TOUCH SUBSTRATE AND TOUCH DISPLAY DEVICE

Abstract

The present disclosure provides a touch substrate and a touch display device. The touch substrate includes: a touch structure (10), at least a part of which is located in the main touch region (02); and a connecting member (50) and a wiring, at least partially located in the wiring region (01), wherein the connecting member (50) is configured to electrically connect the touch structure (10) and the wiring (01); the connecting member (50) has a hollow portion. Such that, touch sensitivity can be improved.

Description

TECHNICAL FIELD

Embodiments of the present disclosure relate to a touch substrate and a touch display device.

BACKGROUND

In recent years, with improvement of controllability of electronic equipment and development of electronic technology, touch screen technology has been widely used in electronic devices such as mobile phones, tablet computers, notebook computers and the like. There have been a variety of technical directions appearing under the development of touch technology, such as resistance, capacitance, and electromagnetism, and the capacitive screen with low cost and excellent user experience has become a mainstream product.

SUMMARY

Embodiments of the present disclosure provide a touch substrate and a touch display device, which can improve touch sensitivity.

An embodiment of the present disclosure provides a touch substrate, which includes: a touch structure, at least a part of which is located in a main touch region; a connecting member and a wiring which are at least partially located in a wiring region, wherein the connecting member is configured to electrically connect the touch structure and the wiring, and the connecting member has a hollow portion.

In one example, the touch substrate further includes an organic layer at least partially located in the wiring region and overlapping the connecting member and the wiring.

In one example, the metal connecting bar is in a mesh structure.

In one example, a length of the metal connecting bar is 1˜5 mm.

In one example, a width of the metal connecting bar is 0.2˜0.3 mm.

In one example, the touch structure includes a first touch electrode and a second touch electrode which are insulated from and intersect with each other, the first touch electrode includes a plurality of first touch sub-electrodes, and the plurality of first touch sub-electrodes are electrically connected by a bridge; the bridge are isolated from the second touch electrode by an insulating layer; the organic layer and the insulating layer are located in a same layer.

In one example, the organic layer is a first coating protection layer.

In one example, the bridge, the metal connecting bar and the wiring is in a same layer.

In one example, the bridge is in a bar structure; a length of the bridge is 100˜300 μm.

In one example, the width of a bridge is 5˜10 μm.

In one example, the touch substrate further includes a light shielding layer disposed in the wiring region.

In one example, the light shielding layer is a white light shielding layer or a black light shielding layer.

In one example, the touch substrate further includes a second coating protection layer overlapping the touch structure.

In one example, an explosion-proof film is disposed on the protection layer.

Another embodiment of the present disclosure provides a touch display device, which includes a display panel and a touch substrate disposed on a light emitting side of the display panel, wherein the touch substrate is a touch substrate as described above.

In one example, the display panel is a liquid crystal display panel or an organic light emitting diode display panel.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to describe technical solutions in embodiments of the present disclosure more clearly, the accompanying drawings in the embodiments will be introduced briefly. Obviously, the accompanying drawings to be described below merely relate to some embodiments of the present disclosure, but do not constitute a limitation to the disclosure.

In order to describe technical solutions in embodiments of the present disclosure or in the prior art more clearly, the accompanying drawings to be used in the description of embodiments or the prior art will be introduced briefly. Obviously, the accompanying drawings to be described below are merely some embodiments of the present disclosure, and a person of ordinary skill in the art can obtain other drawings according to those drawings without paying any creative effort.

FIG. 1 is a schematic structural view of a touch substrate;

FIG. 2 is a schematic plan structural view of a touch substrate provided by an embodiment of the present disclosure;

FIG. 3 is a cross-sectional view along the direction of A-A′ in FIG. 2;

FIG. 4(a) is a schematic structural view of a metal connecting bar provided by an embodiment of the present disclosure;

FIG. 4(b) is a schematic structural view of a metal connecting bar provided by an embodiment of the present disclosure;

FIG. 4(c) is a schematic structural view of a metal connecting bar provided by an embodiment of the present disclosure;

FIG. 4(d) is a schematic structural view of a metal connecting bar provided by an embodiment of the present disclosure;

FIG. 5(a) is a schematic plan structural view of a touch substrate provided by an embodiment of the present disclosure;

FIG. 5(b) is a schematic cross-sectional view along the direction of B-B′ in FIG. 5(a)

FIG. 6(a) is a schematic plan view of a touch substrate provided by an embodiment of the present disclosure;

FIG. 6(b) is a schematic cross-sectional view along the direction of C-C′ in FIG. 6(a)

FIG. 7 is another schematic cross-sectional view along the direction of C-C′ in FIG. 6(a).

