TECHNIQUES TO ENABLE DISAGGREGATION OF PHYSICAL MEMORY RESOURCES IN A COMPUTE SYSTEM
Various embodiments are generally directed to an apparatus, method and other techniques enable disaggregation of physical memory resources from physical compute resources. For example, embodiments may include a memory interface coupled with the memory controller and a memory module. The memory interface may receive data in parallel via a bus, and convert the received parallel data to send to a memory module of a memory expander sled in serial via a high speed serial link, and receive data in serial via the high speed serial link from the memory module of the memory expander sled, and convert the received serial data to send in parallel to the memory controller via the bus.
This application claims priority to U.S. Provisional Patent Application No. 62/365,969, filed Jul. 22, 2016, U.S. Provisional Patent Application No. 62/376,859, filed Aug. 18, 2016, and U.S. Provisional Patent Application No. 62/427,268, filed Nov. 29, 2016, each of which are hereby incorporated by reference in their entirety.
TECHNICAL FIELDEmbodiments described herein generally include determining and communicating metric for physical resources in a data center environment.
BACKGROUNDA computing data center may include one or more computing systems including a plurality of compute nodes or sleds that may include various compute structures and may be physically located on multiple racks. These sleds may include a number of physical resources and provide processing and storage capabilities.
From time-to-time these physical resources may need to be replaced and updated due to failures and newer equipment. Typically, processing resources and memory resources on a sled are replaced at the same time because it is difficult to disaggregate the memory resources from processing resources. This significantly increases the total cost of maintaining the data center since the cost of memory resources occupies a large percentage of the total cost of a sled. Thus, embodiments are directed to solving these others problem.
Embodiments of the invention are illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings in which like reference numerals refer to similar elements.
Various embodiments may be generally directed to enabling disaggregation of physical compute resources from physical memory resources. As previously discussed, physical compute resources, such as processors, and physical memory resources are typically replaced at the same time because of their integration on the same sled or node. Thus, embodiments are directed to disaggregation solutions to decouple physical compute resources and physical memory resources such that when physical compute resources are replaced, the physical memory resources may be reused. Some of the solutions discussed herein may include physical memory resources incorporated on a memory expander sled coupled with the physical compute resources on a different sled via a high speed link. The memory expander sled may come in various form factors, such as the dual in-line memory module (DIMM) form factor or a solid state drive (SSD) form factor to reduce the overall size and footprint of the memory expander sled.
In one example, the physical memory resources may be implemented in a memory expander sled in a SSD form factor, as previously mentioned. In this example, the SSD form factor may enable a reduction in pin count, but maintain high speed serial links between the physical memory resources and the physical compute resources.
In another example, the physical memory resources may be in a memory expander sled having DIMM form factor and coupled with the physical compute resources via a pig tail connector. The pig tail connector may couple with the physical compute resources via a high serial speed link and include circuitry to convert parallel data to serial data to send data to the physical memory resources. The expander sled may also include circuitry to convert serial data back to parallel data at the physical memory resources for communication with the memory modules. During read operations, the expander sled including the circuitry may convert data read from memory devices from parallel data to serial data to communicate to the physical compute resources via the high serial speed link and pig tail connector. The pig tail connector may receive the data and convert it from serial data back to parallel data to communicate to the physical compute resources. The parallel data may be data communicated in parallel via a bus or link and the serial data may be data communicated in serial via a bus or link.
In a third example, the physical memory resources may be incorporated in a memory expander sled, and asled including the physical compute resources may be coupled with the memory expander sled via a high speed serial link. In this example, the sled having the physical compute resources may have one or more memory controllers and serialization/deserialization (SerDes) circuitry to convert parallel data to serial data for communication with the physical memory resources in the memory expander sled. In some instances, the memory controllers may be integrated memory controllers with the processor or part of a different chipset of the sled with the physical compute resources. Further, the memory expander sled may also include SerDes circuitry to convert the serial data to parallel data for communication with the memory modules.
In a fourth example, the physical memory resources of a memory expander sled may be shared between a number of physical compute resources and may be in a single or individual sleds. The memory expander sled the physical compute resources sled(s) may be coupled via a high speed serial link and each may include circuitry to convert data between parallel data and serial data. Further, the memory expander sled may include a circuit switch to enable the sharing of the physical memory resources with the physical compute resources. These and other details will become more apparent in the following description.
Reference is now made to the drawings, wherein like reference numerals are used to refer to like elements throughout. In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding thereof. It may be evident, however, that the novel embodiments can be practiced without these specific details. In other instances, well-known structures and devices are shown in block diagram form in order to facilitate a description thereof. The intention is to cover all modifications, equivalents, and alternatives consistent with the claimed subject matter.
The illustrative data center 100 differs from typical data centers in many ways. For example, in the illustrative embodiment, the circuit boards (“sleds”) on which components such as CPUs, memory, and other components are placed are designed for increased thermal performance. In particular, in the illustrative embodiment, the sleds are shallower than typical printed circuit boards (PCBs). In other words, the sleds are shorter from the front to the back, where cooling fans are located. This decreases the length of the path that air must to travel across the components on the PCB. Further, the components on the sled are spaced further apart than in typical PCBs, and the components are arranged to reduce or eliminate shadowing (i.e., one component in the air flow path of another component). In the illustrative embodiment, processing components such as the processors are located on a top side of a sled while memory modules are located on a bottom side of the sled. As a result of the enhanced airflow provided by this design, the components may operate at higher frequencies and power levels than in typical systems, thereby increasing performance. Furthermore, the sleds are configured to blindly mate with power and data communication cables in each rack 102A, 102B, 102C, 102D, enhancing their ability to be quickly removed, upgraded, reinstalled, and/or replaced. Similarly, individual components located on the sleds, such as processors, accelerators, memory, and data storage drives, are configured to be easily upgraded due to their increased spacing from each other. In the illustrative embodiment, the components additionally include hardware attestation features to prove their authenticity.
Furthermore, in the illustrative embodiment, the data center 100 utilizes a single network architecture (“fabric”) that supports multiple other network architectures which may be in accordance to standards, such as Institute of Electrical and Electronics Engineers (IEEE) 802.3-2015 standard (Ethernet) or any predecessors, revisions, or variants thereof, and other architectures, such as Intel® Omni-Path®. The sleds, in the illustrative embodiment, are coupled to switches via optical fibers, which provide higher bandwidth and lower latency than typical twisted pair cabling (e.g., Category 5, Category 5e, Category 6, etc.). Due to the high bandwidth, low latency interconnections and network architecture, the data center 100 may, in use, pool resources, such as memory, accelerators (e.g., graphics accelerators, FPGAs, ASICs, etc.), and data storage drives that are physically disaggregated, and provide them to compute resources (e.g., processors) on an as needed basis, enabling the compute resources to access the pooled resources as if they were local. The illustrative data center 100 additionally receives usage information for the various resources, predicts resource usage for different types of workloads based on past resource usage, and dynamically reallocates the resources based on this information.
