COMPONENT MOUNTER
A component mounter for holding a component and for mounting the component on a surface of a board includes a head, a horizontal moving device, a vertical moving device, a mounting control device, and an imaging device. The imaging device is configured to image an imaging target by receiving incident light from the imaging target on an imaging element via an optical system. The optical system includes a first optical system configured to guide incident light from a direction of a side surface of a nozzle tip to a first region of the imaging element, and a second optical system configured to guide incident light from a direction of the surface of the board to a second region of the imaging element. The imaging device is configured to image an image via the first optical system and the second optical system.
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The present application relates to a component mounter that holds a component and mounts it on a surface of a board.
BACKGROUND ARTConventionally, there are known component mounters of a type that pick up a component with a suction nozzle held on a head and mount the component on the surface of a board, wherein an imaging device is provided on the head (for example, refer to patent literature 1). With this component mounter, a mirror is provided at a position on the light axis of the imaging device, and by rotating the mirror such that the light axis faces up or down it is possible to image a component held by a suction nozzle and to image the board surface with one imaging device.
Patent Literature 1: JP-A-2011-86847 SUMMARYHowever, with the above component mounter, because a switching mechanism for switching the imaging device is required, the imaging device is made complex. Also, to acquire an image of a component held by a suction nozzle, or an image of the board surface, or the like, because it is necessary to perform imaging the same number of times as there are images to be acquired, the time required for imaging is long, thereby worsening mounting board production efficiency.
An object of the present disclosure is to provide an imaging device capable of acquiring a side surface of a nozzle tip section and an image of a board surface without making the device complex.
The present disclosure uses the following means to achieve the above object.
A first component mounter of the present disclosure is a component mounter configured to hold a component and mount the component on a surface of a board, the component mounter including:
a head having a nozzle configured to hold the component at a nozzle tip of the nozzle;
a horizontal moving device configured to move the head in a horizontal direction with respect to the surface of the board;
a vertical moving device configured to move the nozzle in a vertical direction with respect to the surface of the board;
a mounting control device configured to perform mounting operation of mounting the component held by the nozzle at a mounting location on the surface of the board by moving the head using the horizontal moving device such that the nozzle is positioned above the mounting position on the surface of the board and lowering the nozzle using the vertical moving device; and
an imaging device provided on the head and configured to image an imaging target by receiving incident light from the imaging target on an imaging element via an optical system,
wherein
the optical system includes
a first optical system configured to guide incident light from a direction of a side surface of the nozzle tip to a first region of the imaging element, and
a second optical system configured to guide incident light from a direction of the surface of the board to a second region of the imaging element in a state with the nozzle above the surface of the board,
and
the imaging device is configured to be able to image an image of the side surface of the nozzle tip and an image of the surface of the board respectively via the first optical system and the second optical system.
The first component mounter of the present disclosure is provided with an imaging device, provided on the head and configured to image an imaging target object by receiving incident light onto an imaging element from the direction of the imaging target object via an optical system. By providing a first optical system configured to guide incident light from a direction of a side surface of the nozzle tip to a first region of the imaging element, and a second optical system configured to guide incident light from a direction of the surface of the board to a second region of the imaging element in a state with the nozzle above the surface of the board as the optical system, the imaging device is configured to be able to image an image of the side surface of the nozzle tip and an image of the surface of the board respectively via the first optical system and the second optical system. By this, it is possible to acquire a side surface image of a nozzle tip and an image of a board surface with a single imaging device without having a complex configuration. Also, being able to acquire a side surface image of a nozzle tip and an image of a board surface with a single imaging allows imaging time to be shortened, thereby preventing production efficiency from worsening. Further, by using a side surface image of a nozzle tip and an image of a board surface, it is easy to judge whether a component has been mounted correctly on the board surface.
