SYSTEMS AND METHODS FOR AUTOMATED SINGLE TANK SURFACE TREATMENT

Abstract

A system and method for automated single tank surface treatment, the system including a process tank, a manifold fluidly coupled to the process tank, a controller coupled to the manifold, and a plurality of holding tanks in fluid communication with the process tank via the manifold. The process tank may include a conductive support configured to hold a workpiece to be anodized and electrically coupled to a power supply source, and one or more cathodes electrically coupled to the power supply source, wherein the power supply source is configured to apply a voltage between the one or more cathodes and the workpiece via the conductive support. The system may also include a pH sensor, a temperature sensor, a cooling coil, a heating element, a level sensor, a vacuum outlet, a pressurized air inlet, and a pressure sensor.

Description

BACKGROUND

Anodization is an electrochemical process that converts a metal surface into a durable, corrosion resistant anodic oxide finish. The anodizing process is ideally suited for aluminum, however other nonferrous metals such as titanium can also be anodized. Anodization, as well as other surface treatment processes such as electroplating or coating, typically requires subjecting a part to be treated to a plurality of solutions and/or processes.

SUMMARY

In one aspect, the technology relates to a system for automated single tank surface treatment, the system including a process tank, a manifold fluidly coupled to the process tank, a controller coupled to the manifold and configured to control operation of the manifold, and a plurality of holding tanks in fluid communication with the process tank via the manifold. In an example of the above aspect, the process tank includes a conductive support configured to hold a workpiece to be anodized and electrically coupled to a power supply source, and one or more cathodes electrically coupled to the power supply source, wherein the power supply source is configured to apply a voltage between the one or more cathodes and the workpiece via the conductive support. In another examples, the system further includes at least one of a pH sensor, a temperature sensor, a cooling coil, a heating element, a level sensor, a vacuum outlet, a pressurized air inlet, and a pressure sensor.

In another example of the above aspect, the process tank includes a bottom surface, the bottom surface having a dome shape. In yet another example, the manifold includes a plurality of connectors, a plurality of valves respectively fluidly coupled to the plurality of connectors and to a plurality of input lines, a plurality of valve actuators respectively coupled to the plurality of valves, and an output valve fluidly coupled to the plurality of connectors and to an output line. In other examples, each of the plurality of input lines is fluidly coupled to one of the plurality of holding tanks. In another example, the output valve is fluidly coupled to the process tank. In an example, the surface treatment is an anodization treatment. In another example, the surface treatment is one of an electroplating treatment and a coating treatment.

In another aspect, the technology relates to a system for automated single tank surface treatment of a workpiece, the system including a process tank coupled to a power supply, a plurality of holding tanks, each holding tank holding a fluid as part of the surface treatment, a manifold fluidly coupled to the process tank and to the plurality of holding tanks, an input device, a processor operatively coupled to the manifold, the process tank, the power supply, the plurality of holding tanks, and the input device, and a memory coupled to the processor, the memory storing instructions that, when executed by the processor, perform a set of operations. In various examples, the set of operations include receiving, at the input device, information related to the surface treatment of the workpiece, determining, via the processor, one or more operations to achieve the surface treatment of the workpiece, and performing, via the processor, the one or more operations to treat the surface of the workpiece.

In an example of the above aspect, the surface treatment includes an anodization treatment, and the information includes at least one of a thickness of an anodized layer, a color of the anodized layer, and a type of sealant of the anodized layer. For example, the type of sealant includes one of a heat treatment and an application of a compound. In another example, the process tank includes at least one cathode facing the workpiece, and the one or more operations include at least one of flowing one or more fluids from the holding tanks to the process tank, when a fluid is in the process tank: controlling a temperature of the fluid, controlling a pressure in the process tank, controlling a level of the fluid in the process tank, and controlling a pH of the fluid in the process tank, flowing the one or more fluids from the process tank to the holding tanks or to waste, and applying a voltage between the workpiece and the at least one cathode in the process tank.

In another example of the above aspect, the set of operations include flowing the one or more fluids from the holding tanks to the process tank and flowing the one or more fluids from the process tank to the holding tanks or to waste according to a sequence, the sequence being determined by the processor based on the received information related to the surface treatment of the workpiece. In other examples of the above aspect, the surface treatment includes an electroplating treatment or a coating treatment, and the information includes at least one of a thickness of an electroplated layer, a composition of the electroplated layer, a physico-chemical property of the electroplated layer, and an optical property of the electroplated layer.