The racks 102A, 102B, 102C, 102D of the data center 100 may include physical design features that facilitate the automation of a variety of types of maintenance tasks. For example, data center 100 may be implemented using racks that are designed to be robotically-accessed, and to accept and house robotically-manipulable resource sleds. Furthermore, in the illustrative embodiment, the racks 102A, 102B, 102C, 102D include integrated power sources that receive a greater voltage than is typical for power sources. The increased voltage enables the power sources to provide additional power to the components on each sled, enabling the components to operate at higher than typical frequencies.
In various embodiments, dual-mode optical switches may be capable of receiving both Ethernet protocol communications carrying Internet Protocol (IP packets) and communications according to a second, high-performance computing (HPC) link-layer protocol (e.g., Intel® Omni-Path Architecture®, Infiniband®) via optical signaling media of an optical fabric. As reflected in
Included among the types of sleds to be accommodated by rack architecture 600 may be one or more types of sleds that feature expansion capabilities.
MPCMs 916-1 to 916-7 may be configured to provide inserted sleds with access to power sourced by respective power modules 920-1 to 920-7, each of which may draw power from an external power source 921. In various embodiments, external power source 921 may deliver alternating current (AC) power to rack 902, and power modules 920-1 to 920-7 may be configured to convert such AC power to direct current (DC) power to be sourced to inserted sleds. In some embodiments, for example, power modules 920-1 to 920-7 may be configured to convert 277-volt AC power into 12-volt DC power for provision to inserted sleds via respective MPCMs 916-1 to 916-7. The embodiments are not limited to this example.
MPCMs 916-1 to 916-7 may also be arranged to provide inserted sleds with optical signaling connectivity to a dual-mode optical switching infrastructure 914, which may be the same as—or similar to—dual-mode optical switching infrastructure 514 of
Sled 1004 may also include dual-mode optical network interface circuitry 1026. Dual-mode optical network interface circuitry 1026 may generally comprise circuitry that is capable of communicating over optical signaling media according to each of multiple link-layer protocols supported by dual-mode optical switching infrastructure 914 of
Coupling MPCM 1016 with a counterpart MPCM of a sled space in a given rack may cause optical connector 1016A to couple with an optical connector comprised in the counterpart MPCM. This may generally establish optical connectivity between optical cabling of the sled and dual-mode optical network interface circuitry 1026, via each of a set of optical channels 1025. Dual-mode optical network interface circuitry 1026 may communicate with the physical resources 1005 of sled 1004 via electrical signaling media 1028. In addition to the dimensions of the sleds and arrangement of components on the sleds to provide improved cooling and enable operation at a relatively higher thermal envelope (e.g., 250 W), as described above with reference to
As shown in
In another example, in various embodiments, one or more pooled storage sleds 1132 may be included among the physical infrastructure 1100A of data center 1100, each of which may comprise a pool of storage resources that is available globally accessible to other sleds via optical fabric 1112 and dual-mode optical switching infrastructure 1114. In some embodiments, such pooled storage sleds 1132 may comprise pools of storage devices such as solid-state drives (SSDs), hard disk drives (HDD), hard drive, disk drive, fixed disk drives, and so forth. In various embodiments, one or more high-performance processing sleds 1134 may be included among the physical infrastructure 1100A of data center 1100. In some embodiments, high-performance processing sleds 1134 may comprise pools of high-performance processors, as well as cooling features that enhance air cooling to yield a higher thermal envelope of up to 250 Watts (W) or more. In various embodiments, any given high-performance processing sled 1134 may feature an expansion connector 1117 that can accept a memory expansion sled, such that the next level (second level or third level) memory that is locally available to that high-performance processing sled 1134 is disaggregated from the processors and memory comprised on that sled. In some embodiments, such a high-performance processing sled 1134 may be configured with the next level memory using an expansion sled that comprises low-latency SSD. The optical infrastructure allows for compute resources on one sled to utilize remote accelerator/FPGA, memory, and/or storage resources that are disaggregated on a sled located on the same rack or any other rack in the data center. The remote resources can be located one switch jump away or two-switch jumps away, e.g. remote resources connected through a single or two switches, in the spine-leaf network architecture described above with reference to
In various embodiments, one or more layers of abstraction may be applied to the physical resources of physical infrastructure 1100A in order to define a virtual infrastructure, such as a software-defined infrastructure 1100B. In some embodiments, virtual computing resources 1136 of software-defined infrastructure 1100B may be allocated to support the provision of cloud services 1140. In various embodiments, particular sets of virtual computing resources 1136 may be grouped for provision to cloud services 1140 in the form of software defined infrastructure (SDI) services 1138. Examples of cloud services 1140 may include—without limitation—software as a service (SaaS) services 1142, platform as a service (PaaS) services 1144, and infrastructure as a service (IaaS) services 1146.
In some embodiments, management of software-defined infrastructure 1100B may be conducted using a virtual infrastructure management framework 1150B. In various embodiments, virtual infrastructure management framework 1150B may be designed to implement workload fingerprinting techniques and machine-learning techniques in conjunction with managing allocation of virtual computing resources 1136 and/or SDI services 1138 to cloud services 1140. In some embodiments, virtual infrastructure management framework 1150B may use/consult telemetry data in conjunction with performing such resource allocation. In various embodiments, an application/service management framework 1150C may be implemented to provide quality of service (QoS) management capabilities for cloud services 1140. The embodiments are not limited in this context.
In embodiments, the sled 1204 may be the same as other sleds discussed herein, such as sled 1004 illustrated in
In embodiments, the physical compute resource 1205-4 may be implemented as a microprocessor, a processor, a central processing unit, a multi-core processor, a mobile device processor, a single core processor, a system-on-chip (SoC) device, and so forth. The physical compute resource 1205-4 may be integrated on a single die or multiple dies in a single chip package. Moreover, each of the cores 1207 of the physical compute resources 1205-4 may be independent processing units capable of reading and executing program instructions. The instructions are ordinary instructions that can be executed at the same time or in parallel. In embodiments, the physical compute resource 1205-4 may be coupled with other components of the sled 1204 via one or more interconnects or links.
The physical compute resource 1205-4 also includes a memory controller 1236, which may be an integrated memory controller on the same die as the cores 1207. In other instances, the memory controller 1236 may be integrated into a different die on a different chipset and couple with the cores 1207 by a bus or link, for example. The memory controller 1236 may receive read requests and memory address(es) to read data from memory, e.g. the physical memory resources 1205-3. Data may be read from the physical memory resources 1205-3 of the memory expander sled 1218. The memory controller 1236 may provide the data to the cores 1207 once it is read from memory, for example. Further, the memory controller 1236 may also receive write requests, memory address(es) and associated data to write to the physical memory resources 1205-3 of the memory expander sled 1218.
