Headphone

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Description

FIG. 1 is a perspective view of a headphone showing the new design in a first embodiment;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a side elevational view thereof;

FIG. 5 is an opposite side elevational view thereof;

FIG. 6 is a top view thereof;

FIG. 7 is a bottom view thereof;

FIG. 8 is a perspective view of the headphone in a second embodiment, illustrating a mirror image of the headphone of FIGS. 1-7;

FIG. 9 is a front elevational view thereof;

FIG. 10 is a rear elevational view thereof;

FIG. 11 is a side elevational view thereof;

FIG. 12 is an opposite side elevational view thereof;

FIG. 13 is a top view thereof; and,

FIG. 14 is a bottom view thereof.

The broken lines in the figures illustrate portions of the headphone that form no part of the claimed design. The shading is provided merely to represent contours of the design and does not connote the character of the surfaces such as any specific texture, material, gloss, translucence, transparency, surface treatment, or surface decoration.

Claims

The ornamental design for a headphone, as shown and described.

Referenced Cited
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Patent History
Patent number: D1005992
Type: Grant
Filed: Dec 30, 2021
Date of Patent: Nov 28, 2023
Assignee: Harman International Industries, Incorporated (Northridge, CA)
Inventors: Pohsun Lee (Shenzhen), Laurent Lindenberger (Shenzhen)
Primary Examiner: Dana K Weiland
Assistant Examiner: Russell Carnell Smith, Jr.
Application Number: 29/821,531
Classifications
Current U.S. Class: Headphone (D14/223)