. The controlling plate may make contact with the shielding plate. The controlling plate may have a plurality of controlling holes for controlling an opening ratio of the plurality of shielding holes. The rotary actuator may rotate the controlling plate to control the opening ratio of the plurality of shielding holes.

According to example embodiments, there may be provided a plating apparatus. The plating apparatus may include a plating bath, an anode, a cathode and a shielding unit. The plating bath may be configured to receive an electrolyte. The anode may be arranged in the plating bath. The cathode may be arranged in the plating bath. The cathode may be arranged facing the anode. The cathode may be configured to hold an object. The shielding unit may include a shielding plate, a first controlling plate and a second controlling plate. The shielding plate may be arranged between the anode and the cathode. The shielding plate may have a plurality of holes through which an electrolyte may pass. The first controlling plate may make contact with a first region of the shielding plate. The first controlling plate may have a plurality of first controlling holes for controlling an opening ratio of the plurality of holes in the first region of the shielding plate. The second controlling plate may make contact with a second region of the first shielding plate. The second controlling plate may have a plurality of second controlling holes for controlling opening ratio of the plurality of holes in the second region of the shielding plate.

According to example embodiments, a shielding unit for a plating apparatus includes a shielding plate having a plurality of holes configured to permit a passage of an electrolyte therethrough; a controlling plate positioned adjacent the shielding plate, the controlling plate having a plurality of controlling holes configured to control an opening ratio of the plurality of holes of the shielding plate; and an actuator configured to move the controlling plate to control the opening ratio of the plurality of holes of the shielding plate.

In example embodiments, the shielding unit is configured to be positioned in a plating apparatus comprising a plating bath, an anode, a cathode, and a diffusion plate between the anode and the cathode, the shielding unit being configured to be positioned between the diffusion plate and the cathode.

In example embodiments, the actuator is configured to move the controlling plate from a first position to a second position that changes a degree to which the plurality of controlling holes overlap the plurality of holes of the shielding plate to thereby control the opening ratio of the plurality of holes of the shielding plate.

In example embodiments, the shielding plate includes a first shielding plate and the plurality of holes comprises a plurality of first holes, the shielding unit further comprising a second shielding plate configured to make contact with the controlling plate, the second shielding plate having a plurality of second holes configured to permit a passage of an electrolyte therethrough.

In example embodiments, each of the plurality of second holes has a size substantially the same as a size of each of the plurality of first holes, the plurality of first holes are arranged spaced apart from each other by a substantially same interval, and the plurality of second holes are arranged spaced apart from each other by an interval substantially the same as the interval between the plurality of first holes.

According to example embodiments, the controlling holes of the controlling plate may be selectively and partially overlapped with the plurality of holes of the shielding plate to control the opening ratio of the plurality of holes. Thus, the electrolyte may be uniformly distributed to improve a thickness uniformity of a plated layer. Particularly, the opening ratio of the plurality of holes may be controlled by changing a position of the controlling plate in accordance with the type of object being plated so that it may not be required to exchange the shielding plate for another shielding plate when the object being plated is changed.

BRIEF DESCRIPTION OF THE DRAWINGS

Example embodiments will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings. FIGS. 1 to 14 represent non-limiting, example embodiments as described herein.

FIG. 1 is an exploded perspective view illustrating a shielding unit in accordance with example embodiments;

FIG. 2 is a perspective view illustrating the shielding unit in FIG. 1;

FIG. 3 is a front view illustrating the shielding unit in FIG. 2;

FIG. 4 is a cross-sectional view taken along a line IV-IV′ in FIG. 3;

FIG. 5 is a front view illustrating a rotated controlling plate of the shielding unit in FIG. 2;

FIG. 6 is a cross-sectional view taken along a line VI-VI′ in FIG. 5;

FIG. 7 is an exploded perspective view illustrating a shielding unit in accordance with example embodiments;

FIG. 8 is a front view illustrating the shielding unit in FIG. 7;

FIG. 9 is an exploded perspective view illustrating a shielding unit in accordance with example embodiments;

FIG. 10 is a front view illustrating the shielding unit in FIG. 9;

FIG. 11 is an exploded perspective view illustrating a shielding unit in accordance with example embodiments;

FIG. 12 is an exploded perspective view illustrating a shielding unit in accordance with example embodiments;

FIG. 13 is a front view illustrating the shielding unit in FIG. 12; and

FIG. 14 is a cross-sectional view illustrating a plating apparatus including the shielding unit in FIG. 1.

DETAILED DESCRIPTION OF THE EMBODIMENTS

Various example embodiments will be described more fully hereinafter with reference to the accompanying drawings, in which some example embodiments are shown. The present invention may, however, be embodied in many different forms and should not be construed as limited to the example embodiments set forth herein. Rather, these example embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the present invention to those skilled in the art. In the drawings, the sizes and relative sizes of layers and regions may be exaggerated for clarity.

