Headphone

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Description

FIG. 1 is a perspective view of a headphone showing the new design in a first embodiment;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a side elevational view thereof;

FIG. 5 is an opposite side elevational view thereof;

FIG. 6 is a top view thereof;

FIG. 7 is a bottom view thereof;

FIG. 8 is a perspective view of the headphone in a second embodiment, illustrating a mirror image of the headphone of FIGS. 1-7;

FIG. 9 is a front elevational view thereof;

FIG. 10 is a rear elevational view thereof;

FIG. 11 is a side elevational view thereof;

FIG. 12 is an opposite side elevational view thereof;

FIG. 13 is a top view thereof; and,

FIG. 14 is a bottom view thereof.

The broken lines immediately adjacent the shaded areas represent the bounds of the claimed design while all other broken lines are directed to environment; the broken lines form no part of the claimed design.

Claims

The ornamental design for a headphone, as shown and described.

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Patent History
Patent number: D1008210
Type: Grant
Filed: Aug 13, 2021
Date of Patent: Dec 19, 2023
Assignee: Harman International Industries, Incorporated (Northridge, CA)
Inventors: Pohsun Lee (Shenzhen), Laurent Lindenberger (Shenzhen)
Primary Examiner: Paula Allen Greene
Application Number: 29/803,538
Classifications
Current U.S. Class: Headphone (D14/223)