In another aspect, the technology relates to a method for automated single tank surface treatment of a workpiece, the method including receiving information related to the surface treatment of the workpiece, determining one or more operations to achieve the surface treatment of the workpiece, and performing the one or more operations to treat the surface of the workpiece. In an example, the surface treatment includes an anodization treatment, and the information includes at least one of a thickness of an anodized layer, a color of the anodized layer, and a type of sealant of the anodized layer.

In an example of the above aspect, the process tank includes at least one cathode facing the workpiece, and the one or more operations include at least one of flowing one or more fluids from the holding tanks to the process tank, when a fluid is in the process tank: controlling a temperature of the fluid, controlling a pressure in the process tank, controlling a level of the fluid in the process tank, and controlling a pH of the fluid in the process tank, flowing the one or more fluids from the process tank to the holding tanks or to waste, and applying a voltage between the workpiece and the at least one cathode in the process tank.

In another example of the above aspect, flowing the one or more fluids from the holding tanks to the process tank and flowing the one or more fluids from the process tank to the holding tanks or to waste are performed according to a sequence, the sequence being determined by the processor based on the received information related to the surface treatment of the workpiece. In yet another example, the surface treatment includes an electroplating treatment or a coating treatment, and the information includes at least one of a thickness of an electroplated layer, a composition of the electroplated layer, a physico-chemical property of the electroplated layer, and an optical property of the electroplated layer.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic diagram of a conventional anodization apparatus.

FIG. 2 is a diagram of a surface treatment apparatus, according to various examples of the disclosure.

FIGS. 3A-3B are views illustrating a process tank in a surface treatment apparatus, according to various examples of the disclosure.

FIG. 4 is a cross-section of a process tank in a surface treatment apparatus, according to various examples of the disclosure.

FIG. 5 depicts a manifold used in a surface treatment apparatus, according to various examples of the disclosure.

FIG. 6 depicts an example of a method of surface treatment, according to various examples of the disclosure.

FIG. 7 depicts an example of a suitable operating environment in which one or more of the present examples can be implemented.

DETAILED DESCRIPTION

A typical anodizing process involves mounting, or “racking,” the workpiece(s) or part(s) to be anodized onto an electrically conductive rack, after which the rack of parts is transferred into and out of a series of open tanks filled with different process chemicals, or rinse water, needed to achieve the anodization process. While in the anodizing tank which is used to apply a voltage or potential to the parts, the rack is typically connected to a power supply which supplies the parts with the electrical connection to undergo the electrochemical anodizing process. There are a variety of chemicals, concentrations, process times, process temperatures, and power inputs, e.g., voltage and/or current, involved in the anodizing process, some of which may be varied depending on specifics of the process. However, such conventional techniques typically have disadvantages in terms of equipment failure due to required continuous movement of the rack, cross-contamination between the various tanks when the part to be anodized is transported from one tank to another, formation of bubbles in the electrolytes and various liquids used during the anodization process, and increased chances of operator injury due to the presence of a number of open tanks. Although the above discusses the examples of an anodization process, similar examples apply to other surface treatments such as, e.g., electroplating or coating.

A system and process according to various examples of this disclosure provides the ability to perform all of the operations necessary to perform an anodization, from loading un-anodized parts to un-loading finished parts, i.e., from beginning of the process to end, in a single tank, referred to herein as a process tank. For example, the various process fluids necessary to achieve the anodization of the parts are held in separate tanks, referred to herein as holding tanks, and the holding tanks are connected to the process tank through a series of lines and valves connecting together at a manifold. An automated controller or processor may control the flow of each process fluid from a holding tank into and out of the process tank according to pre-programmed schedules corresponding to a given surface treatment, e.g., anodization, process. In various examples, the controller may control the fluid temperatures in each holding tank and in the process tank via heating elements within the tanks, control the power applied to the parts during the anodizing or electrochemical process, and control fluid levels in the tanks. In addition, the controller may also control other parameters of the fluids in each of the tanks such as, e.g., pH, pressure, level, and the like.

In various examples, although the above discussion centers around anodization, the same system and method may be applied to any other electroplating, coating or other process that typically necessitates a rack transporting a part or workpiece between several tanks. As such, a single process tank may receive the part or workpiece, and the various other fluids and liquids necessary to perform the electroplating, coating, or other process may be flowed in and out of the process tank.