For such a first component mounter of the present disclosure, the head may be a rotary type head provided with multiple nozzles in a circumferential direction and capable of revolving the multiple nozzles in the circumferential direction, the mounting control device may perform mounting operation of mounting the component held by the nozzle at the mounting location on the surface of the board by moving the head using the horizontal moving device such that a mounting target nozzle out of the multiple nozzles is positioned above the mounting position on the surface of the board and lowering the mounting target nozzle using the vertical moving device, and the imaging device may be able to image a first image that is at least one of a side image of the nozzle tip of a pre-mounting nozzle used to perform mounting operation of the component after the mounting target nozzle or a side image of the nozzle tip of a post-mounting nozzle used to perform mounting operation of the component before the mounting target nozzle, and a second image that is an image of surface of the board when the mounting target nozzle is performing mounting operation of the component respectively via the first optical system and the second optical system.
For this form of the first component mounter of the present disclosure, the optical system may include a third optical system configured to guide incident light from a direction of the mounting target nozzle to a third region of the imaging element, and the imaging device may be capable of imaging the first image, the second image, and a third image that is an image of the mounting target nozzle respectively via the first optical system, the second optical system, and the third optical system. Accordingly, it is possible to determine whether a mounting target nozzle is present or absent using the third image.
Also, for the first component mounter of the present disclosure, the following may also be included: an imaging control device configured to control the imaging device such that the image of the surface of the board is imaged at a first timing at which the component held by the nozzle contacts the surface of the board when the nozzle is lowered by the vertical moving device. Accordingly, it is possible judge whether the component was correctly mounted on the board surface based on the image of the board surface imaged at the first timing. For this form of the first component mounter of the present disclosure, the imaging control device may be configured to control the imaging device such that, after the first timing, the side image of the nozzle tip is imaged after performing mounting operation of the component, and further provided may be a determining device configured to determine whether the nozzle correctly mounted the component based on the image of the surface of the board imaged at the first timing and the side image of the nozzle tip imaged after the first timing. Accordingly, it is also possible to judge whether the component remained stuck on the nozzle after the nozzle mounted the component on the board surface.
Further, for the first component mounter of the present disclosure, the following may also be included: an imaging control device configured to control the imaging device such that the image of the surface of the board is imaged at a second timing at which the nozzle has been raised by a specified amount by the vertical moving device after the nozzle has performed mounting operation of the component. Accordingly, it is possible judge whether the component was correctly mounted on the board surface based on the image of the board surface imaged at the second timing. Also, it is possible to judge whether the component remained stuck on the nozzle after the nozzle mounted the component on the board surface. For this form of the first component mounter of the present disclosure, the imaging control device may be configured to control the imaging device such that, before the second timing, the side image of the nozzle tip of the nozzle yet to perform mounting operation of the component is imaged, and further provided may be a determining device configured to determine whether the nozzle correctly mounted the component based on the image of the surface of the board imaged at the second timing and the side image of the nozzle tip imaged before the second timing. Accordingly, it is also possible to judge whether a nozzle is holding a component before performing mounting operation.
A second component mounter of the present disclosure may be configured to hold a component and mount the component on a surface of a board, the component mounter including:
a rotary type head provided with multiple nozzles in a circumferential direction and capable of revolving the multiple nozzles in the circumferential direction,
a horizontal moving device configured to move the head in a horizontal direction with respect to the surface of the board;
a vertical moving device configured to move the nozzle in a vertical direction with respect to the surface of the board;
a mounting control device configured to perform mounting operation of mounting the component held by the nozzle at the mounting location on the surface of the board by moving the head using the horizontal moving device such that a mounting target nozzle out of the multiple nozzles is positioned above the mounting position on the surface of the board and lowering the mounting target nozzle using the vertical moving device, and
an imaging device provided on the head,
wherein
the imaging device is able to image
at least one of a side image of the nozzle tip of a pre-mounting nozzle used to perform mounting operation of the component after the mounting target nozzle or a side image of the nozzle tip of a post-mounting nozzle used to perform mounting operation of the component before the mounting target nozzle, and
an image of surface of the board when the mounting target nozzle is performing mounting operation of the component.