In some embodiments, the physical memory resources 1205-3 including the memory modules 1211 may include one or more byte addressable write-in-place non-volatile memory devices. The memory devices may also include future generation non-volatile devices, such as a three dimensional crosspoint memory device, or other byte addressable write-in-place nonvolatile memory devices. In one embodiment, the memory devices may be or may include memory devices that use chalcogenide glass, multi-threshold level NAND flash memory, NOR flash memory, single or multi-level Phase Change Memory (PCM), a resistive memory, nanowire memory, ferroelectric transistor random access memory (FeTRAM), anti-ferroelectric memory, magnetoresistive random access memory (MRAM) memory that incorporates memristor technology, resistive memory including the metal oxide base, the oxygen vacancy base and the conductive bridge Random Access Memory (CB-RAM), or spin transfer torque (STT)-MRAM, a spintronic magnetic junction memory based device, a magnetic tunneling junction (MTJ) based device, a DW (Domain Wall) and SOT (Spin Orbit Transfer) based device, a thiristor based memory device, or a combination of any of the above, or other memory. The memory devices may refer to the die itself and/or to a packaged memory product. In some embodiments, the memory modules 1211 may include other types of memory devices, such as dynamic RAM (DRAM), static RAM (SRAM), double data rate DRAM (DDR DRAM), synchronous DRAM (SDRAM), DDR SDRAM, and so forth. Some embodiments may include a combination of different memory types, embodiments are not limited in this manner.
In some embodiments, the memory module 1211 may be a dual in-line memory module (DIMM) having one or more memory devices capable of plugging into a DIMM slot of a PCB of the memory expander sled 1218. The module 1211 may have a DIMM form factor in accordance with one or more standards, such as Joint Electronic Device Engineering Council (JEDEC) defined technical standard JESD248 (“DDR NVDIMM-N Design Standard”), JEDEC Module 4.20.27 (“288-Pin, 1.2 V (VDD), PC4-1600/PC4-1866/PC4-2133/PC4-2400/PC4-2666/PC4-3200 DDR4 SDRAM Load Reduced DIMM Design Specification”), JESD79-4A (“DDR4 SDRAM Standard”), JEDEC Module 4.20.28 (“288-Pin, 1.2 V (VDD), PC4-1600/PC4-1866/PC4-2133/PC4-2400/PC4-2666/PC4-3200 DDR4 SDRAM Registered DIMM Design Specification”), and so forth. Embodiments are not limited in this manner. In some instances, the memory module 1211 may be integrated circuit memory devices incorporated directly on a PCB of the memory expander sled 1218.
In embodiments, the memory controller 1236 may be coupled with a memory interface 1234 via a parallel link 1253, wherein the memory interface 1234 is capable of interfacing with the physical memory resources 1205-3 of the memory expander sled 1218 via a high speed serial link 1251. The parallel link 1253 may be a high-speed parallel link or bus to communicate data in parallel and coupled with the memory interface 1234 and the high speed serial link 1251 may be a link to communicate data in serial. The memory interface 1234 may also include circuitry to communicate data between the memory controller 1234 and the memory module(s) 1211. For example, the memory interface 1234 may include an optical transceiver to communicate data via an optical high speed serial link. In another example, the memory interface 1234 may include an electrical transceiver to communicate via electrical high speed serial links.
The memory interface 1234 may also include circuitry, such as serializer/deserializer (SerDes) circuitry, to convert parallel data to serial data, and vice versa. More specifically, the memory interface 1234 can convert parallel data communicated from one or more cores 1207 to serial data for communication to the memory module(s) 1211 via the high speed serial links 1251. Similarly, the memory interface 1234 may convert serial data received from the memory module(s) 1211 to parallel data for communication to the one or more cores 1207 via the high speed parallel links 1253. Embodiments are not limited to this example, and in some instances, the SerDes circuitry may be incorporated into the connector 1217 instead of the memory interface 1234.
In some embodiments, the memory interface 1234 may include circuitry to compress and decompress data communicated via the high speed serial link 1251. For example, a compression mechanism may be used to generate a fabric packet including the compressed data to communicate serial via the high speed serial links 1251. The compression mechanism may utilize a compression algorithm, such as a Byte Pattern Repeat compression mechanism, a Word (2 bytes) Pattern Repeat compression mechanism, a Dword (4 bytes) Pattern Repeat compression mechanism, and a Qword (8 bytes) Pattern Repeat. In some instances, other compression mechanisms may be utilized, such as compression logic or an algorithm to perform lossless data compression on the data. In one example, a run-length encoding (RLE) algorithm may be used on the data such that a repeating pattern and the length of the repeating pattern are indicated in the compressed data. Other examples of compression algorithms that may be used include Lempel-Ziv 1978, Lempel-Ziv Fast (LZF), DEFLATE, bzip2, Lempel-Ziv-Markov chain algorithm, Lempel-Ziv-Oberhumer, and so forth.
In some embodiments, the memory interface 1234 may communicate information and data including packets using a transaction protocol. The transaction protocol may enable transaction-based data transfers using the high speed interconnect 1251. For example, the high speed interconnect may support a Quick-Path Interconnect transaction protocol that may employ packet-based transfers using a multi-layer protocol architecture. Among its features is support for coherent transactions (e.g., memory coherency). In embodiments, to increase memory transaction bandwidth, a Fully Buffered DIMM (or FB-DIMM) architecture is employed, which introduces an advanced memory buffer (AMB) between the memory controller 1236 and a memory module 1211. Unlike the parallel bus architecture of traditional DRAMs, the high speed serial link 1251 enables an increase in the width of the memory without increasing the pin count of the memory controller 1236 beyond a feasible level. In another example, the high speed serial link 1251 may be a scalable memory interconnect (SMI) link and include Scalable Memory Buffers (SMB).
The memory interface 1234 may be coupled to the connector 1217 via a high speed serial link 1251. In some embodiments, the connector 1217 may be a low pin count high-speed slot connector capable of receiving and coupling with the connector 1219 of the memory expander sled 1218. In one example, the connector 1217 may be a serial attachment (SATA) connector, a micro SATA (mSATA) connector, a SATA2 connector a SATA3 connector, a SATA4 connector, a universal serial bus (USB) connector, a USB3 connector, a SATAe connector, a Thunderbolt 3 connector, a connector in accordance with JEDEC defined technical standard, such as the MO-297 standard, and the MO-300 standard. Other examples, may include a Next Generation Form Factor (NGFF) connector or an M.2 connector. In some embodiments, the connector 1217 may provide an optical connection, e.g. an optical fiber connector. Embodiments are not limited to these examples and other high speed serial connectors may be utilized for the connectors 1217 and 1219.
In some instances, the form factor of the memory expander sled 1218 may determine which connector type is utilized for connectors 1217 and 1219. For example, the memory expander sled 1218 may be in a solid state drive (SSD) form factor and the memory module(s) 1211 may include one or more byte addressable write-in-place non-volatile memory devices, or any other memory device, as previously discussed. In some instances, the memory expander sled 1218 may not incorporate memory modules, but may have integrated circuit memory devices incorporated directly on a printed circuit board (PCB) of the memory expander sled 1218. Embodiments are not limited in this manner.
