Automated Optical Measurement System To Determine Semiconductor Properties

Abstract

Described are devices and methods for measuring semiconductor materials, devices, circuits, and systems. The device includes a probe head that accepts multiple optical assemblies. At least one optical assembly provides a light source, and at least one optical assembly provides a detector. Both are coupled to the probe head. The optical assemblies may be manually or automatically adjustable using kinematic mounts, and may include optical fibers for conveying light to and from a sample. Each optical assembly may include a lens stack or an objective. Illumination and collection assemblies may share a common focal point, and different subsets of assemblies may share different focal points. The device may include a sample bed for imaging multiple samples at once, and may be coupled to a control system for automatically positioning the samples and/or the optical assemblies.

Description

BACKGROUND

Traditionally, semiconductors used for electronic and optoelectronic applications are optimized using a top-down engineering approach, wherein a single device is built, tested, and afterwards studied to determine where improvements in performance can be made. Oftentimes, more than one device is fabricated in order to obtain statistics or to compare different processing conditions. This common practice is time-intensive, inefficient, and expensive.

SUMMARY

Described herein is an automated, optical measurement system (or “tool”) for determining various properties of semiconductor samples. The tool is capable of handling multiple samples and concurrently or simultaneously measuring a broadband optical response of a photoactive layer, such as photoexcited carrier recombination rates and diffusion length. Unlike the known prior art, the tool described herein is a single instrument that allows a user to “plug and play” (i.e. freely substitute) their own light source (e.g. a laser) and detection systems (e.g. imaging sensors). The tool is capable of accurately predicting device performance by analyzing only half of the total layers in the completed device.

Also, this tool allows the user to evaluate materials to a performance limit (e.g. a maximum theoretical performance limit). Traditionally, materials are compared to reference or calibration devices, which can take a long time to fabricate. Theoretical limits, on the other hand, can provide users (e.g. researchers) an advantage in the materials and device optimization processes. It is noted that additional user experience in fabricating high-quality devices can provide helpful information and processing constraints that could facilitate even more efficient workflow.

Thus, one embodiment of the concepts, techniques, and systems described herein is a device for optically measuring properties of a semiconductor sample, the device comprising a probe head configured to accept a plurality of optical assemblies; one or more optical assemblies, each comprising a light source, coupled to the probe head and configured to direct light toward the sample; and one or more optical assemblies, each comprising a detector, coupled to the probe head and configured to detect light from the one or more light sources.

Some embodiments further include a sample bed for concurrently accepting multiple samples.

In some embodiments, the optical assemblies comprise a broadband optical light source and optics for detecting a response of a semiconductor.

In some embodiments, the optics for detecting a response of a semiconductor comprises optics for detecting a response of a semiconductor having a photoactive layer.

In some embodiments, the optical assemblies comprise a broadband light source and a detector configured to detect signals from the broadband light source.

In some embodiments, the optical assemblies comprise a monochromatic light source and a detector configured to detect signals from the monochromatic light source.

In some embodiments, the optical assemblies comprise a plurality of light sources and a detector that is configured to detect signals from multiple ones of the plurality of light sources.

In some embodiments, a number of light sources coupled to the probe head equals a number of detectors coupled to the probe head.

In some embodiments, each detector is configured to detect light from a corresponding one of the light sources.

Another embodiment is a probe head comprising means for concurrently making measurements of a semiconductor using one or more broadband light sources and one or more monochromatic light sources.

In some embodiments, at least one of the one or more monochromatic light sources is a laser light source.

Another embodiment is a measurement system comprising an interchangeable optical probe head configured to accept multiple sources and multiple detectors thereby allowing for concurrent measurements and imaging on multiple samples.

Some embodiments further include a processor configured to perform data management and/or a data analysis methodology applicable to any optically active material.

Another embodiment is a method of determining physical parameters of a semiconductor sample, the method comprising: accepting the semiconductor sample; concurrently exposing the semiconductor sample to a plurality of light sources; concurrently detecting light from the plurality of light sources; and determining a range of physical parameters of the semiconductor sample.

In some embodiments, accepting the semiconductor sample comprises accepting a plurality of partially completed semiconductors; and determining the range of physical parameters of the semiconductor sample comprises determining a range of physical parameters of the plurality of partially completed semiconductors.

The concepts, systems, devices and techniques described herein find utility in a variety of areas including, but not limited to: semiconducting materials used for solar cells, light-emitting diodes, integrated circuits, photodetectors, lasers, etc. It had been recognized that such semiconducting materials are traditionally difficult to optimize because performance losses depend on several factors. Pinpointing these factors typically requires multiple measurements over separate instruments, making the process time-intensive. The concepts, systems, devices and techniques are directed towards a large-area, automated characterization system (also sometimes referred to herein as an “automated tool” or more simply a “tool”) capable of performing several distinct measurements with the same mechanical configuration (i.e. the same setup) and extracting a range of physical parameters. In embodiments, such parameters may be provided as inputs to a system that predicts performance before completing the device. Overall, the concepts, systems, devices and techniques described herein save both time and cost and provides new physical insights that guide rational device optimization.

Accordingly, the system described herein, is a system capable of handling/measuring/analyzing one or more samples with less (and ideally minimal) human interaction compared with prior art systems. In embodiments, the tool is capable of concurrently handling/measuring/analyzing properties of multiple, different samples.