In various examples, the fluids may be transferred between tanks by a variety of methods. In one implementation, the process tank includes a pressure and vacuum-rated vessel with a removable lid, so that the parts and part rack can be enclosed in the tank, and fluids transferred to and from the tank via air pressure or vacuum. In other examples, the process tank may be an open tank, and fluids may be moved in and out of the open process tank via one or more connectors and pumps. Because the anodizing process requires specific temperatures and chemical concentrations, the system may include temperature sensors, various meters such as pH and pressure sensors, and level sensors, which may be connected to the automated controller. The automated controller or processor may allow user inputs via a control panel. Operator inputs may include part surface area, desired color, or other process variables.

The systems of and methods according to various examples of the disclosure provide a number of advantages over a typical anodizing or surface treatment line. Such examples includes, e.g., an automated treatment so that an operator merely has to load the parts in the process tank, and once the program is started, no further interaction may be needed until the treatment is completed. In addition, during the anodization or electrochemical process, the operator is free to perform other tasks. The treatment is controlled by an electronic controller or processor, so the risk of operator errors and variation may be reduced or eliminated, which may result in more uniform results of the anodization, electrochemical or chemical process. The nature of the design of a single process tank, which typically takes up less physical space than an open-tank line, allows for a flexible layout and positioning of the process tank and of the holding tanks, which may enable the system to be installed in locations where it may not otherwise be practical to set up an open-tank line. This space saving also enables the system to be modular in the sense that multiple different chemicals, dyes, etc., may be included in the holding tanks and utilized in the process as needed without requiring any physical proximity, as would be the case in an open-tank line.

Other advantages include the fact that the process tank and the holding tanks may also be covered with e.g., a hermetic lid, which may reduce issues associated with evaporation, environmental contamination, fume management, and the like. Containing the parts to be treated, e.g., anodized, in a single vessel instead of moving the parts from tank to tank reduces the risk of the parts being damaged, dropped, or losing electrical connectivity, which would compromise the anodizing or surface treatment process. The racking can also be simplified due to the reduction in interfaces to various tanks, electrical connections, and handling equipment. Also, if a closed, pressure- and vacuum-capable pressure tank is utilized as the process tank, there may be advantage in the anodizing process by operating under vacuum or under some pressure. Operating under pressure may help remove entrapped air bubbles, or improved dye or seal penetration, which are not typically possible with traditional open tanks.

FIG. 1 is a schematic diagram of a conventional anodization apparatus 100. In FIG. 1, the apparatus 100 includes a rack 110 configured to transport a part 120 from tank 130 to tank 130. In operation, the rack 110 transports the part 120 from beginning of the process in a pre-treatment tank 130 for, e.g., degreasing the part 120. Next, the rack 110 transports the part 120 to the next tank 130 in line for rinsing the part 120, then to the next tank 130 for etching the part 120, then to the next tank 130 for rinsing the part 120, then to the next tank 130 for desmutting the part 120, then to the next tank 130 for rinsing the part 120 again, and to as many tanks 130 as needed to complete the treatment of the parts. In an anodizing process, after rinsing in the latest tank 130, the part 120 is transported to a tank 130 that is connected to a power supply that supplies the electric power or voltage necessary to anodize the part 120. Once anodization is complete, the rack 110 transports the part 120 to another tank 130 to rinse the part 120, then to a tank 130 for dyeing the part 120, if that is necessary, then to another tank 130 for rinsing the part 120, and to another tank 130 for sealing the anodized part 120. In a typical anodization, electrochemical, coating or other surface treatment process, there may be more or less tanks 130 holding different fluids and chemicals based on the given application. Typically, all the tanks 130 are arranged in a line, and the rack 110 transports the part 120 to be treated from tank 130 to tank 130 from the beginning of the surface treatment to the end of the surface treatment.

