POLISHING DEVICE
An object of the present invention is to provide the diamond polishing device having a function capable of performing polishing even a surface of a semi-closed space such as an inner circumferential surface of a cylinder member or a ring member. The polishing device of the present invention includes a polishing member having a long shape, means for delivering and winding the polishing member, a polishing member support that holds the polishing member to be capable of being wound and displaced, a base to which the polishing member support is attached, and pressing means for pressing the base toward a machining surface of a member to be polished. The base includes an extending section that extends in a direction different from the pressing direction. The polishing member support is disposed at a distal end portion of the extending section.
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The present invention relates to a polishing device for a diamond surface and, more particularly, to a device that polishes the surfaces of various diamond products.
BACKGROUND ARTDiamond, which is a carbon crystal, has extremely high hardness, excellent abrasion resistance, slipperiness and thermal conductivity, and a high refractive index, as physical properties . Because of such physical properties, the diamond is used in, for example, cutting tools such as a turning tool, an end mill, and a file, plastic working dies such as a punch and a die, sliding members such as a valve lifter and a bearing, heat dissipation members such as a heat sink, and optical components such as an electronic board, a lens, and a window. Such diamond products are machined according to the application. However, in general, it is often required to polish the surfaces of the diamond products into smooth surfaces.
For polishing of a diamond surface, a mechanical polishing method in which an abrasive grain or a grind stone made of diamond is used has been adopted also as polishing means . However, since the polishing takes time and the diamond surface and the polishing means shave each other, there is a problem in that tool life is short. There is also a problem in that the mechanical polishing is unsuitable when a diamond surface to be polished is a three-dimensional surface having unevenness rather than a plane. Therefore, currently, a polishing method by chemical treatment rather than mechanical polishing is proposed. The polishing method is a polishing method including a step of, first, setting a machining portion to a high temperature state, rubbing a diamond surface with highly reactive metal or metal oxide, and causing the diamond surface to react and removing the diamond surface.
Patent Literature 1 discloses a polishing method for using a polishing member configured from metal easily reacting with carbon in a diamond crystal, applying ultrasound to the polishing member, heating the polishing member while vibrating the polishing member with the ultrasound, and pressing the polishing member against the diamond surface to perform polishing. As the metal easily reacting with the carbon functioning as the polishing member, stainless steel including γ-Fe, titanium (Ti), zirconium (Zr), and tantalum (Ta) are illustrated.
When frictional heat by the ultrasound vibration is used in the heating method described above, temperature control has to be performed according to the number of vibrations and a pressing force. The control is extremely difficult and it is difficult to stably perform the polishing with constant efficiency. Since the frictional heat is used, energy efficiency of the frictional heat is low. To increase temperature, the polishing member needs to be pressed against the diamond surface with a considerable pressing force. The hardness of the metal configuring the polishing member is considerably low compared with the diamond. Therefore, there is a disadvantage that wear of the polishing member is marked and the life of the polishing member is short. In view of this point, as the heating method, there has also been proposed a method of radiating a laser beam to be focused on a diamond surface to polish the diamond surface.
An invention disclosed in Patent Literature 2 is an invention for adopting a prior heating method by laser radiation and causing metal configuring a polishing member to chemically react with carbon of a diamond surface to perform polishing. However, an object of the invention is to provide a polishing method for a diamond surface with which the life of the polishing member is long and control of the polishing member is easy and that can obtain a surface with high smoothness and can be easily applied to polishing of a three-dimensional surface having unevenness and to provide a polishing method for a diamond surface that is capable of performing polishing by using a polishing member formed of inexpensive metal alone without using an expensive material obtained by a special manufacturing method such as an intermetallic compound. Therefore, the invention provides a polishing method for a diamond surface for, as shown in B and C of
In the polishing method, the polishing member formed of the metal material and having the shape of the linear shape or the belt shape is used and a contact section of the polishing member is displaced to rub the diamond surface. Therefore, the worn polishing member is sequentially updated. Reaction of the easily reactive metal and the carbon of the diamond surface or diffusion and permeation of the carbon do not reach a saturated state or a surface pressure is not changed by wear. The polishing always stably advances. As a result, there is an effect that it is possible to continuously perform stable polishing for a long period. As shown in A of
Patent Literature 1: Japanese Patent Application Laid-open No. 2005-231022 “POLISHING METHOD AND DEVICE FOR DIAMOND” Published on Sep. 2, 2005
Patent Literature 2: Japanese Patent Application Laid-open No. 2011-177883 “POLISHING METHOD FOR DIAMOND SURFACE” Published on Sep. 15, 2011
SUMMARY OF INVENTION Technical ProblemAn object of the present invention is to provide a diamond polishing device that uses a polishing member having a long shape such as a linear shape or a belt shape and performs polishing while winding the polishing member on a polishing member support and pressing a polishing surface against a surface of a member to be polished via the polishing member support while continuously or intermittently displacing the polishing surface, the diamond polishing device having a function capable of performing polishing even a surface of a semi-closed space such as an inner circumferential surface of a cylinder member or a ring member.