It will be understood that when an element or layer is referred to as being “on,” “connected to” or “coupled to” another element or layer, it can be directly on, connected or coupled to the other element or layer or intervening elements or layers may be present. In contrast, when an element is referred to as being “directly on,” “directly connected to” or “directly coupled to” another element or layer, there are no intervening elements or layers present. Like numerals refer to like elements throughout. As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items.

It will be understood that, although the terms first, second, third etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the present invention.

Spatially relative terms, such as “beneath,” “below,” “lower,” “above,” “upper” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as “below” or “beneath” other elements or features would then be oriented “above” the other elements or features. Thus, the exemplary term “below” can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. As used herein, the singular forms “a,” “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises” and/or “comprising,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.

Example embodiments are described herein with reference to cross-sectional illustrations that are schematic illustrations of idealized example embodiments (and intermediate structures). As such, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, are to be expected. Thus, example embodiments should not be construed as limited to the particular shapes of regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. Thus, the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the actual shape of a region of a device and are not intended to limit the scope of the present invention.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

Hereinafter, example embodiments will be explained in detail with reference to the accompanying drawings.

Shielding Unit for a Plating Apparatus

FIG. 1 is an exploded perspective view illustrating a shielding unit in accordance with example embodiments, FIG. 2 is a perspective view illustrating the shielding unit in FIG. 1, FIG. 3 is a front view illustrating the shielding unit in FIG. 2, and FIG. 4 is a cross-sectional view taken along a line IV-IV′ in FIG. 3.

Referring to FIGS. 1 to 4, a shielding unit 100 of this example embodiment may include a first shielding plate 110, a second shielding plate 120, a controlling plate 130 and a rotary actuator 140. The first shielding plate 110 and the second shielding plate 120 may be arranged to face each other. The controlling plate 130 may be arranged between the first shielding plate 110 and the second shielding plate 120.

The first shielding plate 110 may be oriented toward an anode of a plating apparatus. The first shielding plate 110 may be fixed to a plating bath of the plating apparatus. The first shielding plate 110 may have a plurality of first holes 112. An electrolyte may pass through the first holes 112. The first holes 112 may be arranged spaced apart from each other in lengthwise and breadthwise directions by substantially the same interval. Alternatively, the first holes 112 may be arranged spaced apart from each other in lengthwise and breadthwise directions by a different interval. The first shielding plate 110 may have a circular shape. Alternatively, the first shielding plate 110 may have any suitable shape including the circular shape.

The second shielding plate 120 may be oriented toward a cathode of the plating apparatus. The cathode may be configured to hold an object on which a plated layer may be formed. The second shielding plate 120 may have a shape substantially the same as the shape of the first shielding plate 110. Thus, the second shielding plate 120 may have the circular shape including a plurality of second holes 122. The second holes 122 may be arranged spaced apart from each other in the lengthwise and breadthwise directions by an interval substantially the same as the interval between the first holes 112. Each of the second holes 122 may have a size substantially the same as that of each of the first holes 112. Further, numbers of the second holes 122 may be substantially the same as numbers of the first holes 112. Alternatively, the second shielding plate 122 may have any suitable shape including the circular shape. In some embodiments, the shielding unit 100 may not include the second shielding plate 120. That is, the shielding unit 100 may include only the first shielding plate 110, the controlling plate 130 and the rotary actuator 140.

The controlling plate 130 may be interposed between the first shielding plate 110 and the second shielding plate 120. The controlling plate 130, the first shielding plate 110 and the second shielding plate 120 may have a same axis. The controlling plate 130 may be rotatably arranged in the plating bath. The controlling plate 130 may be rotated with respect to a center point of the controlling plate 130.

The controlling plate 130 may have a rectangular shape; however, any suitable shape may be used. In example embodiments, the controlling plate 130 may have a square shape. The controlling plate 130 may have a first surface oriented toward the first shielding plate 110, and a second surface oriented toward the second shielding plate 120. The second surface may be opposite to the first surface. The first surface of the controlling plate 130 may make contact with the first shielding plate 110. The second surface of the controlling plate 130 may make contact with the second shielding plate 120.

The controlling plate 130 may have a plurality of controlling holes 132. The controlling holes 132 may be arranged spaced apart from each other in the lengthwise and breadthwise directions by an interval substantially the same as the interval between the first holes 112. Each of the controlling holes 132 may have a size substantially the same as the size of each of the first holes 112. Thus, the controlling holes 132 may be fully or partially overlapped with the first holes 112 in accordance with rotation angles of the controlling plate 130. When the controlling holes 132 may be fully overlapped and align with the first holes 112, the size of each of the first holes 112 may be maintained. In contrast, when the controlling holes 132 may be partially overlapped with the first holes 112, the first holes 112 may be partially blocked by the controlling plate 132 so that the size of the first hole 112 partially overlapped with the controlling hole 132 may be decreased. The size of the first holes 112 may be controlled by changing positions of the controlling holes 132 so that an amount of a current through the first holes 112 may be controlled. Therefore, a thickness of the plated layer may be controlled depending on a position of the object to improve a thickness uniformity of the plated layer.