The SSD form factor may be in accordance with the JEDEC MO-297-A (May 2009) standard or any predecessors, revisions, or variants thereof. Other examples include SSD form factors in accordance with a Next Generation Form Factor (NGFF) or an M.2 form factor. The connectors 1217 and 1219 may be one of the SATA connectors, e.g. SATA2, SATA3, SATA4, etc., or other high speed serial connectors for connecting with a SSD form factor. In this example, the SSD form factor enables the sled 1204 having the physical compute resource 1205-4 to be changed without changing the memory expander sled 1218 and memory modules 1211 or allowing them to be reused with other physical compute resources 1205-4.
In another example, the memory expander sled 1218 may have a DIMM form factor and the memory module 1211 may be integrated circuit memory devices incorporated on the PCB of the memory expander sled 1218. The connector 1217 of the sled 1204 may be a pig tail type connector capable of coupling with connector 1219 of the memory expander sled 1218 via a high speed serial link 1251. The DIMM form factor of the memory expander sled 1218 may be in accordance with one or more standards, such as JEDEC defined technical standard JESD248 (“DDR NVDIMM-N Design Standard”), JEDEC Module 4.20.27 (“288-Pin, 1.2 V (VDD), PC4-1600/PC4-1866/PC4-2133/PC4-2400/PC4-2666/PC4-3200 DDR4 SDRAM Load Reduced DIMM Design Specification”), JESD79-4A (“DDR4 SDRAM Standard”), JEDEC Module 4.20.28 (“288-Pin, 1.2 V (VDD), PC4-1600/PC4-1866/PC4-2133/PC4-2400/PC4-2666/PC4-3200 DDR4 SDRAM Registered DIMM Design Specification”), and so forth. Embodiments are not limited in this manner. In this example, the connector 1217, configured as a pig tail, may be added as DIMM connector to the PCB of the sled 1204. The connector 1217 may couple with a high speed serial link, which may be low pin count cable or wire that is part of the pig tail having an opposing end that may couple with a DIMM connector (connector 1219) of the memory expander sled 1218. In this example, the connectors 1217 and 1219 may include SerDes circuitry to convert data from parallel to serial, and vice versa, for communication via the low pin count wire between the memory expander sled 1218 and the sled 1204. Note that
On the memory expander sled 1218, the connector 1219 may be coupled with a physical memory resource 1205-3, including a memory interface 1209 via a high speed serial link 1251 or a high speed parallel link (not shown) for instances when the SerDes circuitry is incorporated in the connector 1219 itself. Data may be passed or communicated to the memory interface 1209, which may include at least one of an optical transceiver and electrical transceiver to communicate data between the memory module(s) 1211 and the memory controller 1236 of the sled 1204. In some instances, the memory interface 1209 may also include SerDes circuitry to convert parallel data to serial data. Thus, data communicated from the connector 1219 to the memory interface 1209 in a serial data format and the memory interface 1209 may convert the data back to parallel data for the memory module(s) 1211. Similarly, parallel data communicated from the memory module(s) 1211 may be serialized by the memory interface 1209 for communication to the sled 1204. The memory interface 1209 may also include circuitry to perform compression and decompression and communicate data via a transactional protocol, as previously discussed.
In embodiments, the memory interface 1209 may receive the read requests from memory interface 1234, which may include one or more address(es) to read data from the memory modules 1211. The data may be read from the memory modules 1211 and the memory interface 1209 may provide the data over the high speed serial link 1251, as discussed. Similarly, the memory interface 1209 may also receive write requests from memory interface 1234, which may include one or more address(es) and data that may be written into memory modules 1211. The data may be written into the memory modules 1211 based on the one or more address(es).
In embodiments, the physical compute resource 1305-4 may be implemented via a processor, computer processing unit, multi-core processor, and so forth as similarly discussed with respect physical compute resources 1205-4 of
Each of the memory controllers 1336-1 through 1336-4 may process read and write requests. Further, each of the memory controllers 1336-1 through 1336-4 may provide a memory channel in a multi-channel memory architecture. Each of the memory channels may enable communication between the memory controllers 1336-1 through 1336-4 and one or more of the memory modules 1311-1 through 1311-8. In some instances, the throughput may be 50 GigaTransfers/second (GT/s)/Channel. The illustrated embodiment includes four channels; however, embodiments are not limited in this manner and embodiments may include more or fewer channels.
In embodiments, each of the memory controllers 1336-1 through 1336-4 may be coupled with a corresponding memory interface 1334-1 through 1334-4 via parallel links 1353. The parallel links 1353 may be high-speed parallel links or a bus coupled with the memory interfaces 1334-1 through 1334-4. In embodiments, each of the memory interface 1334-1 through 1334-4 may include circuitry, e.g. an optical and/or electrical transceiver, to communicate data between the corresponding memory controllers 1336-1 through 1336-4 and the memory modules 1311-1 through 1311-8. Each of the memory interfaces 1334-1 through 1334-4 may also include circuitry, such as SerDes circuitry, to convert parallel data to serial data, and vice versa. Thus, data communicated from one or more cores 1307 may be converted from parallel data to serial data for communication to the memory modules 1311-1 through 1311-8 by the memory interfaces 1334-1 through 1334-4. Similarly, the memory interfaces 1334-1 through 1334-4 may convert serial data received from the memory modules 1311-1 through 1311-8 to parallel data for communication to the one or more cores 1307. Embodiments are not limited in this manner and some instances, the SerDes circuitry may be implemented as part of the connector 1317. In this example, memory interfaces 1334 may be coupled with the connector 1317 via parallel links and the connector 1317 may convert the data. However, if each of the memory interfaces 1334-1 through 1334-4 includes SerDes circuitry, they may also circuitry to send and receive data via at least one of optical serial links and electrical serial links, perform compression and decompression of the data, and use a transactional protocol.
In embodiments, the memory interfaces 1334-1 through 1334-4 may be coupled with a connector 1317 via a high speed serial link 1351 or a parallel link depending on whether the parallel to serial (or vice versa) conversation occurs in the memory interface 1334 or the connector 1317. In embodiments, the connector 1317 may couple with connector 1319 of the memory expander sled 1318 via the high speed serial links 1351. Each high speed serial link 1351 may provide a memory channel for the multi-channel memory architecture. In embodiments, the connectors 1317 and 1319 may provide at least one of an optical high-speed serial connection and electrical high-speed serial connection via the high speed serial link 1351.
