DISPLAY APPARATUS
A display apparatus includes at least one substrate with several penetration holes, several displaying units and several switch devices disposed at different sides of the at least one substrate, and at least one bonding material filling up the penetration holes, wherein the displaying units and the switch devices are connected to each other through the at least one bonding material.
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This application claims the benefit of People's Republic of China application Serial No. 201610230262.6, filed Apr. 14, 2016, the subject matters of which are incorporated herein by references.
BACKGROUND Technical FieldThe disclosure relates in general to a display apparatus, and more particularly to a display apparatus with plural displaying units and switch devices disposed at different sides of the substrate.
Description of the Related ArtElectronic products with display panel, such as smart phones, tablets, notebooks, monitors, and TVs, have become indispensable necessities to modern people no matter in their work, study or entertainment. With a flourishing development of the portable electronic products, the consumers have higher expects on the functions, the specifications and the prices of the products. The development of next-generation display focuses on the energy saving and environment-friendly techniques. Different displaying techniques have been well-developed. For example, liquid crystal display (LCD) has several advantages of lightweight, compactness, portability and low price, which has replaced the CRT monitors and becomes one of the most commonly-used displays in the electronic products. Besides LCD displaying technique, the displaying techniques also include the organic light emitting diode (OLED) displaying technique and the micro-LED displaying technique. In the OLED displaying technique, the organic material thin film (ex: an emissive electroluminescent layer) and the glass substrate are adopted. When an electric current passes through the emissive electroluminescent layer, the emissive electroluminescent layer emits light in response to the electric current; thus, no backlight is required in the OLED display. Compared to the LCD, the OLED display without a backlight saves more energy, and is lighter and thinner. However, a life span of an OLED display is shorter than that of a LCD (ex: due to the short life span of the blue organic material). Also, it is more challenging for making a large size OLED display than making a large size LCD display. The micro-LED displaying technique drives an array of addressed micro-LEDs, and possesses several advantages such as power-saving, simple construction, small volume, thin outline package, high brightness, high reliability and high speed of response, etc. Moreover, the stability of materials and the life span of the micro-LED display are better than that of the OLED display. The micro-LED display would be more competitive than the OLED display in the future.
Whether what types of the displaying techniques or related components are adopted in the display apparatus, the important factors for manufacturing a qualified display apparatus includes not only the details in procedures such as accurate patterning steps (ex: lithography and etch) for manufacturing the semiconductive layers and conductive layers without breaking the related traces and patterns, but also the precise positions of the relative layers and pattern designs for meeting the electrical performance requirements of the product, thereby producing the display apparatus with good reliability. For example, whether the electrical connections between the displaying units and the switch devices are good is one of considerable factors for determining the electrical performances of the display apparatus. The faulty design of the display apparatus will lead to the decreases of the yield and reliability of production, thereby affecting the electrical performances of the display apparatus and deteriorating the displaying quality.
SUMMARYThe disclosure is directed to a display apparatus, which the displaying units and the switch devices are respectively disposed at different sides of the substrate, and a bonding material fills up the penetration holes of the substrate for electrical connecting the displaying units and the switch devices, thereby increasing the production yields.
According to one aspect of the present disclosure, a display apparatus is provided, comprising at least one substrate having a plurality of penetration holes; plural displaying units and switch devices respectively disposed at different sides of the at least one substrate; and at least one bonding material filling up the plurality of penetration holes, wherein the displaying units and the switch devices are connected to each other through the at least one bonding material.
According to one aspect of the present disclosure, another display apparatus is provided, comprising a first substrate having plural first penetration holes filled with a first bonding material; a second substrate having plural second penetration holes filled with a second bonding material; plural switch devices disposed at an upper side of the first substrate; and plural displaying units disposed at a lower side of the second substrate, wherein a lower side of the first substrate is assembled to an upper side of the second substrate through connection between the first bonding material and the second bonding material.
According to one aspect of the present disclosure, another display apparatus is provided, comprising at least one substrate having plural penetration holes and data lines intersected with scan lines to define a plurality of pixel regions. Each of the pixel regions comprises a displaying unit and a switch device respectively disposed at different sides of the at least one substrate; and at least one bonding material filling up the penetration holes, wherein the displaying unit is connected to the switch device through the at least one bonding material.
