FLEXIBLE HEAT TRANSFER STRUCTURE
A heat transfer structure, including: a plurality of layers of graphite material each having a shape selected for providing a thermal path between a hotspot in an electronic device and a heat dissipating structure of the electronic device; and a set of intervening bonding layers for coupling together the layers of graphite material such that the heat transfer structure has a flexible body for avoiding mechanical stress on the hotspot when the heat transfer structure is coupled between the hotspot and the heat dissipating structure.
An electronic device can include components that generate heat. A component that generates heat in an electronic device can be referred to as a hotspot. A hotspot in an electronic device can negatively impact the functioning of the electronic device. An electronic device can include a heat dissipating structure, e.g., a housing or heat sink, for dissipating heat generated by hotspots in the electronic device.
A hotspot in an electronic device can be located a distance away from a heat dissipating structure. A metal, e.g., copper, bridge structure can be used to transfer heat from a hotspot to a heat dissipating structure located a distance away from the hotspot. A metal bridge structure can place mechanical stress on components in an electronic device, which can negatively impact the functioning of the electronic device.
SUMMARYIn general, in one aspect, the invention relates to a heat transfer structure for an electronic device. The can include: a plurality of layers of graphite material each having a shape selected for providing a thermal path between a hotspot in the electronic device and a heat dissipating structure of the electronic device; and a set of intervening bonding layers for coupling together the layers of graphite material such that the heat transfer structure has a flexible body for avoiding mechanical stress on the hotspot when the heat transfer structure is coupled between the hotspot and the heat dissipating structure.
In general, in another aspect, the invention relates to a method for heat transfer in an electronic device. The method can include: forming a plurality of layers of graphite material each having a shape selected for providing a thermal path between a hotspot in the electronic device and a heat dissipating structure of the electronic device; and bonding together the layers of graphite material such that the heat transfer structure has a flexible body for avoiding mechanical stress on the hotspot when the heat transfer structure is coupled between the hotspot and the heat dissipating structure.
Other aspects of the invention will be apparent from the following description and the appended claims.
Embodiments of the present invention are illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings and in which like reference numerals refer to similar elements.
Reference will now be made in detail to the various embodiments of the present disclosure, examples of which are illustrated in the accompanying drawings. Like elements in the various figures are denoted by like reference numerals for consistency. While described in conjunction with these embodiments, it will be understood that they are not intended to limit the disclosure to these embodiments. On the contrary, the disclosure is intended to cover alternatives, modifications and equivalents, which may be included within the spirit and scope of the disclosure as defined by the appended claims. Furthermore, in the following detailed description of the present disclosure, numerous specific details are set forth in order to provide a thorough understanding of the present disclosure. However, it will be understood that the present disclosure may be practiced without these specific details. In other instances, well-known methods, procedures, components, have not been described in detail so as not to unnecessarily obscure aspects of the present disclosure.
The hot spot 14 in this example is an optical fiber connector mounted on a printed circuit board in the electronic device 12. For example, the electronic device can be a communication hub, switch, router, bridge, repeater, etc. The optical fiber connector can generate heat when converting an optical signal into an electrical signal.
The heat dissipating structure 16 in this example is a housing of the electronic device 12. In other embodiments, the heat dissipating structure 16 can be a heat sink for one or more electronic components on a printed circuit board in the electronic device 12.
In the embodiment of
In one or more embodiments, the heat transfer structure 10 can include 5 layers of 32 micrometers thick graphite sheets bonded to each other by intervening 10-micrometer double-sided pressure sensitive adhesive tape. The adhesive areas of each bent end 10a-10b can measure 15 millimeters by 15 millimeters of pressure sensitive adhesive tape. The heat transfer structure 10 in this configuration can decrease a temperature of the hotspot 14 of 129 degrees C. by approximately 41 degrees C.
In the embodiment shown in
In an example of the configuration shown in
In an example of the configuration shown in
At step 650, a plurality of layers of graphite material are formed, each having a shape selected for providing a thermal path between a hotspot in the electronic device and a heat dissipating structure of the electronic device. Step 650 can include cutting the layers from a synthetic graphite sheet. The dimensions and shape of the cuts and the number of layers can be adapted to the distance between the hotspot and the heat dissipating structure.
At step 660, the layers of graphite material are bonded together such that the heat transfer structure has a flexible body for avoiding mechanical stress on the hotspot when the heat transfer structure is coupled between the hotspot and the heat dissipating structure. Step 760 can applying a pressure sensitive adhesive or an adhesive resin between the layers.