Moreover, the connector 1319 of the memory expander sled 1818 may communicate data with the sled 1304 via the high speed serial links 1351, as discussed. In some instances, the connector 1319 also includes SerDes circuitry to convert data from parallel data to serial data to communicate to the memory modules 1311, and vice versa to communicate data to the sled 1304. The connector 1319 may be coupled with the physical memory resource 1305-3, and in particular, memory interfaces 1309-1 through 1309-4. Although
Each of the memory interfaces 1309-1 through 1309-4 may be coupled with the connector 1319 via a parallel link if the connector 1319 includes the SerDes circuitry or a high speed serial link 1351 if the memory interfaces 1309 include the SerDes circuitry. In embodiments, each of the memory interfaces 1309-1 through 1309-4 may also include circuitry, e.g. an electrical or optical transceiver, to send and receive data via optical serial links and electrical serial links. Each of the memory interfaces 1309-1 through 1309-4 may be capable of receiving and sending data between the memory module(s) 1311-1 through 1311-8 of the memory expander sled 1318 and the sled 1304. In instances, the data may be communicated via high-speed parallel links 1353 with the memory modules 1311-1 through 1311-8.
In embodiments, the physical memory resources 1305-3 may include a number of memory modules 1311-1 through 1311-8, each of which include one or more byte addressable write-in-place non-volatile memory devices. The memory devices may also include future generation non-volatile devices, such as a three dimensional crosspoint memory device, or other byte addressable write-in-place nonvolatile memory devices. In one embodiment, the memory devices may be or may include memory devices that use chalcogenide glass, multi-threshold level NAND flash memory, NOR flash memory, single or multi-level Phase Change Memory (PCM), a resistive memory, nanowire memory, ferroelectric transistor random access memory (FeTRAM), anti-ferroelectric memory, magnetoresistive random access memory (MRAM) memory that incorporates memristor technology, resistive memory including the metal oxide base, the oxygen vacancy base and the conductive bridge Random Access Memory (CB-RAM), or spin transfer torque (STT)-MRAM, a spintronic magnetic junction memory based device, a magnetic tunneling junction (MTJ) based device, a DW (Domain Wall) and SOT (Spin Orbit Transfer) based device, a thiristor based memory device, or a combination of any of the above, or other memory. The memory devices may refer to the die itself and/or to a packaged memory product. In some embodiments, the memory modules 1211 may include other types of memory devices, such as dynamic RAM (DRAM), static RAM (SRAM), double data rate DRAM (DDR DRAM), synchronous DRAM (SDRAM), DDR SDRAM, and so forth. Some embodiments may include a combination of different memory types, embodiments are not limited in this manner. In some embodiments, the memory module 1311 may be a dual in-line memory module (DIMM) having one or more memory devices capable of plugging into a DIMM slot of a PCB of the memory expander sled 1318. The memory module 1311 may have a DIMM form factor in accordance with one or more standards, such as Joint Electronic Device Engineering Council (JEDEC) defined technical standard JESD248 (“DDR NVDIMM-N Design Standard”), JEDEC Module 4.20.27 (“288-Pin, 1.2 V (VDD), PC4-1600/PC4-1866/PC4-2133/PC4-2400/PC4-2666/PC4-3200 DDR4 SDRAM Load Reduced DIMM Design Specification”), JESD79-4A (“DDR4 SDRAM Standard”), JEDEC Module 4.20.28 (“288-Pin, 1.2 V (VDD), PC4-1600/PC4-1866/PC4-2133/PC4-2400/PC4-2666/PC4-3200 DDR4 SDRAM Registered DIMM Design Specification”), and so forth. Embodiments are not limited in this manner.
In embodiments, the memory expander sled 1318 coupled with the sled 1304 via the connectors 1317 and 1319 and the high speed serial links 1351 may enable disaggregation of the physical compute resources 1305-4 from the physical memory resources 1305-3. Thus, the physical compute resources 1305-4 or the physical memory resources 1305-3 may be replaced without affecting the remaining physical resource (memory or compute) in the compute system 1300.
In instances, each of the physical compute resources 1405-4 may include one or more cores (not shown), one or more memory controllers 1436, and one or more memory interfaces 1434. These components may be similar or the same as the liked named components as previously discussed in
In embodiments, the memory interfaces 1434 may be coupled to a connector 1417 via high speed serial links 1451. Although not shown, in some instances the memory interfaces 1434 may be coupled to connector 1417 via parallel links, and the connector 1417 may include SerDes circuitry to convert data between parallel and serial formats. Further, the connector 1417 may couple with connector 1419 of the memory expander sled 1418 via high speed serial links 1451 to electrically and/or optically link the two sleds 1404 and 1418 together. In some instances, each high speed serial link 1451 linking the two sleds 1404 and 1418 may provide a memory channel for a multi-channel memory architecture. Similar to connector 1417, the connector 1419 of the memory expander sled 1418 may also include SerDes circuitry to convert data from parallel data to serial data and vice versa. However, embodiments are not limited in this manner and some instances; memory interfaces 1409 may include the SerDes circuitry to convert serial data to parallel data and vice versa. The memory interfaces 1434 may also include circuitry to perform compression/decompression of the data and communicate via a transactional protocol.
The connector 1419 may be coupled with a circuit switch 1414, such as an electrical circuit switch (flit or FED) or an optical circuit switch. The circuit switch 1414 may enable the physical compute resources 1405 to share memory, such as the memory modules 1411 of physical memory resource 1405-3. In some instances, the circuit switch 1414 may be incorporated in or be part of the connector 1419. The circuit switch 1414 may couple one or more memory modules 1411 with a physical compute resource 1405-4 for utilization by the physical compute resources 1405-4 to process data and workloads.
In some instances, the circuit switch 1414 may include circuitry to determine workloads for the physical compute resource 1405-4 and a required amount of memory to process those workloads. The circuit switch 1414 may dynamically assign memory modules 1411 (and channels) for use by a physical compute resource 1405-4 during run-time to process a workload, for example. Once a workload is complete or processed, the circuit switch 1414 may configure or reallocate memory modules 1411 to process another workload. The reallocation and configuration of which memory modules 1411 are used by which physical compute resource 1405-4 may occur continuously, and in real-time, while the compute system 1400 is processing workloads.
The circuit switch 1414 may also be configurable based on information received by a controller. For example, a baseboard management controller (not shown) of a sled 1404 may communicate information and control the circuit switch 1414. The information may indicate a circuit switch configuration or information of workloads, which may be used by the circuit switch 1414 to make the determination of configuration. The circuit switch 1414 may receive information from other controllers of the compute system 1400, such as pod management controller and a rack management controller. In some instances, the circuit switch 1414 may be configured or reconfigured at a time of a boot or reboot. For example, if one or more of the physical compute resources 1405-4 are rebooted or booted, the circuit switch 1414 may configure itself to allocate memory modules 1411 accordingly, e.g. to process workloads based on a requirement of the physical compute resources 1405. Embodiments are not limited in this manner.
