HEAT DISSIPATING MODULE WITH TWO VAPOR CHAMBERS

Abstract

A heat dissipating module includes a lower vapor chamber, an upper vapor chamber, a heat pipe and fins. The lower and upper vapor chambers have a first chamber and a second chamber, respectively. The upper vapor chamber is disposed over the upper vapor chamber. The heat pipe is connected between the lower vapor chamber and the upper vapor chamber and has a third chamber. The first chamber, the second chamber and the third chamber communicate with each other. The fins are parallelly upright connected between the lower vapor chamber and the upper vapor chamber. Upper ends and lower ends of the fins connect to the upper vapor chamber and the lower vapor chamber, respectively.

Description

BACKGROUND OF THE INVENTION

Technical Field

The invention relates to coolers, particularly to a heat dissipating module with two vapor chambers.

Related Art

With unceasing upgrade of electronic components, their produced heat becomes higher and higher. To solve this problem of high produced heat, the industries combine heat pipes and vapor chambers into coolers to improve efficiency of heat dissipation.

However, condensing ends of heat pipes or vapor chambers of such conventional coolers are connected to fins, but these fins can dissipate heat only by pressure difference caused by environmental temperature variation, so efficiency of heat dissipation of fins is limited considerably. As a result, heat is accumulated at the condensing ends of heat pipes or vapor chambers and finally the cooling effect malfunctions.

SUMMARY OF THE INVENTION

An object of the invention is to provide a heat dissipating module, which uses a heat pipe and fins to connect between two vapor chambers so as to improve performance of heat transfer and dissipation.

To accomplish the above object, the heat dissipating module of the invention includes a lower vapor chamber, an upper vapor chamber, a heat pipe and fins. The lower and upper vapor chambers have a first chamber and a second chamber, respectively. The upper vapor chamber is disposed over the upper vapor chamber. The heat pipe is connected between the lower vapor chamber and the upper vapor chamber and has a third chamber. The first chamber, the second chamber and the third chamber communicate with each other. The fins are parallelly upright connected between the lower vapor chamber and the upper vapor chamber. Upper ends and lower ends of the fins connect to the upper vapor chamber and the lower vapor chamber, respectively.

According to the above description, the fins and the heat pipe are located between the two vapor chambers, heat absorbed by the lower vapor chamber can be dissipated by both thermal conductions caused by environmental temperature variation via the fins and heat transfer by the heat pipe and the upper vapor chamber through circulation of working fluid. The latter makes the heat transferred to both the upper vapor chamber and the outside. As a result, great performance and efficiency of heat transfer and dissipation can be obtained.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of the invention;

FIG. 2 is a cross-sectional view of the invention;

FIG. 3 is another cross-sectional view of the invention;

FIG. 4 is still another cross-sectional view of the invention;

FIG. 5 is a cross-sectional view of another embodiment of the invention;

FIG. 6 is a cross-sectional view of still another embodiment of the invention; and

FIG. 7 is a cross-sectional view of yet another embodiment of the invention.

DETAILED DESCRIPTION OF THE INVENTION

Please refer to FIGS. 1-4. The invention provides a heat dissipating module used for a heating element 100. The heat dissipating module 10 includes a lower vapor chamber 1, an upper vapor chamber 2, a heat pipe 3 and fins 4.

The lower vapor chamber 1 has a first chamber 11. The upper vapor chamber 2 is disposed over the upper vapor chamber 1. The upper vapor chambers 2 has a second chamber. The heating element 100 is attached on the lower vapor chamber 1.

The heat pipe 3 is connected between the lower vapor chamber 1 and the upper vapor chamber 2 and has a third chamber 31. The heat pipe 3 corresponds to the heating element 100 in position as shown in FIG. 4. The first chamber 11, the second chamber 21 and the third chamber 31 communicate with each other. The heat pipe 3 is of a bar shape, but not limited to this.

The fins 4 are parallelly upright connected between the lower vapor chamber 1 and the upper vapor chamber 2. Upper ends and lower ends of the fins 4 connect to the upper vapor chamber 2 and the lower vapor chamber 1, respectively. Parts of the fins 4 connect to the heat pipe 3.

The fins 4 are connected to the lower chamber 1, the upper chamber 2 and the heat pipe 3 in one-piece molding, but not limited to this. The fins 4 may be inserted into the lower vapor chamber 1, the upper vapor chamber 2 and the heat pipe 3.

In detail, the lower vapor chamber 1 has a first side 12 and a second side 13, which are opposite to each other. The lower vapor chamber 1 further has a middle section 14 between the first side 12 and the second side 13. The heat pipe 3 is one in number and is disposed in the middle section 14.