The rotary actuator 140 may be configured to rotate the controlling plate 130 to control the overlapped ratios between the controlling holes 132 and the first holes 112, which are referred to herein as an “opening ratio.” The rotary actuator 140 may rotate the controlling plate 130 with respect to the center point of the controlling plate 130. When the object to be plated may be identified, the rotary actuator 140 may rotate the controlling plate 130 to provide the first holes 112 with opening ratios. In order to prevent the opening ratios from being changed during a plating process, the rotary actuator 140 may not rotate the controlling plate 130. Thus, the controlling plate 130 may be fixed during the plating process.

Because the rotary actuator 140 may rotate the controlling plate 130 with respect to the center point of the controlling plate 130, an edged controlling hole 132 far from the center point of the controlling plate 132 may have a travel length relatively longer than a travel length of a central controlling hole 132 adjacent to the center point of the controlling plate 132.

Therefore, when the rotary actuator 140 may rotate the controlling plate 132 under a condition that the controlling holes 132 may be fully overlapped with the first holes 112, a central opening ratio of the first hole 112, which may correspond to an overlapped ratio between the central first hole 112 adjacent to the center point of the first shielding plate 110 and the central controlling hole 132 adjacent to the center point of the controlling plate 130, may be higher than a peripheral opening ratio of the first hole 112, which may correspond to an overlapped ratio between the edged first hole 112 far from the center point of the first shielding plate 110 and the edged controlling hole 132 far from the center point of the controlling plate 132. Thus, an amount of the electrolyte passing through the central first hole 112 may be relatively larger than an amount of the electrolyte passing through the edged first hole 112 so that the plated layer on an central region of the object may have a thickness greater than a thickness of the plated layer on an edge region of the object. Controlling the opening ratios of the first holes 112 with respect to the central region and the edge region of the object may be determined by an introducing direction of the electrolyte. Because the electrolyte may be supplied from the edge region of the object to the central region of the object, an electrolyte may be more concentrated on the edge region of the object rather than the central region of the object. Thus, the thickness of the plated layer on the edge region of the object may be thicker than the thickness of the plated layer on the central region of the object. In order to provide the plated layer with the uniform thickness, the electrolyte may be uniformly distributed by controlling the opening ratios of the first holes 112.

Referring to FIGS. 3 and 4, the first holes 112 of the first shielding plate 110 may be fully overlapped with the controlling holes 132 of the controlling plate 130. Thus, the opening ratios of the first holes 112 may be about 100%. The electrolyte may be supplied to the entire regions of the object through the first holes 112, the controlling holes 132 and the second holes 122. However, as mentioned above, because the electrolyte may be supplied from the edge region of the object to the central region of the object, the amount of the electrolyte supplied to the edge region of the object may be larger than the amount of the electrolyte supplied to the central region of the object so that the thickness of the plated layer on the edge region of the object may be thicker than the thickness of the plated layer on the central region of the object.

FIG. 5 is a front view illustrating a rotated controlling plate of the shielding unit in FIG. 2, and FIG. 6 is a cross-sectional view taken along a line VI-VI′ in FIG. 5.

Referring to FIGS. 5 and 6, the rotary actuator 140 may rotate the controlling plate 130 with respect to the center point of the controlling plate 130. As mentioned above, because the travel length of the edged controlling hole 132 far from the center point of the controlling plate 132 may be relatively longer than the travel length of the central controlling hole 132 adjacent to the center point of the controlling plate 132, the central opening ratio of the first hole 112 may be higher than the peripheral opening ratio of the first hole 112. Thus, an amount of the electrolyte passing through the central first hole 112 may be larger than an amount of the electrolyte passing through the edged first hole 112. As a result, the plated layer on the object may have uniform thickness.

According to this example embodiment, the opening ratios of the first holes in the first shielding plate may be selectively controlled by rotating the controlling plate. Therefore, the plated layer may have the uniform thickness.

FIG. 7 is an exploded perspective view illustrating a shielding unit in accordance with example embodiments, and FIG. 8 is a front view illustrating the shielding unit in FIG. 7.

Referring to FIGS. 7 and 8, a shielding unit 100a of this example embodiment may include a first shielding plate 110, a second shielding plate 120, a first controlling plate 150, a second controlling plate 160, a first linear actuator 142 and a second linear actuator 144.

In example embodiments, the first shielding plate 110 and the second shielding plate 120 may have substantially the same structures as those of the first shielding plate 110 and the second shielding plate 120 in FIG. 1, respectively. Thus, the same reference numerals may refer to the same elements and any further illustrations with respect to the first shielding plate 110 and the second shielding plate 120 may be omitted herein for brevity.