The physical memory resource 1405-3 may include any number of memory modules 1411-c, where c may be any positive integer. Moreover, the memory modules 1411 may be shared with the physical compute resources 1405-4 via the circuit switch 1414; and therefore, may be considered a pool of memory modules 1411. each of which include one or more byte addressable write-in-place non-volatile memory devices. The memory devices may also include future generation non-volatile devices, such as a three dimensional crosspoint memory device, or other byte addressable write-in-place nonvolatile memory devices. In one embodiment, the memory devices may be or may include memory devices that use chalcogenide glass, multi-threshold level NAND flash memory, NOR flash memory, single or multi-level Phase Change Memory (PCM), a resistive memory, nanowire memory, ferroelectric transistor random access memory (FeTRAM), anti-ferroelectric memory, magnetoresistive random access memory (MRAM) memory that incorporates memristor technology, resistive memory including the metal oxide base, the oxygen vacancy base and the conductive bridge Random Access Memory (CB-RAM), or spin transfer torque (STT)-MRAM, a spintronic magnetic junction memory based device, a magnetic tunneling junction (MTJ) based device, a DW (Domain Wall) and SOT (Spin Orbit Transfer) based device, a thiristor based memory device, or a combination of any of the above, or other memory. The memory devices may refer to the die itself and/or to a packaged memory product. In some embodiments, the memory modules 1211 may include other types of memory devices, such as dynamic RAM (DRAM), static RAM (SRAM), double data rate DRAM (DDR DRAM), synchronous DRAM (SDRAM), DDR SDRAM, and so forth. Some embodiments may include a combination of different memory types, embodiments are not limited in this manner.
In embodiments, the memory modules 1411 may be in memory expander sled 1418 in an SSD form factor and may use any SATA connector, as previously discussed. For example, The SSD form factor may be in accordance with the JEDEC MO-297-A (May 2009) standard or any predecessors, revisions, or variants thereof. Other examples include SSD form factors in accordance with a Next Generation Form Factor (NGFF) or an M.2 form factor. The connectors 1417 and 1419 may be one of the SATA connectors, e.g. SATA2, SATA3, SATA4, etc., or other high speed serial connectors for connecting with a SSD form factor. Embodiments are not limited to these examples, and other SSD form factors may be utilized and be consistent with embodiments discussed herein.
In embodiments, the memory expander sled 1418 coupled with the sled 1404 via the connectors 1417 and 1419 and the high speed serial links 1451 may enable disaggregation of the physical compute resources 1405-4 from the physical memory resources 1405-3. Thus, the physical compute resources 1405-4 or the physical memory resources 1405-3 may be replaced without affecting the remaining physical resource (memory or compute) in the compute system 1400.
With respect to logic flow 1500, embodiments include receiving data via a high speed parallel link from a core of physical compute resource at block 1502. In some instances, the data may be data a core requests to store or write to memory. The data may be communicated to a memory interface via a memory controller and may also be communicated with address information for use by the memory to store the data.
At block 1504, the logic flow 1500 may include converting the data received via the high speed parallel link for communication via a high speed serial link. For example, the memory interface may serialize the data, via SerDes circuitry, to communicate the data via a single/differential link. In embodiments, the SerDes circuitry may convert the data for communication via a high speed serial link using any number of techniques, including but not limited to, a parallel clock SerDes technique, an Embedded clock SerDes technique, a 8b/10b SerDes technique, and a bit interleaved SerDes technique. To convert the data for serial communication, the SerDes circuitry may receive a parallel clock input, a set of data input lines (parallel link), and input data latches. The SerDes circuitry may utilize a phase-locked looped to multiply the incoming parallel clock up to a serial frequency for the high speed serial link.
At block 1506, the logic flow 1500 may include sending the data via the high speed serial link to one or more memory modules. In some instances, the one or more memory modules may be incorporated on a memory expander sled to enable easy disaggregation of the memory modules and the cores.
With respect to logic flow 1550, embodiments include receiving data via a high speed serial link from a memory of a memory expander sled at block 1522. In some instances, the data may be data a core requests to be read from the memory and may be received based on a read request. The data may be communicated to the memory interface via a memory interface of a memory expander sled. In some instances, data may be received from a circuit switch coupled with the memory interface of the memory expander sled.
At block 1554, the logic flow 1550 may include converting the data received via high speed serial link for communication via a high speed parallel link. For example, the memory interface may deserialize the data, via SerDes circuitry, to communicate the data via a parallel link. In embodiments, the SerDes circuitry may convert the data for communication via a high speed parallel link using any number of techniques, including but not limited to, the parallel clock SerDes technique, the Embedded clock SerDes technique, the 8b/10b SerDes technique, and the bit interleaved SerDes technique. To convert the data for parallel, the SerDes circuitry may utilize a receive clock output to clock down to a parallel data rate for communication of the data via the parallel link. The data may be communicated via a set of output lines using output data latches to the cores. based on the parallel rate, for example. In some instances, a buffer (two registers) may be used to clock down the data from the high serial link to the parallel link rate. At block 1556, the logic flow 1500 may include sending the data via the high speed parallel link to a core.
With respect to logic flow 1600, embodiments include receiving data via a high speed parallel link from a memory module of physical memory resource at block 1602. In some instances, the data may be data a core requested to read from the memory module.
At block 1604, the logic flow 1600 may include converting the data received via the high speed parallel link for communication via a high speed serial link. For example, the memory interface may serialize the data, via SerDes circuitry, to communicate the data via a single/differential link. In embodiments, the SerDes circuitry may convert the data for communication via a high speed serial link using any number of techniques, including but not limited to, a parallel clock SerDes technique, an Embedded clock SerDes technique, a 8b/10b SerDes technique, and a bit interleaved SerDes technique. To convert the data for serial communication, the SerDes circuitry may receive a parallel clock input, a set of data input lines (parallel link), and input data latches. The SerDes circuitry may utilize a phase-locked looped to multiply the incoming parallel clock up to a serial frequency for the high speed serial link. At block 1606, the logic flow 1600 may include sending the data via the high speed serial link to physical compute resources include the core requesting the data.
With respect to logic flow 1650, embodiments include receiving data via a high speed serial link from a physical compute resources at block 1652. In some instances, the data may be data a core requests to be read from the memory to be stored in the memory. The data may be communicated to the memory interface via a memory interface of a sled having the physical compute resources. In some instances, data may be received from a circuit switch coupled with the memory interface of the memory expander sled.
At block 1654, the logic flow 1650 may include converting the data received via high speed serial link for communication via a high speed parallel link. For example, the memory interface may deserialize the data, via SerDes circuitry, to communicate the data via a parallel link. In embodiments, the SerDes circuitry may convert the data for communication via a high speed parallel link using any number of techniques, including but not limited to, the parallel clock SerDes technique, the Embedded clock SerDes technique, the 8b/10b SerDes technique, and the bit interleaved SerDes technique. To convert the data for parallel, the SerDes circuitry may utilize a receive clock output to clock down to a parallel data rate for communication of the data via the parallel link. The data may be communicated via a set of output lines using output data latches to the memory based on the parallel rate, for example. In some instances, a buffer (two registers) may be used to clock down the data from the high serial link to the parallel link rate. At block 1656, the logic flow 1600 may include sending the data via the high speed parallel link to memory or memory module.
