ELECTROPLATING SYSTEM

Abstract

An electroplating system includes an electroplating bath in which a cathode end and at least an anode end are configured. The anode end is provided with plural anode elements which are insulative from one another, as well as plural conductive elements which are connected electrically with each anode element, respectively. The electroplating system enables a variety of distribution of the electric lines of force to be formed in the electroplating bath through energizing one or any number of anode elements. In particular, good benefits can be achieved by a more aggressive and reliable means, without a need for changing the original anode end equipment.

Description

BACKGROUND OF THE INVENTION

a) Field of the Invention

The present invention relates to an electroplating system, and more particularly to an electroplating system in which the electric power distribution can be adjusted according to the shape of the product or the configuration that the product is suspended and disposed.

b) Description of the Prior Art

It is well known that the electroplating process is a method of coating a layer of membrane on an object using the electrolytic reduction reaction. The machine used in the electroplating process depends upon the product to be electroplated, and no matter what kind of machine is used, the electroplating region is designed with a different number of electrode bars as the anodes, so as to result in the ionization of metal ions in the electroplating solution; whereas, the workpieces to be electroplated are usually designed as the cathodes.

When performing the electroplating operation, an electric voltage is applied to the anodes and the cathodes respectively, allowing the metal ions to be precipitated in the electroplating solution by the electrolytic reaction. These metal ions will be deposited at the cathode end, forming a metal coating which is plated on the surface of the workpiece to be electroplated after being reduced at the cathodes. The existing electroplating system is divided into a soluble anode electroplating system and an insoluble anode electroplating system depending upon the method for providing the electroplating metal.

In the insoluble anode electroplating system, when the electric current flows from the top of an anode to the bottom of the anode, the magnitude of electric current will decrease gradually by the resistance. In other words, at the top of the anode, more metal ions will be decomposed and released as the electric current passing through this location is larger; on the other hand, the electric current passing through the lower part of the anode is less than the electric current passing through the upper part of the anode, thus fewer metal ions will be decomposed and released, which then results in the phenomenon that the electric lines of force do not distribute uniformly (i.e., the electric current density does not distribute uniformly) in the electroplating bath.

This phenomenon will cause that the product coating is thicker at the place where the electric current density is large and the product coating is thinner at the place where the electric current density is small. Therefore, the quality of product (especially the sub-product) will be affected seriously as the surface coating on the product is not uniform. Furthermore, under some conditions, the product can be charred easily as the electric current density is too large (the electric lines of force are too dense). Accordingly, it has long been an issue to be solved by the related industry to provide an electroplating system in which the electric power distribution can be adjusted depending upon the shape of the product or the configuration that the product is suspended and disposed.

SUMMARY OF THE INVENTION

Accordingly, the primary object of the present invention is to provide an electroplating system in which the electric power distribution can be adjusted depending upon the shape of the product or the configuration that the product is suspended and disposed.

To achieve the abovementioned object, the electroplating system of the present invention includes an electroplating bath in which a cathode end and at least an anode end are disposed. The anode end is provided with plural anode elements which are insulative from one another. In addition, there are plural conductive elements which are connected electrically with each anode element, respectively.

By using the abovementioned structure features, in the electroplating system according to the present invention, a variety of distribution of the electric lines of force is able to be formed in the electroplating bath through energizing one or any number of anode elements. In particular, when the shape of the product to be electroplated or the configuration that the product is suspended and disposed is changed, the corresponding distribution of the electric lines of force can be formed only through a simple way of switching an electric current supplying loop, without a need for changing the original anode end equipment. Therefore, the quality of electroplating can be improved by a more aggressive and reliable means to result in good benefits.

In the electroplating system disclosed by the present invention, plural anode elements, each of which is able to control the on or off of the circuit, are used primarily, such that a variety of distribution of the electric lines of force can be formed in the electroplating bath through energizing one or any number of anode elements. In particular, when the shape of the product to be electroplated or the configuration that the product is suspended and disposed is changed, the corresponding distribution of the electric lines of force can be formed only through a simple way of switching an electric current supplying loop, without a need for changing the original anode end equipment. Therefore, the quality of electroplating can be improved by a more aggressive and reliable means to result in good benefits.