With the second component mounter of the present disclosure, being provided with a rotary type head able to revolve multiple nozzles in a circumferential direction and an imaging device attached to the head, it is possible to make the imaging device image a side surface image of the nozzle tip before mounting of the nozzle to perform mounting after the mounting target nozzle, a side surface image of the nozzle tip after mounting of the nozzle that mounted a component before the mounting target nozzle, and an image of the board surface on which the mounting target nozzle mounts the component. Accordingly, by using at least one of a side surface image of a nozzle tip before mounting and a side surface image of a nozzle tip after mounting, and an image of the board surface when the mounting target nozzle performs mounting operation of the component, it is easy to judge whether the component has been correctly mounted on the board surface.
Embodiments of the present disclosure are described below using the figures.
Component mounting system 1 is provided with component mounter 10 that mounts electronic component (hereinafter “component”) P on circuit board (hereinafter “board”) S, and management device 110 that performs overall system management. Note that, for the present embodiment, in
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Nozzle holder 62 is configured from a hollow cylindrical member that extends in the Z-axis direction. Upper end section 62a of nozzle holder 62 is formed as a cylinder with a diameter larger than the shaft section of nozzle holder 62. Also, flange section 62b with a diameter larger than the shaft section is formed on nozzle holder 62 at a specified position lower than upper end section 62a. Spring (coil spring) 65 is arranged between the circular surface of the bottom of flange section 62b and a cavity, which is not shown, formed in the upper surface of rotary head 64. Thus, spring 65 engaged in the cavity on the upper surface of rotary head 64 biases nozzle holder 62 (flange section 62b) upwards.
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In this manner, side surface camera 80, with a single imaging operation, is able to image suction nozzle 61 (nozzle imaging area) at mounting position A0, suction nozzle 61 (pre-mounting imaging area) at pre-mounting position A1, and suction nozzle 61 (post-mounting imaging area) at post-mounting position A2, and acquire respective images of each. Further, by imaging with side surface camera 80 with suction nozzle 61 at mounting position A0 positioned above board S, in addition to the above three images, it is also possible to acquire an image of the surface of board S (board imaging area).
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Management device 110 is, for example, a multipurpose computer. As shown in
Next, operation of component mounter 10 figured as given above is described in detail.
During component mounting processing, CPU 101 of control device 100, first, performs board conveyance processing of controlling board conveyance device 30 to convey board S (S100). Continuing, CPU 101 performs pickup operation (S120) by controlling X-axis actuator 55 and Y-axis actuator 59 such that mounting position A0 of rotary head 64 is moved to the component supply position of component supply device 20 (S110), controlling R-axis actuator 66 and Z-axis actuator 70 such that suction nozzle 61 at pre-mounting position A1 is lowered while being revolved to mounting position A0, and controlling electromagnetic valve 79 such that negative pressure is supplied to suction nozzle 61 and suction nozzle 61 picks up component P. CPU 101, when pickup operation has been performed, determines whether there is a component P to be picked up next (S130). Then, CPU 101, when judging that there is a component P to be picked up next, returns to S120, repeats pickup operation, and when judging that there is no component P to pick up next, proceeds to processing of S140.
Then, CPU 101 controls X-axis actuator 55 and Y-axis actuator 59 such that mounting position A0 of rotary head 64 is directly above the mounting position of board S, so as to move head unit 60 above board S (S140). Note that, movement of head unit 06 is performed passing over component camera 90. When head unit 60 passes over component camera 90, component P being held by suction nozzle 61 is imaged by component camera 90, and a position deviation of component P with respect to suction nozzle 61 is detected based on the acquired image.
