Headphone and stand assembly

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Description

FIG. 1 is a front perspective view of the headphone component of the headphone and stand assembly, showing my new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a right side view thereof;

FIG. 5 is a left side view thereof;

FIG. 6 is a top view thereof;

FIG. 7 is a bottom view thereof;

FIG. 8 is a front perspective view of the headphone and stand assembly;

FIG. 9 is a front perspective view of the stand component of the headphone and stand assembly;

FIG. 10 is a front view thereof;

FIG. 11 is a rear view thereof;

FIG. 12 is a right side view thereof;

FIG. 13 is a left side view thereof;

FIG. 14 is a top view thereof;

FIG. 15 is a bottom view thereof;

FIG. 16 is an enlarged detail view of area 16 in FIG. 1;

FIG. 17 is an enlarged detail view of area 17 in FIG. 1;

FIG. 18 is an enlarged detail view of area 18 in FIG. 1;

FIG. 19 is an enlarged detail view of area 19 in FIG. 2;

FIG. 20 is an enlarged detail view of area 20 in FIG. 7; and,

FIG. 21 is an enlarged detail view of area 21 in FIG. 7;

The dot-dash broken lines delineate areas of the figures shown enlarged and form no part of the claimed design. The broken lines showing portions of the headphone and stand assembly form no part of the claimed design.

Claims

The ornamental design for a headphone and stand assembly, as shown and described.

Referenced Cited
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Other references
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Patent History
Patent number: D1001096
Type: Grant
Filed: Sep 21, 2022
Date of Patent: Oct 10, 2023
Assignee: Guangzhou Minyuxing Technology Co., Ltd. (Guangzhou)
Inventor: Shumao Yuan (Changning)
Primary Examiner: Kathleen L Jones
Application Number: 29/854,001