VAPOR CHAMBER

A vapor chamber includes a condensation board and an evaporation board. The evaporation board includes an evaporation surface. The condensation board includes a condensation surface. A groove is defined on the condensation surface. The groove is sealed up by the condensation board and the evaporation board therebetween with the evaporation surface facing the condensation surface. A plurality of isolation boards are positioned in the groove. The groove is divided into a plurality of separated cavities by the isolation boards.

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Description
CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims priority to Chinese patent application no. 201510479870.6 filed on Aug. 7, 2015, the contents of which are incorporated by reference herein.

FIELD

The subject matter generally relates to heat dissipations, especially relates to a vapor chamber.

BACKGROUND

A vapor chamber is a plate type vacuum cavity with working medium sealed up therein. The vapor chamber is used for removing heat from heat-generating electronic components such as central processing units (CPUs) and others. A traditional vapor chamber has only a single vacuum cavity. If the vacuum cavity invalid, the vapor chamber cannot work.

BRIEF DESCRIPTION OF THE DRAWINGS

Implementations of the present technology will now be described, by way of example only, with reference to the attached FIGURES:

The FIGURE is an exploded, isometric view of a vapor chamber in accordance with the exemplary embodiment of the present disclosure.

DETAILED DESCRIPTION

It will be appreciated that for simplicity and clarity of illustration, where appropriate, reference numerals have been repeated among the different FIGURES to indicate corresponding or analogous elements. In addition, numerous specific details are set forth in order to provide a thorough understanding of the embodiments described herein. However, it will be understood by those of ordinary skill in the art that the embodiments described herein can be practiced without these specific details. In other instances, methods, procedures and components have not been described in detail so as not to obscure the related relevant feature being described. Also, the description is not to be considered as limiting the scope of the embodiments described herein. The drawings are not necessarily to scale and the proportions of certain parts may be exaggerated to better illustrate details and features of the present disclosure.

Several definitions that apply throughout this disclosure will now be presented.

The term “substantially” is defined to be essentially conforming to the particular dimension, shape, or other feature that the term modifies, such that the component need not be exact. For example, “substantially rectangular” means that the object resembles a rectangle, but can have one or more deviations from a true rectangle. The term “comprising” when utilized, means “including, but not necessarily limited to”; it specifically indicates open-ended inclusion or membership in the so-described combination, group, series and the like.

Referring to the FIGURE, a vapor chamber 100 of the exemplary embodiment includes a condensation board 10 and an evaporation board 20. A groove 13 is defined on the condensation board 10. At least one isolation board 30 is configured in the groove 13. The groove 13 is divided into several separate cavities 40 by the isolation boards 30.

In this exemplary embodiment, the condensation board 10 is substantially rectangular. The condensation board 10 includes a condensation surface 11 and a side wall 12. The groove 13 is defined on the condensation surface 11. The side wall 12 extends away from the condensation board 10. Preferably, the side wall 12 extends vertically from periphery edge of the condensation surface 11 away from the condensation board 10. The condensation surface 11 and the side wall 12 together define the groove 13. In this exemplary embodiment, the groove 13 is substantially rectangular. Wick structures can be formed in the groove 13 (not shown in FIGs).

The evaporation board 20 is flat. The evaporation board 20 is consistent with the condensation board 10. The condensation board 10 and the evaporation board 20 are coupled with each other to seal up the groove 13 therebetween. Preferably, the condensation board 10 and the evaporation board 20 are both made of copper. The condensation board 10 and the evaporation board 20 can be mutually matched and tightly adhered with each other via standard molecular diffusion welding technology. The relative positions of the condensation board 10 and the evaporation board 20 can be fixed after the condensation board 10 and the evaporation board 20 being mutually matched and tightly adhered.

The evaporation board 20 includes an evaporation surface 21. Wick structures can be formed on the evaporation surface 21 (not shown in FIGs). The condensation board 10 and the evaporation board 20 are mutually matched and are tightly adhered with the condensation surface 11 facing the evaporation surface 21.

The at least one isolation board 30 is formed on the condensation board 10.

Preferably, the isolation board 30 is positioned in the groove 13 to divide the groove 13 into several separate cavities 40. The at least one isolation board 30 can be parallel, crossed or the combination. Preferably, at least one isolation board 30 can be crossed at the same point. In this exemplary embodiment, the vapor chamber 100 includes two isolation boards 30. Preferably, the isolation boards 30 are perpendicular to each other. Preferably, each isolation board 30 is contacted with and perpendicular to the side wall 12 of the condensation board 10.

Each isolation board 30 extends away from the condensation board 10. Preferably, the isolation boards 30 have the same extending direction with the side wall 12 of the condensation board 10. In this exemplary embodiment, each isolation board 30 extends from the condensation surface 11 of the condensation board 10. Top surfaces of the isolation boards 30 and a top surface of the side wall 12 of the condensation board 10 are coplanar. In other words, a height of each isolation board 30 is equal to a depth of the groove 13.

