Soldering station
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Description
The broken lines depict portions of the soldering station in which the design is embodied that are not considered part of the claimed design.
Claims
The ornamental design for a soldering station, as shown and described.
Referenced Cited
U.S. Patent Documents
| D274882 | July 31, 1984 | Rittmann |
| D415435 | October 19, 1999 | Yoshimura |
| D428427 | July 18, 2000 | Neef |
| D490448 | May 25, 2004 | Ishihara |
| D530349 | October 17, 2006 | Ishihara |
| D620328 | July 27, 2010 | Masaki |
| D623206 | September 7, 2010 | Mittmann |
| D656525 | March 27, 2012 | Mochizuki |
| D703715 | April 29, 2014 | Kita |
| D740339 | October 6, 2015 | Teraoka |
| D762254 | July 26, 2016 | Kita |
| D762754 | August 2, 2016 | Kita |
| D780241 | February 28, 2017 | Teraoka |
| D790613 | June 27, 2017 | Fischer |
| D829790 | October 2, 2018 | Gou |
| D829791 | October 2, 2018 | Fischer |
| D879849 | March 31, 2020 | Kita |
| D888789 | June 30, 2020 | Gou |
| D928209 | August 17, 2021 | Gou |
| D937915 | December 7, 2021 | Gou |
| D938504 | December 14, 2021 | Van Fossen |
| D941898 | January 25, 2022 | Bublitz |
| D953397 | May 31, 2022 | Bublitz |
| D966365 | October 11, 2022 | Gou |
| D969185 | November 8, 2022 | Gou |
| D993729 | August 1, 2023 | Gou |
| 20150083707 | March 26, 2015 | Miyazaki |
| 20160175959 | June 23, 2016 | Mochizuki |
Patent History
Patent number: D1005808
Type: Grant
Filed: Feb 17, 2022
Date of Patent: Nov 28, 2023
Assignee: ERSA GmbH (Wertheim)
Inventors: Thorsten Issler (Buetthard), Lars Mayer (Hanau), Eugen Weissenberger (Eussenheim)
Primary Examiner: Philip S Hyder
Application Number: 29/827,063
Type: Grant
Filed: Feb 17, 2022
Date of Patent: Nov 28, 2023
Assignee: ERSA GmbH (Wertheim)
Inventors: Thorsten Issler (Buetthard), Lars Mayer (Hanau), Eugen Weissenberger (Eussenheim)
Primary Examiner: Philip S Hyder
Application Number: 29/827,063
Classifications
Current U.S. Class:
Solid Material Melting, E.g., Solder, Etc. (D15/144.2)