Abstract: A vapor chamber includes a shell body, a wick structure, a single-piece support structure and a working fluid. The shell body includes a first shell and a second shell. A chamber is formed between the first shell and the second shell. The wick structure is disposed in the chamber and attached on the shell body. The single-piece support structure is disposed in the chamber and between the first shell and the second shell, and includes support bodies and ribs. Each support body includes a hollow rod and an annular seat. Any adjacent two of the annular seats are connected by one of the ribs. The support body are arranged at an interval. The ribs are arranged along the support bodies to form hollow portions between each support body and each rib. The working fluid is disposed in the chamber.

Abstract: A fabricating method of a non-woven film, for electronic components, includes the following steps. Providing a polyetherimide substrate and an aerogel dispersion, in which the aerogel dispersion includes an aerogel, and the aerogel has a moisture content between 0.7% and 0.9% and a porosity between 85% and 95%. Dipping the polyetherimine substrate in the aerogel dispersion, such that the aerogel dispersion covers the polyetherimine substrate. Performing a thermal compression process on the polyetherimide substrate, such that the aerogel and the polyetherimide substrate are composited with each other. Performing an ultrasonic oscillating process on the polyetherimine substrate, such that the aerogel not being composited with the polyetherimine substrate is removed.

Abstract: A non-woven film for electronic components is provided in the present disclosure. The non-woven film for electronic components includes a polyetherimide substrate and an aerogel. The aerogel is disposed on the polyetherimide substrate. The aerogel has a moisture content between 0.7% and 0.9% and a porosity between 85% and 95%.

Abstract: An antifuse-type memory includes a first memory cell. The first memory cell includes a first select transistor, a first following transistor and a first antifuse transistor. A first drain/source terminal of the first select transistor is connected with a first bit line. A gate terminal of the first select transistor is connected with a first word line. A first drain/source terminal of the first following transistor is connected with a second drain/source terminal of the first select transistor. A gate terminal of the first following transistor is connected with a first following control line. The first antifuse transistor includes a first fin, a first gate structure, a first drain/source contact layer and a second drain/source contact layer. The first gate structure includes a first gate dielectric layer and a first gate layer. The first gate layer is connected with a first antifuse control line.

Abstract: A layout optimization method and a semiconductor wafer are provided. The method includes: generating adjusted patterns corresponding to a first layout pattern; generating a layout optimization test group according to the adjusted patterns, wherein the layout optimization test group includes first and second clusters of test pattern arrays, the first cluster include first test pattern arrays in accordance with one of the adjusted patterns and different from one another in terms of capacity, and the second cluster include second test pattern arrays in accordance with another one of the adjusted patterns and different from one another in terms of capacity; forming the layout optimization test group on a wafer; performing an electrical inspection on the first and second pattern arrays, and determining a best manufacturing solution from the adjusted patterns according to the electrical inspection.

Abstract: A separate capillary vapor chamber structure for dual heat sources is provided for transferring heat between low and high heat sources, and includes lower and upper plates covering each other, an evaporation area having the low and high heat sources, a first condensation area extended from a side of the evaporation area and adjacent to the low heat source, a second condensation area extended from another side of the evaporation area and adjacent to the high heat source. The lower plate has a lower capillary layer extended from the first condensation area to an end of the second condensation area through the evaporation area, and the upper plate has an upper capillary layer extended from an end of the first condensation area into the evaporation area to form a cut edge, such that the upper capillary layer is shorter than the lower capillary layer.

Abstract: A separate active noise cancellation device is installed on an electronic device which includes a circuit board and a noise generating source. The separate active noise cancellation device includes an active noise cancellation controller, a microphone and a speaker, the active noise cancellation controller is installed on and electrically connected to the circuit board, the microphone and the active noise cancellation controller are separately installed, the microphone has a cable provided for electrically connecting the active noise cancellation controller, the microphone is arranged around the noise generating source, the speaker is electrically connected to the active noise cancellation controller and capable of issuing a noise cancelling sound to offset the noise generated by the noise generating source. In this way, the amount of noise may be accurately captured and reduced to overcome the annoying noise problem.

Abstract: A display card includes a circuit board, a graphic processing unit and a noise reduction module. The circuit board has multiple gold fingers. The graphic processing unit is disposed on the circuit board. The noise reduction module is disposed on and electrically connected to the circuit board. The noise reduction module includes an active noise cancellation and a speaker electrically connected to the active noise cancellation. The speaker is capable of emitting a noise reduction sound to offset a noise from surrounding environment by the noise reduction sound. Thereby, the disclosure can effectively overcome the disturbing problem of noise.

Abstract: A manufacturing method for a semiconductor structure is provided. First active areas, a second active area, and a third active area are formed. A first dielectric layer is formed on the active areas. A patterned region that includes a cavity region and a dielectric region is formed in the first dielectric layer, and the cavity region surrounds the dielectric region. A filling layer is formed in the cavity region. Multiple first contact holes and at least one second contact hole that penetrate the first dielectric layer are formed. Each first contact hole exposes a portion of the corresponding first active area, and the second contact hole replaces the dielectric region and exposes a portion of the second active area. Metal layers are filled in to the first contact holes and the second contact hole.

