Patents by Inventor Chun-Hung Lin
Chun-Hung Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12335251Abstract: Techniques of service to service authentication in distributed computing systems are disclosed herein. One example technique includes identifying a token type of a security token and an authentication scheme indicated in an access request for authenticating the access request. The example technique also includes using a combination of the identified token type of the security token and the authentication scheme indicated in the access request as a key to locate an authentication pattern in a mapping table and identifying an authentication policy corresponding to the authentication pattern. The example technique can then include applying the identified authentication policy to the received data package to authenticate the access request based on the security token and conditionally providing the client service access to the platform service.Type: GrantFiled: December 16, 2021Date of Patent: June 17, 2025Assignee: Microsoft Technology Licensing, LLCInventors: Chun-Hung Lin, Matthias Leibmann
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Publication number: 20250158616Abstract: A level shifter includes a first load circuit, a second load circuit, a BJT transistor, a first MOSFET transistor and a NOT gate. A first terminal of the first load circuit receives the second supply voltage. A first terminal of the second load circuit receives the input signal. A collector of the BJT transistor is connected with a second terminal of the first load circuit. A base of the BJT transistor is connected with a second terminal of the second load circuit. A drain terminal of the first MOSFET transistor is connected with an emitter of the BJT transistor. A source terminal of the first MOSFET transistor receives a ground voltage. A gate terminal of the first MOSFET transistor receives the input signal. An input terminal of the NOT gate is connected with the first load circuit. An output terminal of the NOT gate generates an output signal.Type: ApplicationFiled: November 8, 2024Publication date: May 15, 2025Inventors: Chien-Han WU, Chun-Hung LIN
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Patent number: 12276461Abstract: A vapor chamber includes a shell body, a wick structure, a single-piece support structure and a working fluid. The shell body includes a first shell and a second shell. A chamber is formed between the first shell and the second shell. The wick structure is disposed in the chamber and attached on the shell body. The single-piece support structure is disposed in the chamber and between the first shell and the second shell, and includes support bodies and ribs. Each support body includes a hollow rod and an annular seat. Any adjacent two of the annular seats are connected by one of the ribs. The support body are arranged at an interval. The ribs are arranged along the support bodies to form hollow portions between each support body and each rib. The working fluid is disposed in the chamber.Type: GrantFiled: April 4, 2023Date of Patent: April 15, 2025Assignee: TAIWAN MICROLOOPS CORP.Inventor: Chun-Hung Lin
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Publication number: 20250092599Abstract: A fabricating method of a non-woven film, for electronic components, includes the following steps. Providing a polyetherimide substrate and an aerogel dispersion, in which the aerogel dispersion includes an aerogel, and the aerogel has a moisture content between 0.7% and 0.9% and a porosity between 85% and 95%. Dipping the polyetherimine substrate in the aerogel dispersion, such that the aerogel dispersion covers the polyetherimine substrate. Performing a thermal compression process on the polyetherimide substrate, such that the aerogel and the polyetherimide substrate are composited with each other. Performing an ultrasonic oscillating process on the polyetherimine substrate, such that the aerogel not being composited with the polyetherimine substrate is removed.Type: ApplicationFiled: December 1, 2024Publication date: March 20, 2025Inventors: Shao-Yen CHANG, Shang-Chih CHOU, Chun-Hung LIN
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Patent number: 12209357Abstract: A non-woven film for electronic components is provided in the present disclosure. The non-woven film for electronic components includes a polyetherimide substrate and an aerogel. The aerogel is disposed on the polyetherimide substrate. The aerogel has a moisture content between 0.7% and 0.9% and a porosity between 85% and 95%.Type: GrantFiled: December 2, 2021Date of Patent: January 28, 2025Assignee: TAIWAN TEXTILE RESEARCH INSTITUTEInventors: Shao-Yen Chang, Shang-Chih Chou, Chun-Hung Lin
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Publication number: 20250024668Abstract: An antifuse-type memory includes a first memory cell. The first memory cell includes a first select transistor, a first following transistor and a first antifuse transistor. A first drain/source terminal of the first select transistor is connected with a first bit line. A gate terminal of the first select transistor is connected with a first word line. A first drain/source terminal of the first following transistor is connected with a second drain/source terminal of the first select transistor. A gate terminal of the first following transistor is connected with a first following control line. The first antifuse transistor includes a first fin, a first gate structure, a first drain/source contact layer and a second drain/source contact layer. The first gate structure includes a first gate dielectric layer and a first gate layer. The first gate layer is connected with a first antifuse control line.Type: ApplicationFiled: May 22, 2024Publication date: January 16, 2025Inventors: Yi-Hung LI, Chun-Hung LIN