DETAILED DESCRIPTION

In order to make purposes, technical solutions and advantages of embodiments of the present disclosure more clear, the technical solutions in the embodiments of the present disclosure will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present disclosure. Obviously, the embodiments to be described are merely a part of but not all of embodiments of the present disclosure. All other embodiments made by a person of ordinary skill in the art without paying any creative effort shall be included in the protection scope of the present disclosure on the basis of the described embodiments of the present disclosure.

One Glass Solution (abbreviated as OGS) technology means that a touch structure is formed on a cover glass, and the cover glass serves dual roles of protection function and touch function at the same time. A light shielding layer that serves roles of shielding wirings and decorative effect is further formed in a wiring region of the cover glass.

In a touch substrate, as shown in FIG. 1, a touch structure 10 is connected to an IC (Integrated Circuit) via a wiring 20 in a wiring region 01. However, since the area of the wiring 20 is greatly different from that of the touch structure 10, a large metal impedance is easily generated, thereby affecting touch sensitivity.

An embodiment of the present disclosure provides a touch substrate 100. As shown in FIG. 2, the touch substrate 100 includes a main touch region 02 and a wiring region 01.

The touch substrate 100 includes a base substrate S, and a touch structure 10 disposed on the base substrate 10, and the touch structure 10 is in the main touch region 02. The touch structure 10 includes a first touch electrode 11 and a second touch electrode 12 which are insulated from and intersect with each other.

The touch substrate 100 includes an organic layer 40 disposed in the wiring region 01.

The touch substrate 100 further includes a metal connecting bar 50 and a wiring 20 disposed on the organic layer 40, and the metal connecting bar 50 is used for electrically connecting the first touch electrode 11 as well as the second touch electrode 12 to the wiring 20 respectively. As shown in FIGS. 3, 4(a) and 4(b), the metal connecting bar 50 has a hollow portion. Here, the hollow portion means, for example, an opening in a thickness direction (for example, in a direction perpendicular to the base substrate S) of the metal connecting bar 50.

For example, a contact area between the metal connecting bar 50 and the touch structure (for example, the first touch electrode 11 or the second touch electrode 12) is larger than that between the metal connecting bar 50 and the wiring 20. Here, the contact area between the metal connecting bar 50 and the touch structure means, for example, a direct contact area between the metal connecting bar 50 and the touch structure. And the contact area between the metal connecting bar 50 and the wiring 20 means, for example, a direct contact area between the metal connecting bar 50 and the wiring 20.

It should be noted that, firstly, the touch structure 10 is not limited, as long as the touch function can be realized, and the touch structure 10 in FIG. 2 is merely illustrative.

Secondly, the main touch region 02 is a region for picture display when the touch substrate 100 is applied to a display device. The wiring region 01 is located on the periphery of the main touch region 02.

Thirdly, the specific shape of the metal connecting bar 50 is not limited, as long as the metal connecting bar 50 has a hollow portion. The metal connecting bar 50 in FIG. 2, 3, 4(a) or 4(b) is merely illustrative.

Fourthly, for any metal connecting bar 50, one end of it is electrically connected to the first touch electrode 11 or the second touch electrode 12, and the other end is electrically connected to the wiring 20, such that the first touch electrode 11 or the second touch electrode 12 is electrically connected to the wiring 20.

The wire 20 and the metal connecting bar 50 may be disposed in a same layer or in different layers, which is not limited herein.

Fifthly, the relative position of the organic layer 40 and the touch structure 10 is not limited, and FIG. 2 is merely illustrative.