The logic flow 1700, at block 1702, includes receiving configuration information to configure usage of memory, such as one or more memory modules. In some instances, the configuration information may be received from a controller, such as baseboard management controller of a sled, a rack management controller of a rack, and a pod management controller of a pod. The configuration information may include information associating workloads and cores processing the workloads with particular memory modules. In some embodiments, the configuration information may include an indication of workload requirements and the circuit switch may determine which memory modules may support the workload. For example, the determination may be based on a storage size, a bandwidth, a transfer rate, error correction, and so forth for the memory module.
At block 1704, the logic flow 1700 may include determining a configuration of memory. Further and a block 1706, the logic flow may include setting the configuration for the memory. The configuration may include setting the circuit switch to direct read/write requests based on data, associated workloads, and received addresses. For example, the circuit switch may direct a read request to a particular memory and memory module based on an address associated with the read request.
At decision block 1708, the logic flow 1700 may include determine whether update configuration information is received. If so, the logic flow 1700 may include perform operations as previous discussed in blocks 1704 and 1706. If not, the logic flow 1700 may include waiting a period of time at block 1710 and then making the determination again at decision block 1708.
The detailed disclosure now turns to providing examples that pertain to further embodiments. Examples one through twenty-five (1-25) provided below are intended to be exemplary and non-limiting.
In a first example, a system, a device, an apparatus, and so forth may include a memory controller, and a memory interface coupled with the memory controller, the memory interface to receive data in parallel via a bus, and convert the received parallel data to send to a memory module of a memory expander sled in serial via a high speed serial link, and receive data in serial via the high speed serial link from the memory module of the memory expander sled, and convert the received serial data to send in parallel to the memory controller via the bus.
In a second example and in furtherance of the first example, a system, a device, an apparatus, and so forth may include the memory interface wherein the memory module is a dual in-line memory module or a integrated circuit.
In a third example and in furtherance of any of the previous examples, a system, a device, an apparatus, and so forth may include the memory interface comprising an optical transceiver and the high speed serial link comprising an optical high speed serial link coupled with the memory module.
In a fourth example and in furtherance of any of the previous examples, a system, a device, an apparatus, and so forth may include the memory interface comprising an electrical transceiver and the high speed serial link comprising an electrical high speed serial link coupled with the memory module.
In a fifth example and in furtherance of any of the previous examples, a system, a device, an apparatus, and so forth may include the high speed serial link providing a memory channel for communication of data between the memory controller and the memory module.
In a sixth example and in furtherance of any of the previous examples, a system, a device, an apparatus, and so forth may include a plurality of memory controllers including the memory controller, and a plurality of memory interfaces including the memory interface, each of the plurality of memory interfaces to couple to one of the plurality of memory controllers via buses, each of the plurality of memory interfaces to couple with at least one of a plurality of memory modules including the memory module via at least one of a plurality of high speed serial links including the high speed serial link.
In a seventh example and in furtherance of any of the previous examples, a system, a device, an apparatus, and so forth may include each of the high speed serial links to provide one of a plurality of memory channels between one of the memory controllers and one of the memory modules.
In an eighth example and in furtherance of any of the previous examples, a system, a device, an apparatus, and so forth may include a processing unit comprising the plurality of memory controllers and the plurality of memory interfaces.
In a ninth example and in furtherance of any of the previous examples, a system, a device, an apparatus, and so forth may include the memory interface to couple with one of a plurality memory modules including the memory module via a circuit switch coupled with the high speed serial link.
In a tenth example and in furtherance of any of the previous examples, a system, a device, an apparatus, and so forth may include the memory interface comprising serializer/deserializer (SERDES) circuitry to convert data from parallel to serial and serial to parallel.
In an eleventh example and in furtherance of any of the previous examples, a system, a device, an apparatus, and so forth may include the memory interface comprising a pig tail connector comprising circuitry to convert data from the parallel to serial and serial to parallel.
In a twelfth example and in furtherance of any of the previous examples, a system, a device, an apparatus, and so forth may include a memory module, and a memory interface coupled with the memory module. The memory interface to receive data in parallel via a bus, and convert the received parallel data to send to to a memory module of a memory expander sled in serial via a high speed serial link, and receive data in serial via the high speed serial link from the memory module of the memory expander sled, and convert the received serial data to send in parallel to the memory controller via the bus.
In a thirteenth example and in furtherance of any of the previous examples, a system, a device, an apparatus, and so forth may include the memory interface comprising an optical transceiver and the high speed serial link comprising an optical high speed serial link coupled with the memory controller.
In a fourteenth example and in furtherance of any of the previous examples, a system, a device, an apparatus, and so forth may include the memory interface comprising an electrical transceiver and the high speed serial link comprising an electrical high speed serial link coupled with the memory controller.
In a fifteenth example and in furtherance of any of the previous examples, a system, a device, an apparatus, and so forth may include the high speed serial link providing a memory channel for communication of data between the memory controller and the memory module.
In a sixteenth example and in furtherance of any of the previous examples, a system, a device, an apparatus, and so forth may include a plurality of memory modules including the memory module, and a plurality of memory interfaces including the memory interface, each of the plurality of memory interfaces to couple at least one of the plurality of memory modules with one of a plurality of memory controllers including the memory controller via one of a plurality of high speed serial links including the high speed serial link.
In a seventeenth example and in furtherance of any of the previous examples, a system, a device, an apparatus, and so forth may include each of the high speed serial links to provide one of a plurality of memory channels between one of the memory controllers and one of the memory modules.
In an eighteenth example and in furtherance of any of the previous examples, a system, a device, an apparatus, and so forth may include a memory expander sled comprising the plurality of memory modules and the plurality of memory interfaces.
In a nineteenth example and in furtherance of any of the previous examples, a system, a device, an apparatus, and so forth the memory interface to couple the memory module with the memory controller via a circuit switch coupled with the high speed serial link.
In a twentieth example and in furtherance of any of the previous examples, a method may include the memory interface comprising serializer/deserializer (SERDES) circuitry to convert data received in parallel to send in serial to a memory controller, and convert data received in serial from the memory controller to parallel to send to the memory module.
In a twenty-first example and in furtherance of any of the previous examples, a memory expander sled comprising the memory module in a low pin count high speed memory slot, wherein the memory module is byte accessible.
In a twenty-second example and in furtherance of any of the previous examples, a method may include receiving data in parallel via a bus, and convert the received parallel data to send to a memory module of a memory expander sled in serial via a high speed serial link, and receiving data in serial via the high speed serial link from the memory module of the memory expander sled, and convert the received serial data to send in parallel to the memory controller via the bus.
In a twenty-third example and in furtherance of any of the previous examples, a method may include receiving the data from a core in parallel via a high speed parallel link.
In a twenty-fourth example and in furtherance of any of the previous examples, a method may sending the data in serial to the memory module of the memory expander sled via the high speed serial link.