In the embodiments of the present disclosure, a display apparatus is provided. According to the embodiment, the displaying units and the switch devices are respectively disposed at different sides of the substrate, and a bonding material fills up the penetration holes of the substrate for electrical connecting the displaying units and the switch devices. According to the design of the embodiments, the accurate patterns of the displaying units and the switch devices can be implemented without sacrificing the electrical performance. Excellent electrical performances of the display apparatus (including good electrical connection) can be achieved, thereby producing the display apparatus with good reliability and good displaying quality. Also, according to the embodied design of the display apparatus, the displaying units directly disposed on the substrate can further increase the production yields.
The embodiments of the present disclosure can be applied to an array substrate of a display apparatus, and the switch devices on the substrate can be (but not limited to) the thin film transistors (TFT). Examples of the applicable types of TFT include the back channel etch type TFT, the etch-stop type TFT, the top-gate type TFT, and the bottom-gate type TFT. The applicable types of lighting devices in the embodiment can be micro-LEDs (light emitting diodes), OLEDs, or other suitable self-emission components.
The embodiments are described in details with reference to the accompanying drawings. It is noted that the details of the structures of the embodiments are provided for exemplification, and the described details of the embodiments are not intended to limit the present disclosure. It is noted that not all embodiments of the invention are shown. Modifications and variations can be made without departing from the spirit of the disclosure to meet the requirements of the practical applications. Thus, there may be other embodiments of the present disclosure which are not specifically illustrated. Further, the accompany drawings are simplified for clear illustrations of the embodiment; sizes and proportions in the drawings are not directly proportional to actual products, and shall not be construed as limitations to the present disclosure. Thus, the specification and the drawings are to be regard as an illustrative sense rather than a restrictive sense. Also, the identical and/or similar elements of the embodiments are designated with the same and/or similar reference numerals.
Moreover, use of ordinal terms such as “first”, “second”, “third”, etc., in the specification and claims to modify an element does not by itself connote any priority, precedence, or order of one claim element over another or the temporal order in which acts of a method are performed, but are used merely as labels to distinguish one claim element having a certain name from another element having the same name (but for use of the ordinal term) to distinguish the claim elements.
First EmbodimentIn the embodiment, the switch device 20 (i.e. the BCE-type TFT) may include a gate electrode 21a, an anode 21b, a cathode 21c, a gate insulating layer 22 (formed on the gate electrode 21a, the anode 21b and the cathode 21c), a semiconductor layer 23 formed on the gate insulating layer 22, a source electrode 24a/a drain electrode 24b (S/D), and a first protective layer 29 covering those switch elements (i.e. can be referred as a switching assembly). In the first embodiment, the switch electrodes (ex: the anode 21b and the cathode 21c) of the switch device 20 directly contact the substrate 10, and the penetration holes 105 are positioned correspondingly to the switch electrodes.
The displaying units 50 of the embodiment can be implemented by micro-LEDs. Take a GaN (gallium-nitride)-based LED (i.e. a blue light-emitting diode) for example, a GaN-based LED includes a N-type GaN layer 51, a
P-type GaN layer 52, a multiple-quantum-well layer(MQW) 53, a N-type conductive layer 54 formed on the N-type GaN layer 51, a P-type conductive layer 55 formed on the P-type GaN layer 52, an N-type bump 56 formed on the N-type conductive layer 54 and a P-type bump 57 formed on the P-type conductive layer 55. Also, the N-type bump 56 and the N-type conductive layer 54 function as a N-type electrode of the displaying unit 50, while the P-type bump 57 and the P-type conductive layer 55 function as a P-type electrode of the displaying unit 50. It is known that those elements as described above are provided for illustrating one type of applicable displaying unit 50. Other light colors and/or configurations of the displaying units are applicable, and the disclosure is not limited thereto.
As shown in
Afterwards, as shown in
The excess portion of the bonding material layer 40 is removed, so as to form the bonding material 41 filling up the penetration holes 105 as shown in
In
In the embodiment, the substrate 10 has a certain bearing capacity (ex: the material of the substrate 10 has a certain rigidness) and flatness, thereby increasing the yield of bonding between the displaying units 50 and the switch devices 20 when they are disposed on the flat substrate 10. According to the embodiment, applicable material examples of the substrate 10 include glass, polymeric materials (such as polyethylene (PE)), a semiconductor substrate (ex: silicon substrate) wrapped with an insulating material, a metal wrapped with an insulating material, and other suitable materials. The bonding material 41 can be formed by spot welding using an Au/Sn alloy or other suitable conductive materials to form the solder balls or the solder plates; alternatively, the bonding material 41 can be formed by electrode plating a suitable metal (ex: copper). The disclosure has no limitation thereto. Additionally, considering the stability and reliability of the product after assembly, the coefficients of thermal expansion (CTEs) of the materials for forming the gate electrode 21a, the anode 21b, the cathode 21c, the bonding material 41, the N-type bump 56 and the P-type bump 57 can be close.