Solution to ProblemA polishing device of the present invention includes: a polishing member having a long shape; means for delivering and winding the polishing member; a polishing member support that enable the polishing member to be wound and displaced; a base to which the polishing member support is attached; and pressing means for pressing the base to a machining surface of a member to be polished. The base includes an extending section that extends in a direction different from the pressing direction. The polishing member support is disposed at a distal end portion of the extending section.
In one embodiment of the present invention, the means for delivering and winding the polishing member is attached on the base.
In another embodiment of the present invention, the direction in which the polishing member is pressed toward the machining surface of the member to be polished is horizontal.
In still another embodiment of the present invention, the polishing member has a surface made of metal easily reactive with carbon, carburizing metal, or metal oxide. In still another embodiment, the polishing device is used for polishing of diamond or a diamond film. In still another embodiment, a configuration is adopted in which the polishing device includes heating means for heating the polishing member and/or the member to be polished.
Advantageous Effects of InventionThe base of the polishing device according to the present invention includes the extending section that extends in the direction different from the pressing direction on the surface to be machined. The polishing member support is disposed at the distal end portion of the extending section. Therefore, there are special effects that it is possible to shift a machining position where the polishing member support is disposed and positions of a main body section of the base and the pressing means and it is possible to prevent the main body section of the base and the pressing means from interfering with the member to be polished and polish a semi-closed space such as an inner circumferential surface of a cylinder member or a ring member.
In the polishing device of the present invention adopting the configuration in which the means for delivering and winding the polishing member is attached on the base, the polishing member support and the means for delivering and winding the polishing member are attached on the same base. Therefore, a change does not occur in tension of the polishing member laid over between the polishing member support and the means even during operation. A pressing force on the machining surface stabilizes.
In the polishing device of the present invention having the form in which the direction in which the polishing member is pressed toward the machining surface of the member to be polished is horizontal, the pressing direction of the machining surface is orthogonal to the gravity direction. Therefore, it is possible to perform polishing without being affected by gravity applied to the members of the device.
In the polishing device of the present invention adopting, as the polishing member, the polishing member having the surface made of metal easily reactive with carbon, carburizing metal, or metal oxide, when the polishing device is used for polishing of diamond or a diamond film, it is possible to perform effective polishing through chemical treatment rather than mechanical machining.
In the polishing device of the present invention added with the heating means for heating the polishing member and/or the member to be polished, the chemical treatment is facilitated and a machining time is reduced.
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- 1 member to be polished (machined)
- 1a surface to be machined (diamond surface)
- 2 heating means
- 2a laser beam
- 3 polishing member
- 3a fixed polishing member
- 3b linear polishing member
- 3c belt-like polishing member
- 4 polishing member support
- 4a pulley
- 4b roller
- 5 base
- 5a extending section
- 6 delivering and winding means
- 7 pressing means
Embodiments of the present invention are explained below in detail.
A diamond polishing device having a form for performing polishing while winding a polishing member having a long shape on a polishing member support and pressing a polishing surface against a surface of a member to be polished via the polishing member support while continuously or intermittently displacing the polishing surface has a function capable of performing polishing even a surface of a semi-closed space such as an inner circumferential surface of a cylinder member or a ring member. Therefore, a basic characteristic adopted by the present invention resides in a configuration in which the polishing member support wound with the polishing member is attached to an extending section of a base extending in a direction different from the pressing direction by pressurizing means such that the presence of delivering and winding means for the long polishing member, which is an accessory member of the diamond polishing device of this type, and pressing means for pressing the polishing surface toward a machining surface of the member to be polished does not interfere with the structure of the member to be machined. The configuration is adopted in which the base of the present invention includes the extending section extending in the direction different from the pressing direction on the surface to be machined and the polishing member support is disposed at the distal end portion of the extending section. Therefore, it is possible to shift a machining position where the polishing member support is disposed and positions of a main body section of the base and the pressing means and it is possible to prevent the main body section of the base and the pressing means from interfering with the member to be polished and polish a semi-closed space such as an inner circumferential surface of a cylinder member or a ring member.