In embodiments, the samples may be semiconductor materials or devices (collectively referred to herein as a “semiconductors”). In embodiments, the tool may measure a series of specific properties (characteristics) of one or more semiconductors. The tool allows the measurements to be done concurrently on one or more semiconductor materials or devices. In embodiments, the measured properties of the one or more semiconductor materials or devices may be used as inputs into models used to estimate or predict performance limits (e.g. theoretical performance limits) of the one or more semiconductor materials or devices. In embodiments, the one or more semiconductor materials or devices may include, but are not limited to, solar cells, light-emitting diodes, integrated circuits, photodetectors, lasers, to name but a few examples.

In embodiments, the tool allows the measurements to be done concurrently on one or more partially completed semiconductor materials or devices. In embodiments, the measured properties of the partially completed semiconductor materials or devices may be used as inputs into device models(e.g. detailed-balance device models) which may estimate or predict performance limits (e.g. theoretical performance limits) of a completed semiconductor material or device. In embodiments, the completed one or more semiconductor materials or devices may be include, but are not limited to: solar cells, light-emitting diodes, integrated circuits, photodetectors, lasers, to name but a few examples.

In embodiments, the tool is capable of making multiple measurements at different points in time (or at different portions of one or more fabrication steps) throughout a device fabrication process.

In embodiments, the tool comprises a multimodal probe head design which allows the tool to concurrently (or in some cases simultaneously) measure with both broadband as well as monochromatic (i.e. laser) sources with. Concurrent and/or simultaneous measurement allows for rapid acquisition of data sets (which may be relatively large) used to identify performance-limiting regions. In embodiments, the multimodal probe head may be guided by machine vision. A controller coupled to the multimodal probe head coupled with machine vision allows the tool to be automated. The tool may thus result in a significant reduction in the user time incurred for traditional measurements. The tool has a modular design where external light-sources or detection systems available to a user can be easily integrated with the tool, providing both versatility and cost-savings. Light sources, detectors, and timing electronics can comprise >90% of the total instrument cost. The system described herein allows the user to “plug-and-play” with light sources and/or detectors including existing commercially available light sources and/or detectors

Embodiments of the tool may be used at least for the following, illustrative purposes: (A) Bulk Performance Measurements; (B) Bulk Stability Measurements; and (C) Imaging Measurements.

Bulk Performance Measurements may include: (A1) automated acquisition of single measurements including transmittance, reflectance, steady-state photoluminescence, and time-resolved photoluminescence on a single or multiple samples; and (A2) automated acquisition of simultaneous and sequential measurements of transmittance, reflectance, steady-state photoluminescence, and time-resolved photoluminescence paired with data analysis to extract material recombination rate constants, interfacial recombination rates, surface recombination velocities, diffusion lengths, quantities related to the dielectric function (i.e. absorption coefficient), and sample thickness; which are then used as inputs into theoretical device models for a single or multiple samples.

Bulk Stability Measurements may include: (B1) in-situ monitoring of light or thermal induced degradation; (B2) monitoring of chemical and structural changes with optical probes over extended periods of time (i.e. months).

Imaging Measurements may include: (C1) the probe head (described in further detail hereinbelow) can be equipped with imaging optics (i.e. an objective) to perform both macro and microscopic measurements including photoluminescence, electroluminescence, and light-beam induced current (LBIC) imaging. Defects from processing and poor interlayer contacts can be quickly identified, isolated, and optimized.

The tool described herein may have an interchangeable optical probe head allowing for simultaneous measurements and imaging on multiple samples. The tool's design is modular allowing users to integrate their own light sources and detectors into the setup which, in some cases, can reduce (and in some cases significantly reduce) the total system cost. By contrast, known commercial instruments for performing common physical measurements can only measure one sample at a time.

In embodiments, the tool comprises a processor configured to perform data management and/or a data analysis methodology that is broadly applicable to any optically active material.

The first demonstrations of this tool have revealed several unexpected results. For example, in embodiments, a solar cell's performance can be predicted by depositing and measuring only 3 of 6 total layers, saving >60% of the typical time to complete a full device. In embodiments, using the automated tool described herein, it is found that a user may, on average, save 8 minutes of instrument interaction time per sample. For a common solar cell device batch of 16 samples, this equates to approximately 2 hours of time savings for the user.

This Summary is provided to introduce a selection of concepts in simplified form that are further described below in the Detailed Description. This Summary is not intended to identify key or essential features or combinations of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter.

BRIEF DESCRIPTION OF THE DRAWINGS

The foregoing and other objects, features and advantages will be apparent from the following more particular description of the embodiments, as illustrated in the accompanying drawings in which like reference characters refer to the same parts throughout the different views. The drawings are not necessarily to scale, emphasis instead being placed upon illustrating the principles of the embodiments.

FIG. 1 is a block diagram of a system for characterizing a semiconductor and capable of measuring multiple semiconductor parameters (simultaneously if necessary) with different light sources and detectors;

FIG. 2A is a front isometric view of a system for characterizing a semiconductor and capable of simultaneously measuring multiple semiconductor parameters;

FIG. 2B is a rear isometric view of a system for characterizing a semiconductor and capable of simultaneously measuring multiple semiconductor parameters;

FIG. 3A is a rear isometric view of a system for characterizing a semiconductor and capable of simultaneously measuring multiple semiconductor parameters illustrating a probe head and optic assembly locations;

FIG. 3B is an enlarged view of the probe head and optic assemblies of FIG. 3A with an example of a signal collection geometry with one light source and two detecting systems;

FIG. 4 is a partially exploded view of a pair of optical assemblies disposed over a probe head;

FIG. 5 is an isometric view of a probe head;

FIG. 6 is an isometric view of three optical assemblies disposed over a probe head;

FIG. 7A is an enlarged view of an optical assembly;