The first controlling plate 150 may be configured to make contact with a first region of the first shielding plate 110. The second controlling plate 160 may be configured to make contact with a second region of the first shielding plate 110. The first region may correspond to a central region of the first shielding plate 110. The second region may correspond to an edge region of the first shielding plate 110.

The first controlling plate 150 may be a single plate having a rectangular shape. The second controlling plate 160 may be a pair of plates arranged at both sides of the first controlling plate 160. Thus, a combined structure of the first controlling plate 150 and the two second controlling plates 160 may have a shape substantially the same as the shape of the controlling plate 130 in FIG. 1. That is, the first controlling plate 150 and the two second controlling plates 160 may be formed by dividing the controlling plate 130 in FIG. 1 into three plates.

The first controlling plate 150 may be configured to make contact with the central region, an upper edge region and a lower edge region of the first shielding plate 110. Thus, the first region may include at least the central region of the first shielding plate 110. The pair of the second controlling plates 160 may be configured to make contact with a left edge region and a right edge region of the first shielding plate 110. Thus, the second region may partially include the edge region of the first shielding plate 110. Alternatively, the first region and the second region of the first shielding plate 110 may not be restricted within the above-mentioned regions. The first region and the second region of the first shielding plate 110 may be changed in accordance with a type of object being plated.

The first controlling plate 150 may have a plurality of first controlling holes 152. The second controlling plate 160 may have a plurality of second controlling holes 162. The first controlling holes 152 and the second controlling holes 162 may be arranged spaced apart from each other in the lengthwise and breadthwise directions by substantially the same interval. Alternatively, the first controlling holes 152 and the second controlling holes 162 may be arranged spaced apart from each other in the lengthwise and breadthwise directions by a different interval.

The first linear actuator 142 may be configured to linearly move the first controlling plate 150. Thus, overlapped ratios between the first controlling holes 152 of the first controlling plate 150 and the central first holes 112 of the first shielding plate 110 may be adjusted to control the central opening ratio of the central first holes 112 in the first shielding plate 110. The first linear actuator 142 may linearly move the first controlling plate 150 to provide the central first holes 112 of the first shielding plate 110 with the central opening ratio. In order to prevent the central opening ratio from being changed during the plating process, the first linear actuator 142 may not linearly move the first controlling plate 150. Thus, the first controlling plate 150 may be fixed during the plating process.

The second linear actuator 144 may be configured to linearly move the second controlling plate 160. Thus, overlapped ratios between the second controlling holes 162 of the second controlling plate 160 and the edged first holes 112 of the first shielding plate 110 may be adjusted to control the peripheral opening ratio of the edged first holes 112 in the first shielding plate 110. The second linear actuator 144 may linearly move the second controlling plate 160 to provide the edged first holes 112 of the first shielding plate 110 with the peripheral opening ratio. In order to prevent the peripheral opening ratio from being changed during the plating process, the second linear actuator 144 may not linearly move the second controlling plate 160. Thus, the second controlling plate 160 may be fixed during the plating process.

Alternatively, the first controlling plate 150 may be fixed. That is, the first linear actuator 142 may not be connected with the first controlling plate 150. Further, the second controlling plate 160 may be fixed. That is, the second linear actuator 144 may not be connected with the second controlling plate 160.

According to this example embodiment, the opening ratios of the first holes in the first shielding plate may be regionally controlled by linearly moving the controlling plates. Therefore, the thickness of the plated layer may be accurately controlled in accordance with a type of object being plated.

FIG. 9 is an exploded perspective view illustrating a shielding unit in accordance with example embodiments, and FIG. 10 is a front view illustrating the shielding unit in FIG. 9.

Referring to FIGS. 9 and 10, a shielding unit 100b of this example embodiment may include a first shielding plate 110, a second shielding plate 120, a first controlling plate 170, a second controlling plate 180, a third controlling plate 190, a first linear actuator 146, a second linear actuator 147 and a third linear actuator 148.

In example embodiments, the first shielding plate 110 and the second shielding plate 120 may have substantially the same structures as those of the first shielding plate 110 and the second shielding plate 120 in FIG. 1, respectively. Thus, the same reference numerals may refer to the same elements and any further illustrations with respect to the first shielding plate 110 and the second shielding plate 120 may be omitted herein for brevity.

The first controlling plate 170 may be configured to make contact with a first region of the first shielding plate 110. The second controlling plate 180 may be configured to make contact with a second region of the first shielding plate 110. The third controlling plate 190 may be configured to make contact with a third region of the first shielding plate 110. The first region may correspond to a central region of the first shielding plate 110. The second region may correspond to an edge region of the first shielding plate 110. The third region may correspond to a middle region between the central region and the edge region of the first shielding plate 110.

