COOLING DEVICE

Abstract

The present invention provides a cooling device, comprising a first cooling portion, a second cooling portion, and a first receiving cavity sandwiched between the first cooling portion and the second cooling portion, where the first cooling portion is disposed around the second cooling portion, and the first cooling portion and the second cooling portion are distributed spaced-apart. According to the present invention, the liquid to be cooled in the first receiving cavity is simultaneously cooled by the first cooling portion and the second cooling portion without an additive being added, so that the cooling effect is substantially improved.

Description

The present application claims priority to Chinese Patent Application No. 201911174823.5 filed on the filing date Nov. 26, 2019 and entitled “Cooling Device”, the content of which is incorporated herein by reference in its entirety.

TECHNICAL FIELD

The present invention relates to the technical field of cooling, and particularly to a cooling device.

BACKGROUND

In hot summer days, some consumers like drinking iced drinks. Additionally, iced drinks offer a better taste. At present, a method of cooling a freshly-squeezed drink is adding ice cubes into a cup filled with the drink. However, since the ice cubes melt into liquid water to mix with the drink, the concentration of the drink will be lowered, which will affect the taste of the drink.

In view of the above, it is necessary to provide a cooling device to solve the above problem.

SUMMARY

An object of the present invention is to provide a cooling device which may achieve quick cooling.

To achieve the above object, an embodiment of the present invention provides a cooling device, comprising a first cooling portion, a second cooling portion, and a first receiving cavity sandwiched between the first cooling portion and the second cooling portion, wherein the first cooling portion is disposed around the second cooling portion, and the first cooling portion and the second cooling portion are distributed spaced-apart.

As a further improvement of one embodiment of the present invention, the cooling device comprises a cup body, the cup body comprises an outer wall and a first inner wall in sequence from the outside to the inside, the first cooling portion is formed between the outer wall and the first inner wall, the second cooling portion is located in a cavity surrounded by the first inner wall, and the first receiving cavity is formed between the first inner wall and the second cooling portion.

As a further improvement of one embodiment of the present invention, the cooling device further comprises a lid that fits with the cup body.

As a further improvement of one embodiment of the present invention, the outer wall comprises an outer bottom wall and an outer peripheral wall disposed around the outer bottom wall, the first inner wall comprises a first bottom wall and a first peripheral wall disposed around the first bottom wall, a first gap is disposed between the outer bottom wall and the first bottom wall, a second gap is disposed between the outer peripheral wall and the first peripheral wall, and the first gap is communicated with the second gap.

As a further improvement of one embodiment of the present invention, a gap exists between an outer surface of the second cooling portion and the first bottom wall and between the outer surface of the second cooling portion and the first peripheral wall.

As a further improvement of one embodiment of the present invention, the first cooling portion is a first refrigerant circuit, and the second cooling portion is a semiconductor cooling portion.

As a further improvement of one embodiment of the present invention, the cooling device further comprises a lid fitted with the cup body, and the semiconductor cooling portion is connected to the lid.

As a further improvement of one embodiment of the present invention, the first cooling portion is a first refrigerant circuit, and the second cooling portion is a second refrigerant circuit.

As a further improvement of one embodiment of the present invention, the cup body further comprises a second inner wall, the second inner wall is far away from the outer wall relative to the first inner wall, the first receiving cavity is formed between the first inner wall and the second inner wall, and the second inner wall surrounds to form the second refrigerant circuit.

As a further improvement of one embodiment of the present invention, the cup body further comprises a third inner wall, the third inner wall is far away from the outer wall relative to the second inner wall, the second refrigerant circuit is formed between the second inner wall and the third inner wall, the third inner wall surrounds to form a second receiving cavity, and the second receiving cavity is communicated with the first receiving cavity.

As compared with the prior art, the present invention achieves the following advantageous effects: in one embodiment of the present invention, the liquid to be cooled in the first receiving cavity is simultaneously cooled by the first cooling portion and the second cooling portion without an additive being added, so that the cooling effect is substantially improved.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic view of a cooling device according to a first specific example of the present invention;

FIG. 2 is a schematic view of a cooling device according to a second specific example of the present invention;

FIG. 3 is a schematic view of a cooling device according to a third specific example of the present invention.