FIG. 7B is an isometric view of the optical assembly of FIG. 7A having a light shield thereof removed to reveal a kinematic coupling;

FIG. 8 is an isometric view illustrating an alternate embodiment of a probe head design;

FIG. 9 is a top view of four optical assemblies disposed over a probe head;

FIG. 10A is a top view of a probe head embodiment configured to hold three optical assemblies;

FIG. 10B is a top view of a probe head embodiment configured to hold eight optical assemblies;

FIG. 11A is an isometric view illustrating an alternate embodiment of a probe head and optical assembly design with the optical assembly having a different mounting scheme for the kinematic mount and an objective assembly having a lens stack (e.g. as illustrated in FIG. 4) replaced with an objective;

FIG. 11B is an isometric view illustrating that an objective can be used to direct light to and from the sample in replacement of the lens stack;

FIG. 12A is an isometric view of a system having a probe head with an adjustable portion configured to accept a lens stack or an objective of an optical assembly;

FIG. 12B is a cartoon side view of FIG. 12A illustrating an effect of adjusting the optical assembly;

FIG. 13A is an isometric view of a system in which focal points of the source and collection optics are aligned (i.e. directed toward a single focal point);

FIG. 13B is an isometric view of a system in which focal points of the source and collection optics are purposely displaced (i.e. the system has multiple focal points);

FIG. 14 is a top view of an alternate embodiment of a probe head in which collection optics and illumination optics are oriented such that their positions on the probe head can be independently changed;

FIG. 15 is a side view of an alternate embodiment of a probe head in which at least portions of the optical assembly are perpendicular to the sample;

FIG. 16 is a side view of an alternate embodiment of a system in which electrical contacts are disposed on a probe head;

FIG. 17 illustrates solar cells in various stages of processing that can be measured to probe their intrinsic, interfacial, and extrinsic factors leading to energy loss in the device or which otherwise impact device performance;

FIG. 18 is a plot of user instrument interaction time vs. number of samples for a typical collection of photoluminescence data from a semiconductor;

FIG. 19A is a plot of transmittance and reflectance vs. wavelength used to calculate an absorptivity spectrum of a sample;

FIG. 19B is a plot of absorptivity vs. wavelength computed using the transmittance and reflectance values in FIG. 19A;

FIG. 20A is a plot of steady state photoluminescence (PL) vs. wavelength and b) time-resolved PL decay trace obtained by using different configurations of an embodiment;

FIG. 20B is a plot of time-resolved photoluminescence (PL) vs. time;

FIG. 21A is a plot of photoluminescence (PL) intensity vs. time using various configurations of an embodiment;

FIG. 21B is a reduced Chi-squared surface plot (i.e. error) with a circle marking a global minimum; and

FIG. 22 is a flowchart of a method of determining physical parameters of a semiconductor sample according to an embodiment.

DETAILED DESCRIPTION

Referring now to FIG. 1, a system for characterizing a sample (e.g. semiconductor) and capable of measuring multiple sample (e.g. semiconductor) parameters (simultaneously, if necessary) includes a probe head configured to accept multiple different optical assemblies, each of which may include one or more light sources and one or more detectors. Sources may include, but are not limited to, two or more of: photoluminescence (PL) sources, electroluminescence (EL) sources, laser beam induced current (LBIC) sources and light emitting diode (LED) source. Other light sources may, of course, also be used. The particular combination of light sources to use in any application depends upon a variety of factors including, but not limited to, the type of sample being measured.

One or more detectors, capable of detecting signals from the sources are disposed to detect the signals. The detected signals (which may be raw data or data processed by the detectors) are provided to a performance metrics processor (not shown) which computes or otherwise determines performance metrics. A control system is coupled to the various components to coordinate operation of the various components. In particular, a motion controller controls motion of a platform on which a semiconductor under test may be disposed. The motion controller may implement motion logic via a processor that is the same or a different processor as the performance metrics processor.

Referring now to FIGS. 2A and 2B, a system for characterizing a semiconductor includes a frame, a transport assembly, and a probe head coupled to one or more optical assemblies. In embodiments, the probe head may be coupled to the frame and the one or more optical assemblies may be coupled to the probe head (as shown in more detail in subsequent Figures). In embodiments, the one or more optical assemblies may be coupled to the frame and to the probe head. In embodiments, both the one or more optical assemblies and the probe head may be coupled to the frame. The optical transport assembly comprises a platform configured to accepts one or more samples (e.g. one or more semiconductors) and move the one or more samples to a position at which the probe head/optical assembly may measure the one or more samples. A motion controller (which may implement motion logic via a processor) controls motion of the platform on which one or more samples under test may be disposed.

An advantage of the tool's design is its flexibility and the range of equipment with which it can be paired. The three subcomponents of the tool—the light source, probe head, and detection equipment—are each designed for modularity. Further explanation of the modularity of these systems and the process flow is described below, starting from the light source, to the optical fiber, to the probe head, to signal collection through another optical fiber, and finally to the detection equipment.

The light source can vary depending on the tool's application and multiple light sources can be used simultaneously. For example, a monochromatic light source, such as a laser, could be used alongside a broadband light source such as a xenon arc, tungsten, or metal halide lamp. Any of these light sources could also be used independently if desired. The flexibility in light source and detector selection is coordinated with control software and accompanying microelectronics. Thus, the optical assemblies may comprise a plurality of light sources and a detector that is configured to detect signals from multiple ones of the plurality of light sources. Alternately, a number of light sources coupled to the probe head may equal a number of detectors coupled to the probe head, and each detector is configured to detect light from a corresponding one of the light sources.