Abstract: A heat dissipation device having a noise cancelling module includes: a seat body; a cover member correspondingly covering the seat body, and an accommodation chamber is formed between the seat body and the cover member, the cover member has an air inlet port and an air outlet port communicating with the accommodation chamber; a fan disposed in the accommodation chamber and arranged corresponding to the air inlet port, and having a plurality of blades; a heat dissipation fin set disposed in the accommodation chamber and arranged corresponding to the air outlet port; and a noise cancelling module generating a noise cancellation sound, the noise cancelling module is disposed on the cover member or the heat dissipation fin set to make the noise cancellation sound offset a noise generated when each of the blades rotates.

Abstract: A zwitterionic resin is manufactured by a manufacturing method which includes the following steps. A first thermal process is performed on a first crosslinking agent and a choline having hydroxyl group or amino group to form a first mixture, in which the first crosslinking agent includes an isocyanate group. A second thermal process is performed on the first mixture, a second crosslinking agent, a chain extender, and an amino acid to form the zwitterionic resin, in which the chain extender includes a polyol.

Abstract: A vapor chamber includes a shell body, a wick structure, a single-piece support structure and a working fluid. The shell body includes a first shell and a second shell. A chamber is formed between the first shell and the second shell. The wick structure is disposed in the chamber and attached on the shell body. The single-piece support structure is disposed in the chamber and between the first shell and the second shell, and includes support bodies and ribs. Each support body includes a hollow rod and an annular seat. Any adjacent two of the annular seats are connected by one of the ribs. The support body are arranged at an interval. The ribs are arranged along the support bodies to form hollow portions between each support body and each rib. The working fluid is disposed in the chamber.

Abstract: A composite heat dissipation device includes a base, a cover, a first fan, and a second fan. The cover covers the base to form a first heat dissipation area and a second heat dissipation area. The cover is provided with a first air inlet and a first air outlet communicating with the first air inlet. The cover is provided with a second air inlet, and a second air outlet and a third air outlet communicating with the second air inlet. A first fan is corresponding to the first air inlet and the first air outlet. A second fan is corresponding to the second air inlet, the second and the third air outlets. The first air outlet is opposite to the second air outlet, and the third air outlet is adjacent to the second air outlet, the air outlets do not interfere with each other, and heat dissipation performance is improved.

Abstract: A zwitterionic resin is manufactured by a manufacturing method which includes the following steps. A first thermal process is performed on a first crosslinking agent and a choline having hydroxyl group or amino group to form a first mixture, in which the first crosslinking agent includes an isocyanate group. A second thermal process is performed on the first mixture, a second crosslinking agent, a chain extender, and an amino acid to form the zwitterionic resin, in which the chain extender includes a polyol.

Abstract: A degassing tube includes a first plate, a second plate and a degassing tube. The first plate has a recess portion and a flange surrounding the recess portion. The flange has a first side and a second side opposite to the first side. A tube connector is disposed protrusively from the second side and located on the flange. The second plate covers the first plate. The degassing tube is disposed in the tube connector. The tube connector is formed with a degassing opening indented from the first side. The degassing opening has a maximum width defined in the tube connector and a minimum width defined on the first side. The minimum width is less than the maximum width for making the degassing tube tightly connected in the tube connector.

Abstract: A separate capillary vapor chamber structure for dual heat sources is provided for transferring heat between low and high heat sources, and includes lower and upper plates covering each other, an evaporation area having the low and high heat sources, a first condensation area extended from a side of the evaporation area and adjacent to the low heat source, a second condensation area extended from another side of the evaporation area and adjacent to the high heat source. The lower plate has a lower capillary layer extended from the first condensation area to an end of the second condensation area through the evaporation area, and the upper plate has an upper capillary layer extended from an end of the first condensation area into the evaporation area to form a cut edge, such that the upper capillary layer is shorter than the lower capillary layer.

Abstract: A functional resin material is manufactured by the following reagents including a polyol, a polyamine, a first cross-linking agent, a second cross-linking agent, and a nanocellulose. Each of the first cross-linking agent and the second cross-linking agent includes an isocyanate block.

Abstract: The present disclosure provides a component matching and reporting method, which includes steps as follows. A 3D file is parsed to obtain features; the features is analyzed according to a feature analysis parameter to find out at least one component feature; it is judged whether the at least one component feature corresponds to a component according to a feature judgment parameter; when the at least one component feature corresponds to the component, the component is located; after the component is located, the component is measured to output a measurement report.

Abstract: An anti-fuse memory device includes an anti-fuse module, a reference current circuit and a controller. A write enable signal enables a write controller and a write buffer of the anti-fuse module to program a selected anti-fuse memory cell in an anti-fuse array of the anti-fuse module, and a timing controller of the anti-fuse module stops a program operation of the anti-fuse array after a sense amplifier of the anti-fuse module changes a state of a readout data signal for a predetermined time duration.