The first controlling plate 170 may be a single plate having a rectangular shape. The second controlling plate 180 may be a pair of plates arranged at both sides of the first controlling plate 160. The third controlling plate 190 may be a pair of plates arranged between the first controlling plate 170 and the second controlling plates 180. Thus, a combined structure of the first controlling plate 170, the two second controlling plates 180 and the two third controlling plates 190 may have a shape substantially the same as the shape of the controlling plate 130 in FIG. 1. That is, the first controlling plate 170, the two second controlling plates 180 and the two third controlling plates 190 may be formed by dividing the controlling plate 130 in FIG. 1 into five plates.

The first controlling plate 170 may be configured to make contact with the central region, an upper edge region and a lower edge region of the first shielding plate 110. Thus, the first region may include at least the central region of the first shielding plate 110. The pair of the second controlling plates 180 may be configured to make contact with a left edge region and a right edge region of the first shielding plate 110. Thus, the second region may partially include the edge region of the first shielding plate 110. The pair of the third controlling plates 190 may be configured to make contact with the middle region between the central region and the right and left edge regions of the first shielding plate 110. Alternatively, the first region, the second region and the third region of the first shielding plate 110 may not be restricted within the above-mentioned regions. The first region, the second region and the third region of the first shielding plate 110 may be changed in accordance with a type of object being plated.

The first controlling plate 170 may have a plurality of first controlling holes 172. The second controlling plate 180 may have a plurality of second controlling holes 182. The third controlling plate 190 may have a plurality of third controlling holes 192. The first controlling holes 172, the second controlling holes 182 and the third controlling holes 192 may be arranged spaced apart from each other in the lengthwise and breadthwise directions by substantially the same interval. Alternatively, the first controlling holes 172, the second controlling holes 182 and the third controlling holes 192 may be arranged spaced apart from each other in the lengthwise and breadthwise directions by a different interval.

The first linear actuator 146 may be configured to linearly move the first controlling plate 170. Thus, overlapped ratios between the first controlling holes 172 of the first controlling plate 170 and the central first holes 112 of the first shielding plate 110 may be adjusted to control the central opening ratio of the central first holes 112 in the first shielding plate 110. The first linear actuator 146 may linearly move the first controlling plate 170 to provide the central first holes 112 of the first shielding plate 110 with the central opening ratio. In order to prevent the central opening ratio from being changed during the plating process, the first linear actuator 146 may not linearly move the first controlling plate 170. Thus, the first controlling plate 170 may be fixed during the plating process.

The second linear actuator 147 may be configured to linearly move the second controlling plate 180. Thus, overlapped ratios between the second controlling holes 182 of the second controlling plate 180 and the edged first holes 112 of the first shielding plate 110 may be adjusted to control the peripheral opening ratio of the edged first holes 112 in the first shielding plate 110. The second linear actuator 147 may linearly move the second controlling plate 180 to provide the edged first holes 112 of the first shielding plate 110 with the peripheral opening ratio. In order to prevent the peripheral opening ratio from being changed during the plating process, the second linear actuator 147 may not linearly move the second controlling plate 180. Thus, the second controlling plate 180 may be fixed during the plating process.

The third linear actuator 148 may be configured to linearly move the third controlling plate 190. Thus, overlapped ratios between the third controlling holes 192 of the third controlling plate 190 and the middle first holes 112 of the first shielding plate 110 may be adjusted to control the middle opening ratio of the middle first holes 112 in the first shielding plate 110. The third linear actuator 148 may linearly move the third controlling plate 190 to provide the edged first holes 112 of the first shielding plate 110 with the middle opening ratio. In order to prevent the middle opening ratio from being changed during the plating process, the third linear actuator 148 may not linearly move the third controlling plate 190. Thus, the third controlling plate 190 may be fixed during the plating process.

Alternatively, the first controlling plate 170 may be fixed. That is, the first linear actuator 146 may not be connected with the first controlling plate 170. The second controlling plate 180 may be fixed. That is, the second linear actuator 147 may not be connected with the second controlling plate 180. The third controlling plate 190 may be fixed. That is, the third linear actuator 148 may not be connected with the third controlling plate 190. Further, at least one of the first to third controlling plates 170, 180 and 190 may be rotatably arranged. At least one of the first to third controlling plates 170, 180 and 190 may be fixed.

In example embodiments, the controlling plate may be divided into the three plates or the five plates. However, the number of plates that the shielding plate may be divided into is not restricted to a specific number, and any suitable number of plates and/or configuration of plates may be used. The number of plates that the shielding plate may be divided into may be changed in accordance with the kinds of the objects being plated.

FIG. 11 is an exploded perspective view illustrating a shielding unit in accordance with example embodiments.

A shielding unit 100c of this example embodiment may include elements substantially the same as those of the shielding unit 100a in FIG. 7 except for a first shielding plate and a second shielding plate. Thus, the same reference numerals may refer to the same elements and any further illustrations with respect to the same elements may be omitted herein for brevity.

Referring to FIG. 11, a first shielding plate may be divided into a single first central shielding plate 110-1 and two first side shielding plates 110-2 by two parallel vertical lines.