Referring now to FIGS. 3A and 3B, shown is an embodiment of the tool that employs a single set of illumination optics and multiple collection optics. Threaded mounts are placed in axial symmetry along a focal plane below the probe head center. As such, illumination and detection optics are placed equidistantly at complementary angles so that each optical configuration shares the same focal point (as also shown in FIG. 13A and discussed below). This focal point is just below the base of the probe head in order to avoid collision with the sample, while still shielding external light that would impact the signal-to-noise ratio. This configuration allows for collection of reflected light as well as emission.

Other embodiments of this tool can collect sample signals at oblique angles to quantify light directionality (as also shown in FIGS. 12A-12B and discussed below). These data can be filtered spatially or spectrally to avoid signal cross-talk along different points of the optical train. The incorporation of multiple mounting points for illumination and collection optics (as shown in FIG. 5 and discussed below) gives the tool the capability of collecting a combination of data simultaneously. This not only increases throughput, it also allows for the application of device models that can process multiple data types.

The probe head also interfaces with the motion systems of the tool. The probe head is capable of translation in all three Cartesian axes (i.e. x, y, and z). This motion may be guided by a control processor which may, for example, execute control software, which can detect sample locations and direct the probe head to each sample autonomously, using techniques known in the art. This allows the tool to analyze multiple points on a single sample, or multiple samples, in a single run. As a result, the tool may be used to reduce the user-time required compared to traditional methods (as shown in FIG. 18 and discussed below).

Thus, in FIGS. 2A-3B is shown a device for optically measuring properties of a semiconductor sample. The device includes a probe head configured to accept a plurality of optical assemblies. The device also includes one or more optical assemblies, each comprising a light source, coupled to the probe head and configured to direct light toward the semiconductor sample. And the device includes one or more optical assemblies, each comprising a detector, coupled to the probe head and configured to detect light from the one or more light sources. The device includes a sample bed for concurrently accepting multiple samples.

As may be seen in FIG. 4 (and FIGS. 7A, 7B, 11A, 11B, and 12A discussed below), the light source may be coupled to the probe head via an optical fiber such that light may be transmitted from the light source to the probe head via the optical fiber. The optical fiber is selected based on characteristics such as appropriate signal attenuation, spectral window, and permitted optical modes depending on the measurement type. This modularity further contributes to the overall flexibility of the tool since light sources and detection equipment can be freely substituted. As a result, these external components can remain a part of other optical systems and still be utilized for this tool when needed.

As the light source enters the probe head, it is adjusted and focused to meet the needs of the application. The specific adjustment/focusing/tuning needs vary for each application based upon the light source, sample, and characterization tests being performed. The probe head accounts for the range of tuning needs through the implementation of a modular optics mounting strategy. In embodiments, the optics may utilize industry-standard threads for easy interchangeability while remaining compatible with the threaded mounts placed on the base of the probe head. This allows for a variety of optical components such as lenses, lens tubes, and light filters to be placed between the input optical fiber and the sample. The modularity of optical components also applies to the collection optics which collect and filter the signal from the sample and relay it through an output optical fiber.

The output optical fiber can carry the signal to a variety of detection systems. These systems are necessary intermediaries that allow signal from the sample to be collected and transformed into meaningful data. The detection systems could include a single photon avalanche photodiode (SP-APD), a photo-multiplier tube (PMT), a charged coupled device (CCD), and/or an oscilloscope. Modular software design allows for code wrappers to be integrated into the tool's main software that are capable of translating and controlling detection equipment through their native software library. As a result, the characterization tool can be made compatible with a wide range of detection equipment models and manufacturers.

Referring now to FIG. 4, a probe head has an illumination optical assembly (or more simply “illumination optics”) and a collection optical assembly (or more simply “collection optics”) coupled thereto. It is appreciated that the probe head shown in FIG. 4 may accept more than just these two assemblies, and that embodiments of the probe head may be configured to accept other numbers of assemblies (e.g. as shown in FIGS. 9, 10A, and 10B described below). In the illustrative embodiment of FIG. 4, the probe head is provided having six (6) couplings, only three of which are visible and only two of which are used.

The illumination optics comprise a kinematic mount coupled to a kinematic mount coupling, and a lens stack coupled to the kinematic mount. The optical fiber (which is not properly considered a part of the illumination optics) has a first end configured to be coupled to a light source (not shown) and a second end configured to be coupled to the kinematic mount via a fiber adapter. In embodiments, the kinematic mount is coupled to the kinematic mount coupling and a first end of the lens stack is coupled to the kinematic mount and in optical communication with the optical fiber. A second end of the lens stack is coupled to the probe head and disposed over an aperture provided in the probe head such that an optical signal path extends from the light source, through the aperture and optical fiber, to contact the sample (not shown).

It should be noted that all parts aside from the kinematic mount coupling and probe head may be provided as off-the-shelf components. This facilitates interchangeability and use of optical components that laboratories and other entities are likely to already have on hand.

As will be described in further detail below in conjunction with FIGS. 5-16, the kinematic mount coupling and probe head are custom designed components that are integral to the functionality of the system.

Referring to FIG. 5, the multimodal probe head (sometimes referred to herein as an optical probe head) serves as a mobile and modular mounting point for optical components (e.g. the optical assembly) necessary to perform characterization tests. As noted above, optical fibers are used to carry light signals both in and out of the probe head. This allows for a system in which the light source and detection equipment can be placed outside of the tool-leaving them accessible and offering modularity.