DETAILED DESCRIPTION

The present invention will be described in detail with reference to specific embodiments shown in figures. However, these embodiments are not intended to limit the present invention. Structural, methodological or functional variations made by those having ordinary skill in the art according to these embodiments are all included in the protection scope of the present invention.

In the figures of the present invention, some dimensions of structures or portions will be enlarged relative to other structures or portions to facilitate illustration, and therefore are only used to illustrate basic structures of the subject matter of the present invention.

In addition, terms representing spatial relative positions such as “out”, “in”, “up” and “down” in the text describe a relationship of one unit or feature shown in the figures relative to another unit of feature to facilitate illustration. The terms representing the spatial relative positions may be intended to include different orientations in addition to orientations shown in the figures during use or operation of an apparatus. For example, if the apparatus shown in the figures is turned upside down, units described as being located “below” other units or features will become units located “above” other units or features. Therefore, an exemplary term “below” may include two orientations, namely, above and below. The apparatus may be orientated in other manners (rotated by 90 degrees or other orientations), and correspondingly terms related to space used in the text are explained.

Referring to FIG. 1, it is a schematic view of a cooling device 100 according to a first embodiment of the present invention.

The cooling device 100 comprises a first cooling portion 10, a second cooling portion 20, and a first receiving cavity S1 sandwiched between the first cooling portion 10 and the second cooling portion 20.

Here, the first receiving cavity S1 is configured to receive a liquid to be cooled, for example, a hot drink, but not limited thereto. The first receiving cavity S1 may be used to receive a solid or a substance in other states.

The first cooling portion 10 is disposed around the second cooling portion 20, and the first cooling portion 10 and the second cooling portion 20 are distributed spaced-apart.

Here, “the first cooling portion 10 is disposed around the second cooling portion 20” means that the first cooling portion 10 is disposed around an entire outer surface of the second cooling portion 20, or the first cooling portion 10 is disposed around partial outer surface of the second cooling portion 20.

“The first cooling portion 10 and the second cooling portion 20 are distributed spaced-apart” means that the first cooling portion 10 and the second cooling portion 20 are cooling portions that work independently, and the two cooling portions are structurally disconnected from each other, or alternatively the two cooling portions are structurally connected via a connection portion, but the connection portion only functions to connect and does not function to transfer a coolant.

It can be seen that in this embodiment, the liquid to be cooled in the first receiving cavity S1 is simultaneously cooled by the first cooling portion 10 and the second cooling portion 20 without an additive being added, so that the cooling effect is substantially improved.

In the present embodiment, the cooling device 100 comprises a cup body 30, the cup body 30 comprises an outer wall 31 and a first inner wall 32 in sequence from the outside to the inside, the first cooling portion 10 is formed between the outer wall 31 and the first inner wall 32, the second cooling portion 20 is located in a cavity S surrounded by the first inner wall 32, and the first receiving cavity S1 is formed between the first inner wall 32 and the second cooling portion 20.

A thickness of the outer wall 31 may be greater than the thickness of the first inner wall 32 to avoid deformation of the cooling device 100, the outer wall 31 may be made of an ABS material, and the first inner wall 32 may be made of a semiconductor material, but not limited thereto.

Specifically, the outer wall 31 comprises an outer bottom wall 311 and an outer peripheral wall 312 disposed around the outer bottom wall 311, the first inner wall 32 comprises a first bottom wall 321 and a first peripheral wall 322 disposed around the first bottom wall 321, a first gap P1 is disposed between the outer bottom wall 311 and the first bottom wall 321, a second gap P2 is disposed between the outer peripheral wall 312 and the first peripheral wall 322, and the first gap P1 is communicated with the second gap P2.