To enable a further understanding of the said objectives and the technological methods of the invention herein, the brief description of the drawings below is followed by the detailed description of the preferred embodiments.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a structural view of basic compositions of an electroplating system, according to the present invention.

FIG. 2 shows a three-dimensional view of appearance of a first embodiment of an anode end, according to the present invention.

FIG. 3 shows a structural schematic view of a second embodiment of the anode end, according to the present invention.

FIG. 4 shows a structural schematic view of a third embodiment of the anode end, according to the present invention.

FIG. 5 shows a structural schematic view of a fourth embodiment of the anode end, according to the present invention.

FIG. 6 shows a schematic view of a state of use of a fifth embodiment of the anode end, according to the present invention.

FIG. 7 shows a schematic view of a state of use of a sixth embodiment of the anode end, according to the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The present invention provides primarily an electroplating system in which the electric power distribution can be adjusted according to the shape of the product or the configuration that the product is suspended and disposed. As shown in FIG. 1, the electroplating system of the present invention comprises basically an electroplating bath 10 in which an cathode end 20 and at least an anode end 30 are disposed, wherein the anode end 30 is provided with plural anode elements 32 which are insulative from one another. In addition, there are plural conductive elements 33 which are connected electrically with each anode element 32, respectively. Upon implementation, the said anode end 30 can be further provided with a bracket 31, and each anode element 32 is disposed on the bracket 31, insulative from other anode elements 32.

In principle, when the electroplating system of the present invention operates practically, the anode ends 30 in pairs are disposed respectively in the electroplating bath 10, opposite to two sides of the cathode end 20. The product to be electroplated, whereas, is suspended on the cathode end 20. Therefore, when the electric current is applied respectively to the anode ends 30 and the cathode end 20, metal ions will be precipitated and deposited on the cathode end 20 in the electroplating solution in the electroplating bath 10 due to the electrolytic reaction. When the metal ions are reduced on the cathode, a metal coating will be plated on the surface of the product.

As the electroplating system of the present invention is provided with plural anode elements 32, with each of which being able to control the on or off of the circuit, a variety of distribution of the electric lines of force can be formed in the electroplating bath 10 through energizing one or any number of anode elements 32. In particular, when the shape of the product to be electroplated or the configuration that the product is suspended and disposed is changed, the corresponding distribution of the electric lines of force can be formed only through a simple way of switching an electric current supplying loop, without a need for changing the original anode end equipment. Therefore, the quality of electroplating can be improved by a more aggressive and reliable means to result in good benefits.

Referring to FIG. 2, the said anode end 30 is provided with a bracket 31, and each anode element 32 is disposed on the bracket 31, insulative from other anode elements 32. Under this configuration, each conductive element 33 can be also fixed on the bracket 31, and it is preferred that an end of each conductive element 33 is extended out of the bracket 31 by a predetermined length, which not only facilitates the installation of the entire anode ends 30, but also is easier to connect electrically the conductive elements 33 with an external power source.

Referring to FIG. 3, the electroplating system of the present invention further includes a distributor 40 to connect with the external power source. The distributor 40 provides for connecting electrically with the conductive elements 33 disposed on the anode elements 32, and is provided with plural switch circuits, each of which controls the on or off of the circuit of each anode element 32. A preferred structure configuration is that the anode ends 30 are provided with a bracket 31, each anode element 32 is disposed on the bracket 31 and is insulative from other anode elements 32, each conductive element 33 is fixed on the bracket 31, and the distributor 40 is provided with plural lead wires for connecting electrically with each conductive element 33, respectively.

Under all kinds of the abovementioned structure patterns that can be implemented, in the electroplating system of the present invention, the said each anode element 32 is provided with plural meshes 321. In other words, the said anode element 32 can manifest as a structure pattern of a net or basket, so that the metal ions in the electroplating bath can have a better fluidity.