In embodiments, the probe head may be directly connected to one or more linear motion elements and can be positioned with respect to a sample for testing. Various adaptations can be made to the probe head to introduce further features and functionality. It is important to note that, in embodiments, the probe head is designed and configured to facilitate replacement (i.e. one probe head may be rapidly replaced by another probe head). This allows users to reduce the amount of setup time between various optical configurations by simply attaching a pre-aligned probe head if desired. In this example embodiment, the probe head comprises a mounting structure configured to couple to rails provided in a measurement system such as one of the systems described above in conjunction with FIGS. 1-3B.

Referring now to FIG. 6, a probe assembly is comprised of a probe head and optics for both illumination and collection. The purpose of this assembly is to position the optics relative to a sample while allowing for localized optical tuning (via filters and lenses) and adjustment for optical alignment at the desired focal point.

The illumination optics (also sometimes referred to as an “illumination optical assembly”) receives light from a light source via an optical fiber and directs the light toward a sample and a pair of collection optical assemblies (also sometimes referred to as “detection optical assemblies”) comprising collection optics disposed to collect light reflected or otherwise re-directed from the sample. Thus, in embodiments, it is desirable that the focal point of the detection optics be at or near the focal point of the input optical assembly.

Referring now to FIGS. 7A and 7B, after input and output optical fibers have been attached to the probe head and optical assemblies, a variety of off-the-shelf optical components can be used to customize the tuning and filtering of the light directed at a sample and the resulting signal. In order to ensure alignment in and out of each optical fiber, the system includes a kinematic mount assembly (also sometimes referred to as a kinematic mount adapter) comprising a kinematic mount coupling. In ordinary operation, a light shield may be provided to exclude external light sources from the inner workings of the optical assembly. The light shield is shown in FIG. 7A, and removed in FIG. 7B to reveal the kinematic mount coupling

In embodiments, the kinematic mount adapter threads directly to the optics configuration connected to the probe head. A kinematic mount in which the fiber port is attached is then fixed to the coupling with clearance for adjustment of the fiber. The kinematic mount is attached in such a manner that the optical fiber can be adjusted for tip, tilt, pitch, yaw, and both x-and y-directions independently from the fixed optical components that are attached directly to the probe head body. This may be important for calibrating optics and correcting for manufacturing inaccuracies.

Other embodiments of the tool include an electronically actuated fiber mounting system that automatically adjusts the alignment in all six degrees of freedom. Optical fiber alignment thumbscrews can be actuated with positioning motors. This allows an autonomous calibration sequence to get proper optical alignment, and testing in which the focal point of the source or collection optics is dynamically changed. This permits analyzing localized response of a sample as a function of distance from the source focal point. Multiple illumination and detection optics configurations can also be used at once.

Referring now to FIG. 8, shown is an isometric view illustrating an alternate embodiment of a probe head design. In this embodiment, probe head positioning elements are decoupled from the probe head itself through a “hanging” mounting fixture. Also, the probe head is free of linear motion elements (no mounting features for guide rods or bearings). Aside from creating a more conducive volume for an alternative embodiment, this probe head design also allows for probe heads to be “hot swapped”. The probe head is attached with a simple bolted connection that can be unscrewed so a different probe head can be put in place. This offers flexibility to integrate the other potential embodiments shown in later Figures, and also allows users to have pre-configured probe heads (i.e. having different optical assemblies in useful combinations) that can be swapped in if needed.

Thus, in FIG. 8 is shown a measurement system comprising an interchangeable optical probe head configured to accept multiple sources and multiple detectors thereby allowing for concurrent measurements and imaging on multiple samples. The measurement system may be coupled to a processor configured to perform data management and/or a data analysis methodology applicable to any optically active material, as described above.

Referring now to FIG. 9, shown is a top view of four optical assemblies disposed over a probe head. FIG. 9 illustrates four (4) optics mounting points. As illustrated by FIGS. 10A, 10B below, the number of optical assemblies which can be accepted by a probe head can increase or decrease to accommodate the desired number of illumination and collection optics needed for particular applications. The only limitation is physical (Le. available volume in which to mount the components, and working distances required by the optics). It should of course, be appreciated that not all mounting points need to be occupied for operation. Illustratively, FIG. 10A is a top view of a probe head embodiment configured to hold three optical assemblies and FIG. 10B is a top view of a probe head embodiment configured to hold eight optical assemblies.

FIG. 11A is an isometric view illustrating an alternate embodiment of a probe head and optical assembly design with the optical assembly having a different mounting scheme for the kinematic mount, and an objective assembly having its lens stacks (e.g. as illustrated in FIG. 4) replaced with individual objectives. This embodiment comprises spacer blocks which couple the kinematic mount to the probe head, of which only one is identified in FIG. 11A. Their geometry determines the distance from the objective to the sample. This component could be made adjustable or motorized as shown in other embodiments that include the kinematic mount coupling. A kinematic mount may be the same as, or similar to, that described in conjunction with above embodiments, but now serves as the sole mounting point for both the optical fiber and objective. An objective may be used in place of the lens stack (as described in some embodiments above). An objective could also be used in the previous embodiments.

In this example embodiment, the probe head comprises a dome shape. This allows for a mounting scheme in which the kinematic mount serves as the sole mounting point for both the objective (or lens stack) and optical fiber.

Thus, the embodiment of FIG. 11A illustrates a different mounting scheme for the kinematic mount. It also shows the lens stack replaced with an objective. These changes allow the kinematic mount to be the only attachment point for both the objective and optical fiber. As a result, the optical fiber is in a fixed position relative to the objective and the whole assembly is adjusted via the kinematic mount. It should also be noted the kinematic mount coupling is no longer needed in this design and has been replaced by the spacer blocks (green) which serve to set the distance from the objective to the focal point on the sample to within the working distance of the objective.