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Publication number: 20250006562Abstract: A layout optimization method and a semiconductor wafer are provided. The method includes: generating adjusted patterns corresponding to a first layout pattern; generating a layout optimization test group according to the adjusted patterns, wherein the layout optimization test group includes first and second clusters of test pattern arrays, the first cluster include first test pattern arrays in accordance with one of the adjusted patterns and different from one another in terms of capacity, and the second cluster include second test pattern arrays in accordance with another one of the adjusted patterns and different from one another in terms of capacity; forming the layout optimization test group on a wafer; performing an electrical inspection on the first and second pattern arrays, and determining a best manufacturing solution from the adjusted patterns according to the electrical inspection.Type: ApplicationFiled: June 26, 2024Publication date: January 2, 2025Applicant: Winbond Electronics Corp.Inventors: Chun-Hung Lin, Hsin-Hung Chou, Kao-Tsair Tsai
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Patent number: 12173969Abstract: A separate capillary vapor chamber structure for dual heat sources is provided for transferring heat between low and high heat sources, and includes lower and upper plates covering each other, an evaporation area having the low and high heat sources, a first condensation area extended from a side of the evaporation area and adjacent to the low heat source, a second condensation area extended from another side of the evaporation area and adjacent to the high heat source. The lower plate has a lower capillary layer extended from the first condensation area to an end of the second condensation area through the evaporation area, and the upper plate has an upper capillary layer extended from an end of the first condensation area into the evaporation area to form a cut edge, such that the upper capillary layer is shorter than the lower capillary layer.Type: GrantFiled: January 19, 2023Date of Patent: December 24, 2024Assignee: TAIWAN MICROLOOPS CORP.Inventor: Chun-Hung Lin
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Publication number: 20240354038Abstract: A display card includes a circuit board, a graphic processing unit and a noise reduction module. The circuit board has multiple gold fingers. The graphic processing unit is disposed on the circuit board. The noise reduction module is disposed on and electrically connected to the circuit board. The noise reduction module includes an active noise cancellation and a speaker electrically connected to the active noise cancellation. The speaker is capable of emitting a noise reduction sound to offset a noise from surrounding environment by the noise reduction sound. Thereby, the disclosure can effectively overcome the disturbing problem of noise.Type: ApplicationFiled: July 11, 2023Publication date: October 24, 2024Inventor: Chun-Hung LIN
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Publication number: 20240355314Abstract: A separate active noise cancellation device is installed on an electronic device which includes a circuit board and a noise generating source. The separate active noise cancellation device includes an active noise cancellation controller, a microphone and a speaker, the active noise cancellation controller is installed on and electrically connected to the circuit board, the microphone and the active noise cancellation controller are separately installed, the microphone has a cable provided for electrically connecting the active noise cancellation controller, the microphone is arranged around the noise generating source, the speaker is electrically connected to the active noise cancellation controller and capable of issuing a noise cancelling sound to offset the noise generated by the noise generating source. In this way, the amount of noise may be accurately captured and reduced to overcome the annoying noise problem.Type: ApplicationFiled: June 7, 2023Publication date: October 24, 2024Inventor: Chun-Hung LIN
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Patent number: 12119261Abstract: A manufacturing method for a semiconductor structure is provided. First active areas, a second active area, and a third active area are formed. A first dielectric layer is formed on the active areas. A patterned region that includes a cavity region and a dielectric region is formed in the first dielectric layer, and the cavity region surrounds the dielectric region. A filling layer is formed in the cavity region. Multiple first contact holes and at least one second contact hole that penetrate the first dielectric layer are formed. Each first contact hole exposes a portion of the corresponding first active area, and the second contact hole replaces the dielectric region and exposes a portion of the second active area. Metal layers are filled in to the first contact holes and the second contact hole.Type: GrantFiled: April 4, 2022Date of Patent: October 15, 2024Assignee: WINBOND ELECTRONICS CORP.Inventors: Chun-Hung Lin, Kao-Tsair Tsai, Chung-Hsien Liu, Tz-Hau Guo, Yen-Jui Chu
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Publication number: 20240329704Abstract: A heat dissipation device having a noise cancelling module includes: a seat body; a cover member correspondingly covering the seat body, and an accommodation chamber is formed between the seat body and the cover member, the cover member has an air inlet port and an air outlet port communicating with the accommodation chamber; a fan disposed in the accommodation chamber and arranged corresponding to the air inlet port, and having a plurality of blades; a heat dissipation fin set disposed in the accommodation chamber and arranged corresponding to the air outlet port; and a noise cancelling module generating a noise cancellation sound, the noise cancelling module is disposed on the cover member or the heat dissipation fin set to make the noise cancellation sound offset a noise generated when each of the blades rotates.Type: ApplicationFiled: June 7, 2023Publication date: October 3, 2024Inventor: Chun-Hung LIN
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Publication number: 20240317926Abstract: A zwitterionic resin is manufactured by a manufacturing method which includes the following steps. A first thermal process is performed on a first crosslinking agent and a choline having hydroxyl group or amino group to form a first mixture, in which the first crosslinking agent includes an isocyanate group. A second thermal process is performed on the first mixture, a second crosslinking agent, a chain extender, and an amino acid to form the zwitterionic resin, in which the chain extender includes a polyol.Type: ApplicationFiled: May 30, 2024Publication date: September 26, 2024Inventors: Chen-Shou HSU, Sun-Wen JUAN, Chun-Hung LIN
