Electronics case

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Description

FIG. 1 is a front perspective view of an electronics case showing the new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a side elevational view thereof;

FIG. 5 is an opposite side elevational view thereof;

FIG. 6 is a top view thereof;

FIG. 7 is a bottom view thereof;

FIG. 8 is a front elevational view thereof, shown in an open configuration;

FIG. 9 is a top elevational view thereof, shown in an open configuration;

FIG. 10 is a rear perspective view thereof; and,

FIG. 11 is a front perspective view thereof, shown in an open configuration.

The broken lines illustrate portions of the electronics case that form no part of the claimed design.

Claims

The ornamental design for an electronics case, as shown and described.

Referenced Cited
U.S. Patent Documents
D816994 May 8, 2018 Fischer et al.
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D891773 August 4, 2020 Meyer
D897522 September 29, 2020 O
D901178 November 10, 2020 Kim et al.
D902589 November 24, 2020 Li
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D919293 May 18, 2021 Fang
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Foreign Patent Documents
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Other references
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  • JBL Live Free NC+ TWS True Wireless In-Ear NC Headphones Specification Sheet, Harman International Industries, Incorporated, 2020.
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Patent History
Patent number: D1018506
Type: Grant
Filed: Dec 30, 2021
Date of Patent: Mar 19, 2024
Assignee: Harman International Industries, Incorporated (Northridge, CA)
Inventors: Pohsun Lee (Shenzhen), Laurent Lindenberger (Shenzhen)
Primary Examiner: Dana K Weiland
Assistant Examiner: Russell Carnell Smith, Jr.
Application Number: 29/821,558
Classifications
Current U.S. Class: D3/294; D3/274