In addition, in the embodiment as shown in FIG. 2, each said anode element 32 is provided with a rectangular outline. Upon implementation, each said anode element 32 can manifest as a circular outline as shown in FIG. 3, a square outline as shown in FIG. 4, or even an elliptic, triangular, trapezoidal or L-shaped outline as shown in FIG. 5. When necessary, the said each anode end 30 can be also provided with at least two anode elements 32 in a different outline. Furthermore, as shown in FIG. 6, upon implementation, the said each anode end 30 can be further disposed between an anode strip 50 and the cathode end 20 to assure the quality of electroplating. Or, as shown in FIG. 7, upon implementation, the said each anode end 30 can be disposed on the other side to the anode strip 50, opposite to the cathode end 20. Moreover, when necessary, the cathode end 20, the anode ends 30 and the anode strips 50 can be connected with a swinging device 70, thereby achieving an effect that the coating is more uniform.

Specifically, in the electroplating system disclosed by the present invention, plural anode elements, each of which is able to control the on or off of the circuit, are used primarily to form a variety of distribution of the electric lines of force in the electroplating bath through energizing one or any number of anode elements. In particular, when the shape of the product to be electroplated or the configuration that the product is suspended and disposed is changed, the corresponding distribution of the electric lines of force can be formed only through a simple way of switching an electric current supplying loop, without a need for changing the original anode end equipment. Accordingly, the quality of electroplating can be improved by a more aggressive and reliable means to result in good benefits.

It is of course to be understood that the embodiments described herein is merely illustrative of the principles of the invention and that a wide variety of modifications thereto may be effected by persons skilled in the art without departing from the spirit and scope of the invention as set forth in the following claims.

Claims

1. An electroplating system comprising an electroplating bath in which a cathode end and at least an anode end are disposed, wherein each anode end is provided with plural anode elements which are insulative from one another, as well as plural conductive elements which are connected electrically with each anode element, respectively.

2. The electroplating system according to claim 1, wherein the anode end is provided with a bracket and each anode element is disposed on the bracket, insulative from other anode elements.

3. The electroplating system according to claim 2, wherein the bracket is connected with a swinging device.

4. The electroplating system according to claim 1, wherein the anode end is provided with a bracket, each anode element is disposed on the bracket and is insulative from other anode elements, and each conductive element is fixed on the bracket.

5. The electroplating system according to claim 1, further comprising a distributor for connecting with an external power source, wherein the distributor provides for connecting electrically with the conductive elements disposed on each anode element and is provided with plural switch circuits, with each switch circuit controlling the on or off of the circuit of each anode element.

6. The electroplating system according to claim 1, further comprising a distributor for connecting with an external power source, wherein the distributor provides for connecting electrically with the conductive elements disposed on each anode element and is provided with plural switch circuits, with each switch circuit controlling the on or off of the circuit of each anode element; each anode end being provided with a bracket and being disposed on the bracket, insulative from other anode ends; each conductive element being fixed on the bracket; the distributor being provided with plural lead wires, with each lead wire being connected electrically with each conductive element.

7. The electroplating system according to claim 6, wherein the bracket is connected with a swinging device.

8. The electroplating system according to claim 1, wherein each anode element is provided with plural meshes.

9. The electroplating system according to claim 1, wherein each anode element manifests a rectangular outline.

10. The electroplating system according to claim 1, wherein each anode element manifests a circular outline.

11. The electroplating system according to claim 1, wherein each anode elements manifests a square outline.

12. The electroplating system according to claim 1, wherein each anode element manifests an elliptic outline.

13. The electroplating system according to claim 1, wherein each anode element manifests a triangular outline.

14. The electroplating system according to claim 1, wherein each anode element manifests a trapezoidal outline.

15. The electroplating system according to claim 1, wherein each anode element manifests an L-shaped outline.

16. The electroplating system according to claim 1, wherein each anode end is provided with two anode elements in a different outline.

17. The electroplating system according to claim 1, wherein the electroplating system includes an anode strip.

18. The electroplating system according to claim 17, wherein the anode end is further disposed between the anode strip and the cathode end.

19. The electroplating system according to claim 17, wherein the anode end is disposed on the other side of the anode strip, opposite to the cathode end.

20. The electroplating system according to claim 17, wherein the anode strip is connected with a swinging device.

21. The electroplating system according to claim 1, wherein the anode end is connected with a swinging device.

22. The electroplating system according to claim 1, wherein the anode end and the cathode end are connected with a swinging device.

23. The electroplating system according to claim 1, wherein the cathode end is connected with a swinging device.