When head unit 60 is moved to the mounting position, CPU 101 performs mounting operation of mounting component P on board S (S150), and performs mounting check processing that checks whether mounting operation was performed correctly (S160). Then, CPU 101 determines whether there is a component P to be mounted next (S170), and when determining that there is a component P to be mounted next, returns to S150 and repeats mounting operation and mounting check operation, and when determining that there is no component P to be mounted next, ends component mounting processing.
Mounting operation of S150 is performed by performing mounting operation processing of
Mounting check processing of S160 is performed by performing mounting check processing of
Also, in the embodiment, the processing of S300 extracts a pre-mounting image within the pre-mounting image area from the image, and determines whether component P is being held by the suction nozzle 61 positioned at pre-mounting position A1 by checking the brightness values of pixels around the tip of the suction nozzle 61 among the extracted pre-mounting image. As described above, the determination of whether component P remained on the suction nozzle is performed by comparing the image (board image) from the first timing and the image (board image) from the second timing. In this case, by checking whether component P is being held by the suction nozzle 61 positioned at pre-mounting position A1 (that is, component P is present) based on the image (pre-mounting image), it is possible to determine whether component P remained on the suction nozzle by a simple comparison of the image (board image) from the first timing and the image (board image) from the second timing obtained when performing mounting operation in which the suction nozzle 61 positioned at pre-mounting position A1 moves to mounting position A0. That is, in a case in which there is no component P being held by the suction nozzle P positioned at pre-mounting position A1, no change arises between the image (board image) from the first timing and the image (board image) from the second timing obtained when performing mounting operation of moving to mounting position A0, and it is not possible to determine whether component P remained on the suction nozzle with a simple comparison. Therefore, in a case in which it is unclear whether a component P is present on the suction nozzle 61 positioned at the pre-mounting position, it is necessary to perform processing to recognize (recognition processing) component P within the image (board image) from the first timing. Such recognition processing makes image processing complex, and may lead to mis-recognition, so is undesirable. In the present embodiment, by checking whether component P is being held by the suction nozzle 61 positioned at pre-mounting position A1 based on the image (pre-mounting image) and then determining whether component P remained on the suction nozzle by a simple comparison of the image (board image) from the first timing and the image (board image) from the second timing obtained when performing mounting operation in which the suction nozzle 61 positioned at pre-mounting position A1 moves to mounting position A0, it is possible to simply and reliably perform a determination as to whether the component P remained on the suction nozzle.
And, CPU 101, when determining whether a mounting error occurred based on the above processing (S310), if determining that a mounting error did not occur, ends mounting check processing. Conversely, CPU 101, if determining that a mounting error occurred, determines whether the mounting error was an error of component P remaining on the suction nozzle (S320). CPU 101, when determining that the mounting error was not an error of component P remaining on the suction nozzle, ends mounting check processing. In this case, discard processing may be performed on the board S with the mounting error (mounting position deviation) after inspection is performed by an inspection device, not shown, at a later process. Note that, CPU 101, after ending mounting check processing, by ending the component mounting processing of
On the other hand, CPU 101, when determining that the mounting error was an error of component P remaining on the nozzle, after moving the suction nozzle 61 that performed mounting operation of component P from mounting position A0 to post-mounting position A2 (S330), performs imaging using the side surface camera (S340), and performs image processing on the image obtained by the imaging (S350). Processing of S350 extracts a post-mounting image within the post-mounting image area from the image, and determines whether there is a component P (a component remaining on the suction nozzle) on the suction nozzle 61 positioned at post-mounting position A2 by checking the brightness values of pixels around the tip of the suction nozzle 61 of the extracted post-mounting image. CPU 101, when determining that there is a component remaining on the suction nozzle in the post-mounting image area (S360), discards the component P in a discard box that is not shown (S370). Then, CPU 101 exchanges the suction nozzle 61 for a new nozzle for mounting the next component P (S380) and then ends mounting check processing. Note that, CPU 101, after exchanging suction nozzle 61 for a new nozzle, performs imaging using side surface camera 80, extracts a nozzle image within the nozzle imaging area from the obtained image, and determines whether the suction nozzle 61 is attached based on the extracted nozzle image. By this, it is possible to determine whether the suction nozzle 61 has been exchanged. After exchanging suction nozzle 61 and ending mounting check processing, CPU 101 returns to S170 of the component mounting processing of
