LOCAL WIRING IN BETWEEN STACKED DEVICES
Semiconductor devices and methods are provided to fabricate field effect transistor (FET) devices having local wiring between the stacked devices. For example, a semiconductor device includes a first FET device on a semiconductor substrate, the FET device comprising a first source/drain layer, and a first gate structure comprising a gate dielectric layer and a metal gate layer. The semiconductor device further includes a second FET device comprising a second source/drain layer, and a second gate structure comprising a gate dielectric layer and a metal gate layer, wherein the first and second FET devices are in a stacked configuration. The semiconductor device further includes one or more conductive vias in communication with either the first gate structure of the first FET device or the second gate structure of the second FET device.
This disclosure relates generally to semiconductor fabrication techniques and, in particular, to structures and methods for fabricating stacked field-effect transistor (FET) devices.
In a typical complementary metal-oxide-semiconductor (CMOS) layout, ninety percent of the time a first transistor is connected to at least a second transistor. For example, a drain of an n-type transistor is connected to the drain of a p-type transistor to form an inverter. Other arrangements, such as connections between the drain of a first transistor connected to the source of a second transistor, a drain of a first transistor connected to the drain of a second transistor, or a source of a first transistor connected to the source of a second transistor are also considered, where the first and second transistors may be any combination of n-type or p-type transistors. Hence, stacking transistors one on top of another is attractive in order to reduce the area required to accommodate the multiple transistors. However, with normal planar transistors, stacking is difficult and may involve bonding.
SUMMARYEmbodiments of the invention include structures and methods for forming stacked vertical FET devices having local wiring between the stacked devices.
For example, one exemplary embodiment includes a method for fabricating a semiconductor device, comprising:
forming a first field effect transistor (FET) device on a semiconductor substrate, the FET device comprising a first source/drain layer, and a first gate structure comprising a gate dielectric layer and a metal gate layer;
forming a second FET device comprising a second source/drain layer, and a second gate structure comprising a gate dielectric layer and a metal gate layer; wherein the first and second FET devices are in a stacked configuration; and
forming a conductive via communicative with the first gate structure of the first FET device and the second gate structure of the second FET device.
Another exemplary embodiment includes a semiconductor device which comprises a first FET device on a semiconductor substrate, the FET device comprising a first source/drain layer, and a first gate structure comprising a gate dielectric layer and a metal gate layer. The semiconductor device further comprises a second FET device comprising a second source/drain layer, and a second gate structure comprising a gate dielectric layer and a metal gate layer; wherein the first and second FET devices are in a stacked configuration. The semiconductor device further comprises one or more conductive vias in communication with either the first gate structure of the first FET device or the second gate structure of the second FET device.
These and other features, objects and advantages of the present invention will become apparent from the following detailed description of illustrative embodiments thereof, which is to be read in connection with the accompanying drawings.
It is to be understood that the various layers, structures, and regions shown in the accompanying drawings are schematic illustrations that are not drawn to scale. In addition, for ease of explanation, one or more layers, structures, and regions of a type commonly used to form semiconductor devices or structures may not be explicitly shown in a given drawing. This does not imply that any layers, structures, and regions not explicitly shown are omitted from the actual semiconductor structures.
Furthermore, it is to be understood that the embodiments discussed herein are not limited to the particular materials, features, and processing steps shown and described herein. In particular, with respect to semiconductor processing steps, it is to be emphasized that the descriptions provided herein are not intended to encompass all of the processing steps that may be required to form a functional semiconductor integrated circuit device. Rather, certain processing steps that are commonly used in forming semiconductor devices, such as, for example, wet cleaning and annealing steps, are purposefully not described herein for economy of description.
Moreover, the same or similar reference numbers are used throughout the drawings to denote the same or similar features, elements, or structures, and thus, a detailed explanation of the same or similar features, elements, or structures will not be repeated for each of the drawings. It is to be understood that the terms “about” or “substantially” as used herein with regard to thicknesses, widths, percentages, ranges, etc., are meant to denote being close or approximate to, but not exactly. For example, the term “about” or “substantially” as used herein implies that a small margin of error may be present, such as 1% or less than the stated amount.