The embodiment of the present disclosure provides a touch substrate 100. By disposing the metal connecting bar 50 in the wiring region 01 of the touch substrate 100, the first touch electrode 11 as well as the second touch electrode 12 are electrically connected with the wiring 20 though the metal connecting bar 50, respectively. The contact area between the wiring 20 and the first touch electrode 11, and the contact area between the wiring 20 and the second touch electrode 12 are accordingly increased and thus metal impedance is reduced, so touch sensitivity is improved.

When the metal connecting bar 50 is disposed on the organic layer 40, the adhesion of the metal connecting bar 50 to the organic layer 40 is small due to differences in material properties between the metal connecting bar 50 and the organic layer 40. And when the metal connecting bar 50 is formed on the layer 40, a defect is easily formed between the organic layer 40 and the metal connecting bar 50, and the adhesion at the defect position is worse. In this way, when the touch substrate 100 needs rework, such as analysis, disassembly, repair or the like, the metal connecting bar 50 is to be subjected to a force in a tearing direction which makes the metal connecting bar 50 separated from the organic layer 40. As a result, the metal connecting bar 50 is separated from the first touch electrode 11 or the second touch electrode 12, and thus signals on the touch structure 10 are unable to be transmitted to the IC, thereby affecting the touch function of a product and reducing product yield. Based on this, by making the metal connecting bar 50 have a hollow portion, the embodiment of the present disclosure may reduce the contact area between the metal connecting bar 50 and the organic layer 40, and thus reduce the probability of forming defects, resulting in reducing the probability of a separation between the metal connecting bar 50 and the organic layer 40 and improving the product yield.

For example, the metal connecting bar 50 has a mesh structure as shown in FIG. 4(c) or 4(d).

Specific pattern of the mesh is not limited. For example, the pattern of the mesh may be in rhombus as shown in FIG. 4(c), or the pattern of the mesh may be in rectangle as shown in FIG. 4(d). Of course, the pattern of the mesh may be in another shape.

In the embodiment of the present disclosure, the metal connecting bar 50 is arranged in a mesh structure. That is, the metal connecting bar 50 includes two intersecting sets of metal wires, and each set of metal wires includes, for example, a plurality of metal wires parallel to each other. The two sets are located in different directions. On one hand, when subjected to an external force in a single direction, if one set of metal wires is separated from the organic layer 40, the other set of metal wires can remain adhering to the organic layer 40 to ensure that signals on the touch structure 10 can be transmitted to the IC, thereby improving the product yield. On the other hand, the contact portion between the metal connecting bar 50 and the organic layer 40 is a plurality of metal wires, and the contact area between the metal wires and the organic layer 40 is small, so as to reduce the probability of forming defects. As a result, the probability of the separation between the metal connecting bar 50 and the organic layer 40 is reduced, and the product yield is improved.

In addition, the metal connecting bar 50 in a mesh structure can be directly formed under one patterning process without affecting formation of other structures and without increasing process difficulty.

In order to simplify the structure of a product, in an embodiment of the present disclosure, for example, the length of the metal connecting bar 50 is 1˜5 mm; and/or the width of the metal connecting bar 50 is 0.2˜0.3 mm.

Based on the above, for example, as shown in FIGS. 5(a) and 5(b), the first touch electrode 11 is electrically connected through a bridge 13 in a region which the first touch electrode and the second touch electrode cross. The bridge 13 is isolated from the second touch electrode 12 by an insulating block 14. The organic layer 40 is a first coating protection layer 41. The insulating block 14 is provided in a same layer with the first coating protection layer 41.

The coating protection layer is OC (Over Coating).

Based on this, for example, both the material of the first touch electrode 11 and the second touch electrode 12 are transparent conductive material, such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide) and the like. The shape of the first touch electrode 11 or the second touch electrode 12 may be rhombus, bar, cross, snowflake or the like.

In the embodiment of the present disclosure, the insulating block 14 is provided in the same layer with the first coating protection layer 41. The material of the insulating block 14 and the first coating protection layer 41 is, for example, the same.

That is, by forming the insulating block 14 and the first coating protection layer 41 under a same patterning process, the number of patterning processes can be reduced and an aperture ratio can be increased.

Further, in order to reduce the number of patterning processes and make the touch substrate 100 lighter and thinner, in an embodiment of the present disclosure, for example, the bridge 13, the metal connecting bar 50 and the wiring 20 are disposed on a same layer. The material of the bridge 13, the metal connecting bar 50 and the wiring 20 are the same.