CPU 101, when determining in S360 that there is no component remaining on the suction nozzle in the post-mounting image area, determines that there is a possibility that component P has fallen on board S, therefore automatically stops component mounter 10 (S390), and displays an error for instructing an operator to remove the component P (S400). Then, CPU 101 stands by until an instruction to restart production is received from an operator (S410), and when an instruction to restart production is received, to restart component mounting processing, exchanges the suction nozzle 61 for a new nozzle (S380), and ends mounting check processing. Note that, CPU 101, in addition to displaying the error of S400, as well as ending mounting check processing, after ending mounting check processing, by ending the component mounting processing of
Here, mounting check processing of
Component mounter 10 of the embodiment described above is provided with side surface camera 80 on head unit 60, and, as optical system 84 of side surface camera 80, is provided with multiple mirrors 88a to 88f for performing imaging at the same time of suction nozzle 61 at pre-mounting position A1, suction nozzle 61 at post-mounting position A2, and the surface (mounting position) of board S when the suction nozzle 61 positioned at mounting position A0 mounts component P on board S. By this, compared to imaging multiple positions using separate cameras, the device can be made simpler and smaller. Also, because the pre-mounting image, post-mounting image, and board image are acquired with a single imaging, the imaging time is reduced.
Also, component mounter 10 of the present embodiment performs imaging using side surface camera 80 at a first timing at which component P contacts board S by the suction nozzle 61 at mounting position A0 being lowered in the Z-axis direction, and at a second timing at which the suction nozzle 61 has been raised by a specified amount after mounting the component P. By this, in addition to determining whether component P has been mounted at the correct mounting position on board S, it is possible to determine whether the component P remained on the suction nozzle 61 after the mounting of component P, the state being grasped more reliably based on the mounting error state.
Further, component mounter 10 of the present embodiment is able to determine whether there is a suction nozzle 61 at mounting position A0 from also imaging the nozzle imaging area of mounting position A0 with side surface camera 80. By this, in particular, it is possible to determine whether a suction nozzle 61 is attached when exchanging suction nozzles 61.
Component mounter 10 of the present embodiment, during the mounting check processing of
With component mounter 10 of the present embodiment, the board image is acquired by imaging using side surface camera 80 at a timing (first timing) when component P contacts board S due to suction nozzle 61 being lowered, and a timing (second timing) at which the suction nozzle 61 has been raised by a specified amount after mounting the component P, however, it is not essential to perform imaging at the second timing. In this case, compared to a case in which imaging is performed at the second timing, it is possible to start movement in the XY directions and movement in the R direction earlier.
With component mounter 10 of the first embodiment, the suction nozzle 61 at post-mounting position A2 and the suction nozzle 61 at pre-mounting position A1 are imaged at the same time by side surface camera 80 to acquire the post-mounting image and the pre-mounting image, but the configuration is not limited to this, and the configuration may be such that only one of post-mounting position A2 and pre-mounting position A1 is imaged. Also, the suction nozzle 61 at mounting position A0 is imaged to acquire the nozzle image, but it is not essential to image the suction nozzle 61 at mounting position A0.
With component mounter 10 of the first embodiment, the camera for acquiring the post-mounting image by imaging the suction nozzle 61 at post-mounting position A2, the camera for acquiring the pre-mounting image by imaging the suction nozzle 61 at pre-mounting position A1, and the camera for acquiring the board image by imaging the mounting position of board S are combined as a single side surface camera 80, but the configuration is not limited to this, and separate cameras may be provided.