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Publication number: 20240280329Abstract: A vapor chamber includes a shell body, a wick structure, a single-piece support structure and a working fluid. The shell body includes a first shell and a second shell. A chamber is formed between the first shell and the second shell. The wick structure is disposed in the chamber and attached on the shell body. The single-piece support structure is disposed in the chamber and between the first shell and the second shell, and includes support bodies and ribs. Each support body includes a hollow rod and an annular seat. Any adjacent two of the annular seats are connected by one of the ribs. The support body are arranged at an interval. The ribs are arranged along the support bodies to form hollow portions between each support body and each rib. The working fluid is disposed in the chamber.Type: ApplicationFiled: April 4, 2023Publication date: August 22, 2024Inventor: Chun-Hung LIN
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Publication number: 20240268081Abstract: A composite heat dissipation device includes a base, a cover, a first fan, and a second fan. The cover covers the base to form a first heat dissipation area and a second heat dissipation area. The cover is provided with a first air inlet and a first air outlet communicating with the first air inlet. The cover is provided with a second air inlet, and a second air outlet and a third air outlet communicating with the second air inlet. A first fan is corresponding to the first air inlet and the first air outlet. A second fan is corresponding to the second air inlet, the second and the third air outlets. The first air outlet is opposite to the second air outlet, and the third air outlet is adjacent to the second air outlet, the air outlets do not interfere with each other, and heat dissipation performance is improved.Type: ApplicationFiled: March 28, 2023Publication date: August 8, 2024Inventors: Chun-Hung LIN, Han-Lin CHEN
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Patent number: 12043696Abstract: A zwitterionic resin is manufactured by a manufacturing method which includes the following steps. A first thermal process is performed on a first crosslinking agent and a choline having hydroxyl group or amino group to form a first mixture, in which the first crosslinking agent includes an isocyanate group. A second thermal process is performed on the first mixture, a second crosslinking agent, a chain extender, and an amino acid to form the zwitterionic resin, in which the chain extender includes a polyol.Type: GrantFiled: July 1, 2022Date of Patent: July 23, 2024Assignee: TAIWAN TEXTILE RESEARCH INSTITUTEInventors: Chen-Shou Hsu, Sun-Wen Juan, Chun-Hung Lin
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Publication number: 20240216833Abstract: A degassing tube includes a first plate, a second plate and a degassing tube. The first plate has a recess portion and a flange surrounding the recess portion. The flange has a first side and a second side opposite to the first side. A tube connector is disposed protrusively from the second side and located on the flange. The second plate covers the first plate. The degassing tube is disposed in the tube connector. The tube connector is formed with a degassing opening indented from the first side. The degassing opening has a maximum width defined in the tube connector and a minimum width defined on the first side. The minimum width is less than the maximum width for making the degassing tube tightly connected in the tube connector.Type: ApplicationFiled: June 7, 2023Publication date: July 4, 2024Inventor: Chun-Hung LIN
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Publication number: 20240200879Abstract: A separate capillary vapor chamber structure for dual heat sources is provided for transferring heat between low and high heat sources, and includes lower and upper plates covering each other, an evaporation area having the low and high heat sources, a first condensation area extended from a side of the evaporation area and adjacent to the low heat source, a second condensation area extended from another side of the evaporation area and adjacent to the high heat source. The lower plate has a lower capillary layer extended from the first condensation area to an end of the second condensation area through the evaporation area, and the upper plate has an upper capillary layer extended from an end of the first condensation area into the evaporation area to form a cut edge, such that the upper capillary layer is shorter than the lower capillary layer.Type: ApplicationFiled: January 19, 2023Publication date: June 20, 2024Inventor: Chun-Hung LIN
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Patent number: 11993674Abstract: A functional resin material is manufactured by the following reagents including a polyol, a polyamine, a first cross-linking agent, a second cross-linking agent, and a nanocellulose. Each of the first cross-linking agent and the second cross-linking agent includes an isocyanate block.Type: GrantFiled: September 23, 2020Date of Patent: May 28, 2024Assignee: TAIWAN TEXTILE RESEARCH INSTITUTEInventors: Sun-Wen Juan, Chun-Hung Lin, Yi-Ching Sung
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Publication number: 20240161843Abstract: An anti-fuse memory device includes an anti-fuse module, a reference current circuit and a controller. A write enable signal enables a write controller and a write buffer of the anti-fuse module to program a selected anti-fuse memory cell in an anti-fuse array of the anti-fuse module, and a timing controller of the anti-fuse module stops a program operation of the anti-fuse array after a sense amplifier of the anti-fuse module changes a state of a readout data signal for a predetermined time duration.Type: ApplicationFiled: September 20, 2023Publication date: May 16, 2024Applicant: eMemory Technology Inc.Inventors: Chia-Fu Chang, Chun-Hung Lin, Jen-Yu Peng, You-Ruei Chuang