Headphone

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Description

FIG. 1 is a perspective view of a headphone showing my new design;

FIG. 2 is another perspective view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a right side elevational view thereof;

FIG. 7 is a top plan view thereof; and,

FIG. 8 is a bottom plan view thereof.

The broken lines in the drawings are for the purpose of illustrating portions of the headphone that form no part of the claimed design.

Claims

The ornamental design for a headphone, as shown and described.

Referenced Cited
U.S. Patent Documents
D829193 September 25, 2018 Cai
D847794 May 7, 2019 Guo
D893462 August 18, 2020 Liu
D916684 April 20, 2021 Fang
D920293 May 25, 2021 Chen
D930621 September 14, 2021 Rong
D940690 January 11, 2022 Zhang
D940691 January 11, 2022 Zhang
D946555 March 22, 2022 Chen
D962202 August 30, 2022 Zhang
D967802 October 25, 2022 Zhang
D982560 April 4, 2023 Ma
Foreign Patent Documents
306824634 September 2021 CN
306824635 September 2021 CN
Other references
  • Besue, first available Oct. 17, 2022 [online], [retrieved Jun. 14, 2023]. Available from the Internet, URL :<https://a.co/d/0tZCwPd>. (Year: 2022).
  • Soundcore by Anker Liberty 4, first available Oct. 15, 2022 [online], [retrieved Jun. 14, 2023]. Available from the Internet, URL :<https://a.co/d/6pAgAwm>. (Year: 2022).
Patent History
Patent number: D1002587
Type: Grant
Filed: Dec 29, 2021
Date of Patent: Oct 24, 2023
Inventor: Xuemei Chen (Yichang)
Primary Examiner: Dana K Weiland
Assistant Examiner: Russell Carnell Smith, Jr.
Application Number: 29/821,270
Classifications
Current U.S. Class: Headphone (D14/223)