With component mounter 10 of the first embodiment, in a case in which a mounting error occurs, measures for mounting errors are performed according to the mounting check processing of
With component mounter 10 of the first embodiment, control device 100, in S300 of the mounting check processing of
With component mounter 10 of the first embodiment, side surface camera 80 is used to acquire the image (board image) for determining whether component P held by suction nozzle 61 was correctly mounted on board S, but the configuration is not limited to this, and side surface camera 80 may be used for acquiring images for determining whether component P was correctly picked up when component P supplied by component supply device 20 is picked up by suction nozzle 61. In this case, for example, component mounter 10 (control device 100), during S120 of the component mounting processing of
In the embodiments, the present disclosure is described being applied to an item that uses side surface camera 80 to image suction nozzle 61 attached to rotary head 64, but the disclosure is not limited to this, and may be applied to an item that uses a side surface camera to image a suction nozzle attached to a head that does not rotate.
Correspondences between main constituent elements of the embodiments and main constituent elements of the disclosure will be clarified here. Rotary head 64 corresponds to a “head,” XY robot 50 corresponds to a “horizontal moving device,” Z-axis actuator 70 corresponds to a “vertical moving device,” CPU 101 of control device 100 that performs the component mounting processing of
Meanwhile, it goes without saying that the disclosure is not limited to the above-mentioned embodiments and various embodiments may be applied within the technical scope of the disclosure.
INDUSTRIAL APPLICABILITYThe present disclosure may be applied to the industrial field of component mounters and the like.
1: component mounting system; 10: component mounter 12: housing; 20: component supply device; 22: tape feeder 22a: reel; 30: board conveyance device; 32: belt conveyor device; 40: backup device; 50: XY robot; 52, 56: guide rail; 54: X-axis slider; 55: X-axis actuator; 58: Y-axis slider; 59: Y-axis actuator; 60: head unit; 61: suction nozzle; 62: nozzle holder; 62a: upper end section; 62b: flange section; 64: rotary head; 64a: reflective body; 65: spring (coil spring); 66: R-axis actuator; 67: rotation shaft; 68: drive motor; 69: Q-axis actuator; 70: Z-axis actuator 72: ball screw nut; 74: screw shaft; 76: Z-axis slider 77: lever section; 78: drive motor; 79: electromagnetic valve; 80: side surface camera; 82: camera main body; 82a: imaging element; 84: optical system; 86a: left incident opening; 86b: right incident opening; 86c: upper incident opening; 86d: camera connection opening; 87: light emitting body; 88a to 88f: mirror; 90: component camera; 92: mark camera; 94: nozzle stocker; 100: control device; 101, 111: CPU; 102, 112: ROM; 103, 113: HDD; 1-4, 114: RAM; 105, 115: input/output interface; 106, 116: bus; 110: management device; 117: input device; 118: display; A0: mounting position; A1: pre-mounting position; A2: post-mounting position; P: component; S: board
Claims
1: A component mounter configured to hold a component and mount the component on a surface of a board, the component mounter comprising:
- a head having a nozzle configured to hold the component at a nozzle tip of the nozzle;
- a horizontal moving device configured to move the head in a horizontal direction with respect to the surface of the board;
- a vertical moving device configured to move the nozzle in a vertical direction with respect to the surface of the board;
- a mounting control device configured to perform mounting operation of mounting the component held by the nozzle at a mounting location on the surface of the board by moving the head using the horizontal moving device such that the nozzle is positioned above the mounting position on the surface of the board and lowering the nozzle using the vertical moving device; and
- an imaging device provided on the head and configured to image an imaging target by receiving incident light from the imaging target on an imaging element via an optical system,
- wherein
- the optical system includes a first optical system configured to guide incident light from a direction of a side surface of the nozzle tip to a first region of the imaging element, and a second optical system configured to guide incident light from a direction of the surface of the board to a second region of the imaging element in a state with the nozzle above the surface of the board, and
- the imaging device is configured to be able to image an image of the side surface of the nozzle tip and an image of the surface of the board respectively via the first optical system and the second optical system.