A form for polishing an inner circumferential surface of a ring member is explained according to a representative embodiment example of the present invention with reference to
The polishing device of the present invention is not limited to the embodiment example explained above. Various modifications are possible. In the example shown in
The extending section 5a of the base does not always need to extend in the direction orthogonal to the direction of the pressing force for biasing the base 5 in the position on the opposite side of the attached position of the pressurizing means 7. The extending section 5a only has to extend in the direction different from the pressing direction by the pressurizing means. In short, the position of the polishing member support wound with the polishing member only has to be capable of being shifted from the positions of the delivering and winding means 6 and the pressurizing means 7, which form the large device. A form shown in B of
Another preferred form of the polishing device of the present invention is explained with reference to
Further, still another preferred form of the present invention added with heating means is explained with reference to
Since the laser beam is radiated on the machining section, reaction between diamond, which is a material to be polished, and metal easily reactive with carbon, carburizing metal, or metal oxide, which is the material of the polishing member, is facilitated. It is possible to reduce a polishing time. Further, if a heater is also provided as heating means at the distal end portion of the extending section 5a of the base where the polishing member support 4 is disposed, a heating effect is further improved. It is possible to further reduce the polishing time.
INDUSTRIAL APPLICABILITYIn this specification, the polishing member of the present invention is explained as having, on the surface thereof, metal easily reactive with carbon or carburizing metal and performing the chemical polishing. However, the present invention is not limited to this. The present invention can also be applied to a polishing device of a mechanical polishing system including a diamond polishing paper, a belt polishing material, or a diamond wire as long as a long polishing member is continuously or intermittently delivered and wound.
Claims
1. A polishing device comprising:
- a polishing member having a linear shape or a belt shape;
- means for delivering and winding the polishing member;
- a polishing member support that holds the polishing member to be capable of being wound and displaced;
- a base to which the polishing member support is attached; and
- pressing means for pressing the base toward a machining surface of a member to be polished, wherein
- the base includes an extending section that extends in a direction different from the pressing direction, and
- the polishing member support is disposed at a distal end portion of the extending section.
2. The polishing device according to claim 1, wherein the means for delivering and winding the polishing member is attached on the base.
3. The polishing device according to claim 1, wherein the direction in which the polishing member is pressed toward the machining surface of the member to be polished is horizontal.
4. The polishing device according to claim 2, wherein the direction in which the polishing member is pressed toward the machining surface of the member to be polished is horizontal.
5. The polishing device according to claim 1, wherein the polishing device is used for polishing of diamond or a diamond film.
6. The polishing device according to claim 2, wherein the polishing device is used for polishing of diamond or a diamond film.
7. The polishing device according to claim 3, wherein the polishing device is used for polishing of diamond or a diamond film.
8. The polishing device according to claim 5, wherein the polishing member has a surface made of metal easily reactive with carbon, carburizing metal, or metal oxide.
9. The polishing device according to claim 6, wherein the polishing member has a surface made of metal easily reactive with carbon, carburizing metal, or metal oxide.
10. The polishing device according to claim 7, wherein the polishing member has a surface made of metal easily reactive with carbon, carburizing metal, or metal oxide.
11. The polishing device according to claim 8, further comprising heating means for heating the polishing member and/or the member to be polished.
12. The polishing device according to claim 9, further comprising heating means for heating the polishing member and/or the member to be polished.
13. The polishing device according to claim 10, further comprising heating means for heating the polishing member and/or the member to be polished.
Type: Application
Filed: Dec 30, 2016
Publication Date: Apr 20, 2017
Applicant: TOYO SEIKAN GROUP HOLDINGS, LTD. (Tokyo)
Inventors: Ryozo Shiroishi (Yokohama-shi), Kenichi Takao (Yokohama-shi), Takahiro Yamauchi (Yokohama-shi)
Application Number: 15/395,168