Referring now to FIG. 11B, as a follow up to FIG. 11A, an objective can be used to direct light to and from the sample in replacement of the lens stack. The ability to use an objective will be important for giving the characterization tool imaging capability. As such, objectives may be used quite frequently when the tool is deployed into research and industry applications. Thus, an objective may be used in place of a lens stack and mounted directly onto the kinematic mount in the configuration shown.

Referring now to FIG. 12A, shown is a probe head having an adjustable portion configured to accept a lens stack or an objective of an optical assembly. Adjustment allows the incident angle of the optics to be modified to a user's needs. This embodiment illustrates the potential for angular adjustment of the optics at the probe head mounting point. The angle at which the lens stack mounts to the probe head can be varied, and this angle may be configurable using built-in adjustment features on the probe head.

Referring now to FIG. 12B, shown is a cartoon side view of FIG. 12A illustrating an effect of adjusting the optical assembly. As noted above, adjustment would allow for incident angle of the optics to be determined by the user.

Referring now to FIG. 13A, shown is a system in which focal points of the source optics (left) and collection optics (top and right) are aligned, i.e. directed toward a single focal point. It should, of course, be appreciated that focal points of the optics do not necessarily need to be aligned. In alternate embodiments the focal point of the source and collection optics could be purposely displaced to measure sample response as a function of distance from the source focal point.

Referring now to FIG. 13B, shown is a system in which focal points of the source and collection optics are purposely be displaced. In embodiments, multiple focal points may be achieved by adjusting at the kinematic mount or at the lens stack mounting point on the probe head. It is noted that the modularity of the probe head design permits subsets of illumination and collection optics mounted on a single probe head to share the same focal point while other subsets share a different focal point. Thus, a probe head can accommodate multiple focal points shared by different source and collection optics that are analyzed simultaneously.

Referring now to FIG. 14, shown is an embodiment of a probe head in which collection optics and illumination optics are oriented such that their position on the probe head can be changed. Multiple focal points could also be achieved with a probe head as shown in FIG. 14. In this instance, the collection optics and illumination optics are oriented such that their position on the probe head can be changed. This translation can be delivered either manually or autonomously via motorized linear guides. The optics may have independent linear travel built into the probe head.

Referring now to FIG. 15, shown is an embodiment of a probe head in which at least portions of the optical assembly are perpendicular to the sample. In this embodiment, the illumination source and collected signal would be carried through the same objective or lens stack. The collected signal would need to be optically filtered and potentially segregated via a beam splitter. This orientation would be particularly useful for imaging samples and could be used alongside other optics mounted to the probe head such as those shown in angled orientations in previous Figures.

Referring now to FIG. 16, shown is a side view of an alternate embodiment of a system in which electrical contacts are disposed on a probe head. The integration of electrical contacts on the probe head allows for a current to be passed through a sample at specific points, thus for the analysis of a sample's electroluminescence, and could be paired with embodiments from previous Figures to enable electroluminescence imaging. A spring plunger mechanism (or other similar feature) ensures physical contact is made with the sample without damaging the electrical contacts or sample. Electrical contacts may be mated to the surface of the sample, and a current applied. The resulting light emitted by the sample can then be analyzed with the typical optics shown in previous Figures.

Referring now to FIG. 17, shown is an example of different stages in the assembly process for a solar cell, which involves deposition of a photoactive layer on top of an electronically insulating piece of glass, then subsequent deposition of an electron or hole (p-type) transport layer (ETL and HTL, respectively), and finally the deposition of the metal contact to complete the device. Each stage of assembly may provide a sample for separate evaluation by the tool to understand the bulk energy losses within the semiconducting layer, at the charge transport layer/photoactive layer interfaces, as well as through parasitic absorption (due to poor reflectivity) at the back metal contact. It is appreciated that devices other than solar cells are constructed according to similar processes, and thus may be analyzed by the tool at each stage in a similar manner.

In embodiments, the system may include software which may reduce the amount of human interaction typically required to perform a set of measurements as well as reduce the tool's manufacturing cost. Using machine vision, the software may identify samples and suggest collection points, which can be manually approved or automatically executed.

FIG. 18 is a plot of user instrument interaction time vs. number of samples that compares manual sampling and data collection known in the art to automated sampling and collection in accordance with an embodiment. Prior commercially available instruments are logistically time intensive and require loading and unloading multiple samples, setting data acquisition parameters, optical alignment, and additional software interaction. For example, based on a user survey in our research lab, collecting time-resolved photoluminescence data for one sample typically takes about 8 minutes of user-instrument interfacing time, which scales linearly with the number of samples as shown in FIG. 18. Thus, collecting data for 20 samples requires about 160 minutes. By contrast, the automated tool described herein only requires an upfront interface time of 4 minutes, and sampling may be completed within about 1 minute. Paired with the tool, software thus reduces user interaction time and simplifies the labor required to loading samples once, then initiating data collection.

The modular design of embodiments allows for multiple light source and detector configurations. For example, a broadband light source may be used to collect spectrally dependent information with regards to the photoactive layers. Different embodiments involve the broadband light source passing through a spectral filter (i.e. diffraction grating) before or after interacting with the sample.