2: The component mounter according to claim 1, wherein
- the head is a rotary type head provided with multiple nozzles in a circumferential direction and capable of revolving the multiple nozzles in the circumferential direction,
- the mounting control device performs mounting operation of mounting the component held by the nozzle at the mounting location on the surface of the board by moving the head using the horizontal moving device such that a mounting target nozzle out of the multiple nozzles is positioned above the mounting position on the surface of the board and lowering the mounting target nozzle using the vertical moving device, and
- the imaging device is able to image a first image that is at least one of a side image of the nozzle tip of a pre-mounting nozzle used to perform mounting operation of the component after the mounting target nozzle or a side image of the nozzle tip of a post-mounting nozzle used to perform mounting operation of the component before the mounting target nozzle, and a second image that is an image of surface of the board when the mounting target nozzle is performing mounting operation of the component respectively via the first optical system and the second optical system.
3: The component mounter according to claim 2, wherein
- the optical system includes a third optical system configured to guide incident light from a direction of the mounting target nozzle to a third region of the imaging element, and the imaging device is capable of imaging the first image, the second image, and a third image that is an image of the mounting target nozzle respectively via the first optical system, the second optical system, and the third optical system.
4: The component mounter according to claim 1, further comprising:
- an imaging control device configured to control the imaging device such that the image of the surface of the board is imaged at a first timing at which the component held by the nozzle contacts the surface of the board when the nozzle is lowered by the vertical moving device.
5: The component mounting according to claim 4, wherein
- the imaging control device is configured to control the imaging device such that, after the first timing, the side image of the nozzle tip is imaged after performing mounting operation of the component, and further provided is a determining device configured to determine whether the nozzle correctly mounted the component based on the image of the surface of the board imaged at the first timing and the side image of the nozzle tip imaged after the first timing.
6: The component mounter according to claim 1, further comprising:
- an imaging control device configured to control the imaging device such that the image of the surface of the board is imaged at a second timing at which the nozzle has been raised by a specified amount by the vertical moving device after the nozzle has performed mounting operation of the component.
7: The component mounting according to claim 6, wherein
- the imaging control device is configured to control the imaging device such that, before the second timing, the side image of the nozzle tip of the nozzle yet to perform mounting operation of the component is imaged, and further provided is a determining device configured to determine whether the nozzle correctly mounted the component based on the image of the surface of the board imaged at the second timing and the side image of the nozzle tip imaged before the second timing.
8: A component mounter configured to hold a component and mount the component on a surface of a board, the component mounter comprising:
- a rotary type head provided with multiple nozzles in a circumferential direction and capable of revolving the multiple nozzles in the circumferential direction,
- a horizontal moving device configured to move the head in a horizontal direction with respect to the surface of the board;
- a vertical moving device configured to move the nozzle in a vertical direction with respect to the surface of the board;
- a mounting control device configured to perform mounting operation of mounting the component held by the nozzle at the mounting location on the surface of the board by moving the head using the horizontal moving device such that a mounting target nozzle out of the multiple nozzles is positioned above the mounting position on the surface of the board and lowering the mounting target nozzle using the vertical moving device, and
- an imaging device provided on the head,
- wherein
- the imaging device is able to image at least one of a side image of the nozzle tip of a pre-mounting nozzle used to perform mounting operation of the component after the mounting target nozzle or a side image of the nozzle tip of a post-mounting nozzle used to perform mounting operation of the component before the mounting target nozzle, and an image of surface of the board when the mounting target nozzle is performing mounting operation of the component.
Type: Application
Filed: Dec 10, 2014
Publication Date: Nov 9, 2017
Patent Grant number: 10925199
Applicant: FUJI MACHINE MFG. CO., LTD. (Chiryu-shi)
Inventor: Mizuho NOZAWA (Nukata-gun)
Application Number: 15/534,552