The first central shielding plate 110-1 may correspond to a position of the first controlling plate 150. Thus, the first central shielding plate 110-1 may have a width substantially the same as that of the first controlling plate 150. Alternatively, the first central shielding plate 110-1 may have a width different from that of the first controlling plate 150.

The first side shielding plates 110-2 may correspond to the position of the second controlling plates 160. Thus, the first side shielding plate 110-2 may have a width substantially the same as that of the second controlling plates 160. Alternatively, the first side shielding plate 110-2 may have a width different from that of the second controlling plates 160.

Linear actuators 143 may be configured to linearly move the first central shielding plate 110-1 and the first side shielding plate 110-2. Alternatively, the first central shielding plate 110-1 may be fixed. That is, the linear actuator 143 may not be connected with the first central shielding plate 110-1. Further, the first side shielding plates 110-2 may be fixed. That is, the linear actuators 143 may not be connected with the first side shielding plates 110-2.

A second shielding plate may be divided into a single second central shielding plate 120-1 and two second side shielding plates 120-2 by two parallel vertical lines. The second central shielding plate 120-1 may have a size substantially the same as that of the first central shielding plate 110-1. The second side shielding plates 120-2 may have a size substantially the same as that of the first side shielding plates 110-2.

Linear actuators 145 may be configured to linearly move the second central shielding plate 120-1 and the second side shielding plate 120-2. Alternatively, the second central shielding plate 120-1 may be fixed. That is, the linear actuator 145 may not be connected with the second central shielding plate 120-1. Further, the second side shielding plates 120-2 may be fixed. That is, the linear actuators 145 may not be connected with the second side shielding plates 120-2.

In example embodiments, the shielding plate may be divided into the three plates. However, the number of plates that the shielding plate may be divided into is not restricted to a specific number, and any suitable number of plates and/or configuration of plates may be used. The number of plates that the shielding plate may be divided into may be changed in accordance with the kinds of the objects being plated.

FIG. 12 is an exploded perspective view illustrating a shielding unit in accordance with example embodiments, and FIG. 13 is a front view illustrating the shielding unit in FIG. 12.

Referring to FIGS. 12 and 13, a shielding unit 200 of this example embodiment may include a first shielding plate 110, a second shielding plate 120, a first controlling plate 210, a second controlling plate 220, a third controlling plate 230, a fourth controlling plate 240, a first linear actuator 250, a second linear actuator 252, a third linear actuator 254 and a fourth linear actuator 256.

In example embodiments, the first shielding plate 110 and the second shielding plate 120 may have substantially the same structures as those of the first shielding plate 110 and the second shielding plate 120 in FIG. 1, respectively. Thus, the same reference numerals may refer to the same elements and any further illustrations with respect to the first shielding plate 110 and the second shielding plate 120 may be omitted herein for brevity.

The first shielding plate 110 may be divided into a plurality of regions by a radius line of the first shielding plate 110. In example embodiments, the first shielding plate 110 may be divided into first to fourth regions by two diameter lines substantially perpendicular to each other. The first to fourth regions may have a same quarter shape.

The first controlling plate 210 may be configured to make contact with a first region of the first shielding plate 110. The second controlling plate 220 may be configured to make contact with a second region of the first shielding plate 110. The third controlling plate 230 may be configured to make contact with a third region of the first shielding plate 110. The fourth controlling plate 240 may be configured to make contact with a fourth region of the first shielding plate 110. As mentioned above, because the first to fourth regions may have the same size and shape, the first to fourth controlling plates 210, 220, 230 and 240 may have a same square shape. That is, the first to fourth controlling plates 210, 220, 230 and 240 may be formed by dividing the controlling plate 130 in FIG. 2 along the two diameter lines.

The first region may correspond to a central region of the first shielding plate 110. The second region may correspond to an edge region of the first shielding plate 110. The third region may correspond to a middle region between the central region and the edge region of the first shielding plate 110.

The first controlling plate 210 may have a plurality of first controlling holes 212. The second controlling plate 220 may have a plurality of second controlling holes 222. The third controlling plate 230 may have a plurality of third controlling holes 232. The fourth controlling plate 240 may have a plurality of fourth controlling holes 242. The first controlling holes 212, the second controlling holes 222, the third controlling holes 232 and the fourth controlling holes 242 may be arranged spaced apart from each other in the lengthwise and breadthwise directions by substantially the same interval. Alternatively, the first controlling holes 212, the second controlling holes 222, the third controlling holes 232 and the fourth controlling holes 242 may be arranged spaced apart from each other in the lengthwise and breadthwise directions by a different interval.

The first linear actuator 250 may be configured to linearly move the first controlling plate 210. The second linear actuator 252 may be configured to linearly move the second controlling plate 220. The third linear actuator 254 may be configured to linearly move the third controlling plate 230. The fourth linear actuator 256 may be configured to linearly move the fourth controlling plate 240. The linear directions may not be restricted to a specific direction. For example, the linear directions may include a radius direction of the first shielding plate 110, a direction substantially parallel to the diameter line of the first shielding plate 110, etc. During the plating process, the first to fourth linear actuators 250, 252, 254 and 256 may not linearly move the first to fourth controlling plates 210, 220, 230 and 240. Thus, the first to fourth controlling plates 210, 220, 230 and 240 may be fixed in the plating process.