The heat dissipating module 10 further includes a wick structure 5 and working fluid. The wick structure 5 is attached on inner sides of the lower vapor chamber 1, the upper vapor chamber 2 and the heat pipe 3. The working fluid is received in the first chamber 11, the second chamber 21 and the third chamber 3. The wick structure 5 is one or more of grooves, mesh, fibers, sintered powder and waved plates.

The fins 4 and the heat pipe 3 are located between the two vapor chambers 1 and 2, and heat absorbed by the lower vapor chamber 1 can be dissipated by both thermal conductions caused by environmental temperature variation via the fins 4 and heat transfer by the heat pipe 3 and the upper vapor chamber 2 through circulation of working fluid. The latter makes the heat transferred to both the upper vapor chamber 2 and the outside. As a result, great performance and efficiency of heat transfer and dissipation can be obtained.

In addition, the wick structure 5 is attached on inner sides of the lower vapor chamber 1, the upper vapor chamber 2 and the heat pipe 3, so that the working fluid absorbs heat from the lower vapor chamber 1 and then flows to the upper vapor chamber 2 to condense through the heat pipe 3. The two vapor chambers 1 and 2 obtain an effect of rapid heat transfer.

Furthermore, the heat pipe 3 corresponds to the heating element 100 in position as shown in FIG. 4 to accelerate heat transfer from the heating element 100 to the heat pipe 3.

Please refer to FIG. 5, which shows another embodiment of the invention. This embodiment is substantially identical to the abovementioned embodiment and the difference therebetween is the shape of the heat pipe 3. The heat pipe 3 in this embodiment is horizontally mounted and of a rod-shape, but not limited to this. The heat pipe 3 may be any geometric shapes.

Please refer to FIG. 6, which shows still another embodiment of the invention. This embodiment is substantially identical to the abovementioned embodiment and the difference therebetween is the number of the heat pipe 3. In this embodiment, multiple heat pipes 3 are arranged in the middle section 14 at regular intervals. Increase of the number of the heat pipes 3 can transfer heat from the lower vapor chamber 1 more rapidly to enhance efficiency of heat dissipation of the heat dissipating module 10.

Please refer to FIG. 7, which shows yet another embodiment of the invention. This embodiment is substantially identical to the abovementioned embodiment and the difference therebetween is the mounting manner of the fins 4. In this embodiment, the fins 4 are inserted into the lower vapor chamber 1, the upper vapor chamber 2 and the heat pipe 3, but not limited to this. The fins 4 may be connected to the lower vapor chamber 1, the upper vapor chamber 2 and the heat pipe 3 by one-piece molding or adhesion.

It will be appreciated by persons skilled in the art that the above embodiments have been described by way of example only and not in any limitative sense, and that various alterations and modifications are possible without departure from the scope of the invention as defined by the appended claims.

Claims

1. A heat dissipating module for a heating element, comprising:

a lower vapor chamber, having a first chamber, and attached by the heat element;

an upper vapor chamber, disposed over the upper vapor chamber, and having a second chamber;

at least one heat pipe, connected between the lower vapor chamber and the upper vapor chamber, and having a third chamber, wherein the first chamber, the second chamber and the third chamber communicate with each other; and

a plurality of fins, parallelly upright connected between the lower vapor chamber and the upper vapor chamber, wherein upper ends and lower ends of the fins connect to the upper vapor chamber and the lower vapor chamber, respectively.

2. The heat dissipating module of claim 1, wherein parts of the fins are connected to the heat pipe.

3. The heat dissipating module of claim 1, wherein the lower vapor chamber has a first side and a second side, which are opposite to each other, the lower vapor chamber further has a middle section between the first side and the second side, and the heat pipe is one in number and is disposed in the middle section.

4. The heat dissipating module of claim 1, wherein the lower vapor chamber has a first side and a second side, which are opposite to each other, the lower vapor chamber further has a middle section between the first side and the second side, and the heat pipe is more than one in number and is disposed in the middle section at regular intervals.

5. The heat dissipating module of claim 1, further comprising a wick structure and working fluid, the wick structure being attached on inner sides of the lower vapor chamber, the upper vapor chamber and the heat pipe, and the working fluid being received in the first chamber, the second chamber and the third chamber.

6. The heat dissipating module of claim 5, wherein the wick structure is one or more of grooves, mesh, fibers, sintered powder and waved plates.

7. The heat dissipating module of claim 1, wherein the heat pipe corresponds to the heating element in position.