An illustrative embodiment for forming a semiconductor device will be discussed below with reference to
Hard mask material 106 can be, for example, an oxide or nitride material. Hard mask 106 is deposited using a suitable deposition process such as, for example, chemical vapor deposition (CVD) and remains on the top surface of vertical nanowires 104 after patterning and etching processes (not shown) are completed.
The vertical nanowires 104 have sidewalls that are substantially vertical. Although two vertical nanowires 104 are shown in
A next step in forming vertically stacked transistors for semiconductor device 100 is illustrated in
A next step in forming vertically stacked transistors for semiconductor device 100 is illustrated in
A next step in forming vertically stacked transistors is illustrated in
After the semiconductor material is grown, it will be doped with dopant atoms using, for example, in-situ doping or ion implantation or in-situ doping during epitaxy. In this illustrative embodiment, the semiconductor material is doped with a p-type dopant such as, for example, boron, aluminum, gallium, indium, or alloys thereof, to form a PFET source region. In other embodiments as discussed below, the semiconductor material may be doped with a n-type dopant such as, for example, phosphorus, antimony, arsenic, or alloys thereof. After the doping process, the semiconductor material may have dopant a concentration ranging from approximately 1×1019 atoms/cm3 to approximately 5×1021 atoms/cm3.
As one skilled in the art will appreciate,
A next step in forming vertically stacked transistors for semiconductor device 100 is illustrated in
A next step in forming vertically stacked transistors for semiconductor device 100 is illustrated in
A next step in forming vertically stacked transistors for semiconductor device 100 is illustrated in
The gate metal 118 can be deposited directly on a top surface of the high-k dielectric layer by, for example, CVD, ALD or physical vapor deposition (PVD). Suitable gate metals include, for example, a metal system selected from one or more of TiN, TiC, TaN, TaC, TaSiN, HiN, W, Al and Ru, and may be selected at least in part based on the desired work function (WF) of the device (NFET or PFET), as is known. The metal gate may be recessed within the PFET gate and a gate cap may be deposited upon the recessed metal gate within the PFET gate (not shown).
A next step in forming vertically stacked transistors for semiconductor device 100 is illustrated in
A next step in forming vertically stacked transistors for semiconductor device 100 is illustrated in
A next step in forming vertically stacked transistors for semiconductor device 100 is illustrated in
It is to be understood that the methods discussed herein for fabricating semiconductor structures can be incorporated within semiconductor processing flows for fabricating other types of semiconductor devices and integrated circuits with various analog and digital circuitry or mixed-signal circuitry. In particular, integrated circuit dies can be fabricated with various devices such as transistors, diodes, capacitors, inductors, etc. An integrated circuit in accordance with embodiments can be employed in applications, hardware, and/or electronic systems. Suitable hardware and systems for implementing embodiments of the invention may include, but are not limited to, personal computers, communication networks, electronic commerce systems, portable communications devices (e.g., cell phones), solid-state media storage devices, functional circuitry, etc. Systems and hardware incorporating such integrated circuits are considered part of the embodiments described herein.
Furthermore, various layers, regions, and/or structures described above may be implemented in integrated circuits (chips). The resulting integrated circuit chips can be distributed by the fabricator in raw wafer form (that is, as a single wafer that has multiple unpackaged chips), as a bare die, or in a packaged form. In the latter case, the chip is mounted in a single chip package (such as a plastic carrier, with leads that are affixed to a motherboard or other higher level carrier) or in a multichip package (such as a ceramic carrier that has either or both surface interconnections or buried interconnections). In any case, the chip is then integrated with other chips, discrete circuit elements, and/or other signal processing devices as part of either (a) an intermediate product, such as a motherboard, or (b) an end product. The end product can be any product that includes integrated circuit chips, ranging from toys and other low-end applications to advanced computer products having a display, a keyboard or other input device, and a central processor.