FIG. 2 is a diagram of a surface treatment apparatus 200, according to various examples of the disclosure. For example, the surface treatment may be anodization, or other electrochemical or coating process. In FIG. 2, the part 220 that is to be treated, anodized, or otherwise plated or coated, is placed in a process tank 210. In various examples, the process tank 210 may be connected to a power source 215 configured to provide sufficient power or voltage to perform the anodization process, or other electrochemical or plating process. In other examples, the process tank 210 is coupled to a manifold (not shown) controlled by a controller or processor 250, the controller or processor 250 and the processor-controlled manifold being fluidly coupled to a plurality of holding tanks 230 via a plurality of lines 260. For example, each of the holding tanks 230 includes a liquid or fluid necessary to the completion of the anodization, or other electroplating or coating, treatment. In examples, the lines 260 may be pneumatic lines or other lines configured to allow flow of fluid from each of the holding tanks 230, through the processor-controlled manifold, to the process tank 210, and vice-versa.

In various examples of the disclosure, during operation of the surface treatment apparatus 200, the controller or processor 250 may receive instructions from an operator. For example, the controller or processor 250 may include an input device (not shown) through which an operator may enter treatment information. In the case of an anodization treatment, the processor 250 may receive instructions regarding the thickness of the anodization layer, the color of the layer, the type of sealing of the anodization layer, and the like. In various examples, on the basis of this input, the processor 250 determines which holding tanks 230 are to be used, which temperatures, pressure, pH, and the like, for the liquids in each of the holding tanks 230 to be used, and in which order are the liquids in each of the holding tanks to be transferred through the manifold (not shown) and into the process tank 210. The processor 250 also determines how much power to apply in the process tank 210, and for how long, in order to obtain the desired anodized or electroplated layer. In various examples, the processor 250 automatically determines the above parameters and controls operation of fluid transfer, timing of fluid transfer, amount of power to be applied, temperature, pressure, pH, and the like, from each of the holding tanks 230 into and out of the process tank 210.

FIGS. 3A-3B are views illustrating a process tank in a surface treatment apparatus, according to various examples of the disclosure. FIG. 3A illustrates a perspective view of a process tank 300 that may be used in an electrochemical process such as, e.g., in an anodizing apparatus, such as the process tank 210 described above with respect to FIG. 2. In various examples, the process tank 300 may also be used in an electrochemical apparatus, a plating apparatus, a coating apparatus, and the like. In various examples, the process tank 300 includes a body 310 and a lid 390. The lid 390 may include, for example, a pressure gage 395 configured to measure the pressure inside the process tank 300. In other examples of the disclosure, the process tank body 310 includes one or more cathodes or cathode plates 320 that are part of the anodization and/or electrochemical treatment by allowing the application of a voltage or potential between the part or workpiece 330 to be anodized or plated and the cathodes or cathode plates 320. As such, behind each cathode or cathode plate 320 is a cathode power supply connection 325 configured to transmit power to the cathode plates 320 during the anodization or electroplating treatment from a power supply source. The process tank body 310 may also include a conductive support or workpiece rack 335 configured to hold in place the part or workpiece 330 that is to be anodized, electroplated or coated. In various examples, the conductive support or workpiece rack 335 may also be connected to an anode power supply connection 340 so that, in operation, a voltage or potential can be applied between the cathode plates 320 and the part or workpiece 330 so as to perform the anodization or electrochemical treatment. Accordingly, both the cathode power supply connection 325 and the anode power supply connection 340, in operation, are connected to a power supply source so as to apply the voltage or potential between the cathode plates 320 and the part or workpiece 330.

In various examples of the disclosure, the process tank body 310 may include additional features such as, e.g., an overfill level sensor 345 configured to determine the level or volume of the fluid inside the process tank 300, or whether there is an overfill of the fluid inside the process tank 300. The process tank body 310 may also include one or more pressure sensor ports 350 including one or more pressure sensors configured to measure the pressure inside the process tank 300. In other examples, the process tank body 310 may include a vacuum outlet 355 configured to vent or to modulate or vary the amount of vacuum inside the process tank 300 during the treatment, or when the process tank 300 is closed. The process tank body 310 may also include a pressurized air inlet 360 configured to transfer fluid, to provide aeration inside the process tank body 310, or to agitate the fluid inside the process tank body 310. In other examples, the process tank body 310 may include a cooling coil inlet 370 and a cooling coil outlet 375, both the cooling coil inlet 370 and the cooling coil outlet 375 being configured to circulate a cooling liquid or cooling fluid inside the process tank body 310, e.g., when a fluid or liquid is held in the process tank body 310. In further examples of the disclosure, the process tank body 310 may include a heating element 380 configured to heat the liquid or fluid held in the process tank body 310. Accordingly, during operation of the anodization or electrochemical treatment, temperature control may be performed by a feedback loop between the cooling coil inlet 370 and cooling coil outlet 375, the heating element 380 and a temperature sensor (not shown).