Second EmbodimentThe identical and/or similar elements of the second embodiment (
In the second embodiment, the displaying units 50 are disposed before setting the switch devices 20, which is different from the disposing steps of the first embodiment. As shown in
P-type bumps 57 of the displaying units 50. In the second embodiment, the bonding material 41 with conductivity can be adopted to form the gate electrode 21a in the same manufacturing step, as shown in
The identical and/or similar elements of the third embodiment (FIG. 6 and
For example, as shown in
For example, as shown in
Finally, as shown in
The first bonding material 41A and the second bonding material 41B can be made by the same material or different materials, and the disclosure has no limitation thereto. In some embodiments, the coefficients of thermal expansion (CTEs) of the materials for forming the first bonding material 41A and the second bonding material 41B can be close for improving the stability and reliability of the product after assembly. In one embodiment, the first bonding material 41A and the second bonding material 41B can be formed by spot welding using an Au/Sn alloy or other suitable conductive materials to form the solder balls or the solder plates, followed by thermal compression to join the solder balls/solder plates. Alternatively, the first bonding material 41A and the second bonding material 41B can be formed by electrode plating the suitable metals (ex: copper/copper), followed by melt compression (pressing and melting) to accomplish the assembly.
Although the BCE-type TFTs are exemplified as the switch devices of the embodiments, the disclosure is not limited thereto, and other types of switch devices can be applied in the disclosure.
Moreover, although the micro-LEDs are exemplified as the displaying units of the embodiments, the disclosure is not limited thereto, and other types of the displaying units, such as the organic light emitting diodes (OLEDs), can be applied in the disclosure.
Fourth EmbodimentThe identical and/or similar elements of the fourth embodiment (
Then, as shown in
According to the aforementioned descriptions, the display apparatus according to the embodiments is provided by disposing the displaying units and the switch devices at different sides of the substrate, and the connection between the displaying units and the switch devices is achieved by the bonding material filling in the penetration holes of the substrate. In some embodiments, the bonding material is a conductive material, wherein the displaying units and the switch devices disposed respectively at different sides of the substrate are electrically connected to each other through the bonding material in the penetration holes. According to the design of the embodiments, the accurate patterns of the displaying units and the switch devices can be implemented and the good electrical performance (including good electrical connection) of the display apparatus can be achieved, thereby producing the display apparatus with good reliability and good displaying quality. In addition, since the displaying units and the switch devices are disposed on different sides of the substrate, if defect or damage is found in the displaying unit or the switch device during product inspection, only the display unit or only the switch device can be removed independently without affecting the other one. Additionally, according to the display apparatus design of the embodiments, since the displaying units are directly disposed on the flat substrate, the production yield can be increased.
Moreover, in the practical applications, the data lines, the scan lines (
Structural details of the aforementioned embodiments are provided for exemplification only, not for limitation. Other embodiments with different configurations, such as change on components of the switch devices and the displaying units and change on positions of the electrode structures and the penetration holes to meet practical requirements can be applicable. Also, the material selection and jointing methods of the bonding material can be determined according to the actual needs of the practical applications. It is, of course, noted that the configurations of figures are depicted only for demonstration, not for limitation. It is known by people skilled in the art that the configurations and the procedure details of the related components/layers could be adjusted according to the requirements and/or manufacturing steps of the practical applications.
While the disclosure has been described by way of example and in terms of the exemplary embodiment(s), it is to be understood that the disclosure is not limited thereto. On the contrary, it is intended to cover various modifications and similar arrangements and procedures, and the scope of the appended claims therefore should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements and procedures.
Claims
1. A display apparatus, comprising:
- at least one substrate, having a plurality of penetration holes;
- a plurality of displaying units and a plurality of switch devices, respectively disposed at different sides of the at least one substrate; and
- at least one bonding material filling up the plurality of penetration holes, and the plurality of displaying units and the plurality of switch devices being connected to each other through the at least one bonding material.
2. The display apparatus according to claim 1, wherein the plurality of displaying units are directly disposed on the at least one substrate, and the at least one bonding material is a conductive material, wherein the plurality of displaying units are electrically connected to the plurality of switch devices by the at least one bonding material.