FIG. 19A shows example data sets of transmission and reflection spectra, collected with optical components of the tool, which are measured signals that determine the response of a semiconductor having a photoactive layer. These measurements can be used to determine the extinction coefficient, absorbance, and absorptivity of the sample. FIG. 19B shows the calculated absorptivity spectrum, a(E), using the relation

$\begin{array}{cc}a\left(E\right)=1-\frac{T\left(E\right)}{1-R\left(E\right)}& \left(1\right)\end{array}$

where T(E) is the transmittance and R(E) is the reflectance, all as a function of energy E. We note that the absorptivity spectrum is often a critical parameter used in optoelectronic device modeling.

By contrast, a monochromatic light source, such as a laser that operates in continuous wave (CW) or pulsed mode, may be used to measure steady-state and time-resolved photoluminescence as well as the thickness of samples. FIG. 20A shows an example data set of a photoluminescence spectrum collected using one configuration of the tool with a CW laser light source for photoexcitation and a linear charge-coupled device (CCD) with a diffraction grating as a detection system. FIG. 20B shows a time-resolved photoluminescence decay trace using a pulsed diode laser as an excitation source and an avalanche photodiode (APD) paired with a time-correlated single photon counter as the detection system.

It is significant to note that the two data sets in FIGS. 19A-20B are typically collected on separate instruments. However, in accordance with the concepts, techniques, and systems described herein, these data sets may be collected using a single probe head to which multiple illumination optical assemblies (e.g. providing a broadband light source and a CW laser light source) and multiple collection optical assemblies (e.g. collecting spectrally dependent data and photon counts) are simultaneously coupled. If these optical assemblies share a focal point, then these data may be further spatially and/or temporally correlated to a high precision, unlike prior art systems. Thus, the probe head includes means for concurrently making measurements of a semiconductor using one or more broadband light sources and one or more monochromatic light sources (e.g. a laser light source).

In addition to the single data sets that can all be measured with this one tool, multiple data sets can be collected simultaneously or sequentially to obtain inputs into theoretical device models. For example, semiconductor recombination rate constants such as k₁, k₂^ext, and k₃ which correspond to non-radiative, first-order (i.e. Shockley-Read-Hall) effects; the external radiative, second order (i.e. bimolecular) effects; and non-radiative, third-order (i.e. Auger) effects can be measured with intensity-dependent, time-resolved PL or quantum efficiency measurements (shown in FIGS. 21A and 21B respectively). These values, along with the absorptivity spectrum and the film thickness, can be used as inputs into a detailed balance device model.

In FIG. 22 is shown a flowchart of a method of determining physical parameters of a semiconductor sample according to an embodiment. The method begins with accepting the sample into a measurement device, such as the device shown in FIGS. 2A-3B above. In particular the sample may be placed onto a sample bed.

The method continues with concurrently exposing the semiconductor sample to a plurality of light sources. The light sources may be, illustratively, broadband or monochromatic light sources as described above in connection with FIG. 19A-20B, and exposure may be performed using optics and optical assemblies as described in any of the above embodiments.

The method proceeds with concurrently detecting light from the plurality of sources. Detecting may be performed using optical assemblies and detectors as described in any of the above embodiments.

Finally, the method concludes with determining a range of physical parameters of the semiconductor sample. This latter determining process may be accomplished using hardware, or a combination of hardware or software, that is integral with or coupled to the measurement device, using data analysis techniques known in the art that are applied to the detected light.

As described above in connection with FIG. 17, the semiconductor sample may comprise a plurality of partially completed semiconductors. In particular, the partially completed material or device may be a solar cell, a light-emitting diode, an integrated circuit, a photodetector, or a laser, among others that are known to persons having ordinary skill in the art. Thus, the method may include accepting a plurality of partially completed semiconductors, and determining the range of physical parameters for each such partially completed semiconductor.

Various embodiments of the concepts, systems, devices, structures and techniques sought to be protected are described herein with reference to the related drawings. Alternative embodiments can be devised without departing from the scope of the concepts, systems, devices, structures and techniques described herein. It is noted that various connections and positional relationships (e.g., over, below, adjacent, etc.) are set forth between elements in the following description and in the drawings. These connections and/or positional relationships, unless specified otherwise, can be direct or indirect, and the described concepts, systems, devices, structures and techniques are not intended to be limiting in this respect. Accordingly, a coupling of entities can refer to either a direct or an indirect coupling, and a positional relationship between entities can be a direct or indirect positional relationship.

As an example of an indirect positional relationship, references in the present description to forming layer “A” over layer “B” include situations in which one or more intermediate layers (e.g., layer “C”) is between layer “A” and layer “B” as long as the relevant characteristics and functionalities of layer “A” and layer “B” are not substantially changed by the intermediate layer(s).The following definitions and abbreviations are to be used for the interpretation of the claims and the specification. As used herein, the terms “comprises,” “comprising, “includes,” “including,” “has,” “having,” “contains” or “containing,” or any other variation thereof, are intended to cover a non-exclusive inclusion. For example, a composition, a mixture, process, method, article, or apparatus that comprises a list of elements is not necessarily limited to only those elements but can include other elements not expressly listed or inherent to such composition, mixture, process, method, article, or apparatus.

Additionally, the term “exemplary” is used herein to mean “serving as an example, instance, or illustration. Any embodiment or design described herein as “exemplary” is not necessarily to be construed as preferred or advantageous over other embodiments or designs. The terms “one or more” and “one or more” are understood to include any integer number greater than or equal to one, i.e. one, two, three, four, etc. The terms “a plurality” are understood to include any integer number greater than or equal to two, i.e. two, three, four, five, etc. The term “connection” can include an indirect “connection” and a direct “connection”.

