Abstract: The present disclosure relates to a bone conduction earphone. The bone conduction earphone may include an ear hook assembly and a core module. The ear hook assembly may include an ear hook housing. The core module may be disposed on one end of the ear hook assembly. The core module may include a core housing and a core. An opening may be disposed on one end of the core housing to form a chamber structure for accommodating the core. An elastic modulus of the core housing may be greater than an elastic modulus of the ear hook housing.
Type:
Grant
Filed:
July 21, 2023
Date of Patent:
September 24, 2024
Assignee:
SHENZHEN SHOKZ CO., LTD.
Inventors:
Zhen Wang, Zhiqing Liu, Yonggen Wang, Xinnan Mao