Burned-in Component Assembly
A component support fixture having a plurality of oversized compartments of the same size mounted on a top surface of an anisotropic adhesive film such that each of a plurality of burned-in components of different heights and widths are accommodated within a compartment. Patterned traces are formed on the bottom surface of the anisotropic film. The leads of the burned-in components are in electrically communication with those traces through the anisotropic film.
Latest VNS Portfolio LLC Patents:
- Method and apparatus for authentication of a user to a server using relative movement
- METHOD AND APPARATUS FOR AUTHENTICATION OF A USER TO A SERVER USING RELATIVE MOVEMENT
- Method and apparatus for authentication of a user to a server using relative movement
- Method and apparatus for arranging multiple processors on a semiconductor chip
- Method and apparatus for dynamic partial reconfiguration on an array of processors
This application is a non provisional of and claims the benefit of provisional application No. 61/381,399 filed Sep. 9, 2010; and is a continuation-in-part of U.S. application Ser. No. 13/081,384, filed Apr. 6, 2011, which is a divisional application of application Ser. No. 12/163,870, filed Jun. 27, 2008, now U.S. Pat. No. 7,926,173, which is a continuation-in-part and claims the benefit of PCT Application No. PCT/US08/63123 filed on May 8, 2008 which claimed priority to: “ELECTRONIC ASSEMBLY WITHOUT SOLDER,” U.S. Application No. 60/928,467, filed on May 8, 2007; “ELECTRONIC ASSEMBLY WITHOUT SOLDER AND METHODS FOR THEIR MANUFACTURE,” U.S. Application No. 60/932,200, filed on May 29, 2007; “SOLDERLESS FLEXIBLE ELECTRONIC ASSEMBLIES AND METHODS FOR THEIR MANUFACTURE,” U.S. Application No. 60/958,385, filed on Jul. 5, 2007; “ELECTRONIC ASSEMBLIES WITHOUT SOLDER AND METHODS FOR THEIR MANUFACTURE,” U.S. Application No. 60/959,148, filed on Jul. 10, 2007; “MASS ASSEMBLY OF ENCAPSULATED ELECTRONIC COMPONENTS TO A PRINTED CIRCUIT BOARD BY MEANS OF AN ADHESIVE LAYER HAVING EMBEDDED CONDUCTIVE JOINING MATERIALS,” U.S. Application No. 60/962,626, filed on Jul. 31, 2007; “SYSTEM FOR THE MANUFACTURE OF ELECTRONIC ASSEMBLIES WITHOUT SOLDER,” U.S. Application No. 60/963,822, filed on Aug. 6, 2007; “ELECTRONIC ASSEMBLIES WITHOUT SOLDER AND METHODS FOR THEIR MANUFACTURE,” U.S. Application No. 60/966,643, filed on Aug. 28, 2007; “MONOLITHIC MOLDED SOLDERLESS FLEXIBLE ELECTRONIC ASSEMBLIES AND METHODS FOR THEIR MANUFACTURE,” U.S. Application No. 61/038,564, filed on Mar. 21, 2008; and “THE OCCAM PROCESS SOLDERLESS ASSEMBLY AND INTERCONNECTION OF ELECTRONIC PACKAGES,” U.S. Application No. 61/039,059, filed on Mar. 24, 2008; all of which are hereby incorporated by reference.
This application further is a continuation-in-part of co-pending U.S. application Ser. No. 12/170,426 filed Jul. 9, 2008; which application claims the benefit of U.S. provisional application No. 60/959,148 filed Jul. 10, 2007 and U.S. provisional application No. 60/962,627, filed Jul. 31, 2007; all of which are hereby incorporated by reference in their entirety.FIELD OF THE INVENTION
The present invention relates to the field of solderless assembly of packaged components, sometimes known as an Occam process.BACKGROUND OF THE INVENTION
The present invention is an improvement on an Occam process generally described in U.S. Pat. No. 7,926,173, a grandparent of the present application, which is expressly incorporated by reference. That patent describes the process of placing components on a flexible substrate, adhering the components to the substrate with an insulating material, placing a component support fixture over the components to support them while processing the flexible substrate to provide electrical connections to the components. The components support may be temporary or it may be removed.