References in the specification to “one embodiment, “an embodiment,” “an example embodiment,” etc., indicate that the embodiment described can include a particular feature, structure, or characteristic, but every embodiment can include the particular feature, structure, or characteristic. Moreover, such phrases are not necessarily referring to the same embodiment. Further, when a particular feature, structure, or characteristic is described in connection with an embodiment, it is submitted that it is within the knowledge of one skilled in the art to affect such feature, structure, or characteristic in connection with other embodiments whether or not explicitly described.

For purposes of the description herein, terms such as “upper,” “lower,” “right,” “left,” “vertical,” “horizontal, “top,” “bottom,” (to name but a few examples) and derivatives thereof shall relate to the described structures and methods, as oriented in the drawing figures. The terms “overlying,” “atop,” “on top, “positioned on” or “positioned atop” mean that a first element, such as a first structure, is present on a second element, such as a second structure, where intervening elements such as an interface structure can be present between the first element and the second element. The term “direct contact” means that a first element, such as a first structure, and a second element, such as a second structure, are connected without any intermediary elements. Such terms are sometimes referred to as directional or positional terms.

Use of ordinal terms such as “first,” “second,” “third,” etc., in the claims to modify a claim element does not by itself connote any priority, precedence, or order of one claim element over another or the temporal order in which acts of a method are performed, but are used merely as labels to distinguish one claim element having a certain name from another element having a same name (but for use of the ordinal term) to distinguish the claim elements.

The terms “approximately” and “about” may be used to mean within ±20% of a target value in some embodiments, within ±10% of a target value in some embodiments, within ±5% of a target value in some embodiments, and yet within ±2% of a target value in some embodiments. The terms “approximately” and “about” may include the target value. The term “substantially equal” may be used to refer to values that are within ±20% of one another in some embodiments, within ±10% of one another in some embodiments, within ±5% of one another in some embodiments, and yet within ±2% of one another in some embodiments.

The term “substantially” may be used to refer to values that are within ±20% of a comparative measure in some embodiments, within ±10% in some embodiments, within ±5% in some embodiments, and yet within ±2% in some embodiments. For example, a first direction that is “substantially” perpendicular to a second direction may refer to a first direction that is within ±20% of making a 90° angle with the second direction in some embodiments, within ±10% of making a 90° angle with the second direction in some embodiments, within ±5% of making a 90° angle with the second direction in some embodiments, and yet within ±2% of making a 90° angle with the second direction in some embodiments.

It is to be understood that the disclosed subject matter is not limited in its application to the details of construction and to the arrangements of the components set forth in the following description or illustrated in the drawings. The disclosed subject matter is capable of other embodiments and of being practiced and carried out in various ways.

Also, it is to be understood that the phraseology and terminology employed herein are for the purpose of description and should not be regarded as limiting. As such, those skilled in the art will appreciate that the conception, upon which this disclosure is based, may readily be utilized as a basis for the designing of other structures, methods, and systems for carrying out the several purposes of the disclosed subject matter. Therefore, the claims should be regarded as including such equivalent constructions insofar as they do not depart from the spirit and scope of the disclosed subject matter.

Although the disclosed subject matter has been described and illustrated in the foregoing exemplary embodiments, it is understood that the present disclosure has been made only by way of example, and that numerous changes in the details of implementation of the disclosed subject matter may be made without departing from the spirit and scope of the disclosed subject matter.

Claims

1. A device for optically measuring properties of a semiconductor sample, the device comprising:

a probe head configured to accept a plurality of optical assemblies;

one or more optical assemblies, each comprising a light source, coupled to the probe head and configured to direct light toward the semiconductor sample; and

one or more optical assemblies, each comprising a detector, coupled to the probe head and configured to detect light from the one or more light sources.

2. The device of claim 1 further comprising a sample bed for concurrently accepting multiple samples.

3. The device of claim 1 wherein the optical assemblies comprise a broadband optical light source and optics for detecting a response of a semiconductor.

4. The device of claim 3 wherein the optics for detecting a response of a semiconductor comprises optics for detecting a response of a semiconductor having a photoactive layer.

5. The device of claim 1 wherein the optical assemblies comprise a broadband light source and a detector configured to detect signals from the broadband light source.

6. The device of claim 1 wherein the optical assemblies comprise a monochromatic light source and a detector configured to detect signals from the monochromatic light source.

7. The device of claim 1 wherein the optical assemblies comprise a plurality of light sources and a detector that is configured to detect signals from multiple ones of the plurality of light sources.

8. The device of claim 1 wherein a number of light sources coupled to the probe head equals a number of detectors coupled to the probe head.

9. The device of claim 8 wherein each detector is configured to detect light from a corresponding one of the light sources.

10. A probe head comprising means for concurrently making measurements of a semiconductor using one or more broadband light sources and one or more monochromatic light sources.

11. The probe head of claim 10 wherein at least one of the one or more monochromatic light sources is a laser light source.

12. A measurement system comprising an interchangeable optical probe head configured to accept multiple sources and multiple detectors thereby allowing for concurrent measurements and imaging on multiple samples.

13. The device of claim 12 further comprising a processor configured to perform data management and/or a data analysis methodology applicable to any optically active material.

14. A method of determining physical parameters of a semiconductor sample, the method comprising:

(a) accepting the semiconductor sample;

(b) concurrently exposing the semiconductor sample to a plurality of light sources;

(c) concurrently detecting light from the plurality of light sources; and

(d) determining a range of physical parameters of the semiconductor sample.

15. The method of claim 14 wherein:

accepting the semiconductor sample comprises accepting a plurality of partially completed semiconductors; and

determining a range of physical parameters of the semiconductor sample comprises determining the range of physical parameters of the plurality of partially completed semiconductors.