While the foregoing disclosure sets forth various embodiments using specific diagrams, flowcharts, and examples, each diagram component, flowchart step, operation, and/or component described and/or illustrated herein may be implemented, individually and/or collectively, using a range of processes and components.
The process parameters and sequence of steps described and/or illustrated herein are given by way of example only. For example, while the steps illustrated and/or described herein may be shown or discussed in a particular order, these steps do not necessarily need to be performed in the order illustrated or discussed. The various example methods described and/or illustrated herein may also omit one or more of the steps described or illustrated herein or include additional steps in addition to those disclosed.
While the invention has been described with respect to a limited number of embodiments, those skilled in the art, having benefit of this disclosure, will appreciate that other embodiments may be devised which do not depart from the scope of the invention as disclosed herein.
Claims
1. A heat transfer structure for an electronic device, comprising:
- a plurality of layers of graphite material each having a shape selected for providing a thermal path between a hotspot in the electronic device and a heat dissipating structure of the electronic device; and
- a set of intervening bonding layers for coupling together the layers of graphite material such that the heat transfer structure has a flexible body for avoiding mechanical stress on the hotspot when the heat transfer structure is coupled between the hotspot and the heat dissipating structure.
2. The heat transfer structure of claim 1, wherein the hotspot is an optical connector on a printed circuit board in the electronic device.
3. The heat transfer structure of claim 2, wherein the optical connector is thermally coupled to the heat transfer structure via a pressure sensitive adhesive.
4. The heat transfer structure of claim 1, wherein the heat transfer structure is coupled to the heat dissipating structure via a pressure sensitive adhesive.
5. The heat transfer structure of claim 1, wherein the heat transfer structure is coupled to the heat dissipating structure via a detachable mechanism.
6. The heat transfer structure of claim 1, wherein the heat dissipating structure is a heat sink in the electronic device.
7. The heat transfer structure of claim 1, wherein the heat dissipating structure is a housing for the electronic device.
8. The heat transfer structure of claim 7, wherein a pair of respective bent ends of the heat transfer structure are respectively thermally coupled to a pair of respective opposing wall of the housing.
9. The heat transfer structure of claim 7, wherein a pair of respective bent ends of the heat transfer structure are respectively thermally coupled to a wall of the housing and the hotspot.
10. The heat transfer structure of claim 7, wherein a flat end and a bent end of the heat transfer structure are respectively thermally to the hotspot and a wall of the housing.
11. A method for heat transfer in an electronic device, comprising:
- forming a plurality of layers of graphite material each having a shape selected for providing a thermal path between a hotspot in the electronic device and a heat dissipating structure of the electronic device; and
- bonding together the layers of graphite material such that the heat transfer structure has a flexible body for avoiding mechanical stress on the hotspot when the heat transfer structure is coupled between the hotspot and the heat dissipating structure.
12. The method of claim 11, wherein forming a plurality of layers of graphite material comprises forming the layers each having a shape selected for providing a thermal path between an optical connector in the electronic device and a heat dissipating structure of the electronic device.
13. The method of claim 12, further comprising thermally coupling the optical connector to the heat transfer structure via a pressure sensitive adhesive.
14. The method of claim 11, further comprising thermally coupling the heat transfer structure to the heat dissipating structure via a pressure sensitive adhesive.
15. The method of claim 11, further comprising thermally coupling the heat transfer structure to the heat dissipating structure via a detachable mechanism.
16. The method of claim 11, further comprising thermally coupling the heat transfer structure to a heat sink in the electronic device.
17. The method of claim 11, further comprising thermally coupling the heat transfer structure to a housing for the electronic device.
18. The method of claim 17, further comprising forming a pair of respective bent ends of the heat transfer structure and thermally coupling the respective bent ends to a pair of respective opposing wall of the housing.
19. The method of claim 17, further comprising forming a pair of respective bent ends of the heat transfer structure and thermally coupling the respective bent ends to a wall of the housing and the hotspot.
20. The method of claim 17, further comprising forming a flat end and a bent end of the heat transfer structure and thermally coupling the flat end and the bent end to the hotspot and a wall of the housing, respectively.
Type: Application
Filed: Sep 24, 2015
Publication Date: Mar 30, 2017
Inventor: Xiaoning Wu (Beijing)
Application Number: 14/864,483