Each cavity 40 is enclosed by the isolation boards 30 and the side wall 12. Preferably, at least one side surface of the cavity 40 is the side wall 12 of the condensation board 10. In this exemplary embodiment, the groove 13 is divided into four separate cavities 40 by the two isolation boards 30. Each cavity 40 is substantially rectangular. Two adjacent sides of each cavity 40 are part of the two isolation boards 30 and the other two adjacent sides of the cavity 40 are the side wall 12 of the condensation board 10.

The vapor chamber 100 further includes several filling holes 50. The filling holes 50 are defined on the side wall 12 of the condensation board 10. Each filling hole 50 is throughout a corresponding cavity 40. In other words, each filling hole 50 is defined on the side wall 12 of the corresponding cavity 40. In this exemplary embodiment, the vapor chamber 100 includes four filling holes 50. The four filling holes 50 are symmetrically defined on the two opposite ends of the side wall 12 of the condensation board 10 respectively. Each filling hole 50 can be rectangular or circular. In this exemplary embodiment, the filling holes 50 are circles. Portions of the side wall 12 defined the filling holes 50 are recessed into the condensation board 10, thereof defining several gaps 70. The gaps 70 provide convenient for pumping vacuum and filling working medium.

The vapor chamber 100 further includes several copper tubes 60. Each copper tube 60 is welded on a corresponding filling hole 50. The copper tubes 60 are used for pumping vacuum and filling working medium in the cavities 40 of the vapor chamber 100.

Compared to the traditional vapor chambers, the groove 13 of the vapor chamber 100 in the present disclosure is divided into several separate cavities 40 by the isolation boards 30. So the vapor chamber 100 can still remain working even if one or more cavities 40 are invalid. In addition, the isolation boards 30 are formed in the groove 30 of the condensation board 10, thereof enhancing the strength of the condensation board 10.

The embodiment shown and described above is only an example. Many details are often found in the art such as the other features of the vapor chamber. Therefore, many such details are neither shown nor described. Even though numerous characteristics and advantages of the present technology have been set forth in the foregoing description, together with details of the structure and function of the present disclosure, the disclosure is illustrative only, and changes may be made in the detail, especially in matters of shape, size and arrangement of the parts within the principles of the present disclosure up to, and including the full extent established by the broad general meaning of the terms used in the claims. It will therefore be appreciated that the embodiments described above may be modified within the scope of the claims.

Claims

1. A vapor chamber comprising:

a condensation board with a condensation surface;
an evaporation board with an evaporation surface;
a groove defined on the condensation surface, the groove being sealed up by the condensation board and the evaporation board therebetween with the evaporation surface facing the condensation surface; and
a plurality of isolation boards positioned in the groove to divide the groove into a plurality of separate cavities.

2. The vapor chamber of claim 1, wherein the condensation board comprises a side wall, the condensation surface and the side wall together define the groove.

3. The vapor chamber of claim 2, wherein the side wall extends vertically from periphery edge of the condensation surface away from the condensation board.

4. The vapor chamber of claim 3, wherein each isolation board extends from the condensation surface of the condensation board away from the condensation board.

5. The vapor chamber of claim 4, wherein a height of the isolation boards is equal to a depth of the groove.

6. The vapor chamber of claim 2, wherein the vapor chamber comprises two isolation boards, the two isolation boards are perpendicular to each other.

7. The vapor chamber of claim 6, wherein the isolation boards have the same extending direction with the side wall of the condensation board.

8. The vapor chamber of claim 7, wherein each isolation board is contacted with and perpendicular to the side wall of the condensation board.

9. The vapor chamber of claim 8, wherein each cavity is enclosed by the isolation boards and the side wall, at least one side surface of the cavity is the side wall of the condensation board.

10. The vapor chamber of claim 9, wherein two adjacent sides of each cavity are part of the two isolation boards and the other two adjacent sides of the cavity are the side wall of the condensation board.

11. The vapor chamber of claim 9, wherein a filling hole is defined on the side wall of a corresponding cavity.

12. The vapor chamber of claim 11, wherein the filling holes are symmetrically defined on the two opposite ends of the side wall of the condensation board.

13. The vapor chamber of claim 11, wherein each filling hole is a circle.

14. The vapor chamber of claim 11, wherein portions of the side wall defined the filling holes are recessed into the condensation board, thereof defining several gaps to provide convenient for pumping vacuum and filling working medium

15. The vapor chamber of claim 11, wherein a copper tube is welding on a corresponding filling hole for pumping vacuum and filling working medium.

16. The vapor chamber of claim 1, wherein the condensation board and the evaporation board are both made of copper.

17. The vapor chamber of claim 16, wherein the condensation board and the evaporation board are mutually matched and tightly adhered with each other via standard molecular diffusion welding technology.

18. The vapor chamber of claim 17, wherein the relative positions of the condensation board and the evaporation board are fixed after the condensation board and the evaporation board being mutually matched and tightly adhered.

Patent History
Publication number: 20170059254
Type: Application
Filed: Sep 28, 2015
Publication Date: Mar 2, 2017
Inventors: JING ZHANG (Foshan), TAO LI (Foshan), MING-WEI CHEN (Foshan)
Application Number: 14/867,613
Classifications
International Classification: F28D 15/04 (20060101);