3. The display apparatus according to claim 1, wherein a first surface and a second surface of the at least one substrate are positioned at the different sides of the at least one substrate, and the plurality of switch devices are disposed at the first surface while the plurality of displaying units are disposed at the second surface, and the plurality of penetration holes penetrate the at least one substrate from the second surface to the first surface to expose switch electrodes of the plurality of switch devices, wherein the at least one bonding material filling up the plurality of penetration holes has a top surface contacting the switch electrodes of the plurality of switch devices.
4. The display apparatus according to claim 3, wherein the at least one bonding material has a bottom surface contacting electrode layers of the plurality of displaying units.
5. The display apparatus according to claim 1, wherein a first surface and a second surface of the at least one substrate are positioned at the different sides of the at least one substrate, and the plurality of displaying units are disposed at the first surface while the plurality of switch devices are disposed at the second surface, and the plurality of penetration holes penetrate the at least one substrate from the second surface to the first surface to expose electrode layers of the plurality of displaying units, wherein the at least one bonding material filling up the plurality of penetration holes has a top surface contacting the electrode layers of the plurality of displaying units.
6. The display apparatus according to claim 5, wherein the at least one bonding material is a conductive material, and the at least one bonding material functions as switch electrodes of the plurality of switch devices.
7. The display apparatus according to claim 1, wherein switch electrodes of the plurality of switch devices directly contact the at least one substrate, and the plurality of penetration holes are positioned correspondingly to the switch electrodes.
8. The display apparatus according to claim 1, wherein the plurality of displaying units are micro-light emitting diodes or organic light emitting diodes.
9. The display apparatus according to claim 1, wherein the plurality of switch devices are selected from back channel etching thin film transistors (TFT), etching stop layer TFTs, top-gate TFTs and bottom-gate TFTs.
10. The display apparatus according to claim 1, wherein the plurality of switch devices comprise a first protective layer covering a switching assembly of each of the plurality of switch devices, and the plurality of displaying units comprise a second protective layer covering a displaying assembly of each of the plurality of displaying units, wherein the first protective layer has a first protective surface, the second protective layer has a second protective surface, and the first protective surface is substantially parallel to the second protective surface.
11. A display apparatus, comprising:
- a first substrate, having a plurality of first penetration holes filled with a first bonding material;
- a second substrate, having a plurality of second penetration holes filled with a second bonding material;
- a plurality of switch devices, disposed at an upper side of the first substrate; and
- a plurality of displaying units, disposed at a lower side of the second substrate,
- wherein a lower side of the first substrate is assembled to an upper side of the second substrate through connection between the first bonding material and the second bonding material.
12. The display apparatus according to claim 11, wherein the first bonding material contacts switch electrodes of the plurality of switch devices, the second bonding material contacts electrode layers of the plurality of displaying units, wherein the first bonding material and the second bonding material are conductive materials for electrically connecting the plurality of displaying units and the plurality of switch devices.
13. A display apparatus, comprising:
- at least one substrate, having a plurality of penetration holes and comprising data lines intersected with scan lines to define a plurality of pixel regions, and each of the plurality of pixel regions comprising: a displaying unit and a switch device, respectively disposed at different sides of the at least one substrate; and at least one bonding material filling up the plurality of penetration holes, wherein the displaying unit is connected to the switch device through the at least one bonding material.
14. The display apparatus according to claim 13, wherein the displaying units in the plurality of pixel regions are directly disposed on the at least one substrate, and the at least one bonding material is a conductive material, wherein the displaying units are electrically connected to the switch devices by the at least one bonding material.
15. The display apparatus according to claim 13, wherein switch electrodes of the switch devices directly contact the at least one substrate, and the plurality of penetration holes are positioned correspondingly to the switch electrodes.
16. The display apparatus according to claim 13, wherein the displaying units are micro-light emitting diodes or organic light emitting diodes.
17. The display apparatus according to claim 13, wherein the switch devices comprise a first protective layer covering a switching assembly of each of the switch devices, and the displaying units comprise a second protective layer covering a displaying assembly of each of the displaying units, wherein the first protective layer has a first protective surface, the second protective layer has a second protective surface, and the first protective surface is substantially parallel to the second protective surface.
18. The display apparatus according to claim 13, wherein the data lines, the scan lines and the switch device in each of the plurality of pixel regions are disposed at a same side of the at least one substrate.
Type: Application
Filed: Apr 7, 2017
Publication Date: Oct 19, 2017
Applicant: Innolux Corporation (Miao-Li County)
Inventor: Kuan-Feng LEE (Miao-Li County)
Application Number: 15/481,567