Although illustrative embodiments have been described herein with reference to the accompanying drawings, it is to be understood that the invention is not limited to those precise embodiments, and that various other changes and modifications may be made by one skilled in art without departing from the scope or spirit of the invention.
Claims
1. A semiconductor device, comprising:
- a first field-effect transistor (FET) device on a semiconductor substrate, the FET device comprising a first source/drain layer, and a first gate structure comprising a gate dielectric layer and a metal gate layer;
- a second FET device comprising a second source/drain layer, and a second gate structure comprising a gate dielectric layer and a metal gate layer; wherein the first and second FET devices are in a stacked configuration and further wherein the second source/drain layer is disposed on the first source/drain layer; and
- one or more conductive vias in communication with either the first gate structure of the first FET device or the second gate structure of the second FET device.
2. The semiconductor device of claim 1, wherein the first FET device is a PFET device and the second FET device is a NFET device.
3. The semiconductor device of claim 1, wherein the first FET device is a NFET device and the second FET device is a PFET device.
4. The semiconductor device of claim 1, wherein the one or more conductive vias contain a conductive material comprising one of cobalt, copper, nickel and tungsten.
5. The semiconductor device of claim 1, wherein the one or more conductive vias comprise a first conductive via communicative with the first gate structure of the first FET device.
6. The semiconductor device of claim 5, wherein the one or more conductive vias comprise a second conductive via communicative with the second source region of the second FET device.
7. The semiconductor device of claim 6, wherein the one or more conductive vias comprise a third conductive via communicative with the second gate structure of the second FET device.
8. The semiconductor device of claim 1, wherein the one or more conductive vias comprise:
- a first conductive via communicative with the first gate structure of the first FET device;
- a second conductive via communicative with the second source region of the second FET device; and
- a third conductive via communicative with the second gate structure of the second FET device.
9. The semiconductor device of claim 1, wherein the first source/drain layer and the second source/drain layer are disposed in an interconnect metal layer.
10. The semiconductor device of claim 9, wherein the interconnect metal layer is disposed on an insulator layer.
11. A stacked vertical FET comprising:
- one or more semiconductor devices, wherein one of the semiconductor devices comprises:
- a first FET device on a semiconductor substrate, the FET device comprising a first source/drain layer, and a first gate structure comprising a gate dielectric layer and a metal gate layer;
- a second FET device comprising a second source/drain layer, and a second gate structure comprising a gate dielectric layer and a metal gate layer; wherein the first and second FET devices are in a stacked configuration and further wherein the second source/drain layer is disposed on the first source/drain layer; and
- one or more conductive vias in communication with either the first gate structure of the first FET device or the second gate structure of the second FET device.
12. The stacked vertical FET of claim 11, wherein the first FET device is a PFET device and the second FET device is a NFET device.
13. The stacked vertical FET of claim 11, wherein the first FET device is a NFET device and the second FET device is a PFET device.
14. The stacked vertical FET of claim 11, wherein the one or more conductive vias contain a conductive material comprising one of cobalt, copper, nickel and tungsten.
15. The stacked vertical FET of claim 11, wherein the one or more conductive vias comprise a first conductive via communicative with the first gate structure of the first FET device.
16. The stacked vertical FET of claim 15, wherein the one or more conductive vias comprise a second conductive via communicative with the second source region of the second FET device.
17. The stacked vertical FET of claim 16, wherein the one or more conductive vias comprise a third conductive via communicative with the second gate structure of the second FET device.
18. The stacked vertical FET of claim 11, wherein the one or more conductive vias comprise:
- a first conductive via communicative with the first gate structure of the first FET device;
- a second conductive via communicative with the second source region of the second FET device; and
- a third conductive via communicative with the second gate structure of the second FET device.
19. The stacked vertical FET of claim 11, wherein the first source/drain layer and the second source/drain layer are disposed in an interconnect metal layer.
20. The stacked vertical FET of claim 19, wherein the interconnect metal layer is disposed on an insulator layer.
Type: Application
Filed: Oct 29, 2019
Publication Date: Mar 5, 2020
Inventor: Effendi Leobandung (Stormville, NY)
Application Number: 16/667,132