FIG. 3B illustrates another perspective view of the process tank 300 illustrated in FIG. 3A that may be used in an electrochemical treatment such as, e.g., in an anodizing treatment. In various examples, the process tank body 310 includes the overfill level sensor 345, and may also include a low level sensor 348 configured to determine whether the amount of fluid or liquid inside the process tank body 310 is, e.g., lower than a given threshold. In other examples, the process tank body 310 may include a pH sensor port 365 with a pH sensor therein configured to determine the pH of any fluid or liquid held in the process tank body 310. The process tank body 310 may also include a thermowell or temperature sensor 385 configured to sense and determine the temperature of the fluid or liquid held in the process tank body 310. Accordingly, a feedback loop may be created between the temperature sensor 385, the cooling coil inlet 370 and the cooling coil outlet 375 illustrated in FIG. 3A, and the heating element 380 also illustrated in FIG. 3A, so that the temperature of the fluid or liquid inside the process tank body 310 may be controlled. In further examples, the process tank body 310 includes a fluid input and output line 388 configured to provide fluid or liquid from, e.g., a holding tank, to the process tank body 310, and to evacuate the fluid or liquid from the process tank body 310 to, e.g., a holding tank or to waste. For example, the process tank body 310 may have a domed bottom portion 315, e.g., the bottom portion 315 of the process tank body 310 has a dome shape, so as to ensure that all of the fluid can be evacuated from the process tank body 310 before, during, or after the surface treatment. For example, because the fluid input and output line 388 fluidly connects to the bottom of the domed bottom portion 315, all or substantially all of the liquid or fluid that is held in the process tank body 310 may be evacuated. As such, when a rinse cycle is performed in the process tank body 310, the rinse may be effective so as to remove the substantial entirety of the liquid or fluid that held in the process tank body 310.

FIG. 4 is a cross-section of a process tank in a surface treatment apparatus, according to various examples of the disclosure. In FIG. 4, the process tank body 410 includes a workpiece rack 435 configured to hold in place the workpieces or parts 430 that are to be anodized, electroplated or coated. In various examples, the process tank body 410 also includes one or more cathode plates 420 that are part of the anodization and/or electrochemical treatment by allowing the application of a voltage or potential between the part 430 to be anodized or plated and the cathode plates 420. As such, behind each cathode plate 420 is a cathode power supply connection configured to transmit power to the cathode plates 420 during the anodization or electroplating process. In other examples, the process tank body 410 also includes a cooling coil 470 configured to circulate a cooling liquid or cooling fluid inside the process tank body 410, particularly when a fluid or liquid is held in the process tank body 410. Due to the circulation of a cooling liquid or fluid inside the coil 470, the liquid or fluid held in the process tank body 410 may be cooled.

In various examples, the process tank body 410 may also include a thermowell or temperature sensor 485 configured to sense the temperature of the fluid or liquid held in the process tank body 410. In other examples, the process tank body 410 also includes a heating element 480 configured to heat the liquid or fluid held in the process tank body 410. Accordingly, a feedback loop may be created between the temperature sensor 485, the cooling coil 470 and the heating element 480 so that the temperature of the fluid or liquid held in the process tank body 410 may be controlled. In other examples, the process tank body 410 also includes a fluid input and output line 488 configured to provide fluid or liquid inside the process tank body 410 and to evacuate the fluid or liquid from the process tank body 410. For example, the process tank body 410 has a domed bottom portion 415 so as to ensure that all of the fluid can be evacuated from the process tank body 410. As such, when, e.g., a rinse cycle is performed in the process tank body 410, the rinse may be effective so as to remove the substantial entirety of the liquid or fluid held in the process tank body 410.