That is, the bridge 13, the metal connecting bar 50 and the wiring 20 are made of the same material, and formed under one patterning process.

In order to improve the aperture ratio of the touch substrate 100, in an embodiment of the present disclosure, for example, the bridge 13 is in a bar structure, and its length is 100˜300 μm, and/or its width is 5˜10 μm.

A light shielding layer (for example, a white light shielding layer or a black light shielding layer) is used to shield the frame of a metal wiring electronic device. Therefore, in the embodiment of the present disclosure, for example, as shown in FIG. 6(a), the touch substrate 100 further includes a light shielding layer 30 disposed in the wiring region 01. The light shielding layer 30 is a white or black light shielding layer.

Since the light shielding layer 30 contains a conductive element and has certain conductivity, the problem of ESD (Electro-Static Discharge) may be caused between the metal connecting bar 50 and the light shielding layer 30 in the wiring region 01 of the touch substrate 100. As a result, the performance of the touch substrate 100 decreases, or even be damaged, thereby reducing the product yield. Therefore, as shown in FIG. 6(b), the light shielding layer 30 is located, for example, at the bottom of the touch substrate 100, so that the first coating protection layer 41 is located between the metal connecting bar 50 and the light shielding layer 30 to prevent ESD from being generated between the metal connecting bar 05 and the light shielding layer 30.

For example, as shown in FIG. 6(b), a second coating protection layer 60 is disposed on the touch structure 10.

By disposing the second coating protection layer 60 on the touch structure 10, the embodiment of the present disclosure may serve the roles of blocking water and oxygen; protecting the bridge 13, the metal connecting bar 50 and the wiring 20.

For example, as shown in FIG. 7, an explosion-proof film 70 is disposed on the second coating protection layer 60.

The embodiment of the present disclosure provides the explosion-proof film 70 on the second coating protection layer 60 and provides the explosion-proof film 70 in an entire layer, so as to make the touch substrate 100 remain adhering to the explosion-proof film 70 and be prevented from scattering everywhere after broken. When the explosion-proof film 70 needs to be torn off and re-formed due to dust between the explosion-proof film 70 and the second coating protection layer 60 or other reasons, tearing off the explosion-proof film 70 easily causes the separation between the metal connecting bar 50 and the organic layer 40 as well. The present disclosure solves the problem that the metal connecting bar 50 is separated from the organic layer 40 due to tearing off the explosion-proof film 70, by providing the metal connecting bar 50 with a hollow portion.

An embodiment of the present disclosure further provides a touch display device, which includes a display panel and a touch substrate 100 as above described disposed on the light emitting side of the display panel.

The touch display device may be a product or a component having any display or touch function as a display, a television, a mobile phone, a tablet computer, or the like.

The display panel and the touch substrate 100 can be connected by OCR (Optical Clear Resin).

The embodiment of the present disclosure provides a touch display device. By disposing a metal connecting bar 50 in a wiring region 01 of the touch substrate 100 located on the light emitting side of the display panel, so as to make a first touch electrode 11 as well as a second touch electrode 12 be electrically connected with the wiring 20 through the metal connecting bar 50 respectively. A contact area between the wiring 20 and the first touch electrode 11, and a contact area between the wiring 20 and the second touch electrode 12 are accordingly increased, and thus metal impedance is reduced, so touch sensitivity is improved.

When the metal connecting bar 50 is disposed on an organic layer 40, the adhesion of the metal connecting bar 50 to the organic layer 40 is small due to differences in material properties between the metal connecting bar 50 and the organic layer 40. And when the metal connecting bar 50 is formed on the organic layer 40, a defect is easily formed between the organic layer 40 and the metal connecting bar 50, and the adhesion at the defect position is worse. In this way, when the touch substrate 100 needs rework, such as analysis, disassembly, repair or the like, the metal connecting bar 50 is to be subjected to a force in a tearing direction which make the metal connecting bar 50 separated from the organic layer 40. As a result, the metal connecting bar 50 is separated from the first touch electrode 11 or the second touch electrode 12, and thus signals on the touch structure 10 are unable to be transmitted to an IC, thereby affecting the touch function of a product and reducing product yield. Based on this, by making the metal connecting bar 50 have a hollow portion, the embodiment of the present disclosure may reduce a contact area between the metal connecting bar 50 and the organic layer 40, and thus reduce the probability of forming defects, resulting in reducing the probability of a separation between the metal connecting bar 50 and the organic layer 40 and improving the product yield.