While the component support fixture described in the aforementioned patent contains “compartments” of various sizes for different size components, there is no consideration of how to accommodate particular components that have ranges of sizes. If a component is too large in the vertical direction, for example, the component support fixture will not entirely fit over the component such that the support itself will not contact the flexible substrate it is intended to support during subsequent processing of the flexible substrate.SUMMARY OF THE INVENTION
The invention comprises providing component-receiving compartments in the component support fixture of slightly larger dimensions than the largest dimension of the particular type of component. Invention further provides adhesively bonding the component support fixture to the components using an applied adhesive. The invention further provides a vent hole or aperture into the compartment whereby excess adhesive may be extruded through the vent hole or aperture in the case of oversized components. The invention further provides that components be placed on an adhesive substrate, rather than being adhered to an otherwise non-adhesive substrate via a post-placement adhesive (insulating material). Suitable tooling holes may be employed in the adhesive substrate to better locate the placement of the components.
Another feature of the present invention is that the component support fixture comprises a machined or molded lid for both housing in compartments the components and for adhesively supporting the adhesive layer on a machined surface for subsequent processing of the adhesive layer in an Occam process.
Additionally, the substrate adhesive itself may be anisotropically conductive, such that a foil, adhered to the adhesive, may be patterned into conductive traces as provided by co-pending parent U.S. patent application Ser. No. 12/170,426 filed Jul. 9, 2008, which is hereby incorporated by reference.
Each of the components, which may have different vertical heights (and lengths and widths), are package integrated circuits having formed thereon electrical contacts 22 and 32 that will physically contact the adhesive substrate 10. While illustrated in the figure as contacts spaced about the bottom surfaces of the components 20 and 30, the contacts could be of the gullwing, J-leaded or other lead shape variety as illustrated in the aforementioned U.S. Pat. No. 7,926,173. See e.g. FIGS. 8 and 9 of US '173, and the gullwing components 802.
The adhesive may be provided with tooling holes 14 that may be used to provide apertures for tools to better align the adhesive substrate and the tooling, not shown, that physically places the components 20 and 30 on the adhesive substrate 10.
Alternatively to applying the metal foil layer 12 in step two (
Again referring to
As illustrated in
For this purpose, it is understood that the component support fixture 70 can be made of any material for the purpose sense if invites only temporary manufacturing support for the components 30 and 20. If however component support fixture 70 is intended to be permanent, it could be made of a material that is insulating or conductive depending on the purpose for the support, and it further could be made out of a material having a high thermal conductivity, such as aluminum. Examples of materials in the latter category include epoxy glass laminates or molded thermoplastic materials such as PEEK.
The description of the various embodiments above are not to be taken as a limitation on the scope of the invention. Variations of materials and structures and sequence of steps to achieve the overall objective of providing a component support fixture with vent holes or apertures either as a partial step in an Occam process, or as a completed structure in an Occam process, or other process, is within the scope of the present invention.
1. An apparatus comprising;
- an anisotropic adhesive film having a top surface and a bottom surface;
- at least one patterned trace formed on said bottom surface;
- a plurality of burned-in components of different heights and widths within a size range, each of said plurality of burned-in components further having a bottom side and at least one lead formed on said bottom side; wherein each of said plurality of burned-in components is mounted on the top surface of said adhesive film; and further wherein said at least one lead each of said plurality of burned-in components is in contact with said top surface; and
- a component support fixture having a plurality of oversized compartments of the same size mounted on said top side of said adhesive film such that each of said plurality of burned-in components is accommodated within a compartment of said plurality of oversized compartments.
2. The apparatus of claim 1, wherein said burned-in components are covered on all sides but said bottom side with an insulating material.
3. The apparatus of claim 2, wherein each compartment has a vent hole.