FIG. 5 depicts a manifold used in a surface treatment apparatus, according to various examples of the disclosure. In examples, the manifold 500 may be configured to fluidly couple a plurality of holding tanks such as, e.g., the holding tanks 230 illustrated in FIG. 2, to a single tank such as, e.g., the process tank 210 also illustrated in FIG. 2. In FIG. 5, the manifold 500 includes a plurality of fluid connectors 510 connecting tank lines for the holding tanks to the process tank. In various examples, each fluid connector 510 may include a valve actuator 520, a valve 530 such as, e.g., a shutoff valve, as well as an input line 540. The manifold 500 also includes an output valve 550 for the fluid connected 510, the output valve 550 being connected to an outlet line (not shown) and in fluid communication with, e.g., the process tank. Accordingly, in operation, fluid or liquid from any one of the holding tanks may be provided to the manifold 500 through any one of the input lines 540, and selectively or in a determined order, the fluid or liquid provided by the various input lines 540 may then be provided to the process tank via the output valve 550. In other examples, operation of the manifold 500 may be controlled by a processor (not shown), the processor controlling which fluid or liquid that is received via the input valves 550 is to be transferred out of the manifold 500 via the output valve 550, and in what sequence based on, e.g., requirements of the part to be anodized, electrochemically treated, or coated, and based on requirements of the anodized layer, plated layer or coated layer.

FIG. 6 depicts an example of a method of surface treatment 600, according to various examples of the disclosure. In various examples, operation 610 includes receiving an input or information regarding the surface treatment to perform on a workpiece. For example, the surface treatment may be an anodization treatment, and the input or information may include, e.g., the thickness of the anodized layer, the type of sealing of the anodized layer, the color of the anodized layer, the type of workpiece to anodize, and the like. As another example, the treatment may be an electroplating treatment or a coating treatment, and the input or information may include, e.g., a thickness of the electroplated or coated layer, a composition of the electroplated or coated layer, a physico-chemical property of the electroplated or coated layer, and an optical property of the electroplated or coated layer.

In various examples, once such input or information is received, during operation 620, treatment parameters may be determined. For example, the treatment parameters may be inherent to the performance of an electrochemical treatment such as, e.g., an anodization. In the case of an anodization, the treatment parameters may include, e.g., a temperature inside the process tank, the type of electrolyte in which the anodization is to take place, the amount of voltage or current to apply to the part to perform the anodization, the pressure inside the process tank, the pH of the various liquids or fluids to be cycled through the treatment, the volume or level of each liquid or fluid to be cycled through the process tank during the treatment, the sequence of liquids of fluids to be cycled through the process tank from the holding tanks, the duration of time that each liquid or fluid is to be held in the process tank during the treatment, and the like. For example, the specific sequence of operations and the above treatment parameters may be obtained from, e.g., a database accessible by the input device receiving the treatment information.

In various examples of the disclosure, once the treatment parameters are determined, a plurality of operations including flowing fluids or liquids, applying a voltage or potential, and the like, which are based on the treatment parameters determined during operation 620, are performed during operation 630. For example, operation 630 may include flowing a degreasing liquid into the process tank for a given period of time, followed by removing the degreasing liquid from the process tank and adding a rinsing liquid in the process tank. Once the rinsing liquid is removed, an etching liquid may be flowed in the process tank, and then removed from the process tank. Other operations performed in the process tank during operation 630 may include rinsing, desmutting, rinsing, applying a voltage to anodize the part, rinsing, dyeing the anodized layer in the process tank, rinsing the dye from the process tank, and sealing the anodized layer in the process tank. In various examples, a plurality of such operations may be performed during operation 630 based on the treatment parameters determined during operation 620 by, e.g., a processor such as the processor 250 discussed with respect to FIG. 2. For example, each operation may include a cycle of flowing a liquid into the process tank and then removing the liquid from the process tank via a manifold such as manifold 500 illustrated in FIG. 5 under control of a processor such as processor 250 illustrated in FIG. 2. In various examples, the specific sequence of operations and the above treatment parameters may be obtained from, e.g., a database accessible by the input device receiving the treatment information.

FIG. 7 depicts an example of a suitable operating environment in which one or more of the present examples can be implemented. This operating environment may be incorporated directly into the controller for a surface treatment or other anodization or electrochemical system, e.g., such as the controller/processor 250 described with respect to FIG. 2. This is only one example of a suitable operating environment and is not intended to suggest any limitation as to the scope of use or functionality. Other well-known computing systems, environments, and/or configurations that can be suitable for use include, but are not limited to, personal computers, server computers, hand-held or laptop devices, multiprocessor systems, microprocessor-based systems, programmable consumer electronics such as smart phones, network PCs, minicomputers, mainframe computers, tablets, distributed computing environments that include any of the above systems or devices, and the like.

