Case for electronic communications device

- SPIGEN KOREA CO., LTD.
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Description

FIG. 1 is a front perspective view of the case for electronic communications device;

FIG. 2 is a rear elevational view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

The broken lines throughout the drawing figures depict portions of the case for electronic communications device that form no part of the claimed design. The broken lines and regions bounded by broken lines form no part of the claimed design.

Claims

The ornamental design for a case for electronic communications device, as shown and described.

Referenced Cited
U.S. Patent Documents
D363920 November 7, 1995 Roberts
D471524 March 11, 2003 Ebihara
D685779 July 9, 2013 Schriefer
D727885 April 28, 2015 Requa
9451066 September 20, 2016 Jia
D854533 July 23, 2019 Thompson
D896213 September 15, 2020 Lee
D905676 December 22, 2020 Kim
D905680 December 22, 2020 Kim
D908679 January 26, 2021 Kim
D914004 March 23, 2021 Lee
D981998 March 28, 2023 Chen
D991238 July 4, 2023 Kim
Other references
  • Spigen Magnetic Designed for iPhone 15, publication date Sep. 26, 2023, [online] URL: https://www.amazon.com/Spigen-Magnetic-Military-Grade-Protection-Compatible/dp/B0C5S89N4J (Year: 2023).
  • Spigen MagFit Ultra Hybrid Case Compatible with iPhone 14 Pro Zero One, publication date Oct. 29, 2022, [online] URL: https://www.amazon.com.be/-/en/Spigen-MagFit-Hybrid-Compatible-iPhone/dp/B0BBWM6PN9 (Year: 2022).
  • Dbrand Teardown Gripcase for iPhone 13 Pro Unboxing & Review, publication date Feb. 4, 2022, [online] URL: https://www.youtube.com/watch?v=sZwzjeqHi5w (Year: 2022).
  • Blanc Space Circuit Board Teardown V2 Slim Phone Case for Iphone 14 Max, publication date Nov. 14, 2022, [online] URL: https://www.amazon.co.uk/Blanc-Space-iPhone-14-Protective-1-TEARDOWN-V2/dp/B0BM9B63BV (Year: 2022).
Patent History
Patent number: D1010634
Type: Grant
Filed: Sep 19, 2022
Date of Patent: Jan 9, 2024
Assignee: SPIGEN KOREA CO., LTD. (Seoul)
Inventor: Jong Eun Kim (Seoul)
Primary Examiner: L. A. Grabenstetter
Application Number: 29/866,554
Classifications