Assuming that the cup body 30 is a cylindrical or conical cup body, at this time, the outer bottom wall 311 and the first bottom wall 321 are both circular, and the outer peripheral wall 312 and the first peripheral wall 322 are both hollow-cylindrical or hollow-conical. That is to say, referring to FIG. 1, a longitudinal section the first gap P1 and the second gap P2 which are communicated together roughly forms a U shape, and the first cooling portion 10 is formed in the first gap P1 and the second gap P2, whereby an overlapping area of the first cooling portion 10 and the first receiving cavity S1 is increased, thereby improving the cooling effect.

Certainly, in other embodiments, it is also possible that the outer bottom wall 311 and the first bottom wall 321 may be an integral structure, that is, there is no first gap P1 at this time.

In the present embodiment, a gap exists between the outer surface of the second cooling portion 20 and the first bottom wall 321 and between the outer surface of the second cooling portion 20 and the first peripheral wall 322.

That is to say, the second cooling portion 20 is substantially located above the first bottom wall 321, there is a gap between a bottom of the second cooling portion 20 and the first bottom wall 321, and the first peripheral wall 322 is disposed around the second cooling portion 20. In this way, the longitudinal section of the first receiving cavity S1 is U-shaped, and the liquid to be cooled in the first receiving cavity S1 is in full contact with the first cooling portion 10 (or the first inner wall 32) and the second cooling portion 20, thereby further improving the cooling effect.

In the present embodiment, the cooling device 100 further comprises a lid 40 that fits with the cup body 30, and the lid 40 may sealingly fit with the cup body 30, for example, a structure such as a sealing ring may further be disposed between the lid 40 and the cup body 30.

It needs to be appreciated that the cooling device 100 in the present embodiment may be an independent device, the first cooling portion 10 and the second cooling portion 20 may be integrated in the cooling device 100; alternatively, the first cooling portion 10 and the second cooling portion 20 may be disposed independently of the cooling device 100, and the first cooling portion 10 and the second cooling portion 20 are loaded into the cooling device 100 when necessary.

The cooling device 100 may be used in cooperation with a refrigeration device such as a refrigerator. In actual operation, the cooling device 100 with the first cooling portion 10 and the second cooling portion 20 may be first used in cooperation with the refrigerator for refrigeration, so that the first cooling portion 10 and the second cooling portion 20 reserve sufficient cold, and then the cooling device 100 may be used independently, for example, the cooling device 100 may be used for cooling hot drinks outdoors, storing medicines, and the like.

Here, since the first cooling portion 10 and the second cooling portion 20 may reserve enough cold, a refrigeration duration of the cooling device 100 may be prolonged, and the first cooling portion 10 and the second cooling portion 20 may fully cool the liquid to be cooled with a better cooling effect. The cooling device 100 in the present embodiment is structurally simple and convenient to use and provides a good user experience.

Hereinafter, specific embodiments of the cooling device 100 will be introduced.

In a first specific embodiment, referring to FIG. 1, the first cooling portion 10 is a first refrigerant circuit 10, the second cooling portion 20 is a semiconductor cooling portion 20, the first refrigerant circuit 10 is formed between the outer wall 31 and the first inner wall 32, the semiconductor cooling portion 20 is located in the cavity S surrounded by the first inner wall 32, and the first receiving cavity S1 is formed between the first inner wall 32 and the semiconductor cooling portion 20.

Here, the first refrigerant circuit 10 may be filled with a refrigerant which for example may be a liquid or a phase change material with a high specific heat capacity. The first refrigerant circuit 10 may store the cold through a change of the state of the refrigerant, and the refrigerant may be sealingly stored in the first refrigerant circuit 10. Alternatively, the refrigerant may circulate in the first refrigerant circuit 10 by being connected with the first refrigerant circuit 10.

The semiconductor cooling portion 20 may be made of a thermal superconducting alloy or the like. The semiconductor cooling portion 20 may directly absorb and store cold in the refrigerator for use in subsequent refrigeration.

In the specific embodiment, the semiconductor cooling portion 20 is a solid bar-shaped structure, and the semiconductor cooling portion 20 is connected to the lid 40. Here, the semiconductor cooling portion 20 is connected to a central portion of the lid 40.

It needs to be noted that the semiconductor connecting portion 20 may be integrally formed with the lid 40, or assembled and connected with the lid 40, which may depend on actual situations.