In its most basic configuration, operating environment 700 typically includes at least one processing unit 702 and memory 704. Depending on the exact configuration and type of computing device, memory 704 (storing, among other things, instructions to introduce which fluids in the process tank in a given sequence, at a given temperature and pressure, at a given pH, and the like) can be volatile (such as RAM), non-volatile (such as ROM, flash memory, etc.), or some combination of the two. This most basic configuration is illustrated in FIG. 7 by dashed line 706. Further, environment 700 can also include storage devices (removable, 708, and/or non-removable, 710) including, but not limited to, magnetic or optical disks or tape. Similarly, environment 700 can also have input device(s) 714 such as touch screens, keyboard, mouse, pen, voice input, etc., and/or output device(s) 716 such as a display, speakers, printer, etc. Also included in the environment can be one or more communication connections 712, such as LAN, WAN, point to point, Bluetooth, RF, etc.

Operating environment 700 typically includes at least some form of computer readable media. Computer readable media can be any available media that can be accessed by processing unit 702 or other devices having the operating environment. By way of example, and not limitation, computer readable media can include computer storage media and communication media. Computer storage media includes volatile and nonvolatile, removable and non-removable media implemented in any method or technology for storage of information such as computer readable instructions, data structures, program modules or other data. Computer storage media includes, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, digital versatile disks (DVD) or other optical storage, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices, solid state storage, or any other tangible medium which can be used to store the desired information. Communication media embodies computer readable instructions, data structures, program modules, or other data in a modulated data signal such as a carrier wave or other transport mechanism and includes any information delivery media. The term “modulated data signal” means a signal that has one or more of its characteristics set or changed in such a manner as to encode information in the signal. By way of example, and not limitation, communication media includes wired media such as a wired network or direct-wired connection, and wireless media such as acoustic, RF, infrared and other wireless media. Combinations of the any of the above should also be included within the scope of computer readable media. A computer-readable device is a hardware device incorporating computer storage media.

The operating environment 700 can be a single computer operating in a networked environment using logical connections to one or more remote computers. The remote computer can be a personal computer, a server, a router, a network PC, a peer device or other common network node, and typically includes many or all of the elements described above as well as others not so mentioned. The logical connections can include any method supported by available communications media. Such networking environments are commonplace in offices, enterprise-wide computer networks, intranets and the Internet.

In some examples, the components described herein include such modules or instructions executable by computer system 700 that can be stored on computer storage medium and other tangible mediums and transmitted in communication media. Computer storage media includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storage of information such as computer readable instructions, data structures, program modules, or other data. Combinations of any of the above should also be included within the scope of readable media. In some examples, computer system 700 is part of a network that stores data in remote storage media for use by the computer system 700.

This disclosure described some examples of the present technology with reference to the accompanying drawings, in which only some of the possible examples were shown. Other aspects can, however, be embodied in many different forms and should not be construed as limited to the examples set forth herein. Rather, these examples were provided so that this disclosure was thorough and complete and fully conveyed the scope of the possible examples to those skilled in the art.

Although specific examples were described herein, the scope of the technology is not limited to those specific examples. One skilled in the art will recognize other examples or improvements that are within the scope of the present technology. Therefore, the specific structure, acts, or media are disclosed only as illustrative examples. Examples according to the technology may also combine elements or components of those that are disclosed in general but not expressly exemplified in combination, unless otherwise stated herein. The scope of the technology is defined by the following claims and any equivalents therein.

Claims

1. A system for automated single tank surface treatment, the system comprising:

a process tank;

a manifold fluidly coupled to the process tank;

a controller coupled to the manifold and configured to control operation of the manifold; and

a plurality of holding tanks in fluid communication with the process tank via the manifold.

2. The system of claim 1, wherein the process tank comprises:

a conductive support configured to hold a workpiece to be anodized and electrically coupled to a power supply source; and

one or more cathodes electrically coupled to the power supply source;

wherein the power supply source is configured to apply a voltage between the one or more cathodes and the workpiece via the conductive support.

3. The system of claim 1, further comprising at least one of:

a pH sensor;

a temperature sensor;

a cooling coil;

a heating element;

a level sensor;

a vacuum outlet;

a pressurized air inlet; and

a pressure sensor.