Alternatively, the first controlling plate 210 may be fixed. That is, the first linear actuator 250 may not be connected with the first controlling plate 210. The second controlling plate 220 may be fixed. That is, the second linear actuator 252 may not be connected with the second controlling plate 220. The third controlling plate 230 may be fixed. That is, the third linear actuator 254 may not be connected with the third controlling plate 230. The fourth controlling plate 240 may be fixed. That is, the fourth linear actuator 256 may not be connected with the fourth controlling plate 240. Further, at least one of the first to fourth controlling plates 210, 22, 230 and 240 may be rotatably arranged. At least one of the first to fourth controlling plates 210, 220, 230 and 240 may be fixed.

In example embodiments, the controlling plate may be divided into the four plates by the four radius lines. However, the number of plates that the shielding plate may be divided into is not restricted to a specific number, and any suitable number of plates and/or configuration of plates may be used. The number of plates that the shielding plate may be divided into may be changed in accordance with the kinds of the objects being plated.

Plating Apparatus

FIG. 14 is a cross-sectional view illustrating a plating apparatus including the shielding unit in FIG. 1.

Referring to FIG. 14, a plating apparatus 300 of this example embodiment may include a plating bath 310, an anode chamber 320, a cathode chamber 330, a diffusion plate 340 and a shielding unit 100.

The plating bath 310 may be configured to receive an electrolyte. The plating bath 310 may include an inlet 312 through which the electrolyte may be introduced, and an outlet 314 through which the electrolyte may be discharged. The inlet 312 may be formed at a lower surface of the plating bath 310. The outlet 314 may be formed at an upper surface of the plating bath 310. A pump 360 may be connected with the inlet 312 and the outlet 314. The pump 360 may supply the electrolyte to the plating bath 310.

The anode chamber 320 may be arranged under the plating bath 310. An anode 322 may be arranged in the anode chamber 320. The cathode chamber 330 may be arranged over the plating bath 310. A cathode 332 may be arranged in the cathode chamber 330. The cathode 332 may be rotated by a rotating shaft. A clamshell 336 for generating en electric field may be arranged on an inner surface of the cathode chamber 330.

The anode 322 and the cathode 332 may be connected to a power source 350. The cathode 332 may be configured to hold an object. In example embodiments, the object may include a wafer. The plating apparatus 300 may form a metal layer on the wafer for forming a wafer level package. The metal layer may include a nickel layer, a copper layer, a gold layer, etc. Alternatively, the object may not be restricted to a wafer. For example, the plating apparatus 300 may be used for a damascene process, a process for forming a bump, a process for forming a redistribution layer, etc.

The diffusion plate 340 may be arranged between the anode 322 and the cathode 332 to uniformly diffuse the electrolyte. A filter 370 may be arranged between the diffusion plate 340 and the anode 322 to remove impurities from the electrolyte.

The shielding unit 100 may be arranged between the diffusion plate 340 and the cathode 332. The shielding unit 100 may include elements substantially the same as those of the shielding unit 100 in FIG. 1. Thus, any further illustrations with respect to the shielding unit 100 may be omitted herein for brevity. Alternatively, the plating apparatus 300 may include the shielding unit 100a in FIG. 7, the shielding unit 100b in FIG. 9, the shielding unit 100c in FIG. 11 or the shielding unit 200 in FIG. 12.

According to example embodiments, the controlling holes of the controlling plate may be selectively and partially overlapped with holes of the shielding plate to control the opening ratios of the holes. Thus, the electrolyte may be uniformly distributed to improve a thickness uniformity of a plated layer. Particularly, the opening ratios of the holes may be controlled by changing a position of the controlling plate in accordance with the kind of object being plated so that it may not be required to exchange the shielding plate for another shielding plate when a different object is being used.

The foregoing is illustrative of example embodiments and is not to be construed as limiting thereof. Although a few example embodiments have been described, those skilled in the art will readily appreciate that many modifications are possible in the example embodiments without materially departing from the novel teachings and advantages of the present invention. Accordingly, all such modifications are intended to be included within the scope of the present invention as defined in the claims. In the claims, means-plus-function clauses are intended to cover the structures described herein as performing the recited function and not only structural equivalents but also equivalent structures. Therefore, it is to be understood that the foregoing is illustrative of various example embodiments and is not to be construed as limited to the specific example embodiments disclosed, and that modifications to the disclosed example embodiments, as well as other example embodiments, are intended to be included within the scope of the appended claims.