In addition, the number of semiconductor connecting portion 20 is not limited to one, and a plurality of semiconductor connecting portions 20 may be disposed below the lid 40. When the lid 40 fits with the cup body 30, the first receiving cavity S1 is formed between the semiconductor connecting portion 20 and the first inner wall 32.

Upon actual use, the cup body 30 and the lid body 40 may be placed in the refrigerator together for refrigeration, the first refrigerant circuit 10 stores the cold through the refrigerant, and the semiconductor connecting portion 20 directly stores the cold. Then, when the liquid needs to cooled, the lid 40 and the semiconductor connecting portion 20 are removed, the liquid to be cooled is placed in the cavity S, the lid 40 is closed, the semiconductor connecting portion 20 just extends into the liquid to be cooled, and the first refrigerant circuit 10 and the semiconductor connecting portion 20 jointly cool the liquid to be cooled.

Referring to FIG. 2, it is a schematic view of a second specific embodiment. For the convenience of description, like structures are denoted with like reference numbers.

In this specific embodiment, a first cooling portion 10a is a first refrigerant circuit 10a, and a second cooling portion 20a is a second refrigerant circuit 20a.

The cup body 30a comprises an outer wall 31a, a first inner wall 32a and a second inner wall 33a in sequence from the outside to the inside, the second inner wall 33a is far away from the outer wall 31a relative to the first inner wall 32a, and a first refrigerant circuit 10a is formed between the outer wall 31a and the first inner wall 32a, a first receiving cavity S1 is formed between the first inner wall 32a and the second inner wall 33a, and the second inner wall 33a surrounds to form a second refrigerant circuit 20a.

Here, the first receiving cavity S1 having a U-shaped longitudinal section is formed between the second inner wall 33a and the first inner wall 32a, and a space enclosed by the second inner wall 33a is completely filled with a refrigerant to form the second refrigerant circuit 20a. Reference may be made to the first specific embodiment for the depictions of the refrigerant, and detailed depictions will not be presented any more here.

It needs to be appreciated that the refrigerants in the first refrigerant circuit 10a and the second refrigerant circuit 20a may be of the same or different materials, which may depend on actual situations.

In addition, in the present specific embodiment, the lid 40a is detachably disposed above the cup body 30a, a portion of the lid 40a corresponding to the first receiving cavity S1 may be formed with a preventing portion 41a, which may prevent the liquid to be cooled from flowing out of the cooling device 100a during the cooling process.

Upon actual use, the cup body 30a and the lid 40a may be together placed in the refrigerator for refrigeration, and the first refrigerant circuit 10a and the second refrigerant circuit 20a store the cold through the refrigerant. Then, when the liquid is to be cooled, the lid 40 is removed, the liquid to be cooled is placed in the first receiving cavity S1, the lid 40a is closed, and the first refrigerant circuit 10a and the second refrigerant circuit 20a jointly cool the liquid to be cooled. It may be appreciated that the cooling operation may also be performed with the lid 40a not being closed.

Referring to FIG. 3, it is a schematic view of a third specific embodiment. The third specific embodiment differs from the second specific embodiment in that a cup body 30b further comprises a third inner wall 34b, the third inner wall 34b is far away from the outer wall 31b relative to the second inner wall 33b, a second refrigerant circuit 20b is formed between the second inner wall 33b and the third inner wall 34b, the third inner wall 34b surrounds to form a second receiving cavity S2, and the second receiving cavity S2 is communicated with the first receiving cavity S1.

Here, the first receiving cavity S1 is communicated with the second receiving cavity S2 through a through hole passing through the second refrigerant circuit 20b, and both the first receiving cavity S1 and the second receiving cavity S2 may receive the liquid to be cooled. Certainly, the first receiving cavity S1 and the second receiving cavity S2 may also be spaced apart from each other, thereby adapting to different substances to be cooled.

To sum up, the cooling device of the present invention cools the liquid to be cooled in the first receiving cavity S1 via the first cooling portion 10 and the second cooling portion 20 simultaneously, without an additive being added, so that the cooling effect is substantially improved.

