Cockpit module for vehicle
Latest HYUNDAI MOBIS CO., LTD. Patents:
Description
Claims
The ornamental design of cockpit module for vehicle, as shown and described in the drawings.
Referenced Cited
U.S. Patent Documents
D969045 | November 8, 2022 | Okabe |
D972996 | December 20, 2022 | Pérot |
D974257 | January 3, 2023 | Weiler |
D978039 | February 14, 2023 | Manzoni |
D979473 | February 28, 2023 | Anderson |
D982490 | April 4, 2023 | Jung |
D985452 | May 9, 2023 | Schneider |
D986125 | May 16, 2023 | Chu |
D986143 | May 16, 2023 | Hanstock |
D987508 | May 30, 2023 | Hayashi |
D988973 | June 13, 2023 | Benjamin |
D993867 | August 1, 2023 | Satou |
D993868 | August 1, 2023 | Yamamoto |
Patent History
Patent number: D1015994
Type: Grant
Filed: Jun 29, 2022
Date of Patent: Feb 27, 2024
Assignee: HYUNDAI MOBIS CO., LTD. (Seoul)
Inventors: Hyung Soo Kim (Yongin-si), Jong Wan Choi (Yongin-si), Sang Hun Yoo (Yongin-si)
Primary Examiner: Katrina A Betton
Application Number: 29/844,504
Type: Grant
Filed: Jun 29, 2022
Date of Patent: Feb 27, 2024
Assignee: HYUNDAI MOBIS CO., LTD. (Seoul)
Inventors: Hyung Soo Kim (Yongin-si), Jong Wan Choi (Yongin-si), Sang Hun Yoo (Yongin-si)
Primary Examiner: Katrina A Betton
Application Number: 29/844,504
Classifications
Current U.S. Class:
Instrument Panel Or Element Thereof (D12/192)