Claims

1. A shielding unit for a plating apparatus comprising:

a shielding plate having a plurality of holes configured to permit a passage of an electrolyte therethrough;

a controlling plate configured to make contact with the shielding plate, the controlling plate having a plurality of controlling holes for controlling an opening ratio of the plurality of holes of the shielding plate; and

a rotary actuator configured to rotate the controlling plate to control the opening ratio of the plurality of holes of the shielding plate.

2. The shielding unit of claim 1, wherein each of the plurality of holes of the shielding plate has a size substantially the same as a size of each of the plurality of controlling holes.

3. The shielding unit of claim 1, wherein the plurality of holes of the shielding plate are arranged spaced apart from each other by substantially a same interval.

4. The shielding unit of claim 3, wherein the plurality of controlling holes are arranged spaced apart from each other by an interval substantially the same as the interval between the plurality of holes of the shielding plate.

5. The shielding unit of claim 1, wherein the shielding plate has a circular shape, and the controlling plate has a rectangular shape.

6. The shielding unit of claim 1, wherein the rotary actuator rotates the controlling plate with respect to a center point of the controlling plate.

7. The shielding unit of claim 1, wherein the shielding plate comprises a first shielding plate and the plurality of holes comprises a plurality of first holes, the shielding unit further comprising a second shielding plate configured to make contact with the controlling plate, the second shielding plate having a plurality of second holes configured to permit a passage of an electrolyte therethrough.

8. The shielding unit of claim 7, wherein each of the plurality of second holes has a size substantially the same as a size of each of the plurality of first holes, the plurality of first holes are arranged spaced apart from each other by substantially the same interval, and the plurality of second holes are arranged spaced apart from each other by an interval substantially the same as the interval between the plurality of first holes.

9. A shielding unit for a plating apparatus comprising:

a shielding plate having a plurality of s holes configured to permit a passage of an electrolyte therethrough;

a first controlling plate configured to make contact with a first region of the shielding plate, the first controlling plate having a plurality of first controlling holes for controlling an opening ratio of the plurality of holes in the first region of the shielding plate; and

a second controlling plate configured to make contact with a second region of the shielding plate, the second controlling plate having a plurality of second controlling holes for controlling an opening ratio of the plurality of s holes in the second region of the shielding plate.

10. The shielding unit of claim 9, wherein the first region includes at least a central region of the shielding plate, the second region includes an edge region of the shielding plate, the first controlling plate comprises a single plate configured to make contact with the central region of the shielding plate, and the second controlling plate comprises a pair of plates arranged at opposing sides of the first controlling plate and is configured to make contact with the edge region of the shielding plate.

11. The shielding unit of claim 10, further comprising a third controlling plate arranged between the first controlling plate and the second controlling plates and configured to make contact with a third region of the shielding plate, the third controlling plate having a plurality of third controlling holes for controlling an opening ratio of the plurality of holes in the third region of the shielding plate.

12. The shielding unit of claim 9, wherein the first region and the second region are defined by a radius line of the shielding plate.

13. The shielding unit of claim 9, wherein the plurality of holes of the shielding plate, the first controlling holes and the second controlling holes have a substantially same size.

14. The shielding unit of claim 13, wherein the plurality of holes of the shielding plate, the first controlling holes and the second controlling holes are arranged spaced apart from each other by a substantially same interval.

15. The shielding unit of claim 9, further comprising a linear actuator configured to move linearly and individually the first controlling plate and the second controlling plate for controlling an opening ratio of the plurality holes of the shielding plate.

16. A shielding unit for a plating apparatus comprising:

a shielding plate having a plurality of holes configured to permit a passage of an electrolyte therethrough;

a controlling plate positioned adjacent the shielding plate, the controlling plate having a plurality of controlling holes configured to control an opening ratio of the plurality of holes of the shielding plate; and

an actuator configured to move the controlling plate to control the opening ratio of the plurality of holes of the shielding plate.

17. The shielding unit of claim 16, wherein the shielding unit is configured to be positioned in a plating apparatus comprising a plating bath, an anode, a cathode, and a diffusion plate between the anode and the cathode, the shielding unit being configured to be positioned between the diffusion plate and the cathode.

18. The shielding unit of claim 16, wherein the actuator is configured to move the controlling plate from a first position to a second position that changes a degree to which the plurality of controlling holes overlap the plurality of holes of the shielding plate to thereby control the opening ratio of the plurality of holes of the shielding plate.

19. The shielding unit of claim 16, wherein the shielding plate comprises a first shielding plate and the plurality of holes comprises a plurality of first holes, the shielding unit further comprising a second shielding plate configured to make contact with the controlling plate, the second shielding plate having a plurality of second holes configured to permit a passage of an electrolyte therethrough.

20. The shielding unit of claim 19, wherein each of the plurality of second holes has a size substantially the same as a size of each of the plurality of first holes, the plurality of first holes are arranged spaced apart from each other by a substantially same interval, and the plurality of second holes are arranged spaced apart from each other by an interval substantially the same as the interval between the plurality of first holes.