In addition, since the first cooling portion 10 and the second cooling portion 20 may reserve enough cold, a refrigeration duration of the cooling device 100 may be prolonged, and the first cooling portion 10 and the second cooling portion 20 may fully cool the liquid to be cooled with a better cooling effect. The cooling device 100 in the present embodiment is structurally simple and convenient to use and provides a good user experience.

The above embodiments are only intended to illustrate but not to limit the technical solutions of the present invention. Although the present invention is described in detail with reference to preferred embodiments, for example, if techniques in different embodiments are used in a superimposed manner to achieve corresponding effects simultaneously, their solutions also fall within the protection scope of the present invention. Those having ordinary skill in the art should understand that the technical solutions of the present invention may be modified or replaced equivalently, without departing from the spirit and scope of the technical solutions of the present invention.

Claims

1. A cooling device, wherein the cooling device comprises a first cooling portion, a second cooling portion, and a first receiving cavity sandwiched between the first cooling portion and the second cooling portion, where the first cooling portion is disposed around the second cooling portion, and the first cooling portion and the second cooling portion are distributed spaced-apart.

2. The cooling device according to claim 1, wherein the cooling device comprises a cup body, the cup body comprises an outer wall and a first inner wall in sequence from the outside to the inside, the first cooling portion is formed between the outer wall and the first inner wall, the second cooling portion is located in a cavity surrounded by the first inner wall, and the first receiving cavity is formed between the first inner wall and the second cooling portion.

3. The cooling device according to claim 2, wherein the cooling device further comprises a lid that fits with the cup body.

4. The cooling device according to claim 2, wherein the outer wall comprises an outer bottom wall and an outer peripheral wall disposed around the outer bottom wall, the first inner wall comprises a first bottom wall and a first peripheral wall disposed around the first bottom wall, a first gap is disposed between the outer bottom wall and the first bottom wall, a second gap is disposed between the outer peripheral wall and the first peripheral wall, and the first gap is communicated with the second gap.

5. The cooling device according to claim 4, wherein a gap exists between an outer surface of the second cooling portion and the first bottom wall and between the outer surface of the second cooling portion and the first peripheral wall.

6. The cooling device according to claim 2, wherein the first cooling portion is a first refrigerant circuit, and the second cooling portion is a semiconductor cooling portion.

7. The cooling device according to claim 6, wherein the cooling device further comprises a lid fitted with the cup body, and the semiconductor cooling portion is connected to the lid.

8. The cooling device according to claim 2, wherein the first cooling portion is a first refrigerant circuit, and the second cooling portion is a second refrigerant circuit.

9. The cooling device according to claim 8, wherein the cup body further comprises a second inner wall, the second inner wall is far away from the outer wall relative to the first inner wall, the first receiving cavity is formed between the first inner wall and the second inner wall, and the second inner wall surrounds to form the second refrigerant circuit.

10. The cooling device according to claim 9, wherein the cup body further comprises a third inner wall, the third inner wall is far away from the outer wall relative to the second inner wall, the second refrigerant circuit is formed between the second inner wall and the third inner wall, the third inner wall surrounds to form a second receiving cavity, and the second receiving cavity is communicated with the first receiving cavity.

11. The cooling device according to claim 3, wherein the first cooling portion is a first refrigerant circuit, and the second cooling portion is a semiconductor cooling portion.

12. The cooling device according to claim 4, wherein the first cooling portion is a first refrigerant circuit, and the second cooling portion is a semiconductor cooling portion.

13. The cooling device according to claim 5, wherein the first cooling portion is a first refrigerant circuit, and the second cooling portion is a semiconductor cooling portion.

14. The cooling device according to claim 3, wherein the first cooling portion is a first refrigerant circuit, and the second cooling portion is a second refrigerant circuit.

15. The cooling device according to claim 4, wherein the first cooling portion is a first refrigerant circuit, and the second cooling portion is a second refrigerant circuit.

16. The cooling device according to claim 5, wherein the first cooling portion is a first refrigerant circuit, and the second cooling portion is a second refrigerant circuit.