4. The system of claim 1, wherein the process tank comprises a bottom surface, the bottom surface having a dome shape.

5. The system of claim 1, wherein the manifold comprises:

a plurality of connectors;

a plurality of valves respectively fluidly coupled to the plurality of connectors and to a plurality of input lines;

a plurality of valve actuators respectively coupled to the plurality of valves; and

an output valve fluidly coupled to the plurality of connectors and to an output line.

6. The system of claim 5, wherein each of the plurality of input lines is fluidly coupled to one of the plurality of holding tanks.

7. The system of claim 5, wherein the outlet valve is fluidly coupled to the process tank.

8. The system of claim 1, wherein the surface treatment is an anodization treatment.

9. The system of claim 1, wherein the surface treatment is one of an electroplating treatment and a coating treatment.

10. A system for automated single tank surface treatment of a workpiece, the system comprising:

a process tank coupled to a power supply;

a plurality of holding tanks, each holding tank holding a fluid that is part of the surface treatment;

a manifold fluidly coupled to the process tank and to the plurality of holding tanks;

an input device;

a processor operatively coupled to the manifold, the process tank, the power supply, the plurality of holding tanks, and the input device; and

a memory coupled to the processor, the memory storing instructions that, when executed by the processor, perform a set of operations comprising: receiving, at the input device, information related to the surface treatment of the workpiece; determining, via the processor, one or more operations to achieve the surface treatment of the workpiece based on the received information; and performing, via the processor, the one or more operations to treat the surface of the workpiece.

11. The system of claim 10, wherein:

the surface treatment comprises an anodization treatment; and

the information comprises at least one of: a thickness of an anodized layer; a color of the anodized layer; and a type of sealant of the anodized layer.

12. The system of claim 10, wherein the type of sealant comprises one of a heat treatment and an application of a compound.

13. The system of claim 10, wherein the process tank comprises at least one cathode facing the workpiece, and the one or more operations comprise at least one of:

flowing one or more fluids from the holding tanks to the process tank;

when a fluid is in the process tank, at least one of: controlling a temperature of the fluid; controlling a pressure in the process tank; controlling a level of the fluid in the process tank; and controlling a pH of the fluid in the process tank;

flowing the one or more fluids from the process tank to the holding tanks or to waste; and

applying a voltage between the workpiece and the at least one cathode in the process tank.

14. The system of claim 13, wherein the set of operations comprises flowing the one or more fluids from the holding tanks to the process tank and flowing the one or more fluids from the process tank to the holding tanks or to waste according to a sequence, the sequence being determined by the processor based on the received information related to the surface treatment of the workpiece.

15. The system of any one of claim 10, wherein:

the surface treatment comprises one of an electroplating treatment and a coating treatment; and

the information comprises at least one of: a thickness of an electroplated layer; a composition of the electroplated layer; a physico-chemical property of the electroplated layer; and an optical property of the electroplated layer.

16. A method for automated single tank surface treatment of a workpiece, the method comprising:

receiving information related to the surface treatment of the workpiece;

determining one or more operations to achieve the surface treatment of the workpiece based on the received information; and

performing the one or more operations to treat the surface of the workpiece.

17. The method of claim 16, wherein:

the surface treatment comprises an anodization treatment; and

the information comprises at least one of: a thickness of an anodized layer; a color of the anodized layer; and a type of sealant of the anodized layer.

18. The method of claim 16, wherein the process tank comprises at least one cathode facing the workpiece, and the one or more operations comprise at least one of:

flowing one or more fluids from the holding tanks to the process tank;

when a fluid is in the process tank, at least one of: controlling a temperature of the fluid; controlling a pressure in the process tank; controlling a level of the fluid in the process tank; controlling a pH of the fluid in the process tank;

flowing the one or more fluids from the process tank to the holding tanks or to waste; and

applying a voltage between the workpiece and the at least one cathode in the process tank.

19. The method of claim 18, wherein flowing the one or more fluids from the holding tanks to the process tank and flowing the one or more fluids from the process tank to the holding tanks or to waste are performed according to a sequence, the sequence being determined by the processor based on the received information related to the surface treatment of the workpiece.

20. The method of claim 16, wherein:

the surface treatment comprises one of an electroplating treatment and a coating treatment; and

the information comprises at least one of: a thickness of an electroplated layer; a composition of the electroplated layer; a physico-chemical property of the electroplated layer; and an optical property of the electroplated layer.