In a twenty-fifth example and in furtherance of any of the previous examples, a method may include wherein the high speed serial link comprising an optical high speed serial link coupling a memory interface with the memory module, the memory interface comprising an optical transceiver to send the data to the memory module; or the high speed serial link comprising an electrical high speed serial link coupling a memory interface with the memory module, the memory interface comprising an electrical transceiver to send the data to the memory module.
Some embodiments may be described using the expression “one embodiment” or “an embodiment” along with their derivatives. These terms mean that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment. The appearances of the phrase “in one embodiment” in various places in the specification are not necessarily all referring to the same embodiment. Further, some embodiments may be described using the expression “coupled” and “connected” along with their derivatives. These terms are not necessarily intended as synonyms for each other. For example, some embodiments may be described using the terms “connected” and “coupled” to indicate that two or more elements are in direct physical or electrical contact with each other. The term “coupled,” however, may also mean that two or more elements are not in direct contact with each other, but yet still co-operate or interact with each other.
It is emphasized that the Abstract of the Disclosure is provided to allow a reader to quickly ascertain the nature of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. Also, in the preceding Detailed Description, it can be seen that various features are grouped together in a single embodiment for the purpose of streamlining the disclosure. This method of disclosure is not to be interpreted as reflecting an intention that the claimed embodiments require more features than are expressly recited in each claim. Rather, as the following claims reflect, inventive subject matter lies in less than all features of a single disclosed embodiment. Thus the following claims are at this moment incorporated into the Detailed Description, with each claim standing on its own as a separate embodiment. In the appended claims, the terms “including” and “in which” are used as the plain-English equivalents of the respective terms “comprising” and “wherein,” respectively. Moreover, the terms “first,” “second,” “third,” and so forth, are used merely as labels and are not intended to impose numerical requirements on their objects.
What has been described above includes examples of the disclosed architecture. It is, of course, not possible to describe every conceivable combination of components and methodologies, but one of ordinary skill in the art may recognize that many further combinations and permutations are possible. Accordingly, the novel architecture is intended to embrace all such alterations, modifications, and variations that fall within the spirit and scope of the appended claims.
Claims
1. An apparatus, comprising:
- a memory controller; and
- a memory interface coupled with the memory controller and a memory module, the memory interface to:
- receive data in parallel via a bus, and convert the received parallel data to send to a memory module of a memory expander sled in serial via a high speed serial link; and
- receive data in serial via the high speed serial link from the memory module of the memory expander sled, and convert the received serial data to send in parallel to the memory controller via the bus.
2. The apparatus of claim 1, wherein the memory module is a dual in-line memory module or a integrated circuit.
3. The apparatus of claim 1, the memory interface comprising an optical transceiver and the high speed serial link comprising an optical high speed serial link coupled with the memory module.
4. The apparatus of claim 1, the memory interface comprising an electrical transceiver and the high speed serial link comprising an electrical high speed serial link coupled with the memory module.
5. The apparatus of claim 1, the high speed serial link providing a memory channel for communication of data between the memory controller and the memory module.
6. The apparatus of claim 1, comprising:
- a plurality of memory controllers including the memory controller; and
- a plurality of memory interfaces including the memory interface, each of the plurality of memory interfaces to couple to one of the plurality of memory controllers via buses, each of the plurality of memory interfaces to couple with at least one of a plurality of memory modules including the memory module via at least one of a plurality of high speed serial links including the high speed serial link.
7. The apparatus of claim 6, each of the high speed serial links to provide one of a plurality of memory channels between one of the memory controllers and one of the memory modules.
8. The apparatus of claim 6, comprising:
- a processing unit comprising the plurality of memory controllers and the plurality of memory interfaces.
9. The apparatus of claim 1, the memory interface to couple with one of a plurality memory modules including the memory module via a circuit switch coupled with the high speed serial link.
10. The apparatus of claim 1, the memory interface comprising serializer/deserializer (SERDES) circuitry to convert data from parallel to serial and serial to parallel.
11. The apparatus of claim 1, the memory interface comprising a pig tail connector comprising circuitry to convert data from the parallel to serial and serial to parallel.
12. An apparatus, comprising:
- a memory module; and
- a memory interface coupled with the memory module, the memory interface to:
- receive data in parallel via a bus, and convert the received parallel data to send to to a memory module of a memory expander sled in serial via a high speed serial link; and
- receive data in serial via the high speed serial link from the memory module of the memory expander sled, and convert the received serial data to send in parallel to a memory controller via the bus.
13. The apparatus of claim 12, the memory interface comprising an optical transceiver and the high speed serial link comprising an optical high speed serial link coupled with the memory controller.
14. The apparatus of claim 12, the memory interface comprising an electrical transceiver and the high speed serial link comprising an electrical high speed serial link coupled with the memory controller.
15. The apparatus of claim 12, the high speed serial link providing a memory channel for communication of data between the memory controller and the memory module.
16. The apparatus of claim 12, comprising:
- a plurality of memory modules including the memory module; and
- a plurality of memory interfaces including the memory interface, each of the plurality of memory interfaces to couple at least one of the plurality of memory modules with one of a plurality of memory controllers including the memory controller via one of a plurality of high speed serial links including the high speed serial link.
17. The apparatus of claim 16, each of the high speed serial links to provide one of a plurality of memory channels between one of the memory controllers and one of the memory modules.
18. The apparatus of claim 16, comprising:
- a memory expander sled comprising the plurality of memory modules and the plurality of memory interfaces.
19. The apparatus of claim 12, the memory interface to couple the memory module with the memory controller via a circuit switch coupled with the high speed serial link.
20. The apparatus of claim 12, the memory interface comprising serializer/deserializer (SERDES) circuitry to convert data received in parallel to send in serial to a memory controller, and convert data received in serial from the memory controller to parallel to send to the memory module.
21. The apparatus of claim 12, comprising:
- a memory expander sled comprising the memory module in a low pin count high speed memory slot, wherein the memory module is byte accessible.
22. A computer-implemented method, comprising:
- receiving data in parallel via a bus, and convert the received parallel data to send to a memory module of a memory expander sled in serial via a high speed serial link; and
- receiving data in serial via the high speed serial link from the memory module of the memory expander sled, and convert the received serial data to send in parallel to a memory controller via the bus.
23. The computer-implemented method of claim 22, comprising receiving the data from a core in parallel via a high speed parallel link.
24. The computer-implemented method of claim 22, comprising sending the data in serial to the memory module of the memory expander sled via the high speed serial link.
25. The computer-implemented method of claim 22, the high speed serial link comprising an optical high speed serial link coupling a memory interface with the memory module, the memory interface comprising an optical transceiver to send the data to the memory module; or the high speed serial link comprising an electrical high speed serial link coupling a memory interface with the memory module, the memory interface comprising an electrical transceiver to send the data to the memory module.
Type: Application
Filed: Mar 31, 2017
Publication Date: Jan 25, 2018
Inventors: MURUGASAMY K. NACHIMUTHU (BEAVERTON, OR), MOHAN J. KUMAR (ALOHA, OR)
Application Number: 15/476,891