For example, the display panel is a liquid crystal display panel or an organic light emitting diode display panel.

When the display panel is a liquid crystal display panel, the display panel includes an array substrate, an alignment substrate and a liquid crystal layer disposed therebetween. The array substrate may include a TFT (Thin Film Transistor), and a pixel electrode electrically connected to the drain electrode of the TFT, and may further include a common electrode. The alignment substrate may include a black matrix and a color filter. The color filter may be disposed on the alignment substrate or on the array substrate. The common electrode may be disposed on the array substrate or on the alignment substrate.

When the display panel is an organic light emitting diode (abbreviated as OLED) display panel, it includes an array substrate and a package substrate. The array substrate may include a TFT, an anode and a cathode electrically connected to the drain electrode of the TFT, and an organic-material functional layer disposed between the anode and the cathode.

The foregoing descriptions merely show specific implementations of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person of skill in the art can readily conceive of variations and replacements within the technical scope disclosed by the embodiments of the present disclosure, and these variations or replacements shall fall into the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be subject to the protection scope of the claims.

The above descriptions merely show illustrative implementations of the present disclosure, not intended to limit the protection scope of the present disclosure. The protection scope of the disclosure is determined by the appended claims.

This application claims the priority to Chinese Patent Application No. 201610856232.6 filed on Sep. 27, 2016, the entire disclosure of which is hereby incorporated by reference as part of this application.

Claims

1. A touch substrate, comprising:

a touch structure, at least a part of which is located in a main touch region;

a connecting member and a wiring, at least partially located in a wiring region, wherein the connecting member is configured to electrically connect the touch structure and the wiring, and the connecting member has a hollow portion.

2. The touch substrate according to claim 1, further comprising:

an organic layer, at least partially located in the wiring region and overlapping the connecting member and the wiring.

3. The touch substrate according to claim 1 or 2, wherein the connecting member is in a mesh structure.

4. The touch substrate according to any one of claims 1 to 3, wherein a length of the connecting member is 1˜5 mm.

5. The touch substrate according to any one of claims 1 to 4, wherein a width of the connecting member is 0.2˜0.3 mm.

6. The touch substrate according to claim 2, wherein the touch structure comprises a first touch electrode and a second touch electrode which are insulated from and intersect with each other, the first touch electrode comprises a plurality of first touch sub-electrodes, and the plurality of first touch sub-electrodes are electrically connected by a bridge; the bridge are isolated from the second touch electrode by an insulating layer;

the organic layer and the insulating layer are located in a same layer and made of same material.

7. The touch substrate according to claim 6, wherein the organic layer is a first coating protection layer.

8. The touch substrate according to claim 6 or 7, wherein the bridge, the connecting member and the wiring are in a same layer and made of same material.

9. The touch substrate according to any one of claims 6 to 8, wherein the bridge is in a bar structure;

a length of the bridge is 100˜300 μm.

10. The touch substrate according to any one of claims 6 to 9, wherein a width of the bridge is 5˜10 μm.

11. The touch substrate according to any one of claims 1 to 10, further comprising a light shielding layer disposed in the wiring region.

12. The touch substrate according to claim 11, wherein the light shielding layer is a white light shielding layer or a black light shielding layer.

13. The touch substrate according to claims 1 to 11, further comprising a second coating protection layer overlapping the touch structure.

14. The touch substrate according to claim 13, wherein an explosion-proof film is disposed on the protection layer.

15. The touch substrate according to any one of claims 1 to 14, wherein the connecting member is a metal connecting bar.

16. A touch display device, comprising: a display panel, and a touch substrate disposed on a light emitting side of the display panel, wherein the touch substrate is the touch substrate according to any one of claims 1 to 15.

17. The touch display device according to claim 16, wherein the display panel is a liquid crystal display panel or an organic light emitting diode display panel.